WO2014038488A1 - プリント配線板の製造方法及びプリント配線板 - Google Patents

プリント配線板の製造方法及びプリント配線板 Download PDF

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Publication number
WO2014038488A1
WO2014038488A1 PCT/JP2013/073388 JP2013073388W WO2014038488A1 WO 2014038488 A1 WO2014038488 A1 WO 2014038488A1 JP 2013073388 W JP2013073388 W JP 2013073388W WO 2014038488 A1 WO2014038488 A1 WO 2014038488A1
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Prior art keywords
layer
foil
metal
carrier foil
double
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PCT/JP2013/073388
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English (en)
French (fr)
Japanese (ja)
Inventor
吉川　和広
裕昭 津吉
歩 立岡
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三井金属鉱業株式会社
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Application filed by 三井金属鉱業株式会社 filed Critical 三井金属鉱業株式会社
Priority to KR1020187027396A priority Critical patent/KR102046738B1/ko
Priority to KR1020157005383A priority patent/KR102090353B1/ko
Priority to CN201380040227.2A priority patent/CN104737631B/zh
Publication of WO2014038488A1 publication Critical patent/WO2014038488A1/ja

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
    • H05K3/427—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern initial plating of through-holes in metal-clad substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/115—Via connections; Lands around holes or via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0094—Filling or covering plated through-holes or blind plated vias, e.g. for masking or for mechanical reinforcement
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0271—Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0548—Masks
    • H05K2203/0554—Metal used as mask for etching vias, e.g. by laser ablation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
    • H05K3/0032—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material
    • H05K3/0035—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material of blind holes, i.e. having a metal layer at the bottom
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
    • H05K3/0032—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material
    • H05K3/0038—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material combined with laser drilling through a metal layer

Definitions

  • the present invention relates to a method of manufacturing a printed wiring board using a double-sided metal-clad laminate having metal foil layers on both sides of an insulating layer, and connecting both metal foil layers with bottomed via holes, and the printed wiring board.
  • printed wiring boards have been manufactured using a double-sided metal-clad laminate in which metal foils are bonded to both sides of an insulating layer.
  • a wiring circuit is formed on the metal foil provided on both surfaces of the insulating layer by etching or the like. These two layers are connected to each other through bottomed via holes or through holes.
  • a non-through hole is formed by laser processing or the like through the metal foil layer and the insulating layer on one side and with the metal foil layer on the other side as the bottom. To do.
  • the laser is directly irradiated to the metal foil layer on the other side, holes may be formed in the metal foil layer. For this reason, it is difficult to form a bottomed via hole with a high yield.
  • Patent Document 1 a protective metal plate is bonded to the metal foil layer on the other side, and the protective metal plate is removed after the bottomed via hole is formed.
  • Patent Document 1 by adopting this method, heat can be diffused by the protective metal plate even when the carbon dioxide laser is directly applied to the metal foil layer on the other surface side. Therefore, even when using a double-sided metal-clad laminate in which a thin metal foil with a thickness of 3 ⁇ m to 5 ⁇ m is laminated on both sides of the insulating layer, no holes are formed in the metal foil layer on the other side, improving the yield. It can be made to.
  • the insulating layer is thin (for example, 200 ⁇ m or less), so-called warpage is likely to occur. If warpage occurs in the double-sided metal-clad laminate, when forming multiple bottomed via holes in the surface, the hole diameter and hole shape will vary, so even if a protective metal plate is provided on the other side, the yield will be reversed. May fall.
  • the present invention provides for the warpage of the double-sided metal-clad laminate and the variation in hole diameter and hole shape even when the metal foil layers provided on both sides of the thin insulating layer are interconnected by bottomed via holes. It is an object of the present invention to provide a printed wiring board manufacturing method and a printed wiring board capable of achieving good interlayer connection while suppressing the above.
  • the present inventors have achieved the above-mentioned problems by employing the following printed wiring board manufacturing method and the printed wiring board obtained by the manufacturing method.
  • the method for producing a printed wiring board according to the present invention comprises a double-sided metal-clad laminate comprising a metal foil layer and a carrier foil having a thickness of 15 ⁇ m or less in order from the insulating layer side on both sides of an insulating layer having a thickness of 200 ⁇ m or less.
  • the body is irradiated with laser on the surface of the carrier foil on one side, and a via hole forming step for forming a bottomed via hole with the metal foil layer on the other side as a bottom, and after forming the bottomed via hole, A carrier foil peeling step of peeling each carrier foil from the surface of each metal foil layer.
  • a black oxidation treatment step of performing black oxidation treatment on at least the surface of the carrier foil on one side before the via hole forming step it is preferable to include a black oxidation treatment step of performing black oxidation treatment on at least the surface of the carrier foil on one side before the via hole forming step.
  • the thickness of the metal foil layer is preferably 7 ⁇ m or less.
  • the double-sided metal-clad laminate includes a bonding interface layer between the carrier foil and the metal foil layer.
  • the bonding interface layer is preferably an organic bonding interface layer formed of an organic agent.
  • an interlayer connection for conducting electrical connection between the metal foil layer on one side and the metal foil layer on the other side between the via hole forming step and the carrier foil peeling step is preferable to provide a plating process for applying a plating treatment for the inside of the bottomed via hole.
  • the printed wiring board according to the present invention is obtained by the printed wiring board manufacturing method described above.
  • the double-sided metal-clad laminate provided with a metal foil layer and a carrier foil having a thickness of 15 ⁇ m or less in order from the insulating layer side on both sides of the insulating layer, A method of peeling the carrier foil in the carrier foil peeling process by irradiating the surface of the carrier foil on one side with a laser to form a bottomed via hole with the metal foil layer on the other side as the bottom.
  • the carrier foil on one side is peeled to form the via hole.
  • the thickness of the carrier foil provided on both sides can be increased to increase the rigidity of the double-sided metal-clad laminate.
  • a bottomed via hole can be formed in a flat double-sided metal-clad laminate without warping, so a plurality of bottomed via holes are formed in the plane of the double-sided metal-clad laminate. Even in this case, it is possible to prevent variations in the hole diameter and hole shape. Furthermore, since the splash deposited around the hole by laser irradiation can be peeled together with the carrier foil in the carrier foil peeling step, the circumference of the hole can be made flat.
  • the method for manufacturing a printed wiring board according to the present invention includes a double-sided metal-clad laminate in which a metal foil layer 12 and a carrier foil 13 having a thickness of 15 ⁇ m or less are provided on both sides of an insulating layer 11 in order from the insulating layer 11 side. 10 (see FIG. 1 (a)), a bottomed via having a bottom 21 on the metal foil layer 12 (12b) on the other side is irradiated with laser on the surface of the carrier foil 13 (13a) on one side.
  • a via hole forming step for forming the holes 20 see FIG.
  • FIG. 1 is a schematic diagram for explaining each process, and the thickness of each layer is different from the actual ratio of the layer thickness.
  • the surface treatment layers roughening treatment layer, black oxidation treatment layer, etc.
  • Double-sided metal-clad laminate 10 A manufacturing process of double-sided metal-clad laminate 10 will be described. In the manufacturing process, the double-sided metal-clad laminate 10 used in the via hole forming process is manufactured.
  • the double-sided metal-clad laminate 10 refers to a laminate in which metal foil layers 12 are laminated on both sides of the insulating layer 11, and in particular, the double-sided metal-clad laminate 10 used in the via hole forming step is the metal foil layer 12.
  • the layer structure of the double-sided metal-clad laminate 10 manufactured in the manufacturing process will be described.
  • the insulating layer 11 is not particularly limited as long as it is a layer made of an insulating material that satisfies the insulating characteristics required for the printed wiring board.
  • the insulating layer 11 is made by impregnating paper or glass cloth with an insulating resin (epoxy resin, cyanate resin, bismaleimide triazine resin (BT resin), polyphenylene ether resin, phenol resin, or the like).
  • an insulating resin epoxy resin, cyanate resin, bismaleimide triazine resin (BT resin), polyphenylene ether resin, phenol resin, or the like.
  • It may be an insulating resin base material such as a prepreg in which a required number of sheets are stacked, or may be an insulating resin layer made of an insulating resin such as an epoxy resin, a polyimide resin or a polyester resin, and is not particularly limited.
  • the insulating resin layer may contain filler particles made of various inorganic particles such as silica and alumina from the
  • the thickness of the insulating layer 11 is 200 ⁇ m or less. Even if the thickness of the insulating layer 11 exceeds 200 ⁇ m, the method according to the present invention can be applied. However, in that case, since the thickness of the double-sided metal-clad laminate 10 is large and warpage of the double-sided metal-clad laminate 10 is less likely to occur, the necessity of applying the method according to the present invention is reduced. In other words, the method according to the present invention can be preferably applied when manufacturing a thin printed wiring board having a thickness of the insulating layer 11 of 200 ⁇ m or less.
  • the thickness of the insulating layer 11 is preferably 100 ⁇ m or less, and more preferably 60 ⁇ m or less, in order to reduce the thickness of the printed wiring board. If the method according to the present invention is adopted. Even when a double-sided printed wiring board having an insulating layer 11 of 60 ⁇ m or less is manufactured, the double-sided metal-clad laminate 10 can be prevented from warping during the manufacturing process.
  • the metal foil layer 12 is not particularly limited as long as it is a layer made of conductive metal foil, and various metal foils such as copper foil, aluminum foil, nickel foil, cobalt foil, gold foil, platinum foil, or the like It can be set as the layer which consists of these alloy foils. Any of these various metal foils can be suitably used, but it is preferable to use a copper foil, an aluminum foil, a nickel foil, or an alloy foil thereof from the viewpoint of easy availability and low cost. . Furthermore, a copper foil or a copper alloy foil can be suitably used because it has a low electrical resistivity and is excellent in workability during circuit formation by etching or the like.
  • the metal foil constituting the metal foil layer 12 may be a rolled foil or an electrolytic foil, but is more preferably an electrolytic foil. If it is electrolytic foil, it can obtain by depositing a metal so that it may become predetermined thickness on the surface of carrier foil 13. FIG. For this reason, it is because it becomes easy to manufacture the double-sided metal-clad laminate 10 provided with the carrier foil 13 on both sides by laminating the metal foil deposited on the surface of the carrier foil 13 to the insulating layer 11.
  • the thickness of the metal foil layer 12 is preferably 7 ⁇ m or less. When the thickness of the metal foil layer 12 is 7 ⁇ m or less, a high-definition circuit with a narrow circuit pitch can be formed with a better etching factor. Further, in order to configure such a thin metal foil layer 12, a metal foil with a carrier foil provided with a carrier foil 13 provided to be peelable from the metal foil is often used. When applied, it is not necessary to prepare a protective metal plate separately from the carrier foil 13, which is preferable from the viewpoint of resource conservation.
  • the surface of the metal foil layer 12 may be roughened at the interface between the metal foil layer 12 and the insulating layer 11.
  • the metal foil layer 12 and the insulating layer 11 can be satisfactorily adhered to each other by attaching an insulating resin base material or the like constituting the insulating layer 11 to the metal foil layer 12 that has been subjected to the roughening treatment.
  • it is preferable that the surface of the metal foil layer 12 is not roughened.
  • a primer resin layer is provided on the surface of the metal foil layer 12, and the primer resin layer is interposed through the primer resin layer. More preferably, the metal foil layer 12 is bonded to the insulating layer 11.
  • Carrier foil 13 is a foil used as a support for supporting the metal foil in order to improve the handleability of the thin metal foil.
  • a metal foil with a carrier foil is used from the viewpoint of easy manufacturing.
  • the carrier foil 13 is used for the metal foil.
  • a so-called peelable type metal foil with a carrier foil, which is provided so as to be peelable by work, can be preferably used.
  • the material constituting the carrier foil 13 is not particularly limited.
  • a copper foil, a copper alloy foil, an aluminum foil, a composite metal foil in which a metal plating layer such as copper or zinc is provided on the surface of the aluminum foil, a stainless steel foil, etc. can be used.
  • a copper foil can be preferably used as the carrier foil 13.
  • the carrier foil 13 made of copper foil is preferable from the viewpoint of resource conservation because it can be easily reused as a copper raw material after the carrier foil 13 is peeled from the metal foil layer 12.
  • the thickness of the carrier foil 13 is 15 ⁇ m or less. In particular, if the thickness of the carrier foil 13 on the laser irradiation side (one side) becomes too thick, it is necessary to increase the laser output or the number of shots when forming the via hole, making it difficult to form the via hole. This is not preferable. From the viewpoint of resource conservation, the carrier foil 13 is preferably thin. From this viewpoint, the thickness of the carrier foil 13 is more preferably 13 ⁇ m or less.
  • the thickness of the carrier foil 13 is preferably 5 ⁇ m or more, and more preferably 7 ⁇ m or more.
  • the thickness of the carrier foil 13 is less than 5 ⁇ m, it becomes difficult to perform the original function of the carrier foil 13 for supporting an extremely thin metal foil and improving the handleability of the metal foil.
  • the carrier foil 13 provided on the laser irradiation side is preferably thinner, and the carrier foil 13 provided on the other side is preferably thicker.
  • the difference between the thickness of the carrier foil 13 provided on one side and the thickness of the carrier foil 13 provided on the other side is 2 ⁇ m or less. Is preferably 1 ⁇ m or less, and most preferably both thicknesses are equal.
  • warping of the double-sided metal-clad laminate itself can be prevented by reducing the difference in thickness between the carrier foils 13 or by making the thicknesses of the two carrier foils 13 equal.
  • each carrier foil 13 may be 15 ⁇ m or less when the laser is irradiated in the via hole forming step.
  • the carrier foil 13 temporarily exceeding 15 ⁇ m
  • the metal foil layer 12 may be provided. That is, in the metal foil with carrier foil itself used when the double-sided metal-clad laminate 10 is manufactured, the thickness of the carrier foil may exceed 15 ⁇ m.
  • the metal foil with a carrier foil having a carrier foil with a thickness of more than 15 ⁇ m is laminated to the insulating layer 11
  • the metal foil with a carrier foil is then applied before the via hole forming step (before black oxidation treatment when performing black oxidation treatment). What is necessary is just to make thickness of the carrier foil 13 thin by half etching etc. so that thickness may be set to 15 micrometers or less.
  • the carrier foil 13 is bonded between the carrier foil 13 and the metal foil layer 12 so as to be peelable from the metal foil layer 12. It is preferable to provide a bonding interface layer. However, in FIG. 1, the display of the bonding interface layer is omitted.
  • the bonding interface layer is required to allow the carrier foil 13 to be easily peeled off from the metal foil layer 12 by hand, and to have an appropriate adhesion strength until it is peeled off.
  • the bonding interface layer is not particularly limited as long as it can adhere the carrier foil 13 and the metal foil layer 12 with the above-described appropriate adhesion strength.
  • the nitrogen-containing compound and the sulfur-containing layer can be used.
  • An organic bonding interface layer formed with an organic agent such as a compound or carboxylic acid is preferred.
  • nitrogen-containing compounds examples include orthotriazoles, aminotriazoles, imidazoles, their salts, and derivatives.
  • orthotriazoles such as carboxybenzotriazole, aminotriazoles such as 3-amino-1H-1,2,4-triazole, and triazole derivatives N ′, N′-bis (benzotriazolylmethyl) urea Can be mentioned. Any one or more of these can be used to form an organic bonding interface layer made of a nitrogen-containing compound.
  • sulfur-containing compound that forms the organic bonding interface layer examples include thiazole, mercaptobenzothiazole, dibenzoazyl disulfide, mercaptobenzothiazole cyclohexylamine salt, mercaptobenzothiazole dicyclohexylamine salt, thiocyanuric acid and 2-benzimidazolethiol. Can be mentioned. In the case of forming an organic bonding interface layer using a sulfur-containing compound, it is particularly preferable to use mercaptobenzothiazole and thiocyanuric acid among these.
  • carboxylic acids that form an organic bonding interface examples include high molecular weight carboxylic acids. In particular, mention may be made of monocarboxylic acids. In particular, when carboxylic acids are used, it is preferable to use fatty acids that are long-chain hydrocarbon monocarboxylic acids.
  • the fatty acid may be a saturated fatty acid, but it is particularly preferable to use an unsaturated fatty acid such as oleic acid or linolenic acid.
  • the bonding interface layer is not limited to the organic bonding interface layer formed using the organic agent, but may be an inorganic bonding interface layer formed using an inorganic material such as a metal or metal oxide.
  • an inorganic material such as a metal or metal oxide.
  • the metal or metal oxide include chromium, nickel, molybdenum, tantalum, vanadium, tungsten, cobalt, and oxides thereof.
  • the organic peeling interface layer is preferably used because the physical peeling characteristics of the carrier foil 13 are more stable.
  • the thickness of the bonding interface layer is preferably 100 nm or less, and more preferably 50 nm or less.
  • a so-called peelable metal foil with a carrier foil is generally formed by providing a bonding interface layer on the surface of the carrier foil 13 and depositing metal on the bonding interface layer by a technique such as electrolysis. At this time, if the thickness of the bonding interface layer exceeds 100 nm, particularly in the case of an organic bonding interface layer, it becomes difficult to form a metal foil on the bonding interface layer, and the carrier foil 13 and the metal foil are adhered to each other. Strength decreases. Therefore, the thickness of the bonding interface layer is preferably 100 nm or less.
  • the lower limit value of the thickness of the joint interface layer is not limited. However, when the thickness is less than 1 nm, it becomes difficult to form the bonding interface layer with a uniform thickness, and the thickness varies. For this reason, the thickness of the bonding interface layer is preferably 1 nm or more, and more preferably 2 nm or more.
  • a heat-resistant metal layer (not shown) may be provided between the carrier foil 13 and the bonding interface layer, or between the bonding interface layer and the metal foil layer 12. Then, the double-sided metal-clad laminate 10 is placed on both sides of the insulating layer 11 in order from the insulating layer 11 side, respectively, metal foil layer 12 / bonding interface layer / heat-resistant metal layer / carrier foil 13 or metal foil layer 12 / It is also preferable to use a laminate having a layer structure of a heat-resistant metal layer / bonding interface layer / carrier foil 13.
  • the production method is not particularly limited.
  • the insulating resin base material of the so-called B stage, or the insulating resin base material as the insulating layer 11 by laminating the metal foil side of the metal foil with carrier foil on both surfaces of the insulating resin layer, respectively,
  • the double-sided metal-clad laminate 10 in which the metal foil layer 12 and the carrier foil 13 are laminated in this order on both surfaces of the insulating resin layer can be obtained.
  • a metal foil with a resin layer or a metal foil with an adhesive layer provided with a carrier foil may be used as the metal foil with a carrier foil, and the specific lamination process is not limited at all.
  • black oxidation treatment process will be described.
  • a black oxidation treatment step of performing black oxidation treatment blackening treatment
  • blackening treatment blackening treatment
  • the carrier foil 13 is a foil made of a metal foil as described above. For this reason, when the surface of the carrier foil 13 is irradiated with laser light, the laser light is reflected, the initial absorption efficiency of the laser light is poor, and the formation speed of the via hole is slow. For this reason, it is preferable to perform black oxidation treatment (blackening treatment) on the surface of the carrier foil 13 before performing the via hole forming step.
  • the surface of the carrier foil 13 is roughened and blackened or browned. Thereby, the initial absorption efficiency of the laser beam on the surface of the carrier foil 13 can be improved, and the bottomed via hole 20 can be efficiently formed by laser processing in the via hole forming process which is the next process. It becomes possible.
  • the method of the black oxidation treatment is not particularly limited, and a method similar to the black oxidation treatment performed as a pretreatment for improving adhesiveness in the lamination process of the multilayer printed wiring board may be adopted. it can.
  • a black oxidation treatment solution By immersing the double-sided metal-clad laminate 10 having the carrier foil 13 on both sides in a black oxidation treatment solution for a certain time, a cuprous oxide film, a cupric oxide film, or a first oxide film is formed on the surface of the carrier foil 13.
  • a mixed film of copper and cupric oxide is formed.
  • a reduction treatment may be performed, and a reduction black oxidation treatment for reducing copper oxide to copper may be performed.
  • Via hole forming step In the via hole forming step, as described above, one side of the double-sided metal-clad laminate 10 in which the metal foil layer 12 having the carrier foil 13 having a thickness of 15 ⁇ m or less is provided on both sides of the insulating layer 11. The surface of the carrier foil 13 (13a) on the side is irradiated with laser to form a bottomed via hole 20 having the bottom side 21 as the metal foil layer 12 (12b) on the other side.
  • the hole diameter of the bottomed via hole 20 formed in the step is preferably 40 ⁇ m to 150 ⁇ m.
  • a wiring circuit having a higher wiring density is required when the hole diameter of the bottomed via hole 20 is smaller. Obtainable.
  • the type of laser used in the process is not particularly limited, and a carbon dioxide laser, an argon laser, an excimer laser, a YAG laser, or the like can be used. Further, the laser irradiation conditions can be appropriately set appropriately in consideration of the thickness of the double-sided metal-clad laminate 10 and the material of the insulating layer 11 and the like.
  • the metal foil layer 12 on the laser irradiation side is also provided with the carrier foil 13 and then the carrier foil 13 (13a on the single side with respect to the double-sided metal-clad laminate 10 is provided.
  • the carrier foil 13 is peeled in a carrier foil peeling step to be described later. The method is adopted.
  • the carrier foil 13 (13a) is provided not only on the surface of the metal foil layer 12 (12b) on the other surface side which becomes the bottom 21 but also on the surface of the metal foil layer 12 (12a) on the one surface side irradiated with the laser.
  • the thickness of the double-sided metal-clad laminate 10 excluding the thickness of the carrier foil 13
  • the rigidity of the double-sided metal-clad laminate 10 can be increased.
  • the bottomed via hole 20 can be formed in the flat double-sided metal-clad laminate 10 without warping, so that a plurality of bottomed via-holes are formed in the plane of the double-sided metal-clad laminate 10. Even when 20 is formed, it is possible to prevent variations in the hole diameter and hole shape. Moreover, since the splash deposited around the hole (20) by laser irradiation can be peeled off together with the carrier foil 13 in the carrier foil peeling step, the circumference of the hole can be made flat.
  • Plating step After forming the bottomed via hole, for the purpose of electrical connection between the metal foil layer 12 (12a) on one side and the metal foil layer 12 (12b) on the other side, an interlayer connection is provided in the bottomed via hole 20
  • the plating film 22 is preferably formed by performing the plating process. In the plating process, any metal may be deposited as long as electrical connection between the metal foil layer 12 (12a) on one side and the metal foil layer 12 (12b) on the other side can be achieved. In general, it is preferable to perform copper plating or copper alloy plating from the viewpoint of reliable connection reliability.
  • the residual resin in the bottomed via hole 20 is removed by desmear treatment or the like, and after performing electroless copper plating according to a conventional method, electrolytic copper plating is performed to provide a plating layer having a necessary thickness. It is formed in the bottom via hole 20.
  • electrolytic copper plating is performed to provide a plating layer having a necessary thickness. It is formed in the bottom via hole 20.
  • conformal plating in which the plating film 22 has a certain thickness may be performed, or the hole of the bottomed via hole 20 may be formed.
  • FIG. 1 illustrates a case where filling plating is performed on the bottomed via hole 20.
  • the plating step is an optional step, and the plating step is not necessarily performed as long as conduction between the metal foil layer 12 (12a) on one side and the metal foil layer 12 (12b) on the other side can be achieved. There is no need to provide it.
  • the bottomed via hole 20 may be filled with a conductive paste to achieve conduction between the metal foil layer 12 (12a) on one side and the metal foil layer 12 (12b) on the other side.
  • each carrier foil 13 provided on both surfaces of the double-sided metal-clad laminate 10 is peeled from the surface of each metal foil layer 12.
  • the splash deposited around the hole of the bottomed via hole 20 by the laser irradiation can be peeled off together with the carrier foil 13, the periphery of the hole can be flattened.
  • the said carrier foil peeling process is performed after the said plating process like this Embodiment, the plating film 22 formed on the carrier foil 13 with the carrier foil 13 can be peeled.
  • the plating film 22 in the bottomed via hole 20 remains, and the metal foil layer 12 (12a) on one side and the metal foil layer 12 (12b) on the other side Can be conducted.
  • a plating process for achieving interlayer conduction is performed.
  • the thickness of the conductor layer is increased by the amount of the plating film.
  • the plating deposition rate in the surface varies, and therefore the plating film thickness varies.
  • a carrier foil peeling step may be performed after the plating step as in the present embodiment from the viewpoint that a fine wiring circuit can be obtained with a good etching factor. preferable.
  • Wiring circuit forming step for example, a resist pattern corresponding to the wiring circuit to be formed is formed on the metal foil layer 12 on the double-sided metal-clad laminate 10 after the carrier foil 13 is peeled off.
  • a wiring circuit can be formed by a conventionally known method such as forming and etching.
  • the manufacturing method of the printed wiring board demonstrated above is one aspect
  • the carrier foil peeling step is performed after the above-described via hole forming step, there is no particular limitation on the order of performing other steps, the type of processing performed before and after these steps, and the production print Various treatments can be appropriately performed according to the electrical characteristics required of the wiring board. For example, as shown in FIG. 2, (b) a carrier foil peeling step may be performed after the via hole forming step, and then (c) a plating step may be performed. In this case, the plating film 22 can also be formed on the surface of the metal foil layer 12 (12a).
  • the thickness of the carrier foil 13 may be reduced by half etching or the like so as to be 15 ⁇ m or less, the present invention is not limited thereto, and the metal foil with carrier foil provided with the carrier foil of 15 ⁇ m or less is used as the insulating layer. Even in the case of bonding to 11, the thickness of the carrier foil 13 may be reduced by the same method so that the thickness of the carrier foil 13 becomes a desired thickness within the above range.
  • the printed wiring board according to the present invention is obtained by the above-described method for manufacturing a printed wiring board, and has a carrier foil 13 on both sides as shown in FIG. 1 (d) or FIG. 2 (c).
  • any structure can be used as long as the layer structure includes a three-layer structure obtained by peeling the carrier foil 13 (including a wiring pattern formed).
  • the layer structure includes a three-layer structure obtained by peeling the carrier foil 13 (including a wiring pattern formed).
  • it may be a double-sided printed wiring board, or a multilayer printed wiring board in which a build-up layer is further laminated on the double-sided metal-clad laminate 10 on which a wiring pattern is formed.
  • a copper foil with a carrier foil in which a copper foil (12) having a thickness of 3 ⁇ m is provided on a carrier copper foil (13) having a thickness of 12 ⁇ m through an organic bonding interface layer using carboxybenzotriazole.
  • the copper foil side of the copper foil with carrier foil was used as a laminating surface, and the surface was roughened.
  • the copper foil with a carrier foil is laminated
  • the double-sided copper clad laminate was cut into a size of 150 mm ⁇ 150 mm, and a black foil was applied to the surface of the carrier foil.
  • Comparative Example 1 As a sample of Comparative Example 1, a carrier foil is provided only on the other surface side in the same manner as in the example except that the carrier foil on the laser irradiation side was peeled off from the surface of the copper foil before the black oxidation treatment. A double-sided copper-clad laminate was obtained.
  • Comparative Example 2 As a sample of Comparative Example 2, a double-sided copper-clad laminate without a carrier foil was obtained in the same manner as in Example except that the carrier foil was peeled off from the surface of the copper foil on both sides before the black oxidation treatment. It was.
  • the amount of warpage during suction when each double-sided copper clad laminate obtained in this example and comparative example was placed on a laser irradiation stand was measured. Innumerable holes are formed in the laser irradiation table, and the sample is sucked through the holes so as to be in close contact with the laser irradiation table. The value is smaller than the value measured on the observation table. For this reason, the amount of warping during suction was measured as follows using a CCD camera having an autofocus mechanism. First, it was set to 0 mm on the basis of the focus position when focusing on the center of the sample. Next, the CCD camera was moved to each of the four corners of the sample to determine the focus positions at the four corners. The difference in the height direction between each focus position at the four corners of the sample and the focus position at the center of the sample was determined, and this was used as the amount of warpage.
  • each double-sided copper clad laminate obtained in the above example a carbon dioxide laser manufactured by Mitsubishi Electric Corporation, from one side of each double-sided copper clad laminate, a beam diameter of 153 ⁇ m and a pulse width of 10 ⁇ s
  • the laser pulse energy is 18.5 mJ, and one shot of the laser pulse beam is irradiated, and then the pulse width is changed to 3 ⁇ s, 5 ⁇ s, and 7 ⁇ s with respect to the energy density of 2 MW / cm 2 , 3 MW / cm 2 , and 4 MW / cm 2 .
  • the laser pulse beam was 1 shot irradiated respectively, for subsequent energy density 2MW / cm 2, 3MW / cm 2, 4MW / cm 2, the pulse width 3 [mu] s, 5 .mu.s, by changing to 7 .mu.s, the top diameter 75.2 ⁇ m 121 via holes were formed, and the presence or absence of through holes with respect to the copper foil layer on the other surface side was observed to determine the through hole formation ratio (%).
  • the laser irradiation conditions differ between the example and the comparative example because the double-sided copper clad laminate of the example is provided with a carrier foil on the laser irradiation side surface, so that the carrier on the laser irradiation side surface This is because a bottomed via hole cannot be formed unless the laser output is made higher than that of the double-sided copper laminate of the comparative example in which no foil is provided.
  • Warpage amount Table 1 shows the warpage amounts at the four corners of the double-sided copper-clad laminates of this example, comparative example 1 and comparative example 2.
  • Table 1 shows the double-sided copper-clad laminate of Example 1 and Comparative Example 2 did not warp, whereas the double-sided copper-clad laminate of Comparative Example 1 provided with carrier foil only on the other side It was confirmed that warping occurred. This is presumably because the stress balance on both sides of the insulating layer was lost by peeling only the carrier foil on one side from the double-sided copper clad laminate having carrier foils on both sides.
  • the through hole formation ratio of the double-sided copper-clad laminate of this example is slightly higher than that of the double-sided copper-clad laminate of Comparative Example 1.
  • the laser irradiation conditions adopted when forming the bottomed via hole for the double-sided copper-clad laminate of this example are the same as when forming the bottomed via-hole for the double-sided copper-clad laminate of the comparative example.
  • the laser output is higher than the laser irradiation conditions employed. For this reason, although both cannot be compared simply, it is thought that a through-hole formation ratio falls by examining the laser irradiation conditions with respect to the double-sided copper clad laminated body of an Example. Therefore, it is considered that the through hole formation ratio can be effectively reduced by providing the carrier foil on the other surface side regardless of the presence or absence of the carrier foil on the laser irradiation side surface.
  • Variation in hole diameter and hole shape Table 3 shows the hole diameters of the bottomed via holes formed at the four corners and the center of the double-sided copper clad laminate obtained in this example and Comparative Example 1, respectively.
  • Table 3 the variation in the hole diameter of the bottomed via hole formed in the double-sided copper clad laminate obtained in this example was confirmed to be small compared to the double-sided copper clad laminate obtained in Comparative Example 1. It was. Moreover, it was confirmed that the difference between the hole diameter of the bottomed via hole formed at the center of the double-sided copper clad laminate and the hole diameter of the bottomed via hole formed at each of the four corners increases as the warp amount increases.
  • FIG. 3 is a surface observation photograph of each bottomed via hole formed in the double-sided copper clad laminate of Comparative Example 1.
  • the top shape of the bottomed via hole formed in the center part of the double-sided copper-clad laminate with zero warpage is substantially circular, while the warpage is large ( It can be confirmed that the top shapes of the bottomed via holes formed in the upper left (a) and lower left (d)) are distorted.
  • the double-sided copper-clad laminate of this example has a small warp, and the bottomed via hole formed at the four corners also has a substantially circular shape with little variation in hole diameter and hole shape, and the hole shown in FIG. It was confirmed that the hole shape was almost the same as the shape.
  • FIG. 4 is a surface observation photograph of the double-sided copper clad laminate of this example after the carrier foil was peeled off after the bottomed via hole was formed.
  • FIG. 5 is a surface observation photograph of the double-sided copper-clad laminate of Comparative Example 1 after forming the bottomed via hole.
  • splash is deposited around the hole by laser irradiation, whereas the double-sided copper clad laminate of this example. In the body, it was confirmed that the splash accumulated around the hole can be peeled off together with the carrier foil, so that the periphery of the hole becomes flat.
  • each layer The difference in stress generated on one side and the other side can be reduced by the difference in the linear expansion coefficient. For this reason, even when the thickness of the double-sided metal-clad laminate (excluding the thickness of the carrier foil) is thin, it is possible to prevent the double-sided metal-clad laminate from warping. Moreover, the thickness increases by the carrier foil provided on both surfaces, and the rigidity of the double-sided metal-clad laminate can be increased.
  • a bottomed via hole can be formed in a flat double-sided metal-clad laminate without warping, so a plurality of bottomed via holes are formed in the plane of the double-sided metal-clad laminate. Even in this case, it is possible to prevent variations in the hole diameter and hole shape. Further, it is possible to prevent the double-sided metal-clad laminate from being warped when the bottomed via hole is formed due to the influence of stress or heat generated during laser irradiation. Furthermore, since the splash deposited around the hole by laser irradiation can be peeled together with the carrier foil in the carrier foil peeling step, the circumference of the hole can be made flat. Therefore, the present invention can be suitably used when manufacturing a thin double-sided printed wiring board.
  • Double-sided copper clad laminate (with double-sided carrier) 11 ... Insulating layer 12 .
  • Metal foil layer 12a Metal foil layer on one side 12b .
  • Metal foil layer on the other side 13 ... ⁇ Carrier foil 13a ⁇ ⁇ One side carrier foil 13b ⁇ ⁇ Other side carrier foil 20 ... Bottomed via hole 21 ... Bottom 22 ... Plating film

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Laminated Bodies (AREA)
PCT/JP2013/073388 2012-09-05 2013-08-30 プリント配線板の製造方法及びプリント配線板 WO2014038488A1 (ja)

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KR1020187027396A KR102046738B1 (ko) 2012-09-05 2013-08-30 프린트 배선판의 제조 방법 및 프린트 배선판
KR1020157005383A KR102090353B1 (ko) 2012-09-05 2013-08-30 프린트 배선판의 제조 방법 및 프린트 배선판
CN201380040227.2A CN104737631B (zh) 2012-09-05 2013-08-30 印刷布线板的制造方法及印刷布线板

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CN106103082B (zh) * 2014-03-31 2019-04-26 三井金属矿业株式会社 带有载体箔的铜箔、覆铜层压板及印刷线路板
KR102043689B1 (ko) * 2018-05-08 2019-11-12 충남대학교산학협력단 바디 일체형 배선 제조장치 및 이를 이용한 제조방법
WO2022137443A1 (ja) * 2020-12-24 2022-06-30 三菱電機株式会社 プリント配線板の製造方法およびレーザ加工機

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CN104737631B (zh) 2018-05-08
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KR102090353B1 (ko) 2020-03-17
TW201436682A (zh) 2014-09-16
KR20180108880A (ko) 2018-10-04
TWI573508B (zh) 2017-03-01
KR102046738B1 (ko) 2019-11-19

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