TW201540811A - 連接體、連接體之製造方法、連接方法、異向性導電接著劑 - Google Patents

連接體、連接體之製造方法、連接方法、異向性導電接著劑 Download PDF

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Publication number
TW201540811A
TW201540811A TW104101031A TW104101031A TW201540811A TW 201540811 A TW201540811 A TW 201540811A TW 104101031 A TW104101031 A TW 104101031A TW 104101031 A TW104101031 A TW 104101031A TW 201540811 A TW201540811 A TW 201540811A
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Taiwan
Prior art keywords
conductive particles
electronic component
anisotropic conductive
adhesive
liquid crystal
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TW104101031A
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English (en)
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TWI661027B (zh
Inventor
Seiichiro Shinohara
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Dexerials Corp
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Publication of TWI661027B publication Critical patent/TWI661027B/zh

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    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1345—Conductors connecting electrodes to cell terminals
    • G02F1/13452—Conductors connecting driver circuitry and terminals of panels
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    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
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Abstract

即便是電路基板之配線間距或電子零件之電極端子細間距化，亦可確保電子零件與電路基板之導通性並且防止電子零件之電極端子間的短路。 一種連接體，其係於電路基板12上介隔異向性導電接著劑1而連接有電子零件18的連接體10，並且異向性導電接著劑1的導電性粒子4被規則地配置，導電性粒子4之粒徑為電子零件18之連接電極19高度的1/2以下。

Description

連接體、連接體之製造方法、連接方法、異向性導電接著劑
本發明關於連接電子零件與電路基板之方法，特別是關於介隔含導電性粒子之接著劑而將電子零件連接於電路基板而成之連接體、連接體之製造方法、電子零件之連接方法及異向性導電接著劑。本發明是以2014年1月16日於日本申請之日本專利申請案特願2014-6285為基礎並主張優先權，參照該申請，藉此援用於本發明中。
從古至今，液晶顯示裝置或有機EL(organic electro-luminescence)面板用作電視或PC螢幕、手機或智慧型手機、攜帶型遊戲機、平板終端或可穿戴終端、或車輛用螢幕等各種顯示手段。近年來，就細間距(fine pitch)化、輕量薄型化等觀點而言，於此種顯示裝置採用如下方法：將驅動用IC直接構裝於顯示面板之玻璃基板上即所謂之COG(chip on glass)。
例如於採用COG構裝方式之液晶顯示面板中，如圖6(A)(B)所示，將多個由ITO(氧化銦錫)等構成之透明電極102形成於由玻璃基板等構成之透明基板101，於該等透明電極102上連接液晶驅動用IC 103等電子零件。液晶驅動用IC 103於構裝面對應於透明電極102而形成多個電極端子104，並且介隔異向性導電膜105，而被熱壓接於透明基板101上，藉此將電極端子104與透明電極102連接。
異向性導電膜105，其係於黏合劑樹脂混入導電性粒子而形 成為膜狀者，故在2個導體間藉由加熱壓接，利用導體性粒子而取得導體間之電性導通，並且利用黏合劑樹脂而保持導體間之機械連接。構成異向性導電膜105之接著劑，通常是使用可靠度高之熱硬化性之黏合劑樹脂，但亦可使用光硬化性之黏合劑樹脂或光熱併用型之黏合劑樹脂。
介隔此種異向性導電膜105而將液晶驅動用IC 103連接在透 明電極102時，首先，以未圖示之暫時壓接手段來將異向性導電膜105暫時貼於透明基板101之透明電極102上。接著，介隔異向性導電膜105而於透明基板101上搭載液晶驅動用IC 103並形成暫時連接體，之後利用熱壓接頭106等熱壓接手段來將液晶驅動用IC 103與異向性導電膜一起加熱壓接在透明電極102側。藉由該熱壓接頭106所產生之加熱，異向性導電膜105會產生熱硬化反應，藉此液晶驅動用IC 103被壓接於透明電極102上。
【專利文獻1】日本專利第4789738號公報
【專利文獻2】日本特表2009-535843號公報
隨著近年液晶顯示裝置之類的電子機器之小型化、高機能化，電子零件亦被追求小型化、低背化，稱為凸塊之電極端子104之高度亦降低。又，亦朝著電路基板之配線間距或電子零件之電極端子的細間距化，當使用異向性導電膜來將IC晶片等電子零件COG連接於電極端子經細間距化之電路基板上時，為了於已窄化之電極端子間亦確實地夾持導電性粒子並確保導通，必需高密度地充填導電性粒子。
但是，如圖7所示般，若在發展低背化之電極端子104時將導電性粒子107高密度地充填，則於電極端子104間端子間短路之發生率會 提高。即，如圖7(A)所示般，於電極端子104之高度與先前相同之情形時，由於確保有較廣之端子間面積，故即便將導電性粒子107高密度地充填亦不會產生由分散於端子間之導電性粒子107連續所致的端子間短路之問題。因此，可謀求因導電性粒子107之高密度充填所致之導通性之提升及端子間短路之防止。
但是，如圖7(B)所示般，電極端子104經低背化之電子 零件中，因端子間面積被窄化，若使用高密度地充填有導電性粒子107之異向性導電膜，則於電極端子104之端子間導電性粒子會相連而導致端子間短路。再者，形成於電路基板之電極一般是利用印刷等而形成為數十nm~數μm等級之薄度，因此於電路基板側之電極間，短路並不會是問題。
此處，本發明之目的在於提供連接體、連接體之製造方法、 電子零件之連接方法及異向性導電接著劑，該連接體即便電路基板之配線間距或電子零件之電極端子被細間距化，亦可確保電子零件與電路基板之導通性並且防止電子零件之電極端子間之短路。
為了解決上述之問題，本發明之連接體，其於電路基板上介 隔異向性導電接著劑而連接有電子零件，並且上述異向性導電接著劑之導電性粒子被規則地配置，上述導電性粒子之粒徑為上述電子零件之連接電極高度的1/2以下。
又，本發明之連接體之製造方法，其係於電路基板上介隔含 有導電性粒子之接著劑而搭載電子零件，將上述電子零件抵壓於上述電路基板並且使上述接著劑硬化，藉此將上述電子零件連接於上述電路基板上，並且上述異向性導電接著劑之導電性粒子被規則地配置，上述導電性粒子之粒徑為上述電子零件之連接電極高度的1/2以下。
又，本發明之電子零件之連接方法，其係於電路基板上介隔 含有導電性粒子之接著劑而搭載電子零件，將上述電子零件抵壓於上述電 路基板並且使上述接著劑硬化，藉此將上述電子零件連接於上述電路基板上，並且上述異向性導電接著劑之導電性粒子被規則地配置，上述導電性粒子之粒徑為上述電子零件之連接電極高度的1/2以下。
又，本發明之異向性導電接著劑，其被貼著於電路基板之表 面並且搭載電子零件，而將上述電子零件連接於上述電路基板，並且異向性導電接著劑中之導電性粒子被規則地配置，上述導電性粒子之粒徑為上述電子零件之連接電極高度的1/2以下。
根據本發明，由於使異向性導電接著劑之導電性粒子規則地 配置並且使導電性粒子之粒徑為電子零件之連接電極高度的1/2以下，故於連接電極間導電性粒子不會凝聚而保持粒子間距離。因此，即便因連接電極間之剖面積窄化亦可防止端子間短路。
1、105‧‧‧異向性導電膜
2‧‧‧剝離膜
3‧‧‧黏合劑樹脂層
4‧‧‧導電性粒子
6‧‧‧捲取盤
10‧‧‧液晶顯示面板
11、12、101‧‧‧透明基板
12a‧‧‧緣部
13‧‧‧密封件
14‧‧‧液晶
15‧‧‧面板顯示部
16、17、102‧‧‧透明電極
17a‧‧‧端子部
18‧‧‧液晶驅動用IC
18a‧‧‧構裝面
19、104‧‧‧電極端子
20‧‧‧COG構裝部
21‧‧‧基板側對準記號
22‧‧‧IC側對準記號
33、106‧‧‧熱壓接頭
103‧‧‧電子零件
圖1為表示作為連接體之一例的液晶顯示面板之剖面圖。
圖2為表示液晶驅動用IC與透明基板之連接步驟的剖面圖。
圖3為表示異向性導電膜之剖面圖。
圖4為表示使導電性粒子格子狀地規則排列而成之異向性導電膜的俯視圖。
圖5(A)為表示具有先前之電極端子高度之IC晶片的連接狀態之剖面圖。圖5(B)為本發明中達到電極端子低背化之IC晶片的連接狀態之剖面圖。
圖6為表示將IC晶片連接於液晶顯示面板之透明基板之步驟的剖面圖。
圖7(A)為表示具有先前之電極端子高度之IC晶片的連接狀態之剖面 圖。圖7(B)為於先前之構成中達到電極端子低背化之IC晶片的連接狀態之剖面圖。
以下，一面參照圖式，一面詳細地說明使用有本發明之連接體、連接體之製造方法、連接方法、異向性導電接著劑。再者，本發明並非僅限定於以下之實施形態，在不脫離本發明主旨之範圍內當然可進行各種之變化。又，圖式為示意性者，各尺寸之比率等有時與現實尺寸不同。具體之尺寸等應參酌以下之說明做出判斷。又，當然於圖式相互間亦包括相互之尺寸之關係或比率不同之部分。
〔液晶顯示面板〕
以下，作為使用有本發明之連接體，以於液晶顯示面板之玻璃基板構裝作為電子零件之液晶驅動用IC晶片之情況為例進行說明。此液晶顯示面板10如圖1所示般，相對向的配置由玻璃基板等構成之兩片透明基板11、12，該等透明基板11、12藉由框狀之密封件13而相互地貼合。此外，液晶顯示面板10於藉由透明基板11、12所圍成之空間內封入液晶14，藉此形成有面板顯示部15。
透明基板11、12於互為相對之兩內側表面，以相互交叉之方式形成有由ITO(氧化銦錫)等構成之條紋狀的一對透明電極16、17。而且，兩透明電極16、17利用該等兩透明電極16、17之該交叉部位構成作為液晶顯示之最小單位之像素。
兩透明基板11、12中一片透明基板12形成為較另一片之透明基板11的平面尺寸大，於該較大地形成之透明基板12之緣部12a，設置有構裝作為電子零件之液晶驅動用IC 18的COG構裝部20。再者，於COG構裝部20形成有透明電極17之端子部17a、及與被設置於液晶驅動用IC 18 之IC側對準記號22重疊之基板側對準記號21。
液晶驅動用IC 18可藉由對象素選擇性地施加液晶驅動電 壓，使液晶配向局部地產生變化，而進行特定之液晶顯示。又，如圖2所示，液晶驅動用IC 18，於對著透明基板12之構裝面18a形成有與透明電極17之端子部17a導通連接的複數個電極端子19(凸塊)。電極端子19較佳為使用例如銅凸塊或金凸塊，或對銅凸塊施以鍍金而成者等。
〔電極端子〕
電極端子19，例如是沿著構裝面18a之一邊側緣將輸入凸塊排列成一列，沿著與一邊側緣相對之另一邊側緣將輸出凸塊交錯地排列成複數列。 電極端子19與設置在透明基板12之COG構裝部20的端子部17a係分別同數目且相同間距地形成，再將透明基板12與液晶驅動用IC 18位置配合並進行連接，藉此得以連接。
再者，伴隨近年之液晶顯示裝置等電子機器小型化、高機能 化，液晶驅動用IC 18等電子零件亦被要求小型化、低背化，並且亦將電極端子19其高度變低(例如6~15μm)。
又，由於與基板側對準記號21加以重疊，因此液晶驅動用IC 18於構裝面18a形成有進行與透明基板12之對位的IC側對準記號22。再者，由於透明基板12之透明電極17之配線間距或液晶驅動用IC 18之電極端子19的細間距化正在發展，因此液晶驅動用IC 18與透明基板12正被要求著高精度之對準調整。
基板側對準記號21及IC側對準記號22，可使用藉由組合而得以對準透明基板12與液晶驅動用IC 18的各種記號。
於形成在COG構裝部20之透明電極17之端子部17a上，使用異向性導電膜1作為電路連接用接著劑而連接液晶驅動用IC 18。異向性導電膜1含有導電性粒子4，並且隔著導電性粒子4將液晶驅動用IC 18 之電極端子19與形成在透明基板12之緣部12a的透明電極17之端子部17a電性連接。該異向性導電膜1藉由熱壓接頭33而受到熱壓接，藉此黏合劑樹脂流動化，從而導電性粒子4在端子部17a與液晶驅動用IC 18之電極端子19之間被壓扁，在該狀態黏合劑樹脂會硬化。藉此，異向性導電膜1電性且機械性地將透明基板12與液晶驅動用IC 18連接。
又，於兩透明電極16、17上，形成有經特定之摩擦處理的 配向膜24，藉由該配向膜24液晶分子之初期配向受到限制。進而，於兩透明基板11、12之外側設置一對偏光板25、26，藉由該兩偏光板25、26，而限制來自背光等光源(未圖示)之穿透光的震動方向。
〔異向性導電膜〕
接著，說明異向性導電膜1。異向性導電膜(ACF：anisotropic conductive film)1如圖3所示，通常於為基材之剝離膜2上形成有含導電性粒子4之黏合劑樹脂層(接著劑層)3。異向性導電膜1為熱硬化型或紫外線等光硬化型之接著劑，是被貼著在形成於液晶顯示面板10之透明基板12的透明電極17上並且搭載有液晶驅動用IC 18，藉由熱壓接頭33而受到熱加壓，藉此流動化，而導電性粒子4在相對向之透明電極17之端子部17a與液晶驅動用IC 18之電極端子19之間被壓碎，再經加熱或紫外線照射，導電性粒子會以被壓碎之狀態進行硬化。藉此，異向性導電膜1可與透明基板12及液晶驅動用IC18連接並導通。
又，異向性導電膜1之導電性粒子4被規則地以固定之圖案排列於含有膜形成樹脂、熱硬化性樹脂、潛伏性硬化劑、矽烷偶合劑等的通常之黏合劑樹脂層3。
支持黏合劑樹脂層3之剝離膜2，係於例如PET(poly ethylene terephthalate)、OPP(oriented polypropylene)、PMP(poly-4-methylpentene-1)、PTFE(polytetrafluoroethylene)等塗佈聚矽氧等剝離劑而成，防止異向性導 電膜1之乾燥並且維持異向性導電膜1之形狀。
黏合劑樹脂層3所含有之膜形成樹脂較佳為平均分子量為 10000~80000左右之樹脂。膜形成樹脂可列舉環氧樹脂、改質環氧樹脂、胺酯樹脂(urethane resin)、苯氧樹脂等各種樹脂。其中，就膜形成狀態、連接可靠度等觀點而言，特佳為苯氧樹脂。
熱硬化性樹脂並無特別限制，例如可列舉市售之環氧樹脂、 丙烯酸樹脂等。
環氧樹脂並無特別限制，例如可列舉萘型環氧樹脂、聯苯型 環氧樹脂、苯酚酚醛清漆(phenol novolac)型環氧樹脂、雙酚型環氧樹脂、茋(stilbene)型環氧樹脂、三酚甲烷(triphenolmethane)型環氧樹脂、苯酚芳烷基(phenol aralkyl)型環氧樹脂、萘酚型環氧樹脂、二環戊二烯型環氧樹脂、三苯甲烷型環氧樹脂等。該等可單獨，亦可為2種以上之組合。
丙烯酸樹脂並無特別限制，可根據目的適當選擇丙烯酸化合 物、液狀丙烯酸酯等。例如可列舉：丙烯酸甲酯、丙烯酸乙酯、丙烯酸異丙酯、丙烯酸異丁酯、環氧丙烯酸酯、乙二醇二丙烯酸酯、二乙二醇二丙烯酸酯、三羥甲基丙烷三丙烯酸酯、二羥甲基三環癸烷二丙烯酸酯、伸丁二醇四丙烯酸酯(tetramethyleneglycoltetraacrylate)、2-羥基-1,3-二丙烯醯氧基丙烷、2,2-雙[4-(丙烯醯氧基甲氧基)苯基]丙烷、2,2-雙[4-(丙烯醯氧基乙氧基)苯基]丙烷、丙烯酸二環戊烯酯、丙烯酸三環癸酯、三(丙烯醯氧基乙基)異氰尿酸酯、丙烯酸胺酯、環氧丙烯酸酯等。再者，亦可使用將丙烯酸酯改為甲基丙烯酸酯者。該等可單獨使用1種，亦可併用2種以上。
潛伏性硬化劑並無特別限定，例如可列舉加熱硬化型、UV 硬化型等各種硬化劑。潛伏性硬化劑通常並不會反應，而是藉由熱、光、加壓等根據用途而選擇之各種觸發，加以活化而開始反應。熱活性型潛伏性硬化劑之活化方法中，存在如下方法：藉由利用加熱之解離反應等而生 成活性物質(陽離子或陰離子、自由基)之方法；於室溫附近穩定分散於環氧樹脂中且於高溫與環氧樹脂相溶、溶解而開始硬化反應的方法；於高溫溶出分子篩填充型硬化劑而開始硬化反應之方法；利用微膠囊之溶出、硬化方法等。熱活性型潛伏性硬化劑有咪唑系、醯肼系、三氟化硼-胺錯合物、鋶鹽、胺化醯亞胺、聚胺鹽、二氰二胺等或該等之改質物，該等可單獨，亦可為2種以上之混合體。其中，較佳為微膠囊型咪唑系潛伏性硬化劑。
矽烷偶合劑並無特別限定，例如可列舉環氧系、胺基系、巰 基/硫醚系、脲基(ureide)系等。藉由添加矽烷偶合劑，提高有機材料與無機材料之界面的接著性。
〔導電性粒子〕
導電性粒子4可列舉被使用於異向性導電膜1中之周知的任一種導電性粒子。導電性粒子4例如可列舉鎳、鉄、銅、鋁、錫、鉛、鉻、鈷、銀、金等各種金屬或金屬合金之粒子，於金屬氧化物、碳、石墨、玻璃、陶瓷、塑膠等粒子之表面塗佈有金屬者，或於該等粒子之表面進而塗佈有絕緣薄膜者等。當為樹脂粒子之表面塗佈有金屬者時，樹脂粒子例如可列舉環氧樹脂、酚樹脂、丙烯酸樹脂、丙烯腈-苯乙烯(AS)樹脂、苯胍(benzoguanamine)樹脂、二乙烯苯系樹脂、苯乙烯系樹脂等之粒子。
再者，由於透明基板12之透明電極17的配線間距或液晶驅動用IC 18之電極端子19的細間距化正在發展，因此當於透明基板12上使液晶驅動用IC 18進行COG連接時，為了於已狹窄化之電極端子間亦確實地夾持導電性粒子而確保導通，異向性導電膜1被高密度(例如16000個/mm2)地填充導電性粒子4。
〔導電性粒子之規則排列〕
異向性導電膜1之導電性粒子4於俯視時，被規則地以固定之排列圖 案排列，例如如圖4所示被格子狀且均等地排列。藉由於俯視時被規則地排列，與異向性導電膜1之導電性粒子4被無規地分散之情況相比，即便液晶驅動用IC 18之鄰接的電極端子19間細間距化且端子間面積狹窄化，並且導電性粒子4被高密度地填充，在液晶驅動用IC 18之連接步驟中亦可防止因導電性粒子4之凝聚體所致的電極端子19間之短路。
又，藉由將異向性導電膜1之導電性粒子4規則地排列，於 高密度地填充於黏合劑樹脂層3之情形時，亦可防止由導電性粒子4之凝聚所致的低密度之發生。因此，根據異向性導電膜1，即便於經細間距化之端子部17a或電極端子19亦可捕捉導電性粒子4。導電性粒子4之均等排列圖案可任意地設定為於俯視時是四角格子或六角格子等。之後詳細敘述液晶驅動用IC 18之連接步驟。
此種異向性導電膜1可藉由例如下述方法等來製造：於可延 伸之片材上塗佈黏著劑，於其上將導電性粒子4進行單層排列後，再將該片材以所需之延伸倍率進行延伸的方法；使導電性粒子4於基板上整齊排列為特定之排列圖案，之後在剝離膜2所支持之黏合劑樹脂層3轉印導電性粒子4的方法；或者是，於剝離膜2所支持之黏合劑樹脂層3上，介隔按排列圖案而設置有開口部的排列板而供給導電性粒子4之方法等。
〔粒子個數密度〕
又，因異向性導電膜1確實地被夾持於經細間距化之電極端子19及端子部17a之間，因此被高密度地填充於黏合劑樹脂層，較佳為使個數密度為10000~60000個/mm2。若粒子個數密度少於10000個/mm2，則經細間距化之電極端子19及端子部17a之間的粒子捕捉數減少，而導通電阻升高。又，若粒子個數密度多於60000個/mm2，則位於經狹窄化之電極端子19間的空間之導電性粒子會連結，而有使鄰接之電極端子19間短路之虞。
再者，異向性導電膜1之形狀並無特別限定，例如可如圖3 所示，設為可捲繞在卷取盤6之長條帶形狀，並僅剪下一定之長度來使用。
又，上述之實施形態中，異向性導電膜1，是以將在黏合劑 樹脂層3規則排列有導電性粒子4之熱硬化性樹脂組成物成形為膜狀之接著膜為例進行說明，但本發明之接著劑並不限定於此，例如可設為如下之構成：積層有僅由黏合劑樹脂3構成之絕緣性接著劑層、及由規則排列有導電性粒子4之黏合劑樹脂3構成之導電性粒子含有層的構成。又，異向性導電膜1中，只要導電性粒子4在俯視時被規則排列，則除如圖2所示般單層排列以外，亦可跨及多個黏合劑樹脂層3將導電性粒子4排列並且於俯視時被規則地排列。又，異向性導電膜1亦可在多層構成之至少1層內，被單獨地以特定距離分散。
〔連接步驟〕
繼而，針對將液晶驅動用IC 18連接於透明基板12之連接步驟進行說明。首先，將異向性導電膜1暫時貼於透明基板12之形成有端子部17a的COG構裝部20上。接著，將該透明基板12載置於連接裝置之台上，於透明基板12之構裝部上介隔異向性導電膜1而配置液晶驅動用IC 18。
接著，利用已加熱至使黏合劑樹脂層3硬化之特定溫度的熱 壓接頭33，以特定之壓力、時間自液晶驅動用IC 18上進行熱加壓。藉此，異向性導電膜1之黏合劑樹脂層3表現出流動性，而自液晶驅動用IC 18之構裝面18a與透明基板12之COG構裝部20間流出，並且，黏合劑樹脂層3中之導電性粒子4被夾持於液晶驅動用IC 18之電極端子19與透明基板12之端子部17a之間而被壓扁。
結果，藉由在電極端子19與端子部17a之間夾持導電性粒 子4而電性地連接，此狀態下經熱壓接頭33加熱之黏合劑樹脂會硬化。藉此，可製造在液晶驅動用IC 18之端極端子19、與形成於透明基板12之端子部17a之間導通性得以確保的液晶顯示面板10。
並未在電極端子19與端子部17a之間的導電性粒子4，其在 鄰接之電極端子19間被分散於黏合劑樹脂，維持電性絕緣之狀態。藉此，僅在液晶驅動用IC 18之輸出電極端子19與透明基板12之端子部17a之間得以電性導通。再者，使用自由基聚合反應系之快速硬化型作為黏合劑樹脂，藉此即便較短加熱時間亦可使黏合劑樹脂快速硬化。又，異向性導電膜1並未限定在熱硬化型，只要是進行加壓連接者，亦可使用光硬化型或是光熱併用型之接著劑。
〔導電性粒子之直徑〕
此處，本發明中導電性粒子4之粒徑設為上述液晶驅動用IC 18之電極端子19的高度之1/2以下。藉此，可防止因為在經細間距化之電極端子19間導電性粒子4連接所導致之端子間短路。
即，如上所述，隨著近年之液晶顯示裝置之類的電子機器之 小型化、高機能化，液晶驅動用IC 18等電子零件亦被要求小型化、低背化，也使得電極端子19之高度變低，故如圖5(A)(B)所示般，鄰接之電極端子19間的面積亦被狹窄化。
本發明中，異向性導電膜1之導電性粒子被規則地配置，並 且導電性粒子4之粒徑被設為上述液晶驅動用IC 18之電極端子19的高度之1/2以下。藉此，液晶顯示面板10可於電極端子19與端子部17a之間確實地捕捉導電性粒子而可確保導通性，並且可於鄰接之電極端子19間一邊保持一定之粒子間距離一邊將導電性粒子分散而防止電極端子19間之短路。
再者，如上所述，導電性粒子之個數密度較佳設為10000~ 60000個/mm2。藉由具有上述之個數密度，液晶顯示面板10可防止經狹窄化之電極端子19間之短路，並且於經細間距化之電極端子19與端子部17a之間確實地捕捉導電性粒子4，而可使導通性上昇。
【實施例】
繼而，說明本發明之實施例。本實施例中，使用導電性粒子經規則排列之異向性導電膜、及導電性粒子被無規地分散之異向性導電膜，作成將評價用IC連接於評價用玻璃基板而成的連接體樣品，分別測定電極間之導電性粒子的捕捉數、初期及可靠度試驗後之導通電阻、鄰接之端子間短路發生次數。
〔異向性導電膜〕
用於連接評價用IC的異向性導電膜之黏合劑樹脂層係藉由下述方法形成：調製黏合劑樹脂組成物，該黏合劑樹脂組成物係將苯氧樹脂(商品名：YP50，新日鐵化學公司製)60質量份、環氧樹脂(商品名：jER828，三菱化學公司製)40質量份、陽離子系硬化劑(商品名：SI-60L，三新化學工業公司製)2質量份添加於溶劑而成，將該黏合劑樹脂組成物塗佈於剝離膜上並進行燒成。
〔評價用IC〕
使用外形：1.5mm×13mm、厚度0.5mm，凸塊(Au-plated，鍍銀)面積：25μ×140μm，凸塊間空間：7.5μm之評價用IC作為評價元件。
〔評價用玻璃基板〕
使用外形：30mm×50mm、厚度0.5mm，並且形成有與評價用IC之凸塊同尺寸同間距之梳齒狀的電極圖案之ITO圖案玻璃作為連接評價用IC之評價用玻璃基板。
將異向性導電膜暫時貼於該評價用玻璃基板後，一邊取得評 價用IC之凸塊與評價用玻璃基板之配線電極的對準，一邊搭載評價用IC，利用熱壓接頭於180℃、80MPa、5秒之條件進行熱壓接，藉此製成連接體樣品。對各連接體樣品測定位於IC凸塊與基板電極間之導電性粒子的捕捉數、初期及可靠度試驗後之導通電阻、鄰接之凸塊間短路之發生次數。
位於IC凸塊與電極基板之間之導電性粒子的捕捉數，於各 連接體樣品，針對全部IC凸塊及基板電極測量1對IC評價用IC之凸塊與玻璃基板之電極間所捕捉到之導電性粒子的個數，求得其平均數及最少數。又，導通電阻是在初期及可靠度試驗後(85℃、85%RH、500小時)測定。凸塊間短路發生次數是測定評價用IC之凸塊間的短路之發生次數。
又，對各連接體樣品，測量導電性粒子彼此之間隔的最短距 離(μm)、及於剖視整個評價用IC之凸塊的排列方向時存在於凸塊間之導電性粒子的最大數量。
〔實施例1〕
實施例1中，使用將導電性粒子規則排列於黏合劑樹脂層的異向性導電膜。實施例1所使用之異向性導電膜為藉由下述方法製造：於可延伸之片材上塗佈黏著劑並於其上將導電性粒子4單層排列之後，於使該片材以所欲之延伸倍率延伸的狀態，將黏合劑樹脂層進行層壓。所使用之導電性粒子(商品名：AUL704，積水化學工業公司製)之粒徑為4μm、粒子個數密度為16000個/mm2。
又，於實施例1使用之評價用IC的凸塊高度為15μm，凸 塊間之空間的剖面積為112.5μm2(15μm×7.5μm)。
〔實施例2〕
實施例2中，使評價用IC之凸塊高度為12μm，使凸塊間之空間的剖面積為90μm2(12μm×7.5μm)，除此以外，設為與實施例1相同條件。
〔實施例3〕
實施例3中，使評價用IC之凸塊高度為8μm，使凸塊間之空間的剖面積為60μm2(8μm×7.5μm)，除此以外，設為與實施例1相同條件。
〔實施例4〕
實施例4中，使用粒徑5μm之導電性粒子(商品名：AUL705，積水 化學工業公司製)，藉由與實施例1相同之製法而獲得異向性導電膜。粒子個數密度為16000個/mm2。
又，於實施例4使用之評價用IC之凸塊高度為10μm，凸塊間之空間的剖面積為75μm2(10μm×7.5μm)。
〔實施例5〕
實施例5中，使用與實施例1相同之導電性粒子，藉由與實施例1相同之製法而獲得異向性導電膜。使粒子個數密度為10000個/mm2。
又，於實施例5使用之評價用IC之凸塊高度為8μm，凸塊間之空間的剖面積為60μm2(8μm×7.5μm)。
〔實施例6〕
實施例4中，使用粒徑3μm之導電性粒子(商品名：AUL703，積水化學工業公司製)，藉由與實施例1相同之製法而獲得異向性導電膜。粒子個數密度為60000個/mm2。
又，於實施例6使用之評價用IC之凸塊高度為8μm，凸塊間之空間的剖面積為60μm2(8μm×7.5μm)。
〔比較例1〕
比較例1中使用如下之異向性導電膜，該異向性導電膜係將導電性粒子添加於黏合劑樹脂組成物並加以調整，塗佈於剝離膜上進行燒成，藉此導電性粒子被無規地分散於黏合劑樹脂層而成者。所使用之導電性粒子(商品名：AUL704，積水化學工業公司製)之粒徑為4μm，粒子個數密度為16000個/mm2。
又，於比較例1使用之評價用IC之凸塊高度為15μm，凸塊間之空間的剖面積為112.5μm2(15μm×7.5μm)。
〔比較例2〕
比較例2中，使評價用IC之凸塊高度為8μm，使凸塊間之空間的剖面 積為60μm2(8μm×7.5μm)，除此以外，設為與比較例1相同之條件。
〔比較例3〕
比較例3中，使用粒徑為5μm之導電性粒子(商品名：AUL705，積水化學工業公司製)，藉由與實施例1相同之製法而獲得異向性導電膜。粒子個數密度為16000個/mm2。
又，於比較例3使用之評價用IC之凸塊高度為8μm，凸塊間之空間的剖面積為60μm2(8μm×7.5μm)。
如表1所示，實施例1~6之連接體樣品中，夾持於1對評 價用IC之凸塊與評價用玻璃基板的電極間之導電性粒子之數量平均為7.2以上，初期導通電阻為0.2Ω並且可靠度試驗後之導通電阻為5Ω以下，為良好。又，實施例1~6之連接體樣品中，結果為於凸塊間之導電性粒子數，最大為1~4，粒子間隔為0.5~2.1μm，凸塊間之短路發生數為40ppm以下且凸塊間之絕緣性亦良好。
另一方面，比較例1中，由於導電性粒子被無規地分散在黏 合劑樹脂層，因此於凸塊間之導電粒子數最大為7個，最小粒子間隔為0μm，即導電性粒子為連續，凸塊間之短路發生數變為3000ppm。
又，比較例2中，凸塊高度較低，為8μm。凸塊間之空間 的剖面積亦設為較比較例1狹小，為60μm2，因此，凸塊間之導電性粒子數變為最大6個，凸塊間之短路發生數變為5000ppm。
比較例3中，雖然使用使導電性粒子均等排列之異向性導電 膜，但導電性粒子之粒徑(5μm)大於凸塊高度(8μm)之1/2。因此，於凸塊間之空間中產生導電性粒子相連之地方，凸塊間之短路產生數變為60ppm。由此，可知導電性粒子之粒徑較佳設為凸塊高度之1/2以下。
再者，實施例5中，雖然導電性粒子個數密度為10000個/ mm2，而粒子捕捉數4個以下為不良，但其最少為6個，於實際使用上無問題。又，實施例6中，雖然導電性粒子之個數密度為60000個/mm2，而凸塊間之短路數為50ppm以上為不良，但其為40ppm以下，於實際使用上無問題。即，可知將異向性導電膜接著前的導電性粒子之個數密度設為10000~60000個/mm2為佳。

Claims (6)

  1. 一種連接體，其於電路基板上介隔異向性導電接著劑而連接有電子零件，並且，上述異向性導電接著劑之導電性粒子被規則地配置，上述導電性粒子之粒徑為上述電子零件之連接電極之高度的1/2以下。
  2. 如申請專利範圍第1項之連接體，其中，上述異向性導電接著劑之上述導電性粒子之個數密度為10000~60000個/mm2。
  3. 如申請專利範圍第1或2項之連接體，其中，上述導電性粒子被格子狀地排列。
  4. 一種連接體之製造方法，其係於電路基板上介隔含有導電性粒子之接著劑而搭載電子零件，將上述電子零件抵壓於上述電路基板並使上述接著劑硬化，藉此將上述電子零件連接於上述電路基板上，並且，上述異向性導電接著劑之導電性粒子被規則地配置，上述導電性粒子之粒徑為上述電子零件之連接電極之高度的1/2以下。
  5. 一種連接方法，其係於電路基板上介隔含有導電性粒子之接著劑而搭載電子零件，將上述電子零件抵壓於上述電路基板並使上述接著劑硬化，藉此將上述電子零件連接於上述電路基板上，並且，上述異向性導電接著劑之導電性粒子被規則地配置，上述導電性粒子之粒徑為上述電子零件之連接電極之高度的1/2以下。
  6. 一種異向性導電接著劑，其被貼著於電路基板之表面並且搭載電子零件，且將上述電子零件連接於上述電路基板，並且，導電性粒子被規則地配置， 上述導電性粒子之粒徑為上述電子零件之連接電極之高度的1/2以下。
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