WO2012171237A1 - 用于液晶面板的软板上芯片构造 - Google Patents

用于液晶面板的软板上芯片构造 Download PDF

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Publication number
WO2012171237A1
WO2012171237A1 PCT/CN2011/077023 CN2011077023W WO2012171237A1 WO 2012171237 A1 WO2012171237 A1 WO 2012171237A1 CN 2011077023 W CN2011077023 W CN 2011077023W WO 2012171237 A1 WO2012171237 A1 WO 2012171237A1
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Prior art keywords
output side
liquid crystal
crystal panel
board
chip
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PCT/CN2011/077023
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English (en)
French (fr)
Inventor
廖良展
林柏伸
张勇
Original Assignee
深圳市华星光电技术有限公司
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Priority to US13/259,201 priority Critical patent/US20140085587A1/en
Publication of WO2012171237A1 publication Critical patent/WO2012171237A1/zh

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    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1345—Conductors connecting electrodes to cell terminals
    • G02F1/13452—Conductors connecting driver circuitry and terminals of panels
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
    • G09G3/00—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes
    • G09G3/20—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters
    • G09G3/34—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters by control of light from an independent source
    • G09G3/36—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters by control of light from an independent source using liquid crystals
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1345—Conductors connecting electrodes to cell terminals
    • G02F1/13454—Drivers integrated on the active matrix substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/4985—Flexible insulating substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
    • G09G2370/00—Aspects of data communication
    • G09G2370/08—Details of image data interface between the display device controller and the data line driver circuit
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49838—Geometry or layout
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09218—Conductive traces
    • H05K2201/09227—Layout details of a plurality of traces, e.g. escape layout for Ball Grid Array [BGA] mounting

Definitions

  • the present invention relates to a soft on-board chip structure for a liquid crystal panel, and more particularly to a soft on-board chip structure in which the long direction of the drive chip is perpendicular or oblique to the output side.
  • Liquid crystal display Display LCD
  • LCD Liquid crystal display Display
  • FPD liquid crystal display
  • the matrix process in the previous stage is to produce a thin film transistor (TFT) substrate (also called an array substrate) and a color filter (CF) substrate;
  • TFT thin film transistor
  • CF color filter
  • the middle segment forming process is responsible for combining the TFT substrate and the CF substrate, and injecting liquid crystal between the two.
  • the rear-end modular process is responsible for assembling the assembled panel with the backlight module, the panel driving circuit, the outer frame, and the like.
  • the LCD driver chip is an important component of the liquid crystal display, and its main function is to output the required voltage to the pixel to control the degree of twist of the liquid crystal molecules.
  • the Source driver chip is a tube signal
  • the Gate driver chip is a tube gate, which has different functions for the liquid crystal display panel.
  • the LCD image is a line and a line scan.
  • the Gate driver chip is a tube vertical signal. Assume that starting from the top line, the first leg of the Gate driver chip is set to On, and the rest is off. .
  • the source driver chip is the real signal (horizontal), and the signal it sends is only acceptable for the horizontal pixels of the first line.
  • the first line has finished sending the signal, it will change the second line.
  • the content of the Source driver chip should be replaced with the second line, and then the Gate driver chip is replaced with the second leg, and the rest is off, and the data can be sent to the second line.
  • the assembly of the driver chip in the assembly process of the latter stage module is an assembly process in which the source driver chip and the Gate driver chip are packaged together with the LCD liquid crystal panel.
  • packaging chips for LCD driver chips such as quad flat package (quad) Flat package, QFP), chip on glass (COG), tape automated bonding (tape automated) Bonding, TAB) and chip on chip (chip on Film, COF), etc.
  • the COF soft on-board chip structure has become the mainstream of the LCD driver chip packaging process because of its flexibility and ability to provide a smaller pitch.
  • FIG. 1 discloses a top view of a conventional soft-board chip structure assembled to a liquid crystal panel. It is specifically noted that, for convenience of explanation, FIG. 1 is presented in a simplified schematic manner in which the number of lines has been simplified, and details not related to the description are also omitted.
  • the edge of a liquid crystal panel 91 is connected to a chip-on-board structure 92.
  • the chip-on-board structure 92 includes a flexible board 921, a driving chip 922, a plurality of output side lines 923, and a plurality of inputs. Side line 924.
  • the soft board 921 is provided with an output side 9211 and an input side 9212.
  • the output side 9211 is connected to the liquid crystal panel 91, and the input side 9212 is disposed on the output side.
  • the other side of the 9211 is for connecting to a circuit board 93.
  • the driving chip 922 is a Source driving chip, and the driving chip 922 is formed in an elongated shape and disposed on an upper surface of the flexible board 921.
  • the long direction of the driving chip 922 and the output side 9211 The plurality of output side lines 923 are connected to the two sides of the driving chip 922 in the long direction (not shown) to the output side 9211; the plurality of input side lines 924 are connected to the driving chip.
  • the contacts on both sides of the long side of the 922 are to the input side 9212.
  • the directions of the arrows of the plurality of output side lines 923 and the plurality of input side lines 924 represent directions of signal transmission.
  • the plurality of input side lines 924 are responsible for transmitting signals of the circuit board 93 to the driving chip 922; the plurality of output side lines 923 are responsible for transmitting signals of the driving chip 922 to the liquid crystal panel 91.
  • the number of traces of the plurality of input side lines 924 is small (for example, 136), and the number of traces of the plurality of output side lines 923 is large (for example, 1102).
  • the lower side of the driving chip 922 is connected to the plurality of input side lines 924, and the contacts of the lower side of the driving chip 922 are connected to the plurality of outputs.
  • the side line 923 is connected. That is to say, the contact portion of the driving chip 922 on the lower side needs to bypass the driving chip 922 through the plurality of output side lines 923, and the line is shifted by 180 degrees to the upper side of the figure.
  • the output side 9211 is described. Therefore, the existing on-board chip structure 92 complicates the overall circuit design.
  • FIG. 2 discloses a top view of another prior art soft-board chip structure assembled to a liquid crystal panel.
  • Another prior art soft-board-on-board configuration 92' of FIG. 2 is substantially similar to the soft-on-board chip configuration 92 of FIG. 1, thus employing the same component symbols and names, but differing in that: FIG. 2 is soft
  • the chip-on-board configuration 92' is a soft-on-board chip structure 92' of a Gate driver chip.
  • the driver chip 922' of the on-chip chip structure 92' of FIG. 2 is a Gate driver chip, and the on-chip chip structure 92' is only connected to the liquid crystal panel 91, and is not connected to The circuit board 93.
  • the plurality of output side lines 923 include a first output side line 923a and a second output side line 923b.
  • the first output side line 923a outputs a signal of the driving chip 922' to the liquid crystal panel 91; the second output side line 923b inputs a signal of the liquid crystal panel 91 to the driving chip 922. '. Therefore, almost all the contacts (not shown) of the driving chip 922' are connected to the output side 9211 through the first output side line 923a and the second output side line 923b to be connected to the Liquid crystal panel 91.
  • the output side line 923 (the first output side line 923a and the second output side line 923b) on the lower side of the driving chip 922 must bypass the driving chip 922', and the line direction is changed by 180 degrees to The output side 9211 on the upper side of the figure.
  • the on-chip chip configuration 92&apos also complicates the overall circuit design.
  • the invention provides a soft on-board chip structure for a liquid crystal panel to solve the problem of complicated circuit design existing in the prior art.
  • the present invention provides a soft on-board chip structure for a liquid crystal panel, comprising:
  • a flexible board having an output side for connecting to a liquid crystal panel
  • a driving chip in the form of a strip, disposed on the surface of the flexible board, the long direction of the driving chip being perpendicular to the output side;
  • a plurality of output side lines connect the contacts on both sides of the driving chip in the long direction to the output side.
  • the present invention further provides a soft on-board chip structure for a liquid crystal panel, which comprises:
  • a flexible board having an output side for connecting to a liquid crystal panel
  • a driving chip is disposed in a strip shape on the surface of the flexible board, and a longitudinal direction of the driving chip is inclined at an angle to the output side;
  • a plurality of output side lines connect the contacts on both sides of the driving chip in the long direction to the output side.
  • the present invention further provides a soft on-board chip structure for a liquid crystal panel, which comprises:
  • a flexible board having an output side for connecting to a liquid crystal panel
  • a driving chip in the form of a strip, disposed on the surface of the flexible board, the long direction of the driving chip being perpendicular or at an oblique angle to the output side;
  • each of the output side lines being in a straight line, an arc or an L shape, connecting the contacts on both sides of the long direction of the driving chip to the output side.
  • each of the output side lines is in a straight line, an arc or an L shape.
  • the plurality of output side lines include: a first output side line that outputs the driving chip signal to the liquid crystal panel; and a second output side line that signals the liquid crystal panel Input to the driver chip.
  • the flexible board further includes an input side, and the input side is disposed on the other side corresponding to the output side for connecting to a circuit board.
  • the flexible board further includes a plurality of input side lines connecting the contacts on both sides of the driving chip in the long direction to the input side, and each of the output side lines is in a straight line and an arc. Line or L shape.
  • the tilt angle is between 30 degrees and 60 degrees.
  • the present invention provides a soft on-board chip structure for a liquid crystal panel in which the long direction of the drive chip is perpendicular or oblique to the output side.
  • the plurality of output side lines are in a straight line, an arc or an L shape, and the plurality of output side lines are connected to connect the contacts on both sides of the driving chip to the output side, thereby simplifying the chip on the soft board Constructed circuit design.
  • the invention provides a soft on-board chip structure for a liquid crystal panel, wherein a longitudinal direction of the driving chip is perpendicular or inclined to the output side.
  • the plurality of output side lines are in a straight line, an arc or an L shape, and the plurality of output side lines are connected to connect the contacts on both sides of the driving chip to the output side, thereby simplifying the chip on the soft board Constructed circuit design.
  • FIG. 1 is a top view of a conventional soft board chip structure assembled to a liquid crystal panel.
  • Figure 2 A top view of another prior art soft board chip assembly assembled to a liquid crystal panel.
  • Figure 3 is a top plan view of a first embodiment of a soft on-board chip assembly assembled to a liquid crystal panel.
  • Figure 4 is a top plan view of a second embodiment of a soft on-board chip assembly assembled to a liquid crystal panel.
  • Figure 5 is a top plan view of a third embodiment of a soft on-board chip construction of the present invention.
  • FIG. 3 discloses a top view of a first embodiment of a soft on-board chip structure assembled to a liquid crystal panel according to the present invention. It is specifically noted that, for convenience of explanation, FIG. 3 is presented in a simplified schematic manner in which the number of lines has been simplified, and details not related to the description are also omitted.
  • the edge of a liquid crystal panel 10 is connected to a chip-on-board structure 20, which includes a flexible board 21, a driving chip 22, a plurality of output side lines 23, and a plurality of inputs. Side line 24.
  • the soft board 21 is provided with an output side 211 and an input side 212.
  • the output side 211 is connected to the liquid crystal panel 10, and the input side 212 is disposed on the output side.
  • the other side of the 211 is for connecting to a circuit board 30.
  • the driving chip 22 is a Source driving chip, and the driving chip 22 is formed in an elongated shape and disposed on the upper surface of the flexible board 21, and the long direction of the driving chip 22 and the output side 211
  • the plurality of output side lines 23 are connected to the two sides of the driving chip 22 (not shown) to the output side 211; the plurality of input side lines 24 are connected to the driving chip 22
  • the contacts on both sides of the long direction are to the input side 212.
  • the directions of the arrows of the plurality of output side lines 23 and the plurality of input side lines 24 represent directions of signal transmission.
  • the plurality of input side lines 24 are responsible for transmitting signals of the circuit board 30 to the driving chip 22;
  • the plurality of output side lines 23 are responsible for transmitting signals of the driving chip 22 to the liquid crystal panel 10.
  • the number of traces of the plurality of input side lines 24 is small (for example, 136), and the number of traces of the plurality of output side lines 23 is large (for example, 1102).
  • the plurality of output side lines 23 or the plurality of input side lines 24 may be in a straight line, an arc line or an L shape.
  • the long direction of the driver chip is parallel to the output side. Therefore, the output side line on the lower side of the driving chip must bypass the driving chip, and the line direction is connected to the output side by 180 degrees, which complicates the overall circuit design of the chip structure on the soft board.
  • the soft on-board chip configuration 20 of the first embodiment of the present invention since the long direction of the drive chip 22 is perpendicular to the output side 211, and the output side line 23 or the input side line 24 It is preferably L-shaped to simplify the circuit design of the chip-on-board configuration 20 on the flexible board.
  • FIG. 4 discloses a top view of a second embodiment of a soft on-board chip structure assembled to a liquid crystal panel according to the present invention.
  • the on-board chip structure 20' of the second embodiment of the present invention is substantially similar to the on-board chip structure 20 of the first embodiment of the present invention, and thus the same component symbols and names are used, but the difference is that the present invention
  • the on-board chip structure 20' of the second embodiment is a soft on-board chip structure 20' of a Gate driver chip. Therefore, compared with FIG. 1, the driving chip 22' of the soft-board chip structure 20' of the second embodiment of the present invention is a Gate driving chip, and the chip-on-board structure 20' of the flexible board is only connected to the liquid crystal panel 10.
  • the plurality of output side lines 23 include a first output side line 23a and a second output side line 23b.
  • the first output side line 23a outputs a signal of the driving chip 22' to the liquid crystal panel 10;
  • the second output side line 23b inputs a signal of the liquid crystal panel 10 to the driving chip 22 '. Therefore, almost all the contacts (not shown) of the driving chip 22' are connected to the output side 211 through the plurality of output side lines 23a and the second output side line 23b to be connected to the The liquid crystal panel 10 is described.
  • FIG. 5 illustrates a top view of a third embodiment of a soft on-board chip configuration of the present invention.
  • the on-board chip structure 20'' of the third embodiment of the present invention is substantially similar to the on-board chip structure 20 of the first embodiment of the present invention, and thus the same component symbols and names are used, but the difference is that the present invention
  • the length direction of the driving chip 22 ′ of the soft-board chip structure 20 ′′ of the third embodiment is inclined at an oblique angle to the output side 211 , and the tilt angle of the driving chip 22 ′ is preferably 30 degrees. Between 60 degrees. As shown in FIG.
  • the output side line 23 of the upper side of the driving chip 22'' can be directly connected to the output side 211 in a straight line, and the driving chip 22'' is on the lower side.
  • the output side line 23 may be connected to the output side 211 in an arc shape or an L shape. Therefore, the on-chip chip structure 20 ′′ of the third embodiment of the present invention can also simplify the chip configuration 20 on the soft board. Circuit design.
  • the output side line of the driving chip on the lower side must bypass the driving chip, and the line direction is changed by 180 degrees. Connecting to the output side complicates the overall circuit design of the existing on-board chip structure.
  • the output side line 23 is preferably in a straight line or an arc Or L-shaped, thereby simplifying the circuit design of the chip-on-board configuration 20.

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Abstract

一种用于液晶面板（10）的软板上芯片构造（20），包含一软板（21）、一驱动芯片（22）及多个输出侧线路（23）。所述软板（21）设有一输出侧边（211）用以连接至液晶面板（10）。所述驱动芯片（22）设于所述软板（21）上表面，所述驱动芯片（22）的长方向与所述输出侧边（211）呈垂直或呈倾斜角。所述多个输出侧线路（23）呈一直线、弧线或L形，以连接所述驱动芯片（22）两侧的接点至所述输出侧边（211），从而简化所述软板上芯片构造（20）的电路设计。

Description

用于液晶面板的软板上芯片构造 技术领域
本发明涉及一种用于液晶面板的软板上芯片构造，特别是涉及一种驱动芯片的长方向与输出侧边呈垂直或倾斜角的软板上芯片构造。
 背景技术
液晶显示器(liquid crystal display，LCD)是利用液晶材料的特性来显示图像的一种平板显示装置(flat panel display，FPD)，其相较于其他显示装置而言更具轻薄、低驱动电压及低功耗等优点，已经成为整个消费市场上的主流产品。现今液晶显示面板的制作过程中，大致可分为前段矩阵(Array)工艺、中段成盒(Cell)工艺及后段模块化(Module)工艺。前段的矩阵工艺为生产薄膜式晶体管(TFT)基板(又称阵列基板)及彩色滤光片(CF)基板；中段成盒工艺则负责将TFT基板与CF基板组合，并两者之间注入液晶与切割合乎产品尺寸之面板；后段模块化工艺则负责将组合后的面板与背光模块、面板驱动电路、外框等做组装的工艺。
其中，LCD驱动芯片为液晶显示器的重要零组件，其主要功能是输出需要的电压至像素，以控制液晶分子的扭转程度。LCD驱动芯片分为两种：一为列于X轴的源极驱动芯片(Source Driver IC)与列于Y轴的闸极驱动芯片(Gate Driver IC)。换言之Source驱动芯片是管信号的，Gate驱动芯片则是管门闸的，对于液晶显示面板各有不同的作用。简单来说，LCD的影像是一条线一条线扫瞄下来的Gate驱动芯片是管垂直的信号，假设从最上面的一条线开始，那么就是Gate驱动芯片的第一支脚设为开，其余为关。Source驱动芯片里头是真正的信号(水平的)，它送出的信号只有第一条线的水平像素可以接受。第一条线送完信号，就换第二条线。这时Source驱动芯片的内容要换成第二线的了，然后Gate驱动芯片换成第二支脚开，其余为关，就可以把资料送到第二线。
再者，后段模块组装工艺中的驱动芯片的组装，是将上述Source驱动芯片及Gate驱动芯片经过封装后再要与LCD液晶面板组合在一起的组装工艺。LCD用驱动芯片的封装形式有许多种类，例如四边扁平封装(quad flat package, QFP)、玻璃上芯片(chip on glass，COG)、带载自动键合(tape automated bonding，TAB)及软板上芯片(chip on film，COF)等。其中，COF软板上芯片构造因具有可挠性及能提供更小的间距，因此已成为LCD驱动芯片封装工艺的主流。
请参照图1所示，图1揭示现有一种软板上芯片构造组装于一液晶面板的上视图。特别说明的是，为了说明上的方便，图1是以简化示意的方式来呈现，其中的线路数量已经过简化，并且也省略了与说明无关的细节。如图1所示，一液晶面板91的边缘连接一软板上芯片构造92，所述软板上芯片构造92包含一软板921、一驱动芯片922、多个输出侧线路923及多个输入侧线路924。所述软板921设有一输出侧边9211及一输入侧边9212，所述输出侧边9211用以连接至所述液晶面板91，而所述输入侧边9212设于对应于所述输出侧边9211的另一侧，用以连接至一电路板93。
另外，所述驱动芯片922是一Source驱动芯片，所述驱动芯片922呈一长条状且设于所述软板921的上表面，所述驱动芯片922的长方向与所述输出侧边9211约呈平行；所述多个输出侧线路923连接所述驱动芯片922长方向两侧的接点(未绘示)至所述输出侧边9211；所述多个输入侧线路924连接所述驱动芯片922长方向两侧的接点至所述输入侧边9212。
再者，所述多个输出侧线路923及所述多个输入侧线路924的箭头的方向代表信号传输的方向。其中，所述多个输入侧线路924负责将所述电路板93的信号传输至所述驱动芯片922；所述多个输出侧线路923负责将所述驱动芯片922的信号传输至所述液晶面板91。其中，所述多个输入侧线路924的走线数量较少(例如136条)，而所述多个输出侧线路923的走线数量较多(例如1102条)。因此，所述驱动芯片922靠下侧的接点只有一小部份是与所述多个输入侧线路924连接，而大部份所述驱动芯片922靠下侧的接点则与所述多个输出侧线路923连接。也就是说，所述驱动芯片922大部份靠下侧的接点需要通过所述多个输出侧线路923绕过所述驱动芯片922，并且线路走向转变180度的连接至图中上侧的所述输出侧边9211。因此，现有所述软板上芯片构造92使得整体的电路设计变得复杂。
请再参照图2所示，图2揭示现有另一种软板上芯片构造组装于一液晶面板的上视图。图2的现有另一种现有软板上芯片构造92’大致相似于图1的软板上芯片构造92，因此沿用相同的组件符号与名称，但其不同之处在于：图2的软板上芯片构造92’是一Gate驱动芯片的软板上芯片构造92’。与图1相比，图2的软板上芯片构造92’的驱动芯片922’是一Gate驱动芯片，并且所述软板上芯片构造92’只有连接至所述液晶面板91，而没有连接至所述电路板93。
另外，所述多个输出侧线路923包含第一输出侧线路923a及第二输出侧线路923b。所述第一输出侧线路923a是将所述驱动芯片922’的信号输出至所述液晶面板91；所述第二输出侧线路923b是将所述液晶面板91的信号输入至所述驱动芯片922’。因此，几乎全部的所述驱动芯片922’的接点(未绘示)都通过所述第一输出侧线路923a及所述第二输出侧线路923b连接至所述输出侧边9211以连接至所述液晶面板91。所述驱动芯片922靠下侧的所述输出侧线路923(第一输出侧线路923a及所述第二输出侧线路923b)必需绕过所述驱动芯片922’，线路走向转变180度的连接至图中上侧的所述输出侧边9211。因此，所述软板上芯片构造92’同样使得整体的电路设计变得复杂。
因此，有必要提供一种用于液晶面板的软板上芯片构造，以解决现有技术所存在的问题。
 技术问题
本发明提供一种用于液晶面板的软板上芯片构造，以解决现有技术所存在的电路设计复杂的问题。
 技术解决方案
为达上述目的，本发明提供一种用于液晶面板的软板上芯片构造，其包含：
一软板，设有一输出侧边，用以连接至一液晶面板；
一驱动芯片，呈一长条状，设于所述软板上表面，所述驱动芯片的长方向与所述输出侧边垂直；及
多个输出侧线路，连接所述驱动芯片长方向两侧的接点至所述输出侧边。
为达上述目的，本发明另提供一种用于液晶面板的软板上芯片构造，其其包含：
一软板，设有一输出侧边，用以连接至一液晶面板；
一驱动芯片，呈一长条状，设于所述软板上表面，所述驱动芯片的长方向与所述输出侧边呈一倾斜角；及
多个输出侧线路，连接所述驱动芯片长方向两侧的接点至所述输出侧边。
为达上述目的，本发明另提供一种用于液晶面板的软板上芯片构造，其特征在于：其包含：
一软板，设有一输出侧边，用以连接至一液晶面板；
一驱动芯片，呈一长条状，设于所述软板上表面，所述驱动芯片的长方向与所述输出侧边垂直或呈一倾斜角；及
多个输出侧线路，每一所述输出侧线路呈一直线、弧线或L形，连接所述驱动芯片长方向两侧的接点至所述输出侧边。
在本发明的一实施例中，每一所述输出侧线路呈一直线、弧线或L形。
在本发明的一实施例中，所述多个输出侧线路包含：第一输出侧线路，将所述驱动芯片信号输出至所述液晶面板；及第二输出侧线路，将所述液晶面板信号输入至所述驱动芯片。
在本发明的一实施例中，所述软板另包含一输入侧边，所述输入侧边设于对应于所述输出侧边的另一侧，用以连接至一电路板。
在本发明的一实施例中，所述软板另包含多个输入侧线路，连接所述驱动芯片长方向两侧的接点至所述输入侧边，每一所述输出侧线路呈直线、弧线或L形。
在本发明的一实施例中，所述倾斜角介于30度至60度之间。
因此，本发明提供一种用于液晶面板的软板上芯片构造，其驱动芯片的长方向与所述输出侧边呈垂直或倾斜角。所述多个输出侧线路呈一直线、弧线或L形，通过所述多个输出侧线路以连接所述驱动芯片两侧的接点至所述输出侧边，从而简化所述软板上芯片构造的电路设计。
 有益效果
本发明提供一种用于液晶面板的软板上芯片构造，其驱动芯片的长方向与所述输出侧边呈垂直或倾斜角。所述多个输出侧线路呈一直线、弧线或L形，通过所述多个输出侧线路以连接所述驱动芯片两侧的接点至所述输出侧边，从而简化所述软板上芯片构造的电路设计。
附图说明
图1：现有一种软板上芯片构造组装于一液晶面板的上视图。
图2：现有另一种软板上芯片构造组装于一液晶面板的上视图。
图3：本发明一种软板上芯片构造的第一实施例组装于一液晶面板的上视图。
图4：本发明一种软板上芯片构造的第二实施例组装于一液晶面板的上视图。
图5：本发明一种软板上芯片构造的第三实施例的上视图。
 本发明的最佳实施方式
为让本发明上述目的、特征及优点更明显易懂，下文特举本发明较佳实施例，并配合附图，作详细说明如下。再者，本发明所提到的方向用语，例如「上」、「下」、「前」、「后」、「左」、「右」、「内」、「外」、「侧面」等，仅是参考附加图式的方向。因此，使用的方向用语是用以说明及理解本发明，而非用以限制本发明。
请参照图3所示，图3揭示本发明一种软板上芯片构造的第一实施例组装于一液晶面板的上视图。特别说明的是，为了说明上的方便，图3是以简化示意的方式来呈现，其中的线路数量已经过简化，并且也省略了与说明无关的细节。如图3所示，一液晶面板10的边缘连接一软板上芯片构造20，所述软板上芯片构造20包含一软板21、一驱动芯片22、多个输出侧线路23及多个输入侧线路24。所述软板21设有一输出侧边211及一输入侧边212，所述输出侧边211用以连接至所述液晶面板10，而所述输入侧边212设于对应于所述输出侧边211的另一侧，用以连接至一电路板30。
另外，所述驱动芯片22是一Source驱动芯片，所述驱动芯片22呈一长条状且设于所述软板21的上表面，所述驱动芯片22的长方向与所述输出侧边211呈垂直；所述多个输出侧线路23连接所述驱动芯片22长方向两侧的接点(未绘示)至所述输出侧边211；所述多个输入侧线路24连接所述驱动芯片22长方向两侧的接点至所述输入侧边212。
再者，所述多个输出侧线路23及所述多个输入侧线路24的箭头的方向代表信号传输的方向。其中，所述多个输入侧线路24负责将所述电路板30的信号传输至所述驱动芯片22；所述多个输出侧线路23负责将所述驱动芯片22的信号传输至所述液晶面板10。其中，所述多个输入侧线路24的走线数量较少(例如136条)，而所述多个输出侧线路23的走线数量较多(例如1102条)。其中，所述多个输出侧线路23或所述多个输入侧线路24可呈一直线、弧线或L形。
在现有软板上芯片的技术中，由于驱动芯片的长方向与输出侧边平行。因此，驱动芯片靠下侧的输出侧线路必需绕过驱动芯片，线路走向转变180度的连接至输出侧边，使得软板上芯片构造整体的电路设计变得复杂。在本发明第一实施例的所述软板上芯片构造20中，由于所述驱动芯片22的长方向与所述输出侧边211垂直，并且所述输出侧线路23或所述输入侧线路24优选呈L形，从而简化所述软板上芯片构造20的电路设计。
请再参照图4所示，图4揭示本发明一种软板上芯片构造的第二实施例组装于一液晶面板的上视图。本发明第二实施例的软板上芯片构造20’大致相似于本发明第一实施例的软板上芯片构造20，因此沿用相同的组件符号与名称，但其不同之处在于：本发明第二实施例的软板上芯片构造20’是一Gate驱动芯片的软板上芯片构造20’。因此与图1相比，本发明第二实施例的软板上芯片构造20’的驱动芯片22’是一Gate驱动芯片，并且所述软板上芯片构造20’只有连接至所述液晶面板10，而没有连接至所述电路板30。另外，所述多个输出侧线路23包含第一输出侧线路23a及第二输出侧线路23b。所述第一输出侧线路23a是将所述驱动芯片22’的信号输出至所述液晶面板10；所述第二输出侧线路23b是将所述液晶面板10的信号输入至所述驱动芯片22’。因此，几乎全部的所述驱动芯片22’的接点(未绘示)都通过所述多个输出侧线路23a及所述第二输出侧线路23b连接至所述输出侧边211，以连接至所述液晶面板10。
由于，所述驱动芯片22’的长方向与所述输出侧边211垂直，并且所述输出侧线路23的所述第一输出侧线路23a及所述第二输出侧线路23b优选呈一直线、弧线或L形，从而简化所述软板上芯片构造20’的电路设计。
请再参照图5所示，图5揭示本发明一种软板上芯片构造的第三实施例的上视图。本发明第三实施例的软板上芯片构造20’’大致相似于本发明第一实施例的软板上芯片构造20，因此沿用相同的组件符号与名称，但其不同之处在于：本发明第三实施例的软板上芯片构造20’’的驱动芯片22’’的长方向与所述输出侧边211呈一倾斜角，所述驱动芯片22’’的倾斜角优选是介于30度至60度之间。如图5所示，所述驱动芯片22’’靠上侧的所述输出侧线路23可呈直线的直接连接至所述输出侧边211，所述驱动芯片22’’靠下侧的所述输出侧线路23可呈弧形或L形的连接至所述输出侧边211，因此，本发明第三实施例的软板上芯片构造20’’同样能够简化所述软板上芯片构造20的电路设计。
综上所述，相较于现有软板上芯片构造中，由于驱动芯片的长方向与输出侧边平行，驱动芯片靠下侧的输出侧线路必需绕过驱动芯片，线路走向转变180度的连接至输出侧边，使得现有软板上芯片构造整体的电路设计变得复杂。在本发明的所述软板上芯片构造20中，由于所述驱动芯片22的长方向与所述输出侧边211呈垂直或倾斜角，并且所述输出侧线路23优选呈一直线、弧线或L形，从而简化所述软板上芯片构造20的电路设计。
本发明已由上述相关实施例加以描述，然而上述实施例仅为实施本发明的范例。必需指出的是，已公开的实施例并未限制本发明的范围。相反地，包含于权利要求书的精神及范围的修改及均等设置均包括于本发明的范围内。
 本发明的实施方式
工业实用性
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Claims (16)

  1. 一种用于液晶面板的软板上芯片构造，其特征在于：其包含：
    一软板，设有一输出侧边，用以连接至一液晶面板；
    一驱动芯片，呈一长条状，设于所述软板上表面，所述驱动芯片的长方向与所述输出侧边垂直或呈一倾斜角；及
    多个输出侧线路，每一所述输出侧线路呈一直线、弧线或L形，连接所述驱动芯片长方向两侧的接点至所述输出侧边。
  2. 如权利要求1所述的用于液晶面板的软板上芯片构造，其特征在于：所述倾斜角介于30度至60度之间。
  3. 如权利要求1所述的用于液晶面板的软板上芯片构造，其特征在于：所述多个输出侧线路包含：
    第一输出侧线路，将所述驱动芯片信号输出至所述液晶面板；及
    第二输出侧线路，将所述液晶面板信号输入至所述驱动芯片。
  4. 如权利要求1所述的用于液晶面板的软板上芯片构造，其特征在于：所述软板另包含一输入侧边，所述输入侧边设于对应于所述输出侧边的另一侧，用以连接至一电路板。
  5. 如权利要求4所述的用于液晶面板的软板上芯片构造，其特征在于：所述软板另包含多个输入侧线路，连接所述驱动芯片长方向两侧的接点至所述输入侧边，每一所述输出侧线路呈直线、弧线或L形。
  6. 一种用于液晶面板的软板上芯片构造，其特征在于：其包含：
    一软板，设有一输出侧边，用以连接至一液晶面板；
    一驱动芯片，呈一长条状，设于所述软板上表面，所述驱动芯片的长方向与所述输出侧边垂直；及
    多个输出侧线路，连接所述驱动芯片长方向两侧的接点至所述输出侧边。
  7. 如权利要求6所述的用于液晶面板的软板上芯片构造，其特征在于：每一所述输出侧线路呈一直线、弧线或L形。
  8. 如权利要求7所述的用于液晶面板的软板上芯片构造，其特征在于：所述多个输出侧线路包含：
    第一输出侧线路，将所述驱动芯片信号输出至所述液晶面板；及
    第二输出侧线路，将所述液晶面板信号输入至所述驱动芯片。
  9. 如权利要求6所述的用于液晶面板的软板上芯片构造，其特征在于：所述软板另包含一输入侧边，所述输入侧边设于对应于所述输出侧边的另一侧，用以连接至一电路板。
  10. 如权利要求9所述的用于液晶面板的软板上芯片构造，其特征在于：所述软板另包含多个输入侧线路，连接所述驱动芯片长方向两侧的接点至所述输入侧边，每一所述输出侧线路呈直线、弧线或L形。
  11. 一种用于液晶面板的软板上芯片构造，其特征在于：其包含：
    一软板，设有一输出侧边，用以连接至一液晶面板；
    一驱动芯片，呈一长条状，设于所述软板上表面，所述驱动芯片的长方向与所述输出侧边呈一倾斜角；及
    多个输出侧线路，连接所述驱动芯片长方向两侧的接点至所述输出侧边。
  12. 如权利要求11所述的用于液晶面板的软板上芯片构造，其特征在于：所述倾斜角介于30度至60度之间。
  13. 如权利要求11所述的用于液晶面板的软板上芯片构造，其特征在于：每一所述输出侧线路呈一直线、弧线或L形。
  14. 如权利要求13所述的用于液晶面板的软板上芯片构造，其特征在于：所述多个输出侧线路包含：
    第一输出侧线路，将所述驱动芯片信号输出至所述液晶面板；及
    第二输出侧线路，将所述液晶面板信号输入至所述驱动芯片。
  15. 如权利要求11所述的用于液晶面板的软板上芯片构造，其特征在于：所述软板另包含：
    一输入侧边，所述输入侧边设于对应于所述输出侧边的另一侧，用以连接至一电路板。
  16. 如权利要求15所述的用于液晶面板的软板上芯片构造，其特征在于：所述软板另包含多个输入侧线路，连接所述驱动芯片长方向两侧的接点至所述输入侧边，每一所述输出侧线路呈直线、弧线或L形。
PCT/CN2011/077023 2011-06-16 2011-07-11 用于液晶面板的软板上芯片构造 WO2012171237A1 (zh)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20150017124A (ko) * 2013-08-06 2015-02-16 삼성디스플레이 주식회사 회로기판 및 이를 구비한 표시장치

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102508371B (zh) * 2011-12-01 2014-05-21 深圳市华星光电技术有限公司 液晶面板的软板上芯片构造的卷带基板
WO2015087498A1 (ja) * 2013-12-11 2015-06-18 パナソニック株式会社 表示装置
KR102454976B1 (ko) 2017-12-19 2022-10-18 삼성디스플레이 주식회사 곡면표시모듈 및 이를 갖는 곡면표시장치
KR102652758B1 (ko) 2018-07-06 2024-04-02 삼성디스플레이 주식회사 표시 장치 및 표시 장치의 제조 방법

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07253591A (ja) * 1995-03-22 1995-10-03 Seiko Epson Corp 液晶パネル駆動用ｉｃ
JPH11297760A (ja) * 1998-04-08 1999-10-29 Seiko Epson Corp 半導体チップ、その実装構造および液晶表示装置
CN1770438A (zh) * 2004-09-22 2006-05-10 夏普株式会社 半导体装置、柔性基板、带载体和具备半导体装置的电子设备
CN202102197U (zh) * 2011-06-16 2012-01-04 深圳市华星光电技术有限公司 用于液晶面板的软板上芯片构造

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07253591A (ja) * 1995-03-22 1995-10-03 Seiko Epson Corp 液晶パネル駆動用ｉｃ
JPH11297760A (ja) * 1998-04-08 1999-10-29 Seiko Epson Corp 半導体チップ、その実装構造および液晶表示装置
CN1770438A (zh) * 2004-09-22 2006-05-10 夏普株式会社 半导体装置、柔性基板、带载体和具备半导体装置的电子设备
CN202102197U (zh) * 2011-06-16 2012-01-04 深圳市华星光电技术有限公司 用于液晶面板的软板上芯片构造

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20150017124A (ko) * 2013-08-06 2015-02-16 삼성디스플레이 주식회사 회로기판 및 이를 구비한 표시장치
KR102096562B1 (ko) * 2013-08-06 2020-04-03 삼성디스플레이 주식회사 회로기판 및 이를 구비한 표시장치

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