WO2014034907A1 - 強化ガラスの加工方法 - Google Patents
強化ガラスの加工方法 Download PDFInfo
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- WO2014034907A1 WO2014034907A1 PCT/JP2013/073447 JP2013073447W WO2014034907A1 WO 2014034907 A1 WO2014034907 A1 WO 2014034907A1 JP 2013073447 W JP2013073447 W JP 2013073447W WO 2014034907 A1 WO2014034907 A1 WO 2014034907A1
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- processing
- substrate
- glass
- positioning
- base table
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- 238000003672 processing method Methods 0.000 title claims abstract description 15
- 239000006058 strengthened glass Substances 0.000 title abstract 3
- 238000012545 processing Methods 0.000 claims abstract description 282
- 239000011521 glass Substances 0.000 claims abstract description 75
- 230000002093 peripheral effect Effects 0.000 claims abstract description 17
- 239000005345 chemically strengthened glass Substances 0.000 claims abstract description 10
- 239000000758 substrate Substances 0.000 claims description 114
- 239000005341 toughened glass Substances 0.000 claims description 102
- 239000000853 adhesive Substances 0.000 claims description 78
- 239000006059 cover glass Substances 0.000 claims description 74
- 230000001070 adhesive effect Effects 0.000 claims description 72
- 238000000034 method Methods 0.000 claims description 62
- 238000012546 transfer Methods 0.000 claims description 56
- 238000005520 cutting process Methods 0.000 claims description 53
- 238000001514 detection method Methods 0.000 claims description 44
- 230000003014 reinforcing effect Effects 0.000 claims description 17
- 230000006866 deterioration Effects 0.000 claims description 13
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 8
- 238000005728 strengthening Methods 0.000 claims description 7
- 230000005284 excitation Effects 0.000 claims description 6
- 238000013459 approach Methods 0.000 claims description 3
- 238000004519 manufacturing process Methods 0.000 abstract description 7
- 238000007730 finishing process Methods 0.000 abstract description 2
- 239000000047 product Substances 0.000 description 73
- 230000008569 process Effects 0.000 description 38
- 239000010410 layer Substances 0.000 description 36
- 238000001723 curing Methods 0.000 description 26
- 239000000523 sample Substances 0.000 description 23
- 238000012360 testing method Methods 0.000 description 21
- 230000008859 change Effects 0.000 description 16
- 230000001681 protective effect Effects 0.000 description 15
- 230000004044 response Effects 0.000 description 15
- 238000002474 experimental method Methods 0.000 description 14
- 239000000463 material Substances 0.000 description 11
- 238000007639 printing Methods 0.000 description 11
- 230000000052 comparative effect Effects 0.000 description 10
- 238000011156 evaluation Methods 0.000 description 10
- 238000003754 machining Methods 0.000 description 8
- 238000003475 lamination Methods 0.000 description 7
- 230000033001 locomotion Effects 0.000 description 7
- 230000000694 effects Effects 0.000 description 6
- 238000002360 preparation method Methods 0.000 description 6
- 238000005096 rolling process Methods 0.000 description 6
- 238000003848 UV Light-Curing Methods 0.000 description 5
- 229910003460 diamond Inorganic materials 0.000 description 5
- 239000010432 diamond Substances 0.000 description 5
- 230000010355 oscillation Effects 0.000 description 5
- 230000003321 amplification Effects 0.000 description 4
- 230000003028 elevating effect Effects 0.000 description 4
- 238000000227 grinding Methods 0.000 description 4
- 238000003199 nucleic acid amplification method Methods 0.000 description 4
- 238000005070 sampling Methods 0.000 description 4
- 239000005354 aluminosilicate glass Substances 0.000 description 3
- 230000005540 biological transmission Effects 0.000 description 3
- 238000004891 communication Methods 0.000 description 3
- 238000007796 conventional method Methods 0.000 description 3
- 230000007423 decrease Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 238000005496 tempering Methods 0.000 description 3
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-M acrylate group Chemical group C(C=C)(=O)[O-] NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 2
- 230000009471 action Effects 0.000 description 2
- 238000005452 bending Methods 0.000 description 2
- 239000013068 control sample Substances 0.000 description 2
- 238000005336 cracking Methods 0.000 description 2
- 230000007246 mechanism Effects 0.000 description 2
- 239000000155 melt Substances 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 230000002787 reinforcement Effects 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000003426 chemical strengthening reaction Methods 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 239000012467 final product Substances 0.000 description 1
- 238000003384 imaging method Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 230000002452 interceptive effect Effects 0.000 description 1
- 239000005340 laminated glass Substances 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 238000007517 polishing process Methods 0.000 description 1
- 229920001690 polydopamine Polymers 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 230000008439 repair process Effects 0.000 description 1
- 238000012552 review Methods 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B1/00—Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes
- B24B1/04—Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes subjecting the grinding or polishing tools, the abrading or polishing medium or work to vibration, e.g. grinding with ultrasonic frequency
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
- B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
- B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
- B24B7/24—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding or polishing glass
- B24B7/247—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding or polishing glass using reciprocating grinding tools
- B24B7/248—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding or polishing glass using reciprocating grinding tools high-frequency reciprocating tools, e.g. magnetically driven
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B9/00—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor
- B24B9/02—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground
- B24B9/06—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain
- B24B9/08—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain of glass
- B24B9/10—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain of glass of plate glass
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D7/00—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting otherwise than only by their periphery, e.g. by the front face; Bushings or mountings therefor
- B24D7/18—Wheels of special form
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D1/00—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor
- B28D1/02—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by sawing
- B28D1/04—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by sawing with circular or cylindrical saw-blades or saw-discs
- B28D1/041—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by sawing with circular or cylindrical saw-blades or saw-discs with cylinder saws, e.g. trepanning; saw cylinders, e.g. having their cutting rim equipped with abrasive particles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D1/00—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor
- B28D1/14—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by boring or drilling
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/02—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills
- B28D5/021—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by drilling
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
- B28D5/047—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools by ultrasonic cutting
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
- C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
- C03B33/037—Controlling or regulating
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/10—Glass-cutting tools, e.g. scoring tools
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C17/00—Surface treatment of glass, not in the form of fibres or filaments, by coating
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B13/00—Adaptive control systems, i.e. systems automatically adjusting themselves to have a performance which is optimum according to some preassigned criterion
- G05B13/02—Adaptive control systems, i.e. systems automatically adjusting themselves to have a performance which is optimum according to some preassigned criterion electric
- G05B13/0205—Adaptive control systems, i.e. systems automatically adjusting themselves to have a performance which is optimum according to some preassigned criterion electric not using a model or a simulator of the controlled system
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B19/00—Programme-control systems
- G05B19/02—Programme-control systems electric
- G05B19/418—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM]
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B2219/00—Program-control systems
- G05B2219/30—Nc systems
- G05B2219/45—Nc applications
- G05B2219/45009—Glassforming
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T409/00—Gear cutting, milling, or planing
- Y10T409/30—Milling
- Y10T409/303752—Process
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T409/00—Gear cutting, milling, or planing
- Y10T409/30—Milling
- Y10T409/304312—Milling with means to dampen vibration
Definitions
- the present invention relates to a method for processing tempered glass.
- tempered glass is used for display devices such as Assistant.
- This tempered glass has a structure in which a surface tempering layer (chemical tempering layer) is provided on the surface side of the glass base material. Based on this, the tempered glass is designed to reduce the thickness of the tempered glass against bending stress and impact. High strength.
- the surface reinforced layer has a thickness of a certain thickness or more and a surface compressive stress of a predetermined value or more (for example, a surface reinforced layer of 40 ⁇ m or more, a surface compressive stress of 600 MPa or more). Since the processing is not easy, as shown in Patent Document 1, a tempered glass to be processed is prepared with a surface reinforcing layer of 30 ⁇ m or less and a surface compressive stress of 600 MPa or less.
- Patent Document 1 only the workability of tempered glass is emphasized, and with the method according to Patent Document 1, the further thinning and further strengthening that have been required recently are satisfied. I can't.
- Patent Document 2 a groove to be cut must be formed in the surface reinforcing layer, which not only increases the number of processes, but the groove to be cut can only be formed in a straight line, and processing for tempered glass is performed. Has become restrictive.
- the present inventor pays attention to a processing method for rotating a processing tool that has been recognized to be difficult to process the tempered glass as a processing method.
- the inventors found for the first time the conditions under which tempered glass itself can be processed accurately.
- the product glass as a product specifically cuts out a plurality of product base plates having a product shape from a large substrate made of tempered glass, and performs processing such as hole processing on each of the cut product base plates. Is formed.
- the present invention has been made in view of such circumstances, and an object of the present invention is to provide a method of processing tempered glass capable of shortening the time required for production of one product glass as much as possible while ensuring the quality of product glass. It is in.
- the present invention (the invention according to claim 1) Under the state of vibrating while rotating the processing tool, a processing method of tempered glass for processing the product base plate as a chemically strengthened glass having a surface strengthening layer with the processing tool, Prior to processing of the processing tool for the product base plate, the product base plate is cut out from a large substrate as a chemically strengthened glass having a surface reinforcing layer by cutting using a dicing blade, When the processing tool is processed on the product base plate, the outer peripheral surface of the product base plate is also finished.
- the preferred embodiment of claim 1 is as described in claim 2 and the following.
- a product base plate is cut out from a large plate substrate by cutting using a dicing blade, so that the large plate substrate is used with a processing tool that vibrates while rotating. Therefore, the product base plate can be cut out more quickly than when the product base plate is cut out.
- the outer periphery of the product base plate is not only used for processing such as hole processing, but with a processing tool that vibrates while rotating.
- Surface finishing can also be performed to accurately repair the outer peripheral surface of the product base plate.
- the finishing process is originally performed on the processed surface including the outer peripheral surface of the product base plate, and is not a special process. For this reason, the time required for production of one product glass can be shortened as much as possible while ensuring the quality of the product glass.
- a plurality of individual bases are arranged on the cutting base table in an aligned state with a gap, and a gap between adjacent individual bases in the cutting base table.
- the large substrate is cut with a dicing blade, so that when the plurality of product base plates are cut out from the large substrate attached to the upper surfaces of the plurality of individual bases, A simple cutting process can be repeated based on information such as the size and the pitch of the individual base on the cutting base table. For this reason, it is possible to cut out the product base plate accurately and to simplify the cutting process control.
- each individual base to which the product base plate is attached is held on the processing base table, and then the product base plate on each individual base on the processing base table is processed by a processing tool. Since the product glass is formed on each individual base, information on the size of the individual base, the pitch of the individual base on the cutting base table, etc. can be grasped in advance in this case as well. Processing can be repeated simple processing. For this reason, it is possible to accurately process the product base plate into product glass without using a high-performance and expensive camera system, and to simplify processing control.
- the plurality of individual bases in a state where the plurality of individual bases are held on the cutting base table.
- the positioning positions of the plurality of positioning portions with respect to the frame-shaped pattern group of the large board substrate that overlap with each other in a state of conforming to the above are reflected in the positioning positions of the positioning-related portions with respect to the frame-shaped pattern group of the large board substrate 1 positioned by the adjustment base table.
- the large board is placed on the adjustment base table, the plurality of alignment marks on the large board are aligned with the plurality of alignment portions, and the transfer is performed under the state.
- the transfer member is attached to the large plate substrate on the adjustment base table while maintaining the plurality of positioning related portions and the plurality of positioning participating portions in a positioned state, and the base table for cutting processing is attached thereto.
- the large plate substrate to which the transfer member is attached is cut while maintaining the state in which the plurality of positioning related portions of the transfer member and the plurality of positioning portions on the cutting base table are positioned. If attached to multiple individual bases held on the base table, the frame-like pattern group of the large board can be fitted without tilting onto the multiple individual bases held on the base table for cutting. Can be stacked. For this reason, the product base plate can be accurately cut out from the large substrate, and accordingly, generation of defective products can be prevented.
- the large board substrate is used on the cutting base table. It is only necessary to have a frame-shaped pattern group that overlaps with a plurality of individual bases and a plurality of alignment marks that have a predetermined arrangement relationship with the frame-shaped pattern group, and a base table for cutting processing As long as it has a plurality of positioning portions that have a predetermined positional relationship with respect to the frame-like pattern group of the large board that overlaps in a state of being adapted to a plurality of individual bases, A mounting surface on which the plate substrate can be mounted, a plurality of alignment portions for aligning a plurality of alignment marks on the large substrate mounted on the mounting surface, and a plurality of alignment portions on each of the plurality of alignment portions Alignment In the state where the workpiece is aligned, the positional relationship with respect to the frame-shaped pattern group of the large board substrate is a plurality of the
- the transfer member can establish a positioning relationship with respect to the plurality of positioning portions and the plurality of positioning involvement portions. What is necessary is just to have a some positioning related part. For this reason, the said method can be implemented using a cheap member. Moreover, there is no failure like a camera or sensors, and in this method, a highly durable one can be used.
- the adhesive since the adhesive is used when the transfer member is attached to the large board, the bonding operation of the transfer member to the large board and a plurality of positioning related portions of the transfer member And positioning work with each of the plurality of positioning participating portions in the adjustment base table can be performed simultaneously without interfering with each other, and workability can be improved.
- the adhesive the transfer member and the large board are integrated with a constant adhesive strength.
- the cover glass is bonded to the large board, and the transfer member is bonded to the large board through the cover glass. Even if the transfer member is attached or removed, even if it becomes dirty or damaged, it can be kept on the cover glass, and the large board used as the final product glass material becomes dirty or damaged. Can prevent damage.
- a laminated body in which a plurality of large board substrates are laminated and frame-like pattern groups of each large board substrate are combined is used to form a laminated body. Since the plurality of alignment marks on each large board in the laminate and the plurality of alignment portions on the adjustment base table are aligned, the plurality of alignment marks on each large board and the adjustment base table By using each of the plurality of alignment portions in the above, it is possible to accurately obtain a laminate in which the frame-like pattern groups of the large board substrates are combined.
- each alignment portion in the adjustment base table is constituted by the pair of detection cameras arranged on the axis extending in the vertical direction. Even if the agent is used and the transparency of the large board decreases, the alignment marks on each large board can be detected accurately and sequentially by the lower and upper detection cameras on the same axis. Can do.
- the adhesive is not cured unless the specific irradiation light is irradiated, it is possible to easily align the alignment marks of the respective large board substrates by adjusting the timing of curing of the adhesive.
- the vibration by the processing tool with respect to the product base plate as the tempered glass is feedback-controlled so that the amplitude and frequency of the processing tool approach the target amplitude and the target frequency, respectively.
- the target amplitude and the target frequency are values that change at each part in the thickness direction of the product base plate due to the processing of the product base plate, and a quality deterioration occurrence value that deteriorates the quality of the product base plate.
- Each is set to one not belonging to the range, and a predetermined sample period of 0.3 msec or less is used as a sample period in feedback control, so that the product base plate has a tempered glass having a high-strength surface strengthened layer (specifically In particular, even if the surface enhancement layer is 40 ⁇ m or more and the surface compressive stress is 600 MPa or more), the processing can be freely performed without being restricted by the processing path or the like. While possible, upon excitation of the processing tool, basically, the amplitude of the processing tool and the number of vibration can be prevented belong to a range of quality deterioration occurrence value.
- the review is made at an extremely early timing, and it is assumed that the amplitude or frequency of the processing tool is within the range of the quality deterioration occurrence value. Even if it becomes a value, the amplitude and frequency of the processing tool can be returned to the target amplitude and the target frequency (outside the range of the quality deterioration occurrence value), respectively, at an extremely early timing. For this reason, even if a minute state change occurs during processing, such as release of tensile stress inside the product base plate, due to processing of the base plate for product as chemically strengthened glass, it can respond (follow) to it. It is possible to accurately suppress occurrence of cracks in the product base plate, chipping exceeding a predetermined level, and the like during processing. As a result, the product base plate can be easily and reliably processed.
- the base plate for a product is a chemically strengthened glass having a surface reinforcing layer and an increased strength, it can be processed easily and reliably while ensuring a degree of processing freedom.
- a predetermined sample period of 0.3 msec or less is used based on the knowledge obtained by the present inventor, and if it exceeds 0.3 msec, the product is used as a chemically strengthened glass. This is because it is not possible to follow the stress change inside the base plate, and there is a high possibility that the accuracy of processing of the base plate for the product will be reduced (cracking of the product base plate, occurrence of chipping exceeding a predetermined level).
- Explanatory drawing explaining the laminated body of the tempered glass which is a process target.
- the enlarged photograph figure (magnification: 270 times) which shows the part corresponded to the A section of FIG. 13 in the protective glass for portable terminals which concerns on a comparative example.
- the enlarged photograph figure (magnification: 270 times) which shows the part corresponded to the B section of FIG. 13 in the protective glass for portable terminals which concerns on a comparative example.
- the enlarged photograph figure (magnification: 270 times) which shows the part corresponded to the C section of FIG. 13 in the protective glass for portable terminals which concerns on a comparative example.
- the enlarged photograph figure (magnification: 90 times) which shows the part corresponded to the D section of FIG. 13 in the protective glass for portable terminals which concerns on a comparative example.
- Process drawing which shows the process which concerns on other embodiment.
- the perspective view which shows the large board
- tempered glass as a processing target
- an ultrasonic vibration processing device as a processing device for tempered glass for processing the tempered glass
- a processing method and processing of tempered glass using the ultrasonic vibration processing device This will be explained in the order of quality comparison.
- the tempered glass 1 is configured such that a surface strengthening layer (chemical strengthening layer) 3 is provided on the front surface side (back surface side) of a glass base material (for example, aluminosilicate glass) 2. .
- the surface strengthened layer 3 ensures that the tempered glass 1 has high strength against bending stress and impact while reducing the thickness.
- a base material 2 having a thickness ⁇ 1 of about 0.7 mm and a surface reinforced layer 3 having a thickness ⁇ 2 of 40 ⁇ m or more (currently 70 ⁇ m has been developed, of course, Targets for processing), and those whose surface compressive stress is 600 MPa to 700 MPa.
- a base material 2 having a thickness ⁇ 1 of about 0.7 mm and a surface reinforced layer 3 having a thickness ⁇ 2 of 40 ⁇ m or more currently 70 ⁇ m has been developed, of course, Targets for processing
- those whose surface compressive stress is 600 MPa to 700 MPa.
- the tempered glass 1 not only the tempered glass 1 but also normal glass is a processing target of the ultrasonic vibration processing apparatus.
- the ultrasonic vibration processing device 4 includes a processing device main body 5 as shown in FIG.
- the processing apparatus main body 5 includes a relatively long bottomed cylindrical housing 6, a vibration device (vibration mechanism) 7 held in the housing 6, and the vibration device. 7 and a motor 9 as a rotational drive source for rotationally driving the excitation device 7.
- the housing 6 has an elevating device (only a part (attachment portion to the housing 6 is shown in FIG. 2)) 10 with its axis extending in the vertical direction and its opening facing downward. Installed on.
- the elevating device 10 has a function of moving the housing 6 up and down in the vertical direction and adjusting the elevating speed at that time (see arrows). With the function of the elevating device 10, the housing 6 is predetermined during processing. It is lowered at the set speed (feed speed).
- the vibration device 7 includes a cylindrical body portion 11 and a cylindrical ultrasonic vibration generation unit 12 that is held by the body portion 11 and generates ultrasonic vibrations.
- the body portion 11 is held on the inner peripheral surface of the housing 6 with a bearing 13 in a state where its axis is directed in the vertical direction, and the body portion 11 is centered on the axis by the bearing 13. It is relatively rotatable and cannot move in the axial direction (vertical direction).
- a cylindrical mounting tube portion 14 for mounting the drive shaft 9a of the motor 9 is formed at the upper end portion of the body portion 11, and a holding hole (not shown) is formed at the lower end surface of the body portion 11. Yes.
- the ultrasonic vibration generating unit 12 is held in the holding hole in the lower end surface of the body part 11.
- the ultrasonic vibration generating unit 12 is configured in a state where an ultrasonic vibrator, a vibration transmitting unit, and an amplifying unit are connected in series, and these are formed from the inside of the holding hole of the body unit 11.
- the ultrasonic transducer, the vibration transmission unit, and the amplification unit are arranged in this order toward the opening side.
- the ultrasonic vibrator has a piezoelectric body and a metal block for bolting the piezoelectric body, and electrodes (not shown) are arranged between the piezoelectric bodies and between the piezoelectric body and the metal blocks. By applying a DC voltage pulse voltage between the electrodes, longitudinal vibration is excited in the piezoelectric body.
- the vibration transmission unit has a function of transmitting the vibration of the ultrasonic transducer to the amplification unit, and the amplification unit has a function of amplifying the vibration transmitted from the vibration transmission unit.
- the processing tool 8 is connected to the amplification section on the axis of the ultrasonic vibration generating unit 12 as shown in FIG. 2 so as to vibrate by the vibration of the ultrasonic vibration generating unit 12. ing.
- the processing tool 8 directly contacts the tempered glass 1 to process the tempered glass.
- a shaft-shaped diamond grindstone is used, and the shaft-shaped processing tool 8 is The ultrasonic vibration generating unit 12 extends downward.
- the processing tool 8 not only processes the tempered glass that is a processing target, but also functions as a sensor that detects pressure fluctuations of the tempered glass.
- the motor 9 is attached to the outer surface (upper end surface) of the bottom 6a of the housing 6.
- a through hole 15 is formed in the bottom portion 6a of the housing 6 so as to penetrate the inside and outside of the housing 6.
- the drive shaft 9a of the motor 9 passes through the through hole 15 and is fitted into the mounting cylinder portion 14 in the body portion 11. It is held together (fixed). Thereby, the driving force of the motor 9 is transmitted to the processing tool 8 via the body part 11 and the ultrasonic vibration generating unit 12, and the processing tool 8 can rotate about its axis.
- the ultrasonic vibration processing device 4 includes an ultrasonic oscillator (vibration adjusting means) 16 that adjusts the amplitude and frequency of the ultrasonic vibration generating unit 12 as shown in FIGS. .
- the ultrasonic oscillator 16 is to adjust an input electric signal (specifically, voltage or current) and apply the adjusted electric signal to the ultrasonic vibration generating unit 12 (ultrasonic vibrator).
- the amplitude and frequency (frequency) of the input voltage from the power source are adjusted under a constant current (for example, a predetermined value of 1 to 2 A), and the adjusted voltage signal (for example, 300 to 400 V) is obtained.
- a constant current for example, a predetermined value of 1 to 2 A
- the adjusted voltage signal for example, 300 to 400 V
- a current signal may be applied to the ultrasonic transducer under a constant voltage.
- the ultrasonic vibration machining device 4 includes a control unit U as a control unit that feedback-controls the ultrasonic oscillator 16 (ultrasonic vibration generation unit 12) and the motor 9. I have.
- a voltage signal (voltage amplitude, frequency signal) from the ultrasonic oscillator 16 and a rotation speed signal (voltage signal) of the motor 9 are input to the control unit U, while an ultrasonic wave is input from the control unit U. Control signals are output to the oscillator 16 and the motor 9, respectively.
- the control unit U includes a setting unit (setting unit) for setting a target value for feedback control, and a determination unit that determines an operation variable based on a deviation between the target value of the setting unit and the control variable. (Determination unit) and an execution control unit (execution control unit) that outputs a control signal to execute an operation variable from the determination unit.
- the setting unit sets a target amplitude and a target frequency with respect to an input voltage to the ultrasonic vibration generation unit 12 (ultrasonic transducer) as a target value for feedback control.
- They are values that change at each part in the thickness direction of the tempered glass accompanying the processing of the tempered glass, and values of quality deterioration that deteriorate the quality of the tempered glass (values that generate cracks, chipping above a predetermined level, etc.) Something that does not belong to the range is set. This is because a change in stress inside the tempered glass accompanying processing such as release of tensile stress inside the tempered glass accompanying processing of the tempered glass is taken into consideration.
- a target current is set from the viewpoint of effective rotation for machining.
- the target amplitude of the input voltage to the ultrasonic vibration generating unit 12 is finally a predetermined amplitude (preferably 8 ⁇ m) in the range where the amplitude of the processing tool 8 is in the range of 3 ⁇ m to 9 ⁇ m (not belonging to the range of the quality deterioration occurrence value).
- the amplitude of the processing tool 8 is less than 3 ⁇ m or more than 9 ⁇ m, the quality deterioration occurrence value range is set.
- the target amplitude is set in the range of 3 ⁇ m to 9 ⁇ m in the final amplitude of the processing tool 8 because, based on the knowledge obtained by the present inventor, the processing capability is not sufficient below 3 ⁇ m (cutting chips). Etc., and the cutting resistance etc.
- the frequency of the processing tool 8 is finally in the range of 60 kHz to 64 kHz (not belonging to the range of the quality deterioration occurrence value).
- the frequency of the processing tool 8 is set to be a predetermined frequency (preferably 63 kHz) and the frequency of the processing tool 8 is less than 60 kHz and more than 64 kHz, the quality deterioration occurrence value range is set.
- the target frequency is set to 60 kHz to 64 kHz in the final frequency of the processing tool 8 based on the knowledge of the inventors of the present invention.
- the target current for the motor 9 is set so that the rotational speed of the processing tool 8 finally becomes a predetermined rotational speed (preferably 5000 rpm) in the range of 2000 rpm to 30000 rpm.
- the rotational speed of the processing tool 8 is in the range of 2000 rpm to 30000 rpm. If the rotational speed is less than 2000 rpm, the effect of processing on the tempered glass is not sufficient. This is because the effect of processing is reduced to cause a problem from the viewpoint of durability.
- reference numeral 18 denotes a set value input unit for inputting a set value to the set unit.
- the determination unit determines an operation variable from the deviation between the amplitude of the voltage (return voltage) from the ultrasonic oscillator 16 and the target amplitude of the setting unit, and the frequency of the processing tool 8 With respect to, the operation variable is determined from the deviation between the frequency of the voltage (return voltage) from the ultrasonic oscillator 16 and the target frequency of the setting unit. Moreover, regarding the rotation speed of the processing tool 8, an operation variable is determined from the deviation between the current signal from the motor 9 and the target current of the setting unit.
- the execution control unit is to output each operation variable from the determination unit to the ultrasonic oscillator 16 and the motor 9 as a control signal.
- the output voltage (amplitude, frequency) from the ultrasonic oscillator 16 is adjusted, and the processing tool 8 is feedback controlled so as to have a predetermined vertical amplitude and a predetermined frequency.
- the rotational speed is feedback controlled, and the processing tool 8 is maintained at a predetermined rotational speed.
- the control unit U performs the feedback control with a predetermined sample period (preferably 0.2 msec) within a range of 0.3 msec to 0.2 msec in which the sample period (response speed) is 0.3 msec or less.
- a predetermined sample period preferably 0.2 msec
- the predetermined sample period within the range of 0.3 msec to 0.2 msec cannot follow the minute stress change during the processing of tempered glass if it exceeds 0.3 msec. This is because there is an increased possibility that cracks, chipping exceeding a predetermined level, etc. occur in the tempered glass.
- 0.2 msec is set as the lower limit because it is the lowest limit that can be obtained at the present time, and feedback control cannot be actually performed with a sample period less than that value. . It will be more preferable if a value of less than 0.2 msec is developed in the future.
- the analog / digital conversion function and the arithmetic processing capability of the CPU are speeded up as compared with the conventional one in order to speed up the sampling period of the feedback control.
- the frequency (frequency) of the processing tool 8 is set to 80 kHz and the sample period is set to 0.2 msec, before the oscillation occurs in the optimum environment corresponding to the load variation.
- the vibration impact applied to the tempered glass can be suppressed to 16 times.
- the oscillation environment is optimized with a sample period of 0.2 msec under the feed rate of the processing tool 8 of 30 mm / min, the progress of the processing is feedback-controlled every 0.1 ⁇ m. It is possible to cope with (follow up) a minute state change (stress change).
- the frequency (frequency) of the processing tool 8 is 80 kHz
- a vibration impact is applied to the tempered glass once every 0.0000125 seconds (0.0125 ms).
- the sample period (oscillation response speed) is 10 msec (in the case of a conventional control unit)
- 800 times of vibration shock is given to the tempered glass until oscillation occurs in the optimum environment corresponding to the load fluctuation.
- the oscillation environment is optimized with a sample period of 10 msec under the feed speed of the processing tool 8 of 30 mm / min, the progress of the processing becomes 5 ⁇ m.
- Such 5 ⁇ m is a value that is relatively large with respect to the surface reinforced layer of several tens of ⁇ m, and the response for each 5 ⁇ m cannot follow the state change of the tempered glass. As a result, processing must be performed while applying stress to the tempered glass, and cracks and the like are generated in the tempered glass.
- Target value of control, etc. is supported by the following processing experiments 1 to 3 conducted by the present inventors.
- the processing experiments 1 to 3 were performed on the tempered glass under the following common experimental conditions, and the evaluation was performed based on the following common evaluation criteria.
- Tempered glass base material as processing object for common experimental conditions Aluminosilicate glass Base material thickness ⁇ 1: 0.70 mm
- Compressive residual stress of the surface reinforcing layer 600 MPa to 700 MPa
- Processing tool 8 Processing feed rate: 60mm / min
- Particle size of processing tool 8 # 600
- the target frequency of the processing tool 8 is preferably 60 kHz to 64 kHz (particularly 63 kHz) (less than 60 kHz and those exceeding 64 kHz are within the range of quality deterioration occurrence values). did.
- the contents shown in FIG. 5 were obtained. According to the contents shown in FIG. 5, it was found that the amplitude of the processing tool 8 is preferably 3 ⁇ m to 9 ⁇ m (particularly 8 ⁇ m) (less than 3 ⁇ m and those exceeding 9 ⁇ m are within the range of quality deterioration occurrence values).
- Processing experiment 3 (e-1) Focusing on the importance of the sample period for feedback control of processing for tempered glass that undergoes a minute state change during processing, target amplitude of processing tool 8: 8 ⁇ m, target frequency of processing tool 8 : An experiment was conducted in which the sampling period (response speed) of feedback control was changed under the condition of fixing at 63 kHz.
- FIG. 7 shows the relationship between the feedback control sample period (response speed) and the machining success rate. According to FIG. 7, the smaller the response speed, the higher the machining success rate. In particular, at 0.5 ms or less, the machining success rate increased with a sudden rise.
- the evaluation of the processing success is the same as the above-described evaluation ( ⁇ ). In FIG. 6, the processing success rate of 87% or more was evaluated as “ ⁇ ”.
- a tempered glass having a surface reinforcing layer 3 (specifically, a base material having a thickness of 0.7 mm, a surface reinforcing layer having a thickness of 40 ⁇ m or more, and a surface compressive stress of 600 MPa or more) 1
- a large board This is for cutting out a predetermined shape from a large substrate in order to produce protective glasses for portable terminals, tablets, and the like.
- a laminated body in which a plurality of (for example, 12) large substrates (tempered glass 1) are bonded in a laminated state with an adhesive 20 (adhesive layer 80 ⁇ m to 100 ⁇ m).
- Glass group 1A is prepared.
- the adhesive 20 is preferably a UV curable adhesive or the like that is cured by ultraviolet rays and is melted by warm water. This is because it is necessary to quickly cure the adhesive, and finally to peel off each tempered glass cut out.
- the glass 1n which comprises the outermost surface (front surface, back surface) of 1 A of laminated bodies, you may use normal glass with low cost instead of tempered glass. This is because the outermost surface of the laminate 1A tends to be particularly susceptible to chipping.
- substrate (tempered glass 1) with a base material thickness of 0.5 mm you may prepare the laminated body 1A which adhered 16 sheets.
- the laminated body 1 ⁇ / b> A is set on a thick plate-shaped fixing base 21.
- a plurality of grooves (not shown) are formed on the upper surface of the fixing base 21, and communication holes 22 connected to the respective grooves are opened from the side surfaces through the inside of the fixing base 21.
- a suction device (not shown), not shown, is connected to each communication hole 22, and air above the fixed base 21 is sucked through the groove on the top surface of the fixed base 21 and the communication hole 22. Is supposed to. Thereby, the laminated body 1A set on the fixed base 21 is fixed to the fixed base 21 based on this suction action.
- a plurality of portable terminal protective glass sizes are cut out from the laminate 1A.
- grinding is performed so as to form the long holes 23 and the square holes 24 in the respective laminated blocks 1a.
- the laminated body 1A other than the laminated block 1a is removed, and as shown in FIG. 12, the outer periphery of each laminated block 1a, the long hole 23
- finish grinding is performed on the square hole 24.
- each laminated block 1a is maintained in a state of being fixed to the fixed base 21 based on the suction action.
- the fixed base 21 is shown in a contracted state, and the long holes 23 and the square holes 24 formed in the laminated block 1a are omitted.
- the tempering accompanying the processing of the tempered glass is basically performed to prevent the occurrence of cracking, chipping, etc. of the tempered glass.
- the thing outside the range of the quality deterioration generation value (crack of tempered glass, generation
- the target amplitude of the processing tool 8 is preferably within a range of 3 ⁇ m to 9 ⁇ m, for example, 8 ⁇ m, and the target frequency of the processing tool 8 is preferably within a range of 60 kHz to 64 kHz, for example, 63 kHz.
- the reason for setting the target amplitude of the processing tool 8 within the range of 3 ⁇ m to 9 ⁇ m and the reason for setting the target frequency of the processing tool 8 within the range of 60 kHz to 64 kHz are as described above.
- 0.2 msec which is 0.3 msec or less, is used as the sampling period in the feedback control in this case. This is because the stress change generated inside the tempered glass can be quickly grasped, the stress on the tempered glass can be reduced, and the occurrence of cracks in the tempered glass can be prevented accurately.
- the processing tool 8 is rotated at a predetermined rotational speed of 5000 rpm within a range of 2000 rpm to 30000 rpm. This is to obtain a preferable effect by the rotation of the processing tool 8 while sufficiently exerting the effect of the ultrasonic vibration processing.
- general conditions are used for other processing conditions.
- the laminated block 1a that has been processed through the polishing process is immersed in warm water through a chemical treatment for strengthening the glass end face such as hydrofluoric acid, and each tempered glass 1 is peeled off. Thereby, the processed tempered glass is obtained as a product (protective glass for portable terminals, etc.).
- the preparation method of the test glass is the same as the processing method of the tempered glass described above. That is, a tempered glass having a surface reinforcing layer (specifically, a base material: aluminosilicate glass, a base material thickness of 0.7 mm, a surface reinforcing layer of 40 ⁇ m, and a surface compressive stress of 600 MPa) is a large substrate. Prepare 12 sheets that are laminated and fixed by using UV curing adhesive, etc., then cut out the size of the protective glass for the portable terminal (laminated block 1a), and for the cut out, The long hole 23 and the square hole 24 are ground (primary processing) to produce a primary processed product (laminated body).
- a surface reinforcing layer specifically, a base material: aluminosilicate glass, a base material thickness of 0.7 mm, a surface reinforcing layer of 40 ⁇ m, and a surface compressive stress of 600 MPa
- the outer periphery, the long hole 23, and the square hole 24 in the primary processed product are chamfered (secondary processing) to create a secondary processed product (laminate).
- polish processing is performed on the secondary processed product, and then each glass plate of the laminated block 1a that has been processed is immersed in warm water and peeled off to obtain a glass for testing (for evaluation).
- the above-described ultrasonic vibration processing device 4 is used in the primary processing and the secondary processing, and the processing conditions in the primary processing and the secondary processing are as follows.
- Primary processing condition processing tool 8 Type Axial diamond wheel (grain size: # 320) Diameter: 1.5mm Feeding speed: 60mm / min Amplitude: 8 ⁇ m Frequency: 63kHz Sample period (response speed) of feedback control: 0.2 msec Rotation speed: 5000rpm
- Secondary processing condition processing tool 8 Type Axial diamond wheel (grain size: # 600) Diameter: 1.5mm Feeding speed: 60mm / min Amplitude: 5 ⁇ m Frequency: 63kHz Sample period (response speed) of feedback control: 0.2 msec Rotation speed: 5000rpm
- each part A to E of the test glass is in any processing stage (after primary processing, secondary processing, polishing Even in the state of (after processing), a good processing state was shown.
- Primary processing condition processing tool 8 Type Axial diamond wheel (grain size: # 320) Diameter: 1.5mm Feeding speed: 60mm / min Amplitude: 8 ⁇ m Frequency: 50kHz Sample period (response speed) of feedback control: 10 msec Rotation speed: 5000rpm
- FIG. 23 to FIG. 39 show other embodiments.
- the same components as those of the above-described embodiment are denoted by the same reference numerals, and the description thereof is omitted.
- This embodiment shows a specific processing method (manufacturing method) for efficiently producing protective glass for portable terminals, tablets, etc. as product glass by effectively using the ultrasonic vibration processing device 4 described above.
- FIG. 23 shows a process diagram of the processing method.
- the tempered glass having a surface reinforcing layer 3 (specifically, a base material thickness of 0.7 mm, a surface reinforcing layer thickness of 40 ⁇ m or more, and a surface compressive stress of 600 MPa or more) 1 is used.
- a large plate substrate (hereinafter referred to as reference numeral 1) in which the size of the tempered glass is increased is prepared.
- the large substrate 1 is bonded in a state where a plurality of large substrates 1 are laminated so as to be used as a laminated body 1A at the time of processing. For this reason, a large number of large substrates 1 are prepared in advance.
- Each large board 1 is formed in a rectangular shape in plan view as shown in FIG.
- each large board 1 has a large number of frame-shaped patterns 50 (frame-shaped pattern group) and two alignment marks.
- As an alignment mark (positioning mark) 51 a printing is performed in advance.
- the frame-like pattern 50 occupies the peripheral part of the protective glass for mobile terminals, tablets, etc.
- the frame of the protective glass By the shape pattern 50, a rectangular display screen is partitioned on the mobile terminal, tablet, or the like.
- the large number of frame-like patterns 50 are the same in each large board 1 and are arranged in rows and columns of the large board 1 to form a plurality of rows, and between each row of the frame-like patterns 50, In order to perform a cutting process by a dicing blade, a slight interval 52 extending linearly is provided.
- the alignment mark 51 is provided in the vicinity of the pair of opposing sides (long sides) in one set of the peripheral portions of the large substrate 1, and both the alignment marks 51 are a pair of opposing sides in the other set. They are arranged in a state of being separated in the parallel arrangement direction of (short sides).
- the two alignment marks 51 have a predetermined arrangement relationship with respect to a large number of frame-shaped patterns 50, and the predetermined arrangement relationship between the large number of frame-shaped patterns 50 and the two alignment marks 51 corresponds to each large plate. Common to the substrate 1.
- a cover glass 1n is prepared to constitute the outermost surface (front surface, back surface) of the above-described laminate 1A. Unlike the chemically strengthened glass, the cover glass 1n is made of ordinary glass having no surface reinforcing layer, and the size of the cover glass 1n is the same as that of the large substrate 1. This cover glass 1n is transparent, and nothing is printed on the outer surface thereof.
- a first base table 54 having a rectangular shape in plan view, two positioning pins 55 provided on the first base table 54, and a lower side of the first base table 54
- the two detection cameras 56 disposed on both sides in the width direction of the first base table 54 and two mark printing units respectively provided on the upper side of the first base table 54 corresponding to the detection cameras 56.
- An ink jet head 57 An ink jet head 57.
- the first base table 54 has a flat upper surface on which the large substrate 1 can be placed.
- the upper surface shape resembles the shape (plate surface shape) of the large substrate 1 or the like, and is larger than the large substrate 1. Somewhat larger. For this reason, when an operator looks at the upper surface shape of the first base table 54, it is possible to grasp how the large board 1 is arranged with respect to the upper surface.
- the two positioning pins 55 are arranged in the vicinity of one of a pair of opposing sides (long sides) in one set, and the other positioning pins 55 are It is arrange
- the one positioning pin 55 is used as the large board 1.
- the other positioning pin 55 comes into contact with the short side portion of the large board 1 and the large board 1 is positioned at a predetermined position on the first base table 54.
- Each detection camera 56 is mounted on a moving unit 58 that can be moved by an operator's manual operation. By the movement of each moving unit 58, each detection camera 56 is positioned below the first base table 54. On the side, it is movable. Each detection camera 56 has a function of projecting the upper region, and the projected content is displayed on a monitor (not shown) together with a reference mark indicating the imaging center (position on the axis of the detection camera). It has become.
- Each mark printing inkjet head 57 is mounted on each moving unit 58.
- the respective inkjet heads 57 are arranged (arranged on the same axis) above the respective detection cameras 56 so as to face the respective detection cameras 56, and the respective inkjet heads 57 are moved by the movement of the respective movement units 58.
- the upper base table 54 moves in synchronism with each detection camera 56.
- the large substrate 1 (with a large number of frame-like patterns 50 printed thereon) is placed on the first base table 54, and the size of the large substrate 1 is increased.
- a cover glass 1 n is placed on the plate substrate 1. Then, both the outer peripheral surfaces of the stacked large substrate 1 and the cover glass 1n are brought into contact with two positioning pins 55 on the upper surface of the first base table 54, and the stacked large substrate is covered by the both positioning pins 55. 1 and the cover glass 1 n are positioned at predetermined positions on the first base table 54.
- the operator moves each moving unit 58, and each alignment between each detection camera 56 (axis) and the large board 1 is performed.
- the mark 51 is positioned on the same axis extending in the vertical direction.
- an opening (not shown) is formed in the first base table 54 in a region where each alignment mark 51 is expected to be arranged on the large substrate 1, and each detection camera 56 detects each alignment mark 51 through the opening. It is supposed to be able to work. Further, when the operator decides the moving position of the moving unit 58, an alignment mark 51 and a reference mark (marks on the monitor indicating the imaging center: not shown) displayed on the monitor based on the output signal from the detection camera 56. Is aligned.
- the inkjet head 57 When each detection camera 56 (reference mark on the monitor) is aligned with each alignment mark 51, the inkjet head 57 is lowered by the moving unit 58, and the alignment mark 53 is placed on the cover glass 1n by the inkjet head 57. Print. As a result, the alignment mark 53 printed on the cover glass 1 n is arranged so as to overlap the alignment mark 51 of the large substrate 1.
- a printing unit 59 that is movable in the longitudinal direction and the width direction of the first base table 54 is also provided.
- the printing unit 59 includes an inkjet head 60 that performs printing on the cover glass 1n, and a curing lamp unit 61 that cures the ink.
- the printing unit 59 includes position information (alignment) of the detection camera 56 described above. On the basis of the mark 51 position), each frame-like pattern 50 of the large substrate 1 is moved on the cover glass 1n, and within each frame-like pattern 50, it can be moved finely for printing and curing. .
- the inkjet head 60 of the printing unit 59 prints on the cover glass 1n the scheduled processing conditions and the like input to a control unit (storage means) (not shown) in addition to the product management number in each frame-like pattern 50. By comparing this printed content with the final processing result (processing result after the completion of ultrasonic vibration processing), many processing conditions for obtaining a good product glass can be obtained. .
- the cover glass 1n is removed, and the next new cover glass is placed on the large substrate 1 placed on the first base table 54. 1n is placed. Then, the same operation as described above is performed on the new cover glass 1n, and the alignment mark 53 and the like are printed on the new cover glass 1n.
- an “adhesive application step” is executed.
- the object to be processed is a laminated body 1A in which a plurality of large plate substrates 1 are laminated.
- the laminated body 1A has a structure in which the uppermost stage and the lowermost stage are the cover glass 1n.
- the cover glass 1n (the one on which the alignment mark 53 is printed) which is the lowermost layer of the laminate 1A is placed on the second base table 63. Then, the cover glass 1n is positioned by being brought into contact with the positioning block 64 disposed on the second base table 63 over the range of the half circumference. Then, an adhesive is applied to the cover glass 1 n on the second base table 63 with a predetermined pattern using a movable adhesive application dispenser 65.
- a UV curable adhesive or the like that is cured by ultraviolet rays and melts by warm water is used. This is because it is necessary to peel the adhesive as each product glass after the product glass laminate 1A is finally formed while the adhesive is cured rapidly.
- the cover glass 1n applied with the adhesive in the previous step is placed on the third base table 67 with its adhesive application surface facing upward,
- the cover glass 1n is positioned by a positioning pin (not shown), and then sucked and fixed to the third base table 67 by a vacuum suction device (not shown).
- the large substrate 1 is stacked on the cover glass 1 n on the third base table 67, and the third base table 67 on which they are placed is moved toward the rolling roller 69 by the transport unit 68.
- the adhesive between the cover glass 1n and the large plate substrate 1 is rolled, and the adhesive protruding from both the glasses 1n and 1 is collected in the scraper / adhesive collection tray 70.
- the fourth base table 72 having a rectangular shape in plan view as the adjustment base table and the fourth base table 72 are sandwiched up and down.
- Two pairs of detection cameras 73a and 73b (positioning portions) to be disposed and a temporary curing lamp device 74 for temporarily curing the adhesive are provided.
- the fourth base table 72 has a flat upper surface on which the large plate substrate 1 and the cover glass 1n can be placed. On the upper surface, the schematic arrangement direction and arrangement region of the large plate substrate 1 and the like are arranged. An arrangement area guide block (not shown) is provided to inform the operator of the above. Based on this, the fourth base table 72 is formed with openings (not shown) that are slightly wider than the assumed arrangement area in consideration of the arrangement assumed area of each alignment mark 51 of the large substrate 1. The fourth base table 72 is appropriately formed with an opening (not shown) in addition to the above opening, and the opening is connected to a vacuum suction device (not shown).
- each pair of detection cameras 73a and 73b is attached to a support member 75 that is fixed to the fourth base table 72, and each pair of detection cameras 73a and 73b is The fourth base table 72 is fixed.
- One of the pair of detection cameras 73a and 73b of each set is disposed below the fourth base table 72 as the lower detection camera 73a, and the other is disposed above the fourth base table 72 as the upper detection camera 73b.
- the lower detection camera 73a and the upper detection camera 73b are arranged to face each other, and the imaging centers of both the cameras 73a and 73b are set to be arranged on the same axis extending in the vertical direction. .
- the two sets of detection cameras 73a and 73b are arranged so as to be spaced apart in the longitudinal direction on both sides in the width direction of the fourth base table 72 in a plan view, and both sets of the detection cameras 73a and 73b.
- the planar distance between them (the distance between the intersection of the fourth base table 72 and the axis connecting the lower detection camera 73a and the upper detection camera 73b in each set) is the two alignment marks on the large board 1 described above. It is made equal to the distance between 51.
- the large board 1 is accommodated in the fourth base table 72, the short side of the large board 1 is along the short side of the fourth base table 72, and the long side of the large board 1 is The arrangement is along the long side of the fourth base table 72.
- the temporary curing lamp device 74 emits irradiation light that promotes curing of the adhesive.
- the temporary curing lamp device 74 since the UV curing adhesive is used as the adhesive used between the cover glass 1n and the large substrate 1, the temporary curing lamp device 74 emits ultraviolet rays. Yes. In this case, irradiation of ultraviolet rays by the temporary curing lamp device 74 cures the UV curing adhesive to a certain extent, but does not reach complete curing.
- the cover glass 1n and the large plate substrate 1 bonded together in the previous step are placed on the fourth base table 72 with the cover glass 1n facing down. Placed on. Then, the cover glass 1n is moved on the fourth base table 72, and the respective alignment marks 53 are positioned on the axis of the lower detection camera 73a of each group. When this alignment is completed, the cover glass 1n is sucked and fixed to the fourth base table 72 by a vacuum suction device (not shown).
- each alignment mark 51 is positioned on the axis of each pair of upper detection cameras 73b.
- the operator performs an operation of matching each mark 51 (53) with the reference mark of the detection camera 73 while looking at the monitor.
- the lower detection camera 73a is used for alignment of the cover glass 1n arranged on the lower side
- the upper detection camera 73b is used for alignment of the large board 1 arranged on the upper side.
- the alignment is performed as in the case where only one of the lower and upper detection cameras 73 is used. The accuracy does not decrease, and a high alignment accuracy can be ensured.
- the adhesive is temporarily cured, and the cover glass 1n is large.
- the plate substrate 1 is temporarily integrated with a certain degree of adhesive force. This temporary integration is based on temporary curing of the adhesive, but it is not easy to peel off or shift the cover glass 1n and the large substrate 1 by human power.
- a cover glass 1n and a large substrate 1 temporarily integrated (hereinafter referred to as a temporary integrated product) 1A 'on the second base table 63 are mounted with the cover glass 1n facing down.
- the adhesive is applied to the large substrate 1 in the same manner as in the “adhesive application step” described above (see FIG. 26) (see FIG. 29).
- a temporary integrated object is placed on the third base table 67 with the large-sized substrate 1 coated with an adhesive facing upward, and a new large-sized substrate 1 is placed on the large-sized substrate 1. Then, the adhesive between the large plate substrates 1 is rolled by the rolling roller 69 (see FIG. 27).
- the temporary integrated object in which the large board 1 is newly laminated in the previous step is placed on the fourth base table 72 with the cover glass facing downward.
- the alignment mark of the lowermost cover glass 1n is aligned on the axis of the lower detection camera 73a, and when the alignment is completed, the cover glass 1n is moved to the fourth position by a vacuum suction device (not shown).
- the base table 72 is fixed by suction.
- the alignment plate 51 is positioned on the axis line of the upper detection camera 73b of each set of the large board 1 currently disposed at the uppermost stage. Move to.
- the adhesive between the new large substrate 1 and the lower large substrate 1 is temporarily cured by the irradiation light from the temporary curing lamp device 74 again, The cover glass 1n, the large substrate 1 and the large substrate 1 are used.
- the “adhesive application step”, “glass bonding and adhesive rolling step”, “lamination alignment adjustment and adhesive temporary curing step” This is repeated, and a plurality of large plate substrates 1 are bonded while being laminated. Finally, the cover glass 1n is bonded in a state of being laminated on the large substrate 1, and the cover glass 1n is arranged not only at the lowermost stage but also at the uppermost stage.
- a slide-type drawer unit 76 is provided, and each drawer unit 76 is provided with a main curing lamp 77.
- the temporary integrated product 1A ′ that has finished the “stacking alignment adjustment and adhesive temporary curing step” as the previous step is installed in a state of being pulled out into each drawer unit 76, and then returned to its original state.
- the main curing lamp 77 is turned on.
- the main curing lamp 77 is lit for a predetermined time after the start of lighting, and with this lighting, the adhesive of the temporary integrated object 1A 'is completely cured. Thereby, the laminated body 1A is obtained.
- the equipment used in the “stacking alignment adjustment and adhesive temporary curing process” is used, and the equipment has a unique structure for executing this process. And its unique structure is utilized with new related members.
- cylindrical first and second positioning cylinder portions 78a and 78b are erected on a fourth base table 72, which is one of the devices, and the first and second portions thereof.
- a transfer plate 80 as a transfer member and positioning pins 81a and 81b are prepared (see FIGS. 28 and 31).
- the first and second positioning cylinder portions 78a and 78b are arranged on both sides in the width direction on the fourth base table 72.
- the first and second positioning cylinder portions 78a and 78b are arranged on the fourth base table 72. It is located in the outer region of the positioned large board 1.
- the first and second positioning cylinder portions 78a and 78b are symmetric with a staggered arrangement relationship with respect to the longitudinal center of the fourth base table 72 (positioned large board 1). Yes.
- the arrangement positions of the first and second positioning cylinder portions 86a and 86b with respect to the frame-like pattern 50 group of the large board 1 properly arranged on the jig plate 82 are determined based on the fourth base table 72. This is reflected in the arrangement positions of the first and second positioning cylinder portions 78a and 78b with respect to the frame-like pattern 50 group of the large board 1 positioned in step S2.
- the transfer plate 80 has a rectangular shape in plan view, and the length in the longitudinal direction is somewhat larger than the length in the width direction of the large substrate 1.
- the transfer plate 80 is formed with first and second positioning holes 80a and 80b (positioning related portions) on both sides in the longitudinal direction, and both the positioning holes 80a and 80b are formed on the transfer plate 80. It is located at the corner of the diagonal.
- These positioning holes 80a and 80b correspond to the first and second positioning cylinder parts 78a and 78b, and when the opening of the first positioning cylinder part 78a and the opening of the first positioning hole 80a overlap, The opening of the second positioning cylinder portion 78b and the opening of the second positioning hole 80b can be overlapped.
- the first and second positioning pins 81a and 81b cooperate with the first and second positioning cylinders 78a and 78b and the first and second positioning holes 80a and 80b, respectively, to transfer the transfer plate 80 to the fourth base table.
- the first positioning pin 81a is inserted into the first positioning cylinder part 78a and the positioning hole 80a
- the second positioning pin 81b is inserted into the second positioning cylinder part. It will be inserted into 78b and positioning hole 80b.
- the laminated body 1A is placed on the fourth base table 72, and each lower detection camera is the same as in the case of the above-described lamination alignment adjusting step.
- 73a is used to position each alignment mark (alignment mark of the large substrate 1) on the cover glass 1n on each axis.
- the positioned laminated body 1A is sucked and fixed onto the fourth base table 72 by a vacuum suction device (not shown).
- the transfer plate 80 to which the adhesive is applied is overlaid on the laminate 1A (cover glass 1n (uppermost glass)) with the side on which the adhesive is present facing the laminate 1A, and the transfer plate 80 is also placed.
- the opening of the first positioning hole 80a is overlapped with the opening of the first positioning cylinder part 78a
- the opening of the second positioning hole 80b is overlapped with the opening of the second positioning cylinder part 78b.
- the first positioning pin 81a is inserted into the first positioning cylinder part 78a and the first positioning hole 80a, and the second positioning cylinder part 78b and the second positioning hole 80b are second.
- the positioning pins 81b are inserted, and the transfer plate 80 is bonded to the laminated body 1A (cover glass 1n) in a positioned state (see FIG. 31).
- the adhesive that adheres the transfer plate 80 to the laminate 1A is different from the adhesive that adheres the large substrate 1 and the like to each other. This is because, as will be described later, the timing at which the transfer plate 80 is separated from the stacked body 1A is different from the timing at which the large board 1 and the like are peeled from each other.
- the adhesive for example, a modified acrylate structure adhesive composed of an acrylic resin and an acrylic oligomer is used.
- a jig plate 82 As shown in FIG. 32, a jig plate 82, a number of setting jigs 83 that can be detachably held on the jig plate 82, and a dicing blade 84 (see FIG. 35) are provided. ing.
- the jig plate 82 is formed in a rectangular shape in plan view with the same size as the first to fourth base tables 54, 63, 67, 72 described above.
- a number of recesses 85, cylindrical first and second positioning cylinder portions 86 a and 86 b, and positioning holes 87 are provided on the upper surface.
- the large number of recesses 85 correspond to the large number of frame-like patterns 50 on the large board 1 while making the planar size of the respective depressions 85 smaller than the frame-like pattern 50 of the large board 1 described above.
- the plurality of recesses 85 are aligned in the longitudinal direction and the width direction of the jig plate 82 to form a plurality of rows.
- the first and second positioning tube portions 86 a and 86 b are erected on both sides in the width direction on the jig plate 82, and the first and second positioning tube portions 86 a and 86 b are formed on the fourth base table 72.
- the arrangement positions of the first and second positioning cylinder portions 78a and 78b with respect to the frame-shaped pattern 50 group of the large board 1 thus made are the same.
- the openings of the first and second positioning cylinder portions 86a and 86b are formed when the first positioning hole 80a of the transfer plate 80 is overlapped with the opening of the first positioning cylinder portion 86a.
- the 80 second positioning holes 80b are set so as to overlap the opening of the second positioning cylinder portion 86b.
- Two positioning holes 87 are formed for each recess 85 on the upper surface of the jig plate 82, and the two positioning holes 87 are provided for each recess 85 in the width direction of the jig plate 82. It arrange
- each set jig 83 has a fitting projection 88 and a support base provided on the base end side of the fitting projection 88 and having a flat surface (outer surface, upper surface). A portion 89 and a positioning hole 90 formed on the back surface of the support base portion 89 are provided.
- the fitting convex portion 88 is formed corresponding to the size of the recess 85, and the fitting convex portion 88 and the recess 85 can be detachably fitted.
- the setting jig 83 is positioned on the jig plate 82 by the fitting of the fitting convex portion 88 and the recess 85.
- the support base 89 is formed in a rectangular shape in plan view that is larger than the fitting convex portion 88 and somewhat smaller than the frame-like pattern 50 of the large substrate 1, and the fitting convex portion 88 is formed in the recess 85. When it is fitted, the thickness of the support base 89 protrudes from the upper surface of the jig plate 82.
- Two positioning holes 90 are formed at the peripheral edge of the back surface of the support base 89 corresponding to the positioning holes 87 of the jig plate 82, and when the fitting projection 88 is fitted into the recess 85, The positioning holes 90 on the back surface of the support base 89 and the positioning holes 87 of the jig plate 82 overlap each other.
- each set jig 83 is The same pattern as many frame-like patterns of the large board 1 is formed with a slightly reduced area compared to the frame-like pattern 50 of the large board 1, and each frame-like pattern 50 of the large board 1 is formed.
- the large board 1 is stacked on a number of set jigs 83 in accordance with the set jigs 83 on the jig plate 82, the support bases of the set jigs 83 are located in the regions below the frame patterns 50. Part 89 will be accommodated.
- the set jig 83 is aligned to form a plurality of rows, and gaps 91 are formed between the adjacent rows. For this reason, the dicing blade 84 can enter the gaps 91 for cutting.
- an electromagnetic chuck 92 is provided below the jig plate 82.
- the electromagnetic chuck 92 is configured using an electromagnet.
- the electromagnetic chuck 92 is When operated, the setting jig 83 is firmly held by the jig plate 82.
- the dicing blade 84 (see FIG. 35) is used paying attention to the fact that cutting processing can be made faster than the case of using the shaft-shaped processing tool 8 in the ultrasonic vibration processing device 4 based on its rigidity and the like.
- As the dicing blade 84 for example, a diamond blade or the like is used.
- the dicing blade 84 is controlled by a control unit (not shown) whose movement drive source and the like are controlled by the position of the jig plate 82 and the setting jig 83 on the jig plate 82. Based on information such as the arrangement position, the size of the setting jig 83, and the gap 91 between adjacent setting jigs 83, the dicing blade 84 cuts out the laminated block 1a from the laminated body 1A.
- a positioning pin (not shown) is inserted into the positioning hole 87 provided for each recess 85 on the jig plate 82, and the positioning pin is inserted.
- the set jig 83 is fitted into each recess 85, and the positioning pin is inserted into the positioning hole 90 of the set jig 83.
- the electromagnetic chuck 92 is operated and each set jig 83 is attracted to the jig plate 82. Thereby, each set jig 83 is firmly held by the jig plate 82 at a predetermined position (see FIG. 32).
- each set jig 83 is firmly held on the jig plate 82, an adhesive is applied to the lower surface of the laminated body 1A to which the transfer plate 80 is bonded, and then the laminated body 1A is attached to the jig plate. Carry to 82. Then, the first positioning hole 80a in the transfer plate 80 is aligned with the opening of the first positioning cylinder portion 86a, and the second positioning hole 80b in the transfer plate 80 is aligned with the opening of the second positioning cylinder portion 86b.
- the transfer plate 80 is positioned on the jig plate 82, and in the state where the frame patterns 50 of the laminated body 1A are properly arranged on the setting jigs 83, the laminated body 1A is Bonded to the set jig 83.
- the arrangement positions of the first and second positioning cylinder portions 86a and 86b with respect to a large number of frame-like patterns 50 of the large board 1 that are appropriately arranged on the large number of setting jigs 83 are positioned on the fourth base table 72. This is because the arrangement positions of the first and second positioning cylinder portions 78a and 78b with respect to the large number of frame-shaped patterns 50 in the laminated body 1A are reflected.
- the UV curing adhesive described above is not used as the adhesive used on the lower surface of the laminated body 1A to which the transfer plate 80 is bonded. This is because when a UV curing adhesive is used, a curing lamp device for curing the adhesive must be provided in the vicinity of the jig plate 82. For this reason, as the adhesive, an adhesive that cures without irradiation by a curing lamp device, for example, the above-mentioned modified acrylate structure adhesive or the like is used.
- the transfer plate 80 is removed from the stacked body 1A.
- an external force that breaks the adhesion between the transfer plate 80 and the laminated body 1A is applied.
- the transfer plate 80 is bonded to the uppermost cover glass 1n in the laminated body 1A, there is no problem even if the cover glass 1n is damaged.
- a dicing blade 84 cutting (dicing) is performed between the rows of the frame-like patterns 50 in the stacked body 1A in consideration of the gaps 91 between the setting jigs 83. .
- the cutting process using the dicing blade 84 is because the dicing blade 84 has higher rigidity than the shaft-shaped processing tool 8 in the ultrasonic vibration processing apparatus 4, and the laminated body 1 ⁇ / b> A (large plate substrate 1 is obtained by the cutting process. ) From the laminated block 1a (cut out from the laminated body 1A: product base plate) is faster than cutting out the laminated block 1a using the shaft-shaped processing tool 8 in the ultrasonic vibration processing device 4. It is.
- each frame-like pattern 50 is cut out in the laminated body 1 ⁇ / b> A, and the laminated block 1 a is bonded to the upper surface of the set jig 83 on each set jig 83. It is cut out in the state that was done.
- the laminated block 1a bonded to the setting jig 83 is cut out, the laminated block 1a bonded to the setting jig 83 is carried to an “ultrasonic vibration machining process” as shown in FIG. .
- a processing jig plate 96 as a processing base table and the above-described ultrasonic vibration processing device 4 are provided.
- the processing jig plate 96 has basically the same configuration as the jig plate 82.
- the processing jig plate 96 is different from the jig plate 82 in that the first and second positioning cylinders.
- the points 86a and 86b are omitted and the interval between the adjacent recesses 85 is widened to be adjacent to each other.
- the only difference is that a predetermined gap 97 is secured between the laminated blocks 1a to enable ultrasonic vibration machining.
- the same components as those of the jig plate 82 are denoted by the same reference numerals and the description thereof is omitted.
- the ultrasonic vibration processing device 4 includes not only the lifting device 10 (see FIG. 2) that moves the housing 6 up and down, but also the lifting device 10.
- a moving device (not shown) for moving the housing 6 including the front, rear, left and right is provided.
- the movement of the moving device and the raising / lowering motion of the lifting device 10 are set in consideration of information such as the setting jig 83 set on the processing jig plate 96 and the laminated block 1a bonded on the setting jig 83. Is controlled by the control unit U (see FIG. 3).
- the set jig 83 to which the cut-out laminated block 1a is bonded is taken out from the jig plate 82 and processed.
- Each set jig 83 is firmly held on the processing jig plate 96 by the electromagnetic chuck 92 while being set in each recess 85 of the jig plate 96 (the fitting convex portion 88 is fitted in the recess 85, etc.). To do.
- the set jig 83 to which the laminated block 1a is bonded is carried to a “peeling process step” as shown in FIG. This is because it is necessary to peel the laminated block 1a from the set jig 83 and peel the cover glass 1n, the product glass, and the product glass from each other to obtain a product glass (product).
- this step first, an external force to be peeled off is applied to the laminated block 1a and the set jig 83 to peel off both the la and 83a.
- the laminated block 1a is put in a hot tub containing hot water, and the adhesive in the laminated block 1a and the like is dissolved. Thereby, the product glass as a product will be obtained.
- the laminated block 1a is cut out by cutting the laminated body 1A using the dicing blade 84, and therefore the shaft-like processing tool 8 of the ultrasonic vibration processing apparatus 4 is used.
- the laminated block 1a can be cut out faster than the laminated block 1a.
- the laminated block 1 a is processed by a cutting process using a dicing blade 84. Even if chipping occurs on the outer peripheral surface of 1a, the chip is repaired by processing performed by the processing tool 8 of the ultrasonic vibration processing device 4 that is basically performed. For this reason, the time required for production of one product glass can be shortened as much as possible while ensuring the quality of the product glass.
- a large number of setting jigs 83 can be regularly arranged at predetermined positions on the jig plate 82, and each frame of the large substrate 1 can be placed on each setting jig 83 by using the transfer plate 80 or the like. Since the large substrate 1 can be bonded to a large number of setting jigs 83 while the pattern 50 is properly arranged, the cutting process by the dicing blade 84 can be repeated as a simple operation. The same thing can be reliably cut out from the large substrate 1 and the cutting process control by the dicing blade 84 can be simplified.
- each frame-like pattern 50 of the large board 1 can be formed on the jig plate 82 by using only the transfer plate 80, the positioning cylinders 78a, 78b, 86a, 86b and the like without using a camera or sensors. It can arrange
- the ultrasonic vibration machining apparatus 4 can be made to perform regular work. For this reason, control of the ultrasonic vibration processing apparatus 4 can also be simplified.
- the present invention includes the following aspects.
- the target amplitude is set to a predetermined amplitude in the range of 3 ⁇ m to 9 ⁇ m
- the target frequency is set to a predetermined frequency in the range of 60 kHz to 64 kHz.
- the target amplitude is set to 3 ⁇ m to 9 ⁇ m because if less than 3 ⁇ m, the processing capability is not sufficient (due to cutting chips remaining and cutting resistance etc. being increased), cracks in the tempered glass, chipping over a predetermined level
- the target frequency is set to 60 kHz to 64 kHz, as in the case of the target amplitude. If the frequency is less than 60 kHz, the processing capability is not sufficient and cracks are generated in the tempered glass.
- the rotational speed of the processing tool is set to a predetermined rotational speed within a range of 2000 rpm to 30000 rpm.
- the rotational speed of the processing tool is set to a predetermined rotational speed in the range of 2000 rpm to 30000 rpm. If the rotational speed is less than 2000 rpm, the effect of processing on the tempered glass is not sufficient. This is because a reduction in processing resistance occurs and the processing effect decreases, and a problem arises from the viewpoint of durability.
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Abstract
Description
Assistant)等の表示装置には、一般に化学強化された強化ガラスが用いられている。この強化ガラスは、ガラス母材の表面側に表面強化層(化学強化層)が設けられた構成とされており、これに基づき、強化ガラスは、薄板化を図りつつ、曲げ応力、衝撃に対して高強度を示している。
加工具を回転させつつ加振させた状態の下で、該加工具をもって、表面強化層を有する化学強化ガラスとしての製品用素板に対して加工を行う強化ガラスの加工方法であって、
前記製品用素板に対する前記加工具の加工に先立ち、表面強化層を有する化学強化ガラスとしての大板基板から前記製品用素板を、ダイシングブレードを用いた切断加工により切り出し、
前記製品用素板に対する前記加工具の加工に際して、該製品用素板の外周面に対する仕上げ加工をも行う構成とされている。この請求項1の好ましい態様としては、請求項2以下の記載の通りとなる。
1.強化ガラス
強化ガラス1は、図1に示すように、ガラス母材(例えばアルミノシリケートガラス)2の表面側(裏面側)に表面強化層(化学強化層)3が設けられた構成とされている。この表面強化層3により、強化ガラス1は、薄板化を図りつつ、曲げ応力、衝撃に対して高強度が確保されることになっている。具体的には、強化ガラス1としては、母材2の厚みδ1が0.7mm前後、表面強化層3の厚みδ2が40μm以上(現在の時点で70μmのものが開発されているが、勿論、加工の対象)、表面圧縮応力が600MPa~700MPaとされたものが対象とされている。勿論、強化ガラス1だけでなく通常のガラスも、超音波振動加工装置の加工対象となる。
(1)超音波振動加工装置4は、図2に示すように、加工装置本体5を備えている。
上記制御の目標値等は、本件発明者が行った下記加工実験1~3に裏付けられている。この場合、加工実験1~3は、下記共通実験条件の下で強化ガラスに対して行い、その評価は下記共通の評価基準に基づいて行った。
加工対象としての強化ガラス
母材材質:アルミノシリケートガラス
母材厚みδ1:0.70mm
表面強化層の厚みδ2:40μm(0.04mm)
表面強化層の圧縮残留応力:600MPa~700MPa
加工具8
加工送り速度:60mm/分
回転数:5000rpm
軸状の加工具径:1.5mm
加工具8の粒度:♯600番
(b)共通の評価基準
×:強化ガラスが割れた
△:チッピング100~150μm(加工ができるが、品質が悪い状態)
○:チッピング30μm以下(加工、品質共に良い状態)
(c-1)1枚の強化ガラスに対する加工具8の良好な振動数を得るために電圧を調整することにより、加工具8の目標振幅:8μm、フィードバックのサンプル周期(応答速度):0.2msecに固定した条件の下で、加工具8の目標振動数(目標周波数)を変化させる実験を行った。
(d-1)1枚の強化ガラスに対する加工具8の良好な目標振幅を得るために電圧を調整することにより、加工具8の目標周波数:63kHz、フィードバックのサンプル周期(応答速度):0.2msecに固定した条件の下で、加工具8の目標振幅を変化させる実験を行った。
(e-1)加工中に微細な状態変化を起こす強化ガラスにとって、その加工のフィードバック制御のサンプル周期が重要であることに着目し、加工具8の目標振幅:8μm、加工具8の目標周波数:63kHzに固定した条件の下で、フィードバック制御のサンプル周期(応答速度)を変化させる実験を行った。
(1)本件方法を用いて作成した試験用ガラスの場合
試験用ガラスとして、図13に示す携帯端末用保護ガラス1Pを作成することを試みた。
試験用ガラスの作成方法は、前述の強化ガラスの加工方法と同様である。すなわち、表面強化層を有する強化ガラス(具体的には、母材材質:アルミノシリケートガラス、母材厚み0.7mm、表面強化層40μm、表面圧縮応力600MPaのもの)が大板基板とされたもの12枚を、UV硬化接着剤等を用いることにより積層固定状態としたものを用意し、それから携帯端末用保護ガラスの大きさのもの(積層ブロック1a)を切り出し、その切り出したものに対して、長孔23、角孔24の研削加工を行って(一次加工)、一次加工品(積層体)を作成する。次に、一次加工品における外周、長孔23、角孔24の面取り仕上げ加工(二次加工)を行い、二次加工品(積層体)を作成する。次に、二次加工品に対してポリッシュ加工を行い、その後、加工を終えた積層ブロック1aの各ガラス板を温水に漬けて剥がし、試験用(評価用)ガラスを得る。
一次加工条件
加工具8
種類:軸状のダイヤモンド砥石(粒度:♯320番)
直径:1.5mm
送り速度:60mm/min
振幅:8μm
振動数:63kHz
フィードバッグ制御のサンプル周期(応答速度):0.2msec
回転数:5000rpm
二次加工条件
加工具8
種類:軸状のダイヤモンド砥石(粒度:♯600番)
直径:1.5mm
送り速度:60mm/min
振幅:5μm
振動数:63kHz
フィードバッグ制御のサンプル周期(応答速度):0.2msec
回転数:5000rpm
図13に示す試験用ガラスの各部A~Eにおける一次加工後、二次加工後、ポリッシュ加工後の加工状態を確認した。
本件方法による試験用ガラスの場合同様、試験用ガラスとして、図13に示す携帯端末用保護ガラスを作成することを試みた。
前述の本件方法同様、12枚の大板基板(表面強化層を有する強化ガラス)を積層状態をもって接着したものを用意し、それに対して、下記一次加工条件の下で、一次加工(積層ブロック1aの切り出し、長孔23、角孔24の加工)を行おうとした。しかし、積層ブロック1aの切り出し後、一次加工における長孔23の加工初期に、早々と複数のクラックが生じた。このため、比較例に係る試験用ガラスの孔加工に関する部分(D部,E部(図13参照))に関しては、一次加工における角孔24の加工を含め、以後の加工を行うことを断念した。また、比較例に係る試験用ガラスの外周面に関する部分(A部~C部(図13参照))のうち、B部、C部に関しては、二次加工、ポリッシュ加工を行ったが、A部に関しては、クラックが入ったため、以後の加工を断念した。
一次加工条件
加工具8
種類:軸状のダイヤモンド砥石(粒度:♯320番)
直径:1.5mm
送り速度:60mm/min
振幅:8μm
振動数:50kHz
フィードバッグ制御のサンプル周期(応答速度):10msec
回転数:5000rpm
比較例に係る試験用ガラスの各部A~D(図13参照)において、一次加工後の加工状態を確認したところ、図19~図21(270倍)、図22に示す拡大写真図(90倍)に示す結果となった。すなわち、比較例に係る試験用ガラスの各部A~Cでは、クラック又は所定以上のチッピングが生じ、D部では、複数の大きなクラックが発生し、製品として成立し得ない品質のものとなった。図22中、中央の大きな穴は、長孔23に至る前の加工初期の穴である。
(1)請求項9の構成の下で、目標振幅を3μm~9μmの範囲の所定振幅とすると共に、目標振動数を60kHz~64kHzの範囲の所定振動数にすること。これにより、本件発明者が見出した知見に基づき、加工具の具体的な振幅及び振動数として、強化ガラスの加工精度の観点から好ましいものを提供できる。
(2)請求項9の構成の下で、加工具の回転数を、2000rpm~30000rpmの範囲内の所定回転数とすること。これにより、本件発明者の知見に基づき、前述の加振条件の下で、加工具の回転数を、強度の高い表面強化層を有する強化ガラスを加工する観点から、好ましいものにできる。
1A 積層体(大板基板)
1a 積層ブロック
1n カバーガラス
3 表面強化層
4 超音波振動加工装置
7 加振装置(加振機構)
8 加工具
50 枠状模様
51 アライメントマーク(位置合わせマーク)
53 位置合わせマーク
72 第4ベーステーブル(調整用ベーステーブル)
73a 検知カメラ(位置合わせ部)
73b 検知カメラ(位置合わせ部)
78a 第1位置決め筒部(位置決め関与部)
78b 第2位置決め筒部(位置決め関与部)
80 移載プレート(移載部材)
80a 第1位置決め孔(位置決め関係部)
80b 第2位置決め孔(位置決め関係部)
82 治具プレート(切断加工用ベーステーブル)
83 セット治具(個別ベース)
84 ダイシングブレード
86a 第1位置決め筒部(位置決め部)
86b 第2位置決め筒部(位置決め部)
91 隙間
96 加工用治具プレート(加工用ベーステーブル)
U 制御ユニット(制御手段)
Claims (9)
- 加工具を回転させつつ加振させた状態の下で、該加工具をもって、表面強化層を有する化学強化ガラスとしての製品用素板に対して加工を行う強化ガラスの加工方法であって、
前記製品用素板に対する前記加工具の加工に先立ち、表面強化層を有する化学強化ガラスとしての大板基板から前記製品用素板を、ダイシングブレードを用いた切断加工により切り出し、
前記製品用素板に対する前記加工具の加工に際して、該製品用素板の外周面に対する仕上げ加工をも行う、
ことを特徴とすることを特徴とする強化ガラスの加工方法。 - 請求項1において、
上面上に複数の個別ベースを隙間をあけつつ整列させた状態で着脱可能に保持できる切断加工用ベーステーブルと、上面上に、前記切断加工用ベーステーブルにおける隣り合う個別ベース間の隙間よりも広げられた隙間をもって、前記複数の個別ベースを整列した状態で着脱可能に保持できる加工用ベーステーブルと、を用意し、
先ず、前記切断加工用ベーステーブル上に前記複数の個別ベースを保持した上で、該複数の個別ベースの上面に前記大板基板を該複数の個別ベースが覆われるようにして取付け、
次に、前記切断加工用ベーステーブルにおける各隣り合う個別ベース間の隙間の上方領域において、前記大板基板を前記ダイシングブレードをもって切断することにより、前記各製品用素板を該各個別ベース上面にそれぞれ取付けられた状態で切り出し、
次に、前記製品用素板が取付けられた各個別ベースを前記加工用ベーステーブルに保持し、
次に、前記加工用ベーステーブル上における各個別ベース上の製品用素板に対して前記加工具により加工を行って、該各個別ベース上に製品ガラスをそれぞれ形成し、
この後、前記各個別ベースから前記各製品ガラスを外す、
ことを特徴とすることを特徴とする強化ガラスの加工方法。 - 請求項2において、
前記大板基板として、前記切断加工用ベーステーブル上に前記複数の個別ベースが保持された状態において、該複数の個別ベースに適合した状態で重なる枠状模様群と、該枠状模様群に対して所定の配置関係を有する複数の位置合わせマークと、が印刷されているものを用意し、
前記切断加工用ベーステーブルとして、前記複数の個別ベースが保持された状態において、該複数の個別ベースに適合した状態で重なる前記大板基板の枠状模様群に対して所定の位置関係となる複数の位置決め部を有するものを用意し、
さらには、調整用ベーステーブルと、移載部材と、を用意し、
前記調整用ベーステーブルとして、前記大板基板を載置できる載置面と、該載置面上に載置される大板基板の複数の位置合わせマークを位置合わせする複数の位置合わせ部と、該複数の各位置合わせ部に前記複数の各位置合わせマークを位置合わせした状態において、該大板基板の枠状模様群に対する位置関係が、前記切断加工用ベースにおいて、前記複数の個別ベースに適合した状態で重なる前記大板基板の枠状模様群に対する前記複数の位置決め部の位置関係と同一とされる位置決め関与部と、を有するものを用意し、
前記移載部材として、前記複数の位置決め部及び前記複数の位置決め関与部に対して位置決め関係を成立させることができる複数の位置決め関係部を有するものを用意し、
その上で、前記調整用ベーステーブル上に前記大板基板を載置して、該大板基板の複数の各位置合わせマークを前記複数の各位置合わせ部に位置合わせし、
次に、前記複数の各位置合わせマークと前記複数の各位置合わせ部とを位置合わせした状態の下で、前記移載部材の複数の各位置決め関係部と前記複数の各位置決め関与部とを位置決めした状態に維持しつつ、該移載部材を前記調整用ベーステーブル上の前記大板基板に取付け、
次に、前記移載部材が取付けられた大板基板を前記切断加工用ベーステーブルに運んで、該移載部材の複数の各位置決め関係部と前記切断加工用ベーステーブル上の複数の各位置決め部とを位置決めした状態に維持しつつ、該移載部材が取付けられた大板基板を、該切断加工用ベーステーブル上に保持される複数の個別ベースに取付け、
その後、前記移載部材を前記大板基板から外す、
ことを特徴とすることを特徴とする強化ガラスの加工方法。 - 請求項3において、
前記移載部材を前記大板基板に取付けるに際して、接着剤を用いる、
ことを特徴とすることを特徴とする強化ガラスの加工方法。 - 請求項4において、
前記大板基板に前記移載部材を接着する前に、該大板基板にカバーガラスを接着し、
前記移載部材を前記カバーガラスを介して前記大板基板に接着する、
ことを特徴とすることを特徴とする強化ガラスの加工方法。 - 請求項5において、
前記大板基板にカバーガラスを接着するに際して、温水により溶ける接着剤を用いる、
ことを特徴とすることを特徴とする強化ガラスの加工方法。 - 請求項3において、
前記大板基板として、複数枚の大板基板が積層されて該各大板基板の枠状模様群が合わされた積層体が用いられ、
前記積層体を形成するに際して、該積層体における各大板基板の複数の各位置合わせマークと前記調整用ベーステーブルにおける複数の各位置合わせ部とを位置合わせする、
ことを特徴とすることを特徴とする強化ガラスの加工方法。 - 請求項7において、
前記調整用ベーステーブルにおける各位置合わせ部が、上下方向に延びる軸線上に配置される一対の検知カメラによりそれぞれ構成され、
前記積層体を構成する各大板基板が、特定照射光により硬化する接着剤を利用して互いに接着され、
前記積層体を形成するに際して、最下段に配置される大板基板の位置合わせマークを下側の検知カメラの軸線上に位置させる一方、該最下段の大板基板の上に積層する大板基板については、その各積層の度に、該大板基板の位置合わせマークを上側の検知カメラの軸線上に位置させた後、その積層した大板基板とその下側の大板基板との間に介在される接着剤に対して特定照射光を照射する、
ことを特徴とすることを特徴とする強化ガラスの加工方法。 - 請求項1~8のいずれか1項において、
前記強化ガラスとしての製品用素板に対する前記加工具による加振を、該加工具の振幅及び振動数が目標振幅及び目標振動数にそれぞれ近づくようにフィードバック制御すると共に、該目標振幅及び目標振動数を、該製品用素板の加工に伴う該製品用素板の厚み方向各部において変化する値であって該製品用素板の品質を悪化させる品質悪化発生値の範囲に属さないものにそれぞれ設定し、
しかも、前記フィードバック制御におけるサンプル周期として、0.3msec以下の所定サンプル周期を用いる、
ことを特徴とする強化ガラスの加工方法。
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- 2013-08-30 KR KR1020157004890A patent/KR101562770B1/ko active IP Right Grant
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- 2013-08-30 WO PCT/JP2013/073447 patent/WO2014034907A1/ja active Application Filing
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