WO2014038488A1 - Printed wiring board production method and printed wiring board - Google Patents
Printed wiring board production method and printed wiring board Download PDFInfo
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- WO2014038488A1 WO2014038488A1 PCT/JP2013/073388 JP2013073388W WO2014038488A1 WO 2014038488 A1 WO2014038488 A1 WO 2014038488A1 JP 2013073388 W JP2013073388 W JP 2013073388W WO 2014038488 A1 WO2014038488 A1 WO 2014038488A1
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
- H05K3/427—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern initial plating of through-holes in metal-clad substrates
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/115—Via connections; Lands around holes or via connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0094—Filling or covering plated through-holes or blind plated vias, e.g. for masking or for mechanical reinforcement
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0271—Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/05—Patterning and lithography; Masks; Details of resist
- H05K2203/0548—Masks
- H05K2203/0554—Metal used as mask for etching vias, e.g. by laser ablation
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0017—Etching of the substrate by chemical or physical means
- H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
- H05K3/0032—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material
- H05K3/0035—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material of blind holes, i.e. having a metal layer at the bottom
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0017—Etching of the substrate by chemical or physical means
- H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
- H05K3/0032—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material
- H05K3/0038—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material combined with laser drilling through a metal layer
Definitions
- the present invention relates to a method of manufacturing a printed wiring board using a double-sided metal-clad laminate having metal foil layers on both sides of an insulating layer, and connecting both metal foil layers with bottomed via holes, and the printed wiring board.
- printed wiring boards have been manufactured using a double-sided metal-clad laminate in which metal foils are bonded to both sides of an insulating layer.
- a wiring circuit is formed on the metal foil provided on both surfaces of the insulating layer by etching or the like. These two layers are connected to each other through bottomed via holes or through holes.
- a non-through hole is formed by laser processing or the like through the metal foil layer and the insulating layer on one side and with the metal foil layer on the other side as the bottom. To do.
- the laser is directly irradiated to the metal foil layer on the other side, holes may be formed in the metal foil layer. For this reason, it is difficult to form a bottomed via hole with a high yield.
- Patent Document 1 a protective metal plate is bonded to the metal foil layer on the other side, and the protective metal plate is removed after the bottomed via hole is formed.
- Patent Document 1 by adopting this method, heat can be diffused by the protective metal plate even when the carbon dioxide laser is directly applied to the metal foil layer on the other surface side. Therefore, even when using a double-sided metal-clad laminate in which a thin metal foil with a thickness of 3 ⁇ m to 5 ⁇ m is laminated on both sides of the insulating layer, no holes are formed in the metal foil layer on the other side, improving the yield. It can be made to.
- the insulating layer is thin (for example, 200 ⁇ m or less), so-called warpage is likely to occur. If warpage occurs in the double-sided metal-clad laminate, when forming multiple bottomed via holes in the surface, the hole diameter and hole shape will vary, so even if a protective metal plate is provided on the other side, the yield will be reversed. May fall.
- the present invention provides for the warpage of the double-sided metal-clad laminate and the variation in hole diameter and hole shape even when the metal foil layers provided on both sides of the thin insulating layer are interconnected by bottomed via holes. It is an object of the present invention to provide a printed wiring board manufacturing method and a printed wiring board capable of achieving good interlayer connection while suppressing the above.
- the present inventors have achieved the above-mentioned problems by employing the following printed wiring board manufacturing method and the printed wiring board obtained by the manufacturing method.
- the method for producing a printed wiring board according to the present invention comprises a double-sided metal-clad laminate comprising a metal foil layer and a carrier foil having a thickness of 15 ⁇ m or less in order from the insulating layer side on both sides of an insulating layer having a thickness of 200 ⁇ m or less.
- the body is irradiated with laser on the surface of the carrier foil on one side, and a via hole forming step for forming a bottomed via hole with the metal foil layer on the other side as a bottom, and after forming the bottomed via hole, A carrier foil peeling step of peeling each carrier foil from the surface of each metal foil layer.
- a black oxidation treatment step of performing black oxidation treatment on at least the surface of the carrier foil on one side before the via hole forming step it is preferable to include a black oxidation treatment step of performing black oxidation treatment on at least the surface of the carrier foil on one side before the via hole forming step.
- the thickness of the metal foil layer is preferably 7 ⁇ m or less.
- the double-sided metal-clad laminate includes a bonding interface layer between the carrier foil and the metal foil layer.
- the bonding interface layer is preferably an organic bonding interface layer formed of an organic agent.
- an interlayer connection for conducting electrical connection between the metal foil layer on one side and the metal foil layer on the other side between the via hole forming step and the carrier foil peeling step is preferable to provide a plating process for applying a plating treatment for the inside of the bottomed via hole.
- the printed wiring board according to the present invention is obtained by the printed wiring board manufacturing method described above.
- the double-sided metal-clad laminate provided with a metal foil layer and a carrier foil having a thickness of 15 ⁇ m or less in order from the insulating layer side on both sides of the insulating layer, A method of peeling the carrier foil in the carrier foil peeling process by irradiating the surface of the carrier foil on one side with a laser to form a bottomed via hole with the metal foil layer on the other side as the bottom.
- the carrier foil on one side is peeled to form the via hole.
- the thickness of the carrier foil provided on both sides can be increased to increase the rigidity of the double-sided metal-clad laminate.
- a bottomed via hole can be formed in a flat double-sided metal-clad laminate without warping, so a plurality of bottomed via holes are formed in the plane of the double-sided metal-clad laminate. Even in this case, it is possible to prevent variations in the hole diameter and hole shape. Furthermore, since the splash deposited around the hole by laser irradiation can be peeled together with the carrier foil in the carrier foil peeling step, the circumference of the hole can be made flat.
- the method for manufacturing a printed wiring board according to the present invention includes a double-sided metal-clad laminate in which a metal foil layer 12 and a carrier foil 13 having a thickness of 15 ⁇ m or less are provided on both sides of an insulating layer 11 in order from the insulating layer 11 side. 10 (see FIG. 1 (a)), a bottomed via having a bottom 21 on the metal foil layer 12 (12b) on the other side is irradiated with laser on the surface of the carrier foil 13 (13a) on one side.
- a via hole forming step for forming the holes 20 see FIG.
- FIG. 1 is a schematic diagram for explaining each process, and the thickness of each layer is different from the actual ratio of the layer thickness.
- the surface treatment layers roughening treatment layer, black oxidation treatment layer, etc.
- Double-sided metal-clad laminate 10 A manufacturing process of double-sided metal-clad laminate 10 will be described. In the manufacturing process, the double-sided metal-clad laminate 10 used in the via hole forming process is manufactured.
- the double-sided metal-clad laminate 10 refers to a laminate in which metal foil layers 12 are laminated on both sides of the insulating layer 11, and in particular, the double-sided metal-clad laminate 10 used in the via hole forming step is the metal foil layer 12.
- the layer structure of the double-sided metal-clad laminate 10 manufactured in the manufacturing process will be described.
- the insulating layer 11 is not particularly limited as long as it is a layer made of an insulating material that satisfies the insulating characteristics required for the printed wiring board.
- the insulating layer 11 is made by impregnating paper or glass cloth with an insulating resin (epoxy resin, cyanate resin, bismaleimide triazine resin (BT resin), polyphenylene ether resin, phenol resin, or the like).
- an insulating resin epoxy resin, cyanate resin, bismaleimide triazine resin (BT resin), polyphenylene ether resin, phenol resin, or the like.
- It may be an insulating resin base material such as a prepreg in which a required number of sheets are stacked, or may be an insulating resin layer made of an insulating resin such as an epoxy resin, a polyimide resin or a polyester resin, and is not particularly limited.
- the insulating resin layer may contain filler particles made of various inorganic particles such as silica and alumina from the
- the thickness of the insulating layer 11 is 200 ⁇ m or less. Even if the thickness of the insulating layer 11 exceeds 200 ⁇ m, the method according to the present invention can be applied. However, in that case, since the thickness of the double-sided metal-clad laminate 10 is large and warpage of the double-sided metal-clad laminate 10 is less likely to occur, the necessity of applying the method according to the present invention is reduced. In other words, the method according to the present invention can be preferably applied when manufacturing a thin printed wiring board having a thickness of the insulating layer 11 of 200 ⁇ m or less.
- the thickness of the insulating layer 11 is preferably 100 ⁇ m or less, and more preferably 60 ⁇ m or less, in order to reduce the thickness of the printed wiring board. If the method according to the present invention is adopted. Even when a double-sided printed wiring board having an insulating layer 11 of 60 ⁇ m or less is manufactured, the double-sided metal-clad laminate 10 can be prevented from warping during the manufacturing process.
- the metal foil layer 12 is not particularly limited as long as it is a layer made of conductive metal foil, and various metal foils such as copper foil, aluminum foil, nickel foil, cobalt foil, gold foil, platinum foil, or the like It can be set as the layer which consists of these alloy foils. Any of these various metal foils can be suitably used, but it is preferable to use a copper foil, an aluminum foil, a nickel foil, or an alloy foil thereof from the viewpoint of easy availability and low cost. . Furthermore, a copper foil or a copper alloy foil can be suitably used because it has a low electrical resistivity and is excellent in workability during circuit formation by etching or the like.
- the metal foil constituting the metal foil layer 12 may be a rolled foil or an electrolytic foil, but is more preferably an electrolytic foil. If it is electrolytic foil, it can obtain by depositing a metal so that it may become predetermined thickness on the surface of carrier foil 13. FIG. For this reason, it is because it becomes easy to manufacture the double-sided metal-clad laminate 10 provided with the carrier foil 13 on both sides by laminating the metal foil deposited on the surface of the carrier foil 13 to the insulating layer 11.
- the thickness of the metal foil layer 12 is preferably 7 ⁇ m or less. When the thickness of the metal foil layer 12 is 7 ⁇ m or less, a high-definition circuit with a narrow circuit pitch can be formed with a better etching factor. Further, in order to configure such a thin metal foil layer 12, a metal foil with a carrier foil provided with a carrier foil 13 provided to be peelable from the metal foil is often used. When applied, it is not necessary to prepare a protective metal plate separately from the carrier foil 13, which is preferable from the viewpoint of resource conservation.
- the surface of the metal foil layer 12 may be roughened at the interface between the metal foil layer 12 and the insulating layer 11.
- the metal foil layer 12 and the insulating layer 11 can be satisfactorily adhered to each other by attaching an insulating resin base material or the like constituting the insulating layer 11 to the metal foil layer 12 that has been subjected to the roughening treatment.
- it is preferable that the surface of the metal foil layer 12 is not roughened.
- a primer resin layer is provided on the surface of the metal foil layer 12, and the primer resin layer is interposed through the primer resin layer. More preferably, the metal foil layer 12 is bonded to the insulating layer 11.
- Carrier foil 13 is a foil used as a support for supporting the metal foil in order to improve the handleability of the thin metal foil.
- a metal foil with a carrier foil is used from the viewpoint of easy manufacturing.
- the carrier foil 13 is used for the metal foil.
- a so-called peelable type metal foil with a carrier foil, which is provided so as to be peelable by work, can be preferably used.
- the material constituting the carrier foil 13 is not particularly limited.
- a copper foil, a copper alloy foil, an aluminum foil, a composite metal foil in which a metal plating layer such as copper or zinc is provided on the surface of the aluminum foil, a stainless steel foil, etc. can be used.
- a copper foil can be preferably used as the carrier foil 13.
- the carrier foil 13 made of copper foil is preferable from the viewpoint of resource conservation because it can be easily reused as a copper raw material after the carrier foil 13 is peeled from the metal foil layer 12.
- the thickness of the carrier foil 13 is 15 ⁇ m or less. In particular, if the thickness of the carrier foil 13 on the laser irradiation side (one side) becomes too thick, it is necessary to increase the laser output or the number of shots when forming the via hole, making it difficult to form the via hole. This is not preferable. From the viewpoint of resource conservation, the carrier foil 13 is preferably thin. From this viewpoint, the thickness of the carrier foil 13 is more preferably 13 ⁇ m or less.
- the thickness of the carrier foil 13 is preferably 5 ⁇ m or more, and more preferably 7 ⁇ m or more.
- the thickness of the carrier foil 13 is less than 5 ⁇ m, it becomes difficult to perform the original function of the carrier foil 13 for supporting an extremely thin metal foil and improving the handleability of the metal foil.
- the carrier foil 13 provided on the laser irradiation side is preferably thinner, and the carrier foil 13 provided on the other side is preferably thicker.
- the difference between the thickness of the carrier foil 13 provided on one side and the thickness of the carrier foil 13 provided on the other side is 2 ⁇ m or less. Is preferably 1 ⁇ m or less, and most preferably both thicknesses are equal.
- warping of the double-sided metal-clad laminate itself can be prevented by reducing the difference in thickness between the carrier foils 13 or by making the thicknesses of the two carrier foils 13 equal.
- each carrier foil 13 may be 15 ⁇ m or less when the laser is irradiated in the via hole forming step.
- the carrier foil 13 temporarily exceeding 15 ⁇ m
- the metal foil layer 12 may be provided. That is, in the metal foil with carrier foil itself used when the double-sided metal-clad laminate 10 is manufactured, the thickness of the carrier foil may exceed 15 ⁇ m.
- the metal foil with a carrier foil having a carrier foil with a thickness of more than 15 ⁇ m is laminated to the insulating layer 11
- the metal foil with a carrier foil is then applied before the via hole forming step (before black oxidation treatment when performing black oxidation treatment). What is necessary is just to make thickness of the carrier foil 13 thin by half etching etc. so that thickness may be set to 15 micrometers or less.
- the carrier foil 13 is bonded between the carrier foil 13 and the metal foil layer 12 so as to be peelable from the metal foil layer 12. It is preferable to provide a bonding interface layer. However, in FIG. 1, the display of the bonding interface layer is omitted.
- the bonding interface layer is required to allow the carrier foil 13 to be easily peeled off from the metal foil layer 12 by hand, and to have an appropriate adhesion strength until it is peeled off.
- the bonding interface layer is not particularly limited as long as it can adhere the carrier foil 13 and the metal foil layer 12 with the above-described appropriate adhesion strength.
- the nitrogen-containing compound and the sulfur-containing layer can be used.
- An organic bonding interface layer formed with an organic agent such as a compound or carboxylic acid is preferred.
- nitrogen-containing compounds examples include orthotriazoles, aminotriazoles, imidazoles, their salts, and derivatives.
- orthotriazoles such as carboxybenzotriazole, aminotriazoles such as 3-amino-1H-1,2,4-triazole, and triazole derivatives N ′, N′-bis (benzotriazolylmethyl) urea Can be mentioned. Any one or more of these can be used to form an organic bonding interface layer made of a nitrogen-containing compound.
- sulfur-containing compound that forms the organic bonding interface layer examples include thiazole, mercaptobenzothiazole, dibenzoazyl disulfide, mercaptobenzothiazole cyclohexylamine salt, mercaptobenzothiazole dicyclohexylamine salt, thiocyanuric acid and 2-benzimidazolethiol. Can be mentioned. In the case of forming an organic bonding interface layer using a sulfur-containing compound, it is particularly preferable to use mercaptobenzothiazole and thiocyanuric acid among these.
- carboxylic acids that form an organic bonding interface examples include high molecular weight carboxylic acids. In particular, mention may be made of monocarboxylic acids. In particular, when carboxylic acids are used, it is preferable to use fatty acids that are long-chain hydrocarbon monocarboxylic acids.
- the fatty acid may be a saturated fatty acid, but it is particularly preferable to use an unsaturated fatty acid such as oleic acid or linolenic acid.
- the bonding interface layer is not limited to the organic bonding interface layer formed using the organic agent, but may be an inorganic bonding interface layer formed using an inorganic material such as a metal or metal oxide.
- an inorganic material such as a metal or metal oxide.
- the metal or metal oxide include chromium, nickel, molybdenum, tantalum, vanadium, tungsten, cobalt, and oxides thereof.
- the organic peeling interface layer is preferably used because the physical peeling characteristics of the carrier foil 13 are more stable.
- the thickness of the bonding interface layer is preferably 100 nm or less, and more preferably 50 nm or less.
- a so-called peelable metal foil with a carrier foil is generally formed by providing a bonding interface layer on the surface of the carrier foil 13 and depositing metal on the bonding interface layer by a technique such as electrolysis. At this time, if the thickness of the bonding interface layer exceeds 100 nm, particularly in the case of an organic bonding interface layer, it becomes difficult to form a metal foil on the bonding interface layer, and the carrier foil 13 and the metal foil are adhered to each other. Strength decreases. Therefore, the thickness of the bonding interface layer is preferably 100 nm or less.
- the lower limit value of the thickness of the joint interface layer is not limited. However, when the thickness is less than 1 nm, it becomes difficult to form the bonding interface layer with a uniform thickness, and the thickness varies. For this reason, the thickness of the bonding interface layer is preferably 1 nm or more, and more preferably 2 nm or more.
- a heat-resistant metal layer (not shown) may be provided between the carrier foil 13 and the bonding interface layer, or between the bonding interface layer and the metal foil layer 12. Then, the double-sided metal-clad laminate 10 is placed on both sides of the insulating layer 11 in order from the insulating layer 11 side, respectively, metal foil layer 12 / bonding interface layer / heat-resistant metal layer / carrier foil 13 or metal foil layer 12 / It is also preferable to use a laminate having a layer structure of a heat-resistant metal layer / bonding interface layer / carrier foil 13.
- the production method is not particularly limited.
- the insulating resin base material of the so-called B stage, or the insulating resin base material as the insulating layer 11 by laminating the metal foil side of the metal foil with carrier foil on both surfaces of the insulating resin layer, respectively,
- the double-sided metal-clad laminate 10 in which the metal foil layer 12 and the carrier foil 13 are laminated in this order on both surfaces of the insulating resin layer can be obtained.
- a metal foil with a resin layer or a metal foil with an adhesive layer provided with a carrier foil may be used as the metal foil with a carrier foil, and the specific lamination process is not limited at all.
- black oxidation treatment process will be described.
- a black oxidation treatment step of performing black oxidation treatment blackening treatment
- blackening treatment blackening treatment
- the carrier foil 13 is a foil made of a metal foil as described above. For this reason, when the surface of the carrier foil 13 is irradiated with laser light, the laser light is reflected, the initial absorption efficiency of the laser light is poor, and the formation speed of the via hole is slow. For this reason, it is preferable to perform black oxidation treatment (blackening treatment) on the surface of the carrier foil 13 before performing the via hole forming step.
- the surface of the carrier foil 13 is roughened and blackened or browned. Thereby, the initial absorption efficiency of the laser beam on the surface of the carrier foil 13 can be improved, and the bottomed via hole 20 can be efficiently formed by laser processing in the via hole forming process which is the next process. It becomes possible.
- the method of the black oxidation treatment is not particularly limited, and a method similar to the black oxidation treatment performed as a pretreatment for improving adhesiveness in the lamination process of the multilayer printed wiring board may be adopted. it can.
- a black oxidation treatment solution By immersing the double-sided metal-clad laminate 10 having the carrier foil 13 on both sides in a black oxidation treatment solution for a certain time, a cuprous oxide film, a cupric oxide film, or a first oxide film is formed on the surface of the carrier foil 13.
- a mixed film of copper and cupric oxide is formed.
- a reduction treatment may be performed, and a reduction black oxidation treatment for reducing copper oxide to copper may be performed.
- Via hole forming step In the via hole forming step, as described above, one side of the double-sided metal-clad laminate 10 in which the metal foil layer 12 having the carrier foil 13 having a thickness of 15 ⁇ m or less is provided on both sides of the insulating layer 11. The surface of the carrier foil 13 (13a) on the side is irradiated with laser to form a bottomed via hole 20 having the bottom side 21 as the metal foil layer 12 (12b) on the other side.
- the hole diameter of the bottomed via hole 20 formed in the step is preferably 40 ⁇ m to 150 ⁇ m.
- a wiring circuit having a higher wiring density is required when the hole diameter of the bottomed via hole 20 is smaller. Obtainable.
- the type of laser used in the process is not particularly limited, and a carbon dioxide laser, an argon laser, an excimer laser, a YAG laser, or the like can be used. Further, the laser irradiation conditions can be appropriately set appropriately in consideration of the thickness of the double-sided metal-clad laminate 10 and the material of the insulating layer 11 and the like.
- the metal foil layer 12 on the laser irradiation side is also provided with the carrier foil 13 and then the carrier foil 13 (13a on the single side with respect to the double-sided metal-clad laminate 10 is provided.
- the carrier foil 13 is peeled in a carrier foil peeling step to be described later. The method is adopted.
- the carrier foil 13 (13a) is provided not only on the surface of the metal foil layer 12 (12b) on the other surface side which becomes the bottom 21 but also on the surface of the metal foil layer 12 (12a) on the one surface side irradiated with the laser.
- the thickness of the double-sided metal-clad laminate 10 excluding the thickness of the carrier foil 13
- the rigidity of the double-sided metal-clad laminate 10 can be increased.
- the bottomed via hole 20 can be formed in the flat double-sided metal-clad laminate 10 without warping, so that a plurality of bottomed via-holes are formed in the plane of the double-sided metal-clad laminate 10. Even when 20 is formed, it is possible to prevent variations in the hole diameter and hole shape. Moreover, since the splash deposited around the hole (20) by laser irradiation can be peeled off together with the carrier foil 13 in the carrier foil peeling step, the circumference of the hole can be made flat.
- Plating step After forming the bottomed via hole, for the purpose of electrical connection between the metal foil layer 12 (12a) on one side and the metal foil layer 12 (12b) on the other side, an interlayer connection is provided in the bottomed via hole 20
- the plating film 22 is preferably formed by performing the plating process. In the plating process, any metal may be deposited as long as electrical connection between the metal foil layer 12 (12a) on one side and the metal foil layer 12 (12b) on the other side can be achieved. In general, it is preferable to perform copper plating or copper alloy plating from the viewpoint of reliable connection reliability.
- the residual resin in the bottomed via hole 20 is removed by desmear treatment or the like, and after performing electroless copper plating according to a conventional method, electrolytic copper plating is performed to provide a plating layer having a necessary thickness. It is formed in the bottom via hole 20.
- electrolytic copper plating is performed to provide a plating layer having a necessary thickness. It is formed in the bottom via hole 20.
- conformal plating in which the plating film 22 has a certain thickness may be performed, or the hole of the bottomed via hole 20 may be formed.
- FIG. 1 illustrates a case where filling plating is performed on the bottomed via hole 20.
- the plating step is an optional step, and the plating step is not necessarily performed as long as conduction between the metal foil layer 12 (12a) on one side and the metal foil layer 12 (12b) on the other side can be achieved. There is no need to provide it.
- the bottomed via hole 20 may be filled with a conductive paste to achieve conduction between the metal foil layer 12 (12a) on one side and the metal foil layer 12 (12b) on the other side.
- each carrier foil 13 provided on both surfaces of the double-sided metal-clad laminate 10 is peeled from the surface of each metal foil layer 12.
- the splash deposited around the hole of the bottomed via hole 20 by the laser irradiation can be peeled off together with the carrier foil 13, the periphery of the hole can be flattened.
- the said carrier foil peeling process is performed after the said plating process like this Embodiment, the plating film 22 formed on the carrier foil 13 with the carrier foil 13 can be peeled.
- the plating film 22 in the bottomed via hole 20 remains, and the metal foil layer 12 (12a) on one side and the metal foil layer 12 (12b) on the other side Can be conducted.
- a plating process for achieving interlayer conduction is performed.
- the thickness of the conductor layer is increased by the amount of the plating film.
- the plating deposition rate in the surface varies, and therefore the plating film thickness varies.
- a carrier foil peeling step may be performed after the plating step as in the present embodiment from the viewpoint that a fine wiring circuit can be obtained with a good etching factor. preferable.
- Wiring circuit forming step for example, a resist pattern corresponding to the wiring circuit to be formed is formed on the metal foil layer 12 on the double-sided metal-clad laminate 10 after the carrier foil 13 is peeled off.
- a wiring circuit can be formed by a conventionally known method such as forming and etching.
- the manufacturing method of the printed wiring board demonstrated above is one aspect
- the carrier foil peeling step is performed after the above-described via hole forming step, there is no particular limitation on the order of performing other steps, the type of processing performed before and after these steps, and the production print Various treatments can be appropriately performed according to the electrical characteristics required of the wiring board. For example, as shown in FIG. 2, (b) a carrier foil peeling step may be performed after the via hole forming step, and then (c) a plating step may be performed. In this case, the plating film 22 can also be formed on the surface of the metal foil layer 12 (12a).
- the thickness of the carrier foil 13 may be reduced by half etching or the like so as to be 15 ⁇ m or less, the present invention is not limited thereto, and the metal foil with carrier foil provided with the carrier foil of 15 ⁇ m or less is used as the insulating layer. Even in the case of bonding to 11, the thickness of the carrier foil 13 may be reduced by the same method so that the thickness of the carrier foil 13 becomes a desired thickness within the above range.
- the printed wiring board according to the present invention is obtained by the above-described method for manufacturing a printed wiring board, and has a carrier foil 13 on both sides as shown in FIG. 1 (d) or FIG. 2 (c).
- any structure can be used as long as the layer structure includes a three-layer structure obtained by peeling the carrier foil 13 (including a wiring pattern formed).
- the layer structure includes a three-layer structure obtained by peeling the carrier foil 13 (including a wiring pattern formed).
- it may be a double-sided printed wiring board, or a multilayer printed wiring board in which a build-up layer is further laminated on the double-sided metal-clad laminate 10 on which a wiring pattern is formed.
- a copper foil with a carrier foil in which a copper foil (12) having a thickness of 3 ⁇ m is provided on a carrier copper foil (13) having a thickness of 12 ⁇ m through an organic bonding interface layer using carboxybenzotriazole.
- the copper foil side of the copper foil with carrier foil was used as a laminating surface, and the surface was roughened.
- the copper foil with a carrier foil is laminated
- the double-sided copper clad laminate was cut into a size of 150 mm ⁇ 150 mm, and a black foil was applied to the surface of the carrier foil.
- Comparative Example 1 As a sample of Comparative Example 1, a carrier foil is provided only on the other surface side in the same manner as in the example except that the carrier foil on the laser irradiation side was peeled off from the surface of the copper foil before the black oxidation treatment. A double-sided copper-clad laminate was obtained.
- Comparative Example 2 As a sample of Comparative Example 2, a double-sided copper-clad laminate without a carrier foil was obtained in the same manner as in Example except that the carrier foil was peeled off from the surface of the copper foil on both sides before the black oxidation treatment. It was.
- the amount of warpage during suction when each double-sided copper clad laminate obtained in this example and comparative example was placed on a laser irradiation stand was measured. Innumerable holes are formed in the laser irradiation table, and the sample is sucked through the holes so as to be in close contact with the laser irradiation table. The value is smaller than the value measured on the observation table. For this reason, the amount of warping during suction was measured as follows using a CCD camera having an autofocus mechanism. First, it was set to 0 mm on the basis of the focus position when focusing on the center of the sample. Next, the CCD camera was moved to each of the four corners of the sample to determine the focus positions at the four corners. The difference in the height direction between each focus position at the four corners of the sample and the focus position at the center of the sample was determined, and this was used as the amount of warpage.
- each double-sided copper clad laminate obtained in the above example a carbon dioxide laser manufactured by Mitsubishi Electric Corporation, from one side of each double-sided copper clad laminate, a beam diameter of 153 ⁇ m and a pulse width of 10 ⁇ s
- the laser pulse energy is 18.5 mJ, and one shot of the laser pulse beam is irradiated, and then the pulse width is changed to 3 ⁇ s, 5 ⁇ s, and 7 ⁇ s with respect to the energy density of 2 MW / cm 2 , 3 MW / cm 2 , and 4 MW / cm 2 .
- the laser pulse beam was 1 shot irradiated respectively, for subsequent energy density 2MW / cm 2, 3MW / cm 2, 4MW / cm 2, the pulse width 3 [mu] s, 5 .mu.s, by changing to 7 .mu.s, the top diameter 75.2 ⁇ m 121 via holes were formed, and the presence or absence of through holes with respect to the copper foil layer on the other surface side was observed to determine the through hole formation ratio (%).
- the laser irradiation conditions differ between the example and the comparative example because the double-sided copper clad laminate of the example is provided with a carrier foil on the laser irradiation side surface, so that the carrier on the laser irradiation side surface This is because a bottomed via hole cannot be formed unless the laser output is made higher than that of the double-sided copper laminate of the comparative example in which no foil is provided.
- Warpage amount Table 1 shows the warpage amounts at the four corners of the double-sided copper-clad laminates of this example, comparative example 1 and comparative example 2.
- Table 1 shows the double-sided copper-clad laminate of Example 1 and Comparative Example 2 did not warp, whereas the double-sided copper-clad laminate of Comparative Example 1 provided with carrier foil only on the other side It was confirmed that warping occurred. This is presumably because the stress balance on both sides of the insulating layer was lost by peeling only the carrier foil on one side from the double-sided copper clad laminate having carrier foils on both sides.
- the through hole formation ratio of the double-sided copper-clad laminate of this example is slightly higher than that of the double-sided copper-clad laminate of Comparative Example 1.
- the laser irradiation conditions adopted when forming the bottomed via hole for the double-sided copper-clad laminate of this example are the same as when forming the bottomed via-hole for the double-sided copper-clad laminate of the comparative example.
- the laser output is higher than the laser irradiation conditions employed. For this reason, although both cannot be compared simply, it is thought that a through-hole formation ratio falls by examining the laser irradiation conditions with respect to the double-sided copper clad laminated body of an Example. Therefore, it is considered that the through hole formation ratio can be effectively reduced by providing the carrier foil on the other surface side regardless of the presence or absence of the carrier foil on the laser irradiation side surface.
- Variation in hole diameter and hole shape Table 3 shows the hole diameters of the bottomed via holes formed at the four corners and the center of the double-sided copper clad laminate obtained in this example and Comparative Example 1, respectively.
- Table 3 the variation in the hole diameter of the bottomed via hole formed in the double-sided copper clad laminate obtained in this example was confirmed to be small compared to the double-sided copper clad laminate obtained in Comparative Example 1. It was. Moreover, it was confirmed that the difference between the hole diameter of the bottomed via hole formed at the center of the double-sided copper clad laminate and the hole diameter of the bottomed via hole formed at each of the four corners increases as the warp amount increases.
- FIG. 3 is a surface observation photograph of each bottomed via hole formed in the double-sided copper clad laminate of Comparative Example 1.
- the top shape of the bottomed via hole formed in the center part of the double-sided copper-clad laminate with zero warpage is substantially circular, while the warpage is large ( It can be confirmed that the top shapes of the bottomed via holes formed in the upper left (a) and lower left (d)) are distorted.
- the double-sided copper-clad laminate of this example has a small warp, and the bottomed via hole formed at the four corners also has a substantially circular shape with little variation in hole diameter and hole shape, and the hole shown in FIG. It was confirmed that the hole shape was almost the same as the shape.
- FIG. 4 is a surface observation photograph of the double-sided copper clad laminate of this example after the carrier foil was peeled off after the bottomed via hole was formed.
- FIG. 5 is a surface observation photograph of the double-sided copper-clad laminate of Comparative Example 1 after forming the bottomed via hole.
- splash is deposited around the hole by laser irradiation, whereas the double-sided copper clad laminate of this example. In the body, it was confirmed that the splash accumulated around the hole can be peeled off together with the carrier foil, so that the periphery of the hole becomes flat.
- each layer The difference in stress generated on one side and the other side can be reduced by the difference in the linear expansion coefficient. For this reason, even when the thickness of the double-sided metal-clad laminate (excluding the thickness of the carrier foil) is thin, it is possible to prevent the double-sided metal-clad laminate from warping. Moreover, the thickness increases by the carrier foil provided on both surfaces, and the rigidity of the double-sided metal-clad laminate can be increased.
- a bottomed via hole can be formed in a flat double-sided metal-clad laminate without warping, so a plurality of bottomed via holes are formed in the plane of the double-sided metal-clad laminate. Even in this case, it is possible to prevent variations in the hole diameter and hole shape. Further, it is possible to prevent the double-sided metal-clad laminate from being warped when the bottomed via hole is formed due to the influence of stress or heat generated during laser irradiation. Furthermore, since the splash deposited around the hole by laser irradiation can be peeled together with the carrier foil in the carrier foil peeling step, the circumference of the hole can be made flat. Therefore, the present invention can be suitably used when manufacturing a thin double-sided printed wiring board.
- Double-sided copper clad laminate (with double-sided carrier) 11 ... Insulating layer 12 .
- Metal foil layer 12a Metal foil layer on one side 12b .
- Metal foil layer on the other side 13 ... ⁇ Carrier foil 13a ⁇ ⁇ One side carrier foil 13b ⁇ ⁇ Other side carrier foil 20 ... Bottomed via hole 21 ... Bottom 22 ... Plating film
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Laminated Bodies (AREA)
Abstract
The present invention addresses the issue of providing a printed wiring board production method and a printed wiring board that, even when metal foil layers provided on both surfaces of a thin insulating layer are interlayer-connected by a via hole having a bottom, are capable of suppressing warping of a double-sided metal clad laminate and variation in hole diameter and hole shape, and of achieving good interlayer connection. In order to solve this issue, a printed wiring board production method and a printed wiring board are provided, said production method characterized by comprising: a via hole forming step in which a laser is irradiated on the surface of a carrier foil on one side of a double-sided metal clad laminate comprising, on both surfaces of an insulating layer of no more than 200 µm and in order from the insulating layer side, a metal foil layer and the carrier foil having a thickness of no more than 15 µm, and a via hole with a bottom is formed, said via hole having the metal foil layer on the other surface side as the bottom section therefor; and a carrier foil separation step in which each carrier foil is separated from the surface of each metal foil layer, after the via hole with a bottom is formed.
Description
本件発明は、絶縁層の両面に金属箔層を備えた両面金属張積層体を用い、両金属箔層を有底バイアホールにより層間接続するプリント配線板の製造方法及び当該プリント配線板に関する。
The present invention relates to a method of manufacturing a printed wiring board using a double-sided metal-clad laminate having metal foil layers on both sides of an insulating layer, and connecting both metal foil layers with bottomed via holes, and the printed wiring board.
従来より、絶縁層の両面に金属箔を張り合わせた両面金属張積層板を用いてプリント配線板を製造することが行われている。絶縁層の両面に設けられた金属箔には、エッチング加工等により配線回路が形成される。そして、これらの両層は有底バイアホール或いはスルーホール等により層間接続される。ここで、有底バイアホールにより層間接続を行う場合には、片面側の金属箔層と絶縁層とを貫通し、他面側の金属箔層を底部とする非貫通孔をレーザ加工等により形成する。このとき他面側の金属箔層にもレーザが直接照射されると、金属箔層にも孔が形成される場合がある。このため、歩留まりよく有底バイアホールを形成するのは困難であった。
Conventionally, printed wiring boards have been manufactured using a double-sided metal-clad laminate in which metal foils are bonded to both sides of an insulating layer. A wiring circuit is formed on the metal foil provided on both surfaces of the insulating layer by etching or the like. These two layers are connected to each other through bottomed via holes or through holes. Here, when performing interlayer connection with a bottomed via hole, a non-through hole is formed by laser processing or the like through the metal foil layer and the insulating layer on one side and with the metal foil layer on the other side as the bottom. To do. At this time, if the laser is directly irradiated to the metal foil layer on the other side, holes may be formed in the metal foil layer. For this reason, it is difficult to form a bottomed via hole with a high yield.
そこで、特許文献1に記載の方法では、他面側の金属箔層に、保護金属板を接着させ、有底バイアホール形成後に保護金属板を取り外すことが行われている。特許文献1によれば、当該方法を採用することにより、炭酸ガスレーザが他面側の金属箔層に直接照射された場合でも、保護金属板により熱を拡散させることができる。このため、厚みが3μm~5μmの薄い金属箔を絶縁層の両面に張り合わせた両面金属張積層板を用いる場合でも、他面側の金属箔層に孔が形成されることがなく、歩留まりを向上させることができるとしている。
Therefore, in the method described in Patent Document 1, a protective metal plate is bonded to the metal foil layer on the other side, and the protective metal plate is removed after the bottomed via hole is formed. According to Patent Document 1, by adopting this method, heat can be diffused by the protective metal plate even when the carbon dioxide laser is directly applied to the metal foil layer on the other surface side. Therefore, even when using a double-sided metal-clad laminate in which a thin metal foil with a thickness of 3 μm to 5 μm is laminated on both sides of the insulating layer, no holes are formed in the metal foil layer on the other side, improving the yield. It can be made to.
ところで、上記両面金属張積層体を製造する際には、絶縁層の両面に金属箔を積層し、熱間プレス加工により絶縁層を溶融硬化させる。絶縁層と金属材料とは熱膨張係数が異なるため、この熱間プレス加工時に加わる熱及び圧力により、絶縁層と金属箔層との界面に応力が発生する。ここで、上記特許文献1に記載の方法では、両面金属張積層体を製造する際に、絶縁層の両面にそれぞれ保護金属板を備えた金属箔を張り合わせた後、片面側の保護金属板を取り外す方法を採用している。片面側の保護金属板を取り外すと、絶縁層の両面側の応力のバランスが崩れることから、絶縁層の厚みが薄い場合(例えば、200μm以下)、いわゆる反りが発生する恐れが高い。両面金属張積層体に反りが生じると、面内に複数の有底バイアホールを形成する場合、孔径や孔形状にバラツキが生じるため、他面側に保護金属板を設けても歩留まりが逆に低下する恐れがある。
By the way, when manufacturing the double-sided metal-clad laminate, metal foil is laminated on both sides of the insulating layer, and the insulating layer is melt-cured by hot pressing. Since the thermal expansion coefficient differs between the insulating layer and the metal material, stress is generated at the interface between the insulating layer and the metal foil layer due to heat and pressure applied during the hot pressing. Here, in the method described in Patent Document 1, when manufacturing a double-sided metal-clad laminate, after attaching metal foils each provided with a protective metal plate on both sides of the insulating layer, a single-sided protective metal plate is attached. The removal method is adopted. When the protective metal plate on one side is removed, the balance of stresses on both sides of the insulating layer is lost. Therefore, when the insulating layer is thin (for example, 200 μm or less), so-called warpage is likely to occur. If warpage occurs in the double-sided metal-clad laminate, when forming multiple bottomed via holes in the surface, the hole diameter and hole shape will vary, so even if a protective metal plate is provided on the other side, the yield will be reversed. May fall.
そこで、本件発明は、厚みの薄い絶縁層の両面に設けられた金属箔層同士を有底バイアホールにより層間接続する場合であっても、両面金属張積層体の反り、孔径や孔形状のバラツキを抑制した上で、良好な層間接続を行うことのできるプリント配線板の製造方法及びプリント配線板を提供することを課題とする。
Therefore, the present invention provides for the warpage of the double-sided metal-clad laminate and the variation in hole diameter and hole shape even when the metal foil layers provided on both sides of the thin insulating layer are interconnected by bottomed via holes. It is an object of the present invention to provide a printed wiring board manufacturing method and a printed wiring board capable of achieving good interlayer connection while suppressing the above.
本発明者等は、鋭意研究を行った結果、以下のプリント配線板の製造方法及び当該製造方法により得られたプリント配線板を採用することで上記課題を達成するに到った。
As a result of intensive studies, the present inventors have achieved the above-mentioned problems by employing the following printed wiring board manufacturing method and the printed wiring board obtained by the manufacturing method.
本件発明に係るプリント配線板の製造方法は、200μm以下の厚みの絶縁層の両面に、金属箔層と、15μm以下の厚みのキャリア箔とを当該絶縁層側から順にそれぞれ備えた両面金属張積層体に対して、片面側のキャリア箔の表面にレーザを照射して、他面側の金属箔層を底部とする有底バイアホールを形成するバイアホール形成工程と、有底バイアホール形成後に、各キャリア箔を各金属箔層の表面から剥離するキャリア箔剥離工程とを備えることを特徴とする。
The method for producing a printed wiring board according to the present invention comprises a double-sided metal-clad laminate comprising a metal foil layer and a carrier foil having a thickness of 15 μm or less in order from the insulating layer side on both sides of an insulating layer having a thickness of 200 μm or less. The body is irradiated with laser on the surface of the carrier foil on one side, and a via hole forming step for forming a bottomed via hole with the metal foil layer on the other side as a bottom, and after forming the bottomed via hole, A carrier foil peeling step of peeling each carrier foil from the surface of each metal foil layer.
本件発明に係るプリント配線板の製造方法において、前記バイアホール形成工程の前に、少なくとも前記片面側のキャリア箔の表面に黒色酸化処理を施す黒色酸化処理工程を備えることが好ましい。
In the method for manufacturing a printed wiring board according to the present invention, it is preferable to include a black oxidation treatment step of performing black oxidation treatment on at least the surface of the carrier foil on one side before the via hole forming step.
本件発明に係るプリント配線板の製造方法において、前記金属箔層の厚みは、7μm以下であることが好ましい。
In the method for manufacturing a printed wiring board according to the present invention, the thickness of the metal foil layer is preferably 7 μm or less.
本件発明に係るプリント配線板の製造方法において、前記両面金属張積層体は、前記キャリア箔と、前記金属箔層との間に接合界面層を備えることが好ましい。
In the method for manufacturing a printed wiring board according to the present invention, it is preferable that the double-sided metal-clad laminate includes a bonding interface layer between the carrier foil and the metal foil layer.
本件発明に係るプリント配線板の製造方法において、前記接合界面層は、有機剤により形成された有機接合界面層であることが好ましい。
In the method for manufacturing a printed wiring board according to the present invention, the bonding interface layer is preferably an organic bonding interface layer formed of an organic agent.
本件発明に係るプリント配線板の製造方法において、前記バイアホール形成工程と、前記キャリア箔剥離工程との間に、片面の金属箔層と他面の金属箔層との導通を図るための層間接続用のめっき処理を有底バイアホール内に施すめっき工程を備えることが好ましい。
In the method for manufacturing a printed wiring board according to the present invention, an interlayer connection for conducting electrical connection between the metal foil layer on one side and the metal foil layer on the other side between the via hole forming step and the carrier foil peeling step. It is preferable to provide a plating process for applying a plating treatment for the inside of the bottomed via hole.
本件発明に係るプリント配線板は、上記記載のプリント配線板の製造方法により得られたことを特徴とする。
The printed wiring board according to the present invention is obtained by the printed wiring board manufacturing method described above.
本件発明によれば、バイアホール形成工程において、絶縁層の両面に、金属箔層と、15μm以下の厚みのキャリア箔とを当該絶縁層側から順にそれぞれ備えた両面金属張積層体に対して、片面側のキャリア箔の表面にレーザを照射して、他面側の金属箔層を底部とする有底バイアホールを形成し、その後、キャリア箔剥離工程においてキャリア箔を剥離する方法を採用している。このように、本件発明では、絶縁層の両面に金属箔層を介してキャリア箔を設けた状態で、バイアホール形成工程を行うことにより、片面側のキャリア箔を剥離してバイアホールを形成する場合とは異なり、絶縁層の両面側に生じる応力が不均一になるのを防止することができる。このため、絶縁層の厚みが薄い場合でも、当該両面金属張積層体に反りが生じるのを防止することができる。また、両面に設けられたキャリア箔によりその厚みを増加して、両面金属張積層体の剛性を上げることもできる。これらのことにより、平坦な反りのない状態の両面金属張積層体に対して有底バイアホールを形成することができるため、両面金属張積層体の面内に複数の有底バイアホールを形成する場合であっても、孔径や孔形状にバラツキが生じるのを防止することができる。さらに、レーザ照射により孔の周囲に堆積したスプラッシュを、キャリア箔剥離工程においてキャリア箔と共に剥離することができるため、孔の周囲を平坦にすることができる。
According to the present invention, in the via hole forming step, the double-sided metal-clad laminate provided with a metal foil layer and a carrier foil having a thickness of 15 μm or less in order from the insulating layer side on both sides of the insulating layer, A method of peeling the carrier foil in the carrier foil peeling process by irradiating the surface of the carrier foil on one side with a laser to form a bottomed via hole with the metal foil layer on the other side as the bottom. Yes. As described above, in the present invention, by performing the via hole forming step with the carrier foil provided on both surfaces of the insulating layer via the metal foil layer, the carrier foil on one side is peeled to form the via hole. Unlike the case, it is possible to prevent the stress generated on both sides of the insulating layer from becoming uneven. For this reason, even when the insulating layer is thin, it is possible to prevent the double-sided metal-clad laminate from warping. Further, the thickness of the carrier foil provided on both sides can be increased to increase the rigidity of the double-sided metal-clad laminate. As a result, a bottomed via hole can be formed in a flat double-sided metal-clad laminate without warping, so a plurality of bottomed via holes are formed in the plane of the double-sided metal-clad laminate. Even in this case, it is possible to prevent variations in the hole diameter and hole shape. Furthermore, since the splash deposited around the hole by laser irradiation can be peeled together with the carrier foil in the carrier foil peeling step, the circumference of the hole can be made flat.
以下、本件発明に係るプリント配線板の製造方法及びプリント配線板の実施の形態を説明する。
Hereinafter, an embodiment of a printed wiring board manufacturing method and a printed wiring board according to the present invention will be described.
1.プリント配線板の製造方法
最初に、本件発明に係るプリント配線板の製造方法の実施の形態を図1を参照しながら説明する。本件発明に係るプリント配線板の製造方法は、絶縁層11の両面に、金属箔層12と、15μm以下の厚みのキャリア箔13とを当該絶縁層11側から順にそれぞれ備えた両面金属張積層体10(図1(a)参照)に対して、片面側のキャリア箔13(13a)の表面にレーザを照射して、他面側の金属箔層12(12b)を底部21とする有底バイアホール20(図1(b)参照)を形成するバイアホール形成工程と、有底バイアホール20形成後に、各キャリア箔13を各金属箔層12の表面から剥離するキャリア箔剥離工程とを備えることを特徴としている。本実施の形態では、これらの工程の他に、バイアホール形成工程の前に行う両面金属張積層体10の製造工程及び黒色酸化処理工程、バイアホール形成工程の後に行うめっき工程等についても併せて説明する。以下、処理の順序に従って、説明する。なお、図1は、各工程を説明するための模式図であり、各層の厚みは実際の層厚の比率とは異なっている。また、図1には各層に施される表面処理層(粗化処理層、黒色酸化処理層等)については表示を省略している(図2についても同様である。)。 1. First, an embodiment of a printed wiring board manufacturing method according to the present invention will be described with reference to FIG. The method for manufacturing a printed wiring board according to the present invention includes a double-sided metal-clad laminate in which ametal foil layer 12 and a carrier foil 13 having a thickness of 15 μm or less are provided on both sides of an insulating layer 11 in order from the insulating layer 11 side. 10 (see FIG. 1 (a)), a bottomed via having a bottom 21 on the metal foil layer 12 (12b) on the other side is irradiated with laser on the surface of the carrier foil 13 (13a) on one side. A via hole forming step for forming the holes 20 (see FIG. 1B) and a carrier foil peeling step for peeling the carrier foils 13 from the surfaces of the metal foil layers 12 after the bottomed via holes 20 are formed. It is characterized by. In the present embodiment, in addition to these processes, the manufacturing process of the double-sided metal-clad laminate 10 performed before the via hole forming process, the black oxidation process, the plating process performed after the via hole forming process, and the like are also performed. explain. Hereinafter, description will be given in the order of processing. FIG. 1 is a schematic diagram for explaining each process, and the thickness of each layer is different from the actual ratio of the layer thickness. In FIG. 1, the surface treatment layers (roughening treatment layer, black oxidation treatment layer, etc.) applied to each layer are not shown (the same applies to FIG. 2).
最初に、本件発明に係るプリント配線板の製造方法の実施の形態を図1を参照しながら説明する。本件発明に係るプリント配線板の製造方法は、絶縁層11の両面に、金属箔層12と、15μm以下の厚みのキャリア箔13とを当該絶縁層11側から順にそれぞれ備えた両面金属張積層体10(図1(a)参照)に対して、片面側のキャリア箔13(13a)の表面にレーザを照射して、他面側の金属箔層12(12b)を底部21とする有底バイアホール20(図1(b)参照)を形成するバイアホール形成工程と、有底バイアホール20形成後に、各キャリア箔13を各金属箔層12の表面から剥離するキャリア箔剥離工程とを備えることを特徴としている。本実施の形態では、これらの工程の他に、バイアホール形成工程の前に行う両面金属張積層体10の製造工程及び黒色酸化処理工程、バイアホール形成工程の後に行うめっき工程等についても併せて説明する。以下、処理の順序に従って、説明する。なお、図1は、各工程を説明するための模式図であり、各層の厚みは実際の層厚の比率とは異なっている。また、図1には各層に施される表面処理層(粗化処理層、黒色酸化処理層等)については表示を省略している(図2についても同様である。)。 1. First, an embodiment of a printed wiring board manufacturing method according to the present invention will be described with reference to FIG. The method for manufacturing a printed wiring board according to the present invention includes a double-sided metal-clad laminate in which a
1-1.両面金属張積層体10の製造工程
両面金属張積層体10の製造工程について説明する。当該製造工程では、バイアホール形成工程に供される両面金属張積層体10を製造する。ここで、両面金属張積層体10は、絶縁層11の両面に金属箔層12が積層された積層体を指し、特に、バイアホール形成工程で用いる両面金属張積層体10は、金属箔層12の表面にそれぞれ15μm以下の厚みのキャリア箔13が積層されたキャリア箔付の両面金属張積層体10を指す。まず、当該製造工程において製造する両面金属張積層体10の層構成について説明する。 1-1. Manufacturing process of double-sided metal-clad laminate 10 A manufacturing process of double-sided metal-clad laminate 10 will be described. In the manufacturing process, the double-sided metal-clad laminate 10 used in the via hole forming process is manufactured. Here, the double-sided metal-clad laminate 10 refers to a laminate in which metal foil layers 12 are laminated on both sides of the insulating layer 11, and in particular, the double-sided metal-clad laminate 10 used in the via hole forming step is the metal foil layer 12. The double-sided metal-clad laminate 10 with a carrier foil in which a carrier foil 13 having a thickness of 15 μm or less is laminated on each surface. First, the layer structure of the double-sided metal-clad laminate 10 manufactured in the manufacturing process will be described.
両面金属張積層体10の製造工程について説明する。当該製造工程では、バイアホール形成工程に供される両面金属張積層体10を製造する。ここで、両面金属張積層体10は、絶縁層11の両面に金属箔層12が積層された積層体を指し、特に、バイアホール形成工程で用いる両面金属張積層体10は、金属箔層12の表面にそれぞれ15μm以下の厚みのキャリア箔13が積層されたキャリア箔付の両面金属張積層体10を指す。まず、当該製造工程において製造する両面金属張積層体10の層構成について説明する。 1-1. Manufacturing process of double-sided metal-clad laminate 10 A manufacturing process of double-sided metal-
(1)絶縁層11
本実施の形態において、絶縁層11は、プリント配線板に要求される絶縁特性を満足する絶縁性材料からなる層であれば特に限定されるものではない。具体的には、当該絶縁層11は、紙、または、ガラス布等に絶縁性樹脂(エポキシ樹脂、シアネート樹脂、ビスマレイミドトリアジン樹脂(BT樹脂)、ポリフェニレンエーテル樹脂、フェノール樹脂等)を含浸させたシートを必要枚数重ねたプリプレグ等の絶縁樹脂基材であってもよいし、エポキシ樹脂、ポリイミド樹脂或いはポリエステル樹脂等の絶縁樹脂からなる絶縁樹脂層であってもよく、特に限定されるものではない。また、絶縁樹脂層には絶縁性を向上する等の観点からシリカ、アルミナ等の各種無機粒子からなるフィラー粒子等が含有されていてもよい。 (1) Insulating layer 11
In the present embodiment, the insulating layer 11 is not particularly limited as long as it is a layer made of an insulating material that satisfies the insulating characteristics required for the printed wiring board. Specifically, the insulating layer 11 is made by impregnating paper or glass cloth with an insulating resin (epoxy resin, cyanate resin, bismaleimide triazine resin (BT resin), polyphenylene ether resin, phenol resin, or the like). It may be an insulating resin base material such as a prepreg in which a required number of sheets are stacked, or may be an insulating resin layer made of an insulating resin such as an epoxy resin, a polyimide resin or a polyester resin, and is not particularly limited. . In addition, the insulating resin layer may contain filler particles made of various inorganic particles such as silica and alumina from the viewpoint of improving the insulating properties.
本実施の形態において、絶縁層11は、プリント配線板に要求される絶縁特性を満足する絶縁性材料からなる層であれば特に限定されるものではない。具体的には、当該絶縁層11は、紙、または、ガラス布等に絶縁性樹脂(エポキシ樹脂、シアネート樹脂、ビスマレイミドトリアジン樹脂(BT樹脂)、ポリフェニレンエーテル樹脂、フェノール樹脂等)を含浸させたシートを必要枚数重ねたプリプレグ等の絶縁樹脂基材であってもよいし、エポキシ樹脂、ポリイミド樹脂或いはポリエステル樹脂等の絶縁樹脂からなる絶縁樹脂層であってもよく、特に限定されるものではない。また、絶縁樹脂層には絶縁性を向上する等の観点からシリカ、アルミナ等の各種無機粒子からなるフィラー粒子等が含有されていてもよい。 (1) Insulating layer 11
In the present embodiment, the insulating layer 11 is not particularly limited as long as it is a layer made of an insulating material that satisfies the insulating characteristics required for the printed wiring board. Specifically, the insulating layer 11 is made by impregnating paper or glass cloth with an insulating resin (epoxy resin, cyanate resin, bismaleimide triazine resin (BT resin), polyphenylene ether resin, phenol resin, or the like). It may be an insulating resin base material such as a prepreg in which a required number of sheets are stacked, or may be an insulating resin layer made of an insulating resin such as an epoxy resin, a polyimide resin or a polyester resin, and is not particularly limited. . In addition, the insulating resin layer may contain filler particles made of various inorganic particles such as silica and alumina from the viewpoint of improving the insulating properties.
また、本件発明において、絶縁層11の厚みは200μm以下であることを特徴とする。絶縁層11の厚みが200μmを超える場合であっても本件発明に係る方法を適用することは可能である。しかしながら、その場合、両面金属張積層体10の厚みが厚く、当該両面金属張積層体10の反り等が生じにくくなるため、本件発明に係る方法を適用する必要性が低下する。換言すれば、本件発明に係る方法は、絶縁層11の厚みが200μm以下の薄いプリント配線板を製造する際に好ましく適用することができる。また、プリント配線板の薄型化の要請から当該絶縁層11の厚みは100μm以下であることが好ましく、60μm以下であることがより好ましい。本件発明に係る方法を採用すれば。60μm以下の絶縁層11を備える両面プリント配線板を製造する際にも、その製造過程において両面金属張積層体10の反りが生じるのを防止することができる。
In the present invention, the thickness of the insulating layer 11 is 200 μm or less. Even if the thickness of the insulating layer 11 exceeds 200 μm, the method according to the present invention can be applied. However, in that case, since the thickness of the double-sided metal-clad laminate 10 is large and warpage of the double-sided metal-clad laminate 10 is less likely to occur, the necessity of applying the method according to the present invention is reduced. In other words, the method according to the present invention can be preferably applied when manufacturing a thin printed wiring board having a thickness of the insulating layer 11 of 200 μm or less. Further, the thickness of the insulating layer 11 is preferably 100 μm or less, and more preferably 60 μm or less, in order to reduce the thickness of the printed wiring board. If the method according to the present invention is adopted. Even when a double-sided printed wiring board having an insulating layer 11 of 60 μm or less is manufactured, the double-sided metal-clad laminate 10 can be prevented from warping during the manufacturing process.
(2)金属箔層12
金属箔層12は、導電性を有する金属箔からなる層であれば特に限定されるものではなく、銅箔、アルミニウム箔、ニッケル箔、コバルト箔、金箔、白金箔等の種々の金属箔又はこれらの合金箔等からなる層とすることができる。これらの各種金属箔はいずれも好適に用いることができるが、入手が容易であり、且つ、安価であるという観点から、銅箔、アルミニウム箔、ニッケル箔又はこれらの合金箔等を用いることが好ましい。さらに、電気抵抗率が低く、エッチング等による回路形成時の加工性に優れるという点から銅箔又は銅合金箔を好適に用いることができる。 (2)Metal foil layer 12
Themetal foil layer 12 is not particularly limited as long as it is a layer made of conductive metal foil, and various metal foils such as copper foil, aluminum foil, nickel foil, cobalt foil, gold foil, platinum foil, or the like It can be set as the layer which consists of these alloy foils. Any of these various metal foils can be suitably used, but it is preferable to use a copper foil, an aluminum foil, a nickel foil, or an alloy foil thereof from the viewpoint of easy availability and low cost. . Furthermore, a copper foil or a copper alloy foil can be suitably used because it has a low electrical resistivity and is excellent in workability during circuit formation by etching or the like.
金属箔層12は、導電性を有する金属箔からなる層であれば特に限定されるものではなく、銅箔、アルミニウム箔、ニッケル箔、コバルト箔、金箔、白金箔等の種々の金属箔又はこれらの合金箔等からなる層とすることができる。これらの各種金属箔はいずれも好適に用いることができるが、入手が容易であり、且つ、安価であるという観点から、銅箔、アルミニウム箔、ニッケル箔又はこれらの合金箔等を用いることが好ましい。さらに、電気抵抗率が低く、エッチング等による回路形成時の加工性に優れるという点から銅箔又は銅合金箔を好適に用いることができる。 (2)
The
また、金属箔層12を構成するこれらの金属箔は、圧延箔、電解箔のいずれであってもよいが、電解箔であることがより好ましい。電解箔であれば、キャリア箔13の表面に所定の厚みとなるように金属を析出させることにより得ることができる。このため、絶縁層11にキャリア箔13の表面に析出させた金属箔を張り合わせることにより、両面にキャリア箔13を備えた両面金属張積層体10を製造することが容易になるためである。
The metal foil constituting the metal foil layer 12 may be a rolled foil or an electrolytic foil, but is more preferably an electrolytic foil. If it is electrolytic foil, it can obtain by depositing a metal so that it may become predetermined thickness on the surface of carrier foil 13. FIG. For this reason, it is because it becomes easy to manufacture the double-sided metal-clad laminate 10 provided with the carrier foil 13 on both sides by laminating the metal foil deposited on the surface of the carrier foil 13 to the insulating layer 11.
金属箔層12の厚みは、7μm以下であることが好ましい。金属箔層12の厚みが7μm以下であると、回路ピッチの狭い高精細な回路をより良好なエッチングファクタで形成することができる。また、このような厚みの薄い金属箔層12を構成するには、金属箔に対して剥離自在に設けられるキャリア箔13を備えたキャリア箔付金属箔を用いる場合が多いため、後述する方法を適用する際に、キャリア箔13とは別に保護金属板を用意する必要がなく、資源保全の観点から好ましい。
The thickness of the metal foil layer 12 is preferably 7 μm or less. When the thickness of the metal foil layer 12 is 7 μm or less, a high-definition circuit with a narrow circuit pitch can be formed with a better etching factor. Further, in order to configure such a thin metal foil layer 12, a metal foil with a carrier foil provided with a carrier foil 13 provided to be peelable from the metal foil is often used. When applied, it is not necessary to prepare a protective metal plate separately from the carrier foil 13, which is preferable from the viewpoint of resource conservation.
金属箔層12と、絶縁層11との界面において、金属箔層12の表面には粗化処理が施されていてもよい。粗化処理が施された金属箔層12に対して絶縁層11を構成する絶縁樹脂基材等を張り合わせることにより、金属箔層12と絶縁層11とを良好に密着させることができる。より高精細な回路をより良好なエッチングファクタで形成するためには、金属箔層12の表面には粗化処理が施されていないことが好ましい。この場合、粗化処理の施されていない金属箔層12と絶縁層11との密着性を向上させるため、当該金属箔層12の表面にプライマー樹脂層を設け、当該プライマー樹脂層を介して当該金属箔層12を絶縁層11に張り合わせることがより好ましい。
The surface of the metal foil layer 12 may be roughened at the interface between the metal foil layer 12 and the insulating layer 11. The metal foil layer 12 and the insulating layer 11 can be satisfactorily adhered to each other by attaching an insulating resin base material or the like constituting the insulating layer 11 to the metal foil layer 12 that has been subjected to the roughening treatment. In order to form a higher-definition circuit with a better etching factor, it is preferable that the surface of the metal foil layer 12 is not roughened. In this case, in order to improve the adhesion between the metal foil layer 12 and the insulating layer 11 that have not been roughened, a primer resin layer is provided on the surface of the metal foil layer 12, and the primer resin layer is interposed through the primer resin layer. More preferably, the metal foil layer 12 is bonded to the insulating layer 11.
(3)キャリア箔13
キャリア箔13は、厚みの薄い金属箔の取り扱い性を向上するために、金属箔を支持する支持体として用いられる箔である。両面金属張積層体10を製造する際には、上述したとおり、製造が容易になるという観点からキャリア箔付金属箔を用いるが、本件発明では、特に、金属箔に対してキャリア箔13が手作業により剥離自在に設けられたいわゆるピーラブルタイプのキャリア箔付金属箔を好ましく用いることができる。 (3)Carrier foil 13
Thecarrier foil 13 is a foil used as a support for supporting the metal foil in order to improve the handleability of the thin metal foil. When manufacturing the double-sided metal-clad laminate 10, as described above, a metal foil with a carrier foil is used from the viewpoint of easy manufacturing. In the present invention, in particular, the carrier foil 13 is used for the metal foil. A so-called peelable type metal foil with a carrier foil, which is provided so as to be peelable by work, can be preferably used.
キャリア箔13は、厚みの薄い金属箔の取り扱い性を向上するために、金属箔を支持する支持体として用いられる箔である。両面金属張積層体10を製造する際には、上述したとおり、製造が容易になるという観点からキャリア箔付金属箔を用いるが、本件発明では、特に、金属箔に対してキャリア箔13が手作業により剥離自在に設けられたいわゆるピーラブルタイプのキャリア箔付金属箔を好ましく用いることができる。 (3)
The
キャリア箔13を構成する材料に特に限定はないが、例えば、銅箔、銅合金箔、アルミニウム箔、アルミニウム箔の表面に銅或いは亜鉛等の金属めっき層が設けられた複合金属箔、ステンレス箔等を用いることができる。これらの箔の中でも特に、銅箔をキャリア箔13として好適に用いることができる。銅箔からなるキャリア箔13であれば、金属箔層12から当該キャリア箔13を剥離した後、これを銅原料として再利用することが容易であるため、資源保全の観点から好ましい。
The material constituting the carrier foil 13 is not particularly limited. For example, a copper foil, a copper alloy foil, an aluminum foil, a composite metal foil in which a metal plating layer such as copper or zinc is provided on the surface of the aluminum foil, a stainless steel foil, etc. Can be used. Among these foils, a copper foil can be preferably used as the carrier foil 13. The carrier foil 13 made of copper foil is preferable from the viewpoint of resource conservation because it can be easily reused as a copper raw material after the carrier foil 13 is peeled from the metal foil layer 12.
本件発明において、キャリア箔13の厚みは、15μm以下であることを特徴とする。特に、レーザ照射側(片面側)のキャリア箔13の厚みが厚くなり過ぎると、バイアホールを形成する際のレーザの出力、或いはショット数を増加させる必要があり、バイアホールを形成することが困難になるため好ましくない。また、資源保全の観点からも、キャリア箔13の厚みが薄い方が好ましい。当該観点から、キャリア箔13の厚みは13μm以下であることがより好ましい。
In the present invention, the thickness of the carrier foil 13 is 15 μm or less. In particular, if the thickness of the carrier foil 13 on the laser irradiation side (one side) becomes too thick, it is necessary to increase the laser output or the number of shots when forming the via hole, making it difficult to form the via hole. This is not preferable. From the viewpoint of resource conservation, the carrier foil 13 is preferably thin. From this viewpoint, the thickness of the carrier foil 13 is more preferably 13 μm or less.
しかしながら、キャリア箔13の厚みが薄くなりすぎると、レーザ照射時に、熱を十分に拡散することができず、他面側の金属箔層12(12b)にも貫通孔が形成される可能性が高くなる。従って、当該観点から、少なくとも他面側の金属箔層12(12b)に設けられるキャリア箔13の厚みは5μm以上であることが好ましく、7μm以上であることがより好ましい。また、キャリア箔13の厚みが5μm未満になると、極薄い金属箔を支持して、当該金属箔の取り扱い性を向上させるというキャリア箔13本来の機能を果たすことが困難になり、好ましくない。
However, if the thickness of the carrier foil 13 becomes too thin, heat cannot be sufficiently diffused during laser irradiation, and a through hole may be formed in the metal foil layer 12 (12b) on the other side. Get higher. Therefore, from this viewpoint, the thickness of the carrier foil 13 provided on at least the metal foil layer 12 (12b) on the other surface side is preferably 5 μm or more, and more preferably 7 μm or more. On the other hand, when the thickness of the carrier foil 13 is less than 5 μm, it becomes difficult to perform the original function of the carrier foil 13 for supporting an extremely thin metal foil and improving the handleability of the metal foil.
本来、レーザ照射側に設けられるキャリア箔13の厚みは薄い方が好ましく、他面側に設けられるキャリア箔13の厚みは厚い方が好ましい。しかしながら、当該両面金属張積層体10の反りを防止するという観点において、片面側に設けられるキャリア箔13の厚みと、他面側に設けられるキャリア箔13の厚みとの差は2μm以下であることが好ましく、1μm以下であることがより好ましく、両厚みが等しいことが最も好ましい。当該両面金属張積層体10において、両キャリア箔13の厚みの差を小さく、或いは、両キャリア箔13の厚みを等しくすることにより、当該両面金属張積層板自体の反りを防止することができる。
Originally, the carrier foil 13 provided on the laser irradiation side is preferably thinner, and the carrier foil 13 provided on the other side is preferably thicker. However, in terms of preventing warpage of the double-sided metal-clad laminate 10, the difference between the thickness of the carrier foil 13 provided on one side and the thickness of the carrier foil 13 provided on the other side is 2 μm or less. Is preferably 1 μm or less, and most preferably both thicknesses are equal. In the double-sided metal-clad laminate 10, warping of the double-sided metal-clad laminate itself can be prevented by reducing the difference in thickness between the carrier foils 13 or by making the thicknesses of the two carrier foils 13 equal.
但し、バイアホール形成工程においてレーザが照射される際に各キャリア箔13の厚みが15μm以下であればよく、両面金属張積層体10の製造工程においては、一時的に15μmを超えるキャリア箔13が金属箔層12に設けられていてもよい。すなわち、両面金属張積層体10を製造する際に用いるキャリア箔付金属箔自体においては、キャリア箔の厚みが15μmを超えていてもよい。15μmを超える厚みのキャリア箔を備えたキャリア箔付金属箔を絶縁層11に張り合わせた場合は、その後、バイアホール形成工程の前(黒色酸化処理を行う場合は、黒色酸化処理の前)にその厚みが15μm以下となるように、ハーフエッチング等によりキャリア箔13の厚みを薄くすればよい。
However, the thickness of each carrier foil 13 may be 15 μm or less when the laser is irradiated in the via hole forming step. In the manufacturing process of the double-sided metal-clad laminate 10, the carrier foil 13 temporarily exceeding 15 μm The metal foil layer 12 may be provided. That is, in the metal foil with carrier foil itself used when the double-sided metal-clad laminate 10 is manufactured, the thickness of the carrier foil may exceed 15 μm. When a metal foil with a carrier foil having a carrier foil with a thickness of more than 15 μm is laminated to the insulating layer 11, the metal foil with a carrier foil is then applied before the via hole forming step (before black oxidation treatment when performing black oxidation treatment). What is necessary is just to make thickness of the carrier foil 13 thin by half etching etc. so that thickness may be set to 15 micrometers or less.
(4)接合界面層
本件発明では、当該両面金属張積層体10において、上記キャリア箔13と、上記金属箔層12との間に、前記キャリア箔13を前記金属箔層12から剥離自在に接合する接合界面層を備えることが好ましい。但し、図1においては、接合界面層の表示を省略している。 (4) Bonding interface layer In the present invention, in the double-sided metal-cladlaminate 10, the carrier foil 13 is bonded between the carrier foil 13 and the metal foil layer 12 so as to be peelable from the metal foil layer 12. It is preferable to provide a bonding interface layer. However, in FIG. 1, the display of the bonding interface layer is omitted.
本件発明では、当該両面金属張積層体10において、上記キャリア箔13と、上記金属箔層12との間に、前記キャリア箔13を前記金属箔層12から剥離自在に接合する接合界面層を備えることが好ましい。但し、図1においては、接合界面層の表示を省略している。 (4) Bonding interface layer In the present invention, in the double-sided metal-clad
接合界面層は、キャリア箔13を手作業により金属箔層12から容易に引き剥がすことができるようにすると共に、剥離されるまでの間は適度な密着強度を有することが要求される。接合界面層としては、キャリア箔13と金属箔層12とを上述した適度な密着強度で密着させることができる層であれば、特に限定されるものではないが、例えば、窒素含有化合物、硫黄含有化合物、カルボン酸類等の有機剤により形成された有機接合界面層であることが好ましい。
The bonding interface layer is required to allow the carrier foil 13 to be easily peeled off from the metal foil layer 12 by hand, and to have an appropriate adhesion strength until it is peeled off. The bonding interface layer is not particularly limited as long as it can adhere the carrier foil 13 and the metal foil layer 12 with the above-described appropriate adhesion strength. For example, the nitrogen-containing compound and the sulfur-containing layer can be used. An organic bonding interface layer formed with an organic agent such as a compound or carboxylic acid is preferred.
このような窒素含有化合物として、例えば、オルトトリアゾール類、アミノトリアゾール類、イミダゾール類、これらの塩、或いは誘導体などを挙げることができる。特に、オルソトリアゾール類であるカルボキシベンゾトリアゾール、アミノトリアゾール類である3-アミノ-1H-1,2,4-トリアゾール、トリアゾール誘導体であるN’,N’-ビス(ベンゾトリアゾリルメチル)ユリアを挙げることができる。これらのいずれか一種以上を用いて窒素含有化合物からなる有機接合界面層を形成することができる。
Examples of such nitrogen-containing compounds include orthotriazoles, aminotriazoles, imidazoles, their salts, and derivatives. In particular, orthotriazoles such as carboxybenzotriazole, aminotriazoles such as 3-amino-1H-1,2,4-triazole, and triazole derivatives N ′, N′-bis (benzotriazolylmethyl) urea Can be mentioned. Any one or more of these can be used to form an organic bonding interface layer made of a nitrogen-containing compound.
有機接合界面層を形成する硫黄含有化合物として、例えば、チアゾール、メルカプトベンゾチアゾール、ジベンゾアジルジスルフィド、メルカプトベンゾチアゾールのシクロヘキシルアミン塩、メルカプトベンゾチアゾールのジシクロヘキシルアミン塩、チオシアヌル酸および2-ベンズイミダゾールチオール等が挙げることができる。硫黄含有化合物を用いて有機接合界面層を形成する場合は、これらの中でも、特に、メルカプトベンゾチアゾールおよびチオシアヌル酸を用いることが好ましい。
Examples of the sulfur-containing compound that forms the organic bonding interface layer include thiazole, mercaptobenzothiazole, dibenzoazyl disulfide, mercaptobenzothiazole cyclohexylamine salt, mercaptobenzothiazole dicyclohexylamine salt, thiocyanuric acid and 2-benzimidazolethiol. Can be mentioned. In the case of forming an organic bonding interface layer using a sulfur-containing compound, it is particularly preferable to use mercaptobenzothiazole and thiocyanuric acid among these.
有機系接合界面を形成するカルボン酸類として、例えば高分子量カルボン酸が挙げられる。特に、モノカルボン酸を挙げることができる。特に、カルボン酸類を用いる場合は、長鎖炭化水素のモノカルボン酸である脂肪酸を用いることが好ましい。脂肪酸は飽和脂肪酸であってもよいが、特に、オレイン酸、リノレイン酸などの不飽和脂肪酸を用いることが好ましい。
Examples of carboxylic acids that form an organic bonding interface include high molecular weight carboxylic acids. In particular, mention may be made of monocarboxylic acids. In particular, when carboxylic acids are used, it is preferable to use fatty acids that are long-chain hydrocarbon monocarboxylic acids. The fatty acid may be a saturated fatty acid, but it is particularly preferable to use an unsaturated fatty acid such as oleic acid or linolenic acid.
接合界面層は、上記有機剤を用いて形成した有機接合界面層に限らず、金属又は金属酸化物等の無機材料を用いて形成した無機接合界面層を用いてもよい。金属又は金属酸化物等としては、具体的には、クロム、ニッケル、モリブデン、タンタル、バナジウム、タングステン、コバルト、又は、これらの酸化物等を挙げることができる。しかしながら、これらの無機接合界面層と比較すると、有機接合界面層を採用した方がキャリア箔13の物理的な引き剥がし特性が安定するため、有機接合界面層を採用することが好ましい。
The bonding interface layer is not limited to the organic bonding interface layer formed using the organic agent, but may be an inorganic bonding interface layer formed using an inorganic material such as a metal or metal oxide. Specific examples of the metal or metal oxide include chromium, nickel, molybdenum, tantalum, vanadium, tungsten, cobalt, and oxides thereof. However, in comparison with these inorganic bonding interface layers, the organic peeling interface layer is preferably used because the physical peeling characteristics of the carrier foil 13 are more stable.
接合界面層の厚みは、100nm以下であることが好ましく、50nm以下であることがより好ましい。いわゆるピーラブルタイプのキャリア箔付金属箔は、一般に、キャリア箔13の表面に接合界面層を設け、電解等の手法により、接合界面層上に金属を析出させて金属箔を形成する。このとき、接合界面層の厚みが100nmを超えると、特に有機系の接合界面層の場合、接合界面層上に金属箔を形成することが困難になると共に、キャリア箔13と金属箔との密着強度が低下する。従って、接合界面層の厚みは100nm以下であることが好ましい。均一な厚みの接合界面層を形成することができれば、接合界面層の厚みの下限値が限定されるものではない。しかしながら、1nm未満になると、均一な厚みで接合界面層を形成することが困難になり、厚みにバラツキが生じるようになる。このため、接合界面層の厚みは1nm以上であることが好ましく、2nm以上であることがより好ましい。
The thickness of the bonding interface layer is preferably 100 nm or less, and more preferably 50 nm or less. A so-called peelable metal foil with a carrier foil is generally formed by providing a bonding interface layer on the surface of the carrier foil 13 and depositing metal on the bonding interface layer by a technique such as electrolysis. At this time, if the thickness of the bonding interface layer exceeds 100 nm, particularly in the case of an organic bonding interface layer, it becomes difficult to form a metal foil on the bonding interface layer, and the carrier foil 13 and the metal foil are adhered to each other. Strength decreases. Therefore, the thickness of the bonding interface layer is preferably 100 nm or less. If the joint interface layer having a uniform thickness can be formed, the lower limit value of the thickness of the joint interface layer is not limited. However, when the thickness is less than 1 nm, it becomes difficult to form the bonding interface layer with a uniform thickness, and the thickness varies. For this reason, the thickness of the bonding interface layer is preferably 1 nm or more, and more preferably 2 nm or more.
なお、当該両面金属張積層体10において、キャリア箔13と接合界面層との間、若しくは、接合界面層と金属箔層12との間に耐熱金属層(図示略)を設けてもよい。そして、当該両面金属張積層体10を、絶縁層11の両面に、それぞれ絶縁層11側から順に、金属箔層12/接合界面層/耐熱金属層/キャリア箔13、又は、金属箔層12/耐熱金属層/接合界面層/キャリア箔13の層構成を備えた積層体とすることも好ましい。
In the double-sided metal-clad laminate 10, a heat-resistant metal layer (not shown) may be provided between the carrier foil 13 and the bonding interface layer, or between the bonding interface layer and the metal foil layer 12. Then, the double-sided metal-clad laminate 10 is placed on both sides of the insulating layer 11 in order from the insulating layer 11 side, respectively, metal foil layer 12 / bonding interface layer / heat-resistant metal layer / carrier foil 13 or metal foil layer 12 / It is also preferable to use a laminate having a layer structure of a heat-resistant metal layer / bonding interface layer / carrier foil 13.
(5)両面金属張積層体10の製造方法
当該両面金属張積層体10の製造工程では、絶縁層11に対してキャリア箔13を金属箔層12の外側に備える上記両面金属張積層体10を得ることができれば、その製造方法は特に限定されるものではない。例えば、いわゆるBステージの上記絶縁樹脂基材、或いは、上記絶縁樹脂層の両面にそれぞれキャリア箔付金属箔の金属箔側を積層し、加熱加圧することにより絶縁層11としての絶縁樹脂基材又は絶縁樹脂層の両面にそれぞれ金属箔層12、キャリア箔13が当該順序で積層された上記両面金属張積層体10を得ることができる。このとき、キャリア箔付金属箔として、キャリア箔を備えた樹脂層付金属箔或いは接着剤層付金属箔を用いてもよく、その具体的な積層工程は何ら限定されるものではない。 (5) Manufacturing method of double-sided metal-cladlaminate 10 In the manufacturing process of the double-sided metal-clad laminate 10, the double-sided metal-clad laminate 10 including the carrier foil 13 on the outside of the metal foil layer 12 with respect to the insulating layer 11 If it can be obtained, the production method is not particularly limited. For example, the insulating resin base material of the so-called B stage, or the insulating resin base material as the insulating layer 11 by laminating the metal foil side of the metal foil with carrier foil on both surfaces of the insulating resin layer, respectively, The double-sided metal-clad laminate 10 in which the metal foil layer 12 and the carrier foil 13 are laminated in this order on both surfaces of the insulating resin layer can be obtained. At this time, a metal foil with a resin layer or a metal foil with an adhesive layer provided with a carrier foil may be used as the metal foil with a carrier foil, and the specific lamination process is not limited at all.
当該両面金属張積層体10の製造工程では、絶縁層11に対してキャリア箔13を金属箔層12の外側に備える上記両面金属張積層体10を得ることができれば、その製造方法は特に限定されるものではない。例えば、いわゆるBステージの上記絶縁樹脂基材、或いは、上記絶縁樹脂層の両面にそれぞれキャリア箔付金属箔の金属箔側を積層し、加熱加圧することにより絶縁層11としての絶縁樹脂基材又は絶縁樹脂層の両面にそれぞれ金属箔層12、キャリア箔13が当該順序で積層された上記両面金属張積層体10を得ることができる。このとき、キャリア箔付金属箔として、キャリア箔を備えた樹脂層付金属箔或いは接着剤層付金属箔を用いてもよく、その具体的な積層工程は何ら限定されるものではない。 (5) Manufacturing method of double-sided metal-clad
1-2.黒色酸化処理工程
次に、黒色酸化処理工程について説明する。本件発明では、バイアホール形成工程に先立って、上記両面金属張積層体10の表面、すなわちキャリア箔13の表面に対して黒色酸化処理(黒化処理)を施す黒色酸化処理工程を行うことが好ましい。キャリア箔13は、上述のとおり、金属箔からなる箔である。このため、レーザ光をキャリア箔13の表面に照射すると、レーザ光が反射し、レーザ光の初期吸収効率が悪く、バイアホールの形成速度が遅くなる。このため、バイアホール形成工程を行う前に、キャリア箔13の表面に対して黒色酸化処理(黒化処理)を施すことが好ましい。当該黒色酸化処理を施すことにより、キャリア箔13の表面が粗化されると共に黒色化、若しくは褐色化する。これにより、キャリア箔13の表面におけるレーザ光の初期吸収効率を向上させることができ、次工程であるバイアホール形成工程において、レーザ加工により、効率よく有底バイアホール20を効率よく形成することが可能になる。 1-2. Next, the black oxidation treatment process will be described. In the present invention, prior to the via hole forming step, it is preferable to perform a black oxidation treatment step of performing black oxidation treatment (blackening treatment) on the surface of the double-sided metal-cladlaminate 10, that is, the surface of the carrier foil 13. . The carrier foil 13 is a foil made of a metal foil as described above. For this reason, when the surface of the carrier foil 13 is irradiated with laser light, the laser light is reflected, the initial absorption efficiency of the laser light is poor, and the formation speed of the via hole is slow. For this reason, it is preferable to perform black oxidation treatment (blackening treatment) on the surface of the carrier foil 13 before performing the via hole forming step. By performing the black oxidation treatment, the surface of the carrier foil 13 is roughened and blackened or browned. Thereby, the initial absorption efficiency of the laser beam on the surface of the carrier foil 13 can be improved, and the bottomed via hole 20 can be efficiently formed by laser processing in the via hole forming process which is the next process. It becomes possible.
次に、黒色酸化処理工程について説明する。本件発明では、バイアホール形成工程に先立って、上記両面金属張積層体10の表面、すなわちキャリア箔13の表面に対して黒色酸化処理(黒化処理)を施す黒色酸化処理工程を行うことが好ましい。キャリア箔13は、上述のとおり、金属箔からなる箔である。このため、レーザ光をキャリア箔13の表面に照射すると、レーザ光が反射し、レーザ光の初期吸収効率が悪く、バイアホールの形成速度が遅くなる。このため、バイアホール形成工程を行う前に、キャリア箔13の表面に対して黒色酸化処理(黒化処理)を施すことが好ましい。当該黒色酸化処理を施すことにより、キャリア箔13の表面が粗化されると共に黒色化、若しくは褐色化する。これにより、キャリア箔13の表面におけるレーザ光の初期吸収効率を向上させることができ、次工程であるバイアホール形成工程において、レーザ加工により、効率よく有底バイアホール20を効率よく形成することが可能になる。 1-2. Next, the black oxidation treatment process will be described. In the present invention, prior to the via hole forming step, it is preferable to perform a black oxidation treatment step of performing black oxidation treatment (blackening treatment) on the surface of the double-sided metal-clad
黒色酸化処理の方法は、特に限定されるものではなく、多層プリント配線板の積層工程等において、接着性を向上するための前処理等として行われる黒色酸化処理と同様の方法を採用することができる。上記キャリア箔13を両面に備える両面金属張積層体10を黒色酸化処理溶液に一定時間浸漬することにより、キャリア箔13の表面に酸化第一銅被膜、酸化第二銅被膜、或いは、酸化第一銅と酸化第二銅の混合被膜を形成する。このとき、キャリア箔13の表面には酸化第一銅粒又は酸化第二銅粒が形成されるため、キャリア箔13の表面が粗化され、これと共に、キャリア箔13の表面が酸化第一銅又は酸化第二銅により黒色或いは褐色を呈する。その後、還元処理を施し、酸化銅を銅に還元する還元黒色酸化処理を施してもよい。
The method of the black oxidation treatment is not particularly limited, and a method similar to the black oxidation treatment performed as a pretreatment for improving adhesiveness in the lamination process of the multilayer printed wiring board may be adopted. it can. By immersing the double-sided metal-clad laminate 10 having the carrier foil 13 on both sides in a black oxidation treatment solution for a certain time, a cuprous oxide film, a cupric oxide film, or a first oxide film is formed on the surface of the carrier foil 13. A mixed film of copper and cupric oxide is formed. At this time, since cuprous oxide grains or cupric oxide grains are formed on the surface of the carrier foil 13, the surface of the carrier foil 13 is roughened, and the surface of the carrier foil 13 is cuprous oxide. Or it becomes black or brown with cupric oxide. Thereafter, a reduction treatment may be performed, and a reduction black oxidation treatment for reducing copper oxide to copper may be performed.
1-3.バイアホール形成工程
バイアホール形成工程では、上述したとおり、絶縁層11の両面に、15μm以下の厚みのキャリア箔13を有する金属箔層12が設けられた両面金属張積層体10に対して、片面側のキャリア箔13(13a)の表面にレーザを照射して、他面側の金属箔層12(12b)を底部21とする有底バイアホール20を形成する。 1-3. Via hole forming step In the via hole forming step, as described above, one side of the double-sided metal-cladlaminate 10 in which the metal foil layer 12 having the carrier foil 13 having a thickness of 15 μm or less is provided on both sides of the insulating layer 11. The surface of the carrier foil 13 (13a) on the side is irradiated with laser to form a bottomed via hole 20 having the bottom side 21 as the metal foil layer 12 (12b) on the other side.
バイアホール形成工程では、上述したとおり、絶縁層11の両面に、15μm以下の厚みのキャリア箔13を有する金属箔層12が設けられた両面金属張積層体10に対して、片面側のキャリア箔13(13a)の表面にレーザを照射して、他面側の金属箔層12(12b)を底部21とする有底バイアホール20を形成する。 1-3. Via hole forming step In the via hole forming step, as described above, one side of the double-sided metal-clad
当該工程において形成する有底バイアホール20の孔径は、40μm~150μmであることが好ましい。本件発明では、上述したとおり、厚みの薄い金属箔層12を用いて微細な配線パターンを有するプリント配線板を製造するため、有底バイアホール20の孔径が小さい方が配線密度の高い配線回路を得ることができる。
The hole diameter of the bottomed via hole 20 formed in the step is preferably 40 μm to 150 μm. In the present invention, as described above, in order to manufacture a printed wiring board having a fine wiring pattern using the thin metal foil layer 12, a wiring circuit having a higher wiring density is required when the hole diameter of the bottomed via hole 20 is smaller. Obtainable.
当該工程で用いるレーザの種類は、特に限定されるものではなく、炭酸ガスレーザ、アルゴンレーザ、エキシマレーザ、YAGレーザ等を用いることができる。また、レーザの照射条件は、当該両面金属張積層体10の厚み、絶縁層11等の材質を考慮して適宜、適切な条件とすることができる。
The type of laser used in the process is not particularly limited, and a carbon dioxide laser, an argon laser, an excimer laser, a YAG laser, or the like can be used. Further, the laser irradiation conditions can be appropriately set appropriately in consideration of the thickness of the double-sided metal-clad laminate 10 and the material of the insulating layer 11 and the like.
本件発明では、レーザが照射される側(片面側)の金属箔層12についても、キャリア箔13を設けた上で、当該両面金属張積層体10に対して、片面側のキャリア箔13(13a)の表面にレーザを照射して、他面側の金属箔層12(12b)を底部21とする有底バイアホール20を形成し、その後、後述するキャリア箔剥離工程においてキャリア箔13を剥離する方法を採用している。すなわち、底部21となる他面側の金属箔層12(12b)の表面だけではなく、レーザが照射される片面側の金属箔層12(12a)の表面にもキャリア箔13(13a)を設けることにより、両面金属張積層体10の厚み(但し、キャリア箔13の厚みを除く)が薄い場合でも、当該両面金属張積層体10に反りが生じるのを防止することができる。また、両面に設けられたキャリア箔13によりその厚みが増加するため、両面金属張積層体10の剛性を上げることもできる。これらのことにより、平坦な反りのない状態の両面金属張積層体10に対して有底バイアホール20を形成することができるため、両面金属張積層体10の面内に複数の有底バイアホール20を形成する場合であっても、その孔径や孔形状にバラツキが生じるのを防止することができる。また、レーザ照射により孔(20)の周囲に堆積したスプラッシュを、キャリア箔剥離工程においてキャリア箔13と共に剥離することができるため、孔の周囲を平坦にすることができる。
In the present invention, the metal foil layer 12 on the laser irradiation side (single side) is also provided with the carrier foil 13 and then the carrier foil 13 (13a on the single side with respect to the double-sided metal-clad laminate 10 is provided. ) Is irradiated with a laser to form a bottomed via hole 20 having the metal foil layer 12 (12b) on the other side as the bottom 21, and then the carrier foil 13 is peeled in a carrier foil peeling step to be described later. The method is adopted. That is, the carrier foil 13 (13a) is provided not only on the surface of the metal foil layer 12 (12b) on the other surface side which becomes the bottom 21 but also on the surface of the metal foil layer 12 (12a) on the one surface side irradiated with the laser. Thereby, even when the thickness of the double-sided metal-clad laminate 10 (excluding the thickness of the carrier foil 13) is thin, it is possible to prevent the double-sided metal-clad laminate 10 from warping. Moreover, since the thickness increases by the carrier foil 13 provided on both surfaces, the rigidity of the double-sided metal-clad laminate 10 can be increased. Accordingly, the bottomed via hole 20 can be formed in the flat double-sided metal-clad laminate 10 without warping, so that a plurality of bottomed via-holes are formed in the plane of the double-sided metal-clad laminate 10. Even when 20 is formed, it is possible to prevent variations in the hole diameter and hole shape. Moreover, since the splash deposited around the hole (20) by laser irradiation can be peeled off together with the carrier foil 13 in the carrier foil peeling step, the circumference of the hole can be made flat.
1-4.めっき工程
有底バイアホールを形成した後、片面側の金属箔層12(12a)と他面側の金属箔層12(12b)との導通を図るため、有底バイアホール20内に層間接続用のめっき処理を施し、めっき皮膜22を形成することが好ましい。当該めっき処理に際して、片面側の金属箔層12(12a)と他面側の金属箔層12(12b)との導通を図ることができれば、どのような金属をめっき析出させてもよいが、電気的接続信頼性の観点から、一般に、銅めっき又は銅合金めっきを行うことが好ましい。 1-4. Plating step After forming the bottomed via hole, for the purpose of electrical connection between the metal foil layer 12 (12a) on one side and the metal foil layer 12 (12b) on the other side, an interlayer connection is provided in the bottomed viahole 20 The plating film 22 is preferably formed by performing the plating process. In the plating process, any metal may be deposited as long as electrical connection between the metal foil layer 12 (12a) on one side and the metal foil layer 12 (12b) on the other side can be achieved. In general, it is preferable to perform copper plating or copper alloy plating from the viewpoint of reliable connection reliability.
有底バイアホールを形成した後、片面側の金属箔層12(12a)と他面側の金属箔層12(12b)との導通を図るため、有底バイアホール20内に層間接続用のめっき処理を施し、めっき皮膜22を形成することが好ましい。当該めっき処理に際して、片面側の金属箔層12(12a)と他面側の金属箔層12(12b)との導通を図ることができれば、どのような金属をめっき析出させてもよいが、電気的接続信頼性の観点から、一般に、銅めっき又は銅合金めっきを行うことが好ましい。 1-4. Plating step After forming the bottomed via hole, for the purpose of electrical connection between the metal foil layer 12 (12a) on one side and the metal foil layer 12 (12b) on the other side, an interlayer connection is provided in the bottomed via
当該めっき工程では、例えば、有底バイアホール20内の残存樹脂をデスミア処理等により除去し、定法に従い、無電解銅めっきを行った後、電解銅めっきを行い、必要な厚みのめっき層を有底バイアホール20内に形成する。このとき、有底バイアホール20の孔壁面23に追従して、めっき皮膜22が一定の厚みを有するように形成されたいわゆるコンフォーマルめっきを行ってもよいし、有底バイアホール20の孔の内部にめっき析出させた金属を充填するいわゆる充填めっきを行ってもよい。なお、図1には、有底バイアホール20に対して充填めっきを施した場合を例示している。
In the plating step, for example, the residual resin in the bottomed via hole 20 is removed by desmear treatment or the like, and after performing electroless copper plating according to a conventional method, electrolytic copper plating is performed to provide a plating layer having a necessary thickness. It is formed in the bottom via hole 20. At this time, following the hole wall surface 23 of the bottomed via hole 20, so-called conformal plating in which the plating film 22 has a certain thickness may be performed, or the hole of the bottomed via hole 20 may be formed. You may perform what is called filling plating which fills the metal which carried out plating precipitation inside. FIG. 1 illustrates a case where filling plating is performed on the bottomed via hole 20.
なお、当該めっき工程は、バイアホール形成工程の後であれば、後述するように、キャリア箔剥離工程の後に行ってもよい。また、本件発明において当該めっき工程は任意の工程であり、片面側の金属箔層12(12a)と他面側の金属箔層12(12b)との導通を図ることができれば、必ずしもめっき工程を設ける必要はない。例えば、有底バイアホール20内に導電性ペーストを充填することにより、片面側の金属箔層12(12a)と他面側の金属箔層12(12b)との導通を図ってもよい。
In addition, if the said plating process is after a via hole formation process, you may perform after a carrier foil peeling process so that it may mention later. In the present invention, the plating step is an optional step, and the plating step is not necessarily performed as long as conduction between the metal foil layer 12 (12a) on one side and the metal foil layer 12 (12b) on the other side can be achieved. There is no need to provide it. For example, the bottomed via hole 20 may be filled with a conductive paste to achieve conduction between the metal foil layer 12 (12a) on one side and the metal foil layer 12 (12b) on the other side.
1-5.キャリア箔剥離工程
当該キャリア箔剥離工程では、上記両面金属張積層体10の両面に設けられた各キャリア箔13を各金属箔層12の表面から剥離する。これにより、レーザ照射により、有底バイアホール20の孔の周囲に堆積したスプラッシュを、キャリア箔13と共に剥離することができるため、孔の周囲を平坦にすることができる。また、本実施の形態のように、上記めっき工程の後に当該キャリア箔剥離工程を行えば、キャリア箔13と共にキャリア箔13上に形成されためっき皮膜22を剥離することができる。めっき工程の後にキャリア箔13を剥離しても、有底バイアホール20内のめっき皮膜22は残存し、片面側の金属箔層12(12a)と他面側の金属箔層12(12b)との導通を図ることができる。
ここで、通常の手法では、キャリア箔13を剥離した後に、層間導通を図るためのめっき工程を行う。この場合、金属箔層12の表面にもめっき被膜が形成されるため、導体層の厚さがめっき皮膜の分だけ厚くなる。また、金属箔層12の表面にめっき析出させた場合、面内におけるめっきの析出速度にバラツキが生じるため、めっき被膜の厚みにバラツキが生じる。そのため、エッチングにより配線回路を形成する際、オーバーエッチング量を多くする必要がある。これに対して、めっき工程を行った後に、キャリア箔剥離工程を行えば、金属箔層12自体が導体層となるため、その厚みも均一であり、オーバーエッチング量を少なくすることができるため、設計通りの回路幅で配線パターンを形成することができる。サブトラクティブ法により配線回路を形成する際には、微細な配線回路を良好なエッチングファクタで得ることができるという観点から、当該実施の形態のようにめっき工程の後にキャリア箔剥離工程を行うことが好ましい。 1-5. Carrier foil peeling step In the carrier foil peeling step, eachcarrier foil 13 provided on both surfaces of the double-sided metal-clad laminate 10 is peeled from the surface of each metal foil layer 12. Thereby, since the splash deposited around the hole of the bottomed via hole 20 by the laser irradiation can be peeled off together with the carrier foil 13, the periphery of the hole can be flattened. Moreover, if the said carrier foil peeling process is performed after the said plating process like this Embodiment, the plating film 22 formed on the carrier foil 13 with the carrier foil 13 can be peeled. Even if the carrier foil 13 is peeled after the plating step, the plating film 22 in the bottomed via hole 20 remains, and the metal foil layer 12 (12a) on one side and the metal foil layer 12 (12b) on the other side Can be conducted.
Here, in a normal method, after thecarrier foil 13 is peeled off, a plating process for achieving interlayer conduction is performed. In this case, since a plating film is also formed on the surface of the metal foil layer 12, the thickness of the conductor layer is increased by the amount of the plating film. In addition, when plating is deposited on the surface of the metal foil layer 12, the plating deposition rate in the surface varies, and therefore the plating film thickness varies. Therefore, it is necessary to increase the amount of overetching when forming a wiring circuit by etching. On the other hand, if the carrier foil peeling step is performed after performing the plating step, the metal foil layer 12 itself becomes a conductor layer, the thickness thereof is uniform, and the amount of overetching can be reduced. A wiring pattern can be formed with a designed circuit width. When forming a wiring circuit by the subtractive method, a carrier foil peeling step may be performed after the plating step as in the present embodiment from the viewpoint that a fine wiring circuit can be obtained with a good etching factor. preferable.
当該キャリア箔剥離工程では、上記両面金属張積層体10の両面に設けられた各キャリア箔13を各金属箔層12の表面から剥離する。これにより、レーザ照射により、有底バイアホール20の孔の周囲に堆積したスプラッシュを、キャリア箔13と共に剥離することができるため、孔の周囲を平坦にすることができる。また、本実施の形態のように、上記めっき工程の後に当該キャリア箔剥離工程を行えば、キャリア箔13と共にキャリア箔13上に形成されためっき皮膜22を剥離することができる。めっき工程の後にキャリア箔13を剥離しても、有底バイアホール20内のめっき皮膜22は残存し、片面側の金属箔層12(12a)と他面側の金属箔層12(12b)との導通を図ることができる。
ここで、通常の手法では、キャリア箔13を剥離した後に、層間導通を図るためのめっき工程を行う。この場合、金属箔層12の表面にもめっき被膜が形成されるため、導体層の厚さがめっき皮膜の分だけ厚くなる。また、金属箔層12の表面にめっき析出させた場合、面内におけるめっきの析出速度にバラツキが生じるため、めっき被膜の厚みにバラツキが生じる。そのため、エッチングにより配線回路を形成する際、オーバーエッチング量を多くする必要がある。これに対して、めっき工程を行った後に、キャリア箔剥離工程を行えば、金属箔層12自体が導体層となるため、その厚みも均一であり、オーバーエッチング量を少なくすることができるため、設計通りの回路幅で配線パターンを形成することができる。サブトラクティブ法により配線回路を形成する際には、微細な配線回路を良好なエッチングファクタで得ることができるという観点から、当該実施の形態のようにめっき工程の後にキャリア箔剥離工程を行うことが好ましい。 1-5. Carrier foil peeling step In the carrier foil peeling step, each
Here, in a normal method, after the
1-6.配線回路形成工程
配線回路形成工程では、上記キャリア箔13が引き剥がされた後の両面金属張積層体10に対して、例えば、形成すべき配線回路に対応するレジストパターンを金属箔層12上に形成し、エッチングを施す等の従来公知の方法により、配線回路を形成することができる。 1-6. Wiring circuit forming step In the wiring circuit forming step, for example, a resist pattern corresponding to the wiring circuit to be formed is formed on themetal foil layer 12 on the double-sided metal-clad laminate 10 after the carrier foil 13 is peeled off. A wiring circuit can be formed by a conventionally known method such as forming and etching.
配線回路形成工程では、上記キャリア箔13が引き剥がされた後の両面金属張積層体10に対して、例えば、形成すべき配線回路に対応するレジストパターンを金属箔層12上に形成し、エッチングを施す等の従来公知の方法により、配線回路を形成することができる。 1-6. Wiring circuit forming step In the wiring circuit forming step, for example, a resist pattern corresponding to the wiring circuit to be formed is formed on the
なお、上記説明したプリント配線板の製造方法は、本件発明の一態様であり、本件発明の趣旨を逸脱しない範囲において適宜変更可能なのは勿論である。本件発明では、上述したバイアホール形成工程の後に、キャリア箔剥離工程が行われるのであれば、他の工程を行う順序、これらの工程の前後等に行う処理の種類に特に限定はなく、製造プリント配線板に要求される電気的特性等に応じて、適宜、各種の処理を施すことができる。例えば、図2に示すように、(a)バイアホール形成工程の後に、(b)キャリア箔剥離工程を行い、その後(c)めっき工程を行ってもよい。この場合、金属箔層12(12a)の表面にもめっき皮膜22を形成することができる。
In addition, the manufacturing method of the printed wiring board demonstrated above is one aspect | mode of this invention, Of course, it can change suitably in the range which does not deviate from the meaning of this invention. In the present invention, if the carrier foil peeling step is performed after the above-described via hole forming step, there is no particular limitation on the order of performing other steps, the type of processing performed before and after these steps, and the production print Various treatments can be appropriately performed according to the electrical characteristics required of the wiring board. For example, as shown in FIG. 2, (b) a carrier foil peeling step may be performed after the via hole forming step, and then (c) a plating step may be performed. In this case, the plating film 22 can also be formed on the surface of the metal foil layer 12 (12a).
また、上記両面金属張積層体10の製造工程において、15μmを超える厚みのキャリア箔を備えたキャリア箔付金属箔を絶縁層11に張り合わせた場合は、バイアホール形成工程の前に、その厚みが15μm以下になるようにハーフエッチング等によりキャリア箔13の厚みが薄くなるようにすればよいと述べたが、この場合に限らず、15μm以下のキャリア箔を備えたキャリア箔付金属箔を絶縁層11に張り合わせた場合であっても、上記範囲内において、キャリア箔13の厚みが所望の厚みとなるように、同様の手法でその厚みを削減してもよいのは勿論である。
Moreover, in the manufacturing process of the double-sided metal-clad laminate 10, when a metal foil with a carrier foil provided with a carrier foil having a thickness exceeding 15 μm is bonded to the insulating layer 11, the thickness is increased before the via hole forming process. Although it has been described that the thickness of the carrier foil 13 may be reduced by half etching or the like so as to be 15 μm or less, the present invention is not limited thereto, and the metal foil with carrier foil provided with the carrier foil of 15 μm or less is used as the insulating layer. Even in the case of bonding to 11, the thickness of the carrier foil 13 may be reduced by the same method so that the thickness of the carrier foil 13 becomes a desired thickness within the above range.
2.プリント配線板
次に、本件発明に係るプリント配線板について説明する。本件発明に係るプリント配線板は、上述したプリント配線板の製造方法により得られたものであり、図1(d)又は図2(c)に示すように、キャリア箔13を両面に備えた状態で有底バイアホール20が形成された後に、キャリア箔13を剥離することにより得られた3層構造を層構成に含むもの(配線パターンが形成されたものを含む)であれば、いかなる構成であってもよい。例えば、両面プリント配線板であってもよいし、配線パターンが形成された当該両面金属張積層体10に対して、さらにビルドアップ層を積層した多層プリント配線板であってもよい。 2. Next, the printed wiring board according to the present invention will be described. The printed wiring board according to the present invention is obtained by the above-described method for manufacturing a printed wiring board, and has acarrier foil 13 on both sides as shown in FIG. 1 (d) or FIG. 2 (c). After the bottomed via hole 20 is formed, any structure can be used as long as the layer structure includes a three-layer structure obtained by peeling the carrier foil 13 (including a wiring pattern formed). There may be. For example, it may be a double-sided printed wiring board, or a multilayer printed wiring board in which a build-up layer is further laminated on the double-sided metal-clad laminate 10 on which a wiring pattern is formed.
次に、本件発明に係るプリント配線板について説明する。本件発明に係るプリント配線板は、上述したプリント配線板の製造方法により得られたものであり、図1(d)又は図2(c)に示すように、キャリア箔13を両面に備えた状態で有底バイアホール20が形成された後に、キャリア箔13を剥離することにより得られた3層構造を層構成に含むもの(配線パターンが形成されたものを含む)であれば、いかなる構成であってもよい。例えば、両面プリント配線板であってもよいし、配線パターンが形成された当該両面金属張積層体10に対して、さらにビルドアップ層を積層した多層プリント配線板であってもよい。 2. Next, the printed wiring board according to the present invention will be described. The printed wiring board according to the present invention is obtained by the above-described method for manufacturing a printed wiring board, and has a
次に、実施例および比較例を示して本件発明を具体的に説明する。但し、本件発明は以下の実施例に限定されるものではない。
Next, the present invention will be specifically described with reference to examples and comparative examples. However, the present invention is not limited to the following examples.
実施例では、12μm厚さのキャリア銅箔(13)にカルボキシベンゾトリアゾールを用いた有機接合界面層を介して、3μm厚さの銅箔(12)が剥離自在に設けられたキャリア箔付銅箔を用意した。当該キャリア箔付銅箔の銅箔側を張り合わせ面とし、その表面に対して粗化処理を施した。そして、50μm厚さのプリプレグ(絶縁層11)の両面にそれぞれ当該キャリア箔付銅箔を積層し、加熱加圧することにより、両面にキャリア箔(13)を備えた両面銅張積層体(10)を得た。当該両面銅張積層体を150mm×150mmの大きさにカットし、キャリア箔の表面に黒色酸化処理を施したものを用意した。
In Examples, a copper foil with a carrier foil in which a copper foil (12) having a thickness of 3 μm is provided on a carrier copper foil (13) having a thickness of 12 μm through an organic bonding interface layer using carboxybenzotriazole. Prepared. The copper foil side of the copper foil with carrier foil was used as a laminating surface, and the surface was roughened. And the copper foil with a carrier foil is laminated | stacked on both surfaces of a 50 micrometer-thick prepreg (insulating layer 11), respectively, and the double-sided copper clad laminated body (10) provided with carrier foil (13) on both surfaces by heat-pressing. Got. The double-sided copper clad laminate was cut into a size of 150 mm × 150 mm, and a black foil was applied to the surface of the carrier foil.
[比較例1]
比較例1の試料として、黒色酸化処理を施す前に、レーザを照射する側のキャリア箔を銅箔の表面から引き剥がした以外は実施例と同様にして、他面側にのみキャリア箔を備えた両面銅張積層体を得た。 [Comparative Example 1]
As a sample of Comparative Example 1, a carrier foil is provided only on the other surface side in the same manner as in the example except that the carrier foil on the laser irradiation side was peeled off from the surface of the copper foil before the black oxidation treatment. A double-sided copper-clad laminate was obtained.
比較例1の試料として、黒色酸化処理を施す前に、レーザを照射する側のキャリア箔を銅箔の表面から引き剥がした以外は実施例と同様にして、他面側にのみキャリア箔を備えた両面銅張積層体を得た。 [Comparative Example 1]
As a sample of Comparative Example 1, a carrier foil is provided only on the other surface side in the same manner as in the example except that the carrier foil on the laser irradiation side was peeled off from the surface of the copper foil before the black oxidation treatment. A double-sided copper-clad laminate was obtained.
[比較例2]
比較例2の試料として、黒色酸化処理を施す前に、その両面において銅箔の表面からキャリア箔を引き剥がした以外は実施例と同様にして、キャリア箔を備えない両面銅張積層体を得た。 [Comparative Example 2]
As a sample of Comparative Example 2, a double-sided copper-clad laminate without a carrier foil was obtained in the same manner as in Example except that the carrier foil was peeled off from the surface of the copper foil on both sides before the black oxidation treatment. It was.
比較例2の試料として、黒色酸化処理を施す前に、その両面において銅箔の表面からキャリア箔を引き剥がした以外は実施例と同様にして、キャリア箔を備えない両面銅張積層体を得た。 [Comparative Example 2]
As a sample of Comparative Example 2, a double-sided copper-clad laminate without a carrier foil was obtained in the same manner as in Example except that the carrier foil was peeled off from the surface of the copper foil on both sides before the black oxidation treatment. It was.
[評価]
1.評価方法
(1)反り量
上記本実施例及び比較例(比較例1及び比較例2)で得た各両面銅張積層体の常態時の反り量を測定した。反り量の測定は次のようにして行った。まず、各両面銅張積層体を平坦な観察台に載せた。そして、各両面銅張積層体の4隅(左上、左下、右上、右下)において、観察台と両面銅張積層体との間の離間距離を定規で測定し、その測定値を反り量とした。 [Evaluation]
1. Evaluation method (1) Warpage amount The warpage amount in the normal state of each double-sided copper clad laminate obtained in the above Examples and Comparative Examples (Comparative Example 1 and Comparative Example 2) was measured. The amount of warpage was measured as follows. First, each double-sided copper clad laminate was placed on a flat observation table. And in the four corners (upper left, lower left, upper right, lower right) of each double-sided copper-clad laminate, the distance between the observation table and the double-sided copper-clad laminate is measured with a ruler, and the measured value is taken as the amount of warpage. did.
1.評価方法
(1)反り量
上記本実施例及び比較例(比較例1及び比較例2)で得た各両面銅張積層体の常態時の反り量を測定した。反り量の測定は次のようにして行った。まず、各両面銅張積層体を平坦な観察台に載せた。そして、各両面銅張積層体の4隅(左上、左下、右上、右下)において、観察台と両面銅張積層体との間の離間距離を定規で測定し、その測定値を反り量とした。 [Evaluation]
1. Evaluation method (1) Warpage amount The warpage amount in the normal state of each double-sided copper clad laminate obtained in the above Examples and Comparative Examples (Comparative Example 1 and Comparative Example 2) was measured. The amount of warpage was measured as follows. First, each double-sided copper clad laminate was placed on a flat observation table. And in the four corners (upper left, lower left, upper right, lower right) of each double-sided copper-clad laminate, the distance between the observation table and the double-sided copper-clad laminate is measured with a ruler, and the measured value is taken as the amount of warpage. did.
また、本実施例及び比較例で得た各両面銅張積層体をレーザ照射台に載置したときの吸引時の反り量を測定した。レーザ照射台には無数の孔が形成されており、各孔を介して試料がレーザ照射台に密着するように吸引されているため、レーザ照射台に載置した場合の4隅の反り量は、上記観察台に載置して測定した値よりも小さい。このため、吸引時の反り量は、オートフォーカス機構を有するCCDカメラを用いて次のように測定した。まず、試料の中心にピントを合わせたときのピント位置を基準とし、0mmとした。次に試料の4隅にそれぞれCCDカメラを移動させて、4隅のピント位置をそれぞれ求めた。試料の4隅の各ピント位置と、試料の中心のピント位置との高さ方向の差を求め、これをそれぞれの反り量とした。
In addition, the amount of warpage during suction when each double-sided copper clad laminate obtained in this example and comparative example was placed on a laser irradiation stand was measured. Innumerable holes are formed in the laser irradiation table, and the sample is sucked through the holes so as to be in close contact with the laser irradiation table. The value is smaller than the value measured on the observation table. For this reason, the amount of warping during suction was measured as follows using a CCD camera having an autofocus mechanism. First, it was set to 0 mm on the basis of the focus position when focusing on the center of the sample. Next, the CCD camera was moved to each of the four corners of the sample to determine the focus positions at the four corners. The difference in the height direction between each focus position at the four corners of the sample and the focus position at the center of the sample was determined, and this was used as the amount of warpage.
(2)貫通孔の有無
上記実施例で得た各両面銅張積層体を用い、三菱電機株式会社製の炭酸ガスレーザにより、各両面銅張積層体の片面側から、ビーム径153μm、パルス幅10μs、レーザパルスエネルギー18.5mJで、レーザパルスビームを1ショット照射し、その後、エネルギー密度2MW/cm2、3MW/cm2、4MW/cm2に対して、パルス幅を3μs、5μs、7μsに変化させて、トップ径74μmの有底バイアホールを121孔形成し、他面側の銅箔層に対する貫通孔の有無を観察し、貫通孔形成比率(%)を求めた。同様に、各比較例で得た各両面銅張積層体をそれぞれ複数用い、上記炭酸ガスパルスレーザにより、ビーム径115μm、パルス幅8μs、レーザパルスエネルギー6.2mJで、各両面銅張積層体にそれぞれレーザパルスビームを1ショット照射し、その後エネルギー密度2MW/cm2、3MW/cm2、4MW/cm2に対して、パルス幅を3μs、5μs、7μsに変化させて、トップ径75.2μmのバイアホールをそれぞれ121孔形成し、他面側の銅箔層に対する貫通孔の有無を観察し、貫通孔形成比率(%)を求めた。なお、レーザ照射条件が実施例と比較例とで異なるのは、実施例の両面銅張積層体は、レーザ照射側の面にもキャリア箔が設けられているため、レーザ照射側の面にキャリア箔が設けられていない比較例の両面銅積層体よりもレーザ出力を高くしなければ、有底バイアホールを形成することができないためである。 (2) Presence or absence of through-holes Using each double-sided copper clad laminate obtained in the above example, a carbon dioxide laser manufactured by Mitsubishi Electric Corporation, from one side of each double-sided copper clad laminate, a beam diameter of 153 μm and a pulse width of 10 μs The laser pulse energy is 18.5 mJ, and one shot of the laser pulse beam is irradiated, and then the pulse width is changed to 3 μs, 5 μs, and 7 μs with respect to the energy density of 2 MW / cm 2 , 3 MW / cm 2 , and 4 MW / cm 2 . Then, 121 bottomed via holes having a top diameter of 74 μm were formed, the presence or absence of through holes with respect to the copper foil layer on the other surface side was observed, and the through hole formation ratio (%) was obtained. Similarly, a plurality of double-sided copper clad laminates obtained in the respective comparative examples were used, and each double-sided copper-clad laminate was produced with the carbon dioxide pulse laser with a beam diameter of 115 μm, a pulse width of 8 μs, and a laser pulse energy of 6.2 mJ. the laser pulse beam was 1 shot irradiated respectively, forsubsequent energy density 2MW / cm 2, 3MW / cm 2, 4MW / cm 2, the pulse width 3 [mu] s, 5 .mu.s, by changing to 7 .mu.s, the top diameter 75.2μm 121 via holes were formed, and the presence or absence of through holes with respect to the copper foil layer on the other surface side was observed to determine the through hole formation ratio (%). The laser irradiation conditions differ between the example and the comparative example because the double-sided copper clad laminate of the example is provided with a carrier foil on the laser irradiation side surface, so that the carrier on the laser irradiation side surface This is because a bottomed via hole cannot be formed unless the laser output is made higher than that of the double-sided copper laminate of the comparative example in which no foil is provided.
上記実施例で得た各両面銅張積層体を用い、三菱電機株式会社製の炭酸ガスレーザにより、各両面銅張積層体の片面側から、ビーム径153μm、パルス幅10μs、レーザパルスエネルギー18.5mJで、レーザパルスビームを1ショット照射し、その後、エネルギー密度2MW/cm2、3MW/cm2、4MW/cm2に対して、パルス幅を3μs、5μs、7μsに変化させて、トップ径74μmの有底バイアホールを121孔形成し、他面側の銅箔層に対する貫通孔の有無を観察し、貫通孔形成比率(%)を求めた。同様に、各比較例で得た各両面銅張積層体をそれぞれ複数用い、上記炭酸ガスパルスレーザにより、ビーム径115μm、パルス幅8μs、レーザパルスエネルギー6.2mJで、各両面銅張積層体にそれぞれレーザパルスビームを1ショット照射し、その後エネルギー密度2MW/cm2、3MW/cm2、4MW/cm2に対して、パルス幅を3μs、5μs、7μsに変化させて、トップ径75.2μmのバイアホールをそれぞれ121孔形成し、他面側の銅箔層に対する貫通孔の有無を観察し、貫通孔形成比率(%)を求めた。なお、レーザ照射条件が実施例と比較例とで異なるのは、実施例の両面銅張積層体は、レーザ照射側の面にもキャリア箔が設けられているため、レーザ照射側の面にキャリア箔が設けられていない比較例の両面銅積層体よりもレーザ出力を高くしなければ、有底バイアホールを形成することができないためである。 (2) Presence or absence of through-holes Using each double-sided copper clad laminate obtained in the above example, a carbon dioxide laser manufactured by Mitsubishi Electric Corporation, from one side of each double-sided copper clad laminate, a beam diameter of 153 μm and a pulse width of 10 μs The laser pulse energy is 18.5 mJ, and one shot of the laser pulse beam is irradiated, and then the pulse width is changed to 3 μs, 5 μs, and 7 μs with respect to the energy density of 2 MW / cm 2 , 3 MW / cm 2 , and 4 MW / cm 2 . Then, 121 bottomed via holes having a top diameter of 74 μm were formed, the presence or absence of through holes with respect to the copper foil layer on the other surface side was observed, and the through hole formation ratio (%) was obtained. Similarly, a plurality of double-sided copper clad laminates obtained in the respective comparative examples were used, and each double-sided copper-clad laminate was produced with the carbon dioxide pulse laser with a beam diameter of 115 μm, a pulse width of 8 μs, and a laser pulse energy of 6.2 mJ. the laser pulse beam was 1 shot irradiated respectively, for
(3)孔径及び形状のバラツキ
上記炭酸ガスパルスレーザを用い、本実施例と比較例1で得た各両面銅張積層体の片面側から、それぞれ上述の条件により各両面銅張積層体の4隅及び中央部にそれぞれレーザパルスビームを照射して、他面側の銅箔層を底部とする有底バイアホールを形成した。そして、各有底バイアホールの孔径を測定すると共に、孔の形状を観察し、孔径及び形状のバラツキを評価した。 (3) Variation in hole diameter and shape From the single-sided side of each double-sided copper clad laminate obtained in this example and Comparative Example 1 using the above-mentioned carbon dioxide pulse laser, 4 of each double-sided copper-clad laminate according to the above-mentioned conditions. The corner and the center were each irradiated with a laser pulse beam to form a bottomed via hole with the copper foil layer on the other side as the bottom. And while measuring the hole diameter of each bottomed via hole, the shape of the hole was observed and the variation in hole diameter and shape was evaluated.
上記炭酸ガスパルスレーザを用い、本実施例と比較例1で得た各両面銅張積層体の片面側から、それぞれ上述の条件により各両面銅張積層体の4隅及び中央部にそれぞれレーザパルスビームを照射して、他面側の銅箔層を底部とする有底バイアホールを形成した。そして、各有底バイアホールの孔径を測定すると共に、孔の形状を観察し、孔径及び形状のバラツキを評価した。 (3) Variation in hole diameter and shape From the single-sided side of each double-sided copper clad laminate obtained in this example and Comparative Example 1 using the above-mentioned carbon dioxide pulse laser, 4 of each double-sided copper-clad laminate according to the above-mentioned conditions. The corner and the center were each irradiated with a laser pulse beam to form a bottomed via hole with the copper foil layer on the other side as the bottom. And while measuring the hole diameter of each bottomed via hole, the shape of the hole was observed and the variation in hole diameter and shape was evaluated.
(4)有底バイアホールのトップ形状
次いで、実施例の両面銅張積層体に対して有底バイアホールを形成した後、キャリア箔を除去した後の有底バイアホールのトップ形状と、比較例1の両面銅張積層体に形成した有底バイアホールのトップ形状とを観察した。 (4) Top shape of bottomed via hole Next, after forming the bottomed via hole on the double-sided copper clad laminate of the example, the top shape of the bottomed via hole after removing the carrier foil, and a comparative example The top shape of the bottomed via hole formed in the double-sided copper-clad laminate of No. 1 was observed.
次いで、実施例の両面銅張積層体に対して有底バイアホールを形成した後、キャリア箔を除去した後の有底バイアホールのトップ形状と、比較例1の両面銅張積層体に形成した有底バイアホールのトップ形状とを観察した。 (4) Top shape of bottomed via hole Next, after forming the bottomed via hole on the double-sided copper clad laminate of the example, the top shape of the bottomed via hole after removing the carrier foil, and a comparative example The top shape of the bottomed via hole formed in the double-sided copper-clad laminate of No. 1 was observed.
2.評価結果
(1)反り量
本実施例、比較例1及び比較例2の両面銅張積層体の4隅の反り量をそれぞれ表1に示す。表1に示すように、本実施例1及び比較例2の両面銅張積層体には反りが生じなかったのに対し、キャリア箔を他面にのみ備える比較例1の両面銅張積層体では反りが生じることが確認された。これは、両面にキャリア箔を備えた両面銅張積層体から、片面側のキャリア箔のみを剥離することにより、絶縁層の両面における応力のバランスが崩れたためと考えられる。 2. Evaluation results (1) Warpage amount Table 1 shows the warpage amounts at the four corners of the double-sided copper-clad laminates of this example, comparative example 1 and comparative example 2. As shown in Table 1, the double-sided copper-clad laminate of Example 1 and Comparative Example 2 did not warp, whereas the double-sided copper-clad laminate of Comparative Example 1 provided with carrier foil only on the other side It was confirmed that warping occurred. This is presumably because the stress balance on both sides of the insulating layer was lost by peeling only the carrier foil on one side from the double-sided copper clad laminate having carrier foils on both sides.
(1)反り量
本実施例、比較例1及び比較例2の両面銅張積層体の4隅の反り量をそれぞれ表1に示す。表1に示すように、本実施例1及び比較例2の両面銅張積層体には反りが生じなかったのに対し、キャリア箔を他面にのみ備える比較例1の両面銅張積層体では反りが生じることが確認された。これは、両面にキャリア箔を備えた両面銅張積層体から、片面側のキャリア箔のみを剥離することにより、絶縁層の両面における応力のバランスが崩れたためと考えられる。 2. Evaluation results (1) Warpage amount Table 1 shows the warpage amounts at the four corners of the double-sided copper-clad laminates of this example, comparative example 1 and comparative example 2. As shown in Table 1, the double-sided copper-clad laminate of Example 1 and Comparative Example 2 did not warp, whereas the double-sided copper-clad laminate of Comparative Example 1 provided with carrier foil only on the other side It was confirmed that warping occurred. This is presumably because the stress balance on both sides of the insulating layer was lost by peeling only the carrier foil on one side from the double-sided copper clad laminate having carrier foils on both sides.
(2)貫通孔の有無
実施例、比較例1及び比較例2の両面銅張積層体に対して、レーザ加工により上記有底バイアホールを形成したときの貫通孔形成比率(%)をそれぞれ表2に示す。表2に示すようにキャリア箔を備えていない比較例2の両面銅張積層体は、レーザ出力を増大させた場合、貫通孔が形成される割合が極めて高く、このような薄い両面銅張積層体に対して有底バイアホールを歩留まりよく形成することが困難であることが確認された。一方、他面側にキャリア箔を備える本実施例及び比較例1の両面銅張積層体では、レーザ出力を増大させても貫通孔の形成を抑制する効果が高く、他面側にキャリア箔を設けることにより、当該キャリア箔をヒートシンクとして機能させて、他面側の銅箔層に貫通孔が形成されるのを抑制することができることが確認された。 (2) Presence or absence of through-holes For the double-sided copper-clad laminates of Examples, Comparative Examples 1 and 2, the through-hole formation ratio (%) when the bottomed via hole is formed by laser processing is shown. It is shown in 2. As shown in Table 2, the double-sided copper-clad laminate of Comparative Example 2 that does not have a carrier foil has a very high rate of formation of through-holes when the laser output is increased. It was confirmed that it was difficult to form a bottomed via hole in the body with a high yield. On the other hand, in the double-sided copper-clad laminates of the present example and Comparative Example 1 provided with the carrier foil on the other side, the effect of suppressing the formation of through holes is high even when the laser output is increased. By providing, it was confirmed that the carrier foil can function as a heat sink to suppress the formation of through holes in the copper foil layer on the other side.
実施例、比較例1及び比較例2の両面銅張積層体に対して、レーザ加工により上記有底バイアホールを形成したときの貫通孔形成比率(%)をそれぞれ表2に示す。表2に示すようにキャリア箔を備えていない比較例2の両面銅張積層体は、レーザ出力を増大させた場合、貫通孔が形成される割合が極めて高く、このような薄い両面銅張積層体に対して有底バイアホールを歩留まりよく形成することが困難であることが確認された。一方、他面側にキャリア箔を備える本実施例及び比較例1の両面銅張積層体では、レーザ出力を増大させても貫通孔の形成を抑制する効果が高く、他面側にキャリア箔を設けることにより、当該キャリア箔をヒートシンクとして機能させて、他面側の銅箔層に貫通孔が形成されるのを抑制することができることが確認された。 (2) Presence or absence of through-holes For the double-sided copper-clad laminates of Examples, Comparative Examples 1 and 2, the through-hole formation ratio (%) when the bottomed via hole is formed by laser processing is shown. It is shown in 2. As shown in Table 2, the double-sided copper-clad laminate of Comparative Example 2 that does not have a carrier foil has a very high rate of formation of through-holes when the laser output is increased. It was confirmed that it was difficult to form a bottomed via hole in the body with a high yield. On the other hand, in the double-sided copper-clad laminates of the present example and Comparative Example 1 provided with the carrier foil on the other side, the effect of suppressing the formation of through holes is high even when the laser output is increased. By providing, it was confirmed that the carrier foil can function as a heat sink to suppress the formation of through holes in the copper foil layer on the other side.
ここで、表2を参照すると、本実施例の両面銅張積層体の方が、比較例1の両面銅張積層体よりも貫通孔形成比率がやや高い。しかしながら、本実施例の両面銅張積層体に対して有底バイアホールを形成する際に採用したレーザ照射条件は、比較例の両面銅張積層体に対して有底バイアホールを形成する際に採用したレーザ照射条件よりも、レーザ出力が高い。このため、両者を単純に比較することはできないが、実施例の両面銅張積層体に対するレーザ照射条件の検討を行うことにより、貫通孔形成比率は低下すると考えられる。従って、レーザ照射側の面におけるキャリア箔の有無によらず、他面側にキャリア箔を設けることにより、貫通孔形成比率を有効に低下することが可能であると考える。
Here, referring to Table 2, the through hole formation ratio of the double-sided copper-clad laminate of this example is slightly higher than that of the double-sided copper-clad laminate of Comparative Example 1. However, the laser irradiation conditions adopted when forming the bottomed via hole for the double-sided copper-clad laminate of this example are the same as when forming the bottomed via-hole for the double-sided copper-clad laminate of the comparative example. The laser output is higher than the laser irradiation conditions employed. For this reason, although both cannot be compared simply, it is thought that a through-hole formation ratio falls by examining the laser irradiation conditions with respect to the double-sided copper clad laminated body of an Example. Therefore, it is considered that the through hole formation ratio can be effectively reduced by providing the carrier foil on the other surface side regardless of the presence or absence of the carrier foil on the laser irradiation side surface.
(3)孔径及び孔形状のバラツキ
表3に、本実施例及び比較例1で得た両面銅張積層体の4隅と、中央に形成された有底バイアホールの孔径をそれぞれ示す。表3に示すように、本実施例で得た両面銅張積層体に形成した有底バイアホールの孔径のバラツキは、比較例1で得た両面銅張積層体と比較すると小さいことが確認された。また、両面銅張積層体の中央に形成した有底バイアホールの孔径と、各四隅に形成した有底バイアホールの孔径との差は、反り量が大きくなる程大きくなることが確認された。また、図3は、比較例1の両面銅張積層体に形成した各有底バイアホールの表面観察写真である。図3(c)に示すように、反り量がゼロの両面銅張積層板の中央部に形成された有底バイアホールのトップ形状は略円形であるのに対して、反り量が大きい個所(左上(a)及び左下(d))に形成された有底バイアホールのトップ形状には歪みが生じていることが確認できる。一方、本実施例の両面銅張積層体は反りが小さく、四隅に形成した有底バイアホールについても、略円形を呈し、孔径及び孔の形状のバラツキが少なく、図3(c)に示す孔形状と略同じ孔形状を示すことが確認された。 (3) Variation in hole diameter and hole shape Table 3 shows the hole diameters of the bottomed via holes formed at the four corners and the center of the double-sided copper clad laminate obtained in this example and Comparative Example 1, respectively. As shown in Table 3, the variation in the hole diameter of the bottomed via hole formed in the double-sided copper clad laminate obtained in this example was confirmed to be small compared to the double-sided copper clad laminate obtained in Comparative Example 1. It was. Moreover, it was confirmed that the difference between the hole diameter of the bottomed via hole formed at the center of the double-sided copper clad laminate and the hole diameter of the bottomed via hole formed at each of the four corners increases as the warp amount increases. FIG. 3 is a surface observation photograph of each bottomed via hole formed in the double-sided copper clad laminate of Comparative Example 1. As shown in FIG.3 (c), the top shape of the bottomed via hole formed in the center part of the double-sided copper-clad laminate with zero warpage is substantially circular, while the warpage is large ( It can be confirmed that the top shapes of the bottomed via holes formed in the upper left (a) and lower left (d)) are distorted. On the other hand, the double-sided copper-clad laminate of this example has a small warp, and the bottomed via hole formed at the four corners also has a substantially circular shape with little variation in hole diameter and hole shape, and the hole shown in FIG. It was confirmed that the hole shape was almost the same as the shape.
表3に、本実施例及び比較例1で得た両面銅張積層体の4隅と、中央に形成された有底バイアホールの孔径をそれぞれ示す。表3に示すように、本実施例で得た両面銅張積層体に形成した有底バイアホールの孔径のバラツキは、比較例1で得た両面銅張積層体と比較すると小さいことが確認された。また、両面銅張積層体の中央に形成した有底バイアホールの孔径と、各四隅に形成した有底バイアホールの孔径との差は、反り量が大きくなる程大きくなることが確認された。また、図3は、比較例1の両面銅張積層体に形成した各有底バイアホールの表面観察写真である。図3(c)に示すように、反り量がゼロの両面銅張積層板の中央部に形成された有底バイアホールのトップ形状は略円形であるのに対して、反り量が大きい個所(左上(a)及び左下(d))に形成された有底バイアホールのトップ形状には歪みが生じていることが確認できる。一方、本実施例の両面銅張積層体は反りが小さく、四隅に形成した有底バイアホールについても、略円形を呈し、孔径及び孔の形状のバラツキが少なく、図3(c)に示す孔形状と略同じ孔形状を示すことが確認された。 (3) Variation in hole diameter and hole shape Table 3 shows the hole diameters of the bottomed via holes formed at the four corners and the center of the double-sided copper clad laminate obtained in this example and Comparative Example 1, respectively. As shown in Table 3, the variation in the hole diameter of the bottomed via hole formed in the double-sided copper clad laminate obtained in this example was confirmed to be small compared to the double-sided copper clad laminate obtained in Comparative Example 1. It was. Moreover, it was confirmed that the difference between the hole diameter of the bottomed via hole formed at the center of the double-sided copper clad laminate and the hole diameter of the bottomed via hole formed at each of the four corners increases as the warp amount increases. FIG. 3 is a surface observation photograph of each bottomed via hole formed in the double-sided copper clad laminate of Comparative Example 1. As shown in FIG.3 (c), the top shape of the bottomed via hole formed in the center part of the double-sided copper-clad laminate with zero warpage is substantially circular, while the warpage is large ( It can be confirmed that the top shapes of the bottomed via holes formed in the upper left (a) and lower left (d)) are distorted. On the other hand, the double-sided copper-clad laminate of this example has a small warp, and the bottomed via hole formed at the four corners also has a substantially circular shape with little variation in hole diameter and hole shape, and the hole shown in FIG. It was confirmed that the hole shape was almost the same as the shape.
(4)有底バイアホールのトップ形状
図4は、有底バイアホールを形成した後にキャリア箔を引き剥がした後の本実施例の両面銅張積層体の表面観察写真である。一方、図5は、有底バイアホールを形成した後の比較例1の両面銅張積層体の表面観察写真である。図4と図5を比較すると明らかなように、比較例1の両面銅張積層体においてはレーザ照射により孔の周囲にスプラッシュが堆積しているのに対して、本実施例の両面銅張積層体ではこの孔の周囲に堆積したスプラッシュをキャリア箔と共に剥離することができるため、孔の周囲が平坦になることが確認された。 (4) Top shape of bottomed via hole FIG. 4 is a surface observation photograph of the double-sided copper clad laminate of this example after the carrier foil was peeled off after the bottomed via hole was formed. On the other hand, FIG. 5 is a surface observation photograph of the double-sided copper-clad laminate of Comparative Example 1 after forming the bottomed via hole. As is clear from comparison between FIG. 4 and FIG. 5, in the double-sided copper clad laminate of Comparative Example 1, splash is deposited around the hole by laser irradiation, whereas the double-sided copper clad laminate of this example. In the body, it was confirmed that the splash accumulated around the hole can be peeled off together with the carrier foil, so that the periphery of the hole becomes flat.
図4は、有底バイアホールを形成した後にキャリア箔を引き剥がした後の本実施例の両面銅張積層体の表面観察写真である。一方、図5は、有底バイアホールを形成した後の比較例1の両面銅張積層体の表面観察写真である。図4と図5を比較すると明らかなように、比較例1の両面銅張積層体においてはレーザ照射により孔の周囲にスプラッシュが堆積しているのに対して、本実施例の両面銅張積層体ではこの孔の周囲に堆積したスプラッシュをキャリア箔と共に剥離することができるため、孔の周囲が平坦になることが確認された。 (4) Top shape of bottomed via hole FIG. 4 is a surface observation photograph of the double-sided copper clad laminate of this example after the carrier foil was peeled off after the bottomed via hole was formed. On the other hand, FIG. 5 is a surface observation photograph of the double-sided copper-clad laminate of Comparative Example 1 after forming the bottomed via hole. As is clear from comparison between FIG. 4 and FIG. 5, in the double-sided copper clad laminate of Comparative Example 1, splash is deposited around the hole by laser irradiation, whereas the double-sided copper clad laminate of this example. In the body, it was confirmed that the splash accumulated around the hole can be peeled off together with the carrier foil, so that the periphery of the hole becomes flat.
本件発明によれば、有底バイアホールの底部となる他面側の金属箔層の表面だけではなく、レーザが照射される片面側の金属箔層の表面にもキャリア箔を設けることにより、各層の線膨張係数の差によって片面側と他面側において生じる応力の差を小さくすることができる。このため、両面金属張積層体の厚み(但し、キャリア箔の厚みを除く)が薄い場合でも、当該両面金属張積層体に反りが生じるのを防止することができる。また、両面に設けられたキャリア箔によりその厚みが増加し、両面金属張積層体の剛性を上げることができる。これらのことにより、平坦な反りのない状態の両面金属張積層体に対して有底バイアホールを形成することができるため、両面金属張積層体の面内に複数の有底バイアホールを形成する場合であっても、孔径や孔形状にバラツキが生じるのを防止することができる。また、レーザ照射時に生じる応力や熱の影響によって、有底バイアホールを形成する際に、両面金属張積層体に反りが生じるのを防止することができる。さらに、レーザ照射により孔の周囲に堆積したスプラッシュを、キャリア箔剥離工程においてキャリア箔と共に剥離することができるため、孔の周囲を平坦にすることができる。したがって、本件発明は、厚みの薄い両面プリント配線板を製造する際に好適に用いることができる。
According to the present invention, by providing the carrier foil not only on the surface of the metal foil layer on the other surface side that becomes the bottom of the bottomed via hole, but also on the surface of the metal foil layer on the one surface side irradiated with the laser, each layer The difference in stress generated on one side and the other side can be reduced by the difference in the linear expansion coefficient. For this reason, even when the thickness of the double-sided metal-clad laminate (excluding the thickness of the carrier foil) is thin, it is possible to prevent the double-sided metal-clad laminate from warping. Moreover, the thickness increases by the carrier foil provided on both surfaces, and the rigidity of the double-sided metal-clad laminate can be increased. As a result, a bottomed via hole can be formed in a flat double-sided metal-clad laminate without warping, so a plurality of bottomed via holes are formed in the plane of the double-sided metal-clad laminate. Even in this case, it is possible to prevent variations in the hole diameter and hole shape. Further, it is possible to prevent the double-sided metal-clad laminate from being warped when the bottomed via hole is formed due to the influence of stress or heat generated during laser irradiation. Furthermore, since the splash deposited around the hole by laser irradiation can be peeled together with the carrier foil in the carrier foil peeling step, the circumference of the hole can be made flat. Therefore, the present invention can be suitably used when manufacturing a thin double-sided printed wiring board.
10・・・(両面キャリア付きの)両面銅張積層体
11・・・絶縁層
12・・・金属箔層
12a・・片面側の金属箔層
12b・・他面側の金属箔層
13・・・キャリア箔
13a・・片面側のキャリア箔
13b・・他面側のキャリア箔
20・・・有底バイアホール
21・・・底部
22・・・めっき皮膜 10 ... Double-sided copper clad laminate (with double-sided carrier) 11 ... Insulatinglayer 12 ... Metal foil layer 12a ... Metal foil layer on one side 12b ... Metal foil layer on the other side 13 ...・ Carrier foil 13a ・ ・ One side carrier foil 13b ・ ・ Other side carrier foil 20 ... Bottomed via hole 21 ... Bottom 22 ... Plating film
11・・・絶縁層
12・・・金属箔層
12a・・片面側の金属箔層
12b・・他面側の金属箔層
13・・・キャリア箔
13a・・片面側のキャリア箔
13b・・他面側のキャリア箔
20・・・有底バイアホール
21・・・底部
22・・・めっき皮膜 10 ... Double-sided copper clad laminate (with double-sided carrier) 11 ... Insulating
Claims (7)
- 200μm以下の厚みの絶縁層の両面に、金属箔層と、15μm以下の厚みのキャリア箔とを当該絶縁層側から順にそれぞれ備えた両面金属張積層体に対して、片面側のキャリア箔の表面にレーザを照射して、他面側の金属箔層を底部とする有底バイアホールを形成するバイアホール形成工程と、
有底バイアホール形成後に、各キャリア箔を各金属箔層の表面から剥離するキャリア箔剥離工程と、
を備えることを特徴とするプリント配線板の製造方法。 The surface of the carrier foil on one side with respect to the double-sided metal-clad laminate comprising a metal foil layer and a carrier foil having a thickness of 15 μm or less in order from the insulating layer side on both sides of the insulating layer having a thickness of 200 μm or less. A via hole forming step of forming a bottomed via hole with the bottom of the metal foil layer on the other side,
After forming the bottomed via hole, a carrier foil peeling step of peeling each carrier foil from the surface of each metal foil layer;
A method for manufacturing a printed wiring board, comprising: - 前記バイアホール形成工程の前に、少なくとも前記片面側のキャリア箔の表面に黒色酸化処理を施す黒色酸化処理工程を備える請求項1に記載のプリント配線板の製造方法。 The method for manufacturing a printed wiring board according to claim 1, further comprising a black oxidation treatment step of performing black oxidation treatment on at least a surface of the carrier foil on one side before the via hole forming step.
- 前記金属箔層の厚みは、7μm以下である請求項1又は請求項2に記載のプリント配線板の製造方法。 The method for manufacturing a printed wiring board according to claim 1 or 2, wherein the thickness of the metal foil layer is 7 µm or less.
- 前記両面金属張積層体は、前記キャリア箔と前記金属箔層との間に、接合界面層を備える請求項1~請求項3のいずれか一項に記載のプリント配線板の製造方法。 The method for producing a printed wiring board according to any one of claims 1 to 3, wherein the double-sided metal-clad laminate includes a bonding interface layer between the carrier foil and the metal foil layer.
- 前記接合界面層は、有機剤により形成された有機接合界面層である請求項4に記載のプリント配線板の製造方法。 The method for manufacturing a printed wiring board according to claim 4, wherein the bonding interface layer is an organic bonding interface layer formed of an organic agent.
- 前記バイアホール形成工程と、前記キャリア箔剥離工程との間に、片面の金属箔層と他面の金属箔層との導通を図るための層間接続用のめっき処理を有底バイアホール内に施すめっき工程を備える請求項1~請求項5のいずれか一項に記載のプリント配線板の製造方法。 Between the via hole forming step and the carrier foil peeling step, a plating process for interlayer connection is performed in the bottomed via hole in order to achieve conduction between the metal foil layer on one side and the metal foil layer on the other side. The method for manufacturing a printed wiring board according to any one of claims 1 to 5, further comprising a plating step.
- 請求項1~請求項6のいずれか一項に記載のプリント配線板の製造方法により得られたことを特徴とするプリント配線板。 A printed wiring board obtained by the method for producing a printed wiring board according to any one of claims 1 to 6.
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