WO2014155975A1 - 絶縁熱伝導性樹脂組成物 - Google Patents
絶縁熱伝導性樹脂組成物 Download PDFInfo
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- WO2014155975A1 WO2014155975A1 PCT/JP2014/001135 JP2014001135W WO2014155975A1 WO 2014155975 A1 WO2014155975 A1 WO 2014155975A1 JP 2014001135 W JP2014001135 W JP 2014001135W WO 2014155975 A1 WO2014155975 A1 WO 2014155975A1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
- H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
- H01B3/40—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes epoxy resins
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/28—Nitrogen-containing compounds
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L101/00—Compositions of unspecified macromolecular compounds
- C08L101/12—Compositions of unspecified macromolecular compounds characterised by physical features, e.g. anisotropy, viscosity or electrical conductivity
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L81/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing sulfur with or without nitrogen, oxygen or carbon only; Compositions of polysulfones; Compositions of derivatives of such polymers
- C08L81/06—Polysulfones; Polyethersulfones
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K5/00—Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
- C09K5/08—Materials not undergoing a change of physical state when used
- C09K5/14—Solid materials, e.g. powdery or granular
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/002—Inhomogeneous material in general
- H01B3/006—Other inhomogeneous material
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
- H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
- H01B3/301—Macromolecular compounds obtained by reactions forming a linkage containing sulfur with or without nitrogen, oxygen or carbon in the main chain of the macromolecule, not provided for in group H01B3/302
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2217—Oxides; Hydroxides of metals of magnesium
- C08K2003/222—Magnesia, i.e. magnesium oxide
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2227—Oxides; Hydroxides of metals of aluminium
Definitions
- the present invention relates to an insulating heat conductive resin composition. Specifically, the present invention relates to an insulating heat conductive resin composition used for a heat conductive component for cooling an electronic component or the like, for example, a heat radiating body.
- a heat radiator is usually attached to an electronic component that generates heat.
- a thermal conductivity is improved by forming a co-continuous phase separation structure using a plurality of resins and forming a heat conduction path by unevenly distributing the heat conductive filler in one resin phase or resin interface.
- a method is disclosed (see, for example, Patent Documents 6 and 7).
- Patent Documents 6 and 7 if only the thermally conductive filler is unevenly distributed as in Patent Documents 6 and 7, a certain amount of filling is required for high thermal conductivity, and the moldability may be deteriorated. In addition, it is difficult to continuously form the heat conduction path, and it may be divided by the resin phase. Therefore, the materials of Patent Documents 6 and 7 still have insufficient heat conductivity.
- An object of the present invention is to provide an insulating thermally conductive resin composition having high thermal conductivity and excellent moldability.
- the insulating thermally conductive resin composition according to the first aspect of the present invention is different from the first resin phase in which the first resin is three-dimensionally continuous and the first resin phase, and is formed of the second resin.
- a phase separation structure having two resin phases is provided.
- a small-diameter inorganic filler unevenly distributed in the first resin phase, and a large-diameter inorganic filler straddling the first resin phase and the second resin phase and thermally connecting the small-diameter inorganic filler unevenly distributed in the first resin phase are provided.
- the average particle diameter of the small-diameter inorganic filler is 0.1 to 15 ⁇ m.
- the average particle diameter of the large-diameter inorganic filler is larger than the average particle diameter of the small-diameter inorganic filler and is 1 to 100 ⁇ m.
- the insulating thermally conductive resin composition according to the second aspect of the present invention relates to the resin composition according to the first aspect, and a small-diameter inorganic filler is present at the interface between the first resin phase and the second resin phase.
- the insulating thermally conductive resin composition according to the third aspect of the present invention relates to the resin composition according to the first or second aspect, wherein the small-diameter inorganic filler is at the interface between the first resin phase and the second resin phase. Touching or straddling the interface.
- the insulating thermally conductive resin composition according to the fourth aspect of the present invention relates to the resin composition according to any one of the first to third aspects, and in the first resin phase, heat is generated by contact with the small-diameter inorganic filler. A conduction path is formed.
- the insulated thermal conductive resin composition according to the fifth aspect of the present invention relates to the resin composition according to any one of the first to fourth aspects, and relates to the small-diameter inorganic filler and the large-diameter inorganic filler in the insulated thermal conductive resin composition.
- the total proportion of the filler is 10 to 80% by volume.
- the ratio of the large-diameter inorganic filler in the total of the small-diameter inorganic filler and the large-diameter inorganic filler is 5 to 60% by volume.
- the insulating thermally conductive resin composition according to the sixth aspect of the present invention is the resin composition according to any one of the first to fifth aspects, wherein the small-diameter inorganic filler and the large-diameter inorganic filler are MgO, Al 2 O. 3 , containing at least one selected from the group consisting of BN and AlN.
- the insulating thermally conductive resin composition according to the seventh aspect of the present invention is the resin composition according to any one of the first to sixth aspects, wherein the first resin phase is any one of a thermosetting resin and a thermoplastic resin.
- the second resin phase is formed by the other of the thermosetting resin and the thermoplastic resin.
- the thermosetting resin is an epoxy resin
- the thermoplastic resin is polyethersulfone.
- the insulating thermally conductive resin composition according to the eighth aspect of the present invention is the resin composition according to the seventh aspect, wherein the phase separation structure is a co-continuous structure, and the small-diameter inorganic filler and the large-diameter inorganic filler are MgO, It contains at least one of Al 2 O 3 and BN. Further, the total proportion of the small-diameter inorganic filler and the large-diameter inorganic filler in the insulating heat conductive resin composition is 20 to 80% by volume, and the heat conductivity of the insulating heat conductive resin composition is 3 W / m ⁇ K or more. is there.
- FIG. 1 is a schematic view showing an insulating thermally conductive resin composition according to an embodiment of the present invention.
- FIG. 2 is a schematic view showing a state in which the large-diameter inorganic filler is removed from the insulating thermally conductive resin composition according to the embodiment of the present invention.
- FIG. 3 is a schematic diagram for explaining a phase separation structure, in which (a) shows a sea-island structure, (b) shows a continuous spherical structure, (c) shows a composite dispersion structure, and (d) shows A co-continuous structure is shown.
- FIG. 4 is a scanning electron micrograph showing a cross section of the insulating thermally conductive resin composition of Example 6.
- FIG. 5 is a scanning electron micrograph showing a cross section of the insulating thermally conductive resin composition of Example 7.
- the insulating thermally conductive resin composition 1 according to the embodiment of the present invention is different from the first resin phase 2 in which the first resin is three-dimensionally continuous as shown in FIG. A phase separation structure having a second resin phase 3 formed of the second resin is provided. Further, the first resin phase 2 is unevenly distributed with a small-diameter inorganic filler 4 having an average particle diameter of 0.1 ⁇ m to 15 ⁇ m. And a small-diameter inorganic filler that is spread over the first resin phase and the second resin phase and is unevenly distributed in the first resin phase, and further includes a large-diameter inorganic filler having an average particle diameter of 1 ⁇ m to 100 ⁇ m. Yes.
- the insulating thermally conductive resin composition 1 of the present embodiment has a first resin phase 2 and a second resin phase 3, and further has a structure in which these resin phases are mixed and phase separated. Further, the small-diameter inorganic filler 4 is unevenly distributed in the first resin phase 2, and the small-diameter inorganic fillers 4 are continuously in contact with each other. For this reason, since the heat conduction path 6 for transmitting heat energy is formed inside the first resin phase 2, the heat conductivity of the insulating heat conductive resin composition 1 can be improved.
- the insulating thermally conductive resin composition 1 has a large-diameter inorganic filler 5 arranged so as to straddle the first resin phase 2 and the second resin phase 3.
- the large-diameter inorganic filler 5 forms the heat conduction path 7 by contacting the unevenly distributed small-diameter inorganic filler 4. Therefore, the adjacent heat conduction paths 6 formed by the small diameter inorganic filler 4 are thermally connected by the heat conduction paths 7 formed by the large diameter inorganic filler 5.
- the heat conduction path increases inside the insulating heat conductive resin composition 1, so that high heat conductivity can be achieved.
- FIG. 2 shows a state in which the large-diameter inorganic filler is removed from the insulating thermally conductive resin composition according to the present embodiment.
- 2 has a structure in which the first resin phase 2 and the second resin phase 3 are phase-separated, and the inorganic filler 4 is unevenly distributed in the first resin phase 2 so that the inorganic fillers are in contact with each other.
- the heat conduction path 6 is formed. Therefore, it is easier to form a heat conduction path than in the case where no phase separation structure is used.
- a large amount of the small-diameter inorganic filler 4 is required for high thermal conductivity.
- the large-diameter inorganic filler 5 is disposed in the insulating thermally conductive resin composition 1 according to this embodiment.
- the 2nd resin phase 3 exists between the heat conductive paths 6 formed of the small diameter inorganic filler 4, the heat which connects the heat conductive paths 6 by containing the large diameter inorganic filler 5 is shown.
- a conduction path 7 is formed. Therefore, since heat conduction inside the resin composition is performed not only in the heat conduction path 6 but also in the heat conduction path 7, the heat conductivity can be greatly improved.
- the heat conduction path 7 is formed by the large-diameter inorganic filler 5, so the heat inside the resin composition A conduction path is ensured and thermal conductivity can be improved.
- the small-diameter inorganic filler 4 is unevenly distributed in the first resin phase 2, but may be unevenly distributed in the second resin phase 3.
- the small-diameter inorganic filler 4 does not necessarily have to be disposed inside the first resin phase 2, and a part thereof may be disposed in the second resin phase 3.
- the phase separation structure refers to any of a sea-island structure, a continuous spherical structure, a composite dispersion structure, and a co-continuous structure.
- the sea-island structure means a structure in which a small volume of dispersed phase 3A is dispersed in continuous phase 2A, and a structure in which fine particles or spherical dispersed phases 3A are scattered in continuous phase 2A.
- the continuous spherical structure is a structure in which approximately spherical dispersed phases 3A are connected and dispersed in the continuous phase 2A.
- the composite dispersed structure is a structure in which the dispersed phase 3A is dispersed in the continuous phase 2A, and the resin constituting the continuous phase is further dispersed in the dispersed phase 3A.
- the co-continuous structure is a structure in which the continuous phase 2A and the dispersed phase 3A form a complicated three-dimensional network.
- the first resin phase 2 in which the small-diameter inorganic filler 4 is unevenly distributed needs to be three-dimensionally continuous.
- the heat conduction path 6 can be formed by disposing the small-diameter inorganic filler 4 inside the first resin phase 2. Therefore, in the case of the sea-island structure, the continuous spherical structure, and the composite dispersion structure, the continuous phase 2A needs to be the first resin phase 2.
- the continuous phase 2A and the dispersed phase 3A are three-dimensionally continuous, one of them may constitute the first resin phase 2.
- phase separation structure such as the sea-island structure, continuous spherical structure, composite dispersion structure, and co-continuous structure is achieved by controlling the curing conditions such as the curing speed and reaction temperature of the resin composition, the compatibility of the resin, and the blending ratio. Obtainable.
- the small-diameter inorganic filler 4 is unevenly distributed in the first resin phase 2, and the small-diameter inorganic filler is in contact with each other to form the heat conduction path 6. Therefore, as long as the heat conduction path 6 is formed, the small-diameter inorganic filler 4 may exist at a substantially uniform density inside the first resin phase 2 or may exist in an uneven manner.
- the small-diameter inorganic filler 4 may exist at the interface between the first resin phase 2 and the second resin phase 3. That is, in the first resin phase 2, the small-diameter inorganic filler 4 may be present more in the vicinity of the interface between the first resin phase 2 and the second resin phase 3 than in the central portion of the first resin phase 2. .
- the small-diameter inorganic filler 4 is preferably arranged so as to be in contact with the interface between the first resin phase 2 and the second resin phase 3. Further, some of the particles constituting the small-diameter inorganic filler 4 may be disposed so as to straddle the interface between the first resin phase 2 and the second resin phase 3.
- the small-diameter inorganic filler 4 is present at the interface between the first resin phase and the second resin phase, the small-diameter inorganic fillers 4 are likely to contact each other in the vicinity of the interface inside the first resin phase 2. Become. Therefore, it is possible to form a continuous heat conduction path 6 in the vicinity of the interface between the first resin phase and the second resin phase.
- the first resin phase 2 is preferably formed of one of a thermosetting resin and a thermoplastic resin
- the second resin phase 3 is preferably formed of the other of the thermosetting resin and the thermoplastic resin.
- the first resin phase 2 is made of a thermosetting resin
- the second resin phase 3 is preferably made of a thermoplastic resin.
- the first resin phase 2 is made of a thermoplastic resin
- the second resin phase 3 is preferably made of a thermosetting resin.
- thermosetting resins examples include epoxy resins, unsaturated polyester resins, vinyl ester resins, phenol resins, urethane resins, urea resins, melamine resins, maleimide resins, cyanate ester resins, alkyd resins, and addition-curable polyimide resins. It is done.
- One of these thermosetting resins may be used alone, or two or more may be used in combination.
- an epoxy resin is preferable because it is excellent in heat resistance, electrical insulation, and mechanical properties.
- thermosetting resin When an epoxy resin is used as the thermosetting resin, a known one can be used.
- bisphenol A type epoxy resin, bisphenol F type epoxy resin, bisphenol S type epoxy resin, biphenyl type epoxy resin, naphthalenediol type epoxy resin, phenol novolac type epoxy resin can be used.
- a cresol novolac type epoxy resin, a bisphenol A novolak type epoxy resin, a cyclic aliphatic epoxy resin, or a heterocyclic epoxy resin (triglycidyl isocyanurate, diglycidyl hydantoin, etc.) can also be used.
- modified epoxy resins obtained by modifying these epoxy resins with various materials can be used.
- halides such as bromides and chlorides of these epoxy resins can also be used.
- One of these epoxy resins may be used alone, or two or more of them may be used in combination.
- any compound can be used as long as it has an active group capable of reacting with an epoxy group.
- Known epoxy curing agents can be used as appropriate, but compounds having an amino group, an acid anhydride group, or a hydroxyphenyl group are particularly suitable.
- curing agent may be used individually by 1 type of these, and may be used in combination of 2 or more type.
- the tertiary accelerator is a tertiary amine curing accelerator, a urea derivative curing accelerator, an imidazole curing accelerator, or a diazabicycloundecene (DBU) curing.
- Accelerators can be mentioned.
- organophosphorus curing accelerators for example, phosphine curing accelerators
- onium salt curing accelerators for example, phosphonium salt curing accelerators, sulfonium salt curing accelerators, ammonium salt curing accelerators, etc.
- group hardening accelerator, an acid, and a metal salt type hardening accelerator etc. can be mentioned.
- the thermoplastic resin generally has at least one bond selected from the group consisting of carbon-carbon bond, amide bond, imide bond, ester bond and ether bond in the main chain. Further, the thermoplastic resin may have at least one bond selected from the group consisting of a carbonate bond, a urethane bond, a urea bond, a thioether bond, a sulfone bond, an imidazole bond, and a carbonyl bond in the main chain.
- thermoplastic resin examples include polyolefin resin, polyamide resin, elastomeric resin (styrene, olefin, polyvinyl chloride (PVC), urethane, ester, amide), acrylic resin, polyester Examples thereof include resins. Further, engineering plastics, polyethylene, polypropylene, nylon resin, acrylonitrile-butadiene-styrene (ABS) resin, acrylic resin, ethylene acrylate resin, ethylene vinyl acetate resin, and polystyrene resin can be used.
- thermoplastic resin may be used individually by 1 type, and may be used in combination of 2 or more type.
- thermoplastic resin from the viewpoint of heat resistance.
- polyethersulfone which is excellent in various points such as mechanical properties, insulating properties and solubility in a solvent is more preferable.
- thermoplastic resins may have a functional group capable of reacting with an epoxy resin.
- functional groups include amino groups, hydroxyl groups, chlorine atoms, and alkoxy groups.
- thermosetting resin examples include the following.
- thermosetting resin examples include the thermosetting resin.
- polyethersulfone or polyetherimide can be used as the thermoplastic resin.
- unsaturated polyester resin when used as the thermosetting resin, polystyrene can be used as the thermoplastic resin.
- the small-diameter inorganic filler 4 has an average particle diameter of 0.1 ⁇ m to 15 ⁇ m.
- the average particle size of the small-diameter inorganic filler 4 is 0.1 ⁇ m to 15 ⁇ m, it becomes easy to be unevenly distributed in the first resin phase 2 (continuous phase) in the phase separation structure, and the insulating heat conduction has good workability and moldability.
- Resin composition can be obtained. That is, when the average particle size is 0.1 ⁇ m or more, the viscosity of the resin can be prevented from becoming excessively high, and the fluidity of the resin is ensured, so that workability and moldability are improved.
- the average particle diameter is 15 ⁇ m or less, the small-diameter inorganic filler 4 is easily unevenly distributed in the first resin phase 2, so that the heat conduction path 6 can be formed and high heat conduction can be achieved.
- the average particle size of the small-diameter inorganic filler 4 is preferably 1 ⁇ m to 15 ⁇ m, more preferably 3 ⁇ m to 10 ⁇ m.
- the average particle diameter of the large-diameter inorganic filler 5 is larger than the average particle diameter of the small-diameter inorganic filler 4. Specifically, the large-diameter inorganic filler 5 has an average particle diameter of 1 ⁇ m to 100 ⁇ m. Since the average particle diameter of the large-diameter inorganic filler 5 is 1 ⁇ m to 100 ⁇ m, the large-diameter inorganic filler 5 can exist across the first resin phase 2 and the second resin phase 3.
- the heat conduction path 7 is formed by contacting with the unevenly distributed small-diameter inorganic filler 4 and the heat conduction paths 6 are connected to each other, thereby effectively providing the heat conduction path inside the insulating heat conductive resin composition 1.
- the heat conduction path is increased, and the insulating heat conductive resin composition 1 can be made highly heat conductive. That is, when the average particle diameter is 1 ⁇ m or more, the small-diameter inorganic filler 4 can be efficiently contacted, and high thermal conductivity can be achieved. Moreover, it can suppress that a shaping
- the average particle size of the large-diameter inorganic filler 5 is preferably 20 ⁇ m to 100 ⁇ m, more preferably 20 ⁇ m to 90 ⁇ m.
- the small-diameter inorganic filler 4 has an average particle diameter of 0.1 ⁇ m to 15 ⁇ m
- the large-diameter inorganic filler 5 has an average particle diameter of 1 ⁇ m to 100 ⁇ m.
- the large-diameter inorganic filler 5 needs to have a particle diameter that spans the first resin phase 2 and the second resin phase 3 and that thermally connects the small-diameter inorganic fillers 4 that are unevenly distributed in the first resin phase 2. is there. Therefore, the average particle diameter of the large-diameter inorganic filler 5 is preferably 2 times or more, more preferably 3 or more times the average particle diameter of the small-diameter inorganic filler 4. Thereby, the heat conductive paths 6 made of the small-diameter inorganic filler 4 are thermally connected to each other, and the thermal conductivity of the insulating heat conductive resin composition 1 as a whole can be further increased.
- average particle diameter means median diameter.
- the median diameter means a particle diameter (d50) at which an integrated (cumulative) weight percentage is 50%.
- the median diameter can be measured using, for example, a laser diffraction particle size distribution measuring apparatus “SALD2000” (manufactured by Shimadzu Corporation).
- SALD2000 laser diffraction particle size distribution measuring apparatus
- the average particle diameter of the small diameter inorganic filler 4 and the large diameter inorganic filler 5 contained in the inside of the insulating heat conductive resin composition 1 is obtained by baking the insulating heat conductive resin composition 1 and the small diameter inorganic filler 4. It can be measured by isolating the large-diameter inorganic filler 5.
- the total ratio of the small-diameter inorganic filler 4 and the large-diameter inorganic filler 5 in the insulating thermal conductive resin composition 1 ([total volume of the small-diameter inorganic filler and large-diameter inorganic filler] / [insulating thermal conductive resin] The volume of the composition]) is preferably 10 to 80% by volume.
- the total volume ratio of the small-diameter inorganic filler 4 and the large-diameter inorganic filler 5 is 10% by volume or more, the effect of increasing the thermal conductivity due to the contact between the small-diameter inorganic filler 4 and the large-diameter inorganic filler 5 can be sufficiently expected.
- the total volume ratio of the small-diameter inorganic filler 4 and the large-diameter inorganic filler 5 is 80% by volume or less, there is no hindrance to the formation of the heat conduction path 6 by the small-diameter inorganic filler 4, and the viscosity of the resin at the time of molding. Can be prevented from becoming excessively high.
- the volume ratio can be measured by the method described later.
- the total ratio of the small-diameter inorganic filler 4 and the large-diameter inorganic filler 5 in the insulating heat conductive resin composition 1 is more preferably 15 to 80% by volume, further preferably 20 to 80% by volume, and 30 to 70% by volume. % Is particularly preferable, and 30 to 60% by volume is most preferable. By being in such a range, it becomes possible to achieve both high thermal conductivity and moldability.
- the ratio of the large-diameter inorganic filler 5 in the sum of the small-diameter inorganic filler 4 and the large-diameter inorganic filler 5 is preferably 5 to 60% by volume.
- the volume ratio of the large-diameter inorganic filler 5 is 5% by volume or more, high thermal conductivity can be achieved by contact with the small-diameter inorganic filler 4.
- the volume ratio of the large-diameter inorganic filler 5 is 60% by volume or less, the heat conduction path 6 by the small-diameter inorganic filler 4 can be formed.
- the ratio of the large-diameter inorganic filler 5 to the total of the small-diameter inorganic filler 4 and the large-diameter inorganic filler 5 is more preferably 20 to 50% by volume.
- the insulating thermally conductive resin composition 1 of the present embodiment can provide a resin composition having electrical insulation by using a material exhibiting electrical insulation. And in the insulating heat conductive resin composition 1, it is preferable that the constituent material of the small diameter inorganic filler 4 and the large diameter inorganic filler 5 uses the inorganic compound which has heat conductivity and electrical insulation.
- an inorganic compound having thermal conductivity for example, an inorganic compound having a thermal conductivity of 1 W / m ⁇ K or more can be used.
- the thermal conductivity of an inorganic compound having thermal conductivity is preferably 10 W / m ⁇ K or more, more preferably 30 W / m ⁇ K or more.
- an inorganic compound having electrical insulation an inorganic compound having a volume resistivity of 10 ⁇ ⁇ cm or more at room temperature (25 ° C.) can be used as the inorganic compound having electrical insulation.
- the volume resistivity of the inorganic compound having electrical insulation is preferably 10 5 ⁇ ⁇ cm or more, more preferably 10 8 ⁇ ⁇ cm or more, and particularly preferably 10 13 ⁇ ⁇ cm or more.
- inorganic compounds having both thermal conductivity and electrical insulation include borides, carbides, nitrides, oxides, silicides, hydroxides, carbonates, and the like.
- Specific examples include magnesium oxide (MgO), aluminum oxide (Al 2 O 3 ), boron nitride (BN), aluminum nitride (AlN), and aluminum hydroxide (Al (OH) 3 ).
- the small-diameter inorganic filler 4 and the large-diameter inorganic filler 5 preferably include at least one selected from the group consisting of MgO, Al 2 O 3 , BN, and AlN. Moreover, it is especially preferable that the small diameter inorganic filler 4 and the large diameter inorganic filler 5 contain at least one of MgO, Al 2 O 3 and BN.
- the small-diameter inorganic filler 4 and the large-diameter inorganic filler 5 are subjected to a surface treatment such as a coupling treatment or a dispersant is added to the insulating thermally conductive resin composition 1. Dispersibility may be improved. Moreover, the small diameter inorganic filler 4 can be unevenly distributed more effectively in the phase separation structure by appropriately selecting the surface treatment agent.
- organic surface treatment agents such as fatty acids, fatty acid esters, higher alcohols, and hardened oils can be used.
- an inorganic surface treatment agent such as a silicone oil, a silane coupling agent, an alkoxysilane compound, or a silylated material can also be used for the surface treatment.
- water resistance may be improved, and dispersibility in the resin may be further improved.
- a processing method There exist (1) dry method, (2) wet method, (3) integral blend method etc.
- the dry method means that the surface treatment agent is dropped on the surface while stirring the small-diameter inorganic filler and large-diameter inorganic filler by mechanical stirring such as Henschel mixer, Nauter mixer, and vibration mill. This is a method of processing.
- silane is used as the surface treatment agent, a solution obtained by diluting silane with an alcohol solvent, a solution obtained by diluting silane with an alcohol solvent, further adding water, diluting silane with an alcohol solvent, and further adding water and an acid.
- a preparation method of a surface treating agent is described in the catalog of the manufacturer of a silane coupling agent, etc., a preparation method is suitably determined according to the hydrolysis rate of silane and the kind of inorganic filler.
- the wet method is a method in which a small-diameter inorganic filler and a large-diameter inorganic filler are directly immersed in a surface treatment agent.
- the surface treatment agent that can be used is the same as in the dry method.
- the method for preparing the surface treatment agent is the same as the dry method.
- Integral blend method is a method of diluting a surface treatment agent with a stock solution or alcohol, etc., and directly adding it into a mixer when stirring the resin and filler.
- the preparation method of the surface treatment agent is the same as that of the dry method and wet method, but the amount of the surface treatment agent in the case of the integral blend method is generally larger than that of the dry method and wet method.
- the surface treatment agent is dried as necessary.
- a surface treatment agent using alcohol or the like it is necessary to volatilize the alcohol. If alcohol eventually remains in the formulation, the alcohol is generated as a gas that adversely affects the polymer content. Therefore, it is preferable that the drying temperature be equal to or higher than the boiling point of the solvent used.
- silane when used as the surface treatment agent, it can be heated to a high temperature (eg, 100 ° C. to 150 ° C.) using an apparatus in order to quickly remove silane that has not reacted with the inorganic filler. preferable. However, considering the heat resistance of the silane, it is preferable to keep the temperature below the decomposition point of the silane.
- the treatment temperature is preferably about 80 to 150 ° C., and the treatment time is preferably 0.5 to 4 hours.
- silane amount (g)] [Amount of inorganic filler (g)] ⁇ [Specific surface area of inorganic filler (m 2 / g)] / [Minimum coverage area of silane (m 2 / g)]
- the necessary amount of silane is 0.5 times or more and less than 1.0 times the amount of silane calculated by this formula. Even if the amount of silane is 1.0 times or more, the effect of the present invention can be exhibited. However, when the amount of silane is 1.0 times or more, an unreacted component remains, which may cause deterioration of physical properties such as deterioration of mechanical properties and water resistance. Therefore, the upper limit is preferably less than 1.0 times. Moreover, the reason why the lower limit value is set to 0.5 times the amount calculated by the above formula is that even this amount is sufficiently effective in improving the filler filling property into the resin.
- Insulating thermal conductive resin composition 1 is a colorant, a flame retardant, a flame retardant aid, a fiber reinforcement, a viscosity reducing agent for viscosity adjustment in production, as long as the effect of the present invention is not impaired.
- a dispersion adjusting agent, a release agent and the like for improving dispersibility of the toner (colorant) may be contained. These may be known ones, and examples thereof include the following.
- an inorganic pigment such as titanium oxide, an organic pigment or the like, or a toner containing them as a main component
- a toner containing them as a main component can be used. These may be used individually by 1 type and may be used in combination of 2 or more types.
- flame retardants examples include organic flame retardants, inorganic flame retardants, and reactive flame retardants. These may be used individually by 1 type and may be used in combination of 2 or more types.
- a flame retardant aid examples include antimony trioxide, antimony tetraoxide, antimony pentoxide, sodium antimonate, antimony compounds such as antimony tartrate, zinc borate, and barium metaborate.
- hydrated alumina, zirconium oxide, ammonium polyphosphate, tin oxide, iron oxide, and the like are also included. These may be used individually by 1 type and may be used in combination of 2 or more types.
- the thermal conductivity of the insulating thermally conductive resin composition 1 of the present embodiment is preferably 3 W / m ⁇ K or more. Even if the thermal conductivity is less than 3 W / m ⁇ K, the effect of the present invention can be exhibited. However, with such a thermal conductivity, when the insulating thermally conductive resin composition 1 is used as a heat radiator for an electronic component, the electronic component can be efficiently cooled even if it is reduced in size.
- thermosetting resin constituting the first resin a thermoplastic resin constituting the second resin, an inorganic filler, and a curing agent are added and kneaded to produce an uncured resin composition.
- the kneading of each component may be performed in a single stage, or may be performed in multiple stages by sequentially adding each component. When adding each component sequentially, it can add in arbitrary orders.
- thermoplastic resin As a method of kneading and adding each component, for example, first, a part or all of a thermoplastic resin is kneaded with a thermosetting resin to adjust the viscosity. Next, kneading is performed while sequentially adding the remaining thermoplastic resin, inorganic filler, and curing agent.
- the order of addition is not particularly limited, but the curing agent is preferably added last from the viewpoint of the storage stability of the resin composition.
- additives such as a colorant, a flame retardant, a flame retardant aid, a fiber reinforcement, a viscosity reducer, a dispersion regulator, and a release agent are added to the resin composition as necessary. Also good. Also, the order of addition of these additives is not particularly limited and can be added at an arbitrary stage. However, as described above, the curing agent is preferably added last.
- the kneading machine used for the production of the resin composition conventionally known ones can be used. Specific examples include a roll mill, a planetary mixer, a kneader, an extruder, a Banbury mixer, a mixing vessel provided with a stirring blade, and a horizontal mixing vessel.
- the kneading temperature at the time of producing the resin composition is not particularly limited as long as it can be kneaded, but for example, a range of 10 to 150 ° C. is preferable. When it exceeds 150 degreeC, a partial hardening reaction will start and the storage stability of the resin composition obtained may fall. If it is lower than 10 ° C., the viscosity of the resin composition is high, and it may be difficult to knead substantially.
- the temperature is preferably 20 to 120 ° C, and more preferably 30 to 100 ° C.
- the molding method of the uncured resin composition can be any method, and the molding shape can be any shape.
- various means such as compression molding (direct pressure molding), transfer molding, injection molding, extrusion molding, and screen printing can be used as the molding means.
- the insulating thermally conductive resin composition of the present embodiment is different from the first resin phase 2 in which the first resin is three-dimensionally continuous and the first resin phase 2 and is formed from the second resin phase. And a phase separation structure having three. Further, the small-diameter inorganic filler 4 unevenly distributed in the first resin phase 2 and the small-diameter inorganic filler 4 unevenly distributed in the first resin phase 2 across the first resin phase 2 and the second resin phase 3 are thermally connected. A diameter inorganic filler 5 is provided. The average particle size of the small-diameter inorganic filler 4 is 0.1 to 15 ⁇ m.
- the average particle diameter of the large-diameter inorganic filler 5 is larger than the average particle diameter of the small-diameter inorganic filler 4 and is 1 to 100 ⁇ m.
- the insulated heat conductive resin composition of this embodiment is comprised with the material which has electrical insulation as mentioned above, even the whole resin composition can be equipped with high electrical insulation.
- Epoxy resin (“jER (registered trademark) 828” manufactured by Mitsubishi Chemical Corporation, epoxy equivalent 189 g / eq, hereinafter also referred to as DGEBA (bisphenol A diglycidyl ether))
- Example 1 To 2.3 parts by mass of DGEBA, 22.3 parts by mass of PES pulverized so as to have an average particle diameter of 10 ⁇ m was added. Further, this mixture was stirred in an oil bath warmed to 120 ° C., thereby completely dissolving PES in DGEBA to obtain an epoxy resin solution.
- the resin composition was put into a mold heated to 150 ° C., held in a drying oven at 150 ° C. for 2 hours, and further heated at 180 ° C. for 2 hours to obtain a test piece of this example.
- Examples 2, 6, and 7 and Comparative Examples 1, 2, 5, and 6 A test piece of each example was obtained in the same manner as in Example 1 except that the small-diameter inorganic filler, the large-diameter inorganic filler, and the blending amounts thereof were changed as shown in Table 1.
- Example 3 To 2.3 parts by mass of DGEBA, 22.3 parts by mass of PES pulverized so as to have an average particle diameter of 10 ⁇ m was added. Next, this mixture was stirred in an oil bath warmed to 120 ° C. to completely dissolve PES in DGEBA, thereby obtaining an epoxy resin solution.
- the resin composition was put into upper and lower molds set at 150 ° C., and pressure-pressed at a molding pressure of 1 MPa and a mold temperature of 150 ° C. for 2 hours. Then, the test piece of a present Example was obtained by taking out the hardened
- Examples 4 to 5 Comparative Examples 3 to 4
- a test piece of each example was obtained in the same manner as in Example 3 except that the small-diameter inorganic filler, the large-diameter inorganic filler, and the blending amounts thereof were changed as shown in Table 1.
- volume ratio of inorganic filler First, the volume of the test piece of each example was calculated by the Archimedes method. Next, each test piece was baked at 625 degreeC using the muffle furnace, and the ash weight was measured. And since the ash is an inorganic filler, the total volume ratio of the small diameter and large diameter inorganic filler in the test piece and the large diameter inorganic from the blending ratio and density of the small and large diameter inorganic filler, the weight of the ash, and the volume of the test piece. The volume ratio of the filler was measured.
- the density is, MgO is 3.65 g / cm 3
- BN is 2.27g / cm 3
- Al 2 O 3 is 3.9g / cm 3
- Al (OH ) 3 was a 2.42 g / cm 3. Further, Al (OH) 3 was calculated in consideration of dehydration.
- Thermal conductivity was obtained from the product of thermal diffusivity, heat capacity (product of specific gravity and specific heat) and density. At that time, the thermal diffusivity was measured by the Xenon flash method using Xe flash analyzer LFA447 Nanoflash manufactured by NETZSCH, and the specific gravity and density were measured by the Archimedes method (submerged substitution method). Moreover, specific heat was measured by DSC method using DSC6220 by Seiko Instruments Inc.
- Molding workability was determined according to the following criteria from the molding conditions of the plate-like test pieces when the resin compositions of Examples and Comparative Examples were put into a mold having a length and width of 100 mm and a thickness of 2.0 mm. The determination was made by visual observation or observing the cross section with a scanning electron microscope (SEM). ⁇ : Molding was not observed and molding was possible. X: Short shot and could not be molded. Alternatively, molding defects such as voids were observed.
- Examples 1 to 7 showed higher thermal conductivity than Comparative Examples 1 to 6, despite the same volume ratio of the inorganic filler.
- Example 5 the reason why the thermal conductivity of Example 5 was lower than that of Example 4 was that the volume ratio of the large-diameter inorganic filler was large, and the thermal conduction path of the small-diameter inorganic filler due to phase separation was not sufficiently formed. It is considered that the formation of the phase separation structure was adversely affected. However, it can be seen that Comparative Example 4 in which the volume ratio of the inorganic filler is the same is useful in Example 5 considering that the viscosity has increased and molding has failed.
- FIG. 4 the result of having observed the cross section of the insulation heat conductive resin composition of Example 6 with the scanning electron microscope is shown.
- the small-diameter inorganic filler 4 is unevenly distributed in the first resin phase 2, and the large-diameter inorganic filler 5 straddles the first resin phase 2 and the second resin phase 3. And it can confirm that the large diameter inorganic filler 5 contacts the heat conduction path which consists of the small diameter inorganic filler 4, and is thermally connected.
- FIG. 5 shows the result of observing the cross section of the insulating thermally conductive resin composition of Example 7 with a scanning electron microscope.
- the small-diameter inorganic filler 4 is present at the interface between the first resin phase 2 and the second resin phase 3. It can also be seen that the small-diameter inorganic filler 4 is present more at the interface between the first resin phase 2 and the second resin phase 3 than at the central portion of the first resin phase 2.
- the small-diameter inorganic filler 4 is disposed so as to be in contact with the interface between the first resin phase 2 and the second resin phase 3, and as a result, it is confirmed that a continuous heat conduction path 6 is formed. it can.
- the first resin phase is formed of polyethersulfone, and the polyethersulfone further contains sulfur. Therefore, when the obtained resin composition is observed with a scanning electron microscope, the first resin phase containing sulfur turns gray compared to the second resin phase. Therefore, the first resin phase, the second resin phase, and their interfaces can be discriminated from the scanning electron micrograph.
- the small-diameter inorganic filler is unevenly distributed in the first resin phase, and there is a large-diameter inorganic filler straddling the first resin phase and the second resin phase. Therefore, in order to thermally connect the plurality of heat conduction paths made of the small diameter inorganic filler with the large diameter inorganic filler, a large number of heat conduction paths are generated. As a result, the thermal conductivity is improved even though the filling amount of the thermally conductive inorganic filler is small. Furthermore, since the fluidity
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Abstract
Description
乾式法とは、ヘンシェルミキサー、ナウターミキサー、振動ミルのような機械的な攪拌により小径無機フィラー及び大径無機フィラーを攪拌しながら、これに表面処理剤を滴下して表面処理を行う方法である。表面処理剤としてシランを用いる場合には、シランをアルコール溶剤で希釈した溶液や、シランをアルコール溶剤で希釈し、さらに水を添加した溶液、シランをアルコール溶剤で希釈し、さらに水及び酸を添加した溶液等が使用できる。表面処理剤の調製方法はシランカップリング剤の製造会社のカタログ等に記載されているが、シランの加水分解速度や無機フィラーの種類によって、調製方法を適宜決定する。
湿式法とは、小径無機フィラー及び大径無機フィラーを表面処理剤に直接浸漬して行う方法である。使用できる表面処理剤は、上記乾式法と同様である。また、表面処理剤の調製方法も乾式法と同様である。
インテグラルブレンド法は、樹脂とフィラーとを混合するときに、表面処理剤を原液又はアルコール等で希釈して混合機の中に直接添加し、攪拌する方法である。表面処理剤の調製方法は乾式法及び湿式法と同様であるが、インテグラルブレンド法で行う場合の表面処理剤の量は、乾式法及び湿式法に比べて多くすることが一般的である。
[シラン量(g)]=[無機フィラーの量(g)]×[無機フィラーの比表面積(m2/g)]/[シランの最小被覆面積(m2/g)]
[シランの最小被覆面積(m2/g)]=(6.02×1023)×(13×10-20(m2))/[シランの分子量]
式中、「6.02×1023」はアボガドロ定数であり、「13×10-20」は1分子のシランが覆う面積(0.13nm2)である。
エポキシ樹脂(三菱化学株式会社製「jER(登録商標)828」、エポキシ当量189g/eq、以下、DGEBA(ビスフェノールAジグリシジルエーテル)ともいう。)
ポリエーテルスルホン(住友化学株式会社製、「スミカエクセル(登録商標)5003P」、以下、PESともいう。)
4,4’-メチレンジアニリン(和光純薬工業株式会社製、活性水素当量49.5g/eq、以下、MDAともいう。)
小径無機フィラーA:MgO、平均粒子径(d50)8μm
小径無機フィラーB:BN、平均粒子径(d50)8μm
小径無機フィラーC:Al2O3、平均粒子径(d50)5μm
小径無機フィラーD:Al(OH)3、平均粒子径(d50)8μm
小径無機フィラーE:Al2O3、平均粒子径(d50)1.2μm
小径無機フィラーF:Al2O3、平均粒子径(d50)0.6μm
大径無機フィラーA:MgO、平均粒子径(d50)25μm
大径無機フィラーB:MgO、平均粒子径(d50)80μm
大径無機フィラーC:Al(OH)3、平均粒子径(d50)35μm
大径無機フィラーD:Al2O3、平均粒子径(d50)10μm
大径無機フィラーE:Al2O3、平均粒子径(d50)3μm
DGEBA100質量部に、平均粒子径が10μmになるように粉砕したPESを22.3質量部添加した。さらに、この混合物を120℃に温めたオイルバス中で攪拌することで、PESをDGEBAに完全に溶解させ、エポキシ樹脂溶液を得た。
小径無機フィラー、大径無機フィラー及びこれらの配合量を表1のように変更したこと以外は実施例1と同様の方法で、各例の試験片を得た。
DGEBA100質量部に、平均粒子径が10μmになるように粉砕したPESを22.3質量部添加した。次に、この混合物を120℃に温めたオイルバス中で攪拌することで、PESをDGEBAに完全に溶解させ、エポキシ樹脂溶液を得た。
小径無機フィラー、大径無機フィラー及びこれらの配合量を表1のように変更したこと以外は実施例3と同様の方法で、各例の試験片を得た。
まず、アルキメデス法により各例の試験片の体積を算出した。次に、マッフル炉を用いて各試験片を625℃で焼成し、灰分重量を測定した。そして、灰分が無機フィラーであるため、小径及び大径無機フィラーの配合比率及び密度、当該灰分重量、並びに試験片の体積から、試験片における小径及び大径無機フィラーの合計体積比率及び大径無機フィラーの体積比率を計測した。なお、密度は、MgOが3.65g/cm3、BNが2.27g/cm3、Al2O3が3.9g/cm3、Al(OH)3が2.42g/cm3とした。また、Al(OH)3については、脱水も考慮して計算を行った。
熱伝導率は、熱拡散率と熱容量(比重と比熱との積)と密度との積から求めた。その際、熱拡散率は、NETZSCH社製Xeフラッシュアナライザー LFA447 Nanoflashを用いて、キセノンフラッシュ法により測定し、比重及び密度はアルキメデス法(水中置換法)により測定した。また、比熱は、セイコーインスツル株式会社製DSC6220を用いて、DSC法により測定した。
縦横が100mmで厚みが2.0mmの金型に、各実施例及び比較例の樹脂組成物を投入した際の板状試験片の成形状況から、成形加工性を以下の基準で判定した。なお、判定は目視又は断面を走査型電子顕微鏡(SEM)で観察することにより判定した。
〇:成形欠陥が観察されず、成形できた。
×:ショートショットとなり成形できなかった。または、ボイドなどの成形欠陥が観察された。
2 第1樹脂相
3 第2樹脂相
4 小径無機フィラー
5 大径無機フィラー
Claims (8)
- 第1樹脂が三次元的に連続する第1樹脂相と、前記第1樹脂相と相違し、第2樹脂により形成される第2樹脂相とを有する相分離構造と、
前記第1樹脂相に偏在する小径無機フィラーと、
前記第1樹脂相と第2樹脂相にまたがり、第1樹脂相に偏在する小径無機フィラー同士を熱的に接続する大径無機フィラーと、
を備え、
前記小径無機フィラーの平均粒子径は0.1~15μmであり、前記大径無機フィラーの平均粒子径は前記小径無機フィラーの平均粒子径より大きく、かつ、1~100μmであることを特徴とする絶縁熱伝導性樹脂組成物。 - 前記小径無機フィラーは、前記第1樹脂相と第2樹脂相との界面に存在することを特徴とする請求項1に記載の絶縁熱伝導性樹脂組成物。
- 前記小径無機フィラーは、前記第1樹脂相と第2樹脂相との界面に接触している、又は前記界面をまたいでいることを特徴とする請求項1又は2に記載の絶縁熱伝導性樹脂組成物。
- 前記第1樹脂相では、前記小径無機フィラーが接触することにより熱伝導パスが形成されていることを特徴とする請求項1乃至3のいずれか一項に記載の絶縁熱伝導性樹脂組成物。
- 前記絶縁熱伝導性樹脂組成物における前記小径無機フィラー及び大径無機フィラーの合計の割合が10~80体積%であり、
前記小径無機フィラー及び大径無機フィラーの合計における前記大径無機フィラーの割合が5~60体積%であることを特徴とする請求項1乃至4のいずれか一項に記載の絶縁熱伝導性樹脂組成物。 - 前記小径無機フィラー及び大径無機フィラーが、MgO、Al2O3、BN及びAlNからなる群より選ばれる少なくとも一種を含有することを特徴とする請求項1乃至5のいずれか一項に記載の絶縁熱伝導性樹脂組成物。
- 前記第1樹脂相が熱硬化性樹脂及び熱可塑性樹脂のいずれか一方により形成され、前記第2樹脂相が熱硬化性樹脂及び熱可塑性樹脂の他方により形成され、
前記熱硬化性樹脂がエポキシ樹脂であり、前記熱可塑性樹脂がポリエーテルスルホンであることを特徴とする請求項1乃至6のいずれか一項に記載の絶縁熱伝導性樹脂組成物。 - 前記相分離構造が共連続構造であり、
前記小径無機フィラー及び大径無機フィラーが、MgO、Al2O3及びBNの少なくともいずれか一方を含有し、
前記絶縁熱伝導性樹脂組成物における前記小径無機フィラー及び大径無機フィラーの合計の割合が20~80体積%であり、
前記絶縁熱伝導性樹脂組成物の熱伝導率が3W/m・K以上であることを特徴とする請求項7に記載の絶縁熱伝導性樹脂組成物。
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EP2980161A1 (en) | 2016-02-03 |
US20160042831A1 (en) | 2016-02-11 |
EP2980161B1 (en) | 2018-09-26 |
CN105051115B (zh) | 2018-01-09 |
EP2980161A4 (en) | 2016-04-13 |
JP6025967B2 (ja) | 2016-11-16 |
JPWO2014155975A1 (ja) | 2017-02-16 |
US9779853B2 (en) | 2017-10-03 |
CN105051115A (zh) | 2015-11-11 |
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