WO2014021046A1 - Appareil électronique et feuille conductrice de chaleur - Google Patents

Appareil électronique et feuille conductrice de chaleur Download PDF

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Publication number
WO2014021046A1
WO2014021046A1 PCT/JP2013/068207 JP2013068207W WO2014021046A1 WO 2014021046 A1 WO2014021046 A1 WO 2014021046A1 JP 2013068207 W JP2013068207 W JP 2013068207W WO 2014021046 A1 WO2014021046 A1 WO 2014021046A1
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WO
WIPO (PCT)
Prior art keywords
heat conductive
conductive sheet
heat
electronic device
generating component
Prior art date
Application number
PCT/JP2013/068207
Other languages
English (en)
Japanese (ja)
Inventor
玉谷康浩
Original Assignee
株式会社村田製作所
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社村田製作所 filed Critical 株式会社村田製作所
Priority to JP2014528051A priority Critical patent/JP5850160B2/ja
Publication of WO2014021046A1 publication Critical patent/WO2014021046A1/fr

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
    • H05K7/20445—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff
    • H05K7/20472—Sheet interfaces
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/18—Packaging or power distribution
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • G06F1/203—Cooling means for portable computers, e.g. for laptops
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3735—Laminates or multilayers, e.g. direct bond copper ceramic substrates
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
    • F28F2013/005—Thermal joints
    • F28F2013/006—Heat conductive materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap

Definitions

  • the present invention relates to an electronic device having a heat generating component therein and a heat conductive sheet provided in the electronic device.
  • the inside of the casing of the electronic device is an environment in which the amount of heat generated by heat generating components such as a CPU is increased while the air permeability inside the casing is reduced. Therefore, in recent electronic devices, it is an important issue to suppress the temperature rise of the heat generating component under the environment.
  • Patent Document 1 discloses an electronic device in which the temperature rise of the heat generating component is suppressed.
  • FIG. 92 is a cross-sectional view of the main part of the electronic device 95 according to Patent Document 1.
  • the electronic device 95 includes a heat generating component 11, a substrate 12 on which the heat generating component 11 is mounted, a heat diffusion film 13, a housing 14, and a heat conductive material layer 15 that covers the surface of the heat generating component 11. Yes.
  • the housing 14 is a storage body that stores the heat-generating component 11, the substrate 12, the heat diffusion film 13, and the heat conductive material layer 15.
  • the heat diffusion film 13 is connected to the heat conductive material layer 15. Further, the heat diffusion film 13 is attached to the top plate 14 ⁇ / b> A constituting a part of the housing 14 with an adhesive.
  • the thermal diffusion film 13 is composed of a graphite film.
  • the heat generated in the heat generating component 11 is conducted to the heat diffusion film 13 through the heat conductive material layer 15.
  • the heat conducted to the heat diffusion film 13 is conducted to the housing 14 while spreading in the surface direction in the heat diffusion film 13.
  • the heat conductive material layer 15, the heat diffusion film 13, and the housing 14 radiate the heat conducted from the heat generating component 11 into the air, and suppress the temperature rise of the heat generating component 11.
  • the distance between the heat generating component 11 and the housing 14 has become narrower with the downsizing of the device main body and the high density mounting of electronic components, and the amount of heat generated by the heat generating component 11 has increased with the increase in the speed of the CPU and the like. Yes.
  • An object of the present invention is to provide an electronic device and a heat conductive sheet that are excellent in heat dissipation efficiency of a heat-generating component and can suppress a local increase in the surface temperature of a storage body.
  • the electronic apparatus of the present invention has the following configuration in order to solve the above problems.
  • a heat generating component (1) a heat generating component; A heat conductive sheet having a first flat portion facing the heat generating component and a second flat portion, wherein the first flat portion protrudes from the second flat portion toward the heat generating component; A housing for housing the heat generating component and the heat conductive sheet; The surface on the heat generating component side in the first planar portion is thermally coupled to the heat generating component, and the surface on the opposite side to the heat generating component in the second planar portion is thermally coupled to the inner surface of the storage body. machine.
  • the surface on the heat generating component side in the first plane portion is thermally coupled to the heat generating component means that the surface on the heat generating component side in the first plane portion is joined or close to the heat generating component.
  • the surface on the opposite side to the heat generating component in the second plane part is thermally coupled to the inner surface of the storage body.
  • the surface on the opposite side to the heat generating component in the second plane part is joined to the inner surface of the storage body. Or it is close.
  • the heat generated in the heat generating component is first conducted to the first flat portion of the heat conductive sheet.
  • the heat conducted to the first plane part is conducted to the second plane part.
  • the heat conducted to the second plane part is conducted to the container while spreading in the surface direction in the second plane part.
  • the heat generated in the heat-generating component is not directly conducted from the first plane part to the housing, but is conducted from the first plane part to the second plane part, and spreads in the plane direction in the second plane part. Conducted to the container. For this reason, in this configuration, a local increase in the surface temperature in the region of the storage body facing the heat generating component is suppressed.
  • the electronic device having this configuration is excellent in heat dissipation efficiency of the heat-generating component and can suppress a local increase in the surface temperature of the container.
  • the said heat conductive sheet contains the metal layer comprised from aluminum or aluminum alloy.
  • the metal layer is made of aluminum or an aluminum alloy
  • the heat conductive sheet is lightweight and flexible. Moreover, the manufacturing cost of a heat conductive sheet can be reduced.
  • the said heat conductive sheet further contains the 1st insulating layer formed in the said heat-emitting component side of the said metal layer.
  • the heat generating component and the heat conductive sheet are insulated by the first insulating layer.
  • this structure is suitable when the insulation of the inner surface of a storage body and a heat conductive sheet is unnecessary. This configuration can improve the thermal conductivity from the heat conductive sheet to the storage body due to the absence of the second insulating layer.
  • the said heat conductive sheet further contains the 2nd insulating layer formed in the opposite side to the said heat-emitting component of the said metal layer.
  • this configuration the inner surface of the container and the heat conductive sheet are insulated by the second insulating layer. Moreover, this structure is suitable when the insulation of a heat-emitting component and a heat conductive sheet is unnecessary. This configuration can improve the thermal conductivity from the heat generating component to the heat conductive sheet by the absence of the first insulating layer.
  • the said heat conductive sheet further contains the graphite layer.
  • the thermal conductivity of graphite is higher than the thermal conductivity of metals such as copper, aluminum, aluminum alloy, and stainless steel, so that the thermal conductivity of the thermal conductive sheet is improved.
  • the said container has a metal part which hold
  • the metal layer of the heat conductive sheet is connected to the ground of the circuit board through the metal part of the housing.
  • the storage body has a metal part
  • the second insulating layer is formed with an opening or a notch that exposes the metal layer to the side opposite to the heat-generating component, It is preferable that the metal part is bonded to the metal layer through the opening or the notch.
  • the metal layer of the heat conductive sheet is electrically connected to the metal part of the container. And the metal layer of a heat conductive sheet is connected to the ground of a circuit board through the metal part of a container.
  • the said heat conductive sheet is deform
  • the shape of the heat conductive sheet in which the first flat portion protrudes from the second flat portion toward the heat generating component can be maintained by the cushioning material. Therefore, according to this structure, the shape retention property of a heat conductive sheet improves.
  • the buffer material applies pressure to the heat generating component on the surface opposite to the heat generating component of the first flat portion, the adhesion between the first flat portion and the heat generating component is increased. Thereby, the thermal conductivity from the heat generating component to the first plane portion is improved.
  • the heat conductive sheet has a connection part that connects the first flat part and the second flat part,
  • the connecting portion is preferably formed in a tapered shape.
  • the connecting portion is formed in a tapered shape, the curvature of the portion where the connecting portion intersects the first flat portion or the second flat portion is reduced.
  • the contraction flow in this portion is relaxed and the thermal conductivity is improved. Moreover, since the damage of the heat conductive sheet at the time of a drawing process, etc. are reduced, the yield rate of a heat conductive sheet improves.
  • the area of the surface of the first flat portion on the heat generating component side is larger than the area of the joint surface between the heat generating component and the first flat portion.
  • a heat conductive sheet can be formed in the shape which reduced the curvature of the part which a connection part cross
  • connection portion is far from the joint portion with the heat generating component in the first plane portion. Therefore, the point where the heat conducted to the first plane portion is conducted to the second plane portion is far from the joint portion with the heat generating component in the first plane portion. For this reason, in this configuration, a local increase in the surface temperature in the region of the storage body facing the heat generating component is further suppressed.
  • the electronic device with this configuration can further suppress a local increase in the surface temperature of the storage body.
  • the heat conductive sheet has an opening or a notch in a region facing the antenna.
  • the heat conducting sheet encloses at least one of a heat conducting member or a gas, and has an enclosing portion including the first flat surface portion, It is preferable that a surface of the enclosing portion on the heat generating component side is bonded to the heat generating component.
  • the heat generated in the heat generating component is first conducted to the encapsulating part of the heat conductive sheet. And the heat conducted to the encapsulating part is conducted to the second plane part while being conducted to the heat conducting member or gas in the enclosing part. And the heat conducted to the 2nd plane part spreads in the surface direction in the 2nd plane part.
  • the heat generated in the heat generating component is dissipated to the inside of the container or the outside of the container while being diffused to the heat conductive sheet.
  • the heat conductive sheet encloses the heat conductive member, it has high heat dissipation.
  • the heat conductive sheet encloses gas, since the heat conductivity of gas is low, the heat conduction of the thickness direction in an enclosure part is suppressed. Therefore, the local rise in the surface temperature in the storage body facing the enclosing portion can be suppressed.
  • the heat conducting member is a member that is difficult to deform
  • the heat conducting member is adapted to the installation location of the heat generating component. Can be easily installed. Therefore, since it is not necessary to deform the heat conducting member, it is possible to prevent the heat conducting member from being damaged due to the deformation.
  • the heat conducting member is preferably a graphite sheet.
  • the thermal conductivity of the graphite sheet is higher than that of a metal such as copper, aluminum, aluminum alloy, stainless steel, etc., so that the thermal conductivity of the thermal conductive sheet is improved.
  • part of the heat conducted to the enclosing part is also conducted to the storage body.
  • the enclosing portion protrudes from the second flat portion toward the heat generating component by drawing.
  • the enclosing portion can be easily formed in accordance with the installation location of the heat generating component by drawing. Moreover, a heat conductive member or gas can be easily installed according to the installation location of a heat-emitting component.
  • edge part of the said 2nd plane part is bend
  • the heat conductive sheet has a plurality of the first plane portions, It is preferable that the plurality of first planar portions are periodically arranged in the heat conductive sheet.
  • the heat conductive sheet can be easily joined to the heat generating component regardless of where the heat generating component is arranged on the circuit board. That is, the chance of contact between the heat conductive sheet and the heat generating component increases.
  • heat conductive sheets having different periodic structures of the first plane portion are prepared, and heat conductive sheets suitable for the arrangement of the heat generating components on each circuit board are prepared from the several types of heat conductive sheets. Just choose. That is, it is not necessary to provide a die for drawing processing in accordance with the arrangement of the heat generating components on the circuit board. Therefore, according to the heat conductive sheet having this configuration, versatility is improved and the manufacturing cost can be reduced.
  • the heat conductive sheet has a plurality of the second plane portions, It is preferable that the plurality of second flat portions are periodically arranged in the heat conductive sheet.
  • the first flat portion of the heat conductive sheet is easily joined to the heat generating components regardless of where the heat generating components are arranged on the circuit board. Become. That is, the chance of contact between the heat conductive sheet and the heat generating component increases.
  • heat conductive sheets having different periodic structures of the second planar portion are prepared, and heat conductive sheets suitable for the arrangement of the heat generating components on each circuit board are prepared from the several types of heat conductive sheets. Just choose. That is, it is not necessary to provide a die for drawing processing in accordance with the arrangement of the heat generating components on the circuit board. Therefore, according to the heat conductive sheet having this configuration, versatility is improved and the manufacturing cost can be reduced.
  • the surface on the side of the heat generating component in the first flat surface portion is joined to the heat generating component by deforming the first flat surface portion.
  • the heat conductive sheet and the heat generating component can be more closely attached.
  • the plurality of first planar portions are bonded to one heat generating component.
  • heat generated in one heat generating component is conducted to the plurality of first flat portions, so that heat dissipation of the heat generating component is improved.
  • the said heat conductive sheet has multiple said enclosure parts which enclose the said gas.
  • the heat generating component can be pressed at the time of joining, and the heat conductive sheet and the heat generating component can be more closely attached.
  • the heat conductive sheet having this configuration is excellent in impact resistance.
  • the enclosing portion is formed by forming the second flat portion by heat sealing.
  • a graphite layer or a graphene layer is formed on at least one surface of the second planar portion.
  • the thermal conductivity of the graphite layer or graphene layer is higher than that of a metal such as copper, aluminum, aluminum alloy, stainless steel, or the like. According to this configuration, the thermal conductivity is improved by the graphite layer or the graphene layer, and thermal conduction to other electronic components that are vulnerable to heat can be suppressed (thermal block). Moreover, according to this structure, since the comparatively expensive graphite material or graphene material is used only for a specific location, the manufacturing cost of a heat conductive sheet can be reduced.
  • a graphite layer or a graphene layer is formed on at least one surface of the plurality of enclosure portions.
  • the thermal conductivity of the encapsulated portion is improved by the graphite layer or the graphene layer. Moreover, according to this structure, since the comparatively expensive graphite material or graphene material is used only for a specific location, the manufacturing cost of a heat conductive sheet can be reduced.
  • a graphite layer or a graphene layer is formed on the entire area of at least one of the principal surfaces of the heat conductive sheet.
  • the thermal conductivity is improved by the graphite layer or the graphene layer, and it is possible to form a heat conductive sheet having a three-dimensional shape which is difficult only by graphite or graphene alone.
  • the heat conductive sheet of the present invention has the following configuration in order to solve the above problems.
  • a heat conductive sheet thermally coupled to the heat generating component, A first plane portion and a second plane portion; The first plane portion protrudes from the second plane portion toward the heat generating component.
  • the heat conductive sheet having this configuration is provided in any one of the electronic devices (1) to (26). Therefore, the heat conductive sheet having this configuration has the same effect as the electronic device.
  • the heat conductive sheet has an enclosing portion including the first flat surface portion, It is preferable that the enclosing portion protrudes from the second flat portion toward the heat generating component.
  • the heat conductive sheet having this configuration is provided in any one of the electronic devices from (13) to (26). Therefore, the heat conductive sheet having this configuration has the same effect as the electronic device.
  • the enclosing portion protrudes from the second flat portion to the side opposite to the heat generating component.
  • the heat conductive sheet having this configuration is provided in any one of the electronic devices from (16) to (26). Therefore, the heat conductive sheet having this configuration has the same effect as the electronic device.
  • the enclosing portion encloses a buffer material.
  • the thickness of the enclosing portion can be easily adjusted by the thickness of the buffer material. Moreover, in this structure, the elasticity of an enclosure part improves with a buffer material.
  • the heat conductive sheet having this configuration is provided in any one of the electronic devices (18) to (26). Therefore, the heat conductive sheet having this configuration has the same effect as the electronic device.
  • an electronic device and a heat conductive sheet that are excellent in heat dissipation efficiency of the heat-generating component and can suppress a local increase in the surface temperature of the housing.
  • FIG. 1 is a plan view of the inside of an electronic device 100 according to a first embodiment of the present invention. It is a top view which shows the structure which removed the heat conductive sheet 101 from the electronic device 100 shown in FIG.
  • FIG. 2 is a cross-sectional view taken along line SS shown in FIG.
  • FIG. 2 is a cross-sectional view taken along line SS shown in FIG.
  • FIG. 2 is a cross-sectional view taken along line TT shown in FIG.
  • FIG. 18 is a cross-sectional view taken along the line TT of the electronic device 100 including the heat conductive sheet 861 shown in FIG. It is an expanded sectional view of the heat conductive sheet 871 which concerns on the 3rd modification of the heat conductive sheet 101 shown in FIG.
  • FIG. 21 is a cross-sectional view taken along line SS of the electronic device 100 including the heat conductive sheet 871 shown in FIG.
  • FIG. 21 is a cross-sectional view taken along the line TT of the electronic device 100 including the heat conductive sheet 871 illustrated in FIG. 20.
  • It is an expanded sectional view of the 2nd plane part 820 of the heat conductive sheet 881 which concerns on the 4th modification of the heat conductive sheet 101 shown in FIG.
  • FIG. 25 is a cross-sectional view of the SS line of the electronic device 100 including the heat conductive sheet 881 shown in FIGS. 23 and 24.
  • FIG. 25 is a cross-sectional view taken along the line TT of the electronic device 100 including the heat conductive sheet 881 shown in FIGS. 23 and 24.
  • FIG. 10 is a cross-sectional view taken along line TT of an electronic device 100 including a heat conductive sheet 882 according to a fifth modification of the heat conductive sheet 101 shown in FIG.
  • FIG. 40 is a cross-sectional view taken along line AA shown in FIG. 39.
  • FIG. 40 is a cross-sectional view of the main part of an electronic device 900 according to a ninth embodiment of the present invention, which includes the heat conductive sheet 1201 shown in FIG. 39.
  • FIG. 53 is a cross-sectional view of a main part of an electronic device 1001 according to a first modification of the electronic device 1000 shown in FIG.
  • FIG. 53 is a cross-sectional view of a main part of an electronic device 1002 according to a second modification of the electronic device 1000 shown in FIG. 52.
  • FIG. 53 is a cross-sectional view of a main part of an electronic device 1003 according to a third modification of the electronic device 1000 shown in FIG. 52.
  • FIG. 53 is a cross-sectional view of a main part of an electronic device 1001 according to a first modification of the electronic device 1000 shown in FIG.
  • FIG. 53 is a cross-sectional view of a main part of an electronic device 1002 according to a second modification of the electronic device 1000 shown in FIG. 52.
  • FIG. 53 is a cross-sectional view of a main part of an electronic device 1003 according to a third modification of the electronic device 1000 shown in FIG. 52.
  • FIG. 53 is a cross-sectional view of a main part of an electronic device 1004 according to a fourth modification of the electronic device 1000 shown in FIG. It is a top view of the heat conductive sheet 2401 which concerns on the 9th modification of the heat conductive sheet 1201 shown in FIG.
  • FIG. 58 is a cross-sectional view taken along line BB shown in FIG. 57. It is sectional drawing of the heat conductive sheet 2451 which concerns on the 1st modification of the heat conductive sheet 2401 shown in FIG. It is a top view which shows the manufacturing method of the heat conductive sheet 2401 shown in FIG. It is a top view which shows the manufacturing method of the heat conductive sheet 2401 shown in FIG.
  • FIG. 57 It is a top view which shows the manufacturing method of the heat conductive sheet 2401 shown in FIG. 57 is an electronic device 1100 according to an eleventh embodiment of the present invention, and is a cross-sectional view of a main part of the electronic device 1100 including the heat conductive sheet 2401 shown in FIG. 63 is an electronic device 1101 according to a modification of the electronic device 1100 illustrated in FIG. 63, and is a cross-sectional view of a main part of the electronic device 1101 including the heat conduction sheet 2501 according to the second modification of the heat conduction sheet 2401 illustrated in FIG. 57. is there. It is a top view of the heat conductive sheet 2601 which concerns on the 3rd modification of the heat conductive sheet 2401 shown in FIG. FIG.
  • FIG. 66 is a cross-sectional view taken along the line CC shown in FIG. 65. It is a top view of the heat conductive sheet 2701 which concerns on the 4th modification of the heat conductive sheet 2401 shown in FIG. It is a top view of the heat conductive sheet 2801 which concerns on the 5th modification of the heat conductive sheet 2401 shown in FIG.
  • FIG. 69 is a cross-sectional view taken along the line DD shown in FIG. 68. It is a top view of the heat conductive sheet 2901 which concerns on the 6th modification of the heat conductive sheet 2401 shown in FIG.
  • FIG. 71 is a cross-sectional view taken along line EE shown in FIG. 70.
  • FIG. 73A is a cross-sectional view taken along the line FF shown in FIG.
  • FIG. 73B is a cross-sectional view taken along the line GG shown in FIG.
  • FIG. 75 is a cross sectional view taken along line HH shown in FIG. 74.
  • It is a top view of the heat conductive sheet 3201 which concerns on the 9th modification of the heat conductive sheet 2401 shown in FIG.
  • FIG. 77 is a cross-sectional view taken along the line II shown in FIG. 76.
  • FIG. 80 is a plan view of a bubble cushioning sheet 3261 which is a modification of the bubble cushioning sheet 3260 shown in FIG. 79.
  • FIG. FIG. 77 is a cross-sectional view showing a method for manufacturing the heat conductive sheet 3201 shown in FIG. 76.
  • FIG. 77 is a cross-sectional view showing a method for manufacturing the heat conductive sheet 3201 shown in FIG. 76.
  • FIG. 77 is a plan view showing a method for manufacturing the heat conductive sheet 3201 shown in FIG. 76.
  • FIG. 77 is a plan view showing a method for manufacturing the heat conductive sheet 3201 shown in FIG.
  • FIG. 85A is a cross-sectional view taken along the line JJ shown in FIG.
  • FIG. 85B is a cross-sectional view taken along the line KK in FIG.
  • FIG. 77 is a plan view showing a method for manufacturing the heat conductive sheet 3201 shown in FIG. 76.
  • It is a top view of the heat conductive sheet 3301 which concerns on the 10th modification of the heat conductive sheet 2401 shown in FIG. 76 is a cross-sectional view of a heat conductive sheet 3401 according to a modification of the heat conductive sheet 3201 shown in FIG. 76.
  • FIG. It is a top view of the foam sheet 3460.
  • FIG. It is sectional drawing which shows the manufacturing method of the heat conductive sheet 3401 shown in FIG.
  • FIG. 10 is a cross-sectional view of a main part of an electronic device 95 according to Patent Document 1.
  • FIG. It is a figure which shows the surface temperature distribution of the top plate 14A shown in FIG.
  • FIG. 1 is a plan view of the inside of the electronic device 100 according to the first embodiment of the present invention.
  • FIG. 2 is a plan view showing a configuration in which the heat conductive sheet 101 is removed from the electronic apparatus 100 shown in FIG. 3A is a cross-sectional view taken along the line SS shown in FIG. 4 is a cross-sectional view taken along the line TT shown in FIG.
  • FIGS. 1 and 2 are views of the inside of the electronic device 100 as seen through the top plate 40A from the top plate 40A side of the housing 40.
  • FIG. 1 is a plan view of the inside of the electronic device 100 according to the first embodiment of the present invention.
  • FIG. 2 is a plan view showing a configuration in which the heat conductive sheet 101 is removed from the electronic apparatus 100 shown in FIG. 3A is a cross-sectional view taken along the line SS shown in FIG. 4 is a cross-sectional view taken along the line TT shown in FIG.
  • FIGS. 1 and 2 are views of the inside of the electronic device 100
  • the electronic device 100 includes a housing 40, a circuit board P, and a heat conductive sheet 101, as shown in FIGS.
  • the electronic device 100 is, for example, a mobile device, a portable peripheral device, or a stationary network device, a display device, a lighting device, and a home appliance.
  • the mobile device is, for example, a mobile phone, a smartphone, a tablet, a notebook personal computer, a digital camera, a portable game machine, or a digital video.
  • the portable peripheral device include an external hard disk drive device, a flash memory drive device (SSD), a portable Blu-ray disc playback device, a portable DVD playback device, and a mobile wireless router.
  • the stationary network device is, for example, a stationary wireless router, a network hub, or a network server.
  • the display device is, for example, an LCD or a PDP.
  • Illumination equipment is LED lighting, an HID lamp, etc., for example.
  • Home appliances are a refrigerator, an air conditioner, etc., for example.
  • the housing 40 is a rectangular parallelepiped, and houses the circuit board P and the heat conductive sheet 101.
  • the housing 40 is made of resin. This resin is, for example, ABS or polycarbonate.
  • a circuit board P on which a predetermined circuit pattern (not shown) is formed is attached inside the housing 40.
  • the housing 40 may be comprised from the metal, and may be comprised from the composite material of a metal or an alloy, and resin.
  • circuit board P On the circuit board P, electronic components 50, 51, 52, and 53 that generate heat upon receiving power and antennas A1 and A2 that receive or transmit electromagnetic waves are mounted. Further, on the circuit board P, a metal case 61 covering the electronic component 51 and a metal case 62 covering the electronic components 52 and 53 are attached.
  • the housing 40 corresponds to the “housing” of the present invention.
  • the electronic component 50 corresponds to the “heat generating component” of the present invention.
  • the composite of the electronic component 51 and the metal case 61 also corresponds to the “heat generating component” of the present invention.
  • the composite of the electronic components 52 and 53 and the metal case 62 also corresponds to the “heat generating component” of the present invention.
  • the electronic component 50 includes, for example, a CPU, GPU, baseband IC (BBIC), power management IC (PMIC), flash memory, SIM card slot, SD card slot, power amplifier module (PAM), camera module, lithium ion secondary battery Such as a battery.
  • BBIC baseband IC
  • PMIC power management IC
  • flash memory SIM card slot
  • SD card slot Secure Digital card slot
  • PAM power amplifier module
  • camera module lithium ion secondary battery
  • lithium ion secondary battery Such as a battery.
  • This communication system includes, for example, GSM (registered trademark) (Global System for Mobile Communications), UMTS (Universal Mobile Telecommunications System), LTE (Long Term Evolution, WLAN (BureN), WLAN (Wire), WLAN (N) Near Field Communication).
  • GSM Global System for Mobile Communications
  • UMTS Universal Mobile Telecommunications System
  • LTE Long Term Evolution
  • WLAN BureN
  • WLAN Wireless
  • N Near Field Communication
  • Each of the electronic components 50, 51, 52, 53 is molded with an epoxy resin or the like. Thereby, the main surface (top surface) on the heat conductive sheet 101 side in each of the electronic components 50, 51, 52, and 53 has a flat square shape.
  • the sizes of the electronic components 50, 51, 52, and 53 are all the same, and are 10 mm long ⁇ 10 mm wide ⁇ 0.5 mm high. However, the size is not limited to this.
  • the electronic component 51 is connected to the metal cases 61 and 62 through the heat conductive adhesive layer 31. Further, the electronic components 52 and 53 are connected to the metal case 62 through the heat conductive adhesive layers 32 and 33.
  • the heat conductive adhesive layers 31, 32, and 33 are composed of silicone resin as a main component and conductive particles such as Al and fillers such as silica and ceramic particles.
  • the heat conductive adhesive layers 31, 32, and 33 are preferably formed on all the top surfaces of the electronic components 51, 52, and 53, but are formed over a wide range at least around the center of the top surface. It only has to be.
  • the metal case 61 is provided to electromagnetically shield the electronic component 51 constituting the communication system. Further, as shown in FIGS. 1, 2, and 4, the metal case 62 is provided for electromagnetically shielding the electronic components 52 and 53 that constitute the communication system.
  • the area of the metal case 61 is larger than the area of the electronic component 51 so that the electronic component 51 can be covered.
  • the area of the metal case 62 is larger than the sum of the area of the electronic component 51 and the area of the electronic component 52 so that the electronic components 52 and 53 can be covered.
  • the height of each of the metal cases 61 and 62 is slightly higher than the height of each of the electronic components 50, 51, 52 and 53.
  • the main surface (top surface) on the heat conductive sheet 101 side in each of the metal cases 61 and 62 has a flat rectangular shape.
  • the electronic components 51, 52, 53 that are covered with the metal cases 61, 62 and the electronic components 50 that are not covered with the metal cases 61, 62 are composed of the circuit board P.
  • the top surfaces of the metal cases 61 and 62 are rectangular, but the present invention is not limited to this.
  • the circuit may be designed as appropriate according to the electronic device to be manufactured.
  • the heat conductive sheet 101 includes first flat portions 110, 111, and 112 that face the electronic component 50 and the metal cases 61 and 62, and the electronic component 50 and the metal. It has the 2nd plane part 120 which does not oppose case 61,62, and connection part 130,131,132 which connects the 1st plane part 110,111,112 and the 2nd plane part 120.
  • the size of the heat conductive sheet 101 is substantially the same as the size of the circuit board P, but is not limited thereto. In implementation, the size of the heat conductive sheet 101 may be smaller than the size of the circuit board P. Similarly, the shape of the heat conductive sheet 101 is not limited to a rectangle, and may be a square, or may be a cutting pattern having various shapes according to the shape of the inner surface of the housing 40.
  • a circular opening 71 and a rectangular cutout 72 are formed in a region facing the antennas A1 and A2. Further, the heat conductive sheet 101 is deformed so that the first flat portions 110, 111, and 112 protrude from the second flat portion 120 to the circuit board P side.
  • the heat conductive sheet 101 is manufactured by punching and drawing with a mold on a single laminate sheet. This deep drawing process can easily form the first flat portions 110, 111, and 112 according to the installation locations of the electronic component 50 and the metal cases 61 and 62. Further, the drawing process has a small bending stress after the drawing process and is excellent in shape retention.
  • the heat conductive sheet 101 after the drawing process can maintain a state in contact with the circuit board P or a state in proximity to the circuit board P even without an adhesive material such as a double-sided adhesive tape.
  • the opening part 71 and the notch part 72 are formed in the heat conductive sheet 101 by stamping, it does not restrict to this.
  • the opening 71 and the notch 72 may be formed in the heat conductive sheet 101 by, for example, laser processing or cutting blade processing.
  • the heat conductive sheet 101 is deformed by drawing, but is not limited thereto.
  • the heat conductive sheet 101 may be deformed by a deformation method other than drawing, for example, vacuum forming or blow molding.
  • both the opening 71 and the cutout 72 are formed in the heat conductive sheet 101, but the present invention is not limited to this.
  • either the opening 71 or the notch 72 may be formed in the heat conductive sheet 101.
  • the shape of the opening 71 or the notch 72 is not limited to a circle or a rectangle, but may be another shape such as a square.
  • the shape of the first plane portions 110, 111, and 112 is not limited to a rectangle, and may be another shape such as a circle or a square.
  • the first flat surface portion 110 protrudes from the second flat surface portion 120 to the circuit board P side with a first depth Z1 in order to connect to the top surface of the electronic component 50.
  • the first flat surface portion 111 protrudes from the second flat surface portion 120 to the circuit board P side with a second depth Z ⁇ b> 2 in order to connect to the top surface of the metal case 61.
  • the first flat surface portion 112 protrudes from the second flat surface portion 120 to the circuit board P side with a second depth Z2 in order to connect to the top surface of the metal case 62.
  • the second depth Z2 is shorter than the first depth Z1 because the height of each of the metal cases 61 and 62 is higher than the height of the electronic component 50.
  • Each of the first depth Z1 and the second depth Z2 is 0.5 to 2 mm.
  • the first depth Z1 is 0.9 mm
  • the second depth Z2 is 0.7 mm. .
  • the surface on the circuit board P side in the first flat portions 110, 111, 112 is joined to the electronic component 50 and the metal cases 61, 62 via double-sided adhesive tapes 150, 151, 152. Further, the surface opposite to the circuit board P in the second planar portion 120 is joined to the inner surface of the top plate 40 ⁇ / b> A via the double-sided adhesive tape 160.
  • the top plate 40 ⁇ / b> A is a plate that constitutes a part of the housing 40.
  • FIG. 3B shows an example in which the surface on the circuit board P side of the first planar portion 110 is close to the electronic component 50 (for example, at an interval of 100 ⁇ m or less).
  • the surface of the second planar portion 120 opposite to the circuit board P is joined to the inner surface of the top plate 40A via a double-sided adhesive tape 160.
  • FIG. 3C shows an example in which the surface opposite to the circuit board P of the second planar portion 120 is close to the inner surface of the top plate 40A (for example, at an interval of 100 ⁇ m or less).
  • the surface on the circuit board P side of the first flat portion 110 is bonded to the electronic component 50 via the double-sided adhesive tape 160.
  • the surface on the side of the heat generating component in the first plane portion being thermally coupled to the heat generating component means that the surface on the side of the heat generating component in the first plane portion is bonded or close to the heat generating component.
  • the surface on the opposite side to the heat generating component in the second plane part is thermally coupled to the inner surface of the storage body.
  • the surface on the opposite side to the heat generating component in the second plane part is joined to the inner surface of the storage body. Or it is close.
  • the double-sided adhesive tapes 150, 151, 152, and 160 are made of, for example, a silicone tape containing a silicone resin as a main component and a conductive filler, and have high thermal conductivity and low resistance.
  • the thickness of the double-sided pressure-sensitive adhesive tapes 150, 151, 152, 160 is 10 to 200 ⁇ m.
  • the double-sided pressure-sensitive adhesive tapes 150, 151, 152 are 50 ⁇ m
  • the double-sided pressure-sensitive adhesive tape 160 is 100 ⁇ m.
  • the double-sided adhesive tapes 150, 151, 152 are preferably affixed to all of the top surfaces of the electronic component 51 and the metal cases 61, 62, but are affixed over a wide range at least around the center of the top surface. It only has to be.
  • the double-sided pressure-sensitive adhesive tape 160 is preferably attached to the entire surface of the second flat surface portion 120 opposite to the circuit board P, but at least a wide area centered on the central portion of the surface or a central portion. Except for it, it should just be affixed around an edge part.
  • the double-sided pressure-sensitive adhesive tapes 150, 151, 152, and 160 may be double-sided pressure-sensitive adhesive tapes or rubber made of an adhesive such as epoxy resin, acrylic resin, or polyimide resin.
  • the double-sided pressure-sensitive adhesive tapes 150, 151, 152, 160 may have adhesiveness that can be repeatedly applied. It is excellent in maintainability such as repair of the electronic device 100.
  • the double-sided adhesive tapes 150, 151, 152, 160 may be heat dissipating grease such as silicone grease. Further, in addition to the double-sided adhesive tapes 150, 151, 152, 160, the heat conductive sheet 101 may be fixed to the electronic components 50, 51, 52, 53, the circuit board P, or the housing 40 with screws or the like.
  • connection part 130 is formed around the first plane part 110.
  • connection part 131 is formed around the first plane part 111
  • connection part 132 is formed around the first plane part 112.
  • Each of the connection parts 130, 131, 132 has an R shape by drawing. This R is 1 to 3 mm, for example 1 mm.
  • the metal layer 140 of the heat conductive sheet 101 may be electrically connected to the ground (not shown) of the circuit board P through a metal part (not shown) provided on the housing 40. Thereby, it is possible to prevent external noise and static electricity from the human body from entering the circuit board P and destroying the electronic components 50 to 53.
  • the metal layer 140 of the heat conductive sheet 101 may be exposed and connected to a metal plate or the like, or may be connected through the metal layer 140 of the heat conductive sheet 101 with a screw or a rivet.
  • FIG. 5 is an enlarged cross-sectional view of the heat conductive sheet 101 shown in FIG.
  • the heat conductive sheet 101 includes a first insulating layer 141 formed on the circuit board P side of the metal layer 140, a metal layer 140, and a second insulating layer 142 formed on the opposite side of the metal layer 140 from the circuit board P. And has a structure in which these are sequentially stacked.
  • the heat conductive sheet 101 is a so-called integrated laminate sheet.
  • the thickness of the heat conductive sheet 101 is 80 to 150 ⁇ m, for example, 120 ⁇ m.
  • the metal layer 140 is made of aluminum.
  • the metal layer 140 has a thickness of 80 ⁇ m.
  • the metal layer 140 and the first insulating layer 141 are affixed with a urethane adhesive or the like of about 5 ⁇ m.
  • the metal layer 140 and the second insulating layer 142 are also pasted with a urethane adhesive or the like of about 5 ⁇ m.
  • the heat conductive sheet 101 may be subjected to alumite treatment.
  • the heat conductive sheet 101 may be coated with a heat radiation paint having high heat radiation.
  • the tempering of aluminum may be either soft or hard, but softer is preferable in consideration of workability such as drawing.
  • the material of the metal layer 140 may be aluminum alloy, copper, copper alloy, stainless steel, or the like. Further, the metal layer 140 may have a multilayer structure with different materials.
  • the metal layer 140 may be a discontinuous structure such as a mesh, or a structure that has been embossed to improve surface area.
  • the thickness of the metal layer 140 is preferably in the range of 40 to 120 ⁇ m from the viewpoint of flexibility and shape retention of the heat conductive sheet 101.
  • the thermal conductivity of the heat conductive sheet 101 increases as the thickness of the metal layer 140 increases, but considering the manufacturing cost of the heat conductive sheet 101 (for example, the thickness of the metal layer 140 that can be manufactured by the Roll to Roll manufacturing method),
  • the thickness of the metal layer 140 is preferably 100 ⁇ m or less, particularly preferably 80 ⁇ m or less.
  • the first insulating layer 141 and the second insulating layer 142 are made of polyethylene terephthalate (PET).
  • PET polyethylene terephthalate
  • the thickness of the first insulating layer 141 is 5 to 40 ⁇ m, for example, 15 ⁇ m
  • the thickness of the second insulating layer 142 is also 5 to 40 ⁇ m, for example, 15 ⁇ m.
  • the material of the first insulating layer 141 and the second insulating layer 142 may be polyethylene (PE), polypropylene (PP), nylon (ON), or the like. Further, the first insulating layer 141 and the second insulating layer 142 may contain a filler such as conductive powder in order to increase the thermal conductivity of the heat conductive sheet 101. In addition, it is possible to increase the radiation inside the casing by further roughening the surface of the first insulating layer 141 or the second insulating layer 142 or blackening it, and to further improve the heat dissipation of the heat conductive sheet 101. In addition, the material of the first insulating layer 141 and the second insulating layer 142 may be silicone. In this case, it is not necessary to use a double-sided adhesive tape by utilizing the adhesiveness of silicone itself.
  • first insulating layer 141 and the second insulating layer 142 do not need to use the same material, and may use different materials.
  • first insulating layer 141 and the second insulating layer 142 may have a multilayer structure using different materials.
  • the thermal conductivity of the heat conductive sheet 101 increases as the thickness of the first insulating layer 141 decreases.
  • the thickness of the first insulating layer 141 is preferably 5 to 30 ⁇ m.
  • the first insulating layer 141 is preferably thinner than the second insulating layer 142. Note that the surface of the first insulating layer 141, the second insulating layer 142, or the metal layer 140 may be provided with a rust prevention coating or an antistatic coating.
  • FIG. 6 is a view showing the surface temperature distribution of the top plate 40A in the cross section shown in FIG. 3A.
  • FIG. 7 is a view showing the surface temperature distribution of the top plate 40A in the cross section shown in FIG.
  • the solid line shown in the upper part of FIGS. 6 and 7 represents the surface temperature distribution of the electronic device 100
  • the dotted line represents the surface temperature distribution of the electronic device 100 when the heat conductive sheet 101 is removed from the electronic device 100. Represents.
  • the heat generated in the electronic component 50 is conducted to the first flat portion 110 of the heat conductive sheet 101 as shown in FIGS. 1 and 3A.
  • the heat conducted to the first plane part 110 is conducted to the second plane part 120 via the connection part 130.
  • the heat generated in the electronic component 51 is conducted to the first flat portion 111 of the heat conductive sheet 101 through the metal case 61 as shown in FIGS. 1 and 4. Then, the heat conducted to the first plane part 111 is conducted to the second plane part 120 via the connection part 131. Similarly, the heat generated in the electronic components 52 and 53 is conducted to the first flat portion 112 of the heat conductive sheet 101 through the metal case 62. Then, the heat conducted to the first plane part 112 is conducted to the second plane part 120 through the connection part 132.
  • the heat generated in the electronic components 50 to 53 is dissipated into the air through the heat conductive sheet 101 and the housing 40 while being diffused into the heat conductive sheet 101 and the housing 40. Thereby, the temperature rise of the electronic components 50 to 53 is suppressed. Therefore, since the electronic device 100 radiates heat not only in the heat conductive sheet 101 but also in the housing 40, the heat dissipation efficiency of the electronic components 50 to 53 is excellent.
  • the circuit board P is also provided with a heat dissipation structure using thermal vias.
  • the heat dissipation structure using the heat conductive sheet 101 is effective.
  • the heat generated in the electronic components 50 to 53 is not directly conducted from the first planar portions 110 to 112 to the housing 40, but is conducted from the first planar portions 110 to 112 to the second planar portion 120. Then, it is conducted to the housing 40 while spreading in the surface direction in the second plane part 120. Therefore, in electronic device 100, as shown in FIGS. 6 and 7, a local increase in surface temperature in the region of top plate 40A facing electronic components 50 to 53 is suppressed.
  • the electronic device 100 is excellent in heat dissipation efficiency of the electronic components 50 to 53, and can suppress a local increase in the surface temperature of the housing 40.
  • the heat conductive sheet 101 is lightweight and flexible because the metal layer 140 is made of aluminum. Moreover, the heat conductive sheet 101 can be manufactured at low cost by a recent laminate manufacturing technique.
  • the heat conductive sheet 101 made of aluminum is non-magnetic, the influence on the antenna characteristics and noise characteristics of the electronic device 100 is small compared to the ferromagnetic sheet.
  • NFC Near Field Communication
  • communication is hindered if the heat conductive sheet 101 is interposed in the communication path between the electronic device 100 and the communication partner side device. There is a risk of being.
  • an opening 71 and a notch 72 are formed in the heat conductive sheet 101 so that the heat conductive sheet 101 does not shield the electromagnetic wave. Therefore, according to the electronic device 100, it is possible to prevent communication between the electronic device 100 and the communication partner side device by the antennas A1 and A2 from being hindered.
  • FIG. 8 is a cross-sectional view of a main part of an electronic device 200 according to the second embodiment of the present invention.
  • the electronic device 200 of this embodiment is different from the electronic device 100 according to the first embodiment in a frame 241 and a housing 240. Other configurations are the same. Therefore, in the electronic device 200, the joined body of the frame 241 and the housing 240 corresponds to the “housing body” of the present invention.
  • a metal frame 241 such as stainless steel, magnesium alloy, aluminum, or aluminum alloy is joined to the inner surface of the housing 240.
  • the metal frame 241 includes an outer package of a battery such as a lithium ion secondary battery.
  • the height of the housing 240 is higher than the height of the housing 40.
  • Other configurations of the housing 240 are the same as those of the housing 40.
  • the surface on the opposite side to the circuit board P in the 2nd plane part 120 is joined to the inner surface of the flame
  • the heat conducted from the first plane part 110, 111, 112 to the second plane part 120 is conducted to the frame 241 while spreading in the plane direction in the second plane part 120. Then, the heat conducted to the frame 241 is conducted to the housing 240.
  • the heat generated in the electronic components 50 to 53 is radiated to the air by the heat conductive sheet 101, the frame 241 and the housing 240 while being diffused to the heat conductive sheet 101, the frame 241 and the housing 240.
  • the electronic device 200 has the same effect as the electronic device 100 of the first embodiment.
  • FIG. 9 is a cross-sectional view of a main part of an electronic device 300 according to the third embodiment of the present invention.
  • the electronic device 300 of this embodiment is different from the electronic device 100 according to the first embodiment in a display member 342 and a housing 340. Other configurations are the same. Therefore, in the electronic device 300, the joined body of the display member 342 and the housing 340 corresponds to the “housing body” of the present invention.
  • the housing 340 has an opening.
  • the configuration of the other casing 340 is the same as that of the casing 240 shown in FIG.
  • a display member 342 is fitted into the opening of the housing 340.
  • the display member 342 is a liquid crystal panel, for example.
  • the surface opposite to the circuit board P in the second flat portion 120 is joined to the inner surface of the display member 342 via the double-sided adhesive tape 160.
  • the heat conducted from the first plane part 110, 111, 112 to the second plane part 120 is conducted to the display member 342 while spreading in the plane direction in the second plane part 120.
  • the heat generated in the electronic components 50 to 53 is radiated to the air by the heat conductive sheet 101 and the display member 342 while being diffused to the heat conductive sheet 101 and the display member 342.
  • the electronic device 300 has the same effect as the electronic device 100 of the first embodiment.
  • the display member 342 may be provided with an aluminum plate (metal plate) so as to face the circuit board P in consideration of reinforcement of the display member 342 and heat dissipation. In that case, in particular, it is effective that the surface opposite to the circuit board P in the second flat portion 120 is bonded to the inner surface of the aluminum plate in the display member 342 through the double-sided adhesive tape 160.
  • FIG. 10 is a cross-sectional view of a main part of an electronic device 400 according to the fourth embodiment of the present invention.
  • the electronic device 400 of this embodiment is different from the electronic device 100 according to the first embodiment in a housing 440 and metal mesh members 445 and 446. Other configurations are the same.
  • the housing 440 and the metal mesh members 445 and 446 correspond to the “metal part” of the present invention.
  • the housing 440 is made of metal.
  • This metal is, for example, stainless steel, magnesium alloy, aluminum or aluminum alloy.
  • Other configurations of the housing 440 are the same as those of the housing 40.
  • metal mesh members 445 and 446 are joined to a metal casing 440.
  • the metal mesh members 445 and 446 hold both ends of the heat conductive sheet 101 and are electrically connected to the metal layer 140 and the metal casing 440 of the heat conductive sheet 101.
  • the metal layer 140 of the heat conductive sheet 101 is connected to the ground of the circuit board P via the metal mesh members 445 and 446.
  • the electronic device 400 can prevent external noise and static electricity from the human body from entering the circuit board P and destroying the electronic components 50 to 53 and the like.
  • metal mesh members 445 and 446 may be provided in the electronic device of another embodiment.
  • the metal layer 140 of the heat conductive sheet 101 is connected to the housing 440 via the metal mesh members 445 and 446, but is not limited thereto.
  • the metal layer 140 of the heat conductive sheet 101 may be directly connected to the housing 440.
  • a notch 421 that exposes the metal layer 140 to the side opposite to the circuit board P is formed in the second insulating layer 142 of the heat conductive sheet 101, and the metal of the heat conductive sheet 101 is formed.
  • the layer 140 is attached to the housing 440 with the double-sided adhesive tape 160 through the notch 421.
  • the notch 421 is formed by removing a part of the second insulating layer 142 of the heat conductive sheet 101 by laser processing or the like.
  • the metal layer 140 of the heat conductive sheet 101 is electrically connected to the metal casing 440. Therefore, in the electronic device 450, the metal layer 140 of the heat conductive sheet 101 is connected to the ground of the circuit board P. Therefore, the electronic device 450 has the same effect as the electronic device 400.
  • the notch 421 is formed in the second insulating layer 142, but the present invention is not limited to this, and an opening may be formed in the second insulating layer 142.
  • FIG. 12 is a cross-sectional view of a main part of an electronic device 500 according to the fifth embodiment of the present invention.
  • the electronic device 500 of this embodiment is different from the electronic device 100 according to the first embodiment in that a buffer material K is provided. Other configurations are the same.
  • the cushioning material K is fitted between the surface of the first flat portion 110 opposite to the circuit board P and the inner surface of the housing 40.
  • the buffer material K is also fitted between the surface of the first flat surface portions 111 and 112 opposite to the circuit board P and the inner surface of the housing 40.
  • the buffer material K is composed of a sponge made of urethane resin or the like, a heat conductive rubber made of silicone resin, or the like.
  • the shape of the heat conductive sheet 101 in which the first flat portions 110, 111, and 112 protrude from the second flat portion 120 toward the circuit board P side can be maintained by the three buffer materials K.
  • the three cushioning materials K apply pressure to the electronic component 50 and the metal cases 61 and 62 to the surface opposite to the circuit board P of the first flat portions 110, 111, and 112. Adhesiveness between the first flat portions 110, 111, 112 and the electronic component 50 and the metal cases 61, 62 is increased.
  • the shape retention of the heat conductive sheet 101 is further improved, and the heat conductivity from the electronic component 50 and the metal cases 61, 62 to the first flat portions 110, 111, 112 is also improved. .
  • the buffer material K may be provided in the electronic device of another embodiment.
  • FIG. 13 is a cross-sectional view of a main part of an electronic device 600 according to the sixth embodiment of the present invention.
  • the electronic device 600 of this embodiment is different from the electronic device 100 according to the first embodiment in a heat conductive sheet 601. Other configurations are the same.
  • the heat conductive sheet 601 has a connection part 630 that connects the first flat part 110 and the second flat part 120.
  • the connection portion 630 is formed in a tapered shape.
  • Other configurations of the heat conductive sheet 601 are the same as those of the heat conductive sheet 101.
  • connection part 130 is orthogonal to the first plane part 110 and the second plane part 120 as shown in FIG. In this orthogonal part, a contraction flow occurs and the thermal conductivity is lowered.
  • connection portion 630 is formed in a tapered shape, the curvature of the portion R1 where the connection portion 630 intersects the first flat surface portion 110 or the second flat surface portion 120, and the connection portion 130 is the first flat surface portion 110. Or it reduces from the curvature of the orthogonal part which cross
  • the contracted flow in the portion R1 is further relaxed, and the thermal conductivity is improved. Moreover, since the damage etc. of the heat conductive sheet 601 at the time of drawing are reduced, the yield rate of the heat conductive sheet 601 improves.
  • FIG. 14 is a cross-sectional view of a main part of an electronic device 700 according to the seventh embodiment of the present invention.
  • the electronic device 700 of this embodiment is different from the electronic device 100 according to the first embodiment in a heat conductive sheet 701. Other configurations are the same.
  • the heat conductive sheet 701 has a connection part 730 that connects the first flat part 710 and the second flat part 120.
  • the area of the surface of the first plane part 710 on the circuit board P side is larger than the area of the joint surface between the electronic component 50 and the first plane part 710.
  • Other configurations of the heat conductive sheet 701 are the same as those of the heat conductive sheet 101.
  • the interval between the joining portion of the first flat portion 710 with the electronic component 50 and the second flat portion 120 is widened. Therefore, the heat conductive sheet 701 can be formed in a shape in which the curvature of the portion R ⁇ b> 2 where the connecting portion 730 intersects the first flat portion 710 or the second flat portion 120 is reduced. Therefore, in the heat conductive sheet 701, the contracted flow in the portion R2 is relaxed, and the thermal conductivity is improved.
  • the connecting portion 730 is far from the joint portion with the electronic component 50 in the first plane portion 710. Therefore, the point where the heat conducted to the first plane part 710 is conducted to the second plane part 120 is far from the joint part with the electronic component 50 in the first plane part 710. Therefore, in electronic device 700, a local increase in surface temperature in the region of top plate 40A facing electronic component 50 is further suppressed.
  • the shape of the connecting portion is not limited to a linear shape or a tapered shape, but may be an arc shape or a step shape.
  • FIG. 15 is a cross-sectional view of a main part of an electronic apparatus 800 according to the eighth embodiment of the present invention.
  • the electronic device 800 of this embodiment is different from the electronic device 100 according to the first embodiment in a heat conductive sheet 801. Other configurations are the same.
  • the heat conductive sheet 801 has a first flat surface portion 811 in which the first flat surface portion 111 and the first flat surface portion 112 of the heat conductive sheet 101 shown in FIG. That is, the surface on the circuit board P side in the first flat surface portion 811 is joined to the metal cases 61 and 62 via the double-sided adhesive tapes 151 and 152 so as to straddle the plurality of metal cases 61 and 62.
  • Other configurations of the heat conductive sheet 801 are the same as those of the heat conductive sheet 101.
  • two (a plurality of) heat conductive sheets may be used in accordance with the metal cases 61 and 62. .
  • the electronic device 800 the same operational effects as the electronic device 100 according to the first embodiment can be obtained.
  • FIG. 16 is an enlarged cross-sectional view of a heat conductive sheet 851 according to a first modification of the heat conductive sheet 101 shown in FIG.
  • the heat conductive sheet 851 has a structure in which two heat conductive sheets 101 are heat-sealed.
  • the heat conductive sheet 851 is a circuit of the first insulating layer 141, the metal layer 140, the fusion layer 845, the metal layer 140, and the metal layer 140 formed on the circuit board P side of the metal layer 140. It has the structure where the 2nd insulating layer 142 formed in the opposite side to the board
  • the thickness of the heat conductive sheet 851 is 160 to 300 ⁇ m, for example, 230 ⁇ m.
  • the fused layer 845 is a layer formed by thermally fusing the first insulating layer 141 and the second insulating layer 142 of the two heat conductive sheets 101. Therefore, the fusion layer 845 is made of, for example, modified polypropylene (CPP) as a material that can be thermally fused.
  • the thickness of the fusion layer 845 is 20 to 80 ⁇ m, for example, 25 ⁇ m.
  • the fusion layer 845 is eluted from the end of the heat conductive sheet 101. Since the exuding fusion layer 845 covers the end portion of the metal layer 140, the end portion of the metal layer 140 can be insulated. Other embodiments can similarly insulate the metal layer with a fusion layer. Of course, you may insulate the required location of the heat conductive sheet 101 using an insulating tape.
  • the two heat conductive sheets 101 have the same size, but may have different sizes, that is, a step may be generated at one end of the heat conductive sheet 101. In that case, since the above-described fused layer 845 that has oozed out is held at the stepped portion, the insulation treatment of the end portion of the metal layer 140 is further ensured.
  • the heat conductive sheets 101, 601, 701, and 801 having the structure shown in FIG. 5 are used, but a heat conductive sheet 861 having a different structure may be used.
  • the electronic device 100 in which the heat conductive sheet 101 is replaced with the heat conductive sheet 861 will be described as an example.
  • FIG. 17 is an enlarged cross-sectional view of a heat conductive sheet 861 according to a second modification of the heat conductive sheet 101 shown in FIG. 18 is a cross-sectional view taken along line SS of the electronic device 100 including the heat conductive sheet 861 shown in FIG.
  • FIG. 19 is a cross-sectional view taken along the line TT of the electronic device 100 including the heat conductive sheet 861 shown in FIG.
  • the heat conductive sheet 861 is different from the heat conductive sheet 101 in that the second insulating layer 142 is not formed.
  • Other structures of the heat conductive sheet 861 are the same as those of the heat conductive sheet 101. Therefore, the thickness of the heat conductive sheet 861 is 70 to 110 ⁇ m, for example, 95 ⁇ m.
  • the first insulating layer 141 formed on the circuit board P side of the metal layer 140 is used to form the electronic component 50, the metal cases 61 and 62, and the metal layer of the heat conductive sheet 861.
  • 140 is insulated. Further, the metal layer 140 is exposed on the surface of the heat conductive sheet 861 opposite to the circuit board P. Therefore, the heat conductive sheet 861 is joined to the inner surface of the housing 40 via the metal layer 140.
  • the conductor sheet 101 is joined to the inner surface of the housing 40 via the second insulating layer 142 as shown in FIGS.
  • the thermal conductivity from the heat conductive sheet 861 to the inner surface of the housing 40 is superior to the thermal conductivity from the conductor sheet 101 to the inner surface of the housing 40.
  • this structure is suitable when insulation between the heat conductive sheet 861 and the inner surface of the housing 40 is unnecessary.
  • the heat conductive sheets 101, 601, 701, and 801 having the structure shown in FIG. 5 are used, but a heat conductive sheet 871 having a different structure may be used.
  • the electronic device 100 in which the heat conductive sheet 101 is replaced with the heat conductive sheet 871 will be described as an example.
  • FIG. 20 is an enlarged cross-sectional view of a heat conductive sheet 871 according to a third modification of the heat conductive sheet 101 shown in FIG.
  • FIG. 21 is a cross-sectional view of the SS line of the electronic device 100 including the heat conductive sheet 871 shown in FIG. 22 is a cross-sectional view taken along the line TT of the electronic device 100 including the heat conductive sheet 871 shown in FIG.
  • the heat conductive sheet 871 is different from the heat conductive sheet 101 in that the first insulating layer 141 is not formed as shown in FIG.
  • the structure of the other heat conductive sheet 871 is the same as that of the heat conductive sheet 101. Therefore, the thickness of the heat conductive sheet 871 is 70 to 110 ⁇ m, for example, 95 ⁇ m.
  • the inner surface of the housing 40 and the metal layer 140 of the heat conductive sheet 871 are formed by the second insulating layer 142 formed on the side opposite to the circuit board P of the metal layer 140. And are insulated. Further, the metal layer 140 is exposed on the surface of the heat conductive sheet 871 on the circuit board P side. Therefore, the heat conductive sheet 871 is joined to the electronic component 50 and the metal cases 61 and 62 via the metal layer 140.
  • the conductor sheet 101 is bonded to the electronic component 50 and the metal cases 61 and 62 via the first insulating layer 141.
  • the thermal conductivity from the electronic component 50 to the heat conductive sheet 871 is superior to the thermal conductivity from the electronic component 50 to the conductor sheet 101.
  • the heat conductivity from the metal cases 61 and 62 to the heat conductive sheet 871 is superior to the heat conductivity from the metal cases 61 and 62 to the conductor sheet 101.
  • this structure is suitable when insulation between the heat conductive sheet 871 and the electronic component 50 and the metal cases 61 and 62 is not necessary.
  • the heat conductive sheets 101, 601, 701, and 801 having the structure shown in FIG. 5 are used, but a heat conductive sheet 881 having a different structure may be used.
  • the electronic device 100 in which the heat conductive sheet 101 is replaced with the heat conductive sheet 881 will be described as an example.
  • FIG. 23 is an enlarged cross-sectional view of the second flat portion 820 of the heat conductive sheet 881 according to the fourth modification of the heat conductive sheet 101 shown in FIG.
  • FIG. 24 is an enlarged cross-sectional view of the enclosing portion 190 of the heat conductive sheet 881 according to the fourth modification of the heat conductive sheet 101 shown in FIG.
  • FIG. 25 is a cross-sectional view of the heat conductive sheet 99 and the heat conductive sheet 101.
  • FIG. 26 is a cross-sectional view taken along line SS of the electronic device 100 including the heat conductive sheet 881 shown in FIGS.
  • FIG. 27 is a cross-sectional view taken along the line TT of the electronic device 100 including the heat conductive sheet 881 shown in FIGS.
  • the heat conductive sheet 881 is different from the heat conductive sheet 851 in that the encapsulating portions 190 and 191 are provided. Other structures of the heat conductive sheet 881 are the same as those of the heat conductive sheet 851.
  • the heat conductive sheet 881 faces the electronic component 50 and the metal cases 61 and 62, and encloses 190 that encloses the graphite sheets 170 and 171. 191 and a second flat portion 820 that does not oppose the electronic component 50 and the metal cases 61 and 62.
  • Each of the graphite sheets 170 and 171 corresponds to a “heat conducting member” of the present invention.
  • the enclosing unit 190 includes a first plane part 110, a connection part 130, a third plane part 180 facing the top plate 40A of the housing 40, and a graphite sheet 170.
  • the enclosure portion 191 is also composed of a first plane portion 811, connection portions 131 and 132, a third plane portion 181 that faces the top plate 40 ⁇ / b> A of the housing 40, and a graphite sheet 171.
  • the heat conductive sheet 881 is a sheet formed by heat-sealing the heat conductive sheet 99 and the heat conductive sheet 101 as shown in FIGS. 23, 24, and 25.
  • the fusion layer 845 is a layer formed by thermally fusing the first insulating layer 141 of the heat conductive sheet 99 and the second insulating layer 142 of the heat conductive sheet 101.
  • the heat conductive sheet 99 includes a first insulating layer 141, a metal layer 140, and a second insulating layer 142, and has a structure in which these are stacked in order. Unlike the heat conductive sheet 101, the heat conductive sheet 99 is a flat laminate sheet.
  • the structure of the heat conductive sheet 881 is different between the second flat surface portion 820 and the enclosing portions 190 and 191.
  • the 1st insulating layer 141, the metal layer 140, and the 2nd insulating layer 142 may use the same thickness and the same composition, but the thing from which at least any differs may be used. .
  • the second planar portion 820 includes a first insulating layer 141 formed on the circuit board P side of the metal layer 140, a metal layer 140, a fusion layer 845, and a metal layer. 140 and a second insulating layer 142 formed on the opposite side of the metal layer 140 from the circuit board P, and these are sequentially stacked.
  • the thickness of the second plane part 820 is 160 to 300 ⁇ m, for example 230 ⁇ m.
  • each of the first flat surface portion 811 and the connection portion 130 of the enclosing portion 190 includes a first insulating layer 141 formed on the circuit board P side of the metal layer 140, a metal layer 140, It includes a second insulating layer 142 formed on the opposite side of the circuit board P of the metal layer 140, and has a structure in which these are laminated in order.
  • the thickness of each of the first plane portion 811 and the connecting portion 130 is 80 to 150 ⁇ m, for example, 120 ⁇ m.
  • the third flat surface portion 180 of the enclosing portion 190 also includes a first insulating layer 141 formed on the circuit board P side of the metal layer 140, a metal layer 140, and a circuit board of the metal layer 140. It has the structure where the 2nd insulating layer 142 formed in P and the opposite side was included, and these were laminated
  • the thickness of the third plane portion 180 is also 80 to 150 ⁇ m, for example, 120 ⁇ m.
  • the first flat portion 811, the connecting portion 130, and the third flat portion 180 form a sealed space 175 for enclosing the graphite sheet 170 (see FIG. 24).
  • the graphite sheet 170 is formed by placing the graphite sheet 170 on the first plane portion 811 surrounded by the connection portion 130 in the heat conductive sheet 101, and then connecting the connection portion 130 and the periphery of the first plane portion 811.
  • the three sides of the third plane part 180 are heat-sealed, and the last one is heat-sealed under reduced pressure, so that the inside of the sealing part 190 is hermetically sealed.
  • the enclosure part 191 also has the same structure as the enclosure part 190, and forms the same sealed space. Moreover, the graphite sheet 171 is enclosed in the enclosure part 191 by the same method as the method of enclosing the graphite sheet 170.
  • the structure of the graphite sheet 170 will be described in detail below.
  • the structure of the graphite sheet 171 is the same as that of the graphite sheet 170.
  • the graphite sheet 170 is a sheet formed by a first manufacturing method in which graphite powder is hardened with an organic binder.
  • the implementation is not limited to the first production method, but a second production method in which natural graphite is pulverized and rolled into a sheet, or a third production method in which a polymer film such as polyimide is graphitized by thermal decomposition. A formed graphite sheet may be used.
  • the thickness of the graphite sheet 170 is 10 to 400 ⁇ m, for example, 120 ⁇ m.
  • the thermal conductivity in the plane direction of the graphite sheet 170 is 400 to 1800 W / m ⁇ K, which is higher than the thermal conductivity of metals such as copper, aluminum, aluminum alloy, and stainless steel.
  • the thermal conductivity in the thickness direction of the graphite sheet 170 is 1 to 15 W / m ⁇ K, which is lower than the thermal conductivity of metals such as copper and aluminum.
  • the thermal conductivity of the graphite sheet 170 increases as the thickness of the graphite sheet 170 increases.
  • the thermal conductivity of the graphite sheet formed by the second manufacturing method increases as the thickness of the graphite sheet increases.
  • the thermal conductivity of the graphite sheet formed by the third manufacturing method increases as the thickness of the graphite sheet decreases.
  • the graphite sheets 170 and 171 are easy to transfer heat in the surface direction, but are difficult to transfer heat in the thickness direction. Therefore, in the heat conductive sheet 881, the enclosing portions 190 and 191 enclose the graphite sheets 170 and 171 so that the electronic component 50 and the metal cases 61 and 62 are opposed to the electronic component 50 and the metal cases 61 and 62. Heat is not easily transmitted to the area of the top board 40A.
  • the graphite sheet formed by the first manufacturing method has poor shape retention and is vulnerable to deformation. Therefore, it is difficult to use the graphite sheet after being deformed by drawing or the like.
  • the graphite sheet When the graphite sheet is deformed, the graphite sheet may be damaged or graphite powder may be scattered from the graphite sheet. If graphite powder is scattered from the graphite sheet, a short circuit may occur in the circuit board P. Even when the graphite sheets formed by the second and third manufacturing methods are deformed, the graphite sheets may be damaged.
  • the heat conductive sheet 101 deformed by drawing or the like and the heat conductive sheet 99 are thermally fused, and the graphite sheets 170 and 171 are enclosed in the enclosures 190 and 191. 881 is used.
  • the electronic component 50 and the metal cases 61 and 62 and the top plate 40A of the casing 40 can be used as long as the heat conductive sheet 881 is provided. It can be easily joined to the inner surface of 40 top plates 40A.
  • the surface on the circuit board P side of the first flat portions 110 and 811 is joined to the electronic component 50 and the metal cases 61 and 62 via the double-sided adhesive tapes 150, 151 and 152.
  • the surface of the second flat surface 120 opposite to the circuit board P is joined to the inner surface of the top plate 40 ⁇ / b> A via the double-sided adhesive tape 160.
  • the surface on the opposite side to the circuit board P in the 3rd plane parts 180 and 181 is also joined to the inner surface of the top plate 40A via the double-sided adhesive tape 160.
  • the heat generated in the electronic components 50 to 53 is first conducted to the enclosing portions 190 and 191 of the heat conductive sheet 881.
  • the heat conducted to the encapsulating parts 190 and 191 is conducted to the second plane part 820 and the third plane part 180 while being conducted to the graphite sheets 170 and 171 in the enclosing parts 190 and 191.
  • the heat conducted to the second plane part 820 and the third plane part 180 spreads in the plane direction in the second plane part 820 and the third plane part 180. Therefore, in this configuration, the heat generated in the electronic components 50 to 53 is radiated to the inside of the housing 40 or the outside of the housing 40 while being diffused to the heat conductive sheet 881.
  • the heat conductive sheet 881 in which the graphite sheets 170 and 171 are enclosed in the enclosures 190 and 191 is used, the surface temperature in the region of the top plate 40A facing the electronic components 50 to 53 is increased. The local rise of is suppressed more.
  • the heat conductive sheets 101, 601, 701, and 801 having the structure shown in FIG. 5 are used, but a heat conductive sheet 882 having a different structure may be used.
  • the electronic device 100 in which the heat conductive sheet 101 is replaced with the heat conductive sheet 882 will be described as an example.
  • FIG. 28 is a cross-sectional view taken along line TT of the electronic device 100 including the heat conductive sheet 882 according to the fifth modification of the heat conductive sheet 101 shown in FIG.
  • the difference between the heat conductive sheet 882 and the heat conductive sheet 881 is that it has an enclosing portion 291.
  • the structure of the other heat conductive sheet 882 is the same as the structure of the heat conductive sheet 881.
  • the enclosing portion 291 is thinner than the first flat surface portion 811, the connecting portions 131 and 132, the third flat surface portion 281 protruding from the second flat surface portion 820 toward the circuit board P, and the graphite sheet 171. And a graphite sheet 271.
  • the surface opposite to the circuit board P in the third plane portion 281 is not joined to the inner surface of the top plate 40A.
  • the local increase in the surface temperature in the region of the top plate 40A facing the electronic components 51 to 53 is suppressed as compared with the fourth modification.
  • the method for forming the heat conductive sheet 882 is the same as the method for forming the heat conductive sheet 881.
  • the heat conductive sheets 101, 601, 701, and 801 having the structure shown in FIG. 5 are used, but a heat conductive sheet 883 having a different structure may be used.
  • the electronic device 100 in which the heat conductive sheet 101 is replaced with the heat conductive sheet 883 will be described as an example.
  • FIG. 29 is a cross-sectional view taken along the line TT of the electronic device 100 including the heat conductive sheet 883 according to the sixth modification of the heat conductive sheet 101 shown in FIG.
  • the heat conductive sheet 883 is different from the heat conductive sheet 881 in that the encapsulating part 391 and the second flat part 820 are connected and a connecting part 333 protruding to the circuit board P side is provided.
  • the enclosure portion 391 includes a first plane portion 811, a connection portion 333, a third plane portion 181, and a graphite sheet 171.
  • the other heat conductive sheet 883 has the same structure as that of the heat conductive sheet 881.
  • this fifth modification has the same effects as the fourth modification.
  • the method for forming the heat conductive sheet 883 is the same as the method for forming the heat conductive sheet 881.
  • the heat conductive sheets 101, 601, 701, and 801 having the structure shown in FIG. 5 are used, but a heat conductive sheet 884 having a different structure may be used.
  • the electronic device 100 in which the heat conductive sheet 101 is replaced with the heat conductive sheet 884 will be described as an example.
  • FIG. 30 is an enlarged cross-sectional view of a heat conductive sheet 884 according to a seventh modification of the heat conductive sheet 101 shown in FIG.
  • FIG. 31 is a cross-sectional view taken along line SS of the electronic device 100 including the heat conductive sheet 884 according to the seventh modification of the heat conductive sheet 101 shown in FIG.
  • FIG. 32 is a cross-sectional view taken along line TT of the electronic device 100 including the heat conductive sheet 884 according to the seventh modification of the heat conductive sheet 101 shown in FIG.
  • the heat conductive sheet 884 differs from the heat conductive sheet 101 in that a graphite layer 371 is formed as shown in FIG.
  • the structure of the other heat conductive sheet 884 is the same as that of the heat conductive sheet 101.
  • the heat conductive sheet 884 includes a first insulating layer 141, a metal layer 140, a graphite layer 371, and a second insulating layer 142, and has a structure in which these are laminated in order.
  • the first insulating layer 141 and the metal layer 140, the metal layer 140 and the graphite layer 371, and the graphite layer 371 and the second insulating layer 142 are pasted with an acrylic adhesive or the like.
  • the graphite layer 371 is similarly deformed from a thin graphite sheet along with deformation of the metal layer 140 by drawing or the like.
  • the thermal conductivity of the graphite layer 371 is higher than the thermal conductivity of metals such as copper, aluminum, aluminum alloy, and stainless steel. That is, the thermal conductivity of the graphite layer 371 is higher than the thermal conductivity of the metal layer 140.
  • heat from the electronic component 50 and the metal cases 61 and 62 is conducted through the metal layer 140 and the graphite layer 371.
  • the heat conductive sheet 884 including the graphite layer 371 is used, a local increase in the surface temperature in the region of the top plate 40A facing the electronic components 50 to 53 is further suppressed.
  • the second insulating layer 142 may not be provided if the insulation between the inner surface of the housing 40 and the heat conductive sheet 884 is unnecessary. Further, the first insulating layer 141 may not be provided when the electronic component 50, the metal cases 61 and 62, and the heat conductive sheet 884 are not required to be insulated.
  • the graphite layer 371 is protected by the first insulating layer 141 or the second insulating layer 142. Is preferred.
  • the heat conductive sheets 101, 601, 701, and 801 having the structure shown in FIG. 5 are used, but a heat conductive sheet 885 having a different structure may be used.
  • the electronic device 100 in which the heat conductive sheet 101 is replaced with the heat conductive sheet 885 will be described as an example.
  • FIG. 33 is an enlarged cross-sectional view of a heat conductive sheet 885 according to an eighth modification of the heat conductive sheet 101 shown in FIG.
  • FIG. 34 is a cross-sectional view taken along line SS of the electronic device 100 including the heat conductive sheet 885 according to the eighth modification of the heat conductive sheet 101 shown in FIG.
  • FIG. 35 is a cross-sectional view taken along line TT of the electronic apparatus 100 including the heat conductive sheet 885 according to the eighth modification of the heat conductive sheet 101 shown in FIG.
  • the heat conductive sheet 885 is different from the heat conductive sheet 101 in that a graphite layer 371 is formed as shown in FIG.
  • the other heat conductive sheet 885 has the same structure as the heat conductive sheet 101.
  • the heat conductive sheet 885 is different from the heat conductive sheet 884 in that the stacking order of the metal layer 140 and the graphite layer 371 is switched. Note that the stacking order of the metal layer 140 and the graphite layer 371 is appropriately set according to the thickness and thermal conductivity.
  • the heat conductive sheet 885 includes a first insulating layer 141, a graphite layer 371, a metal layer 140, and a second insulating layer 142, and these are laminated in order.
  • the first insulating layer 141 and the metal layer 140, the metal layer 140 and the graphite layer 371, and the graphite layer 371 and the second insulating layer 142 are pasted with an acrylic adhesive or the like.
  • the heat conductive sheet 885 including the graphite layer 371 since the heat conductive sheet 885 including the graphite layer 371 is used, the local rise in the surface temperature in the region of the top plate 40A facing the electronic components 50 to 53 is further suppressed.
  • the second insulating layer 142 may not be provided when the inner surface of the housing 40 and the heat conductive sheet 885 are not required to be insulated.
  • the first insulating layer 141 may be omitted when the electronic component 50, the metal cases 61 and 62, and the heat conductive sheet 885 are not required to be insulated.
  • the graphite layer 371 is protected by the first insulating layer 141 or the second insulating layer 142. Is preferred.
  • the heat conductive sheets 101, 601, 701, and 801 having the structure shown in FIG. 5 are used, but a heat conductive sheet 886 having a different structure may be used.
  • the electronic device 100 in which the heat conductive sheet 101 is replaced with the heat conductive sheet 886 will be described as an example.
  • FIG. 36 is a cross-sectional view taken along line SS of the electronic device 100 including the heat conductive sheet 886 according to the ninth modification of the heat conductive sheet 101 illustrated in FIG.
  • the difference of the heat conductive sheet 886 from the heat conductive sheet 101 is the shape of the heat conductive sheet 886.
  • the structure of the other heat conductive sheet 886 is the same as the structure of the heat conductive sheet 101.
  • a specific module 59 (camera module or the like) is joined to the inner surface of the top plate 40A of the housing 40.
  • the heat conductive sheet 886 for example, even when the area where the heat conductive sheet 886 and the inner surface of the housing 40 are joined is limited by mounting a specific module 59 (camera module or the like), the area of the heat conductive sheet 886 is reduced. Can be wide. Therefore, the heat conductive sheet 886 has high heat dissipation.
  • the heat conductive sheets 101, 601, 701, and 801 having the structure shown in FIG. 5 are used, but a heat conductive sheet 887 having a different structure may be used.
  • the electronic device 100 in which the heat conductive sheet 101 is replaced with the heat conductive sheet 887 will be described as an example.
  • FIG. 37 is a cross-sectional view taken along line SS of the electronic device 100 including the heat conductive sheet 887 according to the tenth modification of the heat conductive sheet 101 shown in FIG.
  • the difference between the heat conductive sheet 887 and the heat conductive sheet 101 is the shape of the heat conductive sheet 887.
  • the structure of the other heat conductive sheet 887 is the same as the structure of the heat conductive sheet 101.
  • a specific module 59 (camera module or the like) is joined to the inner surface of the top plate 40A of the housing 40.
  • the edge part of the 2nd plane part 120 bends on the opposite side to the circuit board P, and the surface on the opposite side to the circuit board P of the bent part 120B is interposed via the double-sided adhesive tape 160. It is joined to the top plate 40A.
  • the surface of the bent portion 120B on the side of the circuit board P is bonded to the surface of the second flat surface portion 120 other than the portion 120B opposite to the circuit substrate P (by an adhesive or heat fusion).
  • the heat conductive sheet 887 for example, even when the area where the heat conductive sheet 887 and the inner surface of the housing 40 are joined is limited by mounting a specific module 59 (camera module or the like), the area of the heat conductive sheet 887 is reduced. Can be wide. Therefore, the heat conductive sheet 887 has high heat dissipation.
  • the end portion of the heat conductive sheet 887 is located between the second flat portion 120 and the top plate 40A of the housing 40 and is structurally isolated from the circuit board P. Therefore, the tenth modification can prevent the metal layer 140 exposed at the end of the heat conductive sheet 887 from coming into contact with the circuit board P and short-circuiting.
  • the heat conductive sheets 101, 601, 701, and 801 having the structure shown in FIG. 5 are used, but a heat conductive sheet 888 having a different structure may be used.
  • the electronic device 100 in which the heat conductive sheet 101 is replaced with the heat conductive sheet 888 will be described as an example.
  • FIG. 38 is a cross-sectional view taken along the line SS of the electronic device 100 including the heat conductive sheet 888 according to the eleventh modification of the heat conductive sheet 101 shown in FIG.
  • the difference of the heat conductive sheet 888 from the heat conductive sheet 101 is the shape of the heat conductive sheet 888.
  • the structure of the other heat conductive sheet 888 is the same as the structure of the heat conductive sheet 101.
  • a specific module 59 (camera module or the like) is joined to the inner surface of the top plate 40A of the housing 40.
  • the edge part of the 2nd plane part 120 is wound to the circuit board P side, or it is folded in half, and it is formed so that it may face the surface at the side of the circuit board P of the 2nd plane part 120. Yes.
  • the heat conductive sheet 888 for example, even when the area where the heat conductive sheet 888 and the inner surface of the housing 40 are joined is limited by mounting a specific module 59 (camera module or the like), the area of the heat conductive sheet 888 is reduced. Can be wide. Therefore, the heat conductive sheet 888 has high heat dissipation.
  • the end portion of the heat conductive sheet 888 is formed so as to face the surface of the second flat portion 120 on the circuit board P side, and is structurally isolated from the circuit board P. Therefore, this 11th modification can prevent the metal layer 140 exposed in the edge part of the heat conductive sheet 888 from contacting the circuit board P and short-circuiting.
  • the heat conductive sheets 101, 601, 701, and 801 having the structure shown in FIG. 5 are used, but a heat conductive sheet 1201 having a different structure may be used.
  • FIG. 39 is an external perspective view of a heat conductive sheet 1201 according to a modification of the heat conductive sheet 101 shown in FIG. 40 is a cross-sectional view taken along line AA shown in FIG.
  • the difference between the heat conductive sheet 1201 and the heat conductive sheet 101 is the shape of the heat conductive sheet 1201.
  • the structure of the other heat conductive sheet 1201 is the same as the structure of the heat conductive sheet 101.
  • the heat conductive sheet 1201 has a periodic structure in which a plurality of first flat portions 1210 are periodically arranged in a staggered manner. The intervals between the first plane portions 1210 are all uniform. Each first plane portion 1210 has a circular shape in plan view. All of the first planar portions 1210 have the same shape and the same size.
  • the first plane portion 1210 is deformed by the drawing process so that the first plane portion 1210 protrudes from the second plane portion 1220 to the circuit board side.
  • the cross-sectional shape of the drawing process is semicircular or semielliptical.
  • the drawing depth of the first plane portion 1210 is the same. It becomes easy to press the heat-emitting component on the circuit board P by having a semicircular shape or a semi-elliptical shape.
  • the surface on the circuit board side in the first plane portion 1210 is joined to the heat generating component on the circuit board. Further, the surface of the second plane portion 1220 opposite to the circuit board is joined to the inner surface of the top plate of the housing.
  • the heat conductive sheet 1201 has a periodic structure, the heat conductive sheet 1201 can be easily joined to the heat generating component regardless of where the heat generating component is disposed on the circuit board. That is, the chance of contact between the heat conductive sheet 1201 and the heat generating component increases.
  • the heat conductive sheet 101 it is necessary to perform drawing processing in accordance with the arrangement of the heat generating components (the electronic component 50 and the metal cases 61 and 62) on the circuit board P to form the first flat portions 110, 111, and 112. There is. That is, it is necessary to provide a die for drawing in accordance with the arrangement of the heat generating components on the circuit board P.
  • heat conductive sheets having different periodic structures may be prepared, and heat conductive sheets suitable for the arrangement of the heat generating components on each circuit board may be selected from the several types of heat conductive sheets. It is not necessary to provide a die for drawing processing in accordance with the arrangement of the heat generating components on the circuit board P. Therefore, according to the heat conductive sheet 1201, versatility is improved and the manufacturing cost can be reduced.
  • Ninth embodiment 41 is a cross-sectional view of the main part of an electronic device 900 according to the ninth embodiment of the present invention, which includes the heat conductive sheet 1201 shown in FIG.
  • the electronic device 900 of this embodiment is different from the electronic device 100 according to the first embodiment in the arrangement on the heat conductive sheet 1201 and the circuit board P. Other configurations are the same.
  • circuit board P On the circuit board P, electronic components (active components) 50 and 54 that generate heat when supplied with power and passive components 80 and 81 such as capacitors and inductors are mounted.
  • active components 50 and 54 that generate heat when supplied with power and passive components 80 and 81 such as capacitors and inductors are mounted.
  • a heat conductive sheet 1201 shown in FIG. 41 is a sheet in which some of the plurality of first flat portions 1210 of the heat conductive sheet 1201 shown in FIG. 39 are deformed to become first flat portions 1310, 1311, and 1312. Therefore, the heat conductive sheet 1201 has a periodic structure as shown in FIG.
  • the surface on the circuit board P side of the first flat portion 1310 is joined to a part (substantially half) of the top surface of the electronic component 54.
  • the surface on the circuit board P side in the first plane portion 1210 is not joined to any of the electronic components 50 and 54 and the passive component 81 located in the vicinity thereof.
  • the surface on the circuit board P side in the first plane portion 1311 is joined to substantially the entire top surface of the electronic component 50.
  • the surface on the circuit board P side in the first plane portion 1312 is joined to the top surface of the passive component 80.
  • a dimension capable of joining the electronic components 50 and 54 and the first flat portions 1310 and 1311 is appropriately selected.
  • the heights are different as in the case of the electronic parts 50 and 54, it is preferable to match the electronic parts 54 with a low height.
  • the deformation of the first flat portion 1311 on the electronic component 50 side becomes large.
  • the first flat portion 1310 on the electronic component 54 side is an electronic component. Instead of being joined to 54, they may be close to each other.
  • the heat conductive sheet 1201 shown in FIG. 39 is housed in the housing 40 and joined to the electronic components 50 and 54 and the passive component 80, whereby the substantially semicircular cross-sectional shape of the drawing process is deformed.
  • First plane portions 1310, 1311, and 1312 are formed.
  • Some passive components 80 preferably do not allow the heat of the electronic component 50 to be conducted by the heat conductive sheet 1201, but the heat of the electronic component 50 is mainly from the second flat surface adjacent to the first flat portion 1311.
  • the heat conducted to the part 1220 and conducted to the second plane part 1220 is conducted to the top plate 40A of the housing 40 while spreading in the plane direction in the second plane part 1220, so the influence is small.
  • the material of the metal layer 140 of the heat conductive sheet 1201 is, for example, copper, it has a spring property. In this case, the heat conductive sheet 1201 and the electronic component 50 can be more closely attached. Further, even when aluminum is used as the material of the metal layer 140 of the heat conductive sheet 1201, the gap between the housing 40 and the electronic component 50 is smaller than the depth of drawing, so that the electronic component 50 is pressed. The heat conductive sheet 1201 and the electronic component 50 can be more closely attached.
  • the double-sided adhesive tape 150 may not be used to join the electronic components 50 and 54, the passive component 80, and the first flat portions 1310, 1311, and 1312.
  • an adhesive such as a double-sided adhesive tape 150, a heat conductive adhesive layer, or grease may be used.
  • the surface opposite to the circuit board P in the second plane portion 1220 is joined to the inner surface of the top plate 40A of the housing 40 via the double-sided adhesive tape 160.
  • the double-sided pressure-sensitive adhesive tape 160 may be attached to the inner surface of the housing 40 so as to be approximately the same as the size of the heat conductive sheet 1201, or corresponds to the second flat portion 1220 of the heat conductive sheet 1201. You may paste them individually.
  • the metal layer 140 of the heat conductive sheet 1201 may be connected to the ground of the circuit board P.
  • the electronic device 900 has the same effect as the electronic device 100 of the first embodiment.
  • FIG. 42 is a plan view of a heat conductive sheet 1401 according to a first modification of the heat conductive sheet 1201 shown in FIG.
  • FIG. 43 is a plan view of a heat conductive sheet 1501 according to a second modification of the heat conductive sheet 1201 shown in FIG.
  • FIG. 44 is a plan view of a heat conductive sheet 1601 according to a third modification of the heat conductive sheet 1201 shown in FIG.
  • FIG. 45 is a plan view of a heat conductive sheet 1701 according to a fourth modification of the heat conductive sheet 1201 shown in FIG.
  • Each of the heat conductive sheets 1401, 1501, 1601, and 1701 is different from the heat conductive sheet 1201 in that the periodic structure is different.
  • the other structures are the same.
  • the heat conductive sheet 1401 has a periodic structure in which circular first plane portions 1210 are arranged in a matrix in a plan view.
  • the first plane portion 1210 is deformed by drawing so that the first plane portion 1210 protrudes from the second plane portion 1420 to the circuit board side.
  • the shape of the first planar portion 1210 in plan view is not limited to a circular shape, but may be a rectangular shape, an elliptical shape, or a polygonal shape.
  • the heat conductive sheet 1501 has a periodic structure in which rod-shaped first flat portions 1510 are arranged in a row in a plan view.
  • the first plane portion 1510 is deformed by drawing so that the first plane portion 1510 protrudes from the second plane portion 1520 toward the circuit board.
  • continuous processing with a progressive press is easy.
  • the convection inside the housing 40 can be improved.
  • the heat conductive sheet 1601 has a periodic structure in which a lattice-shaped first plane portion 1610 is arranged in a plan view.
  • the first planar portion 1610 is deformed by drawing so that the first planar portion 1610 protrudes from the second planar portion 1620 to the circuit board side.
  • the heat radiation inside the housing 40 is the center, and the outside of the housing 40 is The heat dissipation to is suppressed as compared with the other embodiments.
  • the heat conductive sheet 1701 has a periodic structure in which the first plane portions 1210 in 3 rows and 2 columns are unevenly distributed or scattered.
  • the first flat surface portion 1210 is deformed by drawing so that the first flat surface portion 1210 protrudes from the second flat surface portion 1720 to the circuit board side. Even if it is not sequentially matched with the arrangement of the heat generating components on the circuit board, if the location where the heat generating components are concentrated is known in advance, it is efficient to concentrate the first plane portion 1210 at that location.
  • FIG. 46 is a cross-sectional view of a heat conductive sheet 1801 according to a fifth modification of the heat conductive sheet 1201 shown in FIG. 47 is a cross-sectional view of a heat conductive sheet 1901 according to a sixth modification of the heat conductive sheet 1201 shown in FIG.
  • FIG. 48 is a cross-sectional view of a heat conductive sheet 2001 according to a seventh modification of the heat conductive sheet 1201 shown in FIG.
  • FIG. 49 is a cross-sectional view of a heat conductive sheet 2041 according to an eighth modification of the heat conductive sheet 1201 shown in FIG.
  • FIG. 50 is a cross-sectional view of a heat conductive sheet 2051 according to a ninth modification of the heat conductive sheet 1201 shown in FIG.
  • FIG. 51 is a cross-sectional view of a heat conductive sheet 2101 according to a tenth modification of the heat conductive sheet 1201 shown in FIG.
  • the heat conductive sheet 1801 is a sheet in which the first flat portion 1810 is formed by drawing before being joined to the heat-generating component.
  • the first flat portion 1810 is preferably formed relatively small before joining so as to expand in the top surface direction of the heat-generating component after joining.
  • the heat conductive sheet 1901 shown in FIG. 47 is a sheet formed by embossing the heat conductive sheet 1201 shown in FIG.
  • the heat conductive sheet 1901 includes a first flat surface portion 1910, an embossed portion 1970 and a second flat surface portion 1920 between the first flat surface portion 1910 and the first flat surface portion 1910.
  • embossed part 1970 protrudes from the first plane part 1910 to the side opposite to the circuit board and protrudes from the second plane part 1920 to the circuit board side.
  • embossing is performed so as to connect two adjacent first plane portions 1910, but embossing may be performed so as to connect two or more first plane portions 1910. Embossing is easy to process because it does not extend the heat conductive sheet 1901 unlike drawing.
  • the embossed portion 1970 When the embossed portion 1970 has a narrow pitch of, for example, 1 mm or less, the embossed portion 1970 protrudes from the second plane portion 1920 to the circuit board side as shown in FIG. 47, but in the case of a relatively wide pitch of, for example, 2 mm or more It is also possible for the embossed portion 1970 to be flush with the second plane portion 1920.
  • the heat conductive sheet 2001 has a periodic structure with a plurality of enclosures 2090.
  • the cross-sectional shape of the enclosing portion 2090 has a semicircular shape or a semi-elliptical shape.
  • the enclosing portion 2090 is formed such that the first plane portion 2010 protrudes to the circuit board side from the second plane portion 2020 and the third plane portion 2080.
  • the first plane portion 2010 is formed by drawing.
  • the 2nd plane part 2020 and the 3rd plane part 2080 are formed by heat-sealing (heat-sealing) two heat conductive sheets.
  • the enclosing part 2090 may be formed with a double-sided adhesive tape or the like instead of forming the enclosing part by thermal fusion.
  • the second plane part 2020 and the third plane part 2080 are substantially flush with each other, but the thickness of the second plane part 2020 is the same as that of the third plane part 2080 and the thickness of the first plane part 2010 by heat sealing. It is thinner than the sum of
  • the thermal conductivity in the second flat portion 2020 is improved. It is preferable in terms of thermal conductivity that the metal layers of the second plane portion 2020 be as close as possible.
  • the enclosing portion 2090 forms a sealed space 2075 inside. Unlike the heat conductive sheet 881, the enclosing unit 2090 encloses a gas such as air or nitrogen in the sealed space 2075. The gas is enclosed in the process of heat-sealing the second flat portion 2020.
  • the heat conductive sheet 2001 is excellent in heat dissipation toward the housing 40 side by the third flat surface portion 2080 and has elasticity by the enclosing portion 2090.
  • gas may be sealed after the second flat portion 2020 is heat-sealed. If an air valve or the like is provided on the heat conductive sheet, gas can be sealed after heat fusion.
  • the gas may be sufficiently filled in the sealed space 2075 so that a pressing force can be obtained before being stored in the housing 940, but so that the pressing force can be obtained after being stored in the housing 940.
  • the sealed space 2075 may be filled with a predetermined amount.
  • heat storage material into the sealed space 2075 to perform heat storage and heat transport.
  • heat transport it is preferable in terms of heat transport that the heat storage material is injected into the sealed space 2075 located at the outer edge of the heat conductive sheet 2001.
  • heat transport it is preferable in terms of heat transport to inject into the sealed space 2075 located above the passive component.
  • the heat storage material is composed of solid paraffin.
  • Paraffinic materials include solid paraffin, liquid paraffin, and other various materials having different melting points, heat storage amounts (heats of fusion), and other characteristics.
  • the heat conductive sheet 2001 can be easily sealed in the sealing portion 2090 in this embodiment.
  • solid paraffin that is solid at room temperature is used.
  • the solid paraffin one that melts and becomes liquid when a predetermined temperature, for example, 40 ° C. or higher is used.
  • a heat storage amount of 150 to 250 (kJ / kg) is used.
  • the heat conducted from the electronic components 50 to 53 becomes the latent heat of the heat storage material.
  • inorganic hydrate salts such as calcium chloride hydrate, sodium acetate hydrate and sodium sulfate hydrate may be used.
  • the amount of heat storage is smaller than that of paraffin, but the volume change rate is preferably about 3% or less, which is preferable.
  • a solid paraffin-based material is a material having a relatively large thermal expansion (for example, 10 to 15% at around 30 to 40 ° C.) among other heat storage materials.
  • the heat storage material is hermetically sealed in the sealed portion 2090 under reduced pressure, so that the sealed state can be maintained even if expansion or contraction occurs due to a temperature change. .
  • the heat conduction sheet 2041 shown in FIG. 49 includes an enclosing portion 2094 including the first plane portions 2014A and 2014B and the third plane portion 2084, and a second plane portion 2024.
  • the heat conducting sheet 2041 shown in FIG. 49 is different from the heat conducting sheet 2001 shown in FIG. 48 in the shapes of the first flat portions 2014A and 2014B in the enclosing portion 2094.
  • the enclosing portion 2094 is formed such that the first plane portions 2014A and 2014B protrude from the second plane portion 2024 and the third plane portion 2084 to the circuit board side.
  • the first plane portions 2014A and 2014B are formed by drawing. Thereby, the first plane portion 2014A has a tapered shape, and the first plane portion 2014B has an R shape.
  • the heat conduction sheet 2051 shown in FIG. 50 includes an enclosing portion 2095 including the first flat portions 2015A and 2015B and a third flat portion 2085, and a second flat portion 2025.
  • the heat conducting sheet 2051 shown in FIG. 50 is different from the heat conducting sheet 2001 shown in FIG. 48 in the shapes of the first flat portions 2015A and 2015B in the enclosing portion 2095.
  • the enclosing portion 2095 is formed so that the first plane portions 2015A and 2015B protrude from the second plane portion 2025 and the third plane portion 2085 to the circuit board side.
  • the first plane portions 2015A and 2015B are formed by drawing. Thereby, each of 1st plane part 2015A, 2015B has R shape.
  • the curvature of the first plane portion 2015A is smaller than the curvature of the first plane portion 2015B.
  • the heat conductive sheet 2101 includes an enclosing portion 2190 including a first flat portion 2010 formed by drawing, and a second flat portion 2020 formed by heat-sealing the heat conductive sheet 2101. Have.
  • the heat conductive sheet 2101 has a periodic structure with a plurality of enclosing portions 2190.
  • the enclosing portion 2190 is formed so as to protrude from the second plane portion 2020 on both sides of the circuit board side and the opposite side of the circuit board.
  • the protruding portion on the side opposite to the circuit board of the enclosing portion 2190 is formed by drawing as in the first flat portion 2010.
  • the enclosure 2190 forms a sealed space 2175 inside.
  • the enclosure 2190 encloses a gas such as air or nitrogen in the sealed space 2175. The gas is enclosed in the process of heat-sealing the second flat portion 2020.
  • the enclosure 2090 has elasticity on both the circuit board side and the opposite side of the circuit board.
  • Tenth Embodiment 52 is a cross-sectional view of the main part of an electronic apparatus 1000 according to the tenth embodiment of the present invention, which includes the heat conductive sheet 2101 shown in FIG.
  • the electronic device 1000 of this embodiment is different from the electronic device 100 according to the first embodiment in the heat conductive sheet 2101, the thickness of the housing 940, and the arrangement on the circuit board P. Other configurations are the same.
  • the thickness of the housing 940 is larger than the thickness of the housing 40.
  • circuit board P electronic components 50 and 54 that generate heat when supplied with power and passive components 80 such as capacitors and inductors are mounted.
  • the heat conductive sheet 2101 includes enclosing portions 2290 to 2293 and a second flat portion 2020.
  • the enclosure portions 2290 to 2293 include first plane portions 2210, 2010, 2211 and 2122, and third plane portions 2280 to 2283.
  • the heat conductive sheet 2101 has a periodic structure with a plurality of enclosing portions including enclosing portions 2290 to 2293.
  • the enclosing portions 2290 to 2293 are formed so as to protrude from the second plane portion 2020 on both sides of the circuit board side and the opposite side of the circuit board. Enclosed portions 2290 to 2293 form sealed spaces 2275 to 2278 therein.
  • the enclosure portions 2290 to 2293 enclose gas such as air or nitrogen in the sealed spaces 2275 to 2278. The gas is enclosed in the process of heat-sealing the second flat portion 2020. Therefore, the enclosing portions 2290 to 2293 have elasticity on both the circuit board side and the opposite side to the circuit board.
  • the thermal conductivity of the gas is low, the heat conduction in the thickness direction in the enclosing portions 2290 to 2293 is suppressed. Therefore, it is possible to suppress a local increase in the surface temperature of the casing 940 that faces the third plane portions 2280 to 2283.
  • the first flat portion 2210 is joined to a part (substantially half) of the top surface of the electronic component 54.
  • the first planar portion 2010 is not joined to any of the electronic components 50 and 54 and the passive component 81 located in the vicinity.
  • the main surface on the circuit board P side in the first plane portion 2211 is joined to substantially the entire top surface of the electronic component 50.
  • the main surface on the circuit board P side in the first plane portion 2212 is joined to the top surface of the passive component 80.
  • the depth of the drawing process is appropriately selected so that the electronic parts 50 and 54 and the first flat portions 2210 and 2211 can be joined.
  • the heights of the electronic component 50 and the electronic component 54 are different, it is preferable to match the electronic component 54 with a low height.
  • the deformation of the first flat portion 2211 on the electronic component 50 side becomes large.
  • the first flat portion 2210 on the electronic component 54 side is You may make it adjoin instead of joining to the electronic component 54.
  • the heat conductive sheet 2101 shown in FIG. 51 is accommodated in the housing 940 and joined to the electronic components 50, 54 and the passive component 80, so that the enclosing portion 2190 having a substantially circular cross section for drawing. Is deformed to form first flat portions 2210 to 2212. Further, the encapsulating portion 2190 of the heat conductive sheet 2101 is deformed in contact with the top plate 940A of the housing 940, so that third flat portions 2280 to 2283 are formed.
  • Some passive components 80 preferably do not conduct heat of the electronic component 50 by the heat conductive sheet 2101, but the heat of the electronic component 50 is mainly from the second flat surface adjacent to the first flat portion 2211.
  • the heat conducted to the part 2020 and conducted to the second plane part 2020 is conducted to the third plane part 2282 and the adjacent third plane part 2283 while spreading in the plane direction in the second plane part 2020, and the third plane part 2282. , 2283, it is conducted to the top plate 40A of the housing 40 while spreading in the plane direction, so the influence is small.
  • the electronic components 50 and 54 can be pressed, and the heat conductive sheet 2101 and the electronic components 50 and 54 are more closely attached. Can do.
  • an adhesive such as a double-sided adhesive tape 150, a heat conductive adhesive layer, or grease may be used.
  • the surface opposite to the circuit board P in the third plane portions 2280 to 2283 is joined to the inner surface of the top plate 940A of the housing 940 via the double-sided adhesive tape 160.
  • the double-sided pressure-sensitive adhesive tape 160 may be attached to the inner surface of the housing 940 so as to be substantially the same as the size of the heat conductive sheet 2101, or corresponds to the third flat portions 2280 to 2283 of the heat conductive sheet 2101. You may stick them individually.
  • the electronic device 1000 has the same effect as the electronic device 100 of the first embodiment.
  • FIG. 53 is a cross-sectional view of a main part of an electronic device 1001 according to a first modification of the electronic device 1000 shown in FIG.
  • the electronic component 58 is bonded to the plurality of first flat portions 2211 of the heat conductive sheet 2101.
  • the area of the top surface of the electronic component 58 is larger than the area of the top surface of the electronic component 50 shown in FIG.
  • the heat generated in the electronic component 58 is conducted to the plurality of first flat portions 2211, so that the heat dissipation of the electronic component 58 is improved.
  • an adhesive such as grease may be used.
  • the first flat portions 2211 and 2112 Since an adhesive such as grease wraps around and is filled in between, the adhesiveness between the adhesive such as grease and the heat conductive sheet 2101 is improved, and heat dissipation is improved.
  • FIG. 54 is a cross-sectional view of a main part of an electronic device 1002 according to a second modification of the electronic device 1000 shown in FIG.
  • FIG. 55 is a cross-sectional view of a main part of an electronic device 1003 according to a third modification of electronic device 1000 shown in FIG.
  • the surface opposite to the circuit board P in the third plane portions 2280 to 2283 is directly bonded to the inner surface of the top plate 940A of the housing 940 without the double-sided adhesive tape 160 interposed therebetween. is doing. Since the enclosing portions 2290 to 2293 have elasticity, it is possible to sandwich the heat conductive sheet 2101 between the housing 940, the electronic components 50 and 54, and the passive components 80 and 81 (that is, the circuit board P). .
  • the double-sided adhesive tape 160 can be affixed and fixed to a wide area around the central portion of the heat conductive sheet 2101 or around the end portion except the central portion.
  • double-sided adhesive tapes 1261 and 1262 can be attached and fixed to locations where the heat conductive sheet 2101 is joined to the electronic components 50 and 54 (see FIG. 55).
  • FIG. 56 is a cross-sectional view of a main part of an electronic device 1004 according to a fourth modification of the electronic device 1000 shown in FIG.
  • a first gap is formed between the enclosing portion 2290 and the enclosing portion 2291 (the upper portion of the second flat portion 2020).
  • a second gap is formed between the enclosing portion 2291 and the enclosing portion 2292 (the upper portion of the second plane portion 2020). Therefore, it is possible to provide parts such as the antennas A3 and A4 that are desired to avoid electromagnetic shielding in the first and second gaps.
  • FIG. 57 is a plan view of a heat conductive sheet 2401 according to a ninth modification of the heat conductive sheet 1201 shown in FIG. 58 is a cross-sectional view taken along line BB shown in FIG.
  • the heat conductive sheet 2401 is different from the heat conductive sheet 1201 in that an encapsulating portion 2490 including the first flat portion 2410 is formed by heat-sealing (heat-sealing) the second flat portion 2420 of the heat conductive sheet 2401. It is a point. That is, unlike the heat conductive sheet 1201 shown in FIG. 39, it differs from what formed the 1st plane part 1210 by drawing beforehand.
  • the structure of the heat conductive sheet 2401 is the same as the structure of the heat conductive sheet 2101 shown in FIG.
  • the heat conductive sheet 2401 includes an enclosing portion 2490 including a first flat portion 2410 and a second flat portion 2420. As shown in FIG. 57, the heat conductive sheet 2401 has a periodic structure in which a plurality of enclosing portions 2490 are periodically arranged in a matrix.
  • Each enclosure 2490 has a rectangular shape in plan view. All the enclosing portions 2490 have the same shape and the same size. Each enclosing portion 2490 has a circular or oval cross-sectional shape. Since each enclosing portion 2490 has a circular shape or an oval shape, it is easy to press the heat generating component on the circuit board.
  • the enclosing portion 2490 is formed so as to protrude from the second plane portion 2420 on both sides of the circuit board side and the opposite side of the circuit board.
  • the enclosing portion 2490 forms a sealed space 2475 inside.
  • the enclosure 2490 encloses a gas such as air or nitrogen in the sealed space 2475. The gas is enclosed in the process of heat-sealing the second flat portion 2420.
  • the enclosure 2490 has elasticity on both the circuit board side and the opposite side of the circuit board.
  • the heat conductive sheet 2401 is easy to process because the encapsulating portion 2490 is formed by thermal fusion, and the size of the enclosing portion 2490 can be freely changed.
  • the heat conductive sheet 2401 for example, several types of heat conductive sheets 2401 having different periodic structures may be prepared, and a heat conductive sheet suitable for the arrangement of heat-generating components on each circuit board may be selected from several types of heat conductive sheets. That is, it is not necessary to provide a die for drawing processing in accordance with the arrangement of the heat generating components on the circuit board. Therefore, according to the heat conductive sheet 2401, versatility can be improved and the manufacturing cost can be reduced.
  • the fusion layer has unstretched polypropylene (CPP), ethylene vinyl acetate copolymer resin (EVA), and low density polyethylene (LDPE). Sealant materials such as acrylic copolymer resins are used.
  • FIG. 59 is a cross-sectional view of a heat conductive sheet 2451 according to a first modification of the heat conductive sheet 2401 shown in FIG.
  • the heat conductive sheet 2451 has an enclosing portion 2499 including a first flat portion 2410 and a third flat portion 2489, and a second flat portion 2420.
  • the heat conductive sheet 2451 has a periodic structure with a plurality of enclosure parts 2499.
  • the cross-sectional shape of the enclosing portion 2499 has a semicircular shape or a semielliptical shape.
  • the enclosing portion 2499 is formed such that the first flat portion 2410 formed by heat-sealing the second flat portion 2420 protrudes from the second flat portion 2420 and the third flat portion 2489 to the circuit board side. Yes.
  • the second plane part 2420 and the third plane part 2489 are substantially flush with each other, but the thickness of the second plane part 2420 is thinner than the thickness of the third plane part 2489 by heat sealing.
  • the thermal conductivity in the second flat portion 2420 is improved. It is preferable in terms of thermal conductivity that the metal layers of the second plane portion 2420 be as close as possible.
  • the enclosing portion 2499 forms a sealed space 2479 inside. Unlike the heat conductive sheet 881, the enclosing portion 2499 encloses a gas such as air or nitrogen in the sealed space 2479. The gas is enclosed in the process of heat-sealing the second flat portion 2420.
  • the heat conductive sheet 2451 is excellent in heat dissipation toward the housing 40 side by the third flat surface portion 2489 and has elasticity by the enclosing portion 2499.
  • Heat sealing methods include a hot plate method, an impulse method, and an ultrasonic method.
  • a hot plate method is preferable, and in order to improve heat sealability, an impulse method or an ultrasonic method is preferable.
  • the manufacturing method of this embodiment uses a hot plate method.
  • a predetermined amount of gas such as air or nitrogen is sealed in the sealing portion 90, and then the remaining one side is heat-sealing and the sealing portion 90 is closed. (4-way seal).
  • the rice-shaped portion 21 is thermally fused and divided into four. At this time, the gas is pressed by a pressing jig or the like so as to be uniform in each of the sealed portions 91 to 94, and then thermally fused.
  • heat sealing is further performed in the shape of a rice field.
  • the heat conductive sheet 2401 which has the some enclosure part 2490 and the 2nd plane part 2420 is obtained.
  • the depth of the projecting first planar part 2410 is determined by the amount of gas enclosed, the width of the second planar part 2420, or the size of the small enclosed part 2490.
  • FIG. 63 is a cross-sectional view of a main part of an electronic device 1100 according to the eleventh embodiment of the present invention, which includes the heat conductive sheet 2401 shown in FIG.
  • a heat conductive sheet 2401 shown in FIG. 63 is a sheet in which a plurality of encapsulated portions 2491 of the heat conductive sheet 2401 shown in FIGS. 57 and 58 are deformed to become encapsulated portions 2491 to 2494.
  • the heat conductive sheet 2401 includes enclosing portions 2491 to 2494 and a second flat portion 2420.
  • the enclosing portions 2491 to 2494 include first plane portions 2411, 2410, 2413, and 2410, and third plane portions 2480 to 2483.
  • the heat conductive sheet 2401 has a periodic structure with a plurality of enclosing portions including enclosing portions 2491 to 2494.
  • the structure of the heat conductive sheet 2401 is similar to that of the heat conductive sheet 2101 shown in FIG. 52, but the enclosing portions 2491 to 2494 of the heat conductive sheet 2401 are subjected to drawing processing like the heat conductive sheet 2101. Unlike the encapsulating portions 2290 to 2293 having shape retention, it is more flexible.
  • the enclosing portions 2491 to 2494 are formed so as to protrude from the second plane portion 2420 on both sides of the circuit board side and the opposite side of the circuit board. Enclosed portions 2491 to 2494 form sealed spaces 2476 to 2479 inside. The enclosing portions 2491 to 2494 enclose gas such as air or nitrogen in the sealed spaces 2476 to 2479. The gas is enclosed in the process of heat sealing. Therefore, the enclosing portions 2491 to 2494 have elasticity on both the circuit board side and the opposite side of the circuit board.
  • the first flat portion 2411 is joined to a part (substantially half) of the top surface of the electronic component 54.
  • the first plane portion 2410 is not joined to any of the electronic components 50 and 54 and the passive component 81 located in the vicinity.
  • the main surface on the circuit board P side in the first plane portion 2412 is joined to substantially the entire top surface of the electronic component 50.
  • the main surface on the circuit board P side in the first planar portion 2413 is joined to the top surface of the passive component 80.
  • the heat conductive sheet 2401 shown in FIGS. 57 and 58 is accommodated in the housing 940 and joined to the electronic components 50, 54 and the passive component 80, so that the enclosing portion 2490 having a substantially circular cross section is obtained. Is deformed so as to expand in the direction of the top surface of the electronic component 50, or in the direction of the top surface and the side surface of the electronic component 54, so that the first plane portions 2411 to 2413 are formed. Further, the abutment portion 2490 of the heat conductive sheet 2401 shown in FIGS. 57 and 58 is deformed so as to expand in the surface direction of the top plate 940A by contacting the top plate 940A of the housing 940, and the third flat portions 2480 to 2483 are formed. It is formed.
  • the electronic components 50 and 54 can be pressed, and the heat conductive sheet 2401 and the electronic components 50 and 54 are more closely attached. Can do.
  • an adhesive such as a double-sided adhesive tape 150, a heat conductive adhesive layer, or grease may be used.
  • the surface opposite to the circuit board P in the third plane portions 2480 to 2483 is joined to the inner surface of the top plate 940A of the housing 940 via the double-sided adhesive tape 160.
  • the double-sided adhesive tape 160 may be affixed to the inner surface of the housing 940 so as to be approximately the same as the size of the heat conductive sheet 2401, or corresponds to the third flat portions 2480 to 2483 of the heat conductive sheet 2401. You may stick them individually.
  • the electronic device 1100 has the same effect as the electronic device 100 of the first embodiment.
  • the 64 is an electronic device 1101 according to a modification of the electronic device 1100 shown in FIG. 63, and includes the main part of the electronic device 1101 including the heat conduction sheet 2501 according to the second modification of the heat conduction sheet 2401 shown in FIG. FIG.
  • the heat conductive sheet 2501 is a sheet in which the heat conductive sheets 2401 shown in FIG. 57 and FIG. 58 are folded and overlapped so that the enclosing portion 2594 overlaps between the upper and lower second flat portions 2420. Such an arrangement is particularly effective when the gap between the electronic components 50 and 54 and the top plate 1340A of the housing 1340 is large.
  • the enclosing portions 2594 arranged between the upper and lower second flat portions 2420 overlap in an orderly manner as shown in FIG. 64. However, even if they can be substantially thermally coupled in the up-down direction, they do not need to be in orderly overlapping. Good.
  • FIG. 65 is a plan view of a heat conductive sheet 2601 according to a third modification of the heat conductive sheet 2401 shown in FIG.
  • FIG. 65 shows the main surface of the heat conductive sheet 2601 on the circuit board side.
  • 66 is a cross-sectional view taken along the line CC shown in FIG.
  • the heat conductive sheet 2601 is a sheet in which lattice-like graphite layers G1 and G2 are formed on the main surface on the circuit board side in the second flat portion 2420 of the heat conductive sheet 2401 shown in FIG. Note that a graphene layer may be formed instead of the graphite layers G1 and G2.
  • the thermal conductivity is improved by the graphite layers G1 and G2, and heat conduction to other electronic components that are vulnerable to heat can be suppressed (thermal block).
  • the heat conductive sheet 2601 since a comparatively expensive graphite material is used only in a specific part, the manufacturing cost of the heat conductive sheet 2601 can be reduced. Further, it is possible to form a three-dimensional heat conduction sheet that is difficult with only graphite alone.
  • the graphite layers formed by the first to third manufacturing methods described above may be attached to the heat conductive sheet 2601, or the graphite layers formed by the first to third manufacturing methods.
  • the layer may be attached to an adhesive sheet, an adhesive roll or the like and peeled off (tape peeling method) so that a further thinned graphite layer may be attached to the heat conductive sheet 2601 or transferred. Peeling from the graphite layer can be repeated from the same graphite layer, so that the manufacturing cost can be reduced. Further, if the graphite layers G1 and G2 are formed simultaneously with the thermal fusion of the second flat portion 2420, the productivity is further improved.
  • the encapsulating portion 2490 may be formed after the graphite layers G1 and G2 are formed on the heat conductive sheet 2601 first.
  • An insulating layer (protective layer) such as a resin layer may be formed on the surfaces of the graphite layers G1 and G2 as necessary.
  • FIG. 67 is a plan view of a heat conductive sheet 2701 according to a fourth modification of the heat conductive sheet 2401 shown in FIG.
  • FIG. 67 shows the main surface of the heat conductive sheet 2701 on the circuit board side.
  • the cross-sectional view taken along the line CC in FIG. 67 is the same as the cross-sectional view shown in FIG.
  • the heat conductive sheet 2701 is a sheet in which a striped graphite layer G1 is formed on the main surface on the circuit board side in the second flat portion 2420 of the heat conductive sheet 2401 shown in FIG.
  • the heat conductive sheet 2701 becomes an anisotropic heat conductive sheet due to the high thermal conductivity of the graphite layer G1 formed in a stripe shape.
  • thermal conductivity is improved by the graphite layer G1, and heat conduction to other electronic components that are weak against heat can be suppressed (thermal block).
  • thermal conductivity is improved by the graphite layer G1
  • heat conduction to other electronic components that are weak against heat can be suppressed (thermal block).
  • thermal block since a comparatively expensive graphite material is used only at a specific location, the manufacturing cost of the heat conductive sheet 2701 can be reduced. Further, it is possible to form a three-dimensional heat conduction sheet that is difficult with only graphite alone.
  • the graphite layer G1 may be obtained by transferring graphite thinly formed by a tape peeling method or the like to the heat conductive sheet 2701, or attaching tape-like graphite to the heat conductive sheet 2701.
  • An insulating layer (protective layer) such as a resin layer may be formed on the surface of the graphite layer G1 as necessary.
  • the graphite layer G1 may not be a stripe shape but may be a zigzag shape, for example.
  • the graphite layer G1 may be unevenly distributed or scattered in the heat conductive sheet 2701.
  • FIG. 68 is a plan view of a heat conductive sheet 2801 according to a fifth modification of the heat conductive sheet 2401 shown in FIG.
  • FIG. 68 shows the main surface of the heat conductive sheet 2801 on the circuit board side.
  • 69 is a cross-sectional view taken along line DD shown in FIG.
  • the heat conductive sheet 2801 is a sheet in which a graphite layer G3 is formed on the main surface on the circuit board side in the enclosing portion 2490 of the heat conductive sheet 2401 shown in FIG.
  • the heat dissipation of the enclosing portion 2490 is improved. Moreover, according to the heat conductive sheet 2701, since the comparatively expensive graphite is used only for a specific part, the manufacturing cost of the heat conductive sheet 2801 can be reduced.
  • the graphite layer G3 may be obtained by transferring graphite thinly formed by a tape peeling method or the like to the heat conductive sheet 2401 or attaching tape-like graphite to the heat conductive sheet 2401.
  • An insulating layer (protective layer) such as a resin layer may be formed on the surface of the graphite layer G3 as necessary. Further, the graphite layer G3 may be unevenly distributed or scattered in the heat conductive sheet 2801.
  • FIG. 70 is a plan view of a heat conductive sheet 2901 according to a sixth modification of the heat conductive sheet 2401 shown in FIG.
  • FIG. 70 shows the main surface of the heat conductive sheet 2901 on the circuit board side.
  • 71 is a cross-sectional view taken along line EE shown in FIG.
  • the heat conductive sheet 2901 is a sheet in which a graphite layer G4 is formed over the entire main surface on the circuit board side in the heat conductive sheet 2401 shown in FIG.
  • the heat conductivity is improved by the graphite layer G4, and it is possible to form a heat conductive sheet having a three-dimensional shape, which is difficult with only graphite.
  • the graphite thinly formed by the tape peeling method etc. may be transcribe
  • FIG. 72 is a plan view of a heat conductive sheet 3001 according to a seventh modification of the heat conductive sheet 2401 shown in FIG.
  • FIG. 73A is a cross-sectional view taken along the line FF shown in FIG.
  • FIG. 73B is a cross-sectional view taken along the line GG shown in FIG.
  • the difference between the heat conductive sheet 3001 and the heat conductive sheet 2401 is that the second flat portion 3021 forms a periodic structure.
  • the structure of the heat conductive sheet 3001 is the same as the structure of the heat conductive sheet 2401.
  • the heat conductive sheet 3001 includes an enclosing portion 3090 including a first flat surface portion 3010, a second flat surface portion 3020 surrounding the enclosing portion 3090 and surrounding the enclosing portion 3090, and a plurality of second flat surface portions 3021 ( In this modified example, there are 4 ⁇ 4 second plane portions 3021). As shown in FIG. 72, the heat conductive sheet 3001 has a periodic structure in which a plurality of second flat portions 3021 are periodically arranged in a matrix.
  • Each second plane portion 3021 has a rectangular shape in plan view. All of the second plane portions 3021 have the same shape and the same size.
  • the cross-sectional shape of the enclosure part 3090 has a circular shape or an elliptical shape. Since the enclosing portion 3090 has a circular shape or an oval shape, it is easy to press the heat generating component on the circuit board.
  • the enclosing portion 3090 is formed so as to protrude from the second plane portions 3020 and 3021 on both sides of the circuit board side and the opposite side of the circuit board.
  • the enclosure 3090 forms a sealed space 3075 inside.
  • the enclosure 3090 encloses a gas such as air or nitrogen in the sealed space 3075.
  • the gas is encapsulated in the step of heat-sealing the second flat surface portion 3020 on the outer periphery from the encapsulating portion 3090.
  • the enclosure 3090 has elasticity on both the circuit board side and the opposite side of the circuit board.
  • the enclosing portion 3090 communicates in a lattice shape, the gas can freely flow in the sealed space 3075. Therefore, even when the heights are different as in the electronic parts 50 and 54, the electronic parts 50 and 54 can be easily adjusted to the respective heights, so that the adhesion is further improved and the heat dissipation is improved.
  • the heat conductive sheet 3001 is easy to process because the encapsulating portion 3090 is formed by thermal fusion, and the size of the encapsulating portion 3090 can be freely changed.
  • the heat conductive sheet 3001 for example, several types of heat conductive sheets 3001 having different periodic structures may be prepared, and a heat conductive sheet suitable for the arrangement of heat generating components on each circuit board may be selected from several types of heat conductive sheets. That is, it is not necessary to provide a die for drawing processing in accordance with the arrangement of the heat generating components on the circuit board. Therefore, according to the heat conductive sheet 3001, versatility can be improved and the manufacturing cost can be reduced.
  • FIG. 75 is a cross-sectional view taken along the line HH shown at 72.
  • the difference between the heat conductive sheet 3101 and the heat conductive sheet 2401 is that a periodic structure is formed by the second flat portions 3021 and 3121.
  • the structure of the heat conductive sheet 3101 is the same as the structure of the heat conductive sheet 2401.
  • the heat conductive sheet 3101 includes an enclosing portion 3190 including the first flat surface portion 3010, a second flat surface portion 3020 surrounding the enclosing portion 3190 and surrounding the enclosing portion 3190, and a plurality of second flat surface portions 3021 ( In this modification, it has 4 ⁇ 2 second plane parts 3021) and a plurality of second plane parts 3121 (4 ⁇ 2 second plane parts 3121 in this modification).
  • the heat conductive sheet 3101 has a periodic structure in which a plurality of second flat portions 3021 and 3121 are periodically arranged in a matrix.
  • Each second plane portion 3021 has a rectangular shape in plan view. All of the second plane portions 3021 have the same shape and the same size. Similarly, each second plane portion 3121 has a rectangular shape in plan view. All of the second plane portions 3121 have the same shape and the same size. The size of each second plane part 3021 is larger than the size of each second plane part 3121.
  • the cross-sectional shape of the enclosing portion 3190 has a circular shape or an elliptical shape. Since the enclosing portion 3190 has a circular shape or an oval shape, the heat generating component on the circuit board is easily pressed.
  • the enclosing portion 3190 is formed so as to protrude from the second plane portions 3020, 3021, 3121 on both sides of the circuit board side and the opposite side of the circuit board.
  • the enclosing portion 3190 forms a sealed space 3175 inside.
  • the enclosure 3190 encloses a gas such as air or nitrogen in the sealed space 3175.
  • the gas is encapsulated in the step of heat-sealing the second flat surface portion 3020 on the outer periphery from the encapsulating portion 3190.
  • the enclosing portion 3190 has elasticity on both the circuit board side and the opposite side of the circuit board.
  • the heat conductive sheet 3101 has the same effect as the heat conductive sheet 3001.
  • the size and shape of each of the second plane portions 3021 and 3121 can be made different.
  • the second plane portions 3021 and 3121 may be alternately arranged, or the second plane portions 3021 and 3121 may be scattered in the heat conductive sheet 3101. Accordingly, the heat conductive sheet 3101 can be joined to the heat generating component in accordance with the size and shape of the heat generating component.
  • FIG. 76 is a plan view of a heat conductive sheet 3201 according to a ninth modification of the heat conductive sheet 2401 shown in FIGS. 57 and 58. 77 is a cross-sectional view taken along the line II of FIG.
  • the enclosing portion 3290 encloses the protruding portion 3266.
  • the protrusion 3266 corresponds to the “buffer material” of the present invention.
  • the heat conductive sheet 3201 includes 3 ⁇ 4 enclosing portions 3290 and a second flat portion 3220 surrounding each enclosing portion 3290.
  • Each enclosure part 3290 contains the 1st plane part 3210, and has enclosed the cylindrical projection part 3266 which has enclosed air.
  • the heat conductive sheet 3201 has a structure in which a heat conductive sheet 3298, a bubble cushioning sheet 3260 including a plurality of protrusions 3266, and a heat conductive sheet 3299 are stacked.
  • the heat conductive sheet 3201 has a periodic structure in which a plurality of enclosing portions 3290 are periodically arranged in a matrix.
  • the plurality of enclosure portions 3290 are formed by heat-sealing (heat-sealing) the second flat surface portion 3220.
  • the plurality of enclosure portions 3290 are formed so as to protrude from the second plane portion 3220 on the circuit board side.
  • Each enclosing portion 3290 has a rectangular shape in plan view. All the enclosing portions 3290 have the same shape and the same size.
  • Each enclosing portion 3290 has a semi-elliptical cross-sectional shape. Since each enclosing portion 3290 has a semi-elliptical shape, it is easy to press the heat generating component on the circuit board.
  • each enclosing portion 3290 is matched to the size of the main heat generating component.
  • the width X of the second planar portion 3220 between the encapsulating portions 3290 is preferably smaller in consideration of securing the contact area with the heat-generating component, but the heat dissipation from the first planar portion 3210 to the second planar portion 3220. The larger one is preferable.
  • at least one protrusion 3266 is enclosed in the enclosure 3290.
  • the plurality of protrusions 3266 are preferably arranged at the center of the heat conductive sheet 3201.
  • each enclosing portion 3290 encloses a projection 3266 enclosing air as shown in FIG. Therefore, the elasticity of the encapsulating portion 3290 of the heat conductive sheet 3201 is improved by the protrusion 3266 compared to the elasticity of the encapsulating portion 2490 of the heat conductive sheet 2401 in which only gas (air, nitrogen, etc.) is encapsulated. Moreover, the heat conductive sheet 3201 can adjust the thickness of the enclosure part 3290 easily with the height of the projection part 3266. FIG.
  • the thermal conductivity in the thickness direction of the heat conductive sheet 3201 enclosing the protruding portion 3266 is slightly larger than the thermal conductivity in the thickness direction of the heat conductive sheet 2401 enclosing only the gas, but the surface temperature of the housing is It does not affect the local rise (heat spot).
  • FIG. 78 is a plan view of the heat conductive sheets 3298 and 3299.
  • FIG. FIG. 79 is a plan view of the bubble cushioning sheet 3260.
  • FIG. 80 is a plan view of a bubble cushioning sheet 3261 which is a modification of the bubble cushioning sheet 3260 shown in FIG. 81, 82, 83, and 84 are plan views showing a method of manufacturing the heat conductive sheet 3201 shown in FIG.
  • FIG. 85A is a cross-sectional view taken along the line JJ shown in FIG.
  • FIG. 85B is a cross-sectional view taken along the line KK in FIG.
  • FIG. 86 is a plan view showing a method for manufacturing the heat conductive sheet 3201 shown in FIG. 76.
  • each of the heat conductive sheets 3298 and 3299 includes a first insulating layer 141, a metal layer 140, and a second insulating layer 142, and has a structure in which these are sequentially laminated. is doing.
  • Each of the heat conductive sheets 3298 and 3299 is a flat laminate sheet similarly to the heat conductive sheet 99 shown in FIG.
  • the bubble cushioning sheet 3260 has a periodic structure in which a plurality of protrusions 3266 are periodically arranged in a staggered manner. Each protrusion 3266 encloses air.
  • the diameter R5 of the protrusion 3266 is appropriately selected so that at least one protrusion 3266 is enclosed in the enclosure 3290.
  • the diameter R5 of the protrusion 3266 is, for example, in the range of 3 mm to 30 mm, for example, 5 mm to 15 mm.
  • the height Z5 of the protrusion 3266 is appropriately selected according to the desired thickness of the enclosing part 3290.
  • the height Z5 of the protrusion 3266 is, for example, in the range of 1 mm to 10 mm, for example, 2 mm to 3 mm.
  • bubble buffer sheet 3260 is used in the manufacturing method of this embodiment, it is not restricted to this.
  • a bubble cushioning sheet 3261 having a periodic structure in which a plurality of protrusions 3266 are periodically arranged in a lattice shape may be used.
  • the heat conductive sheets 3298 and 3299 and the bubble buffer sheet 3260 are made of the same material, for example, in the case of polypropylene, the heat conductive sheets 3298 and 3299 and the bubble buffer sheet 3260 are formed in the second plane portion 3220 They are heat fused together.
  • the insulating layers 141 and 142 of the heat conductive sheets 3298 and 3299 are different from the foam cushioning sheet 3260, for example, when the insulating layers 141 and 142 of the heat conductive sheets 3298 and 3299 are polypropylene and the foam cushioning sheet 3260 is polyethylene, polyethylene is generally used.
  • the melting point of polypropylene is higher than the melting point of. Therefore, the heat conductive sheets 3298 and 3299 and the bubble cushioning sheet 3260 are thermally fused to each other in the second flat portion 3220 by matching the temperatures of the heaters H1 and H2 with polypropylene.
  • the insulating layers 141 and 142 of the heat conductive sheets 3298 and 3299 are directly heat-sealed by the bubble buffer sheet 3260 being melted and interrupted first.
  • the bubble buffer sheet 3260 in the enclosing portion 3290 can be melted at the time of heat sealing.
  • the height of the enclosing portion 3290 is adjusted by the protrusion 3266 of the bubble cushioning sheet 3260 when superposed, and the bubble cushioning sheet 3260 of the encapsulating portion 3290 is substantially eliminated after heat sealing.
  • the sealed space is only gas. The same applies to the case where a foam sheet 3460 described later is used.
  • heat sealing is performed with heaters H1 and H2 from the longitudinal direction of the two heat conductive sheets 3298 and 3299, and the enclosing portion 3290 is closed.
  • a heat conductive sheet 3201 having a plurality of enclosing portions 3290 enclosing a plurality of protrusions 3266 and a second flat portion 3220 is obtained.
  • the heat conductive sheet 3201 can be manufactured at a low manufacturing cost.
  • heat fusion is performed with the heaters H1 and H2 in the vertical direction, but this is not a limitation.
  • heat fusion heat sealing
  • the central portion located inside the peripheral portions may be heat-sealed by the heater H2.
  • the reverse order may be used.
  • the heat conductive sheet 3201 in which the plurality of enclosing portions 3290 that enclose the plurality of protrusions 3266 is formed is manufactured, but the present invention is not limited to this.
  • a heat conductive sheet 3301 in which one enclosing portion 3390 enclosing one projecting portion 3266 is formed may be manufactured by a similar manufacturing method.
  • the heat conductive sheet 3301 has an enclosing portion 3390 including a first flat portion 3310 and a second flat portion 3320.
  • FIG. 88 is a cross-sectional view of a heat conductive sheet 3401 according to a modification of the heat conductive sheet 3201 shown in FIGS. 76 and 77.
  • FIG. 89 is a plan view of the foam sheet 3460.
  • 90 is a cross-sectional view showing a method of manufacturing the heat conductive sheet 3401 shown in FIG.
  • the heat conductive sheet 3401 has a structure in which a heat conductive sheet 3298, a foam sheet 3460, and a heat conductive sheet 3299 are laminated.
  • the plurality of enclosing portions 3490 are formed so as to protrude from the second plane portion 3220 on both sides of the circuit board side and the opposite side of the circuit board.
  • Each enclosing portion 3490 has an elliptical cross section.
  • the foam sheet 3460 corresponds to the “buffer material” of the present invention.
  • the manufacturing method of the heat conductive sheet 3401 is different from the manufacturing method of the heat conductive sheet 3201 in that a foam sheet 3460 is used instead of the bubble buffer sheet 3260 as shown in FIG.
  • the two heat conductive sheets 3298 and 3299 are overlapped with the foam sheet 3460 interposed therebetween.
  • each enclosing portion 3490 encloses a foam sheet 3460 containing air as shown in FIG. Therefore, the elasticity of the encapsulating portion 3490 of the heat conductive sheet 3401 is improved by the foam sheet 3460 compared to the elasticity of the encapsulating portion 2490 of the heat conductive sheet 2401 enclosing only gas (air, nitrogen, etc.). . Further, the heat conductive sheet 3401 can easily adjust the thickness of the enclosing portion 3490 by the temperature and time of heat fusion with the two heat conductive sheets 3298 and 3299 and the foamed sheet 3460.
  • the heat conductive sheet 3401 also has the same effect as the heat conductive sheet 3201.
  • the foam sheet can be formed thinner than the bubble buffer sheet. Therefore, the heat conductive sheet 3401 is suitable for manufacturing a thin heat conductive sheet.
  • the heat conductive sheet 3401 can be manufactured at a low manufacturing cost.
  • the heat conductive sheet used by each said embodiment is flexible and has a freedom degree of shape, it can be easily combined with a heat pipe, a heat sink, a cooling fan, a heat storage material, or the like.
  • the heat conductive sheet in each embodiment is demonstrated in the form accommodated in the inside of a housing (housing body), the form in which the heat conductive sheet of each embodiment is arrange
  • the heat conductive sheet 1201 shown in FIGS. 39 and 40 is placed between the bottom of a notebook personal computer (heating component) NP and a desk T on which the notebook personal computer is placed. It is also possible to lay it.
  • the surface of the first flat surface portion 1210 of the heat conductive sheet 1201 on the notebook personal computer NP side is joined to the notebook personal computer NP.
  • the heat conductive sheet in each embodiment can be laid between a cell (heat-generating component) and a cell (heat-generating component) in an assembled battery such as a lithium ion secondary battery, and joined to the cell. It is also possible to lay it on the back side of the solar panel (heat generating component) and join it to a back sheet or a metal frame.
  • Metal mesh member 630 ... Connection portion 710 ... First plane portion 730 ... Connection portion 811 ... First plane portion 845 ... Fusion layer 95 ... Electronic device 900 ... Electronic device 940 ...
  • Housing 940A Top plate 1000, 1001, 1002, 1003, 1004, 1100, 1101 ... Electronic device 1201 ... Heat conductive sheet 1210 ... First plane portion 1220 ... Second plane portion 1261 ... Double-sided adhesive tape 1310, 1311, 1312 ... First plane portion 1340 ... Case 1340A ... Top plate 1401 ... Thermal conductive sheet 1420 ... Second plane 1501 ... Thermal conductive sheet 1510 ... First Surface portion 1520 ... second plane portion 1601 ... heat conduction sheet 1610 ... first plane portion 1620 ... second plane portion 1701 ... heat conduction sheet 1720 ... second plane portion 1801 ... heat conduction sheet 1810 ... first plane portion 1901 ... heat conduction Sheet 1910 ... first plane portion 1920 ...
  • second plane portion 1970 ... embossed portion 2001 ... heat conduction sheet 2010 ... first plane portion 2014A, 2014B ... first plane portion 2015A, 2015B ... first plane portion 2020 ... second plane portion 2024 ... 2nd plane part 2025 ... 2nd plane part 2041 ... Thermal conduction sheet 2051 ... Thermal conduction sheet 2075 ... Sealed space 2080 ... 3rd plane part 2084 ... 3rd plane part 2085 ... 3rd plane part 2090 ... Enclosing part 2094 ... Encapsulating part 2095 ... Encapsulating part 2101 ... Thermal conductive sheet 2175 ... Sealed space 2190 ... Encapsulating parts 2210 and 2211 2212 ... 1st plane part 2275 to 2278 ...

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  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Carbon And Carbon Compounds (AREA)

Abstract

La présente invention porte sur un appareil électronique (100) qui comporte un boîtier (40), une carte à circuits (P), et une feuille conductrice de chaleur (101). La carte à circuits (P) est fixée à l'intérieur du boîtier (40). Sur la carte à circuits (P), des composants électroniques (50, 51, 52, 53) sont montés, et des boîtiers métalliques (61, 62) sont fixés. La feuille conductrice de chaleur (101) a des premières parties de surface plate (110, 111, 112), une seconde partie de surface plate (120), et des parties de connexion (130, 131, 132). La feuille conductrice de chaleur (101) est déformée de telle sorte que les premières parties de surface plate (110, 111, 112) font saillie plus loin vers le côté de la carte à circuits (P) que la seconde partie de surface plate (120). Les surfaces des premières parties de surface plate (110, 111, 112) sur le côté de la carte à circuits (P) sont collées au composant électronique (51) et aux boîtiers métalliques (61, 62). De plus, la surface de la seconde partie de surface plate (120) sur le côté inverse de la carte à circuits (P) est collée à la surface intérieure du boîtier (40).
PCT/JP2013/068207 2012-07-30 2013-07-03 Appareil électronique et feuille conductrice de chaleur WO2014021046A1 (fr)

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