WO2013023386A1 - 液晶面板的软板上芯片构造的卷带基板及液晶面板 - Google Patents

液晶面板的软板上芯片构造的卷带基板及液晶面板 Download PDF

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Publication number
WO2013023386A1
WO2013023386A1 PCT/CN2011/078960 CN2011078960W WO2013023386A1 WO 2013023386 A1 WO2013023386 A1 WO 2013023386A1 CN 2011078960 W CN2011078960 W CN 2011078960W WO 2013023386 A1 WO2013023386 A1 WO 2013023386A1
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WIPO (PCT)
Prior art keywords
tape substrate
liquid crystal
substrate
crystal panel
longitudinal direction
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PCT/CN2011/078960
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English (en)
French (fr)
Inventor
林柏伸
廖良展
吴宇
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深圳市华星光电技术有限公司
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Application filed by 深圳市华星光电技术有限公司 filed Critical 深圳市华星光电技术有限公司
Priority to US13/375,471 priority Critical patent/US8916779B2/en
Publication of WO2013023386A1 publication Critical patent/WO2013023386A1/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/4985—Flexible insulating substrates
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1345—Conductors connecting electrodes to cell terminals
    • G02F1/13452—Conductors connecting driver circuitry and terminals of panels
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/156—Material
    • H01L2924/15786—Material with a principal constituent of the material being a non metallic, non metalloid inorganic material
    • H01L2924/15788—Glasses, e.g. amorphous oxides, nitrides or fluorides

Definitions

  • the present invention relates to the field of liquid crystal display technology, and in particular to a tape substrate and a liquid crystal panel of a soft-board chip structure of a liquid crystal panel.
  • the prior art Chip On Film (COF) type package structure basically adopts on-load automatic bonding (Tape Automated Bonding, TAB) technology performs thermal compression packaging of the driver chip and performs tape winding and tape feeding in a roll.
  • TAB on-load automatic bonding
  • the chip structure of each of the flexible boards can be sequentially cut from the tape substrate and electrically connected between the transparent circuit on the glass substrate of a liquid crystal panel and a driving circuit board.
  • One or several soft-on-board structures may be included between the glass substrate and the driving circuit board. The larger the size of the liquid crystal panel, the more the number of chip structures on the soft board used.
  • the length direction D2 of the driving chip 11 is perpendicular to the longitudinal direction D1 of the tape substrate 10, and the tape substrate 10 is close to the printed circuit board (Printed).
  • Circuit board, PCB side input lead 12 and external wire bonding near the glass substrate (Outer Lead)
  • the output terminal leads 13 on the side of the bonding, OLB are respectively located on both sides of the driving chip 11, and the input terminal 12 and the output terminal 13 are radially extended substantially in the longitudinal direction D1 of the tape substrate 10.
  • the output lead 13 is connected to a transparent circuit (not shown) on the glass substrate of the liquid crystal panel, and the output lead 13 is not only has a large number of wires but also is closely arranged.
  • the width of the tape substrate 10 is small, generally 35 or 48 millimeters (mm), and the specifications thereof have been standardized, so that it is not possible to arbitrarily increase the chip on each of the flexible substrates on the tape substrate 10.
  • COF the size of the liquid crystal panel becomes larger, not only a larger number of COFs are used, but also the number of traces on each COF becomes more, so the COF of the prior art obviously cannot satisfy the large-size liquid crystal panel. High-density wiring requirements for COF.
  • An object of the present invention is to provide a tape substrate and a liquid crystal panel of a soft-on-chip structure of a liquid crystal panel, so as to solve the problem that the width of the tape substrate cannot be increased in the prior art, and the COF cannot satisfy the large-size liquid crystal panel.
  • High-density wiring requirements, especially the output lead of COF, cannot meet the technical requirements of high-density wiring requirements on large-sized liquid crystal panels.
  • the present invention constructs a tape substrate of a soft-on-chip structure of a liquid crystal panel, the tape substrate is arranged with a plurality of package units of a chip structure on a soft board along a longitudinal direction thereof, the package unit including an input lead and an output end lead,
  • the input end lead and the output end lead are respectively disposed on two sides of the tape substrate;
  • the input end leads of adjacent package units are disposed on the same side or on the opposite side of the web substrate.
  • the present invention constructs a tape substrate of a soft-on-chip structure of a liquid crystal panel, the tape substrate is arranged with a plurality of package units of a chip structure on a soft board along a longitudinal direction thereof, the package unit including an input lead and an output end Lead wires are disposed in each package unit along the longitudinal direction of the tape substrate, and the input end leads and the output end leads are respectively disposed on both sides of the tape substrate.
  • the input end leads of the adjacent package units are disposed on the same side of the tape substrate in the longitudinal direction of the tape substrate.
  • the input terminal leads of the adjacent package units are disposed on the opposite sides of the tape substrate in the longitudinal direction of the tape substrate.
  • the present invention constructs a tape substrate having a chip-on-board configuration of a liquid crystal panel, the tape substrate is arranged in a longitudinal direction of a plurality of package units of a chip structure on a soft board, the package unit including a driver chip, and an input terminal lead And the output leads,
  • a length direction of the driving chip is parallel to a longitudinal direction of the tape substrate, and in the longitudinal direction of the tape substrate, the input end lead and the output end lead are respectively disposed on the tape substrate On both sides.
  • the input end leads of the adjacent package units are disposed on the same side of the tape substrate in the longitudinal direction of the tape substrate.
  • the input terminal leads of the adjacent package units are disposed on the opposite sides of the tape substrate in the longitudinal direction of the tape substrate.
  • the present invention is a liquid crystal panel, the liquid crystal panel includes a first substrate and a second substrate, and the transparent circuit on the second substrate is electrically connected to a driving circuit through a plurality of package units configured on a chip board. a board, each of the package units including a driver chip, an input lead, and an output lead
  • a length direction of the driving chip is parallel to a longitudinal direction of the tape substrate, and in the longitudinal direction of the tape substrate, the input end lead and the output end lead are respectively disposed on the tape substrate On both sides.
  • the present invention solves the problem that the width of the tape substrate cannot be increased in the prior art, and the COF cannot meet the high-density wiring requirement of the liquid crystal panel of a large size, especially the output lead of the COF cannot satisfy the large size. High-density wiring requirements on the LCD panel.
  • FIG. 1 is a schematic view showing a package structure of a circuit board on a diaphragm in the prior art
  • FIG. 2 is a structural view showing a first preferred embodiment of a tape substrate of a soft-board structure of a liquid crystal panel according to the present invention
  • FIG. 3 is a structural view showing a second preferred embodiment of a tape substrate of a soft-board structure of a liquid crystal panel according to the present invention.
  • FIG. 4 is an assembled top view of a preferred embodiment of a liquid crystal panel, a chip structure on a soft board, and a driving circuit board in the present invention
  • FIG. 5 is an assembled side view of a preferred embodiment of a liquid crystal panel, a chip structure on a soft board, and a driving circuit board in the present invention.
  • FIG. 2 is a view showing the structure of a first preferred embodiment of a tape substrate having a chip-on-board structure of a liquid crystal panel according to the present invention.
  • the tape substrate includes a tape substrate body 20, and further includes a package unit 21, a package unit 22, ... in a plurality of on-board chip structures arranged in a longitudinal direction M1 of the substrate body 20.
  • the package unit is disposed on the web substrate 20 before being cut.
  • the tape substrate body 20 generally refers to a flexible circuit board (flexible circuit)
  • the board generally comprises at least two flexible polymer layers and a lead layer (not shown) sandwiched between the at least two flexible polymer layers.
  • the package unit 21 includes an input lead 211 and an output lead 212 .
  • the input terminal lead 211 and the output terminal lead 212 are disposed on both sides of the take-up substrate body 20 in the longitudinal direction of the take-up substrate body 20.
  • the input end lead 211 and the output end lead 212 are all part of the lead layer of the web substrate 20 .
  • the package unit 22 is adjacent to the package unit 21, and the package unit 22 includes an input lead 221 and an output lead 222.
  • the package unit 22 includes an input lead 221 and an output lead 222.
  • the input lead 211 of the package unit 21 and the input lead 221 of the package unit 22 are located on the same side of the take-up substrate body 20.
  • the input lead 211 of the package unit 21 and the input lead 221 of the package unit 22 may also be disposed on the opposite side of the tape substrate body 20, and details are not described herein again.
  • the cut-off COF is no longer disposed by placing the input lead and the output lead of each package unit on both sides of the take-up substrate in the longitudinal direction of the take-up substrate. Due to the limitation of the width of the tape substrate, it is possible to flexibly increase the width of the COF according to the wiring requirements on the large-sized liquid crystal panel.
  • FIG. 3 is a view showing the structure of a second preferred embodiment of the tape substrate of the soft-board chip structure of the liquid crystal panel of the present invention.
  • the tape substrate includes a tape substrate body 20, and further includes a package unit 21, a package unit 22, ... in a plurality of on-board chip structures arranged in a longitudinal direction M1 of the substrate body 20.
  • the package unit is disposed on the web substrate 20 before being cut.
  • the tape substrate body 20 generally refers to a flexible circuit board (flexible circuit)
  • the board generally comprises at least two flexible polymer layers and a lead layer (not shown) sandwiched between the at least two flexible polymer layers.
  • the package unit 21 includes an input lead 211 and an output lead 212 .
  • the input terminal lead 211 and the output terminal lead 212 are disposed on both sides of the take-up substrate body 20 in the longitudinal direction of the take-up substrate body 20.
  • the input end lead 211 and the output end lead 212 are all part of the lead layer of the web substrate 20 .
  • the package unit 21 further includes a driving chip 301 whose active surface faces downward, and A gold bump (not shown) of its active surface is bonded to the inner ends of the input terminal lead 211 and the output terminal lead 212 by thermocompression bonding.
  • the tape substrate body 20 extends in the longitudinal direction M1, and the driving chip 301 extends along the length direction M2 thereof.
  • M1 and M2 are parallel to each other.
  • the package unit 22 is adjacent to the package unit 21, and the package unit 22 includes an input lead 221 and an output lead 222.
  • the package unit 22 includes an input lead 221 and an output lead 222.
  • along the longitudinal direction M1 of the take-up substrate The input lead 211 of the package unit 21 and the input lead 221 of the package unit 22 are located on the same side of the take-up substrate body 20.
  • the input lead 211 of the package unit 21 and the input lead 221 of the package unit 22 may also be disposed on the opposite side of the tape substrate body 20, and details are not described herein again.
  • the cut-off COF is no longer disposed by placing the input lead and the output lead of each package unit on both sides of the take-up substrate in the longitudinal direction of the take-up substrate. Due to the limitation of the width of the tape substrate, it is possible to flexibly increase the width of the COF according to the wiring requirements on the large-sized liquid crystal panel.
  • FIG. 4 is an assembled top view of a preferred embodiment of a liquid crystal panel, a soft board chip structure and a driving circuit board according to the present invention
  • FIG. 5 is a schematic diagram of a liquid crystal panel and a soft board chip structure according to the present invention
  • the driving circuit board 41 is further included, and the liquid crystal panel 42 includes a first substrate 421 and a second substrate 422, and a transparent circuit on the second substrate 422 ( The figure is not shown) the drive circuit board 41 is electrically connected by a package unit constructed of a plurality of on-board chips.
  • the package unit in FIG. 4 and FIG. 5 is cut according to the tape substrate constructed on the soft board of the liquid crystal panel of FIG.
  • the package unit 21 is connected to the drive circuit board 41 through the input terminal lead 211, and the second substrate 422 of the liquid crystal display 42 is connected through the output end lead 212.
  • the length direction M2 of the driving chip 301 is parallel to the longitudinal direction M1 of the tape substrate body 20, and the input terminal lead 211 and the output terminal lead 212 are along the The longitudinal direction M1 of the web substrate 20 is disposed on both sides of the web substrate 20.
  • the input lead 211 is electrically connected to the driving circuit board 41
  • the output end lead 212 is electrically connected to the transparent circuit on the second substrate 422 .

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Abstract

一种液晶面板的软板上芯片构造的卷带基板以及使用此卷带基板的液晶面板。卷带基板（20）沿其纵向排列多个软板上芯片构造的封装单元（21），封装单元包括输入端引线（211）和输出端引线（212），在每个封装单元（21）内，沿卷带基板（20）的纵向，输入端引线（211）和输出端引线（212）分别设置于卷带基板（20）的两侧。

Description

液晶面板的软板上芯片构造的卷带基板及液晶面板 技术领域
本发明涉及液晶显示技术领域，特别是涉及一种液晶面板的软板上芯片构造的卷带基板及液晶面板。
 背景技术
随着液晶技术的不断发展，对液晶面板内各部件的要求越来越高。
现有技术的软板上芯片（Chip On Film，COF）型封装构造基本上都采用带载自动键合（Tape Automated Bonding，TAB）技术进行驱动芯片的热压合封装，并以成卷的方式进行卷带和送带的。在使用时，每一软板上芯片构造可依序自卷带基板被切割下来，并电性连接于一液晶面板的玻璃基板上的透明电路与一驱动电路板之间。玻璃基板与驱动电路板之间可包含一个或数个软板上芯片构造，液晶面板的尺寸愈大，使用的软板上芯片构造的颗数就愈多。
请参阅图1，在图1所示的软板上芯片构造(COF)中，驱动芯片11的长度方向D2垂直于卷带基板10的纵向D1，卷带基板10靠近印制电路板（Printed Circuit Board，PCB）侧的输入端引线12和靠近玻璃基板的外引线键合（Outer Lead Bonding，OLB）侧的输出端引线13分别位于驱动芯片11的两侧，且输入端引线12和输出端引线13都大致沿卷带基板10的纵向D1进行放射状延伸排列。
以输出端引线13为例，输出端引线13连接液晶面板的玻璃基板上的透明电路（图未示出），输出端引线13不仅走线较多，而且排列也较紧密。但是现有技术的COF中，卷带基板10的宽度较小，一般为35或48毫米(mm)，且其规格已制式化，因而不能随意的增加卷带基板10上每一软板上芯片构造(COF)的宽度。再者，随着液晶面板的尺寸变大，不仅使用更多颗数的COF，且每一COF上的走线数量也变得更多，因此现有技术的COF显然已不能满足大尺寸液晶面板对COF的高密度布线要求。
故，如何解决现有技术中由于卷带基板的宽度不能增加，导致COF不能满足大尺寸的液晶面板上高密度布线要求，尤其是COF的输出端引线不能满足大尺寸的液晶面板上高密度布线要求，是液晶显示技术领域需要解决的技术问题之一。
 技术问题
本发明的一个目的在于提供一种液晶面板的软板上芯片构造的卷带基板及液晶面板，以解决现有技术中由于卷带基板的宽度不能增加，导致COF不能满足大尺寸的液晶面板上高密度布线要求，尤其是COF的输出端引线不能满足大尺寸的液晶面板上高密度布线要求的技术问题。
 技术解决方案
本发明构造了一种液晶面板的软板上芯片构造的卷带基板，所述卷带基板沿其纵向排列多个软板上芯片构造的封装单元，所述封装单元包括输入端引线和输出端引线，
在每个封装单元内，沿所述卷带基板的纵向，所述输入端引线和输出端引线分别设置于所述卷带基板的两侧；
沿所述卷带基板的纵向，相邻封装单元的输入端引线设置于所述卷带基板的同侧或者异侧。
本发明构造了一种液晶面板的软板上芯片构造的卷带基板，所述卷带基板沿其纵向排列多个软板上芯片构造的封装单元，所述封装单元包括输入端引线和输出端引线，在每个封装单元内，沿所述卷带基板的纵向，所述输入端引线和输出端引线分别设置于所述卷带基板的两侧。
在本发明的液晶面板的软板上芯片构造的卷带基板中，沿所述卷带基板的纵向，相邻封装单元的输入端引线设置于所述卷带基板的同侧。
在本发明的液晶面板的软板上芯片构造的卷带基板中，沿所述卷带基板的纵向，相邻封装单元的输入端引线设置于所述卷带基板的异侧。
本发明构造了一种液晶面板的软板上芯片构造的卷带基板，所述卷带基板沿其纵向排列多个软板上芯片构造的封装单元，所述封装单元包括驱动芯片，输入端引线和输出端引线，
在每个封装单元内，所述驱动芯片的长度方向平行于所述卷带基板的纵向，沿所述卷带基板的纵向，所述输入端引线和输出端引线分别设置于所述卷带基板的两侧。
在本发明的液晶面板的软板上芯片构造的卷带基板中，沿所述卷带基板的纵向，相邻封装单元的输入端引线设置于所述卷带基板的同侧。
在本发明的液晶面板的软板上芯片构造的卷带基板中，沿所述卷带基板的纵向，相邻封装单元的输入端引线设置于所述卷带基板的异侧。
本发明构造了一种液晶面板，所述液晶面板包括一第一基板及一第二基板，所述第二基板上的透明电路通过数个软板上芯片构造的封装单元来电性连接一驱动电路板，每个所述封装单元包括驱动芯片、输入端引线和输出端引线，
在每个封装单元内，所述驱动芯片的长度方向平行于所述卷带基板的纵向，沿所述卷带基板的纵向，所述输入端引线和输出端引线分别设置于所述卷带基板的两侧。
 有益效果
本发明相对于现有技术，解决了现有技术中由于卷带基板的宽度不能增加，导致COF不能满足大尺寸的液晶面板上高密度布线要求，尤其是COF的输出端引线不能满足大尺寸的液晶面板上高密度布线要求。
附图说明
图1为现有技术中膜片上线路板封装结构示意图；
图2为本发明中液晶面板的软板上芯片构造的卷带基板的第一较佳实施例的结构图；
图3为本发明中液晶面板的软板上芯片构造的卷带基板的第二较佳实施例的结构图；
图4为本发明中液晶面板、软板上芯片构造及驱动电路板的较佳实施例的组装上视图；
图5为本发明中液晶面板、软板上芯片构造及驱动电路板的较佳实施例的组装侧视图。
 本发明的最佳实施方式
以下各实施例的说明是参考附加的图式，用以例示本发明可用以实施的特定实施例。
请参阅图2，图2为本发明中液晶面板的软板上芯片构造的卷带基板的第一较佳实施例的结构。
所述卷带基板包括卷带基板主体20，还包括沿带基板主体20纵向M1排列的多个软板上芯片构造的封装单元21、封装单元22…。 在未切割之前，封装单元均设置于所述卷带基板主体20上。所述卷带基板主体20通常是指一柔性电路板(flexible circuit board)，其一般包含至少二可挠性聚合物层及一引线层（图未示出），所述引线层夹于所述至少二可挠性聚合物层之间。
请参阅图2，以封装单元21为例，封装单元21包括有输入端引线211和输出端引线212。在本实施例中，所述输入端引线211和输出端引线212沿所述卷带基板主体20的纵向设置于所述卷带基板主体20的两侧。其中，所述输入端引线211及输出端引线212皆为所述卷带基板主体20的引线层的一部份。
请参阅图2，封装单元22与封装单元21相邻，封装单元22包括输入端引线221和输出端引线222，其中，在图2所示的实施例中，沿所述卷带基板的纵向M1，封装单元21的输入端引线211与封装单元22的输入端引线221位于所述卷带基板主体20的同侧。当然，在具体实施过程中，封装单元21的输入端引线211与封装单元22的输入端引线221也可以设置于所述卷带基板主体20的异侧，此处不再赘述。
在图2所示的实施例中，通过将每个封装单元的输入端引线和输出端引线沿所述卷带基板的纵向设置于所述卷带基板的两侧，使得裁剪出来的COF不再受卷带基板宽度的限制，能够根据大尺寸的液晶面板上的布线要求灵活地增加COF的宽度。
请参阅图3，图3是本发明中液晶面板的软板上芯片构造的卷带基板的第二较佳实施例的结构。
所述卷带基板包括卷带基板主体20，还包括沿带基板主体20纵向M1排列的多个软板上芯片构造的封装单元21、封装单元22…。 在未切割之前，封装单元均设置于所述卷带基板主体20上。所述卷带基板主体20通常是指一柔性电路板(flexible circuit board)，其一般包含至少二可挠性聚合物层及一引线层（图未示出），所述引线层夹于所述至少二可挠性聚合物层之间。
请参阅图3，以封装单元21为例，封装单元21包括有输入端引线211和输出端引线212。在本实施例中，所述输入端引线211和输出端引线212沿所述卷带基板主体20的纵向设置于所述卷带基板主体20的两侧。其中，所述输入端引线211及输出端引线212皆为所述卷带基板主体20的引线层的一部份。
请参阅图3，与图2所示的实施例不同之处在于，在图3所示的实施例中，封装单元21还包括驱动芯片301，所述驱动芯片301的有源表面朝下，且其有源表面的金凸块（图未示出）通过热压合结合于所述输入端引线211及输出端引线212的内端上。
在图3所示的实施例中，所述卷带基板主体20沿纵向方向M1延伸，所述驱动芯片301沿其长度方向M2延伸， M1和M2相互平行。
请参阅图3，封装单元22与封装单元21相邻，封装单元22包括输入端引线221和输出端引线222，其中，在图2所示的实施例中，沿所述卷带基板的纵向M1，封装单元21的输入端引线211与封装单元22的输入端引线221位于所述卷带基板主体20的同侧。当然，在具体实施过程中，封装单元21的输入端引线211与封装单元22的输入端引线221也可以设置于所述卷带基板主体20的异侧，此处不再赘述。
在图3所示的实施例中，通过将每个封装单元的输入端引线和输出端引线沿所述卷带基板的纵向设置于所述卷带基板的两侧，使得裁剪出来的COF不再受卷带基板宽度的限制，能够根据大尺寸的液晶面板上的布线要求灵活地增加COF的宽度。
请参阅图4和图5，图4为本发明中液晶面板、软板上芯片构造及驱动电路板的较佳实施例的组装上视图；图5为本发明中液晶面板、软板上芯片构造及驱动电路板的较佳实施例的组装侧视图。
在图4和图5所示的组装结构中，包括驱动电路板41，还包括液晶面板42，液晶面板42包括第一基板421和第二基板422，所述第二基板422上的透明电路（图未示出）通过数个软板上芯片构造的封装单元来电性连接驱动电路板41。其中，图4和图5中的封装单元为按照图3中液晶面板的软板上芯片构造的卷带基板切割而来。
以封装单元21为例，封装单元21通过输入端引线211连结驱动电路板41，通过输出端引线212连接液晶显示器42的第二基板422。
其中，请参阅图3，在每个封装单元内，所述驱动芯片301的长度方向M2平行于所述卷带基板主体20的纵向M1，所述输入端引线211和输出端引线212沿所述卷带基板主体20的纵向M1设置于所述卷带基板主体20的两侧。请参阅图4和图5，所述输入端引线211电性连接所述驱动电路板41，所述输出端引线212电性连接所述第二基板422上的透明电路。
综上所述，虽然本发明已以优选实施例揭露如上，但上述优选实施例并非用以限制本发明，本领域的普通技术人员，在不脱离本发明的精神和范围内，均可作各种更动与润饰，因此本发明的保护范围以权利要求界定的范围为准。
 本发明的实施方式
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Claims (8)

  1. 一种液晶面板的软板上芯片构造的卷带基板，所述卷带基板沿其纵向排列多个软板上芯片构造的封装单元，所述封装单元包括输入端引线和输出端引线，其特征在于，
    在每个封装单元内，沿所述卷带基板的纵向，所述输入端引线和输出端引线分别设置于所述卷带基板的两侧；
    沿所述卷带基板的纵向，相邻封装单元的输入端引线设置于所述卷带基板的同侧或者异侧。
  2. 一种液晶面板的软板上芯片构造的卷带基板，所述卷带基板沿其纵向排列多个软板上芯片构造的封装单元，所述封装单元包括输入端引线和输出端引线，其特征在于，
    在每个封装单元内，沿所述卷带基板的纵向，所述输入端引线和输出端引线分别设置于所述卷带基板的两侧。
  3. 根据权利要求2所述的液晶面板的软板上芯片构造的卷带基板，其特征在于，沿所述卷带基板的纵向，相邻封装单元的输入端引线设置于所述卷带基板的同侧。
  4. 根据权利要求2所述的液晶面板的软板上芯片构造的卷带基板，其特征在于，沿所述卷带基板的纵向，相邻封装单元的输入端引线设置于所述卷带基板的异侧。
  5. 一种液晶面板的软板上芯片构造的卷带基板，所述卷带基板沿其纵向排列多个软板上芯片构造的封装单元，所述封装单元包括驱动芯片，输入端引线和输出端引线，其特征在于：
    在每个封装单元内，所述驱动芯片的长度方向平行于所述卷带基板的纵向，沿所述卷带基板的纵向，所述输入端引线和输出端引线分别设置于所述卷带基板的两侧。
  6. 根据权利要求5所述的液晶面板的软板上芯片构造的卷带基板，其特征在于，沿所述卷带基板的纵向，相邻封装单元的输入端引线设置于所述卷带基板的同侧。
  7. 根据权利要求5所述的液晶面板的软板上芯片构造的卷带基板，其特征在于，沿所述卷带基板的纵向，相邻封装单元的输入端引线设置于所述卷带基板的异侧。
  8. 一种液晶面板，所述液晶面板包括一第一基板及一第二基板，所述第二基板上的透明电路通过数个软板上芯片构造的封装单元来电性连接一驱动电路板，每个所述封装单元包括驱动芯片、输入端引线和输出端引线，其特征在于：
    在每个封装单元内，所述驱动芯片的长度方向平行于所述卷带基板的纵向，沿所述卷带基板的纵向，所述输入端引线和输出端引线分别设置于所述卷带基板的两侧。
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