WO2015026185A1 - 유기 발광 소자 및 이의 제조방법 - Google Patents
유기 발광 소자 및 이의 제조방법 Download PDFInfo
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- WO2015026185A1 WO2015026185A1 PCT/KR2014/007795 KR2014007795W WO2015026185A1 WO 2015026185 A1 WO2015026185 A1 WO 2015026185A1 KR 2014007795 W KR2014007795 W KR 2014007795W WO 2015026185 A1 WO2015026185 A1 WO 2015026185A1
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- Prior art keywords
- layer
- light emitting
- organic light
- metal pattern
- electrode
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- YYMBJDOZVAITBP-UHFFFAOYSA-N rubrene Chemical compound C1=CC=CC=C1C(C1=C(C=2C=CC=CC=2)C2=CC=CC=C2C(C=2C=CC=CC=2)=C11)=C(C=CC=C2)C2=C1C1=CC=CC=C1 YYMBJDOZVAITBP-UHFFFAOYSA-N 0.000 description 1
- 229910052707 ruthenium Inorganic materials 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 239000000565 sealant Substances 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 238000004528 spin coating Methods 0.000 description 1
- 150000003413 spiro compounds Chemical class 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 125000005504 styryl group Chemical group 0.000 description 1
- 238000010345 tape casting Methods 0.000 description 1
- JBQYATWDVHIOAR-UHFFFAOYSA-N tellanylidenegermanium Chemical compound [Te]=[Ge] JBQYATWDVHIOAR-UHFFFAOYSA-N 0.000 description 1
- 238000002230 thermal chemical vapour deposition Methods 0.000 description 1
- 238000002207 thermal evaporation Methods 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 229930192474 thiophene Natural products 0.000 description 1
- 238000002834 transmittance Methods 0.000 description 1
- 229910052720 vanadium Inorganic materials 0.000 description 1
- GPPXJZIENCGNKB-UHFFFAOYSA-N vanadium Chemical compound [V]#[V] GPPXJZIENCGNKB-UHFFFAOYSA-N 0.000 description 1
- LEONUFNNVUYDNQ-UHFFFAOYSA-N vanadium atom Chemical compound [V] LEONUFNNVUYDNQ-UHFFFAOYSA-N 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- YVTHLONGBIQYBO-UHFFFAOYSA-N zinc indium(3+) oxygen(2-) Chemical compound [O--].[Zn++].[In+3] YVTHLONGBIQYBO-UHFFFAOYSA-N 0.000 description 1
- 229910052726 zirconium Inorganic materials 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/841—Self-supporting sealing arrangements
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/805—Electrodes
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- H—ELECTRICITY
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- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/87—Passivation; Containers; Encapsulations
- H10K59/871—Self-supporting sealing arrangements
- H10K59/8721—Metallic sealing arrangements
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/805—Electrodes
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/842—Containers
- H10K50/8423—Metallic sealing arrangements
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/131—Interconnections, e.g. wiring lines or terminals
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/621—Providing a shape to conductive layers, e.g. patterning or selective deposition
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
- H10K77/10—Substrates, e.g. flexible substrates
- H10K77/111—Flexible substrates
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K85/00—Organic materials used in the body or electrodes of devices covered by this subclass
- H10K85/10—Organic polymers or oligomers
- H10K85/141—Organic polymers or oligomers comprising aliphatic or olefinic chains, e.g. poly N-vinylcarbazol, PVC or PTFE
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K2102/00—Constructional details relating to the organic devices covered by this subclass
- H10K2102/301—Details of OLEDs
- H10K2102/311—Flexible OLED
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- H—ELECTRICITY
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- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K2102/00—Constructional details relating to the organic devices covered by this subclass
- H10K2102/301—Details of OLEDs
- H10K2102/341—Short-circuit prevention
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- H—ELECTRICITY
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- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K2102/00—Constructional details relating to the organic devices covered by this subclass
- H10K2102/301—Details of OLEDs
- H10K2102/351—Thickness
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- H—ELECTRICITY
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- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/851—Division of substrate
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/549—Organic PV cells
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Definitions
- the present application relates to an organic light emitting device and a method of manufacturing the same.
- the organic light emitting device is a device that emits light while emitting holes and electrons injected through excitation of excitons by injecting holes and electrons into the light emitting layer formed between the electrodes.
- the organic light emitting device Since the organic light emitting device has a self-luminous property, it is thinner than a conventional liquid crystal display, has a low power consumption, and has an excellent viewing angle and high response speed. In addition, as compared to the plasma display panel or the inorganic EL panel display can be driven at a lower voltage of less than 10V has the advantage of low power consumption and excellent color. In addition, the organic light emitting device may be manufactured using a plastic substrate having a bending property.
- the organic light emitting device is divided into a passive type and an active type.
- the passive type the bottom emission method of emitting light generated in the light emitting layer to the substrate surface is adopted.
- the active method the aperture ratio is reduced due to the TFT. Accordingly, in order to increase the aperture ratio, a front emission method of emitting light toward the opposite side of the substrate is required.
- the conventional encapsulation method and encapsulation structure of an organic light emitting device having such excellent advantages encapsulates a substrate on which a light emitting body consisting of a first electrode, a second electrode and a light emitting layer is located, and a sealing cap encapsulating the same using a thermosetting or photocurable adhesive member. It is common to do
- An organic light emitting unit in which a first electrode, an organic material layer, and a second electrode are sequentially stacked on the substrate; And an encapsulation part that seals an outer side of the organic light emitting part.
- the encapsulation part includes a sealing layer in contact with an outside of the organic light emitting part, an insulating layer provided on the sealing layer, and a metal pattern layer provided between the sealing layer and the insulating layer,
- the metal pattern layer may include a first metal pattern electrically connecting the first electrode and an external power source, and a second metal pattern electrically connecting the second electrode and an external power source. do.
- the present application provides a lighting device including the organic light emitting device.
- the present application provides a display device including the organic light emitting device.
- an encapsulation part including a sealing layer in contact with an outer side of the organic light emitting part, an insulating layer provided on the sealing layer, and a metal pattern layer provided between the sealing layer and the insulating layer.
- the metal pattern layer may include a first metal pattern electrically connecting the first electrode and an external power supply, and a second metal pattern electrically connecting the second electrode and an external power source. Provide a method.
- the organic light emitting part including a first electrode, an organic material layer, and a second electrode;
- the encapsulation part may include a sealing layer in contact with an outer side of each of the two or more organic light emitting parts; An insulation layer provided on the sealing layer; And a metal pattern layer provided between the sealing layer and the insulating layer and including a first metal pattern electrically connecting the first electrode and an external power source and a second metal pattern electrically connecting the second electrode and an external power source. It provides a method of manufacturing an organic light emitting device comprising a.
- An encapsulant comprising a sealing layer, an insulating layer provided on the sealing layer, and a metal pattern layer provided between the sealing layer and the insulating layer,
- the encapsulant includes at least one contact hole penetrating in the thickness direction,
- At least one of the upper and lower surfaces of the encapsulant includes a protective layer
- the metal pattern layer provides an encapsulant comprising two or more metal patterns spaced apart and electrically shorted.
- An encapsulant comprising a sealing layer, an insulating layer provided on the sealing layer, and a metal pattern layer provided between the sealing layer and the insulating layer,
- It includes a protective layer provided on the upper and lower surfaces of the encapsulant,
- the metal pattern layer provides an encapsulant comprising two or more metal patterns spaced apart from each other and electrically shorted.
- first protective layer on one side of the insulating layer, and forming a metal pattern layer including two or more metal patterns spaced apart from each other and electrically shorted to the other side of the insulating layer,
- It provides a method for producing an encapsulant comprising a.
- the organic light emitting device uses a structure including a sealing layer, an insulating layer, and a metal pattern layer provided between the sealing layer and the insulating layer as an encapsulation part, so that the encapsulation and the electrode of the organic light emitting part are formed.
- the structure for equipotential can be simplified.
- 1 is a view schematically showing a conventional organic light emitting device.
- FIGS. 2 and 3 are views schematically showing an organic light emitting device according to an exemplary embodiment of the present application.
- FIG. 4 is a view schematically showing a conventional method of manufacturing an organic light emitting device.
- FIG. 5 is a view schematically showing a method of manufacturing an organic light emitting device according to an exemplary embodiment of the present application.
- FIG. 6 is a view schematically showing an encapsulant according to an exemplary embodiment of the present application.
- substrate 20 organic light emitting unit
- sealing plate 50 first electrode pad
- substrate 200 organic light emitting unit
- first electrode 220 organic material layer
- sealing layer 320 metal pattern layer
- third metal pattern 330 insulating layer
- OLED technology is a key technology that determines OLED lifetime and reliability.
- OLED material is very vulnerable to moisture and oxygen, causing deformation of organic layer and electrode when moisture or oxygen penetrates, and lifespan. It can cause various problems of degradation. Therefore, OLEDs absolutely need an encapsulation process for blocking outside air.
- FIGS. 1 and 4 A conventional organic light emitting device and a method of manufacturing the same are schematically shown in FIGS. 1 and 4.
- a method of laminating the sealing layer 30 and the like to expose the electrode pad ends 50 and 55 and laminating the organic light emitting device using a carrier is used.
- such a method has difficulty in using altars such as sealing layers, carriers, and the like.
- each of the exposed first electrode pads 50 and the second electrode pads 55 further needs to be electrically connected to an external power source, and a process for this is further required.
- a flexible printed circuit board (FPCB) and a face seal film having a metal pattern and a contact hole on an insulating layer are applied to fabricate a plurality of organic light emitting devices on one large substrate.
- FPCB flexible printed circuit board
- a face seal film having a metal pattern and a contact hole on an insulating layer are applied to fabricate a plurality of organic light emitting devices on one large substrate.
- an altar such as a sealing layer and the use of a carrier can be excluded, and an organic light emitting device having a process advantage and a method of manufacturing the same are provided.
- An organic light emitting device the substrate; An organic light emitting unit in which a first electrode, an organic material layer, and a second electrode are sequentially stacked on the substrate; An encapsulation part encapsulating an outer side of the organic light emitting part, wherein the encapsulation part is in contact with an outer side of the organic light emitting part, an insulating layer provided on the sealing layer, and a metal pattern layer provided between the sealing layer and the insulating layer. Characterized in that it comprises a.
- the metal pattern layer may serve as a barrier to prevent penetration of external moisture, air, and the like into the organic light emitting unit.
- the first electrode or the second electrode may be electrically connected to an external power source through the metal pattern layer.
- the metal pattern layer may include a first metal pattern electrically connecting the first electrode and an external power source, and the metal pattern layer may include a second electrically connecting the second electrode and an external power source. It may include a metal pattern.
- the metal pattern layer may include both the first metal pattern and the second metal pattern.
- the metal pattern layer may include a third metal pattern, and the third metal pattern may be provided on the emission area of the organic light emitting part. That is, in the present application, the metal pattern layer includes a first metal pattern, a second metal pattern, and a third metal pattern, wherein the first metal pattern electrically connects the first electrode and an external power source. A second metal pattern is electrically connected to the second electrode and an external power source, and the third metal pattern is provided on an emission area of the organic light emitting part, and the first metal pattern, the second metal pattern, and the third metal are provided on the light emitting area.
- the patterns may each be spaced apart and electrically shorted.
- the third metal pattern may have an area equal to or larger than that of the light emitting region of the organic light emitting unit.
- the third metal pattern may have a structure that seals the upper and side surfaces of the emission area of the organic light emitting part.
- the third metal pattern may serve as a barrier to prevent penetration of external moisture, air, and the like into the organic light emitting unit.
- the metal pattern layer may be formed by laminating a metal pattern cut in advance on the insulating layer or by depositing a metal layer on the insulating layer and then patterning the metal pattern.
- the metal pattern layer may have a thickness of 1 to 50 ⁇ m, and may be 5 to 20 ⁇ m, but is not limited thereto.
- the sealing unit in the manufacture of two or more organic light emitting devices, may be formed to seal the outside of the organic light emitting part in one step by using two or more metal pattern layers formed on one insulating layer. . Therefore, two or more organic light emitting devices can be manufactured in a continuous process, and a flexible organic light emitting device can be manufactured in a simple process by a roll-to-roll process using a plastic substrate as the substrate.
- the encapsulation part is provided with two or more metal pattern layers on one insulating layer. It can manufacture.
- each metal pattern layer includes a first metal pattern, a second metal pattern and a third metal pattern, which are spaced apart from each other and electrically shorted.
- the first metal pattern is electrically connected to the first electrode and an external power source
- the second metal pattern is electrically connected to the second electrode and an external power source
- the third metal pattern is the organic light emitting part. It may be provided above the light emitting area.
- the encapsulation portion may include a contact hole for electrically connecting the first electrode or the second electrode to an external power source.
- the contact hole may be formed using a method known in the art.
- the contact hole may be formed in a thickness direction of the encapsulation part, and the contact hole may include a first electrode pad connected to the first electrode of the organic light emitting part and extending to a non-light emitting part of the substrate on which the organic light emitting part is formed; And a second electrode pad connected to the second electrode of the organic light emitting part and extending to the non-light emitting part of the substrate on which the organic light emitting part is formed.
- the size of the vertical cross section in the longitudinal direction of the contact hole is determined by the size of the first electrode pad and the second electrode pad, and specifically, the area of the vertical cross section of the contact hole in the longitudinal direction is the first electrode pad and the second electrode. It is less than or equal to the area of the pad. Preferably, the area of the vertical cross section in the longitudinal direction of the contact hole is almost the same or similar to that of the first electrode pad and the second electrode pad.
- the contact hole may be filled with a conductive material to electrically connect the first electrode or the second electrode to an external power source.
- the conductive material may be a conductive paste containing at least one selected from Ag, Au, Cu, Ni, Al, W, Co, Pd, and alloys thereof; Conductive polymers including at least one selected from polyacetylene, polyaniline, doped polyethylene, polypyrrole, polythiophene, conductive epoxy, mixtures thereof and copolymers thereof; And a mixture in which conductive balls are added to the conductive polymer, but is not limited thereto.
- the sealing layer may include a conductive ball.
- the conductive ball may serve to electrically connect the first electrode or the second electrode and an external power source.
- a conductive ball may be disposed on the groove of the pattern to form a pattern in the sealing layer to electrically connect the first electrode or the second electrode to an external power source.
- the insulating layer may further include a first metal pad provided on an opposite surface of the surface on which the metal pattern layer is provided and electrically connected to the first electrode.
- the insulating layer may further include a second metal pad provided on the opposite side of the surface provided with the metal pattern layer and electrically connected to the second electrode.
- the insulating layer may be provided on an opposite side of the surface on which the metal pattern layer is provided, and may include both the first metal pad and the second metal pad.
- an additional insulating layer may be provided between the first metal pad and the second metal pad.
- FIGS. 2 and 3 An organic light emitting diode according to an exemplary embodiment of the present application is schematically illustrated in FIGS. 2 and 3.
- the organic light emitting diode of FIG. 2 schematically shows a structure in which the metal pattern layer 320 is provided on one side of the insulating layer 330 as the encapsulation portion 300, and the organic light emitting diode of FIG. 3 is the encapsulation portion 300.
- the structure of the metal pattern layer 320 is provided on one side of the insulating layer 330 and the first metal pad 600 and the second metal pad 700 are provided on the other side.
- the substrate may be a transparent substrate, and more specifically, may be an organic substrate or a plastic substrate, but is not limited thereto.
- the insulating layer is polyacrylate, polypropylene (PP, polypropylene), polyethylene terephthalate (PET, polyethylene terephthalate), polyethylene ether phthalate (polyethylene ether phthalate), polyethylene phthalate (polyethylene phthalate), Polybutylene phthalate (polybuthylene phthalate), polyethylene naphthalate (PEN), polycarbonate (PC; polycarbonate), polystyrene (PS, polystyrene), polyether imide, polyether sulfone, Polydimethylsiloxane (PDMS; polydimethyl siloxane), polyether ether ketone (PEEK; Polyetheretherketone) and polyimide (PI; polyimide) may include any one or more, but is not limited thereto. Specifically, the insulating layer may include polyimide.
- the insulating layer may have a thickness of about 1 ⁇ m to about 50 ⁇ m and about 5 ⁇ m to about 20 ⁇ m, but is not limited thereto.
- the sealing layer may use a face seal film.
- the face seal film may be an adhesive film including a getter.
- the getter is a substance that absorbs residual gas or forms a compound with the gas, and the getter is not limited to the kind thereof if it is included on the adhesive film to absorb or react with the remaining moisture or oxygen to make the compound, for example, activated carbon At least one of barium, magnesium, zirconium, and red phosphorus.
- the metal pattern layer is copper, aluminum, iron, magnesium, calcium, sodium, potassium, titanium, indium, yttrium, lithium, gadolinium, platinum, gold, tungsten, tantalum, silver, tin, lead, etc. 1 It may include more than one species, but is not limited thereto.
- the organic light emitting unit may include an anode, one or more organic material layers, and a cathode.
- the anode may be formed of one or more selected from magnesium, calcium, sodium, potassium, titanium, indium, yttrium, lithium, gadolinium, aluminum, platinum, gold, tungsten, tantalum, copper, silver, tin, and lead.
- the anode may also be formed of a transparent conductive oxide.
- the transparent conductive oxide may be formed of indium (In), tin (Sn), zinc (Zn), gallium (Ga), cerium (Ce), cadmium (Cd), magnesium (Mg), beryllium (Be), and silver (Ag). ), Molybdenum (Mo), vanadium (V), copper (Cu), iridium (Ir), rhodium (Rh), ruthenium (Ru), tungsten (W), cobalt (Co), nickel (Ni), manganese ( Mn), at least one oxide selected from aluminum (Al), and lanthanum (La).
- the anode is sputtering, e-beam evaporation, thermal evaporation, laser molecular beam epitaxy (L-MBE), and pulsed laser deposition (Pulsed Laser Deposition).
- PLD any one of the physical vapor deposition method (Physical Vapor Deposition, PVD); Thermal Chemical Vapor Deposition, Plasma-Enhanced Chemical Vapor Deposition (PECVD), Light Chemical Vapor Deposition, Laser Chemical Vapor Deposition, Metal- Chemical Vapor Deposition selected from any one of an Organic Chemical Vapor Deposition (MOCVD) and a Hydride Vapor Phase Epitaxy (HVPE); Or it may be formed using an atomic layer deposition method (ALD).
- PVD Physical Vapor Deposition
- PECVD Plasma-Enhanced Chemical Vapor Deposition
- MOCVD Organic Chemical Vapor Deposition
- HVPE Hydride Vapor Phase Epitaxy
- ALD atomic layer deposition method
- auxiliary electrode may be further included to improve resistance of the anode.
- the auxiliary electrode may be formed of at least one selected from the group consisting of a conductive sealant and a metal using a deposition process or a printing process. More specifically, the auxiliary electrode may include at least one of Cr, Mo, Al, Cu, and alloys thereof, but is not limited thereto.
- An insulating layer may be further included on the auxiliary electrode.
- the insulating layer may be formed using materials and methods known in the art. More specifically, common photoresist materials; Polyimide; Polyacrylic; Silicon nitride; Silicon oxide; Aluminum oxide; Aluminum nitride; Alkali metal oxides; It may be formed using an alkaline earth metal oxide or the like, but is not limited thereto.
- the thickness of the insulating layer may be 10 nm to 10 ⁇ m, but is not limited thereto.
- organic material layer is not particularly limited, and materials and formation methods well known in the art may be used.
- the organic layer may be formed into a smaller number of layers by using a variety of polymer materials, but not by a deposition process such as spin coating, dip coating, doctor blading, screen printing, inkjet printing or thermal transfer. It can manufacture.
- the organic material layer may include a light emitting layer, and may have a stacked structure including at least one selected from a hole injection layer, a hole transport layer, an electron transport layer, and an electron injection layer.
- the hole injection material As a material capable of forming the hole injection layer, a material having a large work function is usually preferred to facilitate hole injection into the organic material layer.
- the hole injection material include metals such as vanadium, chromium, copper, zinc and gold or alloys thereof; Metal oxides such as zinc oxide, indium oxide, indium tin oxide (ITO) or indium zinc oxide (IZO); Combinations of metals and oxides, such as ZnO: Al or SnO2: Sb; Conductive polymers such as poly (3-methylthiophene), poly [3,4- (ethylene-1,2-dioxy) thiophene] (PEDT), polypyrrole or polyaniline, and the like, but are not limited thereto.
- the material capable of forming the electron injection layer it is usually preferable that the material has a small work function to facilitate electron injection into the organic material layer.
- the electron injection material include metals such as magnesium, calcium, sodium, potassium, titanium, indium, yttrium, lithium, gadolinium, aluminum, silver, tin, and lead or alloys thereof; Multilayer structure materials such as LiF / Al or LiO 2 / Al, and the like, and the same material as the hole injection electrode material may be used, but is not limited thereto.
- a material capable of forming the light emitting layer a material capable of emitting light in the visible region by transporting and combining holes and electrons from the hole transporting layer and the electron transporting layer, respectively, is preferably a material having good quantum efficiency with respect to fluorescence or phosphorescence.
- Specific examples include 8-hydroxyquinoline aluminum complex (Alq 3); Carbazole series compounds; Dimerized styryl compounds; BAlq; 10-hydroxybenzoquinoline-metal compound; Benzoxazole, benzthiazole and benzimidazole series compounds; Poly (p-phenylenevinylene) (PPV) -based polymers; Spiro compounds; Polyfluorene, rubrene; Phosphorescent host CBP [[4,4'-bis (9-carbazolyl) biphenyl]; Etc., but is not limited thereto.
- Alq 3 8-hydroxyquinoline aluminum complex
- Carbazole series compounds Dimerized styryl compounds
- BAlq 10-hydroxybenzoquinoline-metal compound
- Benzoxazole, benzthiazole and benzimidazole series compounds Poly (p-phenylenevinylene) (PPV) -based polymers
- Spiro compounds Polyfluorene, rubrene
- the light emitting material may further include a phosphorescent dopant or a fluorescent dopant to improve fluorescence or phosphorescent properties.
- a phosphorescent dopant include ir (ppy) (3) (fac tris (2-phenylpyridine) iridium) or F2Irpic [iridium (III) bis (4,6-di-fluorophenyl-pyridinato-N, C2) picolinate] Etc.
- the fluorescent dopant those known in the art may be used.
- a material capable of injecting electrons well from the electron injection layer and transferring the electrons to the light emitting layer is suitable.
- Specific examples include Al complexes of 8-hydroxyquinoline; Complexes including Alq3; Organic radical compounds; Hydroxyflavone-metal complexes and the like, but are not limited thereto.
- the cathode may include at least one or more of Al, Ag, Ca, Mg, Au, Mo, Ir, Cr, Ti, Pd and alloys thereof, but is not limited thereto.
- the organic light emitting device according to the present application may be more preferably applied to the organic light emitting device for lighting.
- the organic light emitting device according to the present application may be more preferably applied to the flexible organic light emitting device.
- a light extraction layer may be further included between the substrate and the first electrode.
- the light extraction layer is not particularly limited as long as it can induce light scattering to improve the internal light extraction efficiency of the device.
- the light extraction layer may include a region having a refractive index of 1.7 or more, specifically, a refractive index of 1.7 to 3.0.
- a material having a refractive index of 1.7 or more in the light extraction layer By including a material having a refractive index of 1.7 or more in the light extraction layer, a light scattering effect due to a difference in refractive index with another region having a relatively low refractive index can be obtained.
- the light extraction layer may have a structure in which scattering particles are dispersed in a binder.
- the binder may have a higher refractive index than the scattering particles and may induce light scattering due to a difference in refractive index at an interface between the binder and the scattering particles.
- the binder may have a refractive index of 1.7 or more, or 1.7 to 3.0.
- the light extraction layer includes scattering particles and a binder, the scattering layer is formed on the opposite side of the surface in contact with the substrate irregularities by the scattering particles; And a flat layer formed on the scattering layer to planarize surface curvature due to the uneven structure of the scattering layer.
- the light extraction layer may increase the internal light extraction efficiency by forming a large difference in refractive index between the scattering particles and the flat layer.
- the flat layer may have a higher refractive index than scattering particles.
- the flat layer may have a refractive index of 1.7 or more, or 1.7 to 3.0.
- the light extraction layer is a binder layer formed on the substrate to form an uneven structure; And a flat layer formed on the binder layer to form a flat surface.
- the refractive index of the flat layer may be 1.7 or more, or 1.7 to 3.0.
- the scattering particles may be spherical, ellipsoidal, or amorphous, preferably spherical or ellipsoidal.
- An average diameter of the scattering particles may be 100 to 300 nm, specifically 150 to 200 nm.
- the scattering particles are not particularly limited as long as they can scatter light using a refractive index difference from a binder to a flat layer, for example, air, silicon, silica, glass, titanium oxide, magnesium fluoride, zirconium oxide, alumina, 1 selected from the group consisting of cerium oxide, hafnium oxide, niobium pentoxide, tantalum pentoxide, indium oxide, tin oxide, indium tin oxide, zinc oxide, silicon, zinc sulfate, calcium carbonate, barium sulfate, silicon nitride and aluminum nitride It may be more than one species. As one example, the scattering particles may be titanium dioxide.
- the binder is not particularly limited and may be an organic, inorganic or organic-inorganic composite binder.
- the binder may be an inorganic or organic-inorganic composite binder.
- Inorganic or organic-inorganic composite binders have better heat resistance and chemical resistance than organic binders, which is advantageous for device performance, particularly lifespan, and do not cause deterioration in high temperature processes, photo processes, and etching processes of 150 ° C.
- the binder may be inorganic or organic based on silicon oxide, silicon nitride, silicon oxynitride, alumina, and siloxane bond (Si-O).
- It may be at least one selected from the group consisting of complexes and the like.
- polycondensation may be performed using siloxane to form an inorganic binder based on [Si-O] bond, or a form of an organic-inorganic complex in which an alkyl group is not completely removed from the siloxane bond may be used.
- Components constituting the flat layer may be selected in the same range as the binder constituting the scattering layer described above. The same component may be used for the binder and the flat layer in the scattering layer, or different components may be used.
- the flat layer may further include a high refractive filler that can increase the refractive index.
- the high refractive filler is not particularly limited as long as it can be dispersed in the light extraction layer to increase the refractive index, for example, alumina, aluminum nitride, zirconium oxide, titanium oxide, cerium oxide, hafnium oxide, niobium pentoxide, tantalum pentoxide, At least one selected from the group consisting of indium oxide, tin oxide, indium tin oxide, zinc oxide, silicon, zinc sulfate, calcium carbonate, barium sulfate and silicon nitride.
- the high refractive filler may be titanium dioxide.
- the average particle diameter of the high refractive filler may be in the range of 5 to 30nm, specifically, 15 to 25nm. If the particle diameter of the high refractive filler is too small, the effect of increasing the refractive index is insignificant, and in the opposite case, the light transmittance may be reduced.
- the organic light emitting device has a total internal reflection due to the difference in refractive index between the layers constituting the device, thereby deteriorating the luminous efficiency and lowering the luminance.
- the present invention improves internal light extraction efficiency by forming a light extraction layer including scattering particles on a substrate.
- the light extraction layer may be formed to be limited to the light emitting region of the device toward the surface on which the device is deposited.
- the light extraction layer may have a structure sealed by the substrate and the anode.
- the present application provides a lighting device including the organic light emitting device.
- the organic light emitting element serves as a light emitting unit.
- Other configurations required for the lighting device may be applied to those known in the art.
- the present application provides a display device including the organic light emitting device.
- the organic light emitting diode may serve as a pixel or a backlight.
- Other configurations of the display apparatus may include those known in the art.
- the method of manufacturing an organic light emitting diode includes sequentially forming an organic light emitting part including a first electrode, an organic material layer, and a second electrode on a substrate; And encapsulating the outer side of the organic light emitting part with a sealing part including a sealing layer in contact with an outer side of the organic light emitting part, an insulating layer provided on the sealing layer, and a metal pattern layer provided between the sealing layer and the insulating layer. Characterized in that it comprises a.
- FIG. 4 A conventional method of manufacturing an organic light emitting device is schematically illustrated in FIG. 4, and a method of manufacturing an organic light emitting device according to an exemplary embodiment of the present application is schematically illustrated in FIG. 5.
- the method of manufacturing an organic light emitting diode may include forming two or more organic light emitting units including a first electrode, an organic material layer, and a second electrode on one substrate; Simultaneously sealing the outside of the at least two organic light emitting parts with an encapsulation part to form at least two organic light emitting devices including a substrate, an organic light emitting part, and an encapsulation part; And separating the two or more organic light emitting devices into individual organic light emitting devices, wherein the encapsulation part is in contact with the outside of each of the two or more organic light emitting parts, an insulating layer provided on the sealing layer, And a metal pattern layer provided between the sealing layer and the insulating layer.
- the metal pattern layer may be formed by laminating a metal pattern cut in advance on the insulating layer or by depositing a metal layer on the insulating layer and then patterning the metal pattern.
- the metal pattern layer may include a first metal pattern electrically connecting the first electrode and an external power source, and a second metal pattern electrically connecting the second electrode and an external power source.
- the metal pattern layer may include a third metal pattern, and the third metal pattern may be provided on the emission area of the organic light emitting part.
- the metal pattern layer includes a first metal pattern, a second metal pattern, and a third metal pattern, wherein the first metal pattern electrically connects the first electrode and an external power source, and the second The metal pattern electrically connects the second electrode and an external power source, and the third metal pattern is provided on an emission area of the organic light emitting part, and the first metal pattern, the second metal pattern, and the third metal pattern are Each may be spaced apart and electrically shorted.
- the third metal pattern may have an area equal to or larger than that of the light emitting region of the organic light emitting unit.
- the third metal pattern may have a structure that seals the upper and side surfaces of the emission area of the organic light emitting part.
- the encapsulation part may further include forming a contact hole for electrically connecting the first electrode or the second electrode to an external power source.
- an organic light emitting part including a first electrode, an organic material layer, and a second electrode; And the description of the encapsulation portion including a sealing layer, an insulating layer, a metal pattern layer can be cited above.
- An encapsulant according to an exemplary embodiment of the present application is an encapsulant including a sealing layer, an insulating layer provided on the sealing layer, and a metal pattern layer provided between the sealing layer and the insulating layer, wherein the encapsulant is in a thickness direction. At least one contact hole penetrating through, characterized in that at least one of the upper surface and the lower surface of the encapsulant comprises a protective layer.
- the encapsulant according to the exemplary embodiment of the present application is an encapsulant including a sealing layer, an insulating layer provided on the sealing layer, and a metal pattern layer provided between the sealing layer and the insulating layer.
- a protective layer provided on an upper surface and a lower surface, and half cutting in the thickness direction of any one of the protective layers provided on the upper and lower surfaces of the encapsulant, the insulating layer, the metal pattern layer, and the sealing layer. It is characterized by.
- FIG. 6 An encapsulant according to an exemplary embodiment of the present application is schematically illustrated in FIG. 6.
- forming a first protective layer on one surface of an insulating layer and forming a metal pattern layer on the other surface of the insulating layer, the insulating layer and the metal pattern Forming a sealing layer on the entire surface of the layer, forming a second protective layer on the sealing layer, and at least one penetrating the thickness direction of the insulating layer, the metal pattern layer, the sealing layer, and the second protective layer. Forming a contact hole.
- the method may further include performing a half cutting process in a thickness direction of the insulating layer, the metal pattern layer, the sealing layer, and the second protective layer. have.
- the encapsulant may be applied to the encapsulant of the organic light emitting device by removing the second protective layer and laminating the alignment on the substrate and the organic light emitting part. Thereafter, the first protective layer is removed, and the first electrode or the second electrode and the external power source can be electrically connected through the contact hole.
- the metal pattern layer may include two or more metal patterns spaced apart from each other and electrically shorted. Specifically, when the encapsulant is used as a sealing material of the organic light emitting part of the organic light emitting diode, the first metal pattern and the second electrode and the external power supply of the organic light emitting diode electrically connect the first electrode and the external power supply of the organic light emitting diode. It may include a second metal pattern for electrically connecting.
- the organic light emitting device uses a structure including a sealing layer, an insulating layer, and a metal pattern layer provided between the sealing layer and the insulating layer as an encapsulation part, so that the encapsulation and the electrode of the organic light emitting part are formed.
- the structure for equipotential can be simplified.
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Abstract
Description
Claims (26)
- 기판; 상기 기판 상에 제1 전극, 유기물층 및 제2 전극이 순차적으로 적층된 유기 발광부; 및 상기 유기 발광부의 외측을 밀봉하는 봉지부를 포함하고,상기 봉지부는 상기 유기 발광부의 외측과 접하는 실링층, 상기 실링층 상에 구비된 절연층 및 상기 실링층과 절연층 사이에 구비된 금속 패턴층을 포함하며,상기 금속 패턴층은 상기 제1 전극과 외부 전원을 전기적으로 연결하는 제1 금속 패턴 및 상기 제2 전극과 외부 전원을 전기적으로 연결하는 제2 금속 패턴을 포함하는 것을 특징으로 하는 유기 발광 소자.
- 청구항 1에 있어서, 상기 금속 패턴층은 제3 금속 패턴을 포함하고, 상기 제3 금속 패턴은 상기 유기 발광부의 발광 영역의 상부에 구비되는 것을 특징으로 하는 유기 발광 소자.
- 청구항 2에 있어서, 상기 유기 발광 소자의 상부 평면도를 기준으로,상기 제3 금속 패턴은 상기 유기 발광부의 발광 영역과 비교하였을 때 동일하거나 더 큰 면적을 가지는 것을 특징으로 하는 유기 발광 소자.
- 청구항 2에 있어서, 상기 제3 금속 패턴은 유기 발광부의 발광 영역의 상부 및 측면을 밀봉하는 것을 특징으로 하는 유기 발광 소자.
- 청구항 2에 있어서, 상기 제1 금속 패턴, 제2 금속 패턴 및 제3 금속 패턴은 각각 이격되어 전기적으로 단락된 구조인 것을 특징으로 하는 유기 발광 소자.
- 청구항 1에 있어서, 상기 봉지부는 두께 방향으로 관통하는 적어도 하나의 컨택홀을 포함하는 것을 특징으로 하는 유기 발광 소자.
- 청구항 6에 있어서, 상기 컨택홀은 도전성 재료로 채워진 것을 특징으로 하는 유기 발광 소자.
- 청구항 7에 있어서, 상기 도전성 재료는 Ag, Au, Cu, Ni, Al, W, Co, Pd 및 이들의 합금으로부터 선택되는 1종 이상을 포함하는 도전성 페이스트; 폴리아세틸렌, 폴리아닐린, 도프된 폴리에틸렌, 폴리피롤, 폴리티오펜, 전도성 에폭시(conductive epoxy), 이들의 혼합물 및 이들의 공중합체로부터 선택되는 1종 이상을 포함하는 전도성 고분자; 및 상기 전도성 고분자에 도전볼을 추가한 혼합물 중 적어도 하나를 포함하는 것을 특징으로 하는 유기 발광 소자.
- 청구항 1에 있어서, 상기 실링층은 제1 전극 또는 제2 전극과 외부 전원을 전기적으로 연결하는 도전볼을 추가로 포함하는 것을 특징으로 하는 유기 발광 소자.
- 청구항 1에 있어서, 상기 절연층 중 금속 패턴층이 구비된 면의 반대면 상에 구비되고 상기 제1 전극과 전기적으로 연결되는 제1 금속 패드를 추가로 포함하는 것을 특징으로 하는 유기 발광 소자.
- 청구항 1에 있어서, 상기 절연층 중 금속 패턴층이 구비된 면의 반대면 상에 구비되고 상기 제2 전극과 전기적으로 연결되는 제2 금속 패드를 추가로 포함하는 것을 특징으로 하는 유기 발광 소자.
- 청구항 1에 있어서, 상기 기판은 유리 기판 또는 플라스틱 기판인 것을 특징으로 하는 유기 발광 소자.
- 청구항 1에 있어서, 상기 절연층은 폴리이미드를 포함하는 것을 특징으로 하는 유기 발광 소자.
- 청구항 1에 있어서, 상기 유기 발광 소자는 플렉서블 유기 발광 소자인 것을 특징으로 하는 유기 발광 소자.
- 청구항 1에 있어서, 상기 기판 및 제1 전극 사이에는 광추출층을 추가로 포함하는 것을 특징으로 하는 유기 발광 소자.
- 청구항 1에 있어서, 상기 유기 발광 소자는 기판 상에 2개 이상의 유기 발광부를 포함하고,상기 봉지부는 1개의 실링층과 1개의 절연층 사이에 구비된 2개 이상의 금속 패턴층을 포함하는 것을 특징으로 하는 유기 발광 소자.
- 청구항 1 내지 16 중 어느 한 항의 유기 발광 소자를 포함하는 조명 장치.
- 청구항 1 내지 16 중 어느 한 항의 유기 발광 소자를 포함하는 디스플레이 장치.
- 기판 상에 제1 전극, 유기물층 및 제2 전극을 포함하는 유기 발광부를 순차적으로 형성하는 단계; 및상기 유기 발광부의 외측과 접하는 실링층, 상기 실링층 상에 구비된 절연층 및 상기 실링층과 절연층 사이에 구비된 금속 패턴층을 포함하는 봉지부로, 상기 유기 발광부의 외측을 밀봉하는 단계를 포함하며,상기 금속 패턴층은 상기 제1 전극과 외부 전원을 전기적으로 연결하는 제1 금속 패턴 및 상기 제2 전극과 외부 전원을 전기적으로 연결하는 제2 금속 패턴을 포함하는 것을 특징으로 하는 유기 발광 소자의 제조방법.
- 청구항 19에 있어서, 상기 금속 패턴층은 절연층 상에 금속 패턴을 라미네이션하거나, 절연층 상에 금속층을 증착하여 형성한 후 패터닝하여 형성하는 것을 특징으로 하는 유기 발광 소자의 제조방법.
- 청구항 19에 있어서, 상기 봉지부에 두께 방향으로 관통하는 적어도 하나의 컨택홀을 형성하는 단계를 추가로 포함하는 것을 특징으로 하는 유기 발광 소자의 제조방법.
- 하나의 기판 상에, 제1 전극, 유기물층 및 제2 전극을 포함하는 유기 발광부를 2개 이상 형성하는 단계;상기 2개 이상의 유기 발광부의 외측을 봉지부로 동시에 밀봉하여, 기판, 유기 발광부 및 봉지부를 포함하는 유기 발광 소자를 2개 이상 형성하는 단계; 및상기 2개 이상의 유기 발광 소자를 각각 개별적인 유기 발광 소자로 분리하는 단계를 포함하고,상기 봉지부는 상기 2개 이상의 유기 발광부 각각의 외측과 접하는 실링층; 상기 실링층 상에 구비된 절연층; 및 상기 실링층과 절연층 사이에 구비되고 상기 제1 전극과 외부 전원을 전기적으로 연결하는 제1 금속 패턴 및 상기 제2 전극과 외부 전원을 전기적으로 연결하는 제2 금속 패턴을 포함하는 금속 패턴층을 포함하는 것을 특징으로 하는 유기 발광 소자의 제조방법.
- 실링층, 상기 실링층 상에 구비된 절연층 및 상기 실링층과 절연층 사이에 구비된 금속 패턴층을 포함하는 봉지재로서,상기 봉지재는 두께 방향으로 관통하는 적어도 하나의 컨택홀을 포함하고,상기 봉지재의 상부면 및 하부면 중 적어도 일면에는 보호층을 포함하며,상기 금속 패턴층은 이격되어 전기적으로 단락된 2 이상의 금속 패턴을 포함하는 것을 특징으로 하는 봉지재.
- 실링층, 상기 실링층 상에 구비된 절연층, 및 상기 실링층과 절연층 사이에 구비된 금속 패턴층을 포함하는 봉지재로서,상기 봉지재의 상부면 및 하부면에 구비된 보호층을 포함하고,상기 봉지재의 상부면 및 하부면에 구비된 보호층 중 어느 하나, 절연층, 금속 패턴층 및 실링층의 두께 방향으로 하프 컷팅(half cutting)되고,상기 금속 패턴층은 서로 이격되어 전기적으로 단락된 2 이상의 금속 패턴을 포함하는 것을 특징으로 하는 봉지재.
- 절연층의 어느 한 면에 제1 보호층을 형성하고, 절연층의 다른 한 면에 서로 이격되어 전기적으로 단락된 2 이상의 금속 패턴을 포함하는 금속 패턴층을 형성하는 단계,상기 절연층 및 금속 패턴층의 전면 상에 실링층을 형성하는 단계,상기 실링층 상에 제2 보호층을 형성하는 단계, 및상기 절연층, 금속 패턴층, 실링층 및 제2 보호층의 두께 방향을 관통하는 적어도 하나의 컨택홀을 형성하는 단계를 포함하는 봉지재의 제조방법.
- 청구항 25에 있어서, 상기 컨택홀을 형성하는 단계 이후, 상기 절연층, 금속 패턴층, 실링층 및 제2 보호층의 두께 방향으로 하프 컷팅(half cutting) 공정을 수행하는 단계를 추가로 포함하는 봉지재의 제조방법.
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
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JP2016507507A JP6336569B2 (ja) | 2013-08-21 | 2014-08-21 | 有機発光素子およびその製造方法 |
US14/891,280 US9876190B2 (en) | 2013-08-21 | 2014-08-21 | Organic light-emitting diode and method for manufacturing same |
EP14838519.8A EP2983223B1 (en) | 2013-08-21 | 2014-08-21 | Organic light-emitting device and method for manufacturing same |
CN201480031246.3A CN105247701B (zh) | 2013-08-21 | 2014-08-21 | 有机发光器件及其制备方法 |
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KR10-2013-0099236 | 2013-08-21 |
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US (1) | US9876190B2 (ko) |
EP (1) | EP2983223B1 (ko) |
JP (1) | JP6336569B2 (ko) |
KR (1) | KR101512274B1 (ko) |
CN (1) | CN105247701B (ko) |
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CN110189637B (zh) * | 2019-06-27 | 2022-01-28 | 京东方科技集团股份有限公司 | 显示装置、可拉伸显示面板及其制造方法 |
FR3101198A1 (fr) * | 2019-09-19 | 2021-03-26 | Tecmoled | Diode électroluminescente organique flexible encapsulée |
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CN105247701B (zh) | 2017-08-25 |
EP2983223A1 (en) | 2016-02-10 |
EP2983223A4 (en) | 2017-08-02 |
US20160087237A1 (en) | 2016-03-24 |
US9876190B2 (en) | 2018-01-23 |
KR101512274B1 (ko) | 2015-04-14 |
TW201526329A (zh) | 2015-07-01 |
JP2016514895A (ja) | 2016-05-23 |
CN105247701A (zh) | 2016-01-13 |
JP6336569B2 (ja) | 2018-06-06 |
EP2983223B1 (en) | 2018-11-14 |
TWI649906B (zh) | 2019-02-01 |
KR20150021906A (ko) | 2015-03-03 |
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