WO2020124765A1 - 柔性显示装置 - Google Patents

柔性显示装置 Download PDF

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Publication number
WO2020124765A1
WO2020124765A1 PCT/CN2019/075508 CN2019075508W WO2020124765A1 WO 2020124765 A1 WO2020124765 A1 WO 2020124765A1 CN 2019075508 W CN2019075508 W CN 2019075508W WO 2020124765 A1 WO2020124765 A1 WO 2020124765A1
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WO
WIPO (PCT)
Prior art keywords
binding
flexible display
area
display device
display panel
Prior art date
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PCT/CN2019/075508
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English (en)
French (fr)
Inventor
徐彬
许红玉
Original Assignee
武汉华星光电半导体显示技术有限公司
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Publication date
Application filed by 武汉华星光电半导体显示技术有限公司 filed Critical 武汉华星光电半导体显示技术有限公司
Priority to US16/471,915 priority Critical patent/US11411058B2/en
Publication of WO2020124765A1 publication Critical patent/WO2020124765A1/zh

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Classifications

    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G09F9/301—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements flexible foldable or roll-able electronic displays, e.g. thin LCD, OLED
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/147—Structural association of two or more printed circuits at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0277—Bendability or stretchability details
    • H05K1/028—Bending or folding regions of flexible printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0277—Bendability or stretchability details
    • H05K1/028—Bending or folding regions of flexible printed circuits
    • H05K1/0281—Reinforcement details thereof
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0154—Polyimide
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/04—Assemblies of printed circuits
    • H05K2201/042—Stacked spaced PCBs; Planar parts of folded flexible circuits having mounted components in between or spaced from each other
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/05—Flexible printed circuits [FPCs]
    • H05K2201/053—Tails
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/05—Flexible printed circuits [FPCs]
    • H05K2201/055—Folded back on itself
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/05—Flexible printed circuits [FPCs]
    • H05K2201/058—Direct connection between two or more FPCs or between flexible parts of rigid PCBs
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09081—Tongue or tail integrated in planar structure, e.g. obtained by cutting from the planar structure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10128—Display
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits
    • H05K3/365—Assembling flexible printed circuits with other printed circuits by abutting, i.e. without alloying process
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K2102/00—Constructional details relating to the organic devices covered by this subclass
    • H10K2102/301—Details of OLEDs
    • H10K2102/311—Flexible OLED
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
    • H10K77/10—Substrates, e.g. flexible substrates
    • H10K77/111—Flexible substrates

Definitions

  • the invention relates to the field of display technology, in particular to a flexible display device.
  • the existing flat display devices on the market include liquid crystal display devices (Liquid Crystal Display, LCD) and organic light emitting diodes (organic light emitting diodes) diode, OLED) display.
  • LCD Liquid Crystal Display
  • OLED organic light emitting diodes
  • LCD liquid crystal display
  • OLED organic light emitting diodes
  • the next-generation display technology which is considered to have great potential, has begun to gradually replace traditional LCD monitors and is widely used in mobile phone screens, computer monitors, and full-color TVs.
  • Existing flat panel displays generally include a display panel (Panel) and an external circuit.
  • an external circuit such as a flexible circuit board (Free Pascal Compiler (FPC), Chip On Film (COF), connected to the outer lead bonding (OLB) area of the panel through leads, and the electrical connection between the external circuit and the OLB area of the display panel is through Bonding (Bonding) process connection, to achieve the drive signal to each signal line in the display panel.
  • FPC Free Pascal Compiler
  • COF Chip On Film
  • FIG. 1 is a schematic diagram of a planar structure of an existing flexible OLED display, including a flexible OLED panel 100 and a COF 200 bound to the flexible OLED panel 100, wherein a binding area 110 is provided at the lower end of the flexible OLED panel 100, the COF 200 and the flexible OLED panel 100 As shown in FIG. 2, the binding area 110 of the flexible OLED panel 100 bends toward the back of the flexible OLED panel 100 through the bending area 120 and is located on the back of the display area 130 to reduce The width of the border of the display device improves the screen ratio. Specifically, as shown in FIG.
  • the COF 200 has a plurality of connection pins 250 provided on the upper edge thereof and a plurality of binding terminals provided on the lowermost edge of the binding area 110 in one-to-one correspondence to form a binding
  • the minimum binding terminal spacing required for the binding area 110 is limited. Therefore, it can be predicted that as the resolution (PPI) of the display panel becomes higher and higher, the width of the connection area between the binding area 110 and the COF 200 at the lower end of the display panel needs to be wider and wider, but the actual display width does not change much, which limits The width of the binding area 110 at the lower end of the display panel.
  • the object of the present invention is to provide a flexible display device, which can increase the number of connection pins accordingly while ensuring the binding accuracy and not increasing the width of the binding area, thereby facilitating high-resolution display of the flexible display device.
  • the present invention provides a flexible display device, which includes a flexible display panel and a flip-chip film bound to the flexible display panel;
  • the flexible display panel is divided into a display area, a binding area on one side of the display area, and a bending area between the display area and the binding area;
  • the flip chip includes a main body part and two expansion binding parts respectively provided perpendicularly on both ends of one side of the main body part;
  • connection pins are arranged on one edge of the main body part adjacent to the two expansion binding parts and the two expansion binding parts;
  • the flip chip is bound to the binding area of the flexible display panel through the plurality of connection pins.
  • the two extended binding parts are respectively bound to the two edges of the connecting bending zone opposite to the binding zone.
  • the two extended binding portions are respectively attached to the two sides of the opposite connecting bending area of the binding area.
  • the two extended binding portions extend respectively above the bending area along two opposite edges of the connecting connection bending area of the binding area, so as to be attached to the binding area and the bending area;
  • each expansion binding part correspondingly attached to the bending area is bent together with the bending area.
  • the flexible display device further includes a flexible circuit board electrically connected to the flip chip.
  • a drive chip electrically connected to the plurality of connection pins is provided on the main body of the flip chip.
  • the flexible display panel includes a flexible substrate and a plurality of binding terminals provided on the flexible substrate corresponding to the binding area;
  • the plurality of binding terminals and the plurality of connection pins are provided in one-to-one correspondence;
  • the flexible display panel is bound to the flip chip through the plurality of binding terminals.
  • the flexible substrate is a polyimide substrate.
  • the flexible display panel is an OLED display panel.
  • the flip chip is bound and connected to the binding area of the flexible display panel through an anisotropic conductive adhesive.
  • the flexible display device of the present invention includes a flexible display panel and a flip-chip film bound to the flexible display panel.
  • the flexible display panel is divided into a display area, a binding area and a bending area
  • the flip-chip film includes a main body part and two expansion binding parts respectively provided perpendicularly on two ends of one side of the main body part, an edge of the main body part adjacent to the two expansion binding parts and the two expansion binding parts
  • a plurality of connection pins are provided on the fixed portion, and the flip-chip film is bound to the binding area of the flexible display panel through the plurality of connection pins.
  • the present invention changes the shape of the flip-chip film on its main body
  • the two sides of the side are added with expansion binding parts, and the existing flip chip is only connected to the edge layout connection pin of one side of the binding area to the three side edge layout connection pin of the corresponding bonding area, to ensure the binding accuracy and Without increasing the width of the binding area, the number of connecting pins can be increased accordingly, thereby facilitating high-resolution display of the flexible display device.
  • FIG. 1 is a schematic plan view of a conventional flexible OLED display
  • FIG. 2 is a schematic side view of the flexible OLED display of FIG. 1;
  • FIG. 3 is a partially enlarged schematic view of the COF and the binding area in the flexible OLED display of FIG. 1;
  • FIG. 4 is a schematic plan view of the first embodiment of the flexible display device of the present invention.
  • FIG. 5 is a schematic side view of the first embodiment of the flexible display device of the present invention.
  • FIG. 6 is a partially enlarged schematic view of the flip chip and the binding area in the first embodiment of the flexible display device of the present invention
  • FIG. 7 is a schematic view of the structure of a flip chip in the first embodiment of the flexible display device of the present invention.
  • FIG. 8 is a schematic plan view of a second embodiment of the flexible display device of the present invention.
  • FIG. 9 is a schematic side view of a second embodiment of the flexible display device of the present invention.
  • the first embodiment of the flexible display device of the present invention includes a flexible display panel 1 , And the flexible display panel 1 Flip chip 2 And with the flip chip 2 Electrically connected flexible circuit board 3 .
  • the flexible display panel 1 Display area 11 , Located in the display area 11 Binding zone 12 And in the display area 11 Binding zone 12 Bending zone 13 .
  • the flip chip 2 Including main body twenty one And each is vertically arranged on the main body twenty one Two expansion binding parts on one side and two ends twenty two .
  • the main body twenty one With the two expansion binding department twenty two The adjacent one side edge and the two expansion binding parts twenty two Multiple connection pins 25 ;
  • the flip chip 2 Through the multiple connection pins 25 With the flexible display panel 1 Binding zone 12 Binding.
  • the two expansion binding parts twenty two Corresponding to the binding zone 12 Relative connection bending zone 13 The edges of the two sides are bound.
  • the flip chip 2 Main body twenty one There are multiple connection pins on the 25 Electrically connected driver chip 26 .
  • the flexible display panel 1 for OLED Display panel including flexible substrate 10 , Corresponding to the binding zone 12 Located on the flexible substrate 10 Multiple binding terminals on 15 , On flexible substrates 10 Corresponding to the display area 11 Successively set TFT (Thin Film Transistor) Array Layer 17 and OLED Device layer and corresponding bonding area 12 And bending zone 13 The set electrical connection to the plurality of binding terminals 15 and TFT Array layer 17 Circuit traces.
  • the flexible display panel 1 Of the back is a flexible substrate 10 keep away TFT On one side of the array layer, the flexible display panel 1 The front side is the side opposite to the back side.
  • the binding area 12 By turning the bending zone 13 Bend to the display area 11
  • the back of the flip chip 2 And flexible circuit boards 3 Correspondingly located in the display area 11 The back of the display, thereby reducing the border width of the flexible display device and increasing the screen ratio.
  • the plurality of binding terminals 15 With the plurality of connection pins 25 Set one by one.
  • the flexible substrate 90 Can be but not limited to polyimide ( PI ) Substrate.
  • the TFT The array layer includes multiple TFT ,
  • the multiple TFT Indium gallium zinc oxide semiconductor TFT Can also be low temperature polysilicon TFT , Of course, you can also use other commonly used in the existing technology TFT .
  • the flip chip 2 Through anisotropic conductive adhesive and the flexible display panel 1 Binding zone 12 Bind connection.
  • the flexible display device of the present invention by changing the rectangular shape of the existing flip-chip film, an expansion binding portion is added at both ends of the main body side of the flip-chip film to bind the existing flip-chip film only correspondingly
  • the layout pin on one side of the zone is changed to the layout pin on the three sides corresponding to the bonding zone.
  • the number of connecting pins can be increased accordingly, which is beneficial to High-resolution display of flexible display device.
  • the second embodiment of the flexible display device of the present invention is different from the first embodiment described above in that the two expansion binding portions twenty two Along the binding zone 12 Relative connection bending zone 13 Edges of both sides extend into the bending zone 13 Above so as to be attached to the binding area 12 And bending zone 13 On; and each expansion binding department twenty two Correspondingly attached to the bending area 13 The upper part follows the bending zone 13 Bend together.
  • Other technical features are the same as those in the first embodiment described above, and will not be repeated here.
  • the second embodiment of the flexible display device of the present invention a flip chip 2
  • the two expansion binding department twenty two Along the binding zone 12 Edges of both sides extend into the bending zone 13 Above, and each expansion binding section twenty two Correspondingly attached to the bending area 13
  • the upper part follows the bending zone 13 Bend together to increase connection pins even further 25
  • the number and due to the flip chip 2 Also flexible, the two expansion binding parts twenty two Can also be used as two important supporting parts 3 Provide support to reduce bending areas 3 Stress damage.
  • the present invention provides a flexible display device including a flexible display panel and a flip-chip film bound to the flexible display panel.
  • the flexible display panel is divided into a display area, a binding area and a bending area
  • the flip chip includes a main body part and two expansion binding parts respectively provided perpendicularly on two ends of one side of the main body part, an edge of the main body part adjacent to the two expansion binding parts and the two expansions
  • a plurality of connection pins are provided on the binding part, and the flip chip is bound to the binding area of the flexible display panel through the plurality of connection pins.
  • the shape of the flip chip is changed
  • the two sides of the main body are provided with additional binding parts, and the existing flip-chip film is only connected to the edge layout connection pin on one side of the binding area to the three side edge layout connection pin corresponding to the binding area, to ensure the binding accuracy
  • the number of connection pins can be correspondingly increased, thereby facilitating high-resolution display of the flexible display device.

Abstract

一种柔性显示装置，包括柔性显示面板（1）及绑定在柔性显示面板（1）上的覆晶薄膜（2），柔性显示面板（1）划分有显示区（11）、绑定区（12）及弯折区（13），覆晶薄膜（2）包括主体部（21）及分别垂直设于主体部（21）一侧边两端的两扩充绑定部（22），主体部（21）与两扩充绑定部（22）相邻的一侧边缘及两扩充绑定部（22）上设有多个连接引脚（25），覆晶薄膜（2）通过多个连接引脚（25）与柔性显示面板（1）的绑定区（12）绑定。柔性显示装置通过改变覆晶薄膜（2）的形状，在其主体部（21）一侧的两端增设扩充绑定部（22），将现有覆晶薄膜（2）只对应绑定区（12）一侧边缘布局连接引脚（25）变更为对应绑定区（12）的三侧边缘布局连接引脚（25），在保证绑定精度及不增加绑定区（12）宽度的情况下增加连接引脚（25）的数量，从而利于柔性显示装置的高分辨率显示。

Description

柔性显示装置 技术领域
本发明涉及显示技术领域，尤其涉及一种柔性显示装置。
 背景技术
现有市场上的平面显示器装置包括液晶显示装置（Liquid Crystal Display，LCD）和有机电致发光二极管（organic light emitting diode, OLED）显示器。其中OLED具有自发光、高亮度、宽视角、高对比度、可挠曲、低能耗、色彩丰富、快速相应及可制备柔性屏等诸多优异特性，引起了科研界和产业界极大的兴趣，被认为是极具潜力的下一代显示技术，已开始逐渐取代传统液晶显示器，被广泛应用在手机屏幕、电脑显示器、全彩电视等。
现有的平板显示器一般包括显示面板（Panel）和外接电路，显示面板在正常显示时，需要使用外接电路，如柔性电路板（Free Pascal Compiler，FPC）、覆晶薄膜（Chip On Film，COF），通过引线连接到面板的外引脚贴合（Outer Lead Bonding，OLB）区域，外接电路与显示面板的OLB区域的电连接是通过绑定（Bonding）工艺连接，实现对显示面板中的各信号线传递驱动信号。
消费者对显示屏的要求，以手机为例，如果手机整体尺寸较大而实际可显示区域较小时会就产生闷堵的心理，所以消费者只会追求屏幕更大、屏占比更高的手机。现如今“全面屏”的设计成为时代的主流，各供应商单位都专注于研发屏占比较高的全面屏产品。而OLED显示器以其柔性的特征对于屏幕全屏化显示起到了至关重要的作用。
图1为现有柔性OLED 显示器的平面结构示意图，包括柔性OLED面板100及与柔性OLED面板100绑定的COF200，其中柔性OLED面板100下端设有绑定区110，所述COF200与柔性OLED面板100的绑定区110相绑定，如图2所示，所述柔性OLED面板100的绑定区110通过弯折区120向柔性OLED面板100的背面弯曲而位于显示区130的背面，以减小显示装置的边界（border）宽度，提升屏占比。具体的，如图3所示，在绑定过程中，COF200通过其上侧边缘设置的多个连接引脚250与绑定区110最下侧边缘设置的多个绑定端子一一对应构成绑定结构而实现绑定，为确保绑定的对位精度，限制了绑定区域110所需预留的最小绑定端子间距。因此可以预测随着显示面板的分辨率（PPI）越来越高，显示面板下端的绑定区110与COF200连接区域的宽度需求越来越宽，但是由于实际显示屏宽度没有太大变化，限制了显示面板下端的绑定区110的宽度。
 技术问题
本发明的目的在于提供一种柔性显示装置，在保证绑定精度及不增加绑定区宽度的情况下，可相应增加连接引脚的数量，从而利于柔性显示装置的高分辨率显示。
 技术解决方案
为实现上述目的，本发明提供一种柔性显示装置，包括柔性显示面板及绑定于所述柔性显示面板上的覆晶薄膜；
所述柔性显示面板划分有显示区、位于显示区一侧的绑定区及位于显示区与绑定区之间的弯折区；
所述覆晶薄膜包括主体部及分别垂直设于所述主体部一侧边两端的两扩充绑定部；
所述主体部与该两扩充绑定部相邻的一侧边缘及该两扩充绑定部上设有多个连接引脚；
所述覆晶薄膜通过所述多个连接引脚与所述柔性显示面板的绑定区绑定。
所述两扩充绑定部分别对应与所述绑定区的相对的连接弯折区的两侧边缘绑定。
所述两扩充绑定部分别对应贴附在所述绑定区的相对的连接弯折区的两侧边缘上。
所述两扩充绑定部分别沿着所述绑定区的相对的连接弯折区的两侧边缘伸入所述弯折区上方，从而贴附在所述绑定区和弯折区上；
每一扩充绑定部对应贴附在所述弯折区上的部分随弯折区一起弯折。
所述的柔性显示装置还包括与所述覆晶薄膜电性连接的柔性电路板。
所述覆晶薄膜的主体部上设有与所述多个连接引脚电性连接的驱动芯片。
所述柔性显示面板包括柔性基板及对应所述绑定区设于所述柔性基板上的多个绑定端子；
所述多个绑定端子与所述多个连接引脚一一对应设置；
所述柔性显示面板通过所述多个绑定端子与所述覆晶薄膜绑定。
所述柔性基板为聚酰亚胺基板。
所述柔性显示面板为OLED显示面板。
所述覆晶薄膜通过各向异性导电胶与所述柔性显示面板的绑定区绑定连接。
 有益效果
本发明的有益效果：本发明的柔性显示装置，包括柔性显示面板及与所述柔性显示面板相绑定的覆晶薄膜，所述柔性显示面板划分有显示区、绑定区及弯折区，所述覆晶薄膜包括主体部及分别垂直设于所述主体部一侧边两端的两扩充绑定部，所述主体部与该两扩充绑定部相邻的一侧边缘及该两扩充绑定部上设有多个连接引脚，所述覆晶薄膜通过所述多个连接引脚与所述柔性显示面板的绑定区绑定，本发明通过改变覆晶薄膜的形状，在其主体部一侧两端增设扩充绑定部，将现有覆晶薄膜只对应绑定区一侧边缘布局连接引脚变更为对应绑定区的三侧边缘布局连接引脚，在保证绑定精度及不增加绑定区宽度的情况下，可相应增加连接引脚的数量，从而利于柔性显示装置的高分辨率显示。
 附图说明
为了能更进一步了解本发明的特征以及技术内容，请参阅以下有关本发明的详细说明与附图，然而附图仅提供参考与说明用，并非用来对本发明加以限制。
附图中，
图1为现有一种柔性OLED 显示器的平面结构示意图；
图2为图1柔性OLED 显示器的侧视示意图；
图3为图1柔性OLED 显示器中COF与绑定区的局部放大示意图；
图4为本发明柔性显示装置的第一实施例的平面结构示意图；
图5为本发明柔性显示装置的第一实施例的侧视示意图；
图6为本发明柔性显示装置的第一实施例中覆晶薄膜与绑定区的局部放大示意图；
图7为本发明柔性显示装置的第一实施例中覆晶薄膜的结构示意图；
图8为本发明柔性显示装置的第二实施例的平面结构示意图；
图9为本发明柔性显示装置的第二实施例的侧视示意图。
 本发明的实施方式
为更进一步阐述本发明所采取的技术手段及其效果，以下结合本发明的优选实施例及其附图进行详细描述。
请参阅图 4-5 ，本发明柔性显示装置的第一实施例包括柔性显示面板 1 、与所述柔性显示面板 1 相绑定的覆晶薄膜 2 及与所述覆晶薄膜 2 电性连接的柔性电路板 3 。
具体地，所述柔性显示面板 1 划分有显示区 11 、位于显示区 11 一侧的绑定区 12 及位于显示区 11 与绑定区 12 之间的弯折区 13 。
具体地，如图 7 所示，所述覆晶薄膜 2 包括主体部 21 及分别垂直设于所述主体部 21 一侧边两端的两扩充绑定部 22 。
具体地，如图 6 所示，所述主体部 21 与该两扩充绑定部 22 相邻的一侧边缘及该两扩充绑定部 22 上设有多个连接引脚 25 ；所述覆晶薄膜 2 通过所述多个连接引脚 25 与所述柔性显示面板 1 的绑定区 12 绑定。
具体地，所述两扩充绑定部 22 分别对应与所述绑定区 12 的相对的连接弯折区 13 的两侧边缘绑定。
具体地，所述两扩充绑定部 22 分别对应贴附在所述绑定区 12 的相对的连接弯折区 13 的两侧边缘上。
具体地，所述覆晶薄膜 2 的主体部 21 上设有与所述多个连接引脚 25 电性连接的驱动芯片 26 。
具体地，所述柔性显示面板 1 为 OLED 显示面板，具体包括柔性基板 10 、对应所述绑定区 12 设于所述柔性基板 10 上的多个绑定端子 15 、在柔性基板 10 上对应所述显示区 11 依次设置的 TFT （薄膜晶体管）阵列层 17 及 OLED 器件层及对应绑定区 12 和弯折区 13 设置的电性连接所述多个绑定端子 15 及 TFT 阵列层 17 的电路走线。所述柔性显示面板 1 的背面为柔性基板 10 远离 TFT 阵列层的一侧，所述柔性显示面板 1 的正面即为与背面相对的一侧。
具体地，所述绑定区 12 通过将所述弯折区 13 进行弯折而位于所述显示区 11 的背面，所述覆晶薄膜 2 及柔性电路板 3 也相应位于所述显示区 11 的背面，从而减小柔性显示装置的边界宽度，提升屏占比。
具体地，所述多个绑定端子 15 与所述多个连接引脚 25 一一对应设置。所述柔性显示面板 1 通过所述多个绑定端子 15 与所述覆晶薄膜 2 绑定。
具体地，所述柔性基板 90 可以但不限于为聚酰亚胺（ PI ）基板。
具体地，所述 TFT 阵列层包括多个 TFT ，所述多个 TFT 可以为铟镓锌氧化物半导体 TFT ，也可以为低温多晶硅 TFT ，当然，也可采用其他现有技术中常用的 TFT 。
具体地，所述覆晶薄膜 2 通过各向异性导电胶与所述柔性显示面板 1 的绑定区 12 绑定连接。
本发明的柔性显示装置的第一实施例，通过改变现有覆晶薄膜矩形的形状，在覆晶薄膜的主体部一侧两端增设扩充绑定部，将现有覆晶薄膜只对应绑定区一侧边缘布局连接引脚变更为对应绑定区的三侧边缘布局连接引脚，在保证绑定精度及不增加绑定区宽度的情况下，可相应增加连接引脚的数量，从而利于柔性显示装置的高分辨率显示。
请参阅图 8-9 ，本发明的柔性显示装置的第二实施例，与上述第一实施例相比，其区别在于，所述两扩充绑定部 22 分别沿着所述绑定区 12 的相对的连接弯折区 13 的两侧边缘伸入所述弯折区 13 上方，从而贴附在所述绑定区 12 和弯折区 13 上；且每一扩充绑定部 22 对应贴附在所述弯折区 13 上的部分随弯折区 13 一起弯折。其他技术特征均与上述第一实施例相同，在此不再赘述。
本发明的柔性显示装置的第二实施例，覆晶薄膜 2 的两扩充绑定部 22 分别沿着绑定区 12 的两侧边缘伸入所述弯折区 13 上方，且每一扩充绑定部 22 对应贴附在所述弯折区 13 上的部分随弯折区 13 一起弯折，从而可更进一步增加连接引脚 25 的数量，并由于所述覆晶薄膜 2 同样具有柔性，该两扩充绑定部 22 也可以作为两个重要支撑部件，对所述弯折区 3 进行支撑，从而减少弯折区 3 的应力破坏。
综上所述，本发明提供一种柔性显示装置，包括柔性显示面板及与所述柔性显示面板相绑定的覆晶薄膜，所述柔性显示面板划分有显示区、绑定区及弯折区，所述覆晶薄膜包括主体部及分别垂直设于所述主体部一侧边两端的两扩充绑定部，所述主体部与该两扩充绑定部相邻的一侧边缘及该两扩充绑定部上设有多个连接引脚，所述覆晶薄膜通过所述多个连接引脚与所述柔性显示面板的绑定区绑定，本发明通过改变覆晶薄膜的形状，在其主体部一侧两端增设扩充绑定部，将现有覆晶薄膜只对应绑定区一侧边缘布局连接引脚变更为对应绑定区的三侧边缘布局连接引脚，在保证绑定精度及不增加绑定区宽度的情况下，可相应增加连接引脚的数量，从而利于柔性显示装置的高分辨率显示。
以上所述，对于本领域的普通技术人员来说，可以根据本发明的技术方案和技术构思作出其他各种相应的改变和变形，而所有这些改变和变形都应属于本发明后附的权利要求的保护范围。

Claims (10)

  1. 一种柔性显示装置，包括柔性显示面板及绑定于所述柔性显示面板上的覆晶薄膜；
    所述柔性显示面板划分有显示区、位于显示区一侧的绑定区及位于显示区与绑定区之间的弯折区；
    所述覆晶薄膜包括主体部及分别垂直设于所述主体部一侧边两端的两扩充绑定部；
    所述主体部与该两扩充绑定部相邻的一侧边缘及该两扩充绑定部上设有多个连接引脚；
    所述覆晶薄膜通过所述多个连接引脚与所述柔性显示面板的绑定区绑定。
  2. 如权利要求1所述的柔性显示装置，其中，所述两扩充绑定部分别对应与所述绑定区的相对的连接弯折区的两侧边缘绑定。
  3. 如权利要求2所述的柔性显示装置，其中，所述两扩充绑定部分别对应贴附在所述绑定区的相对的连接弯折区的两侧边缘上。
  4. 如权利要求2所述的柔性显示装置，其中，所述两扩充绑定部分别沿着所述绑定区的相对的连接弯折区的两侧边缘伸入所述弯折区上方，从而贴附在所述绑定区和弯折区上；
    每一扩充绑定部对应贴附在所述弯折区上的部分随弯折区一起弯折。
  5. 如权利要求1所述的柔性显示装置，还包括与所述覆晶薄膜电性连接的柔性电路板。
  6. 如权利要求1所述的柔性显示装置，其中，所述覆晶薄膜的主体部上设有与所述多个连接引脚电性连接的驱动芯片。
  7. 如权利要求1所述的柔性显示装置，其中，所述柔性显示面板包括柔性基板及对应所述绑定区设于所述柔性基板上的多个绑定端子；
    所述多个绑定端子与所述多个连接引脚一一对应设置；
    所述柔性显示面板通过所述多个绑定端子与所述覆晶薄膜绑定。
  8. 如权利要求7所述的柔性显示装置，其中，所述柔性基板为聚酰亚胺基板。
  9. 如权利要求1所述的柔性显示装置，其中，所述柔性显示面板为OLED显示面板。
  10. 如权利要求1所述的柔性显示装置，其中，所述覆晶薄膜通过各向异性导电胶与所述柔性显示面板的绑定区绑定连接。
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CN107799050A (zh) * 2016-09-07 2018-03-13 三星显示有限公司 显示装置
CN108445590A (zh) * 2017-02-16 2018-08-24 日本奥兰若株式会社 光模块及柔性基板
CN107425142A (zh) * 2017-04-27 2017-12-01 京东方科技集团股份有限公司 一种柔性显示装置的制备方法及柔性显示装置

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