WO2013071578A1 - 用于液晶面板的薄膜上芯片构造 - Google Patents

用于液晶面板的薄膜上芯片构造 Download PDF

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Publication number
WO2013071578A1
WO2013071578A1 PCT/CN2011/082735 CN2011082735W WO2013071578A1 WO 2013071578 A1 WO2013071578 A1 WO 2013071578A1 CN 2011082735 W CN2011082735 W CN 2011082735W WO 2013071578 A1 WO2013071578 A1 WO 2013071578A1
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Prior art keywords
bonding portion
wire bonding
board
chip structure
output side
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PCT/CN2011/082735
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English (en)
French (fr)
Inventor
陈世烽
施明宏
李蒙
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深圳市华星光电技术有限公司
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Priority to US13/380,012 priority Critical patent/US8665407B2/en
Publication of WO2013071578A1 publication Critical patent/WO2013071578A1/zh

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    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1345—Conductors connecting electrodes to cell terminals
    • G02F1/13452—Conductors connecting driver circuitry and terminals of panels
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/4985—Flexible insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • the present invention relates to a soft on-board chip structure for a liquid crystal panel, and more particularly to a soft on-board chip structure for reducing the height of a fan-out line.
  • Liquid crystal display Display LCD
  • LCD Liquid crystal display Display
  • FPD liquid crystal display
  • the matrix process in the previous stage is to produce a thin film transistor (TFT) substrate (also called an array substrate) and a color filter (CF) substrate;
  • TFT thin film transistor
  • CF color filter
  • the middle segment forming process is responsible for combining the TFT substrate and the CF substrate, and injecting liquid crystal between the two.
  • the rear-end modular process is responsible for assembling the assembled panel with the backlight module, the panel driving circuit, the outer frame, and the like.
  • the assembly of the driving chip in the assembly process of the rear module is an assembly process of combining the driving chip and the LCD liquid crystal panel.
  • packaging chips for LCD driver chips such as quad flat package (quad) Flat package, QFP), chip on glass (COG), tape automated bonding (tape automated) Bonding, TAB) and chip on chip (chip on Film, COF), etc.
  • the COF soft on-board chip structure has become the mainstream of the LCD driver chip packaging process because of its flexibility and ability to provide a smaller pitch.
  • FIG. 1 discloses a top view of a conventional soft board chip structure. It is specifically noted that, for convenience of explanation, FIG. 1 is presented in a simplified schematic manner in which the number of lines has been simplified, and details not related to the description are also omitted.
  • the chip structure of a flexible panel of a liquid crystal panel includes a flexible board 90, an output side 91, a wire-cutting portion 92, and a fan-out line portion 93.
  • the output side 91 is disposed on one side of the flexible board 90 for connecting to a liquid crystal panel (not shown).
  • the wire bonding portion 92 has a plurality of elongated lead pieces (not shown), which are disposed on the soft board 90 and located at the center of the soft board 90, and the plurality of lead lines 92 are led.
  • the longitudinal direction of the foot piece is perpendicular to the output side edge 91.
  • the fanout line portion 93 has a plurality of lines in a fan shape, and connects one end of the pin piece of the wire bonding portion 92 to the output side 91, respectively.
  • the wire bonding portion 92 is electrically connected to a driving chip (not shown).
  • the wire bonding portion 92 is further provided with a wire alignment mark 94 on both sides. Since the fan-out line portion 93 is located on both sides, a large height D is reserved for wiring. Therefore, on the one hand, this occupies a space available for the fan-out line portion 93, and on the other hand, the height of the fan-out line portion 93 is increased, which is disadvantageous for the design of the narrowing of the frame of the liquid crystal panel.
  • the present invention provides a soft on-board chip structure for a liquid crystal panel to solve the problem of an increase in the fan-out line height existing in the prior art.
  • the invention provides a soft on-board chip structure for a liquid crystal panel, and the on-board chip structure comprises:
  • a flexible board having an output side connected to a liquid crystal panel
  • first wire bonding portion having a plurality of elongated pin pieces disposed on the flexible board at a center of the flexible board, and a longitudinal direction of the plurality of lead pieces of the first wire bonding portion Vertical to the output side;
  • a second wire bonding portion having a plurality of elongated strips disposed on the flexible board on both sides of the first wire bonding portion, and the pin portions of the second wire bonding portion
  • the long direction is parallel to the output side
  • a fan-out line portion having a plurality of lines in a fan shape, respectively connected to one end of the pin piece of the first wire portion to the output side;
  • the two array line portions have a plurality of lines in a corner shape, and are respectively connected to one end of the lead piece of the second wire portion to the output side.
  • a wire alignment mark is further disposed between the first wire bonding portion and the second wire bonding portion.
  • the width of the second wire bonding portion is approximately equal to the length of the first wire bonding portion.
  • the first wire bonding portion and the second wire bonding portion are electrically connected to a driving chip.
  • the lines of the array line portion are at a corner angle.
  • the line of the array line portion has a circular arc angle.
  • the flexible board further includes an input side, and the input side is disposed on the other side corresponding to the output side for connecting to a circuit board.
  • the present invention further provides a chip-on-board configuration, the board-on-board configuration comprising:
  • first wire bonding portion having a plurality of elongated pin pieces disposed on the flexible board at a center of the flexible board, and a longitudinal direction of the plurality of lead pieces of the first wire bonding portion Vertical to the output side;
  • a second wire bonding portion having a plurality of elongated strips disposed on the flexible board on both sides of the first wire bonding portion, and the pin portions of the second wire bonding portion
  • the long direction is parallel to the output side
  • a driving chip is disposed at a center of the flexible board and electrically connected to the first wire bonding portion and the second wire bonding portion;
  • a fan-out line portion having a plurality of lines in a fan shape, respectively connected to one end of the pin piece of the first wire portion to the output side;
  • the two array line portions have a plurality of lines in a corner shape, and are respectively connected to one end of the lead piece of the second wire portion to the output side.
  • a wire alignment mark is further disposed between the first wire bonding portion and the second wire bonding portion.
  • the width of the second wire bonding portion is approximately equal to the length of the first wire bonding portion.
  • the first wire bonding portion and the second wire bonding portion are electrically connected to a driving chip.
  • the lines of the array line portion are at a corner angle.
  • the line of the array line portion has a circular arc angle.
  • the present invention provides a soft on-board chip structure for a liquid crystal panel, which can reduce the fan-out by designing a turn line parallel to the second wire portion of the output side and the array line portion The height of the line portion is conducive to the design trend of narrowing the frame of the liquid crystal panel.
  • Figure 1 A top view of a prior art on-board chip configuration.
  • Figure 2 is a top plan view of a preferred embodiment of a soft on-board configuration of the present invention.
  • FIG. 2 is a top view of a preferred embodiment of a soft on-board chip structure of the present invention. It is specifically noted that, for convenience of explanation, FIG. 2 is presented in a simplified schematic manner in which the number of lines has been simplified, and details not related to the description are also omitted.
  • the chip structure of a flexible panel of a liquid crystal panel includes a flexible board 10, an output side 11, a first line portion 12a, two second line portions 12b, and a fan-out line portion 13a. Two array line portions 13b.
  • the output side 11 is disposed on one side of the flexible board 10 for connecting to a liquid crystal panel (not shown).
  • the first wire-bonding portion 12a has a plurality of elongated strips (not labeled) disposed on the flexible board 10 and located at the center of the flexible board 10, The longitudinal direction of the plurality of lead pieces of the first wire portion 12a is perpendicular to the output side 11.
  • the second wire-bonding portion 12b has a plurality of elongated lead pieces (not labeled) disposed on the flexible board 10 and located on both sides of the first wire-bonding portion 13a. The longitudinal direction of the lead piece of the second wire bonding portion 12b is parallel to the output side edge 11.
  • the fan-out line portion 13a has a plurality of lines in a fan shape, and connects one end of the lead piece of the first wire-bonding portion 12a to the output side 11 respectively;
  • the array line portion 13b has a plurality of The strip lines are angularly connected to one end of the lead piece of the second wire-bonding portion 12b to the output side edge 11, respectively.
  • the chip structure on the soft board can be Reducing the height of the fan-out line portion 13a is advantageous for the design of the narrowing of the frame of the liquid crystal panel.
  • the first wire bonding portion 12a and the second wire bonding portion 12b are electrically connected to a driving chip (not shown).
  • the driving chip is disposed at a center of the flexible board, and is electrically connected to the first wire bonding portion 12a and the second wire bonding portion 12b by wire bonding or flip chip bonding.
  • a wire alignment mark 14 is further disposed between the first wire bonding portion 12a and the second wire bonding portion 12b to facilitate alignment of the driving chip.
  • the width of the second wire-bonding portion 12b is approximately equal to the length of the first wire-bonding portion 12a.
  • the line of the array line portion 13b is at a corner angle (as shown in FIG. 2); or the line of the array line portion 13b may be in a circular arc angle.
  • the flexible board 10 can include an input side (not shown), and the input side is disposed on the other side corresponding to the output side for connecting to A circuit board (not shown).
  • the first wire bonding portion 12a is disposed at the center of the flexible board 10, and the longitudinal direction of the pin pieces of the first wire bonding portion 12a is perpendicular to the
  • the output side 11 is connected to one end of the first wire-bonding portion 12a to the output side 11; the second wire-bonding portion 12b is disposed on the first wire-bonding portion 12a.
  • the longitudinal direction of the lead piece of the second wire-bonding portion 12b is parallel to the output side 11, and the array line portion 13b is connected to one end of the pin piece of the second wire-bonding portion 12b.
  • the output side 11 is described.
  • the present invention can reduce the height of the fan-out line portion by the design of the turning line parallel to the second wire-bonding portion 12b of the output side 11 and the array line portion 13b, which is advantageous for narrowing the frame of the liquid crystal panel.
  • the design momentum is advantageous for narrowing the frame of the liquid crystal panel.

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  • Physics & Mathematics (AREA)
  • Nonlinear Science (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Chemical & Material Sciences (AREA)
  • Mathematical Physics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Engineering & Computer Science (AREA)
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Abstract

一种用于液晶面板的薄膜上芯片构造，其包含设有输出侧边（11）的薄膜（10）、第一打线部（12a）、第二打线部（12b）、扇出线路部（13a）及阵列线路部（13b）。第一打线部（12a）的引脚片的长方向垂直于输出侧边（11），扇出线路部（13a）连接第一打线部（12a）的一端至输出侧边（11）；第二打线部（12b）的引脚片的长方向平行于输出侧边（11），阵列线路部（13b）连接第二打线部（12b）的引脚片的一端至输出侧边（11）。通过平行于输出侧边（11）的第二打线部（12b）及阵列线路部（13b）的转弯线路设计，可降低所述扇出线路部（13b）的高度，有利于液晶面板边框细窄化的设计。

Description

[根据细则37.2由ISA制定的发明名称]　用于液晶面板的薄膜上芯片构造 技术领域
本发明涉及一种用于液晶面板的软板上芯片构造，特别是涉及一种减少扇出线路高度的软板上芯片构造。
 背景技术
液晶显示器(liquid crystal display，LCD)是利用液晶材料的特性来显示图像的一种平板显示装置(flat panel display，FPD)，其相较于其它显示装置而言更具轻薄、低驱动电压及低功耗等优点，已经成为整个消费市场上的主流产品。现今液晶显示面板的制作过程中，大致可分为前段矩阵(Array)工艺、中段成盒(Cell)工艺及后段模块化(Module)工艺。前段的矩阵工艺为生产薄膜式晶体管(TFT)基板(又称阵列基板)及彩色滤光片(CF)基板；中段成盒工艺则负责将TFT基板与CF基板组合，并两者之间注入液晶与切割合乎产品尺寸之面板；后段模块化工艺则负责将组合后的面板与背光模块、面板驱动电路、外框等做组装的工艺。
其中，后段模块组装工艺中的驱动芯片的组装，是将驱动芯片与LCD液晶面板组合在一起的组装工艺。LCD用驱动芯片的封装形式有许多种类，例如四边扁平封装(quad flat package, QFP)、玻璃上芯片(chip on glass，COG)、带载自动键合(tape automated bonding，TAB)及软板上芯片(chip on film，COF)等。其中，COF软板上芯片构造因具有可挠性及能提供更小的间距，因此已成为LCD驱动芯片封装工艺的主流。
请参照图1所示，图1揭示现有一种软板上芯片构造的上视图。特别说明的是，为了说明上的方便，图1是以简化示意的方式来呈现，其中的线路数量已经过简化，并且也省略了与说明无关的细节。如图1所示，一液晶面板的软板上芯片构造包含一软板90、一输出侧边91、一打线部92及一扇出线路部93。其中，所述输出侧边91设于所述软板90的一侧边，用以连接至一液晶面板(未绘示)。所述打线部92具有多个长条状的引脚片(未标示)，设于所述软板90上，并位于所述软板90的中央，所述打线部92的多个引脚片的长方向垂直于所述输出侧边91。所述扇出(fanout)线路部93具有多条线路呈扇形状，分别连接所述打线部92的引脚片的一端至所述输出侧边91。另外，所述打线部92电性连接至一驱动芯片(未绘示)。
如图1所示，所述打线部92的两侧还设有打线对位标记94。由于所述扇出线路部93靠两侧位置需预留较大高度D用于布线。因此，一方面这会占用所述扇出线路部93可用的空间，另一方面更使得所述扇出线路部93高度增加，不利于液晶面板边框细窄化的设计势头。
因此，有必要提供一种用于液晶面板的软板上芯片构造，以解决现有技术所存在的问题。
 技术问题
本发明提供一种用于液晶面板的软板上芯片构造，以解决现有技术所存在的扇出线路高度增加的问题。
 技术解决方案
本发明提供一种用于液晶面板的软板上芯片构造，所述软板上芯片构造包含：
一软板，设有一输出侧边，连接至一液晶面板；
一第一打线部，具有多个长条状的引脚片，设于所述软板上，位于所述软板的中央，所述第一打线部的多个引脚片的长方向垂直于所述输出侧边；
二第二打线部，具有多个长条状的引脚片，设于所述软板上，位于所述第一打线部的两侧，所述第二打线部的引脚片的长方向平行于所述输出侧边；
一扇出线路部，具有多条线路呈扇形状，分别连接所述第一打线部的引脚片的一端至所述输出侧边；及
二阵列线路部，具有多条线路呈转角状，分别连接所述第二打线部的引脚片的一端至所述输出侧边。
在本发明的一实施例中，所述第一打线部及所述第二打线部之间还设有打线对位标记。
在本发明的一实施例中，所述第二打线部的宽度约等于所述第一打线部的长度。
在本发明的一实施例中，所述第一打线部及所述第二打线部电性连接至一驱动芯片。
在本发明的一实施例中，所述阵列线路部的线路呈切角转角。
在本发明的一实施例中，所述阵列线路部的线路呈圆弧转角。
在本发明的一实施例中，所述软板另包含一输入侧边，所述输入侧边设于对应于所述输出侧边的另一侧，用以连接至一电路板。
为达上述目的，本发明另提供一种用软板上芯片构造，所述软板上芯片构造包含：
一软板，设有一输出侧边；
一第一打线部，具有多个长条状的引脚片，设于所述软板上，位于所述软板的中央，所述第一打线部的多个引脚片的长方向垂直于所述输出侧边；
二第二打线部，具有多个长条状的引脚片，设于所述软板上，位于所述第一打线部的两侧，所述第二打线部的引脚片的长方向平行于所述输出侧边；
一驱动芯片，设于所述软板的中央，电性连接至所述第一打线部及所述第二打线部上；
一扇出线路部，具有多条线路呈扇形状，分别连接所述第一打线部的引脚片的一端至所述输出侧边；及
二阵列线路部，具有多条线路呈转角状，分别连接所述第二打线部的引脚片的一端至所述输出侧边。
在本发明的一实施例中，所述第一打线部及所述第二打线部之间还设有打线对位标记。
在本发明的一实施例中，所述第二打线部的宽度约等于所述第一打线部的长度。
在本发明的一实施例中，所述第一打线部及所述第二打线部电性连接至一驱动芯片。
在本发明的一实施例中，所述阵列线路部的线路呈切角转角。
在本发明的一实施例中，所述阵列线路部的线路呈圆弧转角。
 有益效果
本发明提供一种用于液晶面板的软板上芯片构造，其通过平行于所述输出侧边的所述第二打线部及所述阵列线路部的转弯线路设计，可降低所述扇出线路部的高度，有利于液晶面板边框细窄化的设计势头。
 附图说明
图1：现有一种软板上芯片构造的上视图。
图2：本发明一种软板上芯片构造的较佳实施例的上视图。
 本发明的最佳实施方式
为让本发明上述目的、特征及优点更明显易懂，下文特举本发明较佳实施例，并配合附图，作详细说明如下。再者，本发明所提到的方向用语，例如「上」、「下」、「前」、「后」、「左」、「右」、「内」、「外」、「侧面」等，仅是参考附加图式的方向。因此，使用的方向用语是用以说明及理解本发明，而非用以限制本发明。
请参照图2所示，图2揭示本发明一种软板上芯片构造的较佳实施例的上视图。特别说明的是，为了说明上的方便，图2是以简化示意的方式来呈现，其中的线路数量已经过简化，并且也省略了与说明无关的细节。如图2所示，一液晶面板的软板上芯片构造包含一软板10、一输出侧边11、一第一打线部12a、二第二打线部12b、一扇出线路部13a及二阵列线路部13b。其中，所述输出侧边11设于所述软板10的一侧边上，用于连接至一液晶面板(未绘示)。
如图2所示，所述第一打线部12a具有多个长条状的引脚片(未标示)，设于所述软板10上，并位于所述软板10的中央，所述第一打线部12a的多个引脚片的长方向垂直于所述输出侧边11。另外，所述第二打线部12b具有多个长条状的引脚片(未标示)，设于所述软板10上，并位于所述第一打线部13a的两侧，所述第二打线部12b的引脚片的长方向平行于所述输出侧边11。
再者，所述扇出线路部13a具有多条线路呈扇形状，分别连接所述第一打线部12a的引脚片的一端至所述输出侧边11；所述阵列线路部13b具有多条线路呈转角状，分别连接所述第二打线部12b的引脚片的一端至所述输出侧边11。
本发明由于所述软板10两侧位置的所述第二打线部12b可通过所述阵列线路部13b的转弯线路而连接至所述输出侧边11，因此所述软板上芯片构造可降低所述扇出线路部13a的高度，有利于液晶面板边框细窄化的设计势头。
优选的，所述第一打线部12a及所述第二打线部12b用于电性连接一驱动芯片(未绘示)。所述驱动芯片设于所述软板的中央，通过打线或倒装芯片的方式与所述第一打线部12a及所述第二打线部12b电性连接。
优选的，所述第一打线部12a及所述第二打线部12b之间还设有打线对位标记14，以便于所述驱动芯片的对位。
优选的，所述第二打线部12b的宽度约等于所述第一打线部12a的长度。
优选的，所述阵列线路部13b的线路呈切角转角(如图2所示)；或者所述阵列线路部13b的线路可呈圆弧转角的方式。
再者，在另一实施例中，所述软板10可包含一输入侧边(未绘示)，所述输入侧边设于对应于所述输出侧边的另一侧，用以连接至一电路板(未绘示)。
综上所述，相较于现有软板上芯片构造中，由于扇出线路部靠两侧位置需预留较大高度用于布线。因此占用所述扇出线路部可用的空间，并使得所述扇出线路部的高度增加，不利于液晶面板边框细窄化的设计势头。在本发明的所述软板上芯片构造10中，所述第一打线部12a设于所述软板10中央，所述第一打线部12a的引脚片的长方向垂直于所述输出侧边11，所述扇出线路部13a连接所述第一打线部12a的一端至所述输出侧边11；所述第二打线部12b设于所述第一打线部12a的两侧，所述第二打线部12b的引脚片的长方向平行于所述输出侧边11，所述阵列线路部13b连接所述第二打线部12b的引脚片的一端至所述输出侧边11。本发明通过平行于所述输出侧边11的所述第二打线部12b及所述阵列线路部13b的转弯线路设计，可降低所述扇出线路部的高度，有利于液晶面板边框细窄化的设计势头。
本发明已由上述相关实施例加以描述，然而上述实施例仅为实施本发明的范例。必需指出的是，已公开的实施例并未限制本发明的范围。相反地，包含于权利要求书的精神及范围的修改及均等设置均包括于本发明的范围内。
 本发明的实施方式
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Claims (13)

  1. 一种用于液晶面板的软板上芯片构造，其特征在于：所述软板上芯片构造包含：
    一软板，设有一输出侧边，连接至一液晶面板；
    一第一打线部，具有多个长条状的引脚片，设于所述软板上，位于所述软板的中央，所述第一打线部的多个引脚片的长方向垂直于所述输出侧边；
    二第二打线部，具有多个长条状的引脚片，设于所述软板上，位于所述第一打线部的两侧，所述第二打线部的引脚片的长方向平行于所述输出侧边；
    一扇出线路部，具有多条线路呈扇形状，分别连接所述第一打线部的引脚片的一端至所述输出侧边；及
    二阵列线路部，具有多条线路呈转角状，分别连接所述第二打线部的引脚片的一端至所述输出侧边。
  2. 如权利要求1所述的用于液晶面板的软板上芯片构造，其特征在于：所述第一打线部及所述第二打线部之间还设有打线对位标记。
  3. 如权利要求1所述的用于液晶面板的软板上芯片构造，其特征在于：所述第二打线部的宽度约等于所述第一打线部的长度。
  4. 如权利要求1所述的用于液晶面板的软板上芯片构造，其特征在于：所述第一打线部及所述第二打线部电性连接至一驱动芯片。
  5. 如权利要求1所述的用于液晶面板的软板上芯片构造，其特征在于：所述阵列线路部的线路呈切角转角。
  6. 如权利要求1所述的用于液晶面板的软板上芯片构造，其特征在于：所述阵列线路部的线路呈圆弧转角。
  7. 如权利要求1所述的用于液晶面板的软板上芯片构造，其特征在于：所述软板另包含一输入侧边，所述输入侧边设于对应于所述输出侧边的另一侧，用以连接至一电路板。
  8. 一种软板上芯片构造，其特征在于：所述软板上芯片构造包含：
    一软板，设有一输出侧边；
    一第一打线部，具有多个长条状的引脚片，设于所述软板上，位于所述软板的中央，所述第一打线部的多个引脚片的长方向垂直于所述输出侧边；
    二第二打线部，具有多个长条状的引脚片，设于所述软板上，位于所述第一打线部的两侧，所述第二打线部的引脚片的长方向平行于所述输出侧边；
    一驱动芯片，设于所述软板的中央，电性连接至所述第一打线部及所述第二打线部上；
    一扇出线路部，具有多条线路呈扇形状，分别连接所述第一打线部的引脚片的一端至所述输出侧边；及
    二阵列线路部，具有多条线路呈转角状，分别连接所述第二打线部的引脚片的一端至所述输出侧边。
  9. 如权利要求8所述的软板上芯片构造，其特征在于：所述第一打线部及所述第二打线部之间还设有打线对位标记。
  10. 如权利要求8所述的软板上芯片构造，其特征在于：所述第二打线部的宽度约等于所述第一打线部的长度。
  11. 如权利要求8所述的软板上芯片构造，其特征在于：所述第一打线部及所述第二打线部电性连接至一驱动芯片。
  12. 如权利要求8所述的软板上芯片构造，其特征在于：所述阵列线路部的线路呈切角转角。
  13. 如权利要求8所述的软板上芯片构造，其特征在于：所述阵列线路部的线路呈圆弧转角。
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