WO2015037426A1 - 離型フィルム、成型体の製造方法、半導体部品及びリフレクター部品 - Google Patents
離型フィルム、成型体の製造方法、半導体部品及びリフレクター部品 Download PDFInfo
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- WO2015037426A1 WO2015037426A1 PCT/JP2014/072176 JP2014072176W WO2015037426A1 WO 2015037426 A1 WO2015037426 A1 WO 2015037426A1 JP 2014072176 W JP2014072176 W JP 2014072176W WO 2015037426 A1 WO2015037426 A1 WO 2015037426A1
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- WIPO (PCT)
- Prior art keywords
- release film
- mold
- resin
- release
- molding
- Prior art date
Links
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C33/00—Moulds or cores; Details thereof or accessories therefor
- B29C33/56—Coatings, e.g. enameled or galvanised; Releasing, lubricating or separating agents
- B29C33/68—Release sheets
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C33/00—Moulds or cores; Details thereof or accessories therefor
- B29C33/56—Coatings, e.g. enameled or galvanised; Releasing, lubricating or separating agents
- B29C33/58—Applying the releasing agents
Definitions
- the present invention relates to a release film, a method for producing a molded body using the release film, and a semiconductor component and a reflector component obtained by the production method.
- Patent Document 1 a film of a tetrafluoroethylene-ethylene copolymer has been proposed as a release film for use in molding a printed circuit board.
- a release film comprising a composition comprising a polymer having a 4-methyl-1-pentene content of 80% by mass or more, wherein the composition has a melting point of 170 to 240 ° C., and a semicrystallization time of 70 to 220 seconds.
- Patent Document 2 A release film has also been proposed (Patent Document 2).
- a release film used for molding a printed circuit board a film obtained by extrusion molding a resin composition obtained by mixing 25 to 400 parts by mass of a polyethylene resin with 100 parts by mass of an ethylene copolymer rubber is ionized.
- a release film formed by applying a release layer to a base film formed by irradiating actinic radiation for crosslinking has been proposed (Patent Document 3).
- the film of tetrafluoroethylene-ethylene copolymer of Patent Document 1 the film of polytetrafluoroethylene (PTFE), ethylene-tetrafluoroethylene copolymer (ETFE) or polyimide is formed at the molding temperature. Since the film does not heat shrink, wrinkles are involved when the film is set in the mold, and the shape of the mold may not be accurately reproduced.
- the release film of Patent Document 2 Since the release film of Patent Document 2 has a too high elastic modulus at the time of molding, the release film sufficiently reproduces the shape of the mold by wrinkling the molded product in the thermoforming process of the electronic member. There are things that cannot be done.
- the release film is not very flexible in a general thermal processing step, and the film does not shrink appropriately, so that the release film can be accurately shaped into the mold shape. Cannot stick, causing problems such as wrinkles in the molded product.
- the present invention provides a release film capable of improving moldability in thermoforming, a method for producing a molded body using the release film, and a semiconductor component and a reflector component obtained by the production method.
- the purpose is to do.
- the present invention is as follows.
- [1] A release film having a thermal shrinkage of 5% or more in the MD direction and the TD direction at 120 ° C.
- [2] The release film according to [1], wherein the thermal shrinkage in the MD direction and the TD direction at 110 ° C. is 2% or more.
- [3] A release layer and a base material layer are provided.
- the base material layer includes a polyolefin resin, and the melting point of the base material layer measured by DSC is 128 to 210 ° C.
- the release film as described.
- [6] The release film according to any one of [3] to [5], wherein the polyolefin resin of the base material layer is crosslinked with ionizing radiation.
- a method for producing a molded body comprising: a molding step of supplying a resin to a mold and molding the resin; and a step of peeling the release film.
- the method for producing a molded body according to [7] further including a step of arranging a substrate on which the semiconductor chip is mounted in a mold, and sealing the semiconductor chip with a resin in the molding step.
- the mold release film according to the present invention can improve the moldability in thermoforming as compared with the conventional one by having the above heat shrinkage rate.
- the method for producing a molded body using a release film according to the present invention eliminates the need for a mold cleaning step in the production of a molded body requiring high productivity, and eliminates defects such as wrinkles of the release film. It can be dramatically reduced and productivity can be dramatically increased.
- the thermal shrinkage rate in the MD direction (longitudinal direction, flow direction) and TD direction (lateral direction, width direction) at 120 ° C. is 5% or more.
- the thermal contraction rate of each of MD direction and TD direction in 110 degreeC is 2% or more.
- the said heat shrinkage rate is measured based on measuring method ASTM D2732.
- the above-mentioned “thermal shrinkage rates in the MD direction and the TD direction” are synonymous with “both thermal shrinkage rates in the MD direction and the TD direction”.
- the heat shrinkage rate is less than 5% at 120 ° C., when the film is set on the mold and evacuated, the film does not accurately follow the mold, the film is wrinkled, and the molded body is wrinkled. Will enter. If the heat shrinkage rate is 5% or more, the film is set on the mold without wrinkles, and thus the shape of the mold can be sufficiently reproduced.
- the lower limit of the heat shrinkage rate at 120 ° C. is preferably 5%.
- the upper limit is preferably 50%, more preferably 30%, and still more preferably 20%. These lower limit values and upper limit values can be freely combined to constitute a numerical range.
- the heat shrinkage rate is preferably 5 to 50%, more preferably 5 to 30%, still more preferably 5 to 20%. If the heat shrinkage is 50% or less, problems are less likely to occur in the process of setting the film in a mold and evacuating.
- the lower limit of the heat shrinkage rate at 110 ° C. is preferably 2%.
- the upper limit is preferably 30%, more preferably 20%, still more preferably 10%.
- These lower limit values and upper limit values can be freely combined to constitute a numerical range.
- the heat shrinkage rate is preferably 2 to 30%, more preferably 2 to 20%, still more preferably 2 to 10%. If the heat shrinkage is 30% or less, problems are less likely to occur in the process of setting the film in a mold and evacuating.
- the release film according to the present embodiment is, for example, a multilayer release film including at least two layers of a release layer and a base material layer containing a polyolefin resin, and includes two layers of the release layer and the base material layer. You may have a structure.
- the lower limit of the melting point of the base material layer measured by DSC is preferably 128 ° C.
- the upper limit is preferably 210 ° C, more preferably 160 ° C, and still more preferably 150 ° C.
- the melting point is preferably 128 to 210 ° C, more preferably 128 to 160 ° C, and still more preferably 128 to 150 ° C. If the melting point is 128 ° C. or higher, problems are unlikely to occur in the process of setting the film in a mold and evacuating. Further, if the melting point is 210 ° C. or lower, moderate shrinkage at the molding temperature is likely to occur, and wrinkles are not easily caught in the molded body.
- the base material layer includes, for example, a polyolefin resin as a main component.
- a polyolefin resin is a polymer synthesized using simple olefins or alkenes as unit molecules.
- Examples of the polyolefin resin include polyethylene resin, polypropylene resin, polyolefin polymer alloy, polybutene resin, polymethylpentene resin, and the like.
- polyethylene resin examples include polyethylene and ethylene- ⁇ -olefin copolymers.
- polyethylene examples include high density polyethylene, medium density polyethylene, low density polyethylene, and ultra low density polyethylene.
- the high-density polyethylene can be produced by a generally known method such as a Philips method, a standard method, or a Ziegler method.
- Examples of the medium density polyethylene include linear medium density polyethylene.
- Examples of the low density polyethylene include linear low density polyethylene (LLDPE) and high pressure method low density polyethylene.
- the high-pressure method low-density polyethylene is a low-density polyethylene produced by a so-called high-pressure method (bulk polymerization method).
- Examples of the ultra-low density polyethylene include linear ultra-low density polyethylene (VLDPE).
- the ethylene- ⁇ -olefin copolymer is preferably a copolymer of ethylene and an ⁇ -olefin having 3 to 20 carbon atoms, more preferably a copolymer of ethylene and an ⁇ -olefin having 3 to 12 carbon atoms.
- Examples of the ⁇ -olefin include propylene, 1-butene, 1-pentene, 1-hexene, 1-octene, 4-methyl-1-pentene and the like, and these can be used alone or in combination of two or more. .
- ethylene- ⁇ -olefin copolymer a copolymer of ethylene and at least one comonomer selected from propylene comonomer, butene comonomer, hexene comonomer and octene comonomer is generally easily available. Yes, it can be used suitably.
- Polyethylene resins include ethylene and ⁇ -olefins (propylene, 1-butene, 1-pentene, 1-hexene, 1-octene, 4-methyl-1-pentene, 3-methyl-1-pentene, 1-decene, A copolymer with 1-dodecene, 1-tetradecene, 1-hexadecene, 1-octadecene, 1-eicosane, etc.) is preferred, and ethylene and two ⁇ -olefins (propylene, 1-butene, 1-pentene, 1 -Hexene, 1-octene, 4-methyl-1-pentene, 3-methyl-1-pentene, 1-decene, 1-dodecene, 1-tetradecene, 1-hexadecene, 1-octadecene, 1-eicosane, etc.) A terpolymer (for example, a terpolymer of ethylene, propylene, and
- copolymers may be in any form such as a block copolymer and a random copolymer.
- a random copolymer of ethylene and propylene a random copolymer of ethylene and octene, and a random copolymer of ethylene, propylene and butene are preferable.
- the polyethylene resin can be polymerized using a known catalyst such as a single site catalyst or a multisite catalyst.
- the density of the polyethylene resin from the viewpoint of further excellent contractility, preferably 0.935 g / cm 3 or more, 0.940 g / cm 3 or more is more preferable.
- the shrinkability can be moderately suppressed, and the mechanical suitability of the release film can be improved.
- the lower limit of the melt flow rate (MFR, 190 ° C., 2.16 kg) of the polyethylene resin is preferably 0.5 g / 10 min, more preferably 0.8 g / 10 min, and 1.0 g / 10 min. More preferably.
- the upper limit is preferably 30 g / 10 min, and more preferably 25 g / 10 min. These lower limit values and upper limit values can be freely combined to constitute a numerical range.
- the melt flow rate is preferably 0.5 to 30 g / 10 min, more preferably 0.8 to 30 g / 10 min, and still more preferably 1.0 to 25 g / 10 min from the viewpoint of excellent processability of the release film. .
- polyethylene resin a polyethylene copolymer in which the crystal / amorphous structure (morphology) is controlled in nano order can be used.
- polypropylene resin polypropylene, propylene- ⁇ -olefin copolymer and the like can be suitably used.
- resin corresponding to the said polyethylene-type resin is remove
- the propylene- ⁇ -olefin copolymer refers to a copolymer of propylene and ⁇ -olefin.
- the propylene- ⁇ -olefin copolymer is preferably a copolymer of propylene and an ⁇ -olefin having 4 to 20 carbon atoms, more preferably a copolymer of propylene and an ⁇ -olefin having 4 to 8 carbon atoms.
- examples of the ⁇ -olefin having 4 to 20 carbon atoms include 1-butene, 1-pentene, 1-hexene, 1-octene, 4-methyl-1-pentene, 3-methyl-1-pentene and 1-decene. 1-dodecene, 1-tetradecene, 1-hexadecene, 1-octadecene, 1-eicosane and the like, and these may be used alone or in combination of two or more.
- a copolymer of propylene and at least one comonomer selected from ethylene comonomer, butene comonomer, hexene comonomer and octene comonomer is generally easily available and is preferably used. it can.
- the polypropylene resin can be polymerized using a known catalyst such as a single site catalyst or a multisite catalyst.
- Density of polypropylene resin the lower limit is preferably 0.860 g / cm 3, more preferably 0.870 g / cm 3.
- Upper limit is preferably 0.920 g / cm 3, preferably 0.915g / cm 3, 0.910g / cm 3 is more preferred.
- These lower limit values and upper limit values can be freely combined to constitute a numerical range.
- These same types of polypropylene may be used alone or in combination.
- the lower limit of the melt flow rate (MFR, 230 ° C., 2.16 kg) of the polypropylene resin is preferably 0.3 g / 10 min, more preferably 0.5 g / 10 min, and 0.8 g / 10 min. More preferably.
- the upper limit is preferably 15 g / 10 min, more preferably 12 g / 10 min, still more preferably 10 g / 10 min.
- These lower limit values and upper limit values can be freely combined to constitute a numerical range. For example, from the viewpoint of excellent processability of the release film, 0.3 to 15 g / 10 min is preferable, 0.5 to 12 g / 10 min is more preferable, and 0.8 to 10 g / 10 min is still more preferable.
- polypropylene resin a polypropylene copolymer in which the crystal / amorphous structure (morphology) is controlled in nano order can also be used.
- polypropylene resin a copolymer of propylene and an ⁇ -olefin such as butene, hexene or octene, or a terpolymer of propylene and an ⁇ -olefin such as butene, hexene or octene is preferably used.
- ⁇ -olefin such as butene, hexene or octene
- terpolymer of propylene and an ⁇ -olefin such as butene, hexene or octene
- These copolymers may be in any form such as a block copolymer and a random copolymer.
- the polypropylene resin is not limited to a resin polymerized with a catalyst such as a Ziegler-Natta catalyst, but may be a resin polymerized with a metallocene catalyst or the like, and syndiotactic polypropylene, isotactic polypropylene, or the like can also be used.
- a catalyst such as a Ziegler-Natta catalyst
- metallocene catalyst or the like
- syndiotactic polypropylene, isotactic polypropylene, or the like can also be used.
- the base resin of the base material layer contains the polypropylene resin
- a resin obtained by uniformly finely dispersing a rubber component having a high concentration of 50% by mass or less with respect to the total amount of the polypropylene resin is used as the base resin.
- the rubber component include an ethylene / propylene rubber component (EPR).
- the polybutene resin is particularly excellent in compatibility with the polypropylene resin, it is preferably used in combination with the polypropylene resin for the purpose of adjusting the hardness and waist of the release film.
- resin corresponding to the said polyethylene-type resin and polypropylene resin is remove
- the polybutene resin is crystalline, is a copolymer of butene and an olefin resin having 5 to 8 carbon atoms, and has a butene content of 70 mol in all monomers constituting the polybutene resin. % Or more of a high molecular weight polybutene resin can be suitably used.
- the melt flow rate (MFR, 190 ° C., 2.16 kg) of the polybutene resin is preferably 0.1 to 10 g / 10 min.
- the Vicat softening point is preferably 40 to 100 ° C.
- the Vicat softening point is a value measured according to JIS K7206-1982.
- the content of the polyolefin resin in the base material layer is preferably 50% by mass or more, more preferably 80% by mass or more, and still more preferably 90% by mass or more based on the entire base material layer.
- the base material layer is a known plasticizer, ultraviolet absorber, antioxidant, colorant, antistatic agent, petroleum resin, mineral oil, various surfactants, antiblocking agent, inorganic filler, etc. Further optional additives may be further included. The amount of the additive added is usually 0.1 to 5% by mass based on the entire base material layer.
- the polyolefin resin as described above is preferably crosslinked.
- a release film When such a release film is used in a thermoforming process, it has excellent heat resistance due to the effect of cross-linking, and it becomes easy to impart appropriate elongation and shrinkage by being biaxially stretched. Excellent mold followability.
- a release film can have excellent release properties in post-processing such as coating.
- the polyolefin resin does not melt and flow even in a thermoforming step above the melting point of the polyolefin resin. For this reason, perforation, film breakage and the like are unlikely to occur, and unprecedented flexibility can be exhibited, so that even complicated mold shapes can be stably followed, so that mold reproducibility is further improved.
- crosslinking method examples include a method of irradiating ionizing radiation such as ⁇ rays, ⁇ rays, gamma rays, neutron rays, and electron beams.
- ionizing radiation such as ⁇ rays, ⁇ rays, gamma rays, neutron rays, and electron beams.
- the use of ionizing radiation is preferable because the crosslinking component (so-called gel fraction) can be adjusted according to the irradiation conditions of the ionizing radiation.
- the gel fraction is the ratio of the degree of crosslinking determined by the calculation formula described later.
- the degree of cross-linking varies depending on the type of resin and the environment at the time of irradiation, but it can be controlled to a desired gel fraction by the irradiation density and irradiation intensity of ionizing radiation.
- the reproducibility is relatively good and the gel fraction can be within a certain range.
- LDPE low density polyethylene
- crosslinking starts from an irradiation density of 20 kGy, and the gel fraction increases as the irradiation density increases.
- the resin may be deteriorated or decomposed, and it is important to control the desired gel fraction in terms of ensuring the stability of physical properties.
- the gel fraction of the base material layer is preferably 1 to 80% by mass based on the mass of the entire release film.
- the gel fraction is preferably 1 to 70% by mass, and more preferably 1 to 65% by mass.
- the base material layer including the polyolefin resin described above may have a single layer configuration or a multilayer configuration.
- the resin of each layer of the base material layer may be a single type of resin, if necessary, and may be a mixed resin by blending or the like.
- the thickness of the base material layer of the release film according to this embodiment is preferably 5 to 2000 ⁇ m, more preferably 10 to 1500 ⁇ m, and still more preferably 15 to 800 ⁇ m.
- the thickness is 5 ⁇ m or more, from the viewpoint of excellent workability, it is difficult to cause a problem in tearing or strength when contacting any corner. Further, when the thickness is 2000 ⁇ m or less, the productivity is improved and the mold shape reproducibility is further improved.
- the release film according to this embodiment includes a release layer having a release function with respect to a molding material (resin or the like).
- the release layer is provided on at least one surface side of the base material layer.
- the release film preferably has release layers on both sides in order to peel not only between the molding material but also the mold.
- the release layer having a release function may contain a known compound such as a fluorine compound (fluorine-containing compound) or a silicone compound.
- a release layer made of a fluorine compound or a silicone compound can also be used.
- silicone-based compounds compounds having good affinity with the molded body may impair the releasability, so that fluorine-based compounds are more preferable.
- the release film according to the present embodiment may have one base layer and one release layer, but may have a plurality of base layers and a plurality of release layers. May be.
- the release film according to the present embodiment may be laminated in the order of skin layer / core layer / release layer or skin layer / core layer / skin layer / release layer.
- skin layer refers to the outermost layer
- core layer refers to the innermost layer.
- the release film according to the present embodiment may further include a layer other than the base material layer.
- the stress-strain curve is a curve with the vertical axis representing load (N) and the horizontal axis representing elongation (%).
- the stress-strain curve is measured at 120 ° C. according to JIS K7127. If the yield point does not exist, it is preferable when the film is set on the mold because the film is uniformly stretched and wrinkles are less likely to enter the molded body.
- the ratio (B / A) of 100% elongation load (100% elongation load) B to 50% elongation load (load at 50% elongation) A at 120 ° C. is MD direction. And 1.5 or more in each of the TD directions.
- the ratio is more preferably 1.55 or more, and still more preferably 1.6 or more.
- the thermal shrinkage force in the MD direction and the TD direction at 120 ° C. of the release film according to this embodiment is preferably 0.40 N / cm or less, and more preferably 0.30 N / cm or less.
- the heat shrinkage force is measured according to the measurement method ASTM D2838. When the heat shrinkage force is 0.40 N / cm or less, when the film is set on the mold and evacuated, the heat shrinkage force tends to be weaker than the evacuated force. It is possible to follow accurately, the film is more difficult to wrinkle, and the molded body is also less likely to wrinkle.
- the release film according to this embodiment has been described above. Next, the manufacturing method of the release film which concerns on this embodiment is demonstrated. However, the present invention is not limited only to the following embodiments.
- the raw materials used in each layer are melted from several types of extruders, and the respective resins are coextruded from an annular die to obtain a tube-shaped unstretched parison.
- the tube-like parison has a cooling medium from the outside and water from the outside. Further, from the inside of the tube-like parison, along the inside of the cooling mandrel with water, both inside and outside of the tube-like parison. There are cases where it is further cooled and solidified and then rapidly cooled and solidified, and either method may be used.
- This unstretched parison is irradiated with ionizing radiation (electron beam or the like) and subjected to a crosslinking treatment.
- the cooled and solidified tubular parison is guided into a stretching machine, and air is injected between rolls provided with a speed difference while heating the stretching start point between 80 to 250 ° C., so that the stretching stability is excellent.
- stretching is performed in the MD direction and the TD direction, respectively, preferably at a magnification of 2 to 10 times, more preferably 3 to 7 times.
- the stretching start point refers to a position where the expansion starts in the TD direction due to the internal pressure of the bubble.
- Examples of the film stretching method according to this embodiment include a single bubble inflation method, a double bubble inflation method, a triple bubble inflation method, a tenter method, and the like, from the viewpoint of uniformly shrinking in each of the MD direction and the TD direction. Inflation is preferred. In this way, the base material layer is formed.
- a release layer is applied to the base material layer.
- a release layer may be applied after heat setting for dimensional stabilization, corona treatment, or plasma treatment.
- the release layer may be applied using any known method.
- a release layer may be laminated by a coating process and dried.
- the structural formula CH 2 ⁇ C (R 1 ) —COO (CH 2 ) n1 —R f1 R 1 : hydrogen atom or methyl group, n1: an integer of 0 to 4, R f1 : a polyfluoroalkyl group or polyfluoroether group having 1 to 6 carbon atoms
- a compound having a structural unit derived from the (meth) acrylate is preferable.
- the optical device When the release layer is applied by coating, in the step of molding the optical device using the release film, the optical device is excellent in light extraction property by transferring the release layer to the surface of the molded body. . Moreover, there exists the characteristic that such a molded object can be manufactured efficiently in the manufacturing process of an optical device.
- the release film according to the present embodiment is useful for a thermal processing step for electronic parts and the like.
- the thermal processing step for electronic components, etc. means when sealing semiconductors such as IC chips and LEDs, during molding processing when manufacturing multilayer printed wiring boards, when laminating hot pressing, when applying coverlays when manufacturing printed wiring boards.
- a release film is interposed between the heated mold and the molding material (adhesive, molding, curing resin, and other substrate resins used in the thermoforming process of the electronic component). .
- the release film according to this embodiment is useful in order to prevent the mold and the molding material from coming into direct contact and to prevent the mold from being stained with resin.
- the release film according to this embodiment includes a crosslinked polyolefin resin, even if the processing temperature is equal to or higher than the melting point of the uncrosslinked polyolefin resin, problems such as perforation do not occur, and flexibility is achieved. The function of the release film having good mold reproducibility is easily exhibited.
- a polyolefin resin may be crosslinked, and a release film can be used in thermoforming under a temperature condition higher than the melting point of the uncrosslinked polyolefin resin by crosslinking.
- the application of the release film according to this embodiment is a semiconductor sealing process such as an IC chip or an LED chip, a lamination process with a multilayer printed wiring board, and a coverlay affixing with a flexible wiring board.
- the process etc. are illustrated and it is not specifically limited, As an especially preferable use, the compression sealing process use of an LED chip is illustrated.
- the release film is temporarily fixed by vacuuming on a lower mold having a concave hemispherical cavity. After the LED mounting substrate is set downward on the upper mold, the upper and lower molds are aligned so that the LED chip is arranged at the center of each cavity.
- sealing resin As a molding material into the cavity, molding is performed by closing the upper and lower molds and applying pressure and heating.
- the sealing resin include epoxy resins and silicone resins, and there is no particular limitation.
- a silicone resin is preferably used as a sealing resin for a high power LED that requires heat resistance.
- the manufacturing method of the molded body according to the present embodiment is a manufacturing method using the release film.
- the method for producing a molded body according to this embodiment includes, for example, 1) a step of fixing a release film on a mold, and 2) a step of removing the wrinkle of the release film by shrinking the film on the mold. 3) A step of supplying a resin to the mold and molding the resin, and 4) a step of peeling off the release film.
- This embodiment includes a step of fixing a release film on a mold.
- a method of fixing the release film on the mold There is no limit to the method of fixing the release film on the mold, but for example, a method of fixing the release film by vacuum suction around the molding surface; a fixing pin is placed on the mold, and the release film is placed here
- a method of fixing; a method of fixing the periphery of the molding surface with a metal plate is exemplified. These methods may be used alone, or a plurality of methods may be used in combination.
- This embodiment includes the step of removing the wrinkles of the release film by shrinking the film fixed on the mold.
- the film is shrunk by the heat of the mold when placed on the mold by using a release film that shrinks by heating. And take wrinkles.
- This embodiment includes a molding step of supplying resin to a mold and molding the resin.
- the molding method include compression molding, transfer molding, injection molding, and the like.
- Compression molding is a method in which a measured molding material is placed in a concave portion (cavity) of a heated mold and is cured by pressing with a compression molding machine.
- Transfer molding is a method in which a material once heated and softened in a plunger is hardened by pressing resin into a heated cavity from a narrow material passage (gate, sprue, runner, etc.).
- Injection molding is a method in which a plastic raw material heated and melted in a molding machine is pressed into a mold at high pressure and cured. The difference between transfer molding and injection molding is that in the latter, only one batch of material is put into the plunger.
- the resin used for molding is not particularly limited, and may be a thermoplastic resin or a thermosetting resin.
- a thermosetting resin is particularly preferably used in this embodiment.
- a thermosetting resin that is solid at room temperature, it is possible to impart fluidity by heating to room temperature or higher.
- a liquid at room temperature there are some which exhibit fluidity without heating, and high fluidity can be exhibited by slight heating.
- Thermosetting resins are preferred because they usually have a low molecular weight and a low viscosity in the melt state, and therefore do not require a high filling pressure.
- the thermosetting resin include an epoxy resin, a silicone resin, and an acrylic resin.
- a molded body made only of a resin in a mold it is possible to manufacture a molded body made only of a resin in a mold, and parts made of different materials such as metal parts and board parts embedded in the resin molded body in advance. It is also possible to obtain an integral molded body with a different material by placing it in a mold and filling it with resin. Further, in the method for producing a molded body according to the present embodiment, temporary curing is performed by heating with a mold, and after taking out from the mold, main curing is performed with a heating device such as an oven to complete the curing reaction. It is also possible to make it. In order to increase productivity, a method of performing temporary curing by heating in a mold is preferable.
- This embodiment may include a step of peeling the release film.
- the release film is peeled off from the molded body and the mold.
- the method for manufacturing a molded body according to the present embodiment preferably includes a step of placing a substrate on which a semiconductor chip is mounted in a mold, and in the molding step, the semiconductor chip on the substrate is preferably sealed with a resin.
- a semiconductor component is manufactured by such a manufacturing method.
- the substrate on which the semiconductor chip is mounted may be a semiconductor wafer, a ceramic substrate, an inorganic substrate such as a metal base substrate, or a resinous substrate such as an epoxy resin or a fluorine resin.
- the mounting method is a mounting method in which a semiconductor chip is fixed using a die attach material and conduction is made by wire bonding, and a bump is formed on the lower surface of the semiconductor chip and bonded to a substrate, and then fixed with an underfill material. Examples are methods.
- the semiconductor chip is exemplified by a chip such as a memory, a logic, or an LED, and is not particularly limited.
- the shape of the sealing resin is adjusted to the lower mold according to the chip position. For example, a concave portion (cavity) engraved is prepared, the upper mold and the lower mold are combined, and resin is poured into the gap to be molded.
- the ceramic substrate on which the LED chip is bump-mounted is vacuum-adsorbed to the upper mold, and a lower mold having a concave hemispherical cavity with a diameter of 2 mm is prepared for the lower mold in accordance with the position of each LED chip.
- the upper and lower molds are closed together and about 120 ° C x 5 minutes
- the mold can be clamped and compression-molded under the pre-curing heating conditions.
- the pre-cured molded body is further heated for about 4 hours in an oven heated to 150 ° C. to complete the curing reaction, and then separated into individual pieces to produce LED components.
- the molded body thus obtained can be suitably used as a semiconductor component.
- another preferable manufacturing method further includes a step of placing the lead frame in a mold, and in the molding step, a resin is molded on the lead frame. Is the method.
- a reflector component is manufactured by such a manufacturing method.
- a lead frame is a metal part that supports and fixes a semiconductor chip and connects to external wiring, is a thin metal plate, and is usually supplied in a hoop shape.
- the lead frame material there are no particular restrictions on the lead frame material, and copper alloy materials, iron alloy materials, and other metal sheets with excellent mechanical strength, electrical conductivity, thermal conductivity, corrosion resistance, etc. Those made by etching or the like are preferably used.
- these metals may be subjected to a plating treatment. For example, in order to improve light reflectivity in LED applications, those subjected to Ag plating are preferably used.
- a method of arranging the lead frame in the mold a method of forming a hole at a predetermined position and fixing the hole to a fixing pin of the mold is exemplified, but the method is not limited to this method.
- a mold having a recess (cavity) formed in accordance with a predetermined pattern of the lead frame is prepared, and the upper mold and the lower mold are combined with the lead frame fixed and sandwiched, and the gap
- An example is casting the resin into the mold.
- an upper mold is prepared by engraving the reflector shape into a concave shape. Fix the release film on the upper mold and remove wrinkles.
- a lead frame processed into a predetermined shape is placed in the lower mold, and a tablet obtained by tableting an epoxy resin composition containing titanium oxide particles as a reflector is placed in the mold cylinder, The mold and lower mold are clamped, and this tablet is poured into the mold by a piston (transfer molding).
- the poured epoxy resin is heated in a mold at about 150 ° C. for about 2 minutes to perform molding.
- the upper mold and the lower mold are divided to take out the temporarily cured product of the epoxy resin composition from the mold.
- the molded product taken out from the mold is further cured by heating at about 160 ° C. for 2 hours to complete the curing reaction, thereby completing a cured product of the epoxy resin composition molded integrally with the lead frame. It is possible to obtain a molded lead frame.
- the said molded object obtained using the resin composition containing a white titanium oxide particle can be used conveniently as a reflector component of LED.
- ⁇ Stress-strain curve measurement (SS measurement)> Based on JIS K7127, the stress-strain curve (vertical axis: load (N), horizontal axis: elongation (%)) in each of the MD direction and the TD direction was measured.
- Tensilon manufactured by Yamato Scientific Co., Ltd. was used for the measurement.
- a tensile test was performed under the conditions of a sample length of 100 mm, a chuck distance of 20 mm, and a tensile speed of 1000 mm / min using a release film slit at 10 mm in an environment of 120 ° C. and 50% RH.
- 50% elongation load and 100% elongation load were determined in both the MD direction and the TD direction, and the following value X was determined.
- X (100% elongation load) / (50% elongation load)
- a release film is set on a lower mold heated to 120 ° C. or 130 ° C. and having 100 concave hemispheric cavities with a diameter of 2 mm and 256 concave hemispheric cavities with a diameter of 1 mm, and the lower mold is evacuated. Temporarily fixed to the mold.
- the dummy substrate was set downward on the upper mold, and then the positions of the upper mold and the lower mold were adjusted so that the LED chip was arranged at the center of each cavity.
- a liquid silicone resin was poured into the cavity, and then the mold was clamped with pressure to perform compression molding. Then, mold opening was performed and the moldability and mold release property were confirmed on the following reference
- the silicone resin that is the sealing resin dimethyl silicone type silicone resin KER-2500 manufactured by Shin-Etsu Chemical Co., Ltd. was used.
- Example 1 A lower mold having 100 concave hemispherical cavities with a diameter of 2 mm was prepared and heated to a temperature of 120 ° C.
- the release film (Example 1) produced as described above was set, temporarily fixed to the lower mold by vacuuming, and further the peripheral edge was fixed with a metal plate. The release film shrunk by heat.
- a metal base substrate substrate size: 100 mm ⁇ 100 mm
- the upper and lower molds are arranged so that the LED chips are arranged at the center of each cavity. The position of was adjusted.
- This manufacturing was repeated 100 times, and a total of 10,000 hemispherical lenses were molded on 100 substrates, but no wrinkles were found in the resin lens portion.
- thermosetting reflector molding test An upper mold having 100 reflector-shaped concave cavities of 5 mm length and 5 mm width was prepared and heated to a temperature of 120 ° C. A release film was set thereon, temporarily fixed to the mold by vacuuming, and the peripheral edge was further fixed with a metal plate. The release film shrunk by heat. Next, the lead frame was set in a mold.
- a liquid silicone resin (OE-6636 made by Toray Dow) is injected with a resin containing 10% by mass of titanium oxide particles, the upper and lower molds are closed, and transfer molding is performed under a heating condition of 130 ° C. for 5 minutes. Went. After mold opening, the molded body was taken out and heated in an oven at 150 ° C. for 3 hours to complete the molded body.
- This manufacturing was repeated 100 times, and a total of 10,000 reflector parts were molded on 100 substrates. A state in which no wrinkles were found in all the reflector parts was judged as ⁇ , and a case in which there was one or more resins with wrinkles formed was judged as x.
- a release film (skin layer / core layer / skin layer / release) composed of a base layer composed of a core layer and skin layers formed on both sides thereof, and a release layer Mold layer).
- LL1 ethylene- ⁇ -olefin random copolymer (Dowlex 2032 manufactured by Dow Chemical Japan Co., Ltd., polymerized with a multisite catalyst, ⁇ -olefin: 1-octene, melt flow rate (230 ° C., 2.16 kg, The same applies hereinafter): 2.0 g / 10 min, density: 0.926 g / cm 3 )
- LL3 ethylene- ⁇ -olefin random copolymer (manufactured by Prime Polymer Co., Ltd.
- Coating agent 1 Fluorine coating agent SF Coat SR-4000A (manufactured by AGC Seimi Chemical Co., Ltd.)
- Coating agent 2 Fluorosurfactant Novec FC-740 (manufactured by Sumitomo 3M Limited)
- Coating agent 3 Top notch coat (organosiloxane containing silane coupling agent) TN-1000 (manufactured by JSP Corporation)
- Coating agent 6 Silicone coating agent KP-86 (manufactured by Shin-E
- Each resin was used in the combinations and mixing ratios (mass ratios) shown in Tables 1 and 2, and using two extruders, skin (15%) / core (70%) / With a layer arrangement of skin (15%) (the ratio of the layer thickness in parentheses), it was melt-extruded into a tube shape and rapidly cooled using a water-cooled ring to obtain a tube-shaped raw material for drawing.
- the obtained raw material for drawing was subjected to a crosslinking treatment by irradiating an electron beam accelerated with an acceleration voltage of 2000 kV at an irradiation dose shown in Tables 1 and 2.
- the drawing raw fabric is passed between the two nip rolls, and the drawing raw fabric is drawn by injecting air into the drawing raw fabric according to the speed ratio of the two nip rolls.
- the film formed by stretching was cooled by applying cold air to the bubbles with an air ring. Thereafter, the film was folded to obtain a base material layer composed of skin layer / core layer (inner layer) / skin layer.
- the mixing ratio of the resin forming each layer, the total thickness of the base material layer, and the irradiation dose are shown in Tables 1 and 2.
- coating was performed with the coating agents shown in Tables 1 and 2 to form a release layer to obtain a release film. Tables 1 and 2 show the evaluation results of the obtained release film and molded articles formed using the release film.
- the release films obtained in Examples 1 to 18 have an appropriate heat shrinkability, and have a good shape by accurately following the mold during molding. It was confirmed that a silicone package could be obtained. On the other hand, from the results in Table 3, it was confirmed that the release films obtained in Comparative Examples 1 to 4 could not obtain an appropriate elongation during molding, resulting in a wrinkled package.
- the release film according to the present invention can exhibit excellent heat resistance, flexibility, and release properties during the thermoforming process. Therefore, in particular, the sealing process of semiconductors such as IC chips and LEDs of electronic components, the molding process in the production of multilayer printed wiring boards, the laminating hot pressing process, and the coverlay application process in the production of printed wiring plates, etc. It is useful in the thermal processing of electronic parts. It is also useful in molding resin into lead frames.
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Abstract
Description
[1] 120℃におけるMD方向及びTD方向それぞれの熱収縮率が5%以上である、離型フィルム。
[2] 110℃におけるMD方向及びTD方向それぞれの熱収縮率が2%以上である、[1]に記載の離型フィルム。
[3] 離型層、及び、基材層を備え、基材層は、ポリオレフィン樹脂を含み、DSCで測定した基材層の融点が128~210℃である、[1]又は[2]に記載の離型フィルム。
[4] 基材層のポリオレフィン樹脂が架橋されており、当該離型フィルムの120℃におけるMD方向及びTD方向それぞれの応力-ひずみ曲線において、降伏点がなく、且つ、50%伸び荷重Aに対する100%伸び荷重Bの比B/Aが1.5以上であり、120℃におけるMD方向及びTD方向それぞれの熱収縮力が、0.40N/cm以下である、[3]に記載の離型フィルム。
[5] 離型層がフッ素系化合物を含む、[3]又は[4]に記載の離型フィルム。
[6] 基材層のポリオレフィン樹脂が電離性放射線により架橋されている、[3]~[5]のいずれかに記載の離型フィルム。
[7] [1]~[6]のいずれかに記載の離型フィルムを金型上に固定する工程と、金型上で離型フィルムを収縮させて離型フィルムのシワを取る工程と、金型に樹脂を供給し、樹脂を成型する成型工程と、離型フィルムを剥がす工程と、を含む、成型体の製造方法。
[8] 半導体チップを実装した基板を金型内に配置する工程を更に含み、成型工程において、半導体チップを樹脂で封止する、[7]に記載の成型体の製造方法。
[9] リードフレームを金型内に配置する工程を更に含み、成型工程において、リードフレームに樹脂を成型する、[7]に記載の成型体の製造方法。
[10] [8]に記載の成型体の製造方法によって製造された、半導体部品。
[11] [9]に記載の成型体の製造方法によって製造された、リフレクター部品。
パーキンエルマー社製DSCを用いて下記の6段階にて測定を行った。
1)0℃にて1分保持、
2)0℃から200℃まで10℃/分で昇温、
3)200℃で1分保持、
4)200℃から0℃まで10℃/分で降温、
5)0℃で1分保持、
6)0℃から200℃まで10℃/分で昇温。
上記段階のうち6)における熱量ピークが最大の温度を融点と規定した。
ASTM D2732に準拠して、110℃及び120℃の温度にて10分間収縮させてMD方向(縦方向)及びTD方向(横方向)のそれぞれについて測定した。
JIS K7127に準拠してMD方向及びTD方向それぞれの応力-ひずみ曲線(縦軸:荷重(N)、横軸:伸び(%))の測定を行った。測定については、ヤマト科学株式会社製のテンシロンを用いた。120℃、50%RH環境下で、10mm巾にスリットした離型フィルムを用いて、サンプル長100mm、チャック間20mm、引張速度1000mm/minの条件で引張試験を行った。MD方向、TD方向ともに50%伸び荷重と100%伸び荷重を求め、下記の値Xを求めた。
X=(100%伸び荷重)/(50%伸び荷重)
ASTM D2838に準拠して、120℃で、MD方向、TD方向の熱収縮力を測定した。測定は連続して5分間行い、その最大値を用いた。
袋状に折り畳んだ150メッシュのステンレス製金網の中に、基材層のみを剥ぎ取った試料100mgを封入し、沸騰p-キシレン中で試料(離型フィルム)を12時間抽出し、次式により算出される不溶解部分の割合をゲル分率として求めた。このゲル分率をフィルムの架橋度の尺度として用いた。
ゲル分率(質量%)=(抽出後の試料質量/抽出前の試料質量)×100
直径2mmの凹状半球キャビティを100個、及び、直径1mmの凹状半球キャビティを256個有する、120℃又は130℃に熱した下部金型の上に離型フィルムをセットし、真空引きにて下部金型に仮固定した。
真空引き工程の際、120℃と130℃どちらの温度でもフィルムが金型にシワなく追随している場合を「○」、120℃又は130℃どちらか一方の温度でフィルムが金型にシワなく追随している場合を「△」、120℃でも130℃でもシワが入り込んでいる場合を「×」として判断した。
その後、ダミー基板を上部金型に下向きにセットした後、各キャビティ中心部にLEDチップが配置されるように上部金型及び下部金型の位置を調整した。その状態で液状のシリコーン樹脂をキャビティに流し込んでから、圧力で型締めし、圧縮成型を行った。その後、型開きを行って、下記の基準で成型性と離型性を確認した。封止樹脂であるシリコーン樹脂としては、ジメチルシリコーンタイプのシリコーン樹脂である信越化学工業株式会社製KER-2500を使用した。
メタルベース基板上に形成された、各LEDチップを封止する半球状シリコーン封止樹脂を顕微鏡により観察した。成型されたシリコーン封止樹脂表面上すべてにおいてシワの入っていない場合を◎、100個の半球状シリコーン封止樹脂にのみ全くシワの入っていない場合を〇、シワが形成された封止樹脂が1個以上10個未満である場合を△、シワが形成された封止樹脂が10個以上である場合を×とした。
成型体側に離型フィルムの残渣が残っておらず、フィルムと成型体が完全に剥がれた状態で型開きした場合を〇と判断した。成型体側に離型フィルムがはりついた状態で型開きする、又は、離型フィルムの残渣が多く残った場合を×と判断した。
型開き後、金型からフィルムを引きはがす際、フィルムが金型に付着して取れない場合を×、フィルムが軽く剥がれた場合を〇と判断した。
直径2mmの凹状半球キャビティを100個有する下部金型を準備し、120℃の温度に加熱した。この上に、上記のとおり作製した離型フィルム(実施例1)をセットし、真空引きにて下部金型に仮固定し、さらに周縁部を金属板で固定した。離型フィルムは熱によって収縮した。次に、100個のLEDチップをワイヤーボンド実装したメタルベース基板(基板サイズ:100mm×100mm)を上部金型に下向きにセットした後、各キャビティ中心部にLEDチップが配置されるよう上下金型の位置をあわせた。次に、液状のシリコーン樹脂(東レ・ダウ製OE-6636)をキャビティに流し込んだ後、前記上下金型を閉じあわせ、130℃×5分の加熱条件のもと、3.0MPaの圧力で型締めし圧縮成型を行った。型開きの後、成型体を取出し、150℃オーブンにて3時間追加で加熱を行って、成型体を完成させた。
縦5mm、横5mmサイズのリフレクター形状凹状キャビティを100個有する上金型を準備し、120℃の温度に加熱した。この上に、離型フィルムをセットし、真空引きにて金型に仮固定し、さらに周縁部を金属板で固定した。離型フィルムは熱によって収縮した。次に、リードフレームを金型にセットした。
当該離型フィルムを用い、ゴムクッション/離型フィルム/FPC/離型フィルム/ゴムクッション/熱盤の順となるようなプレス構成にて、プレスラミネート機によりプレスした。プレスにあたっては、熱盤温度を120℃まで昇温させ、10MPaの加圧条件下で、3分間加圧した。その後、プレスサンプルについて以下の項目と基準で評価を行なった。なお、下記評価は、社団法人日本電子回路工業会(以下、JPCAと略す)のJPCA規格(デザインガイドマニュアル 片面及び両面フレキシブルプリント配線版 JPCA-DG02)に準拠し、以下のような項目と基準で行なった。
(評価項目)
離型性:離型フィルムのFPCからの離型性を評価した。具体的には、「JPCA規格 7.5.7.1項表面の付着物」に準拠し、CLプレスラミネート後の離型フィルムのFPCからの剥離状態を目視にて評価した。評価サンプル数を各n=100として評価を行い、FPC表面に樹脂残りが発生したものの数が評価サンプル数の5%未満のものを合格とした。
◎:破れ発生率 3%未満
○:破れ発生率 3%以上5%未満
×:破れ発生率 5%以上
下記に示す樹脂を用いて、コア層及びその両側に形成されたスキン層から構成される基材層と、離型層とから構成される離型フィルム(スキン層/コア層/スキン層/離型層)を作製した。
LL1:エチレン-α-オレフィンランダム共重合体(ダウ・ケミカル日本株式会社製 dowlex2032、マルチサイト触媒にて重合されたもの、α-オレフィン:1-オクテン、メルトフローレート(230℃、2.16kg、以下同様):2.0g/10min、密度:0.926g/cm3)
LL2:エチレン-α-オレフィンランダム共重合体(宇部丸善ポリエチレン株式会社製 ユメリット1520F、メルトフローレート=2.0g/10min、密度=0.915g/cm3)
LL3:エチレン-α-オレフィンランダム共重合体(プライムポリマー株式会社製 モアテック0278G、メルトフローレート=2.1g/10min、密度=0.939g/cm3)
LL4:エチレン-α-オレフィンランダム共重合体(ダウ・ケミカル日本株式会社製 アテイン4203、メルトフローレート=0.8g/10min、密度=0.905g/cm3)
LD1:高圧法低密度ポリエチレン(旭化成ケミカルズ株式会社製 サンテックLD M2004、メルトフローレート=0.4g/10min、密度=0.921g/cm3)
LD2:高圧法低密度ポリエチレン(旭化成ケミカルズ株式会社製 サンテックLD M2102、メルトフローレート=0.2g/10min、密度=0.921g/cm3)
LD3:高圧法低密度ポリエチレン(宇部丸善ポリエチレン株式会社製 UBEポリエチレン B028、メルトフローレート=0.4g/10min、密度=0.927g/cm3)
HD1:高密度ポリエチレン(旭化成ケミカルズ株式会社製 クレオレックスQT6015、メルトフローレート=1.0g/10min、密度=0.958g/cm3)
HD2:高密度ポリエチレン(旭化成ケミカルズ株式会社製 サンテックHD S3600、メルトフローレート=1.0g/10min、密度=0.954g/cm3)
HD3:高密度ポリエチレン(旭化成ケミカルズ株式会社製 サンテックHD J240、メルトフローレート=5.5g/10min、密度=0.966g/cm3)
HD4:高密度ポリエチレン(旭化成ケミカルズ株式会社製 サンテックHD S160S、メルトフローレート=0.8g/10min、密度=0.962g/cm3)
TPO:リアクターTPO(プライムポリマー株式会社製 プライムTPO E-2900H、メルトフローレート=2.5g/10min)
EBC:エチレン-1-ブテン共重合体(三井化学株式会社製 タフマーA4085S、メルトフローレート=3.6g/10min、密度=0.88g/cm3)
コート剤1:フッ素系コーティング剤 エスエフコート SR-4000A(AGCセイミケミカル株式会社製)
コート剤2:フッ素系界面活性剤 ノベック FC-740(住友スリーエム株式会社製)
コート剤3:トップノッチコート(シランカップリング剤を含有するオルガノシロキサン) TN-1000(株式会社ジェイエスピー製)
コート剤4:パーフルオロポリエーテル系コート剤
コート剤5:フッ素系コーティング剤 RBX-HC1(株式会社ネオス製)
コート剤6:シリコーンコーティング剤 KP-86(信越化学工業株式会社製)
コート剤7:構造式CH2=C(CH3)-COO(CH2)2-C6F13で表され
るメタクリレート由来の構成単位を有する化合物
コート剤8:フッ素系コーティング剤 エスエフコート UT-B200A(AGCセイミケミカル株式会社製)
コート剤9:フッ素系コーティング剤 エスエフコート UT-DPN72A(AGCセイミケミカル株式会社製)
コート剤10:フッ素系コーティング剤 オブリガード PS305R(AGCコーテック株式会社製)
コート剤11:フッ素系コーティング剤 オブリガード PS308R(AGCコーテック株式会社製)
PMPフィルム:オピュラン X-44B(厚み 25μm)(三井化学東セロ株式会社製)
未架橋のエチレン-テトラフルオロエチレン共重合体(ETFE)のフィルム(旭硝子株式会社製、LM-50)を単層の基材層として用いて、実施例と同様の評価を行った。その結果を表3に示す。
未架橋の4-メチル-1-ペンテンのフィルム(三井化学東セロ株式会社製、X44B)を単層の基材層として用いて、実施例と同様の評価を行った。その結果を表3に示す。
単層の基材層としての未延伸のポリエチレンフィルムにフッ素コートを行い、実施例と同様の評価を行った。その結果を表3に示す。
未延伸のポリプロピレンフィルム(CPPフィルム)を単層の基材層として用いて、実施例と同様の評価を行った。その結果を表3に示す。
Claims (11)
- 120℃におけるMD方向及びTD方向それぞれの熱収縮率が5%以上である、離型フィルム。
- 110℃におけるMD方向及びTD方向それぞれの熱収縮率が2%以上である、請求項1に記載の離型フィルム。
- 離型層、及び、基材層を備え、
前記基材層は、ポリオレフィン樹脂を含み、
DSCで測定した前記基材層の融点が128~210℃である、請求項1又は2に記載の離型フィルム。 - 前記基材層の前記ポリオレフィン樹脂が架橋されており、
当該離型フィルムの120℃におけるMD方向及びTD方向それぞれの応力-ひずみ曲線において、降伏点がなく、且つ、50%伸び荷重Aに対する100%伸び荷重Bの比B/Aが1.5以上であり、
120℃におけるMD方向及びTD方向それぞれの熱収縮力が、0.40N/cm以下である、請求項3に記載の離型フィルム。 - 前記離型層がフッ素系化合物を含む、請求項3又は4に記載の離型フィルム。
- 前記基材層の前記ポリオレフィン樹脂が電離性放射線により架橋されている、請求項3~5のいずれか一項に記載の離型フィルム。
- 請求項1~6のいずれか一項に記載の離型フィルムを金型上に固定する工程と、
前記金型上で前記離型フィルムを収縮させて前記離型フィルムのシワを取る工程と、
前記金型に樹脂を供給し、前記樹脂を成型する成型工程と、
前記離型フィルムを剥がす工程と、を含む、成型体の製造方法。 - 半導体チップを実装した基板を前記金型内に配置する工程を更に含み、
前記成型工程において、前記半導体チップを樹脂で封止する、請求項7に記載の成型体の製造方法。 - リードフレームを前記金型内に配置する工程を更に含み、
前記成型工程において、前記リードフレームに前記樹脂を成型する、請求項7に記載の成型体の製造方法。 - 請求項8に記載の成型体の製造方法によって製造された、半導体部品。
- 請求項9に記載の成型体の製造方法によって製造された、リフレクター部品。
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- 2014-08-25 EP EP14844773.3A patent/EP3040174A4/en not_active Withdrawn
- 2014-08-25 WO PCT/JP2014/072176 patent/WO2015037426A1/ja active Application Filing
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JP2017013455A (ja) * | 2015-07-06 | 2017-01-19 | 東レ株式会社 | 繊維強化複合材料の製造方法 |
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US10583640B2 (en) | 2015-07-06 | 2020-03-10 | Toray Industries, Inc. | Method for manufacturing fiber-reinforced composite material |
KR102172867B1 (ko) | 2015-12-03 | 2020-11-02 | 미쓰이 가가쿠 토세로 가부시키가이샤 | 공정용 이형 필름, 그 용도 및 이를 이용한 수지 밀봉 반도체의 제조 방법 |
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US11318641B2 (en) | 2017-11-17 | 2022-05-03 | AGC Inc. | Laminated film and method for producing semiconductor element |
JP7151720B2 (ja) | 2017-11-17 | 2022-10-12 | Agc株式会社 | 積層フィルム及び半導体素子の製造方法 |
Also Published As
Publication number | Publication date |
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TWI549824B (zh) | 2016-09-21 |
CN105451954A (zh) | 2016-03-30 |
EP3040174A4 (en) | 2016-10-05 |
US20160200007A1 (en) | 2016-07-14 |
EP3040174A1 (en) | 2016-07-06 |
JP5784858B1 (ja) | 2015-09-24 |
JPWO2015037426A1 (ja) | 2017-03-02 |
TW201509666A (zh) | 2015-03-16 |
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