WO2014069432A1 - Boîtier pour logement d'élément, et structure de montage - Google Patents

Boîtier pour logement d'élément, et structure de montage Download PDF

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Publication number
WO2014069432A1
WO2014069432A1 PCT/JP2013/079201 JP2013079201W WO2014069432A1 WO 2014069432 A1 WO2014069432 A1 WO 2014069432A1 JP 2013079201 W JP2013079201 W JP 2013079201W WO 2014069432 A1 WO2014069432 A1 WO 2014069432A1
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WO
WIPO (PCT)
Prior art keywords
frame
substrate
storage package
frame body
element storage
Prior art date
Application number
PCT/JP2013/079201
Other languages
English (en)
Japanese (ja)
Inventor
稔弘 浅野
亮太 松本
壮大 山岡
Original Assignee
京セラ株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 京セラ株式会社 filed Critical 京セラ株式会社
Priority to JP2014544507A priority Critical patent/JP6139549B2/ja
Priority to CN201390000518.4U priority patent/CN204303794U/zh
Publication of WO2014069432A1 publication Critical patent/WO2014069432A1/fr

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/053—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body
    • H01L23/057—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body the leads being parallel to the base
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/10—Containers; Seals characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • the present invention relates to an element storage package and a mounting structure including the element storage package.
  • the element in the element storage package, the element generates a large amount of heat, and there is a possibility that the sealing performance in the frame body may be destroyed due to the difference in thermal expansion coefficient between the input / output terminals and the frame body.
  • the problem is how to maintain good sealing performance in the frame.
  • the present invention has been made in view of the above, and an object of the present invention is to provide an element storage package excellent in sealing performance and a mounting structure including the element storage package.
  • An element storage package is applied to a substrate having an element mounting region on an upper surface, and one of an upper side and a lower side disposed on the upper surface of the substrate so as to surround an outer periphery of the mounting region.
  • a frame having a notch, and input / output terminals that are inserted through the notch of the frame to electrically connect the inside and the outside of the frame, and the frame has fitting portions at both ends. It is characterized by the four board
  • FIG. 12 is a perspective view of a state in which a seal ring and an input / output terminal are removed from the element storage package of FIG. It is the expansion perspective view which expanded the A4 part of FIG.
  • FIG. 1 and FIG. 2 are perspective views showing a mounting structure 1 according to the present embodiment, and both drawings are different in viewing direction.
  • FIG. 3 is an enlarged view of a corner portion of the frame, which is a portion A1 in FIG.
  • FIG. 4 is a plan view of the mounting structure, in which the lid is removed and the inside of the frame is shown.
  • FIG. 5 is an exploded perspective view of the element storage package, showing a substrate, input / output terminals, a frame, and a seal ring.
  • FIG. 6 is an exploded perspective view of the frame.
  • the mounting structure 1 is mounted on, for example, a home appliance such as a television, a mobile phone or computer device, an electronic device such as a power device, or a communication device such as an optical communication device or a wireless communication device.
  • a home appliance such as a television, a mobile phone or computer device
  • an electronic device such as a power device
  • a communication device such as an optical communication device or a wireless communication device.
  • it is suitable for a high-frequency circuit of an electronic device used at a high frequency such as a microwave or a millimeter wave.
  • the mounting structure 1 includes an element storage package 2 and an element 3 mounted on the element storage package 2.
  • the element storage package 2 includes, for example, an active element such as a semiconductor element, an optical semiconductor element, a transistor, a diode, or a thyristor, or a passive element such as a resistor, a capacitor, a solar cell, a piezoelectric element, a crystal oscillator, or a ceramic oscillator.
  • the element 3 is mounted.
  • the element storage package 2 includes a substrate 4 having a mounting region R of the element 3 on the upper surface, a frame 5 surrounding the outer periphery of the mounting region R on the upper surface of the substrate 4, and input / output terminals arranged inside and outside the frame 5 6 is provided.
  • the substrate 4 has a function of supporting the element 3 and the frame body 5.
  • substrate 4 of this embodiment is a rectangular shape when planarly viewed.
  • the substrate 4 includes an extended portion 4 a that is located at the four corners and extends outward, a screw hole 4 b that is provided in the extended portion 4 a and extends in the vertical direction, and an extended portion in the long side direction of the substrate 4.
  • a step 4c which is located between 4a and has a lower upper surface of the substrate 4.
  • the substrate 4 can be fixed to an external member by tightening a bolt or a screw in the screw hole 4b.
  • the shape of the step 4c corresponds to the shape of the region where the lead terminal 10 below the input / output terminal 6 is not attached, and the input / output terminal 6 is firmly connected to the step 4c via a brazing material. be able to.
  • the substrate 4 can be formed of, for example, a metal material such as copper, iron, tungsten, molybdenum, nickel, or cobalt, an alloy material containing these metal materials, or a composite material thereof.
  • the substrate 4 can have good thermal conductivity and can efficiently dissipate heat generated from the element 3 mounted in the mounting region R to the outside through the substrate 4.
  • the thermal conductivity of the substrate 4 is set to 15 W / (m ⁇ K) or more and 450 W / (m ⁇ K) or less, for example.
  • the Young's modulus of the substrate 4 is set to, for example, 100 GPa or more and 500 GPa or less.
  • the thermal expansion coefficient of the substrate 4 is set to, for example, 5 ⁇ 10 ⁇ 6 / ° C. or more and 25 ⁇ 10 ⁇ 6 / ° C. or less.
  • the substrate 4 is formed in a predetermined shape such as a plate shape by using a conventionally known metal processing method such as rolling or punching for an ingot obtained by casting and solidifying a molten metal material into a mold.
  • the length of the substrate 4 excluding the extending portion 4a is set, for example, such that the long side is 10 mm to 100 mm and the short side is 10 mm to 100 mm.
  • substrate 4 is set to 0.3 mm or more and 5 mm or less, for example.
  • the surface of the substrate 4 is formed with a metal layer such as nickel or gold by using an electroplating method or an electroless plating method in order to suppress oxidative corrosion.
  • the mounting region R of the substrate 4 is a region that is not connected to the frame body 5 when the frame body 5 is connected to the upper surface of the substrate 4. That is, the mounting region R of the substrate 4 is a region that does not overlap the frame 5 in plan view.
  • the shape of the substrate 4 is rectangular.
  • the shape is not limited to the rectangular shape, and may be a square shape, a polygonal shape, an elliptical shape, or the like. .
  • Element 3 is mounted on pedestal 3a.
  • the pedestal 3 a is disposed in the mounting region R inside the element storage package 2.
  • the pedestal 3a mounts the element 3 and can adjust the height position of the element 3.
  • the pedestal 3a is made of an insulating material, and electrical wiring that is electrically connected to the element 3 is formed on the upper surface of the pedestal 3a.
  • the frame body 5 is disposed so as to surround the outer periphery of the mounting region R of the substrate 4 and has a function of protecting the element 3 mounted in the mounting region R from the outside. Further, the frame body 5 is formed with a notch C through which the input / output terminal 6 is inserted in a part of the side surface. That is, the notch C is formed in the plate body constituting the frame body 5. This notch C is formed over one of the upper side and the lower side of the plate. In the present embodiment, the notch C is on the lower side of the plate.
  • the frame 5 has a rectangular outer shape, specifically a rectangular shape. That is, the shape of the frame 5 when viewed in plan is a rectangular shape, specifically, a rectangular shape, but is not limited thereto. That is, it may be a polygonal shape, a circular shape, an elliptical shape, or the like.
  • the frame body 5 is brazed to the substrate 4 through a bonding material such as a brazing material.
  • a bonding material such as a brazing material.
  • the brazing material is made of, for example, silver, copper, gold, aluminum, or magnesium, and may contain an additive such as nickel, cadmium, or phosphorus.
  • the frame 5 is composed of four plates.
  • the four plate bodies have fitting portions 5a and 5b at both ends.
  • the frame body 5 is formed by fitting the fitting portions 5a and 5b of the four plate bodies to each other.
  • each of the fitting portions 5a and 5b has a concave portion 5a at each end of two opposing plate bodies among the four plate bodies, and the remaining two opposing plates out of the four plate bodies.
  • Each of the both ends of this plate body is the convex part 5b.
  • the four plate bodies are fitted with concave portions 5a and convex portions 5b.
  • the recessed part 5a and the convex part 5b are joined in the state fitted through the joining material. That is, a bonding material is interposed between the concave portion 5a and the convex portion 5b, and the concave portion 5a and the convex portion 5b are fitted via the bonding material.
  • the frame 5 can be formed of, for example, a metal material such as copper, iron, tungsten, molybdenum, nickel or cobalt, an alloy material containing these metal materials, or a composite material thereof.
  • the frame 5 can efficiently dissipate heat generated from the element 3 to the outside of the frame 5 in a state where the element 3 is mounted in the mounting region R.
  • the thermal conductivity of the frame 5 is set to, for example, 15 W / (m ⁇ K) or more and 450 W / (m ⁇ K) or less.
  • the Young's modulus of the frame 5 is set to 100 GPa or more and 500 GPa or less, for example.
  • the thermal expansion coefficient of the frame 5 is set to, for example, 5 ⁇ 10 ⁇ 6 / ° C. or more and 25 ⁇ 10 ⁇ 6 / ° C. or less.
  • the length of one side of the frame 5 when viewed in plan is set, for example, such that the long side is 10 mm or more and 100 mm or less and the short side is 10 mm or more and 100 mm or less.
  • the thickness width from the inner side to the outer side of the frame 5 when viewed in plan is set to, for example, 0.3 mm or more and 3 mm or less.
  • the thickness of the frame 5 in the vertical direction is set to, for example, 4 mm or more and 20 mm or less.
  • the material of the bonding material can be selected so that the Young's modulus of the bonding material that connects the concave portion 5a and the convex portion 5b is smaller than the Young's modulus of the substrate 4 or the Young's modulus of the frame body 5.
  • the Young's modulus of the bonding material is set to, for example, 50 GPa or more and 95 GPa or less.
  • the recess 5a has a shape in which the outer main surface, the inner main surface, and the end surface of the plate are cut out at the end of the plate.
  • the recessed part 5a is provided in the center part of the up-down direction in the edge of a board.
  • the recess 5 a is provided on a plate located on the short side of the four plates constituting the frame 5.
  • the size of the concave portion 5a in the direction along the long side of the frame 5 corresponds to the size of the convex portion 5b in the long side direction of the frame 5, and is set to, for example, 0.3 mm or more and 3 mm or less.
  • size of the direction along the short side of the frame 5 of the recessed part 5a is set, for example to 0.3 mm or more and 3 mm or less.
  • the vertical size of the recess 5a is set to, for example, 2 mm or more and 18 mm or less.
  • the convex part 5b is the shape which protruded in the direction along the outer side main surface and inner side main surface of a plate body from the end surface of a plate body in the edge of a plate body. Moreover, the convex part 5b fits into the concave part 5a.
  • the convex part 5b is provided in the center part in the up-down direction at the end of the plate. Moreover, the convex part 5b is provided in the plate body located in a long side among the four plate bodies which comprise the frame 5.
  • the size of the convex portion 5b along the long side direction of the frame body 5 corresponds to the size of the concave portion 5a along the long side direction of the frame body 5, and is set to, for example, 0.3 mm or more and 3 mm or less.
  • the size of the convex portion 5b along the short side direction of the frame 5 corresponds to the size of the concave portion 5a in the short side direction of the frame 5, and is set to, for example, 0.3 mm or more and 3 mm or less.
  • the size of the convex portion 5b in the vertical direction corresponds to the size of the concave portion 5a in the vertical direction, and is set to, for example, 2 mm or more and 18 mm or less.
  • the concave portion 5a and the convex portion 5b are located in the central portion of the frame body 5 in the vertical direction, so that the strength as the frame body 5 can be maintained well. If the concave portion 5a and the convex portion 5b are located in the upper part or the lower portion of the frame body 5, if the frame body 5 receives external force or thermal stress, the concave portion 5a and the convex portion 5b Since the way of fitting is biased, the convex portion 5b is easily detached from the concave portion 5a.
  • the convex portion 5 b is provided on the plate body positioned on the long side of the frame body 5, and the concave portion 5 a is provided on the plate body positioned on the short side of the frame body 5, whereby the input / output terminal 6, the substrate 4, and the frame
  • the force acting in the vertical direction at the end of the long side of the frame 5 due to the difference in thermal expansion with the body 5 can be distributed along the fitting portions 5a and 5b between the concave portion 5a and the convex portion 5b.
  • the convex portion 5b by fitting the convex portion 5b to the concave portion 5a, the vertical movement at the end of the long side of the frame body 5 is restrained by the concave portion 5a, and the vertical direction at the joint portion of the long side and short side of the frame body 5 The force acting on is reduced. As a result, peeling and cracking at the joint between the long side and the short side of the frame 5 are suppressed. Furthermore, the end surface of the plate body positioned on the long side of the frame body 5 is joined to the plate body positioned on the short side of the frame body 5 at two locations positioned on the upper side and the lower side with the convex portion 5b interposed therebetween.
  • the bonding strength between the plate body positioned on the long side of the frame body 5 and the plate body positioned on the short side is ensured, and the joint portion due to expansion or contraction in the long side direction of the frame body 5 is likely to be warped or deformed. Cracking and peeling can be suppressed.
  • a material having a higher thermal conductivity than the material of the frame body 5 (plate body) can be selected as the material of the bonding material for bonding the concave portion 5a and the convex portion 5b.
  • the material of the bonding material may be appropriately selected according to the material of the plate, and can be formed of, for example, a metal material such as gold, silver, or copper.
  • the heat generated from the signal line due to the high frequency and the heat of the element 3 generated when the mounting structure 1 is actuated are likely to go inside the frame 5. If the heat spreads inside the frame body 5, the element 3 becomes hot, and the element 3 may malfunction or be damaged.
  • a material having a higher thermal conductivity than the material of the frame 5 may be employed as a bonding material for bonding the concave portion 5a and the convex portion 5b.
  • a bonding material may be interposed between the inner surface of the concave portion 5a and the outer surface of the convex portion 5b.
  • the plate Since the frame 5 is formed by fitting four plates, the plate is heated by heat generated from the signal line due to high frequency and heat of the element 3 generated when the mounting structure 1 is operated. It may expand and stress may be applied to the concave portion 5a and the convex portion 5b. When stress is applied, there is a possibility that a gap is generated between the concave portion 5a and the convex portion 5b, or that the concave portion 5a and the convex portion 5b are disengaged, and the sealing performance of the element housing package 2 is lowered.
  • the frame 5 is formed so that the height position of the upper surface is the same height, that is, the height of the upper surface is uniform.
  • the frame 5 is composed of four plates, and is fixed via a bonding material by fitting the concave portions 5a and the convex portions 5b.
  • the four separate plate bodies function as the frame body 5 together, but the upper surface of the frame body 5 (plate body) is further set so that the thickness in the vertical direction is all the same. This makes it easier to align the seal ring 7.
  • a light transmissive member 5 c that allows light from an optical fiber located outside to reach a region surrounded by the frame body 5 is disposed on a plate body positioned on the short side of the frame body 5.
  • the light transmissive member 5c is made of a light transmissive material such as a lens, plastic, glass, or sapphire substrate, for example.
  • the frame body 5 is provided with a notch C in a plate body positioned on the long side of the frame body 5.
  • the notch C of the present embodiment is formed from the lower part of the frame 5 to the central part of the frame 5. And the notch C is provided so that a position may correspond to the level
  • the notch C is set to have a vertical size of, for example, 1 mm or more and 20 mm or less.
  • the length of the cutout C in the direction along the long side of the frame 5 is set to, for example, 1 mm or more and 20 mm or less.
  • the length of the notch C in the direction orthogonal to the long side of the frame 5 corresponds to the thickness width from the inside to the outside of the frame 5 and is set to, for example, 0.3 mm or more and 3 mm or less.
  • the input / output terminal 6 inserted through the notch C and having the lower portion fitted in the step 4c includes a plurality of laminated dielectric layers 8, a signal line 9 passing through the dielectric layer 8, and a dielectric located at the lowest layer.
  • a signal line 9 extending on the lower surface of the layer 8 and a lead terminal 10 electrically connected are provided.
  • the dielectric layer 8 is provided with a ground layer corresponding to the signal line 9, and the signal line 9 and the ground layer function as a high-frequency transmission path.
  • the signal line 9 has a function of transmitting a predetermined electric signal.
  • the signal line 9 is used as, for example, a microstrip line or a coplanar line.
  • the signal line 9 is made of a metal material such as copper, silver, gold, aluminum, nickel, or chromium, for example.
  • the line width of the signal line 9 is 1 ⁇ 4 or less of the wavelength of the signal transmitted to the signal line 9, and is set to, for example, 0.05 mm or more and 0.5 mm or less.
  • the signal line 9 is formed with a lead terminal 10 for connection to the outside through, for example, a brazing material.
  • the lead terminal is a member for electrically connecting an external electronic device or the like to the element 3.
  • the ground layer is formed on a part of the lower surface of the dielectric layer 8.
  • the ground layer is set to a constant potential such as ground.
  • the ground layer is made of, for example, a metal material such as copper, silver, gold, aluminum, nickel, or chromium.
  • the substrate 4 is made of a metal material, and the ground layer and the substrate 4 are electrically connected.
  • the dielectric layer 8 is an insulating substrate, for example, an inorganic material such as aluminum oxide, aluminum nitride, or silicon nitride, or an organic material such as epoxy resin, polyimide resin, or ethylene resin, or ceramic such as alumina or mullite. It can be formed of a material or a glass ceramic material. Alternatively, the dielectric layer 8 can be formed of a composite material obtained by mixing a plurality of these materials.
  • the vertical thickness of the dielectric layer 8 is not more than one half of the wavelength of the signal transmitted to the signal line 9 and is set to, for example, not less than 1 mm and not more than 20 mm.
  • the dielectric layer 8 may contain a large number of fillers.
  • the dielectric layer 8 contains a filler, so that the viscosity of the dielectric layer 8 before curing can be adjusted, and the thickness dimension of the dielectric layer 8 can be adjusted. Can be brought close to the desired value.
  • the filler is spherical, and is made of, for example, silicon oxide, silicon carbide, aluminum oxide, aluminum nitride, or aluminum hydroxide, and the filler diameter is set to, for example, 0.05 ⁇ m or more and 6 ⁇ m or less.
  • the thermal expansion coefficient of the output terminal 6 is set to, for example, 4 ⁇ 10 ⁇ 6 / ° C. or more and 10 ⁇ 10 ⁇ 6 / ° C. or less.
  • the relative dielectric constant of the filler contained in the dielectric layer 8 can be set smaller than the relative dielectric constant of the material constituting the dielectric layer 8.
  • the filler can be an insulating filler. By making the filler insulative, the influence on the characteristic impedance of the signal transmitted to the signal line 9 can be reduced.
  • the lead terminal 10 has a function of electrically connecting an external electronic device and the element 3 to each other.
  • the lead terminal 10 is connected to a signal line 9 formed on the lower surface of the input / output terminal 6 through a brazing material. Then, the signal line 9 and the lead terminal 10 are electrically connected.
  • a plurality of signal lines 9 are formed on the lower surface of the input / output terminal 6, and the plurality of signal lines 9 are spaced apart from each other. Adjacent signal lines 9 are electrically insulated from each other. Then, by arranging the respective lead terminals 10 on the respective signal lines 9, the adjacent lead terminals 10 are electrically insulated from each other.
  • the lead terminal 10 is made of a conductive material and can be formed of, for example, a metal material such as copper, iron, tungsten, molybdenum, nickel, or cobalt, or an alloy material containing these metal materials.
  • the lead terminal 10 is bent in a crank shape between one end of the lead terminal 10 and the other end of the lead terminal 10. That is, the lead terminal 10 is bent so that the height position of the lower surface of the lead terminal 10 is the same as the height position of the lower surface of the substrate 4 with the input / output terminal 6 fitted in the step 4c. And both the board
  • the element storage package 2 can be connected so as not to be inclined with respect to the external substrate while increasing the area to be fixed to the external substrate. As a result, the element storage package 2 can be stably and firmly connected to an external substrate.
  • the seal ring 7 is brazed to the upper surface of the frame 5 via a bonding material such as a brazing material.
  • the brazing material is made of, for example, silver, copper, gold, aluminum, or magnesium, and may contain an additive such as nickel, cadmium, or phosphorus.
  • the seal ring 7 is a frame-like member that overlaps with the frame 5 provided on the substrate 4 when viewed in plan.
  • the seal ring 7 is made of a buffer material having excellent thermal conductivity, such as copper, iron, tungsten, molybdenum, nickel, or cobalt.
  • the solid bonding material is provided along the upper surface of the frame body 5 at a location overlapping the seal ring 7. Then, the seal ring 7 is stacked on the bonding material, and heat is applied to the seal ring 7, so that the bonding material is melted and connected to the seal ring 7. Furthermore, the seal ring 7 is fixed to the frame 5 by cooling and solidifying the molten bonding material. At this time, a part of the molten bonding material flows along the edge of the frame body 5 from the upper surface of the frame body 5 and flows into the joint between the four plate bodies.
  • the frame body 5 formed of four plates as separate bodies is poured into the gap between the concave portion 5a and the convex portion 5b to close the gap between the concave portion 5a and the convex portion 5b. It is possible to maintain good sealing performance.
  • a lid 11 is disposed on the seal ring 7.
  • the lid 11 is disposed on the seal ring 7 with the element 3 mounted on the mounting region R.
  • the lid 11 has a function of sealing a space surrounded by the substrate 4 and the frame 5.
  • the lid 11 is brazed to the upper surface of the frame 5 via a brazing material, for example.
  • the lid 11 is made of, for example, a metal material such as copper, iron, tungsten, molybdenum, nickel, or cobalt, or an alloy material containing these metal materials.
  • the element 3 is flip-chip mounted on the element storage package 2 via bumps such as solder.
  • a semiconductor element such as an IC or LSI is mounted, as a raw material of the semiconductor element, for example, a material made of silicon, germanium, gallium arsenide, gallium arsenide phosphorus, gallium nitride, silicon carbide, or the like can be used.
  • the frame body 5 and the input / output terminal 6 are thermally expanded due to heat generated from the signal line due to high frequency and heat of the element 3 generated when operating the mounting structure 1, Since the force acting in the vertical direction of the frame 5 can be distributed along the fitting portions 5a and 5b, the stress applied to the joint between the frame 5 and the substrate 4 can be relaxed, and the frame 5 is peeled off from the substrate 4. Can be suppressed. As a result, the sealing property in the frame 5 can be maintained satisfactorily.
  • the present embodiment it is possible to suppress the frame body 5 from being broken, and as a result, it is possible to maintain the sealing performance in the frame body 5 favorably. In this way, it is possible to provide the element housing package 2 and the mounting structure 1 having excellent sealing properties.
  • the fitting portions 5a and 5b at both ends of each plate constituting the frame body 5 have a structure in which only the concave portion 5a or the convex portion 5b exists. I can't.
  • the frame body 5 may have a structure in which four concave portions 5a are formed at one end of the plate body and four convex portions 5b are formed at the other end of the plate body.
  • one plate body has the one fitting part 5a, 5b in one end, it is not limited to this.
  • 7 and 8 show an element storage package 2 according to another embodiment of the present invention.
  • the element storage package 2 four plate bodies have a plurality of fitting portions 5a and 5b at both ends, and the four plate bodies are fitted by the plurality of fitting portions 5a and 5b. is doing.
  • the bonding area between the plates increases, so that the four plates can be more firmly fixed, and the strength of the frame 5 is improved.
  • a plurality of fitting portions 5a and 5b may be provided on at least one end of two adjacent plates among the four plates.
  • the plate body in which the notch C through which the input / output terminal 6 is inserted is formed in the central portion has the recess 5a.
  • the recess 5a is located in a portion excluding the side of the notch C at both ends of the plate.
  • a stepped portion may be provided between the fitted convex portion 5b and concave portion 5a. That is, in the recessed part 5a and the convex part 5b to be fitted, a part of the convex part 5b may be positioned outside the concave part 5a, or the size of the concave part 5a may be larger than that of the convex part 5b.
  • a meniscus of the bonding material is continuously formed along the step between the fitted convex portion 5b and the concave portion 5a, the bonding area is increased, and the fitting is increased. The joint strength of the joint portions 5a and 5b can be improved.
  • one of the four plates has a plurality of bent portions 5d that are bent toward two adjacent plates. Further, the bent portion 5 d is located at a corner of the rectangular frame 5.
  • the plate body has the bent portion 5d bent toward the adjacent plate body, and the bent portion 5d is positioned at the corner of the frame body 5 so that the fitting portion 5a of the plate body is provided. , 5b can be prevented from becoming corner portions of the frame body 5, and stress can be prevented from concentrating on the fitting portions 5a, 5b of the plate body.
  • the fitting portions 5a, 5b of the plate body It can avoid becoming the corner
  • the plate having the bent portion 5 d can be stably disposed on the upper surface of the substrate 4. That is, the plate body having the bent portion 5d functions as a support for the bent portion 5d at the end portion of the plate body, so that the plate body is not easily tilted with respect to the upper surface of the substrate 4.
  • the fitting portions 5a and 5b of the plate body can be stably fitted.
  • one plate has two bent portions 5d, one at each end, but only one bent portion 5d may be provided.
  • one plate body has the bent portion 5d, a plurality of plate bodies may have the bent portion 5d.
  • the fitting parts 5a and 5b have the inclined part 5e in the outer surface of the convex part 5b which is an uneven
  • the stress applied to the fitting portions 5b and 5c can be dispersed by the inclined portion 5e.
  • each of the substrate 4, the frame body 5, the seal ring 7, the lead terminal 10 and the lid body 11 is prepared.
  • Each of the substrate 4, the four plates, the seal ring 7, the lead terminal 10, and the lid 11 is a punching method and a cutting method for a solidified ingot in which a molten metal material is cast into a mold.
  • a metal processing method such as, it is manufactured in a predetermined shape.
  • the mold of the frame 5 is manufactured in a shape in which the concave portion 5a or the convex portion 5b is provided, and is set in advance so that the frame 5 taken out from the mold has a predetermined shape.
  • the input / output terminal 6 is prepared.
  • a method for manufacturing the input / output terminal 6 when the material of the dielectric layer 8 is an aluminum oxide sintered body, an aluminum nitride sintered body, a mullite sintered body, or the like will be described.
  • the material of the dielectric layer 8 is made of an aluminum oxide sintered body, first, an organic binder, a plasticizer, a solvent, or the like is added to a raw material powder such as aluminum oxide, silicon oxide, magnesium oxide, or calcium oxide. Mix to make a mud. And the dielectric layer 8 before sintering can be produced by molding and processing a slurry-like aluminum oxide material into a green sheet.
  • a high melting point metal powder such as tungsten or molybdenum is prepared, and an organic binder, a plasticizer, a solvent or the like is added to and mixed with the powder to obtain a metal paste.
  • line 9 is formed in the predetermined location using the screen printing method with respect to the prepared dielectric material layer 8 before sintering, for example.
  • a plurality of precursor dielectric layers 8 are laminated and fired at a temperature of about 1600 ° C., and then the lead terminals 10 are joined to the signal lines 9 on the lower surface of the dielectric layer 8 by a brazing material.
  • the input / output terminal 6 made of ceramics can be produced.
  • the frame body 5 is disposed on the prepared substrate 4 via the brazing material, the input / output terminal 6 is disposed on the step 4c via the brazing material, and the input / output terminal 6 is fitted into the notch C of the frame body 5. .
  • a seal ring 7 is disposed on the upper surface of the frame body 5 with a brazing material. Then, the brazing material is melted so that the brazing material flows between the substrate 4, the frame body 5, the input / output terminals 6, and the seal ring 7, and the four corners of the concave portions 5 a and the convex portions 5 b of the frame body 5. Pour brazing material into the gap.
  • the brazing material is cooled to join the substrate 4, the frame body 5, the input / output terminal 6, and the seal ring 7, and the gaps at the four corners of the frame body 5 are closed with the brazing material.
  • the sealing property of the is maintained well.
  • the element storage package 2 can be manufactured.
  • the mounting structure 1 can be manufactured by mounting the element 3 on the element storing package 2 via solder and joining the lid 11 to the seal ring 7 by seam welding.

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  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

Le boîtier pour logement d'élément de l'invention est équipé : d'un substrat possédant sur sa face supérieure une région de montage d'un élément ; de corps de châssis qui sont disposés de manière à entourer la périphérie externe de ladite région de montage sur la face supérieure dudit substrat, et qui possèdent des encoches s'accrochant à un côté supérieur ou un côté inférieur ; et d'une borne d'entrée/sortie insérée dans lesdites encoches desdits corps de châssis, et qui connecte électriquement l'intérieur et l'extérieur desdits corps de châssis. Lesdits corps de châssis au nombre de quatre qui possèdent chacun des parties ajustement à leur deux extrémités, sont caractéristiques en ce qu'ils sont ajustés de manière individuelle par lesdites parties ajustement entre elles.
PCT/JP2013/079201 2012-10-30 2013-10-29 Boîtier pour logement d'élément, et structure de montage WO2014069432A1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2014544507A JP6139549B2 (ja) 2012-10-30 2013-10-29 素子収納用パッケージおよび実装構造体
CN201390000518.4U CN204303794U (zh) 2012-10-30 2013-10-29 元件收纳用封装件以及安装构造体

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JP2012238516 2012-10-30
JP2012-238516 2012-10-30

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CN (1) CN204303794U (fr)
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Cited By (3)

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JP2017045842A (ja) * 2015-08-26 2017-03-02 京セラ株式会社 半導体素子収納用パッケージおよび半導体装置
WO2017038582A1 (fr) * 2015-08-29 2017-03-09 京セラ株式会社 Boîtier permettant de loger un élément semi-conducteur, et dispositif à semi-conducteur
EP4191657A4 (fr) * 2020-08-03 2024-05-01 Nippon Telegraph & Telephone Emballage et son procédé de fabrication

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US11362484B2 (en) * 2017-09-19 2022-06-14 Kyocera Corporation Light-emitting-element housing member, array member, and light emitting device
JP7050045B2 (ja) 2019-12-27 2022-04-07 日亜化学工業株式会社 パッケージ、発光装置、およびレーザ装置
KR102648997B1 (ko) * 2022-05-03 2024-03-18 (주)코스텍시스 가이드 타입 플랜지 패키지 및 가이드 타입 플랜지 패키지를 제조하기 위한 방법

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JP2005114199A (ja) * 2003-10-03 2005-04-28 Toyo Radiator Co Ltd 熱交換器のヘッダおよびその製造方法
JP2012094627A (ja) * 2010-10-26 2012-05-17 Kyocera Corp 素子収納用パッケージ、およびこれを備えた電子装置

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017045842A (ja) * 2015-08-26 2017-03-02 京セラ株式会社 半導体素子収納用パッケージおよび半導体装置
WO2017038582A1 (fr) * 2015-08-29 2017-03-09 京セラ株式会社 Boîtier permettant de loger un élément semi-conducteur, et dispositif à semi-conducteur
JPWO2017038582A1 (ja) * 2015-08-29 2018-04-26 京セラ株式会社 半導体素子収納用パッケージおよび半導体装置
EP4191657A4 (fr) * 2020-08-03 2024-05-01 Nippon Telegraph & Telephone Emballage et son procédé de fabrication

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JP6139549B2 (ja) 2017-05-31
CN204303794U (zh) 2015-04-29
JPWO2014069432A1 (ja) 2016-09-08
JP6329238B2 (ja) 2018-05-23
JP2017085142A (ja) 2017-05-18

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