WO2013024544A1 - Rouleau de matériau adhésif - Google Patents

Rouleau de matériau adhésif Download PDF

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Publication number
WO2013024544A1
WO2013024544A1 PCT/JP2011/068700 JP2011068700W WO2013024544A1 WO 2013024544 A1 WO2013024544 A1 WO 2013024544A1 JP 2011068700 W JP2011068700 W JP 2011068700W WO 2013024544 A1 WO2013024544 A1 WO 2013024544A1
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WO
WIPO (PCT)
Prior art keywords
adhesive
tape
adhesive layer
reel
anisotropic conductive
Prior art date
Application number
PCT/JP2011/068700
Other languages
English (en)
Japanese (ja)
Inventor
立澤　貴
藤縄　貢
松田　和也
恭久 石田
柳川　俊之
忠恭 藤枝
Original Assignee
日立化成工業株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日立化成工業株式会社 filed Critical 日立化成工業株式会社
Priority to PCT/JP2011/068700 priority Critical patent/WO2013024544A1/fr
Priority to PCT/JP2012/070757 priority patent/WO2013024873A1/fr
Priority to CN201210291451.6A priority patent/CN102951498B/zh
Priority to KR1020147006339A priority patent/KR101940355B1/ko
Priority to CN2012204058050U priority patent/CN203021117U/zh
Priority to CN2012204055315U priority patent/CN203020727U/zh
Priority to JP2013529027A priority patent/JP6036694B2/ja
Priority to TW101129778A priority patent/TWI580628B/zh
Publication of WO2013024544A1 publication Critical patent/WO2013024544A1/fr

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/04—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation using electrically conductive adhesives
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H75/00—Storing webs, tapes, or filamentary material, e.g. on reels
    • B65H75/02—Cores, formers, supports, or holders for coiled, wound, or folded material, e.g. reels, spindles, bobbins, cop tubes, cans, mandrels or chucks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H75/00—Storing webs, tapes, or filamentary material, e.g. on reels
    • B65H75/02—Cores, formers, supports, or holders for coiled, wound, or folded material, e.g. reels, spindles, bobbins, cop tubes, cans, mandrels or chucks
    • B65H75/04—Kinds or types
    • B65H75/08—Kinds or types of circular or polygonal cross-section
    • B65H75/14—Kinds or types of circular or polygonal cross-section with two end flanges
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H75/00—Storing webs, tapes, or filamentary material, e.g. on reels
    • B65H75/02—Cores, formers, supports, or holders for coiled, wound, or folded material, e.g. reels, spindles, bobbins, cop tubes, cans, mandrels or chucks
    • B65H75/34—Cores, formers, supports, or holders for coiled, wound, or folded material, e.g. reels, spindles, bobbins, cop tubes, cans, mandrels or chucks specially adapted or mounted for storing and repeatedly paying-out and re-storing lengths of material provided for particular purposes, e.g. anchored hoses, power cables
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
    • H01B5/16—Non-insulated conductors or conductive bodies characterised by their form comprising conductive material in insulating or poorly conductive material, e.g. conductive rubber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R11/00—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts
    • H01R11/01—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts characterised by the form or arrangement of the conductive interconnection between the connecting locations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H2701/00—Handled material; Storage means
    • B65H2701/30—Handled filamentary material
    • B65H2701/37—Tapes
    • B65H2701/377—Adhesive tape
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature

Definitions

  • the present invention relates to an adhesive reel, and more particularly, to an adhesive reel in which an adhesive tape having a tape-like base material and an adhesive layer provided on one surface thereof is wound around a winding core.
  • An anisotropic conductive film (ACF: Anisotropic Conductive Film) is used as a connection material for electrically connecting circuit members having a large number of electrodes to manufacture a circuit connection body.
  • Anisotropic conductive film keeps the conductive state between opposing electrodes when connecting a semiconductor element such as an IC or LSI or a member such as a package to a substrate such as a printed wiring board, LCD glass substrate or flexible printed circuit board. It is a connection material that performs electrical connection and mechanical fixation so as to maintain insulation between electrodes.
  • connection materials such as non-conductive films (NCF) are known.
  • the connecting material includes an adhesive component containing a thermosetting resin and the like, and conductive particles blended as necessary in the case of an anisotropic conductive film, and a substrate such as a polyethylene terephthalate film (PET film). Formed on top as a film.
  • the raw film of the obtained film is cut into a tape shape so as to have a width suitable for the application, and this is wound around a core to produce an adhesive reel (see Patent Document 1).
  • Blocking is a phenomenon in which the adhesive layer is transferred to the back surface of the substrate when the wound adhesive tape is pulled out and used. Since the adhesive layer provided on one surface of the substrate is in an uncured state, it has a certain degree of fluidity. If the adhesive reel is left for a long time, the adhesive may ooze out from the end face of the adhesive tape, and this may stick to the side plate of the reel. When the adhesive tape is pulled out from the reel in this state, there is a problem that a part of the adhesive layer is transferred to the back surface of the base material, or a problem that the adhesive layer is peeled off from the base material and only the base material is pulled out. There is a case.
  • Patent Documents 2 and 3 describe a technique for suppressing blocking from the viewpoint of the shape of the adhesive tape, and an adhesive having a width narrower than the width of the base material on the inner side in the width direction of the base material on the end surface on the tape side.
  • An adhesive tape provided with a layer is disclosed.
  • Patent Document 4 describes a technique for suppressing blocking from the viewpoint of the composition of the adhesive, and discloses an adhesive tape having a temporary fixing force with respect to a substrate within a predetermined range.
  • Patent Document 5 describes a technique for suppressing blocking from the viewpoint of use conditions, and discloses a sticking device having means for controlling the temperature of a reel.
  • Patent Document 6 describes a technique for suppressing blocking from the viewpoint of the structure of a reel part around which an adhesive tape is wound, and discloses an adhesive reel in which a rib structure provided on a side plate has conductivity.
  • Patent Document 7 describes a technique for suppressing blocking from the viewpoint of the configuration of a base material, and discloses a wound body using a material having a superior difference in surface tension between the front and back surfaces as a base material.
  • Patent Document 8 describes a technique for suppressing blocking from the viewpoint of compatibility between an end mark and an adhesive.
  • JP 2003-34468 A International Publication No. 08/053824 International Publication No. 07/015372 Japanese Patent Application Laid-Open No. 2003-064322 JP 2006-218867 A JP 2009-004354 A Japanese Patent Laid-Open No. 11-293206 JP 2001-284005 A
  • the present invention provides an adhesive reel capable of suppressing a problem that the adhesive layer is peeled off from the base material and only the base material is pulled out when pulling out the wound adhesive tape at a sufficiently high level.
  • blocking indicates “a problem that when the wound adhesive tape is pulled out, the adhesive layer is peeled off from the base material and only the base material is pulled out”.
  • An adhesive reel according to the present invention is wound around a winding core, a pair of side plates provided on both sides of the winding core so as to face each other, and a tape-like base material and one surface thereof.
  • An adhesive tape having an adhesive layer provided, and a region to be used and a region to be used as a scraping portion of the entire length of the adhesive tape are separated at a position of 5 m or more from the terminal portion of the adhesive tape An end mark is provided.
  • the length of the adhesive tape that can be wound around the core has been limited, but by adopting the above configuration, the adhesive tape is longer than the conventional product (for example, 200 m or more) is possible.
  • the adhesive layer preferably has a shear viscosity at 30 ° C. of 100000 Pa ⁇ s or less.
  • the low-viscosity adhesive include a thermal radical curable adhesive and a low-temperature curable adhesive.
  • a low-temperature curable adhesive is required to have high fluidity at a low temperature (for example, 130 to 150 ° C.).
  • a thermal radical curable adhesive containing a radical polymerization initiator having a 1 minute half-life temperature of 160 ° C. or less can be mentioned.
  • the thermal radical curable adhesive contains a thermoplastic resin, a radical polymerizable material containing a radical polymerizable substance that is liquid at 30 ° C., and a radical polymerization initiator, blocking with a conventional adhesive reel is possible. It is likely to occur with high probability.
  • the content of the radical polymerizable substance in the thermal radical curable adhesive is 20 to 80 masses with respect to 100 mass parts of the total amount of the thermoplastic resin and the radical polymerizable material. Even if it is a part, blocking can fully be suppressed.
  • the adhesive layer may be an epoxy adhesive containing a thermoplastic resin, a thermosetting material containing an epoxy resin that is liquid at 30 ° C., and a curing agent.
  • the content of the epoxy resin in the epoxy adhesive is the total amount of the thermoplastic resin and the thermosetting material. Even if it is 20 to 80 parts by mass with respect to 100 parts by mass, blocking can be sufficiently suppressed.
  • the inorganic filler content of the adhesive layer may be 20% by volume or less based on the volume of the adhesive layer.
  • the inorganic filler content of the adhesive layer may be 50% by mass or less based on the mass of the adhesive layer. According to the present invention, blocking can be sufficiently suppressed even when an inorganic filler is not blended in the adhesive layer or even when the blending amount is 50% by mass or less.
  • silica is used as the inorganic filler
  • the content is preferably 35% by mass or less based on the mass of the adhesive layer.
  • alumina is used as the inorganic filler, the content is preferably 50% by mass or less based on the mass of the adhesive layer.
  • blocking can be sufficiently suppressed even when the width of the adhesive tape is 0.5 to 3.0 mm.
  • a narrow tape has a relatively large influence of the bleeding of the adhesive on the end face of the tape as compared with a thick tape, and is likely to be blocked.
  • the adhesive tape is suitable for use in circuit connection. As described above, since blocking can be suppressed at a high level, it is possible to manufacture a circuit connection body having excellent connection reliability.
  • the present invention provides a blocking suppression method.
  • the blocking inhibiting method according to the present invention uses the area closer to the end part than the end mark as the unwinding part when the adhesive tape is unwound from the adhesive reel.
  • the present invention provides a method for producing the adhesive reel. That is, the method for manufacturing an adhesive reel according to the present invention includes a step of arranging an end mark at a position determined based on the characteristics of the adhesive tape. Examples of the characteristics of the adhesive tape include the length and width of the adhesive tape, the thickness, composition, and shear viscosity of the adhesive layer 8. Furthermore, the present invention provides a method for arranging end marks at positions determined based on the characteristics of the adhesive tape in the process of manufacturing the adhesive reel.
  • the peeling of the adhesive layer from the base material can be suppressed at a sufficiently high level.
  • FIG. 1 It is a perspective view which shows one Embodiment of the adhesive material reel which concerns on this invention.
  • It is a schematic cross section which shows the structure of the adhesive material reel shown in FIG.
  • It is a front view which shows the inner surface of the side plate of the adhesive material reel shown in FIG.
  • It is a schematic cross section which shows an example of an anisotropic conductive tape.
  • It is a schematic cross section which shows the end mark arrangement
  • It is a schematic cross section which shows an example of the manufacturing method of a circuit connection body.
  • It is a perspective view which shows other embodiment of the adhesive material reel which concerns on this invention.
  • FIG. 1 It is a schematic cross section which shows the structure of the adhesive material reel of FIG. It is a schematic cross section which shows the end mark arrangement
  • an anisotropic conductive tape (adhesive tape) 5 is wound on the outer surface F1 of the core 1 to form a wound body.
  • the anisotropic conductive tape 5 is wound around the core 1 so that the adhesive layer 8 faces the core 1 and the surface of the base 6 on which the adhesive layer is not formed faces the outside. In the state of the wound body, the surface of the adhesive layer 8 is in direct contact with the base material 6 of the anisotropic conductive tape 5 on the inner side of the winding.
  • the side plates 2 are preferably provided at both ends of the core 1 in the axial direction because a plurality of adhesive reels can be easily arranged and stored. However, a part of the core 1 penetrates the side plate 2 and is formed from the outer surface of the side plate 2.
  • the side plate 2 may be provided so as to protrude.
  • the side plate 2 includes a rib structure portion 2 b that protrudes from the surface F ⁇ b> 2 and extends radially from the edge of the through hole 2 a on the inner side surface F ⁇ b> 2 adjacent to the anisotropic conductive tape 5.
  • the rib structure portion 2b By providing the rib structure portion 2b, even if the adhesive oozes out from the end surface of the anisotropic conductive tape 5, the area where the adhesive is adhered to the side plate 2 can be made sufficiently small. In addition, blocking can be effectively suppressed.
  • the side plate 2 has been illustrated with the side plate 2 having the rib structure portion 2b from the viewpoint of further suppressing blocking, but the side plate 2 having no rib structure portion 2b may be employed.
  • the adhesive reel 10 has a shaft hole 10 a into which the rotation shaft 25 a of the crimping device 25 is inserted, and the shaft hole 10 a has a convex portion provided on the rotation shaft. And a notch 10b to be fitted.
  • a configuration other than the notch portion 10b may be adopted as long as it can prevent idling when the adhesive reel 10 is mounted on the rotating shaft of the crimping apparatus.
  • a plastic molded product or the like can be used as a reel component including the core 1 and the side plate 2.
  • the anisotropic conductive tape 5 includes a tape-like base material 6 and an adhesive layer 8 formed on one surface of the base material 6.
  • the anisotropic conductive tape 5 has an end mark EM that divides the region 5a to be used and the region to be the unwinding part 5b out of its entire length.
  • the end mark EM is provided at a position where the distance from the end portion 5c of the anisotropic conductive tape 5 (length L1 in FIG. 5) is 5 m or more. This distance is preferably 5 to 20 m, more preferably 5 to 15 m, and still more preferably 5 to 10 m.
  • the length of the rewinding part 5b By setting the length of the rewinding part 5b to 5 m or more, it is possible to sufficiently prevent the occurrence of blocking when the adhesive reel 10 is used, and on the other hand, the length of the rewinding part 5b is set to 20 m or less. The amount of the adhesive layer 8 that is discarded without being discarded can be suppressed.
  • the position where the end mark EM is disposed is a characteristic of the anisotropic conductive tape 5 (for example, the length and width of the anisotropic conductive tape 5 and the thickness, composition and It is preferable to determine based on shear viscosity. That is, the method for manufacturing the adhesive reel 10 includes a step of placing the end mark EM at a position determined based on the characteristics of the anisotropic conductive tape 5.
  • the adhesive layer 8 from the base 6 is pulled out when the anisotropic conductive tape 5 is pulled out from the adhesive reel 10. Can be suppressed at a sufficiently high level.
  • the end mark EM is disposed on the adhesive layer 8 and has a color different from that of the adhesive layer 8.
  • the different colors mentioned here mean colors that are distinguished from each other from the three attributes of hue, saturation, and brightness, and further include metal colors and fluorescent colors.
  • the end mark EM is disposed between the core 1 and the adhesive layer 8 when the anisotropic conductive tape 5 is wound, and is attached in close contact with the adhesive layer 8. It has been.
  • the shape of the end mark EM is not particularly limited, but is usually rectangular.
  • the end mark EM may be made of a resin-based material, and specific examples of the constituent material include general acrylic resin and PET. Note that the end mark EM may be disposed on the substrate 6.
  • the end mark EM has a color different from that of the substrate 6.
  • the end mark may be in a mode in which the above resin is pasted, but a mode in which a part of the adhesive layer 8 or the substrate 6 is coated with a paint or ink such as paint, or a pattern or characters are applied. An aspect may be sufficient.
  • the anisotropic conductive tape 5 having the end mark EM is preferably used for assembling an automated electronic member.
  • the detector detects the end mark EM, and the remaining anisotropic conductive tape 5 (the unwinding portion 5b) is used. Notify that a new adhesive reel 10 should be replaced.
  • the length of the anisotropic conductive tape 5 is preferably 1 to 1000 m, more preferably 200 to 1000 m, still more preferably 200 to 500 m, still more preferably 250 to 500 m, and particularly preferably 300. ⁇ 500 m.
  • the length of the anisotropic conductive tape 5 that can be wound around the core 1 has been limited. By providing 5b, it is possible to wind the anisotropic conductive tape 5 longer than the conventional product around the core 1.
  • the width of the anisotropic conductive tape 5 is preferably 0.5 to 30 mm, more preferably 0.5 to 3.0 mm, still more preferably 0.5 to 2.0 mm, and particularly preferably 0. .5 to 1.0 mm.
  • the width of the anisotropic conductive tape 5 that can be wound around the core 1 has been limited.
  • the end portion 5c of the anisotropic conductive tape 5 has a predetermined length of the discarded portion 5b. It is possible to wind the anisotropic conductive tape 5 having a narrower width than the conventional product around the core 1.
  • variety of the base material 6 is the same as the width
  • FIG. What is necessary is just to adjust the width
  • the thickness of the adhesive layer 8 may be appropriately selected according to the adhesive component to be used and the type of the adherend, but is preferably 5 to 100 ⁇ m, more preferably 10 to 40 ⁇ m. Conventionally, since blocking is likely to occur, the thickness of the adhesive layer 8 of the anisotropic conductive tape 5 that can be wound around the core 1 has been limited. However, the anisotropic conductive tape 5 has a predetermined length on the end portion 5c side. By providing the winding portion 5b, it is possible to wind the anisotropic conductive tape 5 having the adhesive layer 8 thicker than the conventional product having a thickness of, for example, about 30 to 100 ⁇ m.
  • the thickness of the substrate 6 is preferably about 4 to 200 ⁇ m, more preferably 20 to 100 ⁇ m.
  • the substrate 6 is, for example, polyethylene terephthalate, polyethylene naphthalate, polyethylene isophthalate, polybutylene terephthalate, polyolefin, polyacetate, polycarbonate, polyphenylene sulfide, polyamide, ethylene / vinyl acetate copolymer, polyvinyl chloride, polyvinylidene chloride, Various plastic tapes made of synthetic rubber or liquid crystal polymer can be used. But the material which comprises the base material 6 is not limited to these. Moreover, since the base material 6 is peeled from the adhesive layer 8 at the time of use of the adhesive tape, a substrate having a release treatment applied to the contact surface with the adhesive layer 8 or the like may be used. Furthermore, what mixed 2 or more types chosen from said material, or the thing in which said film was multilayered may be used.
  • an epoxy adhesive or a radical curable adhesive can be used as the adhesive component 8a of the adhesive layer 8.
  • a thermoplastic adhesive such as polyurethane or polyvinyl ester can be used.
  • the use of a crosslinkable material is preferred because of excellent heat resistance and moisture resistance after connection.
  • an epoxy adhesive containing an epoxy resin as a main component as a thermosetting resin is preferable because it can be cured for a short time, has good connection workability, and has excellent molecular adhesion.
  • the radical curable adhesive has characteristics such as excellent curability at a low temperature and in a short time as compared with the epoxy adhesive, and can be appropriately selected depending on the application.
  • a pressure sensitive adhesive can also be used.
  • the epoxy adhesive contains, for example, a thermosetting material such as an epoxy resin and a curing agent. Moreover, it is common to mix
  • the epoxy resin examples include bisphenol A type epoxy resin, bisphenol F type epoxy resin, bisphenol S type epoxy resin, phenol novolac type epoxy resin, cresol novolac type epoxy resin, bisphenol A novolak type epoxy resin, bisphenol F novolak type epoxy.
  • examples thereof include resins, alicyclic epoxy resins, glycidyl ester type epoxy resins, glycidyl amine type epoxy resins, hydantoin type epoxy resins, isocyanurate type epoxy resins, and aliphatic chain epoxy resins. These epoxy resins may be halogenated or hydrogenated. Further, an acryloyl group or a methacryloyl group may be added to the side chain of the epoxy resin. These are used individually by 1 type or in combination of 2 or more types.
  • the curing agent is not particularly limited as long as it can cure the epoxy resin.
  • anionic polymerizable catalyst-type curing agent cationic polymerizable catalyst-type curing agent, polyaddition-type curing agent, etc. Is mentioned.
  • anionic or cationic polymerizable catalyst-type curing agents are preferred because they are excellent in rapid curability and do not require chemical equivalent considerations.
  • anionic or cationic polymerizable catalyst-type curing agent examples include imidazole, hydrazide, boron trifluoride-amine complexes, onium salts (aromatic sulfonium salts, aromatic diazonium salts, aliphatic sulfonium salts, etc.), Examples include amine imides, diaminomaleonitrile, melamine and derivatives thereof, polyamine salts, dicyandiamide, and the like, and modifications thereof.
  • Examples of the polyaddition type curing agent include polyamines, polymercaptans, polyphenols, and acid anhydrides.
  • Latent curing agents that are microencapsulated by coating these epoxy resin curing agents with polyurethane, polyester or other polymer materials, nickel, copper or other metal thin films, inorganic materials such as calcium silicate, etc. are acceptable. It is preferable because the working time can be extended.
  • curing agent is used individually by 1 type or in combination of 2 or more types.
  • the compounding amount of the curing agent is generally about 0.05 to 20 parts by mass with respect to 100 parts by mass of the total amount of the thermosetting material and the thermoplastic resin blended as necessary.
  • the radical curable adhesive contains, for example, a radical polymerizable material and a radical polymerization initiator. Moreover, it is common to mix
  • radical polymerizable material for example, any substance having a functional group that is polymerized by radicals can be used without particular limitation.
  • radical polymerizable substances such as acrylate (including corresponding methacrylate, the same shall apply hereinafter) compound, acryloxy (including corresponding methacryloxy, and the same shall apply hereinafter) compound, maleimide compound, citraconic imide resin, nadiimide resin and the like may be mentioned. It is done.
  • radically polymerizable substances may be used in the state of a monomer or an oligomer, and a monomer and an oligomer can be used in combination.
  • acrylate compound examples include methyl acrylate, ethyl acrylate, isopropyl acrylate, isobutyl acrylate, ethylene glycol diacrylate, diethylene glycol diacrylate, trimethylolpropane triacrylate, tetramethylolmethane tetraacrylate, 2-hydroxy-1,3-dia Acryloxypropane, 2,2-bis [4- (acryloxymethoxy) phenyl] propane, 2,2-bis [4- (acryloxypolyethoxy) phenyl] propane, dicyclopentenyl acrylate, tricyclodecanyl acrylate, Examples include tris (acryloyloxyethyl) isocyanurate, urethane acrylate and the like.
  • the radical polymerizable substance such as an acrylate compound has at least one substituent such as a dicyclopentenyl group, a tricyclodecanyl group, or a triazine ring.
  • a compound described in International Publication No. 2009/063827 can be preferably used. These are used individually by 1 type or in combination of 2 or more types.
  • radical polymerization initiator for example, any compound that can be decomposed by heating or light irradiation to generate free radicals can be used without particular limitation. Specific examples include peroxide compounds and azo compounds. Such a curing agent is appropriately selected depending on the intended connection temperature, connection time, pot life, and the like.
  • examples of the radical polymerization initiator include diacyl peroxide, peroxydicarbonate, peroxyester, peroxyketal, dialkyl peroxide, hydroperoxide, silyl peroxide, and the like.
  • peroxyesters, dialkyl peroxides, hydroperoxides, silyl peroxides, and the like are preferable, and peroxyesters that provide high reactivity are more preferable.
  • compounds described in International Publication No. 2009/063827 can be preferably used. These are used individually by 1 type or in combination of 2 or more types.
  • the amount of the radical polymerization initiator is generally about 0.1 to 10 parts by mass with respect to 100 parts by mass of the total amount of the radical polymerizable material and the thermoplastic resin compounded as necessary.
  • thermoplastic resins blended as necessary with epoxy adhesives and radical curable adhesives facilitate imparting film properties to the adhesive.
  • thermoplastic resins include phenoxy resin, polyvinyl formal resin, polystyrene resin, polyvinyl butyral resin, polyester resin, polyamide resin, xylene resin, polyurethane resin, polyester urethane resin, phenol resin, terpene phenol resin, and the like.
  • the compounds described in International Publication No. 2009/063827 can be suitably used.
  • a phenoxy resin is preferable because of excellent adhesion, compatibility, heat resistance, mechanical strength, and the like. These are used individually by 1 type or in combination of 2 or more types.
  • the blending amount of this thermoplastic resin is generally about 5 to 80 parts by mass with respect to 100 parts by mass of the total amount of the thermoplastic resin and the thermosetting material when blended with the epoxy adhesive. Further, when a thermoplastic resin is blended in the radical curable adhesive, the blending amount of the thermoplastic resin is generally 5 to 80 mass with respect to 100 mass parts of the total amount of the thermoplastic resin and the radical polymerizable material. About a part.
  • an adhesive that has a relatively low viscosity and is likely to cause blocking in the conventional technology is used. It can be used for the adhesive layer.
  • the adhesive layer 8 may have a shear viscosity at 30 ° C. of 100000 Pa ⁇ s or less. The viscosity is more preferably 1000 to 50000 Pa ⁇ s, and still more preferably 1000 to 30000 Pa ⁇ s.
  • a heat radical curable adhesive and a low temperature curable adhesive may be used as the low-viscosity adhesive.
  • thermo radical curable adhesive containing a radical polymerization initiator having a 1 minute half-life temperature of 160 ° C. or less.
  • the 1-minute half-life temperature is more preferably 60 to 140 ° C, still more preferably 60 to 120 ° C.
  • di-tert-butylperoxyhexahydroterephthalate (1 minute half-life temperature: 142 ° C., HTP-65W (trade name) manufactured by Kayaku Azo Co., Ltd.), substituted benzoyl peroxide (1 Minute half-life temperature: 131.1 ° C., manufactured by NOF Corporation, NIPPER BMT (trade name), dilauroyl peroxide (1 minute half-life temperature: 116.4 ° C., manufactured by NOF Corporation, Parroyl L (product) Name)).
  • a thermal radical curable adhesive containing a thermoplastic resin, a radical polymerizable material containing a radical polymerizable substance that is liquid at 30 ° C., and a radical polymerization initiator Is mentioned.
  • the content of the radical polymerizable substance in the thermal radical curable adhesive is preferably 20 to 80 parts by mass with respect to 100 parts by mass of the total amount of the thermoplastic resin and the radical polymerizable material.
  • the content is more preferably 30 to 80 parts by mass, still more preferably 40 to 80 parts by mass.
  • the adhesive component 8a may be an epoxy adhesive containing a thermoplastic resin, a thermosetting material containing an epoxy resin that is liquid at 30 ° C., and a curing agent.
  • the content of the epoxy resin in the epoxy adhesive is preferably 20 to 80 parts by mass with respect to 100 parts by mass of the total amount of the thermoplastic resin and the thermosetting material.
  • the content is more preferably 40 to 80 parts by mass, still more preferably 30 to 80 parts by mass.
  • a component that exerts a relaxing action on internal stress from the viewpoint of suppressing the warpage of the substrate caused by the difference in linear expansion coefficient between the IC chip and the substrate is preferably blended into the adhesive component. Specifically, it is preferable to blend an acrylic rubber or an elastomer component with the adhesive component.
  • a radical curable adhesive as described in International Publication No. 98/44067 can also be used.
  • the conductive particles 8b include metal particles such as Au, Ag, Ni, Cu, and solder, and carbon.
  • metal particles such as Au, Ag, Ni, Cu, and solder, and carbon.
  • non-conductive glass, ceramic, plastic, or the like may be used as a core, and the core may be coated with the above-described metal or carbon film or metal particles.
  • the conductive particles 8b are conductive particles having a plastic core or hot-melt metal particles, the conductive particles 8b have deformability when heated and pressurized. For this reason, it is possible to increase the contact area between the electrode and the conductive particles 8b at the time of connection, and the connection reliability can be improved.
  • the conductive particles 8b may be, for example, metal particles made of copper covered with silver.
  • conductive particles 8b a metal powder having a shape in which a large number of fine metal particles are connected in a chain shape as described in JP-A-2005-116291 can be used.
  • conductive particles having protrusions as described in JP 2008-135734 A can also be used.
  • insulating particles obtained by coating the surface of the conductive particles 8b with a polymer resin or the like may be added.
  • insulating particles when the total amount of particles is increased, it becomes possible to suppress short circuit due to contact between particles when used as anisotropic conductive tape, and insulation between adjacent circuit electrodes Can be improved.
  • the average particle diameter of the conductive particles and the insulating particles is preferably 1 to 18 ⁇ m, more preferably 2.0 to 10 ⁇ m, from the viewpoint of improving dispersibility and conductivity.
  • the blending amount of the conductive particles 8b is not particularly limited, and is preferably 0.1 to 30% by volume, more preferably 0.1 to 10% by volume, and still more preferably 0, based on the entire adhesive component. .5-5% by volume.
  • the blending amount of the conductive particles 8b is 0.1% by volume or more, excellent electrical conductivity can be sufficiently achieved.
  • 30% by volume or less the circuit is used when used as an anisotropic conductive tape. The occurrence of short circuit can be sufficiently suppressed.
  • an inorganic filler may be added to the adhesive component 8a.
  • the inorganic filler is not particularly limited as long as it is, for example, a solid particulate inorganic compound.
  • Specific examples of the material of the inorganic filler include, for example, aluminum hydroxide, magnesium hydroxide, calcium carbonate, magnesium carbonate, calcium silicate, magnesium silicate, calcium oxide, magnesium oxide, alumina, aluminum nitride, aluminum borate whisker, and nitride. Examples include boron, silica such as crystalline silica and amorphous silica, and antimony oxide.
  • An inorganic filler is used individually by 1 type or in combination of 2 or more types.
  • the winding portion 5b having a predetermined length on the end portion 5c side of the anisotropic conductive tape 5 it is possible to add no inorganic filler to the adhesive layer 8, or the adhesive layer. Even when the blending amount is 20% by volume or less based on the volume of 8, blocking can be sufficiently suppressed.
  • the inorganic filler content is more preferably 0 to 15% by volume, still more preferably 0 to 10% by volume.
  • the inorganic filler content is more preferably 0 to 40% by mass, and still more preferably 0 to 30% by mass. Since the specific gravity of an inorganic filler changes with kinds, it is preferable to set content based on mass to a suitable value according to the inorganic filler to be used. For example, when the inorganic filler is silica, blocking can be sufficiently suppressed even if the content based on the mass of the adhesive layer 8 is 35% by mass or less.
  • the silica content is more preferably 0 to 30% by mass, and still more preferably 0 to 20% by mass.
  • the inorganic filler is alumina
  • blocking can be sufficiently suppressed even if the content based on the mass of the adhesive layer 8 is 50% by mass or less.
  • the alumina content is more preferably 0 to 40% by mass, still more preferably 0 to 30% by mass.
  • the content of the inorganic filler can be easily calculated at the time of blending, but can be measured, for example, by the following method when measured from the state of the adhesive tape.
  • a crucible used for measurement is placed in an electric furnace (in an air environment) heated to 700 ° C. in advance and heated for 45 minutes.
  • the temperature of the electric furnace is returned to room temperature, and the mass of the crucible taken out from the electric furnace is quickly weighed in a desiccator.
  • the mass of the crucible or the like is measured to 3 decimal places (0.001 g) using a balance (Precision Electronic Balance UW series manufactured by Shimadzu Corporation).
  • This ash should contain an inorganic filler and conductive particles (metal). (7)
  • the type and content of conductive particles (metal content) contained in the ash are separately calculated by ICP emission spectroscopic analysis.
  • the ash is decomposed with a mixed acid of hydrofluoric acid and nitric acid to obtain a test solution.
  • the metal species contained in the test solution and the content thereof are quantitatively analyzed by an ICP emission spectroscopic analyzer (ICP-AES manufactured by Shimadzu Corporation).
  • the mixed acid is a mixture of hydrofluoric acid, nitric acid and water at a mass ratio of 1: 1: 1.
  • the mass of the conductive particles (metal component) calculated by this ICP emission spectroscopic analysis method is subtracted from the mass of the ash obtained in (6) above to obtain the mass of the inorganic filler.
  • the content of the inorganic filler based on the volume is determined as follows. That is, the specific gravity of the ash extracted from the crucible and the specific gravity of the adhesive layer before heating were measured with a dry hydrometer (Shimadzu dry density meter Accupic II 1340 series) and detected by ICP emission spectroscopy. The theoretical specific gravity and content of the metal are subtracted from the ash, and the volume percentage of the inorganic filler relative to the original adhesive layer is calculated.
  • a coating liquid containing an adhesive component is used on a base film (the above-mentioned various materials can be used as a base, for example, a polyethylene terephthalate film).
  • the raw material of the anisotropic conductive film is produced by coating.
  • This raw fabric is cut into a tape shape so as to have a width suitable for the application.
  • a slit device described in JP-A-2003-285293 can be used.
  • the adhesive reel 10 is manufactured by winding the anisotropic conductive tape 5 having a predetermined width around the core of the reel component.
  • the first portion (terminal portion 5c) of the anisotropic conductive tape is fixed to the core and wound.
  • this fixing method can use a well-known method, it can fix with an adhesive tape and an adhesive, for example.
  • a fastener and a notch part can also be provided and fixed to a winding core.
  • the anisotropic conductive tape 5 may be wound up through an end tape as described in International Publication No. 2010/098354 and International Publication No. 2010/110094. Although there is no restriction
  • a circuit connector 100 shown in FIG. 6 includes a first circuit member 30 and a second circuit member 40 that face each other, and the first circuit member 30 and the second circuit member 40 are disposed between the first circuit member 30 and the second circuit member 40.
  • a connecting portion 50a for connecting them is provided.
  • the first circuit member 30 includes a circuit board 31 and circuit electrodes 32 formed on the main surface 31 a of the circuit board 31.
  • the second circuit member 40 includes a circuit board 41 and circuit electrodes 42 formed on the main surface 41 a of the circuit board 41.
  • the circuit member include chip components such as a semiconductor chip (IC chip), a resistor chip, and a capacitor chip. These circuit members include circuit electrodes, and generally include a large number (at least two or more) of circuit electrodes. Specific examples of the other circuit member to which the circuit member is connected include a flexible substrate having metal wiring, a flexible printed wiring board, and a wiring substrate such as a glass substrate on which indium tin oxide (ITO) is deposited. It is done.
  • ITO indium tin oxide
  • the anisotropic conductive tape 5 drawn from the adhesive reel 10 the circuit members can be connected efficiently and with high connection reliability. Therefore, the anisotropic conductive tape 5 according to the present embodiment is suitable for COG mounting (Chip On Glass) or COF mounting (Chip On Flex) on a wiring board of a chip component having many fine connection terminals (circuit electrodes). It is.
  • each circuit electrode 32, 42 may be composed of one kind selected from gold, silver, tin, ruthenium, rhodium, palladium, osmium, iridium, platinum, and indium tin oxide (ITO), or two or more kinds. It may be comprised. Moreover, the material of the surface of the circuit electrodes 32 and 42 may be the same in all the circuit electrodes, or may be different.
  • connection portion 50a includes a cured product 8A of the adhesive component 8a included in the adhesive layer 8, and conductive particles 8b dispersed therein. And in the circuit connection body 100, the circuit electrode 32 and the circuit electrode 42 which oppose are electrically connected through the conductive particle 8b. That is, the conductive particles 8 b are in direct contact with both the circuit electrodes 32 and 42.
  • connection resistance between the circuit electrodes 32 and 42 is sufficiently reduced, and a good electrical connection between the circuit electrodes 32 and 42 becomes possible.
  • the cured product 8A has electrical insulation, and the insulation between adjacent circuit electrodes is ensured. Therefore, the flow of current between the circuit electrodes 32 and 42 can be made smooth, and the functions of the circuit can be fully exhibited.
  • FIG. 7 is a process diagram illustrating an embodiment of a method for manufacturing a circuit connector in a schematic cross-sectional view.
  • the adhesive layer 8 of the anisotropic conductive tape 5 is thermally cured, and finally the circuit connector 100 is manufactured.
  • the adhesive reel 10 is mounted on the rotating shaft of a connecting device (not shown).
  • the anisotropic conductive tape 5 is pulled out from the adhesive reel 10 so that the adhesive layer 8 faces downward.
  • the anisotropic conductive tape 5 is cut into a predetermined length and placed on the main surface 31a of the circuit member 30 (FIG. 7A).
  • pressure is applied in the directions of arrows A and B in FIG. 7A to temporarily fix the adhesive layer 8 to the first circuit member 30 (FIG. 7B).
  • the pressure at this time is not particularly limited as long as it does not damage the circuit member, but it is generally preferably 0.1 to 30.0 MPa.
  • you may pressurize, heating, and let heating temperature be the temperature which the adhesive bond layer 8 does not harden
  • the heating temperature is preferably 50 to 100 ° C. These heating and pressurization are preferably performed in the range of 0.1 to 2 seconds.
  • the adhesive layer 8 is arranged so that the second circuit member 40 faces the second circuit electrode 42 toward the first circuit member 30. Put it on top. Then, while heating the adhesive layer 8, the whole is pressurized in the directions of arrows A and B in FIG.
  • the heating temperature at this time is set to a temperature at which the adhesive component 8a of the adhesive layer 8 can be cured.
  • the heating temperature is preferably 60 to 180 ° C, more preferably 70 to 170 ° C, and still more preferably 80 to 160 ° C. By setting the heating temperature to 60 ° C. or higher, the curing rate can be sufficiently increased, and by setting the heating temperature to 180 ° C. or lower, the undesirable side reaction can be sufficiently suppressed.
  • the heating time is preferably 0.1 to 180 seconds, more preferably 0.5 to 180 seconds, and still more preferably 1 to 180 seconds.
  • connection part 50a is formed by hardening of the adhesive component 8a, and the circuit connection body 100 as shown in FIG. 6 is obtained.
  • the connection conditions are appropriately selected depending on the application to be used, the adhesive component, and the circuit member.
  • cured with light is used as an adhesive agent component of the adhesive bond layer 8, what is necessary is just to irradiate the adhesive bond layer 8 with an actinic ray or an energy ray suitably.
  • the active light include ultraviolet light, visible light, and infrared light.
  • energy rays include electron beams, X-rays, ⁇ rays, and microwaves.
  • the anisotropic conductive tape 5 wound around the reel part is pulled out by providing the winding portion 5b having a predetermined length on the end portion 5c side of the anisotropic conductive tape 5, the base material is pulled out. 6 can prevent the adhesive layer 8 from peeling at a sufficiently high level.
  • the anisotropic conductive tape 5 is wound around the core so that the adhesive layer 8 faces the core 1 side (inside) and the surface of the substrate 6 where the adhesive layer is not formed faces the outside.
  • the direction of the anisotropic conductive tape 5 may be reversed. 8 and 9, the core 1 is formed such that the surface of the base 6 on which the adhesive layer is not formed faces the core 1 (inside) and the adhesive layer 8 faces the outside.
  • Anisotropic conductive tape 5 is wound around.
  • the end mark EM is provided at a position where the distance from the end portion 5c of the anisotropic conductive tape 5 (length L2 in FIG. 10) is 5 m or more. This distance is preferably 5 to 20 m, more preferably 5 to 15 m, and still more preferably 5 to 10 m.
  • the length of the rewinding part 5b is set to 20 m or less. The amount of the adhesive layer 8 that is discarded without being discarded can be suppressed.
  • the end mark EM is disposed at a predetermined position, and the base material 6 faces the core 1 and the adhesive layer 8 faces the outside.
  • the occurrence of blocking can be more reliably suppressed.
  • the reason why a more excellent effect is achieved by reversing the direction in which the anisotropic conductive tape 5 is wound is not necessarily clear, but the present inventors infer as follows. That is, even when the adhesive oozes out from the end face of the adhesive layer 8 in the region 5a to be used of the anisotropic conductive tape 5 and is adhered to the side plate 2, the adhesive layer 5 is pulled out when the anisotropic conductive tape 5 is pulled out.
  • the adhesive layer 8 on the substrate 6 is previously removed from the last portion (the end portion of the winding) of the anisotropic conductive tape 5 to provide a blank portion, and the adhesive layer 8 is wound around the wound body. Exposure can be prevented.
  • another tape (similar to the base material can be exemplified) is prepared, and this is connected to the end of the base material 6 and wound around the wound body. May be. In addition to the above, contamination from the external environment can be suppressed by storing the adhesive reel 10 in a bag.
  • the anisotropic conductive tape 5 was illustrated as an adhesive tape for circuit connection, the non-conductive tape which the adhesive bond layer 8 consists of the adhesive component 8a and does not contain the electroconductive particle 8b is the core 1.
  • the adhesive reel may be produced by winding the conductive material 8 on the tape, or a conductive tape having no anisotropy in which the conductive particles 8b are blended more than the anisotropic conductive tape may be used.
  • an adhesive tape 15A shown in FIG. 11A includes an adhesive layer 18 having a multilayer structure.
  • the adhesive layer 18 includes a conductive particle non-containing layer 18a that does not contain conductive particles and a conductive particle-containing layer 18b that contains conductive particles.
  • an adhesive agent component of the conductive particle non-containing layer 18a and the conductive particle containing layer 18b the same adhesive component as that of the above-described adhesive layer 8 can be used.
  • the adhesive layer 18 having the two-layer structure is used as a circuit connecting material, the decrease in the number of conductive particles on the circuit electrode due to the flow of the adhesive component can be sufficiently suppressed when the circuit members are joined to each other. .
  • the adhesive layer 18 is disposed so that the surface provided with the metal bumps of the IC chip and the conductive particle-free layer 18a are in contact with the substrate on which the IC chip is to be mounted and the conductive particle-containing layer 18b, respectively. It is preferable to do.
  • the adhesive tape 15 ⁇ / b> B shown in FIG. 11B is provided with a pressure-sensitive adhesive layer 9 a between the substrate 6 and the adhesive layer 8 from the viewpoint of more reliably preventing the adhesive layer 8 from peeling off. .
  • the adhesive tape 15 ⁇ / b> C shown in FIG. 11C is obtained by further laminating the pressure-sensitive adhesive layer 9 b on the adhesive layer 8 from the viewpoint of improving the sticking property to the circuit member. Further, from the viewpoint of more effectively suppressing blocking and protecting the adhesive layer 8, as shown in FIG. 12, even if the cover film 13 is laminated on the surface opposite to the base 6 of the adhesive tape 16. Good.
  • Measurement frequency 10 Hz Atmosphere: under nitrogen Temperature range: 0 ° C to 150 ° C, Temperature increase rate: 10 ° C / min, Probe diameter: 8mm Sample size: 10 mm x 10 mm, Sample thickness: about 0.6 mm, Measurement strain: 1.0%.
  • Example 1 [Preparation of raw materials for adhesive components]
  • the following raw materials were prepared. 50 g of thermoplastic phenoxy resin (manufactured by Union Carbide Co., Ltd., trade name: PKHC, weight average molecular weight: 45000), 1: 1 toluene (boiling point 110.6 ° C.) and ethyl acetate (boiling point 77.1 ° C.) It melt
  • urethane acrylate that is liquid at 30 ° C.
  • an adhesive film was prepared as follows. For 40 parts by mass of the phenoxy resin solution, 40 parts by mass of liquid urethane acrylate, 20 parts by mass of liquid dimethacrylate, and 4 parts by mass of radical generator were blended to obtain a mixed solution. To the liquid mixture, nickel powder (conductive particles) having an average particle diameter of 5 ⁇ m and silica powder (inorganic filler) having an average particle diameter of 0.5 ⁇ m are blended, and nickel powder and silica powder are dispersed in the liquid mixture. A coating solution was obtained.
  • the coating solution is applied to a PET film (carrier film) having a thickness of 80 ⁇ m, a width of 500 mm, and a silicone release treatment on both sides using a coating device, with a length of 320 m, a furnace length of 15 m, and a hot air temperature of 70 ° C. Drying was performed at a speed of 3 m / min using a drying furnace. This obtained the adhesive film (full length 320m) in which the adhesive layer (thickness: 40 micrometers) was provided on the one surface of PET film.
  • the nickel powder content of the adhesive layer after drying was 1.5% by volume, and the silica powder content was 15% by volume (26% by mass).
  • the adhesive film was cut into a width of 1.5 mm using a roll-to-roll slit facility, and an adhesive tape was wound up on a reel part (core outer diameter: 66 mm, plastic molded product) to a length of 300 m. At this time, it wound up so that the adhesive layer faced the core side (inside) and the base material made of PET faced the outside. During winding, an end mark was attached at a position 5 m from the end of the adhesive tape.
  • Reel side plates are provided on both sides of the core, and the clearance distance between the reel side plate and the wound tape of the adhesive tape is about 0.1 mm to 0.5 mm on each side. It was within the range.
  • a reel part having a reel side plate provided with rib structure portions 2b extending radially as shown in FIG. 1 was used.
  • Example 2 An adhesive reel was prepared and evaluated in the same manner as in Example 1 except that the position where the end mark was applied was 10 m instead of 5 m from the end of the adhesive tape.
  • Example 3 An adhesive reel was prepared and evaluated in the same manner as in Example 1 except that the position of the end mark was 15 m instead of 5 m from the end of the adhesive tape.
  • Example 4 An adhesive reel was produced and evaluated in the same manner as in Example 1 except that the position of attaching the end mark was set to 20 m instead of 5 m from the end of the adhesive tape.
  • Tables 1 and 2 show the results of the above examples and comparative examples.

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Storage Of Web-Like Or Filamentary Materials (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Manufacturing Of Electrical Connectors (AREA)

Abstract

Le rouleau de matériau adhésif ci-décrit comprend : une partie centrale ; une paire de feuilles latérales placées en regard l'une de l'autre des deux côtés de la partie centrale ; et une bande de matériau adhésif enroulée autour de la partie centrale et constituée d'un matériau de base en forme de bande et d'une couche adhésive formée à la surface du matériau de base. Un repère de fin est positionné au moins 5 m avant l'extrémité finale de la bande de matériau adhésif, séparant la partie à utiliser de la partie qui est la partie enroulée sacrifiée de la longueur totale de la bande de matériau adhésif.
PCT/JP2011/068700 2011-08-18 2011-08-18 Rouleau de matériau adhésif WO2013024544A1 (fr)

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PCT/JP2011/068700 WO2013024544A1 (fr) 2011-08-18 2011-08-18 Rouleau de matériau adhésif
PCT/JP2012/070757 WO2013024873A1 (fr) 2011-08-18 2012-08-15 Rouleau de matériau adhésif, procédé anti-blocage, procédé de permutation de rouleaux de matériau adhésif, procédé de chargement d'une bande de matériau adhésif, kit rouleau, et emballage
CN201210291451.6A CN102951498B (zh) 2011-08-18 2012-08-15 粘接材料卷盘及卷盘套件
KR1020147006339A KR101940355B1 (ko) 2011-08-18 2012-08-15 접착재 릴, 블록킹 억제 방법, 접착재 릴의 교환 방법, 접착재 테이프의 조출 방법, 접착재 릴의 제조 방법, 릴 키트, 및 곤포체
CN2012204058050U CN203021117U (zh) 2011-08-18 2012-08-15 粘接材料卷盘及卷盘套件
CN2012204055315U CN203020727U (zh) 2011-08-18 2012-08-15 包装体、包装体套件以及包装体组件
JP2013529027A JP6036694B2 (ja) 2011-08-18 2012-08-15 接着材リール、ブロッキング抑制方法、接着材リールの交換方法、接着材テープの繰出し方法、接着材リールの製造方法、リールキット、及び梱包体
TW101129778A TWI580628B (zh) 2011-08-18 2012-08-16 接著材捲筒、阻塞抑制方法、接著材捲筒的交換方法、接著材帶的抽出方法、接著材捲筒的製造方法、設置結束標誌的方法、捲筒套件及包裝體

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US11923335B2 (en) 2013-11-19 2024-03-05 Dexerials Corporation Anisotropic conductive film and connected structure

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TWI664783B (zh) * 2014-03-31 2019-07-01 日商迪睿合股份有限公司 異向性導電膜、其製造方法、連接構造體、及連接構造體之製造方法
JP6098949B2 (ja) * 2014-12-12 2017-03-22 トヨタ自動車株式会社 電解質膜巻回体
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WO2019050012A1 (fr) * 2017-09-11 2019-03-14 日立化成株式会社 Film adhésif pour connexion de circuits et procédé de fabrication associé, procédé de fabrication d'une structure de connexion de circuits et ensemble contenant pour film adhésif
WO2019050005A1 (fr) * 2017-09-11 2019-03-14 日立化成株式会社 Ensemble contenant pour film adhésif et procédé de fabrication associé
WO2019050011A1 (fr) * 2017-09-11 2019-03-14 日立化成株式会社 Film adhésif pour connexion de circuits et procédé de fabrication associé, procédé de fabrication d'une structure de connexion de circuits et ensemble contenant pour film adhésif
KR102631317B1 (ko) * 2017-09-11 2024-02-01 가부시끼가이샤 레조낙 회로 접속용 접착제 필름 및 그의 제조 방법, 회로 접속 구조체의 제조 방법, 그리고 접착제 필름 수용 세트
JPWO2020184583A1 (fr) * 2019-03-13 2020-09-17
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