JP2015135878A - 接続体、接続体の製造方法、接続方法、異方性導電接着剤 - Google Patents

接続体、接続体の製造方法、接続方法、異方性導電接着剤 Download PDF

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Publication number
JP2015135878A
JP2015135878A JP2014006285A JP2014006285A JP2015135878A JP 2015135878 A JP2015135878 A JP 2015135878A JP 2014006285 A JP2014006285 A JP 2014006285A JP 2014006285 A JP2014006285 A JP 2014006285A JP 2015135878 A JP2015135878 A JP 2015135878A
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Japan
Prior art keywords
conductive particles
anisotropic conductive
electronic component
connection
liquid crystal
Prior art date
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JP2014006285A
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English (en)
Japanese (ja)
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JP2015135878A5 (enExample
Inventor
誠一郎 篠原
Seiichiro Shinohara
誠一郎 篠原
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dexerials Corp
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Dexerials Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by Dexerials Corp filed Critical Dexerials Corp
Priority to JP2014006285A priority Critical patent/JP2015135878A/ja
Priority to US15/112,263 priority patent/US10175544B2/en
Priority to CN202010070103.0A priority patent/CN111508855B/zh
Priority to PCT/JP2015/050619 priority patent/WO2015108025A1/ja
Priority to KR1020167017700A priority patent/KR102386367B1/ko
Priority to TW104101031A priority patent/TWI661027B/zh
Priority to CN201580004803.7A priority patent/CN105917529B/zh
Publication of JP2015135878A publication Critical patent/JP2015135878A/ja
Publication of JP2015135878A5 publication Critical patent/JP2015135878A5/ja
Pending legal-status Critical Current

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    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1345—Conductors connecting electrodes to cell terminals
    • G02F1/13452—Conductors connecting driver circuitry and terminals of panels
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    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
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    • H05K2203/16—Inspection; Monitoring; Aligning
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  • Crystallography & Structural Chemistry (AREA)
  • Optics & Photonics (AREA)
  • Mathematical Physics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Wire Bonding (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
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  • Conductive Materials (AREA)
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JP2014006285A 2014-01-16 2014-01-16 接続体、接続体の製造方法、接続方法、異方性導電接着剤 Pending JP2015135878A (ja)

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JP2014006285A JP2015135878A (ja) 2014-01-16 2014-01-16 接続体、接続体の製造方法、接続方法、異方性導電接着剤
US15/112,263 US10175544B2 (en) 2014-01-16 2015-01-13 Connection body, method for manufacturing a connection body, connecting method and anisotropic conductive adhesive agent
CN202010070103.0A CN111508855B (zh) 2014-01-16 2015-01-13 连接体及其制造方法、连接方法、各向异性导电粘接剂
PCT/JP2015/050619 WO2015108025A1 (ja) 2014-01-16 2015-01-13 接続体、接続体の製造方法、接続方法、異方性導電接着剤
KR1020167017700A KR102386367B1 (ko) 2014-01-16 2015-01-13 접속체, 접속체의 제조 방법, 접속 방법, 이방성 도전 접착제
TW104101031A TWI661027B (zh) 2014-01-16 2015-01-13 連接體、連接體之製造方法、連接方法、異向性導電接著劑
CN201580004803.7A CN105917529B (zh) 2014-01-16 2015-01-13 连接体、连接体的制造方法、连接方法、各向异性导电粘接剂

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2023189711A1 (ja) * 2022-03-31 2023-10-05 デクセリアルズ株式会社 接続構造体及びその製造方法

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102593532B1 (ko) * 2016-06-03 2023-10-26 삼성디스플레이 주식회사 이방성 도전 필름 및 이를 이용한 디스플레이 장치
JP6435555B2 (ja) * 2016-11-09 2018-12-12 本田技研工業株式会社 導電部品固定構造
EP3701035A4 (en) 2017-10-26 2021-05-26 Noroo IC Co., Ltd. PREPARATION AND SEPARATION OF 3-HYDROXYPROPIONIC ACID
US11566250B2 (en) 2017-10-26 2023-01-31 Noroo Ic Co., Ltd. Production and separation of 3-hydroxypropionic acid
JP7185252B2 (ja) 2018-01-31 2022-12-07 三国電子有限会社 接続構造体の作製方法
JP7046351B2 (ja) 2018-01-31 2022-04-04 三国電子有限会社 接続構造体の作製方法
JP7160302B2 (ja) * 2018-01-31 2022-10-25 三国電子有限会社 接続構造体および接続構造体の作製方法
TW202534091A (zh) 2020-03-26 2025-09-01 日商積水化學工業股份有限公司 樹脂粒子、導電性粒子、導電材料、及連接結構體

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007035743A (ja) * 2005-07-25 2007-02-08 Asahi Kasei Electronics Co Ltd 回路接続方法および接続構造体
JP2010251336A (ja) * 2010-07-26 2010-11-04 Sony Chemical & Information Device Corp 異方性導電フィルム及びこれを用いた接続構造体の製造方法
WO2013089199A1 (ja) * 2011-12-16 2013-06-20 旭化成イーマテリアルズ株式会社 異方導電性フィルム付き半導体チップ、異方導電性フィルム付き半導体ウェハ、及び半導体装置
WO2013146573A1 (ja) * 2012-03-29 2013-10-03 デクセリアルズ株式会社 導電性粒子、回路接続材料、実装体、及び実装体の製造方法

Family Cites Families (31)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5685939A (en) * 1995-03-10 1997-11-11 Minnesota Mining And Manufacturing Company Process for making a Z-axis adhesive and establishing electrical interconnection therewith
KR100558639B1 (ko) * 1997-02-27 2006-06-28 세이코 엡슨 가부시키가이샤 접착제,액정장치,액정장치의제조방법및전자기기
JP3468103B2 (ja) * 1998-06-18 2003-11-17 松下電器産業株式会社 電子部品の実装方法
JP3379456B2 (ja) * 1998-12-25 2003-02-24 ソニーケミカル株式会社 異方導電性接着フィルム
JP2001323246A (ja) * 2000-03-07 2001-11-22 Sony Chem Corp 電極接続用接着剤及びこれを用いた接着方法
JP2003064324A (ja) * 2001-06-11 2003-03-05 Hitachi Chem Co Ltd 異方導電性接着フィルム及びそれを用いた回路基板の接続方法、回路基板接続体
JP3910527B2 (ja) * 2002-03-13 2007-04-25 シャープ株式会社 液晶表示装置およびその製造方法
KR100559937B1 (ko) * 2003-01-08 2006-03-13 엘에스전선 주식회사 미세회로의 접속방법 및 그에 의한 접속 구조체
KR101057608B1 (ko) * 2003-02-05 2011-08-18 고조 후지모토 단자간 접속 방법 및 반도체 장치의 실장 방법
JP4123998B2 (ja) * 2003-03-24 2008-07-23 松下電器産業株式会社 電子回路装置およびその製造方法
US20060280912A1 (en) 2005-06-13 2006-12-14 Rong-Chang Liang Non-random array anisotropic conductive film (ACF) and manufacturing processes
JP4887700B2 (ja) * 2005-09-09 2012-02-29 住友ベークライト株式会社 異方導電性フィルムおよび電子・電機機器
JP4789738B2 (ja) 2006-07-28 2011-10-12 旭化成イーマテリアルズ株式会社 異方導電性フィルム
WO2008038565A1 (fr) * 2006-09-26 2008-04-03 Hitachi Chemical Company, Ltd. Composition adhésive conductrice anisotrope, film conducteur anisotrope, structure de connexion d'éléments de circuit et procédé de fabrication de particules enrobées
JP4780197B2 (ja) * 2006-10-17 2011-09-28 日立化成工業株式会社 被覆粒子及びその製造方法、並びに、被覆粒子を用いた異方導電性接着剤組成物及び異方導電性接着剤フィルム
JP5147263B2 (ja) * 2007-03-09 2013-02-20 旭化成イーマテリアルズ株式会社 回路接続用異方導電性接着フィルム
US20090278213A1 (en) * 2008-05-08 2009-11-12 International Business Machines Corporation Electrode arrays and methods of fabricating the same using printing plates to arrange particles in an array
JP4897778B2 (ja) * 2008-11-20 2012-03-14 ソニーケミカル＆インフォメーションデバイス株式会社 接続フィルム、並びに、接合体及びその製造方法
JP4888482B2 (ja) * 2008-12-22 2012-02-29 日立化成工業株式会社 異方導電性接着剤組成物、それを用いた回路端子の接続方法及び接続構造体
JP5662945B2 (ja) * 2008-12-23 2015-02-04 スリーエム イノベイティブ プロパティズ カンパニー 微多孔性有機ケイ酸塩材料を有する有機化学センサ
JP2010010142A (ja) * 2009-10-07 2010-01-14 Hitachi Chem Co Ltd 熱硬化性回路接続部材及びそれを用いた電極の接続構造、電極の接続方法
JP5589361B2 (ja) * 2009-11-16 2014-09-17 日立化成株式会社 導電粒子及びその製造方法
WO2011083824A1 (ja) * 2010-01-08 2011-07-14 日立化成工業株式会社 回路接続用接着フィルム及び回路接続構造体
JP5206840B2 (ja) * 2010-06-14 2013-06-12 日立化成株式会社 回路接続用接着フィルム、これを用いた回路接続構造体及び回路部材の接続方法
CN103589384B (zh) * 2010-07-26 2016-03-02 日立化成株式会社 粘接剂组合物、连接结构体、连接结构体的制造方法、以及粘接剂组合物的应用
JP5318840B2 (ja) * 2010-11-08 2013-10-16 デクセリアルズ株式会社 異方性導電フィルム、異方性導電フィルムの製造方法、電子部材間の接続方法及び接続構造体
JP5883679B2 (ja) * 2011-02-25 2016-03-15 積水化学工業株式会社 接続構造体の製造方法、異方性導電材料及び接続構造体
JP2014149918A (ja) * 2011-06-06 2014-08-21 Hitachi Chemical Co Ltd フィルム状回路接続材料及び回路接続構造体
JP5614440B2 (ja) * 2011-10-26 2014-10-29 日立化成株式会社 回路部品及びその製造方法
JP2013105636A (ja) * 2011-11-14 2013-05-30 Dexerials Corp 異方性導電フィルム、接続方法、及び接合体
JP2013182823A (ja) * 2012-03-02 2013-09-12 Dexerials Corp 接続体の製造方法、及び異方性導電接着剤

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007035743A (ja) * 2005-07-25 2007-02-08 Asahi Kasei Electronics Co Ltd 回路接続方法および接続構造体
JP2010251336A (ja) * 2010-07-26 2010-11-04 Sony Chemical & Information Device Corp 異方性導電フィルム及びこれを用いた接続構造体の製造方法
WO2013089199A1 (ja) * 2011-12-16 2013-06-20 旭化成イーマテリアルズ株式会社 異方導電性フィルム付き半導体チップ、異方導電性フィルム付き半導体ウェハ、及び半導体装置
WO2013146573A1 (ja) * 2012-03-29 2013-10-03 デクセリアルズ株式会社 導電性粒子、回路接続材料、実装体、及び実装体の製造方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2023189711A1 (ja) * 2022-03-31 2023-10-05 デクセリアルズ株式会社 接続構造体及びその製造方法

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