WO2014034366A1 - 強化ガラス用加工具、強化ガラス用加工装置及び強化ガラス用加工具の使用方法 - Google Patents
強化ガラス用加工具、強化ガラス用加工装置及び強化ガラス用加工具の使用方法 Download PDFInfo
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- WO2014034366A1 WO2014034366A1 PCT/JP2013/070758 JP2013070758W WO2014034366A1 WO 2014034366 A1 WO2014034366 A1 WO 2014034366A1 JP 2013070758 W JP2013070758 W JP 2013070758W WO 2014034366 A1 WO2014034366 A1 WO 2014034366A1
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- Prior art keywords
- processing tool
- processing
- tempered glass
- hole
- recess
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Images
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B1/00—Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes
- B24B1/04—Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes subjecting the grinding or polishing tools, the abrading or polishing medium or work to vibration, e.g. grinding with ultrasonic frequency
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
- B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
- B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
- B24B7/24—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding or polishing glass
- B24B7/247—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding or polishing glass using reciprocating grinding tools
- B24B7/248—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding or polishing glass using reciprocating grinding tools high-frequency reciprocating tools, e.g. magnetically driven
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B9/00—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor
- B24B9/02—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground
- B24B9/06—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain
- B24B9/08—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain of glass
- B24B9/10—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain of glass of plate glass
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D7/00—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting otherwise than only by their periphery, e.g. by the front face; Bushings or mountings therefor
- B24D7/18—Wheels of special form
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
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- B28D1/02—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by sawing
- B28D1/04—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by sawing with circular or cylindrical saw-blades or saw-discs
- B28D1/041—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by sawing with circular or cylindrical saw-blades or saw-discs with cylinder saws, e.g. trepanning; saw cylinders, e.g. having their cutting rim equipped with abrasive particles
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B28D1/14—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by boring or drilling
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/02—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills
- B28D5/021—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by drilling
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
- B28D5/047—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools by ultrasonic cutting
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
- C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
- C03B33/037—Controlling or regulating
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/10—Glass-cutting tools, e.g. scoring tools
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C17/00—Surface treatment of glass, not in the form of fibres or filaments, by coating
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- G—PHYSICS
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- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B13/00—Adaptive control systems, i.e. systems automatically adjusting themselves to have a performance which is optimum according to some preassigned criterion
- G05B13/02—Adaptive control systems, i.e. systems automatically adjusting themselves to have a performance which is optimum according to some preassigned criterion electric
- G05B13/0205—Adaptive control systems, i.e. systems automatically adjusting themselves to have a performance which is optimum according to some preassigned criterion electric not using a model or a simulator of the controlled system
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- G—PHYSICS
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- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B19/00—Programme-control systems
- G05B19/02—Programme-control systems electric
- G05B19/418—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM]
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- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B2219/00—Program-control systems
- G05B2219/30—Nc systems
- G05B2219/45—Nc applications
- G05B2219/45009—Glassforming
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T409/00—Gear cutting, milling, or planing
- Y10T409/30—Milling
- Y10T409/303752—Process
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T409/00—Gear cutting, milling, or planing
- Y10T409/30—Milling
- Y10T409/304312—Milling with means to dampen vibration
Definitions
- the present invention relates to a processing tool for tempered glass, a processing device for tempered glass, and a method of using the processing tool for tempered glass.
- tempered glass is used for display devices such as Assistant.
- This tempered glass has a structure in which a surface tempering layer (chemical tempering layer) is provided on the surface side of the glass base material. Based on this, the tempered glass is designed to reduce the thickness of the tempered glass against bending stress and impact. High strength.
- the surface reinforced layer has a thickness of a certain thickness or more and a surface compressive stress of a predetermined value or more (for example, a surface reinforced layer of 40 ⁇ m or more, a surface compressive stress of 600 MPa or more). Since the processing is not easy, as shown in Patent Document 1, a tempered glass to be processed is prepared with a surface reinforcing layer of 30 ⁇ m or less and a surface compressive stress of 600 MPa or less.
- Patent Document 1 only the workability of tempered glass is emphasized, and with the method according to Patent Document 1, the further thinning and further strengthening that have been required recently are satisfied. I can't.
- Patent Document 2 a groove to be cut must be formed in the surface reinforcing layer, which not only increases the number of processes, but the groove to be cut can only be formed in a straight line, and processing for tempered glass is performed. Has become restrictive.
- the present inventor pays attention to a processing method for rotating a processing tool that has been recognized to be difficult to process the tempered glass as a processing method.
- the inventors found for the first time the conditions under which tempered glass itself can be processed accurately.
- the processing tool has a shaft shape, and at least the outer surface of the tip portion thereof is a diamond abrasive grain holding surface on which diamond abrasive grains are held. Is used.
- the processing tool is to process a tempered glass having a surface tempered layer under a state in which the processing tool rotates around the axis and vibrates in the direction in which the axis extends. A through hole is formed.
- the processing tool tip surface is a flat surface
- the temperature is increased from the radial center portion thereof, and the radial center portion of the processing tool tip surface is directed radially outward.
- the diamond abrasive grains and the holding layer tend to carbonize, and the diamond abrasive grains and the holding layer tend to peel (detach).
- the processing tool when diamond abrasive grains or the like are peeled (desorbed), the processing tool must be replaced with a new processing tool, and the processing tool is not necessarily in a situation where it can be used for a long time.
- the present invention has been made in consideration of such circumstances, and a first object thereof is to provide a processing tool for tempered glass capable of increasing the usable period as much as possible.
- a second object is to provide a processing apparatus for tempered glass using the tempered glass processing tool.
- a third object is to provide a method for using the above tempered glass processing tool.
- a processing tool for tempered glass which is processed into a chemically strengthened glass having a surface strengthening layer in a state of being formed into an axial shape and oscillating around the axis while being vibrated in the direction in which the axis extends.
- At least the outer surface of the tip is a diamond abrasive grain holding surface on which diamond abrasive grains are held, It is set as the structure by which the recessed part is formed in the front end surface in the radial direction center part of the front end surface.
- Preferred embodiments of the first aspect are as described in the second to sixth aspects.
- the outer surface of at least the tip of the processing tool is a diamond abrasive grain holding surface on which diamond abrasive grains are held, It is set as the structure by which the recessed part is formed in the front end surface of the said processing tool in the radial direction center part of the front end surface.
- Preferred embodiments of the seventh aspect are as described in the eighth to fourteenth aspects.
- a processing tool As a processing tool, it is formed into a shaft shape, and at least its outer surface at the tip is a diamond abrasive grain holding surface on which diamond abrasive grains are held, and a recess is formed in the tip surface of the tip surface in the radial center portion thereof.
- Prepare what is formed Processing the chemically tempered glass having a surface reinforcing layer with the processing tool under a state in which the processing tool is rotated about the axis while being vibrated in the direction in which the axis extends. It is set as the structure used as the usage method of the processing tool for tempered glass characterized by this.
- Preferred embodiments of the fifteenth aspect are as described in the sixteenth and subsequent aspects.
- the shaft-shaped tempered glass processing tool when processing chemically tempered glass, is vibrated in the direction of extension of the axis while rotating about the axis.
- the tip surface diamond abrasive grains
- the tip of the tempered glass processing tool is used. Since the recess is formed in the radial center of the surface, the radial center of the tip surface of the tempered glass processing tool collides with the chemically tempered glass based on the vibration based on the recess. It is possible to prevent the heat due to the collision from being concentrated at the central portion in the radial direction of the front end surface.
- the cutting force which entered into the recessed part by the process by the said tempered glass processing tool is centrifugal force.
- the discharged cutting waste is ultrasonically vibrated with a shaft-shaped processing tool and a hole being processed.
- the discharge action to the outside (so-called pumping action: the action of accelerating the cutting waste to promote the discharge) that occurs between the two can be effectively discharged to the outside. Thereby, it can suppress that a processing surface is damaged by cutting waste, or the process of tempered glass is inhibited.
- the communication hole is formed as a pair of slits extending inward in the axially extending direction from the tip of the recess partition peripheral wall portion in the recess partition peripheral wall portion partitioning the recess, Since the pair of slits are arranged so as to face each other, not only can the communication holes be easily formed, but the balanced arrangement of the pair of slits allows the discharge of cutting waste from the recesses and the through holes. Can be made preferable.
- the processing for the chemically strengthened glass is formation of a through hole for the chemically strengthened glass, and when the through hole is formed, it moves while being inscribed in the inner peripheral planned line of the through hole. Therefore, even if a recess is formed in the front end surface of the processing tool for tempered glass (the processing depth of the through hole to be formed (which should be formed) Regardless of the length of the through-hole extending in the axial center, the through-hole can be accurately formed in the chemically strengthened glass while preventing heat from being concentrated in the central portion in the radial direction of the tip surface of the processing tool.
- a cutting waste discharge space (a space between the hole being processed and the processing tool) can be secured, and the cutting waste can be accurately discharged into the discharge space. For this reason, the process with respect to chemically strengthened glass can be appropriately performed without being affected by the cutting waste.
- the grinding fluid supply passage for supplying the grinding fluid is formed therein, and the grinding fluid supply passage is opened in the recess. It is possible to continuously extrude the cutting waste that has entered the recess of the surface into the hole being processed by the grinding liquid, and to positively discharge the extruded cutting waste together with the grinding liquid. For this reason, it can suppress that a problem generate
- the excitation is feedback controlled so that the amplitude and the frequency approach the target amplitude and the target frequency, respectively, and the target amplitude and the target frequency are A surface having high strength because it is a value that changes in each part in the thickness direction of the chemically strengthened glass during processing and does not belong to the range of quality deterioration occurrence values that deteriorate the quality of the chemically strengthened glass.
- a tempered glass having a tempered layer specifically, a surface reinforced layer having a surface compressive layer of 40 ⁇ m or more and a surface compressive stress of 600 MPa or more
- the amplitude and frequency of the processing tool can be prevented from belonging to the range of the quality deterioration occurrence value.
- the review is made at an extremely early timing, and it is assumed that the amplitude or frequency of the processing tool is within the range of the quality deterioration occurrence value. Even if it becomes a value, the amplitude and frequency of the processing tool can be returned to the target amplitude and the target frequency (outside the range of the quality deterioration occurrence value), respectively, at an extremely early timing. For this reason, even if a fine state change during processing such as release of tensile stress inside the chemically tempered glass occurs due to processing of the chemically tempered glass, it can respond (follow up) to the chemical tempered glass. The occurrence of cracks in the tempered glass, chipping exceeding a predetermined level, etc. can be accurately suppressed. As a result, chemically tempered glass can be processed easily and reliably.
- a predetermined sample period of 0.3 msec or less is used based on the knowledge obtained by the present inventor. This is because there is a higher possibility that the processing accuracy of the chemically strengthened glass is lowered (the crack of the chemically strengthened glass and the occurrence of chipping exceeding a predetermined level).
- the shaft-shaped processing tool is vibrated in the axial direction of the processing tool while being rotated about the shaft center of the processing tool.
- the processing apparatus for tempered glass for processing the chemically tempered glass having the surface strengthening layer with the processing tool at least the outer surface of the tip part of the processing tool is a diamond abrasive grain holding surface on which diamond abrasive grains are held. Since the recess is formed in the front end surface of the processing tool at the center in the radial direction of the front end surface, the processing apparatus for tempered glass uses the processing tool for tempered glass according to claim 1. It becomes comprised, and the processing apparatus for tempered glass using the processing tool for tempered glass which concerns on Claim 1 can be provided.
- the processing on the chemically strengthened glass is formation of a through hole in the chemically strengthened glass, and the processing tool is inscribed in the inner peripheral planned line of the through hole when forming the through hole. Therefore, even if the tip of the tempered glass processing tool has a recess, the processing depth of the through-hole to be formed (formation) is set to move while moving (set to use helical processing). Regardless of the length of the through-hole to extend in the axial center, the through-hole can be accurately formed in the chemically strengthened glass while preventing heat from being concentrated in the central portion in the radial direction of the tip surface of the processing tool. .
- a cutting waste discharge space can be secured at the rear of the processing tool in the moving direction, and the processing on the chemically strengthened glass can be appropriately performed without being obstructed by the cutting waste.
- the rotation direction of the processing tool is set as the rotation direction (so-called down cut) toward the inner peripheral planned line of the through hole on the moving side of the processing tool. Even when the inner peripheral surface of a hole being processed (hole before completion of the through hole) is processed by the side portion of the processing tool, the cutting waste resulting from the processing is smoothly transferred to the discharge space behind the moving direction of the processing tool. It is possible to prevent the occurrence of chipping due to the inclusion of cutting waste.
- the centrifugal force is applied to the cutting waste which entered into the recess by processing with a processing tool. It can be actively discharged to the outside of the side portion of the tempered glass processing tool through the communication hole, and the discharged cutting waste is oscillated between the shaft-shaped processing tool ultrasonically vibrated and the hole being processed. It is possible to effectively discharge to the outside by effectively utilizing the discharge action to the outside (so-called pumping action: action to accelerate the discharge by applying acceleration to the cutting waste). Thereby, it can control that a processing surface is damaged by cutting waste, or processing of chemically strengthened glass is inhibited.
- the communication hole is a pair of slits extending inward in the axial direction of the processing tool from the tip of the recess partition peripheral wall portion in the recess partition peripheral wall portion partitioning the recess. Since the pair of slits are arranged so as to face each other, not only can the communication holes be easily formed, but the balanced arrangement of the pair of slits allows the discharge of cutting waste from the recess. Further, the processing for chemically strengthened glass can be made preferable.
- the liquid injection device for injecting the grinding liquid is provided near the processing position of the processing tool with respect to the chemically strengthened glass, not only the chemically strengthened glass and the processing tool can be cooled, Cutting waste can be positively discharged from the hole in the process of chemically strengthened glass. For this reason, it can suppress that a problem generate
- the grinding fluid supply passage for supplying the grinding fluid is formed inside the processing tool, and the grinding fluid supply passage is opened in the recess. It is possible to continuously extrude the cutting waste that has entered the recess of the tool tip surface into the hole being processed by the grinding liquid, and positively discharge the extruded cutting waste together with the grinding liquid. For this reason, it can suppress that a problem generate
- the vibration control mechanism that vibrates the processing tool toward the chemically strengthened glass, the vibration adjustment unit that adjusts the vibration mechanism, and the vibration adjustment unit are controlled.
- the vibration of the chemically tempered glass by the processing tool is feedback controlled so that the amplitude and frequency of the processing tool approach the target amplitude and target frequency, respectively, and the target amplitude and target frequency are It is a value that changes at each part in the thickness direction of the chemically strengthened glass accompanying the processing of the chemically strengthened glass, and does not belong to the range of the quality deterioration occurrence value that deteriorates the quality of the chemically strengthened glass.
- a control means for executing the control every predetermined sample period of 0.3 msec or less, so that ultrasonic vibration machining in a state where the processing tool is rotated while being vibrated is provided.
- a tempered glass having a surface reinforced layer specifically, a surface reinforced layer having a thickness of 40 ⁇ m or more and a surface compressive stress of 600 MPa or more
- the processing apparatus for tempered glass using the processing tool for tempered glass which concerns on the above-mentioned Claim 6 can be provided.
- the processing tool has an axial shape, and at least the outer surface of the tip portion is a diamond abrasive grain holding surface in which diamond abrasive grains are held, and the tip surface has the A tool having a recess formed in the central portion in the radial direction of the distal end surface is prepared, and the processing tool is rotated in the direction of the axial center while rotating about the axial center, and the applied Since a tool is used to process a chemically strengthened glass having a surface strengthened layer, the chemically strengthened glass is processed using the processing tool for strengthened glass according to claim 1. For this reason, the usage method of the processing tool for tempered glass which concerns on Claim 1 can be provided.
- the processing for the chemically strengthened glass is formation of a through hole for the chemically strengthened glass, and when the through hole is formed, the processing tool is inscribed in the inner peripheral planned line of the through hole. Since it is moved while moving (so-called helical processing), even if a recess is formed in the tip surface of the processing tool, the processing depth of the through hole to be formed (the length of the through hole to be formed in the axial direction) Regardless of this, it is possible to accurately form the through-hole in the chemically strengthened glass while preventing heat from being concentrated in the central portion in the radial direction of the tip surface of the processing tool.
- a cutting waste discharge space can be secured behind the processing tool in the moving direction, and the cutting waste can be accurately discharged into the discharge space. For this reason, the process with respect to chemically strengthened glass can be appropriately performed without being affected by the cutting waste.
- the rotation direction of the processing tool is set to the rotation direction (so-called down cut) toward the inner peripheral planned line of the through hole on the moving side of the processing tool, even when the inner peripheral surface of the hole being machined is machined by the shaft part of the tool, the cutting waste accompanying the machining can be smoothly discharged into the discharge space behind the moving direction of the processing tool, For example, chipping can be suppressed from occurring in the chemically strengthened glass.
- the processing tool having a communication hole in the side portion that communicates the inside and outside of the recess since the processing tool having a communication hole in the side portion that communicates the inside and outside of the recess is used, the cutting waste that has entered the recess due to processing by the processing tool is subjected to centrifugal force. It can be actively discharged from the communicating hole to the outside of the side of the tempered glass processing tool, and the discharged cutting waste is removed between the shaft-shaped processing tool that is ultrasonically vibrated and the hole being processed. Effectively utilizing the generated discharge action to the outside (pumping action: action to accelerate the discharge by applying acceleration to the cutting waste), the discharge can be effectively discharged to the outside. Thereby, it can control that a processing surface is damaged by cutting waste, or processing of chemically strengthened glass is inhibited.
- the communication hole is formed in the recess partition peripheral wall portion that defines the recess, and extends inwardly in the axial extension direction of the processing tool from the tip of the recess partition peripheral wall portion. Since it uses what was formed as a pair of slits arranged in a state of being opposed to each other while extending, not only can the communication holes be easily formed, but the balanced arrangement of the pair of slits allows the inside of the recess to be The discharge of cutting waste, processing on chemically strengthened glass, and the like can be made preferable.
- the grinding liquid when processing the chemically strengthened glass with the processing tool, the grinding liquid is injected near the processing position of the processing tool with respect to the chemically strengthened glass, so that the chemically strengthened glass and the processing tool are cooled. Not only can the cutting waste be positively discharged from the hole in the processing of the chemically strengthened glass.
- the grinding liquid supply passage that opens into the recess is formed inside the processing tool, and the grinding liquid is supplied into the recess from the grinding liquid supply passage.
- the cutting waste that has entered the recess on the front end surface of the processing tool by processing can be continuously extruded from the hole being processed by the grinding fluid, and the extruded cutting waste can be positively discharged to the outside together with the grinding fluid. For this reason, it can suppress that a problem generate
- the start hole for forming the long hole is moved while the processing tool is inscribed in a predetermined inner peripheral line of the start hole. After that, the state in which the processing tool is passed through the start hole is used as the subsequent processing start state of the processing tool. Since it is moved while being inscribed, a long hole can be accurately formed by using a processing tool.
- a processing tool As the helical processing is applied to the chemically strengthened glass, a cutting waste discharge space is formed in the chemically strengthened glass, and the cutting waste is discharged into the discharge space. It can suppress that the processing of glass is adversely affected.
- the rotation direction of the processing tool is set to the rotation direction (so-called down cut) toward the inner peripheral planned lines of the long hole and the start hole on the moving side of the processing tool. Therefore, even when chemically tempered glass is processed by the tip surface and the shaft portion of the processing tool, the cutting waste accompanying the processing can be smoothly discharged into the discharge space behind the processing tool in the moving direction. The occurrence of chipping in the chemically strengthened glass due to entrainment or the like can be suppressed.
- the vibration of the chemically strengthened glass by the processing tool is feedback-controlled so that the amplitude and frequency of the processing tool approach the target amplitude and the target frequency, respectively, and the target amplitude and The target frequency is a value that changes in each part in the thickness direction of the chemically strengthened glass accompanying the processing of the chemically strengthened glass, and does not belong to the range of the quality deterioration occurrence value that deteriorates the quality of the chemically strengthened glass.
- the predetermined sample period of 0.3 msec or less is used as a sample period in the said feedback control, the effect similar to the above-mentioned Claim 6, 14 is produced.
- Explanatory drawing explaining the laminated body of the tempered glass which is a process target.
- the enlarged photograph figure (magnification: 270 times) which shows the part corresponded to the A section of FIG. 13 in the protective glass for portable terminals which concerns on a comparative example.
- the enlarged photograph figure (magnification: 270 times) which shows the part corresponded to the B section of FIG. 13 in the protective glass for portable terminals which concerns on a comparative example.
- the enlarged photograph figure (magnification: 270 times) which shows the part corresponded to the C section of FIG. 13 in the protective glass for portable terminals which concerns on a comparative example.
- the enlarged photograph figure (magnification: 90 times) which shows the part corresponded to the D section of FIG. 13 in the protective glass for portable terminals which concerns on a comparative example.
- the front view which shows a preferable shaft-shaped processing tool.
- the partial expansion perspective view which looked at the processing tool shown in FIG. 23 from the front end side.
- the enlarged view which shows the front end surface of the processing tool shown in FIG. FIG. 24 is an enlarged sectional view taken along line X26-X26 of FIG.
- the enlarged photograph figure (magnification: 270 times) which shows the initial stage deterioration state of the processing tool tip surface at the time of processing the through-hole of the same diameter as the processing tool straightly into tempered glass using the processing tool shown in FIG.
- the enlarged photograph figure (magnification: 270 times) which shows the deterioration state of the processing tool tip surface at the time of performing a helical process when forming a through-hole in tempered glass using the processing tool shown in FIG. 29 is an enlarged photograph (magnification: 270 times) showing a state in which the diamond abrasive grains and the holding layer thereof have been peeled over substantially the entire tip surface of the processing tool as the further processing from FIG. 29 progresses.
- FIG. 44 is an operation state explanatory diagram showing operation changes from FIG. 43;
- tempered glass as a processing target
- an ultrasonic vibration processing device as a processing device for tempered glass for processing the tempered glass
- a processing method and processing of tempered glass using the ultrasonic vibration processing device Description will be given in the order of quality comparison, preferred processing tool used in the ultrasonic vibration processing apparatus, and a method of using the processing tool.
- the tempered glass 1 is configured such that a surface strengthening layer (chemical strengthening layer) 3 is provided on the front surface side (back surface side) of a glass base material (for example, aluminosilicate glass) 2. .
- the surface strengthened layer 3 ensures that the tempered glass 1 has high strength against bending stress and impact while reducing the thickness.
- a base material 2 having a thickness ⁇ 1 of about 0.7 mm and a surface reinforced layer 3 having a thickness ⁇ 2 of 40 ⁇ m or more (currently 70 ⁇ m has been developed, of course, Targets for processing), and those whose surface compressive stress is 600 MPa to 700 MPa.
- the tempered glass 1 but also normal glass is a processing target of the ultrasonic vibration processing apparatus.
- the ultrasonic vibration processing device 4 includes a processing device main body 5 as shown in FIG.
- the processing apparatus main body 5 includes a relatively long bottomed cylindrical housing 6, a vibration device (vibration mechanism) 7 held in the housing 6, and the vibration device. 7 and a motor 9 as a rotational drive source for rotationally driving the excitation device 7.
- the housing 6 has an elevating device (only a part (attachment portion to the housing 6 is shown in FIG. 2)) 10 with its axis extending in the vertical direction and its opening facing downward. Installed on.
- the elevating device 10 has a function of moving the housing 6 up and down in the vertical direction and adjusting the elevating speed at that time (see arrows). With the function of the elevating device 10, the housing 6 is predetermined during processing. It is lowered at the set speed (feed speed).
- the vibration device 7 includes a cylindrical body portion 11 and a cylindrical ultrasonic vibration generation unit 12 that is held by the body portion 11 and generates ultrasonic vibrations.
- the body portion 11 is held on the inner peripheral surface of the housing 6 with a bearing 13 in a state where its axis is directed in the vertical direction, and the body portion 11 is centered on the axis by the bearing 13. It is relatively rotatable and cannot move in the axial direction (vertical direction).
- a cylindrical mounting tube portion 14 for mounting the drive shaft 9a of the motor 9 is formed at the upper end portion of the body portion 11, and a holding hole (not shown) is formed at the lower end surface of the body portion 11. Yes.
- the ultrasonic vibration generating unit 12 is held in the holding hole in the lower end surface of the body part 11.
- the ultrasonic vibration generating unit 12 is configured in a state where an ultrasonic vibrator, a vibration transmitting unit, and an amplifying unit are connected in series, and these are formed from the inside of the holding hole of the body unit 11.
- the ultrasonic transducer, the vibration transmission unit, and the amplification unit are arranged in this order toward the opening side.
- the ultrasonic vibrator has a piezoelectric body and a metal block for bolting the piezoelectric body, and electrodes (not shown) are arranged between the piezoelectric bodies and between the piezoelectric body and the metal blocks. By applying a DC voltage pulse voltage between the electrodes, longitudinal vibration is excited in the piezoelectric body.
- the vibration transmission unit has a function of transmitting the vibration of the ultrasonic transducer to the amplification unit, and the amplification unit has a function of amplifying the vibration transmitted from the vibration transmission unit.
- the processing tool 8 is connected to the amplification section on the axis of the ultrasonic vibration generating unit 12 as shown in FIG. 2 so as to vibrate by the vibration of the ultrasonic vibration generating unit 12. ing.
- the processing tool 8 directly contacts the tempered glass 1 to process the tempered glass.
- a shaft-shaped diamond grindstone is used, and the shaft-shaped processing tool 8 is The ultrasonic vibration generating unit 12 extends downward.
- the processing tool 8 not only processes the tempered glass that is a processing target, but also functions as a sensor that detects pressure fluctuations of the tempered glass.
- the motor 9 is attached to the outer surface (upper end surface) of the bottom 6a of the housing 6.
- a through hole 15 is formed in the bottom portion 6a of the housing 6 so as to penetrate the inside and outside of the housing 6.
- the drive shaft 9a of the motor 9 passes through the through hole 15 and is fitted into the mounting cylinder portion 14 in the body portion 11. It is held together (fixed). Thereby, the driving force of the motor 9 is transmitted to the processing tool 8 via the body part 11 and the ultrasonic vibration generating unit 12, and the processing tool 8 can rotate about its axis.
- the ultrasonic vibration processing device 4 includes an ultrasonic oscillator (vibration adjusting means) 16 that adjusts the amplitude and frequency of the ultrasonic vibration generating unit 12 as shown in FIGS. .
- the ultrasonic oscillator 16 is to adjust an input electric signal (specifically, voltage or current) and apply the adjusted electric signal to the ultrasonic vibration generating unit 12 (ultrasonic vibrator).
- the amplitude and frequency (frequency) of the input voltage from the power source are adjusted under a constant current (for example, a predetermined value of 1 to 2 A), and the adjusted voltage signal (for example, 300 to 400 V) is obtained.
- a constant current for example, a predetermined value of 1 to 2 A
- the adjusted voltage signal for example, 300 to 400 V
- a current signal may be applied to the ultrasonic transducer under a constant voltage.
- the ultrasonic vibration machining device 4 includes a control unit U as a control unit that feedback-controls the ultrasonic oscillator 16 (ultrasonic vibration generation unit 12) and the motor 9. I have.
- a voltage signal (voltage amplitude, frequency signal) from the ultrasonic oscillator 16 and a rotation speed signal (voltage signal) of the motor 9 are input to the control unit U, while an ultrasonic wave is input from the control unit U. Control signals are output to the oscillator 16 and the motor 9, respectively.
- the control unit U includes a setting unit (setting unit) for setting a target value for feedback control, and a determination unit that determines an operation variable based on a deviation between the target value of the setting unit and the control variable. (Determination unit) and an execution control unit (execution control unit) that outputs a control signal to execute an operation variable from the determination unit.
- the setting unit sets a target amplitude and a target frequency with respect to an input voltage to the ultrasonic vibration generation unit 12 (ultrasonic transducer) as a target value for feedback control.
- They are values that change at each part in the thickness direction of the tempered glass accompanying the processing of the tempered glass, and values of quality deterioration that deteriorate the quality of the tempered glass (values that generate cracks, chipping above a predetermined level, etc.) Something that does not belong to the range is set. This is because a change in stress inside the tempered glass accompanying processing such as release of tensile stress inside the tempered glass accompanying processing of the tempered glass is taken into consideration.
- a target current is set from the viewpoint of effective rotation for machining.
- the target amplitude of the input voltage to the ultrasonic vibration generating unit 12 is finally a predetermined amplitude (preferably 8 ⁇ m) in the range where the amplitude of the processing tool 8 is in the range of 3 ⁇ m to 9 ⁇ m (not belonging to the range of the quality deterioration occurrence value).
- the amplitude of the processing tool 8 is less than 3 ⁇ m or more than 9 ⁇ m, the quality deterioration occurrence value range is set.
- the target amplitude is set in the range of 3 ⁇ m to 9 ⁇ m in the final amplitude of the processing tool 8 because, based on the knowledge obtained by the present inventor, the processing capability is not sufficient below 3 ⁇ m (cutting chips). Etc., and the cutting resistance etc.
- the frequency of the processing tool 8 is finally in the range of 60 kHz to 64 kHz (not belonging to the range of the quality deterioration occurrence value).
- the frequency of the processing tool 8 is set to be a predetermined frequency (preferably 63 kHz) and the frequency of the processing tool 8 is less than 60 kHz and more than 64 kHz, the quality deterioration occurrence value range is set.
- the target frequency is set to 60 kHz to 64 kHz in the final frequency of the processing tool 8 based on the knowledge of the inventors of the present invention.
- the target current for the motor 9 is set so that the rotational speed of the processing tool 8 finally becomes a predetermined rotational speed (preferably 5000 rpm) in the range of 2000 rpm to 30000 rpm.
- the rotational speed of the processing tool 8 is in the range of 2000 rpm to 30000 rpm. If the rotational speed is less than 2000 rpm, the effect of processing on the tempered glass is not sufficient. This is because the effect of processing is reduced to cause a problem from the viewpoint of durability.
- reference numeral 18 denotes a set value input unit for inputting a set value to the set unit.
- the determination unit determines an operation variable from the deviation between the amplitude of the voltage (return voltage) from the ultrasonic oscillator 16 and the target amplitude of the setting unit, and the frequency of the processing tool 8 With respect to, the operation variable is determined from the deviation between the frequency of the voltage (return voltage) from the ultrasonic oscillator 16 and the target frequency of the setting unit. Moreover, regarding the rotation speed of the processing tool 8, an operation variable is determined from the deviation between the current signal from the motor 9 and the target current of the setting unit.
- the execution control unit is to output each operation variable from the determination unit to the ultrasonic oscillator 16 and the motor 9 as a control signal.
- the output voltage (amplitude, frequency) from the ultrasonic oscillator 16 is adjusted, and the processing tool 8 is feedback controlled so as to have a predetermined vertical amplitude and a predetermined frequency.
- the rotational speed is feedback controlled, and the processing tool 8 is maintained at a predetermined rotational speed.
- the control unit U performs the feedback control with a predetermined sample period (preferably 0.2 msec) within a range of 0.3 msec to 0.2 msec in which the sample period (response speed) is 0.3 msec or less.
- a predetermined sample period preferably 0.2 msec
- the predetermined sample period within the range of 0.3 msec to 0.2 msec cannot follow the minute stress change during the processing of tempered glass if it exceeds 0.3 msec. This is because there is an increased possibility that cracks, chipping exceeding a predetermined level, etc. occur in the tempered glass.
- 0.2 msec is set as the lower limit because it is the lowest limit that can be obtained at the present time, and feedback control cannot be actually performed with a sample period less than that value. . It will be more preferable if a value of less than 0.2 msec is developed in the future.
- the analog / digital conversion function and the arithmetic processing capability of the CPU are speeded up as compared with the conventional one in order to speed up the sampling period of the feedback control.
- the frequency (frequency) of the processing tool 8 is set to 80 kHz and the sample period is set to 0.2 msec, before the oscillation occurs in the optimum environment corresponding to the load variation.
- the vibration impact applied to the tempered glass can be suppressed to 16 times.
- the oscillation environment is optimized with a sample period of 0.2 msec under the feed rate of the processing tool 8 of 30 mm / min, the progress of the processing is feedback-controlled every 0.1 ⁇ m. It is possible to cope with (follow up) a minute state change (stress change).
- the frequency (frequency) of the processing tool 8 is 80 kHz
- a vibration impact is applied to the tempered glass once every 0.0000125 seconds (0.0125 ms).
- the sample period (oscillation response speed) is 10 msec (in the case of a conventional control unit)
- 800 times of vibration shock is given to the tempered glass until oscillation occurs in the optimum environment corresponding to the load fluctuation.
- the oscillation environment is optimized with a sample period of 10 msec under the feed speed of the processing tool 8 of 30 mm / min, the progress of the processing becomes 5 ⁇ m.
- Such 5 ⁇ m is a value that is relatively large with respect to the surface reinforced layer of several tens of ⁇ m, and the response for each 5 ⁇ m cannot follow the state change of the tempered glass. As a result, processing must be performed while applying stress to the tempered glass, and cracks and the like are generated in the tempered glass.
- Target value of control, etc. is supported by the following processing experiments 1 to 3 conducted by the present inventors.
- the processing experiments 1 to 3 were performed on the tempered glass under the following common experimental conditions, and the evaluation was performed based on the following common evaluation criteria.
- Tempered glass base material as processing object for common experimental conditions Aluminosilicate glass Base material thickness ⁇ 1: 0.70 mm
- Compressive residual stress of the surface reinforcing layer 600 MPa to 700 MPa
- Processing tool 8 Processing feed rate: 60mm / min
- Particle size of processing tool 8 # 600
- the target frequency of the processing tool 8 is preferably 60 kHz to 64 kHz (particularly 63 kHz) (less than 60 kHz and those exceeding 64 kHz are within the range of quality deterioration occurrence values). did.
- the contents shown in FIG. 5 were obtained. According to the contents shown in FIG. 5, it was found that the amplitude of the processing tool 8 is preferably 3 ⁇ m to 9 ⁇ m (particularly 8 ⁇ m) (less than 3 ⁇ m and those exceeding 9 ⁇ m are within the range of quality deterioration occurrence values).
- Processing experiment 3 (e-1) Focusing on the importance of the sample period for feedback control of processing for tempered glass that undergoes a minute state change during processing, target amplitude of processing tool 8: 8 ⁇ m, target frequency of processing tool 8 : An experiment was conducted in which the sampling period (response speed) of feedback control was changed under the condition of fixing at 63 kHz.
- FIG. 7 shows the relationship between the feedback control sample period (response speed) and the machining success rate. According to FIG. 7, the smaller the response speed, the higher the machining success rate. In particular, at 0.5 ms or less, the machining success rate increased with a sudden rise.
- the evaluation of the processing success is the same as the above-described evaluation ( ⁇ ). In FIG. 6, the processing success rate of 87% or more was evaluated as “ ⁇ ”.
- a tempered glass having a surface reinforcing layer 3 (specifically, a base material having a thickness of 0.7 mm, a surface reinforcing layer having a thickness of 40 ⁇ m or more, and a surface compressive stress of 600 MPa or more) 1
- a large board This is for cutting out a predetermined shape from a large substrate in order to produce protective glasses for portable terminals, tablets, and the like.
- a laminated body in which a plurality of (for example, 12) large substrates (tempered glass 1) are bonded in a laminated state with an adhesive 20 (adhesive layer 80 ⁇ m to 100 ⁇ m).
- Glass group 1A is prepared.
- the adhesive 20 is preferably a UV curable adhesive or the like that is cured by ultraviolet rays and is melted by warm water. This is because it is necessary to quickly cure the adhesive, and finally to peel off each tempered glass cut out.
- the glass 1n which comprises the outermost surface (front surface, back surface) of 1 A of laminated bodies, you may use normal glass with low cost instead of tempered glass. This is because the outermost surface of the laminate 1A tends to be particularly susceptible to chipping.
- substrate (tempered glass 1) with a base material thickness of 0.5 mm you may prepare the laminated body 1A which adhered 16 sheets.
- the laminated body 1 ⁇ / b> A is set on a thick plate-shaped fixing base 21.
- a plurality of grooves (not shown) are formed on the upper surface of the fixing base 21, and communication holes 22 connected to the respective grooves are opened from the side surfaces through the inside of the fixing base 21.
- a suction device (not shown), not shown, is connected to each communication hole 22, and air above the fixed base 21 is sucked through the groove on the top surface of the fixed base 21 and the communication hole 22. Is supposed to. Thereby, the laminated body 1A set on the fixed base 21 is fixed to the fixed base 21 based on this suction action.
- a plurality of portable terminal protective glass sizes are cut out from the laminate 1A.
- grinding is performed so as to form the long holes 23 and the square holes 24 in the respective laminated blocks 1a.
- the laminated body 1A other than the laminated block 1a is removed, and as shown in FIG. 12, the outer periphery of each laminated block 1a, the long hole 23
- finish grinding is performed on the square hole 24.
- each laminated block 1a is maintained in a state of being fixed to the fixed base 21 based on the suction action.
- the fixed base 21 is shown in a contracted state, and the long holes 23 and the square holes 24 formed in the laminated block 1a are omitted.
- the tempering accompanying the processing of the tempered glass is basically performed to prevent the occurrence of cracking, chipping, etc. of the tempered glass.
- the thing outside the range of the quality deterioration generation value (crack of tempered glass, generation
- the target amplitude of the processing tool 8 is preferably within a range of 3 ⁇ m to 9 ⁇ m, for example, 8 ⁇ m, and the target frequency of the processing tool 8 is preferably within a range of 60 kHz to 64 kHz, for example, 63 kHz.
- the reason for setting the target amplitude of the processing tool 8 within the range of 3 ⁇ m to 9 ⁇ m and the reason for setting the target frequency of the processing tool 8 within the range of 60 kHz to 64 kHz are as described above.
- 0.2 msec which is 0.3 msec or less, is used as the sampling period in the feedback control in this case. This is because the stress change generated inside the tempered glass can be quickly grasped, the stress on the tempered glass can be reduced, and the occurrence of cracks in the tempered glass can be prevented accurately.
- the processing tool 8 is rotated at a predetermined rotational speed of 5000 rpm within a range of 2000 rpm to 30000 rpm. This is to obtain a preferable effect by the rotation of the processing tool 8 while sufficiently exerting the effect of the ultrasonic vibration processing.
- general conditions are used for other processing conditions.
- the laminated block 1a that has been processed through the polishing process is immersed in warm water through a chemical treatment for strengthening the glass end face such as hydrofluoric acid, and each tempered glass 1 is peeled off. Thereby, the processed tempered glass is obtained as a product (protective glass for portable terminals, etc.).
- the preparation method of the test glass is the same as the processing method of the tempered glass described above. That is, a tempered glass having a surface reinforcing layer (specifically, a base material: aluminosilicate glass, a base material thickness of 0.7 mm, a surface reinforcing layer of 40 ⁇ m, and a surface compressive stress of 600 MPa) is a large substrate. Prepare 12 sheets that are laminated and fixed by using UV curing adhesive, etc., then cut out the size of the protective glass for the portable terminal (laminated block 1a), and for the cut out, The long hole 23 and the square hole 24 are ground (primary processing) to produce a primary processed product (laminated body).
- a surface reinforcing layer specifically, a base material: aluminosilicate glass, a base material thickness of 0.7 mm, a surface reinforcing layer of 40 ⁇ m, and a surface compressive stress of 600 MPa
- the outer periphery, the long hole 23, and the square hole 24 in the primary processed product are chamfered (secondary processing) to create a secondary processed product (laminate).
- polish processing is performed on the secondary processed product, and then each glass plate of the laminated block 1a that has been processed is immersed in warm water and peeled off to obtain a glass for testing (for evaluation).
- the above-described ultrasonic vibration processing device 4 is used in the primary processing and the secondary processing, and the processing conditions in the primary processing and the secondary processing are as follows.
- Primary processing condition processing tool 8 Type Axial diamond wheel (grain size: # 320) Diameter: 1.5mm Feeding speed: 60mm / min Amplitude: 8 ⁇ m Frequency: 63kHz Sample period (response speed) of feedback control: 0.2 msec Rotation speed: 5000rpm
- Secondary processing condition processing tool 8 Type Axial diamond wheel (grain size: # 600) Diameter: 1.5mm Feeding speed: 60mm / min Amplitude: 5 ⁇ m Frequency: 63kHz Sample period (response speed) of feedback control: 0.2 msec Rotation speed: 5000rpm
- each part A to E of the test glass is in any processing stage (after primary processing, secondary processing, polishing Even in the state of (after processing), a good processing state was shown.
- Primary processing condition processing tool 8 Type Axial diamond wheel (grain size: # 320) Diameter: 1.5mm Feeding speed: 60mm / min Amplitude: 8 ⁇ m Frequency: 50kHz Sample period (response speed) of feedback control: 10 msec Rotation speed: 5000rpm
- the processing tool 8 described so far is an axial diamond grindstone having a flat tip surface 8c. From this point of view, as the processing tool 8, as shown in FIGS. 23 to 26, an axial diamond grindstone having a recess 30 in the tip surface 8c is preferable.
- the temperature increases from the central portion in the radial direction, and from the central portion in the radial direction on the front end surface of the processing tool to the radially outward side.
- the diamond abrasive grains and their holding layer may be carbonized, and the diamond abrasive grains and holding layer may be peeled (desorbed), thereby eliminating the problem and improving durability. We are trying to raise it.
- FIGS. 27 to 30 are enlarged photographs (magnification: 270 ⁇ ) specifically showing the above situation (problem of the processing tool having a flat tip surface).
- FIG. 27 is an enlarged photograph of a processing tool that has a flat processing tip surface and is unused, as seen from the processing tip surface side.
- the central portion in the radial direction of the processing tool is white relative to the surroundings, because this is due to the reflection of light.
- FIG. 28 shows that the processing tool shown in FIG. 27 (with the processing tool tip surface flattened) is vibrated and rotated (with ultrasonic vibration processing), and the processing tool is straightened.
- FIG. 27 shows that the processing tool shown in FIG. 27 (with the processing tool tip surface flattened) is vibrated and rotated (with ultrasonic vibration processing), and the processing tool is straightened.
- FIG. 4 is an enlarged photograph showing an initial deterioration state of the processing tool tip end surface 8c when a through hole having a diameter substantially the same as that of the processing tool is formed in the tempered glass 1 by being lowered.
- FIG. 28 shows that the diamond abrasive grains and the holding layer thereof are peeled off at the radial center of the processing tool front end surface 8c, and the base material is exposed from the part (the front end surface of the processing tool front surface). (Refer to the portion that appears white and appears to be a plurality of concentric streaks in the radial center.)
- FIG. 29 shows a helical process when forming a through hole in the tempered glass using the processing tool shown in FIG.
- the processing tool 8 is It is an enlarged photograph figure which shows the deterioration state of the processing tool front end surface at the time of performing the process which makes it move and descend
- the diamond abrasive grains and the holding layer thereof are carbonized and peeled gradually with a circle centered at the position eccentric from the radial center. Is shown (see the white circle in FIG.
- FIG. 30 is an enlarged photograph showing a deteriorated state of the processing tool tip surface 8c when further processing is performed from the state of FIG. FIG. 30 shows a state in which the diamond abrasive grains and the holding layer thereof have been peeled over substantially the entire processing tool front end surface 8c.
- the radial center portion of the tip surface 8 c (diamond abrasive grains). It can be understood that the carbonization and peeling of the diamond abrasive grains and the holding layer proceed from there to the outside in the radial direction of the front end face 8c.
- the rotational force of the processing tool 8 (the peripheral speed faster toward the radially outer side). Will act on the tempered glass 1 as a frictional force, and it is considered that the amount of wear of the diamond abrasive grains is increased.
- the rotational force of the processing tool 8 is a frictional force at the radial center of the processing tool tip end surface 8c. (The peripheral speed is 0 at the axial center of the processing tool 8), only the collision force with the tempered glass 1 based on the vibration of the vibration tool 8 works on the diamond abrasive grains there. This is because the wear amount of diamond abrasive grains is considered to be small.
- the diamond abrasive grain Pr2 has the minimum wear amount h0, whereas the diamond abrasive grain Pr2 The wear amount of h2 is h2, which is larger than h0.
- the diamond abrasive grain most protruding from the processing tool tip surface 8c is The diamond abrasive grains that are most prominent on the processing tool front end surface 8c are changed to Pr0 and Pr1 instead of Pr2 to new diamond abrasive grains Pr1 (immediately after the n-th machining). For this reason, at the time of the next processing (at the time of the (n + 1) th processing), the processing tool 8 includes the diamond abrasive grain Pr0 in the radial center on the processing tool tip surface 8c and the radially outward side on the processing tool tip surface 8c.
- the diamond abrasive grains collide with the tempered glass 1 through the new diamond abrasive grains Pr1, and the diamond abrasive grains colliding with the tempered glass 1 in this way are replaced at the center in the radial direction of the processing tool front end face 8c.
- the degree of collision is changed.
- the present inventor concentrated heat generated at the time of collision on the diamond abrasive grains Pr0 at the center in the radial direction of the processing tool front end surface 8c, and carbonization of the diamond abrasive grains started from there. It is considered that carbonization gradually spreads outward in the radial direction of the processing tool front end surface 8c.
- the present inventor eliminates the collision between the diamond abrasive grains in the radial center portion of the processing tool tip end surface 8c and the tempered glass 1, and the diamond abrasive grains in the radial center portion, etc.
- the idea of forming the recess 30 in the central portion in the radial direction of the processing tool distal end surface 8c was completed, and the present invention was completed.
- the processing tool 8 improved from the viewpoint of durability will be described in detail.
- the collision frequency between the diamond abrasive grains and the tempered glass 1 is reduced while ensuring the processing.
- it is not particularly limited.
- the processing tool 8 has a large diameter region from the base end portion (the portion connected to the amplifying portion of the ultrasonic vibration generating unit 12 described above) to about half the total length.
- a region from the large diameter portion 8a to the tip of the processing tool 8 is a small diameter portion 8b having a smaller diameter than the large diameter portion 8a.
- a region (tip portion) approximately half the length from the tip of the processing tool 8 is a diamond electrodeposited portion 8b-1, and the diamond electrodeposited portion 8b-1
- the diamond abrasive grains are held by using a holding layer (plating layer: not shown) on the peripheral surface and the tip surface (processing tool tip surface 8c). (Specifically, it is held (attached) to the base material via a holding layer).
- a holding layer plating layer: not shown
- the tip surface processing tool tip surface 8c
- the diamond abrasive grains various grains having a grain size of # 600, # 1000, etc. are used, and these are properly used depending on the object to be processed.
- a recess 30 is formed in the front end surface 8c of the processing tool 8 as shown in FIGS.
- the recess 30 is formed as a circular hole having the same axis as that of the diamond electrodeposited portion 8b-1, and the periphery of the recess (circular hole) 30 is defined by a recess partition peripheral wall 31. ing.
- the diameter of the recess 30 is set to about 1/3 to 1 / 2D with respect to the diameter D of the diamond electrodeposit 8b-1, and the depth of the recess 30 is set to The length is set from about 30 to about 1.5 times the diameter of the recess 30.
- the diamond abrasive grains are also held on the inner surface of the recess 30.
- a slit 32 is formed in the recess section peripheral wall portion 31 as a communication hole for communicating the inside and outside of the recess 30.
- a pair of the slits 32 are provided in a state of being opposed to each other, and each of the slits 32 extends from the processing tool distal end surface 8c to the inner side in the axial direction of the processing tool 8.
- the slit 32 is set to have a length in the extending direction shorter than the depth of the recess 30 (for example, a length slightly longer than half of the depth of the recess 30).
- the width of the slit 32 is set to be shorter than the length of the slit 32 in the extending direction.
- the processing tool 8 is used by being connected to the amplifying part of the ultrasonic vibration generating unit 12 in the ultrasonic vibration processing device 4, and the ultrasonic vibration processing device 4 moves the housing 6 up and down.
- a moving device (not shown) for moving the housing 6 including the lifting device 10 back and forth and left and right is provided. The movement of the moving device is controlled by the control unit U (see FIG. 3) based on the set contents.
- the ultrasonic vibration machining device 4 is provided with a liquid injection device 33 for injecting a grinding liquid.
- the liquid injection device 33 has a function of injecting a grinding liquid in the vicinity of the processing position of the processing tool 8 with respect to the tempered glass 1.
- the grinding liquid from the liquid injection device 33 is used as the tempered glass 1 and the processing tool. 8 is cooled and cutting waste generated in the hole 34 being processed is forcibly discharged to the outside.
- tempered glass 1 First, a description will be given of a case where a through-hole that extends straight is formed in a laminated body in which a plurality of tempered glasses 1 are adhered in a laminated state with an adhesive (hereinafter referred to as tempered glass 1 for convenience).
- the processing tool 8 is selected according to the diameter of the through hole 35 to be formed in the tempered glass 1. A diameter slightly smaller than the diameter of the through-hole 35 to be formed is selected.
- the position where the through hole 35 is to be formed is determined on the tempered glass 1, and then the inner peripheral planned line of the through hole 35 on the tempered glass 1.
- 35a (setting contents set in the control unit U or the like for machining) is set, and helical machining is performed in which the machining tool 8 is moved while being inscribed in the inner circumferential planned line 35a of the through hole 35 and is lowered.
- ultrasonic vibration machining is performed, and the rotation direction of the processing tool 8 at that time is such that the moving side is directed to the inner peripheral planned line 35a of the through-hole 35 to be formed in the tempered glass 1.
- Rotation direction (so-called down cut processing).
- the tip end surface 8c (diamond abrasive grains) of the processing tool 8 moves while performing vibration and rotation, and descends to grind the entire inner peripheral line 35a of the through hole 35.
- holes 34 are gradually dug in the planned inner circumference 35 a of the through hole 35.
- the side portion of the processing tool 8 performs downcut processing (grinding) on the inner peripheral surface of the hole 34 being processed.
- the processing tool 1 penetrates the tempered glass 1, and a through hole 35 is formed in the tempered glass 1.
- the processing tool tip surface 8c (diamond abrasive grains) collides with the tempered glass 1 based on excitation (ultrasonic vibration processing). As shown in FIGS. 24 to 26, a recess 30 is formed in the central portion in the radial direction. For this reason, it is prevented that the radial direction center part of the processing tool front end surface 8c collides with the tempered glass 1 based on the vibration of the processing tool 8, and the radial direction center part ( It is possible to prevent heat generated due to collision with the tempered glass 1 from being concentrated on the diamond abrasive grains).
- the diamond abrasive grains and the holding layer thereof in the processing tool 8 are restrained from being carbonized and separated (desorbed) not only in the radial central portion of the processing tool front end surface 8c but also in the radially outward side thereof. Is done.
- the cutting waste 37 enters the recess 30 of the processing tool 8 during the processing.
- the cutting waste 37 may collide with the processing surface and damage the processing surface, and the cutting waste 37 in the recess 30 needs to be quickly discharged.
- a pair of slits 32 is formed in the recess section peripheral wall portion 31, and the cutting waste 37 in the recess 30 is always supplied with centrifugal force based on the rotation of the processing tool 8 and further with a grinding fluid.
- the cavitation in the grinding liquid generated based on the ultrasonic vibration of the processing tool 8 in the hole 34 being processed (vibration based on the crushing of bubbles in the grinding liquid) It is discharged into the hole 34.
- the cutting waste 7 discharged from the slit 32 into the hole 34 being processed is effective due to the flow of the grinding fluid and the pumping action caused by the ultrasonic vibration of the processing tool 8 in the hole 34 being processed. Are discharged to the outside.
- the through hole 35 is formed in the tempered glass 1 using helical processing, but the tempered glass 1 is lowered straightly while ultrasonically vibrating the processing tool 8 without using helical processing.
- the processing until the tempered glass 1 collides with the bottom of the recess 30 in the processing tool 8 does not cause a problem with respect to the heat concentration on the processing tool front end surface 8c, as in the case of performing the helical processing.
- possibility that heat will concentrate will increase and it will be inferior to the case where a helical process is performed in this point.
- the helical processing it is preferable that the tempered glass 1 as a processing target is shorter in thickness than the depth of the recess 30.
- FIG. 36 is a photographic view (magnification: 270 times) showing the processing tool 8 according to the unused embodiment in which a recess is formed in the central portion in the radial direction on the tip surface from the tip surface side. .
- the annular black portion and the black and white pattern portion inside the annular black portion indicate the inside of the recess at the radial center of the tip surface of the processing tool, and the outside of the annular black portion. Indicates the tip surface 8c other than the recess.
- FIG. 37 is a photographic diagram showing the state of the processing tool tip surface 8c when 100 or more holes of tempered glass having various surface reinforcing layers are processed using the processing tool 8 shown in FIG. 36 (magnification: 270 times). ).
- the processing content here is that the diamond abrasive grains and the holding layer are peeled off when the processing tool is used with a processing tool having a flat tip surface.
- FIG. 37 there is almost no peeling of the diamond abrasive grains and the holding layer on the tip surface 8c of the processing tool, and the tip surface has a recess compared to the processing tool 8 having a flat tip surface. It was confirmed that the processing tool 8 having 30 was more durable.
- the start hole 38 is first formed after holding the tempered glass 1 on the fixed base 21, as shown in FIGS.
- the inner peripheral planned line 38 a of the start hole 38 is set on the tempered glass 1, and then the processing tool 8 is vibrated (ultrasonic vibration).
- the processing tool 8 is subjected to helical processing (processing for moving and lowering the processing tool 8 while being inscribed in the inner peripheral planned line 38a of the start hole 38) while performing the processing and rotation.
- the inner peripheral planned line 38 a of the start hole 38 has a size included in the planned inner peripheral line of the long hole to be formed in the tempered glass 1.
- the cutting waste accompanying the processing can be smoothly discharged to the discharge space 36 at the rear of the processing tool 8 in the moving direction, and the processing of the long hole 39 can be performed while suppressing the occurrence of chipping due to the entrapment of the cutting waste. It can be carried out.
- reference numeral 42 denotes a groove formed on the fixing base 21, and the groove 42 allows the tip of the processing tool 8 to move to the fixing base 21 while moving to form the long hole 39. Does not interfere.
- the long hole 39 is formed by the above processing, but in this embodiment, the side surface of the processing tool 8 is further used as a grinding surface as shown in FIG. Finishing is performed (in FIG. 41, the phantom line is the inner peripheral surface of the long hole 39 after finishing). The long hole that has finished this finishing process becomes the final long hole 39F.
- a grinding fluid supply passage 41 for supplying a grinding fluid is formed inside the processing tool 8, and the grinding fluid supply passage 41 is opened in the recess 30.
- a grinding fluid can be supplied to the grinding fluid supply passage 41 from the outside, and the grinding fluid is guided into the recess 30 through the grinding fluid supply passage 41.
- the cutting waste 37 that has entered the recess 30 of the processing tool tip end face 8c by processing the tempered glass 1 is continuously pushed out by the grinding fluid through the slit 32 and the like into the hole 34 that is being processed.
- the cutting waste 37 is positively discharged to the outside together with the grinding fluid from the hole 34 being processed (see arrows in FIGS. 43 and 44).
- the centrifugal force based on the rotation of the processing tool 8 and the cavitation in the grinding fluid based on the ultrasonic vibration of the processing tool 8 in the hole 34 being processed as in the above-described embodiment.
- the cutting waste 37 is positively discharged to the hole 34 being processed through the slit 32, and the cutting waste 37 discharged to the hole 34 being processed includes the cutting tool 8 in the hole 34 being processed.
- the aforementioned discharge action (pumping action) based on the ultrasonic vibration works. For this reason, the cutting waste 37 can be effectively discharged from the inside of the hole 34 being processed, and it is possible to suppress the occurrence of a problem in the processing of the tempered glass 1 based on the remaining cutting waste 37.
- the grinding fluid supply passage 41 is formed inside the processing tool 8, it is possible to eliminate a liquid injection device for supplying the grinding fluid from the outside, and to simplify the structure relating to the supply of the grinding fluid.
- the present invention includes the following aspects.
- the target amplitude is set to a predetermined amplitude in the range of 3 ⁇ m to 9 ⁇ m
- the target frequency is set to a predetermined frequency in the range of 60 kHz to 64 kHz.
- the target amplitude is set to 3 ⁇ m to 9 ⁇ m because if less than 3 ⁇ m, the processing capability is not sufficient (due to cutting chips remaining and cutting resistance etc. being increased), cracks in the tempered glass, chipping over a predetermined level
- the target frequency is set to 60 kHz to 64 kHz, as in the case of the target amplitude. If the frequency is less than 60 kHz, the processing capability is not sufficient, and cracks or the like are generated in the tempered glass. This is because the possibility of cracks and the like occurring in the tempered glass increases due to failure to follow the stress change inside the tempered glass.
- the rotational speed of the processing tool is set to a predetermined rotational speed within a range of 2000 rpm to 30000 rpm.
- the rotational speed of the processing tool is set to a predetermined rotational speed in the range of 2000 rpm to 30000 rpm. If the rotational speed is less than 2000 rpm, the effect of processing on the tempered glass is not sufficient. This is because a reduction in processing resistance occurs and the processing effect decreases, and a problem arises from the viewpoint of durability.
- the tempered glass having a surface tempered layer includes a group of laminated glasses formed by laminating a plurality of the tempered glasses. Thereby, a laminated glass group can be cut out and several laminated glass can be obtained at once, and production efficiency can be improved.
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Abstract
Description
Assistant)等の表示装置には、一般に化学強化された強化ガラスが用いられている。この強化ガラスは、ガラス母材の表面側に表面強化層(化学強化層)が設けられた構成とされており、これに基づき、強化ガラスは、薄板化を図りつつ、曲げ応力、衝撃に対して高強度を示している。
軸状とされ、その軸心を中心として回転させつつその軸心延び方向に加振させた状態の下で、表面強化層を有する化学強化ガラスに対して加工を行う強化ガラス用加工具であって、
少なくとも先端部外面が、ダイヤモンド砥粒が保持されたダイヤモンド砥粒保持面とされ、
先端面に、その先端面の径方向中央部において凹所が形成されている構成とされている。この請求項1の好ましい態様としては、請求項2~6の記載の通りとなる。
軸状の加工具を、該加工具の軸心を中心として回転させつつ該加工具の軸心延び方向に加振させた状態の下で、該加工具をもって、表面強化層を有する化学強化ガラスに対して加工を行う強化ガラス用加工装置において、
前記加工具の少なくとも先端部外面が、ダイヤモンド砥粒が保持されたダイヤモンド砥粒保持面とされ、
前記加工具の先端面に、その先端面の径方向中央部において凹所が形成されている構成とされている。この請求項7の好ましい態様としては、請求項8~14に記載の通りとなる。
加工具として、軸状とされると共に、その少なくとも先端部外面が、ダイヤモンド砥粒が保持されたダイヤモンド砥粒保持面とされ、しかも、その先端面にその先端面の径方向中央部において凹所が形成されているものを用意し、
前記加工具を、その軸心を中心として回転させつつその軸心延び方向に加振させた状態の下で、該加工具をもって、表面強化層を有する化学強化ガラスに対して加工を行う、
ことを特徴とする強化ガラス用加工具の使用方法とした構成としてある。この請求項15の好ましい態様としては、請求項16以下の記載の通りとなる。
強化ガラス1は、図1に示すように、ガラス母材(例えばアルミノシリケートガラス)2の表面側(裏面側)に表面強化層(化学強化層)3が設けられた構成とされている。この表面強化層3により、強化ガラス1は、薄板化を図りつつ、曲げ応力、衝撃に対して高強度が確保されることになっている。具体的には、強化ガラス1としては、母材2の厚みδ1が0.7mm前後、表面強化層3の厚みδ2が40μm以上(現在の時点で70μmのものが開発されているが、勿論、加工の対象)、表面圧縮応力が600MPa~700MPaとされたものが対象とされている。勿論、強化ガラス1だけでなく通常のガラスも、超音波振動加工装置の加工対象となる。
(1)超音波振動加工装置4は、図2に示すように、加工装置本体5を備えている。
上記制御の目標値等は、本件発明者が行った下記加工実験1~3に裏付けられている。この場合、加工実験1~3は、下記共通実験条件の下で強化ガラスに対して行い、その評価は下記共通の評価基準に基づいて行った。
加工対象としての強化ガラス
母材材質:アルミノシリケートガラス
母材厚みδ1:0.70mm
表面強化層の厚みδ2:40μm(0.04mm)
表面強化層の圧縮残留応力:600MPa~700MPa
加工具8
加工送り速度:60mm/分
回転数:5000rpm
軸状の加工具径:1.5mm
加工具8の粒度:♯600番
(b)共通の評価基準
×:強化ガラスが割れた
△:チッピング100~150μm(加工ができるが、品質が悪い状態)
○:チッピング30μm以下(加工、品質共に良い状態)
(c-1)1枚の強化ガラスに対する加工具8の良好な振動数を得るために電圧を調整することにより、加工具8の目標振幅:8μm、フィードバックのサンプル周期(応答速度):0.2msecに固定した条件の下で、加工具8の目標振動数(目標周波数)を変化させる実験を行った。
(d-1)1枚の強化ガラスに対する加工具8の良好な目標振幅を得るために電圧を調整することにより、加工具8の目標周波数:63kHz、フィードバックのサンプル周期(応答速度):0.2msecに固定した条件の下で、加工具8の目標振幅を変化させる実験を行った。
(e-1)加工中に微細な状態変化を起こす強化ガラスにとって、その加工のフィードバック制御のサンプル周期が重要であることに着目し、加工具8の目標振幅:8μm、加工具8の目標周波数:63kHzに固定した条件の下で、フィードバック制御のサンプル周期(応答速度)を変化させる実験を行った。
(1)本件方法を用いて作成した試験用ガラスの場合
試験用ガラスとして、図13に示す携帯端末用保護ガラス1Pを作成することを試みた。
試験用ガラスの作成方法は、前述の強化ガラスの加工方法と同様である。すなわち、表面強化層を有する強化ガラス(具体的には、母材材質:アルミノシリケートガラス、母材厚み0.7mm、表面強化層40μm、表面圧縮応力600MPaのもの)が大板基板とされたもの12枚を、UV硬化接着剤等を用いることにより積層固定状態としたものを用意し、それから携帯端末用保護ガラスの大きさのもの(積層ブロック1a)を切り出し、その切り出したものに対して、長孔23、角孔24の研削加工を行って(一次加工)、一次加工品(積層体)を作成する。次に、一次加工品における外周、長孔23、角孔24の面取り仕上げ加工(二次加工)を行い、二次加工品(積層体)を作成する。次に、二次加工品に対してポリッシュ加工を行い、その後、加工を終えた積層ブロック1aの各ガラス板を温水に漬けて剥がし、試験用(評価用)ガラスを得る。
一次加工条件
加工具8
種類:軸状のダイヤモンド砥石(粒度:♯320番)
直径:1.5mm
送り速度:60mm/min
振幅:8μm
振動数:63kHz
フィードバッグ制御のサンプル周期(応答速度):0.2msec
回転数:5000rpm
二次加工条件
加工具8
種類:軸状のダイヤモンド砥石(粒度:♯600番)
直径:1.5mm
送り速度:60mm/min
振幅:5μm
振動数:63kHz
フィードバッグ制御のサンプル周期(応答速度):0.2msec
回転数:5000rpm
図13に示す試験用ガラスの各部A~Eにおける一次加工後、二次加工後、ポリッシュ加工後の加工状態を確認した。
本件方法による試験用ガラスの場合同様、試験用ガラスとして、図13に示す携帯端末用保護ガラスを作成することを試みた。
前述の本件方法同様、12枚の大板基板(表面強化層を有する強化ガラス)を積層状態をもって接着したものを用意し、それに対して、下記一次加工条件の下で、一次加工(積層ブロック1aの切り出し、長孔23、角孔24の加工)を行おうとした。しかし、積層ブロック1aの切り出し後、一次加工における長孔23の加工初期に、早々と複数のクラックが生じた。このため、比較例に係る試験用ガラスの孔加工に関する部分(D部,E部(図13参照))に関しては、一次加工における角孔24の加工を含め、以後の加工を行うことを断念した。また、比較例に係る試験用ガラスの外周面に関する部分(A部~C部(図13参照))のうち、B部、C部に関しては、二次加工、ポリッシュ加工を行ったが、A部に関しては、クラックが入ったため、以後の加工を断念した。
一次加工条件
加工具8
種類:軸状のダイヤモンド砥石(粒度:♯320番)
直径:1.5mm
送り速度:60mm/min
振幅:8μm
振動数:50kHz
フィードバッグ制御のサンプル周期(応答速度):10msec
回転数:5000rpm
比較例に係る試験用ガラスの各部A~D(図13参照)において、一次加工後の加工状態を確認したところ、図19~図21(270倍)、図22に示す拡大写真図(90倍)に示す結果となった。すなわち、比較例に係る試験用ガラスの各部A~Cでは、クラック又は所定以上のチッピングが生じ、D部では、複数の大きなクラックが発生し、製品として成立し得ない品質のものとなった。図22中、中央の大きな穴は、長孔23に至る前の加工初期の穴である。
(1)これまで説明してきた加工具8は、先端面8cが平坦面とされた軸状のダイヤモンド砥石であったが、耐久性等の観点からは、加工具8としては、図23~図26に示すように、先端面8cに凹所30を有する軸状のダイヤモンド砥石が好ましい。
(1)請求項6,14,24の構成の下で、目標振幅を3μm~9μmの範囲の所定振幅とすると共に、目標振動数を60kHz~64kHzの範囲の所定振動数にすること。これにより、本件発明者が見出した知見に基づき、加工具の具体的な振幅及び振動数として、強化ガラスの加工精度の観点から好ましいものを提供できる。
3 表面強化層
4 超音波振動加工装置
7 加振装置(加振機構)
8 加工具
8b-1 ダイヤモンド電着部
8c 加工具先端面
16 超音波発振器(加振調整手段)
30 凹所
31 凹所区画調整部
32 スリット
33 注液装置
35 貫通孔
35a 貫通孔の内周予定線
38 スタートホール
38a スタートホールの内周予定線
39 長孔
39a 長孔の内周予定線
41 研削液供給通路
U 制御ユニット(制御手段)
Claims (24)
- 軸状とされ、その軸心を中心として回転させつつその軸心延び方向に加振させた状態の下で、表面強化層を有する化学強化ガラスに対して加工を行う強化ガラス用加工具であって、
少なくとも先端部外面が、ダイヤモンド砥粒が保持されたダイヤモンド砥粒保持面とされ、
先端面に、その先端面の径方向中央部において凹所が形成されている、
ことを特徴とする強化ガラス用加工具。 - 請求項1において、
側部に、前記凹所の内外を連通する連通孔が形成されている、
ことを特徴とする強化ガラス用加工具。 - 請求項2において、
前記連通孔が、前記凹所を区画する凹所区画周壁部において、該凹所区画周壁部の先端から軸心延び方向内方に延びる一対のスリットとして形成され、
前記一対のスリットが、互いに対向した状態で配置されている、
ことを特徴とする強化ガラス用加工具。 - 請求項1において、
前記化学強化ガラスに対する加工が、該化学強化ガラスに対する貫通孔の形成であり、
前記貫通孔の形成に際して、該貫通孔の内周予定線に内接させつつ移動するようにして用いられる、
ことを特徴とする強化ガラス用加工具。 - 請求項1において、
内部に、研削液を供給する研削液供給通路が形成され、
前記研削液供給通路が前記凹所内に開口されている、
ことを特徴とする強化ガラス用加工具。 - 請求項1~5のいずれか1項において、
前記加振が、振幅及び振動数が目標振幅及び目標振動数にそれぞれ近づくようにフィードバック制御されると共に、該目標振幅及び目標振動数が、該化学強化ガラスの加工に伴う該化学強化ガラスの厚み方向各部において変化する値であって該化学強化ガラスの品質を悪化させる品質悪化発生値の範囲に属さないものにそれぞれ設定され、
しかも、前記フィードバック制御におけるサンプル周期として、0.3msec以下の所定サンプル周期が用いられる、
ことを特徴とする強化ガラス用加工具。 - 軸状の加工具を、該加工具の軸心を中心として回転させつつ該加工具の軸心延び方向に加振させた状態の下で、該加工具をもって、表面強化層を有する化学強化ガラスに対して加工を行う強化ガラス用加工装置において、
前記加工具の少なくとも先端部外面が、ダイヤモンド砥粒が保持されたダイヤモンド砥粒保持面とされ、
前記加工具の先端面に、その先端面の径方向中央部において凹所が形成されている、
ことを特徴とする強化ガラス用加工装置。 - 請求項7において、
前記化学強化ガラスに対する加工が、該化学強化ガラスに対する貫通孔の形成であり、
前記加工具が、前記貫通孔の形成に際して、該貫通孔の内周予定線に内接しつつ移動するように設定されている、
ことを特徴とする強化ガラス用加工装置。 - 請求項8において、
前記加工具の回転方向が、該加工具の移動側において、前記貫通孔の内周予定線に向かうような回転方向として設定されている、
ことを特徴とする強化ガラス用加工装置。 - 請求項7において、
前記加工具の側部に、前記凹所の内外を連通する連通孔が形成されている、
ことを特徴とする強化ガラス用加工装置。 - 請求項10において、
前記連通孔が、前記凹所を区画する凹所区画周壁部において、該凹所区画周壁部の先端から前記加工具の軸心延び方向内方に延びる一対のスリットとして形成され、
前記一対のスリットは、互いに対向した状態で配置されている、
ことを特徴とする強化ガラス用加工装置。 - 請求項7において、
前記化学強化ガラスに対する前記加工具の加工位置付近に研削液を注液する注液装置が備えられている、
ことを特徴とする強化ガラス用加工装置。 - 請求項7において、
前記加工具内部に、研削液を供給する研削液供給通路が形成され、
前記研削液供給通路が前記凹所内に開口されている、
ことを特徴とする強化ガラス用加工装置。 - 請求項7~13のいずれか1項において、
前記加工具を前記化学強化ガラスに向けて加振させる加振機構と、
前記加振機構を調整する加振調整手段と、
前記加振調整手段を制御して、前記化学強化ガラスに対する前記加工具による加振を、該加工具の振幅及び振動数が目標振幅及び目標振動数にそれぞれ近づくようにフィードバック制御すると共に、該目標振幅及び目標振動数を、前記化学強化ガラスの加工に伴う該化学強化ガラスの厚み方向各部において変化する値であって該化学強化ガラスの品質を悪化させる品質悪化発生値の範囲に属さないものに設定し、さらには、前記フィードバック制御を、0.3msec以下の所定サンプル周期毎に実行させる制御手段と、
を備えている、
ことを特徴とする強化ガラス用加工装置。 - 加工具として、軸状とされると共に、その少なくとも先端部外面が、ダイヤモンド砥粒が保持されたダイヤモンド砥粒保持面とされ、しかも、その先端面にその先端面の径方向中央部において凹所が形成されているものを用意し、
前記加工具を、その軸心を中心として回転させつつその軸心延び方向に加振させた状態の下で、該加工具をもって、表面強化層を有する化学強化ガラスに対して加工を行う、
ことを特徴とする強化ガラス用加工具の使用方法。 - 請求項15において、
前記化学強化ガラスに対する加工が、該化学強化ガラスに対する貫通孔の形成であり、
前記貫通孔の形成に際して、前記加工具を該貫通孔の内周予定線に内接させつつ移動させる、
ことを特徴とする強化ガラス用加工具の使用方法。 - 請求項16において、
前記加工具の回転方向を、該加工具の移動側において、前記貫通孔の内周予定線に向かうような回転方向とする、
ことを特徴とする強化ガラス用加工具の使用方法。 - 請求15において、
前記加工具として、前記凹所の内外を連通する連通孔を側部に有するものを用いる、
ことを特徴とする強化ガラス用加工具の使用方法。 - 請求項18において、
前記加工具として、前記連通孔が、前記凹所を区画する凹所区画周壁部において、該凹所区画周壁部の先端から前記加工具の軸心延び方向内方に延びつつ、互いに対向した状態で配置される一対のスリットとして形成されたものを用いる、
ことを特徴とする強化ガラス用加工具の使用方法。 - 請求項15において、
前記化学強化ガラスに対する前記加工具による加工に際して、該化学強化ガラスに対する該加工具の加工位置付近に研削液を注液する、
ことを特徴とする強化ガラス用加工具の使用方法。 - 請求項15において、
前記加工具内部に、前記凹所内に開口する研削液供給通路を形成して、該研削液供給通路から凹所内に研削液を供給する、
ことを特徴とする強化ガラス用加工具の使用方法。 - 請求項16において、
前記貫通孔として長孔を形成するに際して、該長孔形成のためのスタートホールを、前記加工具を該スタートホールの内周予定線に内接させつつ移動させることにより形成し、
その後、前記加工具を前記スタートホールに貫通させた状態を以後の該加工具の加工開始状態として、前記加工具の軸部側面を研削面として利用しつつ、前記長孔の予定内周線に内接させながら移動させる、
ことを特徴とする強化ガラス用加工具の使用方法。 - 請求項22において、
前記加工具の回転方向を、該加工具の移動側において、前記長孔及び前記スタートホールの各内周予定線に向かうような回転方向とする、
ことを特徴とする強化ガラス用加工具の使用方法。 - 請求項15~23のいずれか1項において、
前記化学強化ガラスに対する前記加工具による加振を、該加工具の振幅及び振動数が目標振幅及び目標振動数にそれぞれ近づくようにフィードバック制御すると共に、該目標振幅及び目標振動数を、該化学強化ガラスの加工に伴う該化学強化ガラスの厚み方向各部において変化する値であって該化学強化ガラスの品質を悪化させる品質悪化発生値の範囲に属さないものにそれぞれ設定し、
しかも、前記フィードバック制御におけるサンプル周期として、0.3msec以下の所定サンプル周期を用いる、
ことを特徴とする強化ガラス用加工具の使用方法。
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- 2013-08-30 WO PCT/JP2013/073447 patent/WO2014034907A1/ja active Application Filing
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2015
- 2015-08-18 US US14/829,089 patent/US20150353412A1/en not_active Abandoned
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JP2004083378A (ja) | 2002-08-29 | 2004-03-18 | Central Glass Co Ltd | 化学強化ガラス |
JP2006018922A (ja) * | 2004-07-01 | 2006-01-19 | Hoya Corp | 磁気ディスク用ガラス基板の製造方法及び磁気ディスクの製造方法 |
JP2009184878A (ja) * | 2008-02-06 | 2009-08-20 | Shuko Denshi Kogyo Yugenkoshi | ガラス加工装置及びガラス加工方法 |
JP2012031018A (ja) | 2010-07-30 | 2012-02-16 | Asahi Glass Co Ltd | 強化ガラス基板及び強化ガラス基板の溝加工方法と強化ガラス基板の切断方法 |
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