WO2013063817A1 - 一种cof封装单元及cof封装卷带 - Google Patents

一种cof封装单元及cof封装卷带 Download PDF

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Publication number
WO2013063817A1
WO2013063817A1 PCT/CN2011/081923 CN2011081923W WO2013063817A1 WO 2013063817 A1 WO2013063817 A1 WO 2013063817A1 CN 2011081923 W CN2011081923 W CN 2011081923W WO 2013063817 A1 WO2013063817 A1 WO 2013063817A1
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Prior art keywords
cof
circuit chip
wiring
input
output
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PCT/CN2011/081923
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English (en)
French (fr)
Inventor
廖良展
林柏伸
毕育欣
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深圳市华星光电技术有限公司
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Application filed by 深圳市华星光电技术有限公司 filed Critical 深圳市华星光电技术有限公司
Priority to US13/378,566 priority Critical patent/US8780577B2/en
Publication of WO2013063817A1 publication Critical patent/WO2013063817A1/zh

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/4985—Flexible insulating substrates
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/93—Batch processes
    • H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits

Definitions

  • the present invention relates to the field of liquid crystal display, and more particularly to a CMOS package unit and a C0F package tape.
  • COF Chip On Film
  • IC Die packaging circuit chips
  • the COF produced by the tape reel type (TAB) package is wound and fed in a roll form.
  • the COF base tape 1 is wound in the reel 101 and fed by the reel 101.
  • the packaged COF structure is as shown in FIG. 2.
  • the COF package structure includes: a COF base tape 1, a circuit chip 2 packaged on the COF base tape 1, and a circuit chip 2 connected to an input terminal and an output terminal (not shown).
  • the input terminal wiring 3 and the output terminal wiring 4, the input terminal and the output terminal (not shown) are respectively disposed on the two trim sides 7 of the COF base tape 1.
  • the circuit chip 2 is rectangular, its short side is parallel to the direction of the COF base tape 1, and the input terminal wiring 3 and the output terminal wiring 4 are also disposed at both ends of the circuit chip 2 along the direction of the COF base tape 1.
  • the wiring on the OLB (Out Leader Bonding) side of the liquid crystal panel is more and more, and the wiring of the COF is also increased.
  • the width of the conventional COF base tape 1 is 35 mm or 48 mm. It is difficult to have enough space to arrange a large number of output wirings 4 on the OLB side, and the COF baseband 1 is used as an upstream material, and it is difficult to adjust it.
  • the technical problem to be solved by the present invention is to provide a COF package unit and a package tape which are adapted to a large-size liquid crystal panel using the existing COF base tape material.
  • a COF package unit of the present invention comprising: a COF base tape, a circuit chip packaged on the COF base tape, and an input terminal connected to the circuit chip Wiring and output wiring, the input wiring and the output wiring are respectively Both edges of the COF base tape are provided with an input terminal and an output terminal.
  • At least two sides of the circuit chip are provided with an input port and an output port, the input terminal wiring is connected to the input port, and the output terminal wiring is connected to the output port. It has enough port setting space. If the number of input ports and output ports is large, you can set ports on multiple sides as needed, which is beneficial to the wiring and the convenience of the process.
  • the circuit chip is provided with an input port and an output port respectively corresponding to the sides of the two edges of the COF base tape.
  • the circuit requirements, and the number of input and output wirings if the number is small, it can be placed on both sides of the edge corresponding to the COF baseband, so that the wiring path does not need to be bent, and the length of the wiring is also short. In turn, materials and processes are saved.
  • the shape of the circuit chip is square.
  • the square circuit chip can provide a wider positive pressure to the direction of the base tape, thereby solving the bending stress problem caused by the tape winding method, so that a single COF package unit can be flatter in use, avoiding warping of the COF package. .
  • the input port and the output port of the circuit chip are respectively disposed on two sides of the edge corresponding to the edge of the COF baseband.
  • the input port and the output port of the circuit chip are respectively disposed on four sides thereof.
  • the input port and the output port can be set on the four sides at the same time, thereby fully utilizing the side of the circuit chip as the wiring area, so that the size of the circuit chip becomes more reasonable. .
  • the circuit chip is parallel to the direction of the COF package baseband. It facilitates the setting of the input wiring and the output wiring, and the square chip shape provides a wider range of positive pressure, which solves the bending stress problem caused by the winding method.
  • a long side of the circuit chip corresponds to an edge of the COF baseband
  • a shape of the circuit chip is a rectangle
  • a long side of the circuit chip corresponds to an edge of the COF baseband
  • an input of the circuit chip The port and the output port are respectively disposed on the two long sides of the circuit chip. Rectangular circuit chip The two long sides are long, suitable for setting more input ports and output ports, and having a wider wiring area, and the rectangular circuit chip is beneficial to provide a wider range of positive pressure on the COF baseband to reduce the bending stress. Impact on COF package units.
  • the COF package tape of the present invention is achieved by the following technical solutions: A COF package tape, including any of the above COF package units.
  • the length of the single COF package structure can be set as needed, and when used for some large-size liquid crystal panels, the input terminal wiring and The number of output wirings is large, especially the output wiring and the output terminals connected thereto are longer in the area of the COF baseband edge, so that the length of the single COF package unit can be determined according to the number of output terminals and the output wiring.
  • the lengthening allows the COF baseband to have sufficient area for wiring and output terminal settings to accommodate the needs of various large-size liquid crystal panels, and without changing the COF baseband width, ie, without changing the upstream material, It is possible to use existing materials to achieve the COF required for large-size LCD panels, rationally integrate and utilize resources, improve equipment utilization, save material procurement costs, and increase economic benefits.
  • 1 is a schematic view of a tape feeding of a base tape in a conventional tape winding mode
  • FIG. 2 is a schematic diagram of a conventional COF packaging method
  • FIG. 3 is a schematic illustration of an embodiment of the invention.
  • the structure of the COF package unit packaged in a tape winding mode includes: a COF base tape 1, a circuit chip 2 packaged on the COF base tape 1, a circuit chip 2, an input terminal, and an output.
  • Input terminal wiring 3 and output terminal wiring 4, which are connected to terminals (not shown), input terminals and output terminals (not shown) are respectively disposed on the two cut edges 7 of the COF base tape 1.
  • FIG. 3 shows a technical solution of the present invention. Different from the prior art shown in FIG. 2, the input terminal wiring 3 and the output terminal wiring 4 are respectively arranged along the edge of the COF base tape 1, that is, the input terminal.
  • the output terminals are arranged along the edge of the COF base tape 1, respectively, and the input terminal wiring 3 and the output terminal wiring 4 are connected to the input terminal and the output terminal, respectively, which are also arranged along the edge of the COF base tape 1.
  • the two edges of the COF base tape 1 are respectively used as an input terminal on the PCB side and an output terminal setting region on the OLB side; thus, when used for a large-sized liquid crystal panel, a large amount of wiring needs to be arranged on the OLB side.
  • the wiring area is required to be wide, and the output terminals are arranged long, avoiding the limitation of the arrangement of the wiring area and the output terminal by using the conventional COF base tape 1 (the conventional base tape is usually 35 mm or 48 mm width), and avoiding the trimming 7 as the
  • the setting area of the input terminal and the output terminal causes insufficient space to pitch a large number of output terminals 4 on the OLB side; and the input terminals and output terminals arranged along both side edges of the COF base tape 1 are not subject to COF baseband 1 width limitation, only need to determine the length of a single COF package unit according to the wiring requirements and the number of input terminals and output terminals, rationally integrate resources, improve equipment utilization, and increase economic benefits;
  • the need to change the COF baseband 1 as an upstream material saves the procurement cost of upstream materials.
  • the input terminal wiring 3 and the output terminal wiring 4 are respectively disposed on both side edges of the COF base tape 1 along the edge and respectively connected to the input terminal and the output terminal (not shown in the drawing).
  • the connection, the input terminal and the output terminal are formed by the input terminal wiring 3 and the output terminal wiring 4 on both side edges of the COF base tape 1, that is, the two sides of the edge of the COF base tape 1 are respectively wired as the PCB side and the OLB side;
  • the circuit chip 2 (IC Die ) is encapsulated on the COF base strip 1 and has a square shape which is arranged parallel to the direction of the COF base strip 1 , and the square shape is advantageous for providing a wider range of positive pressure on the direction of the COF base strip 1 , thereby Solve the bending stress problem caused by the tape winding method (TAB) package.
  • TAB tape winding method
  • the four sides of the circuit chip 2 (IC Die ) are respectively provided with an input port and an output port, and the input terminal wiring 3 and the output terminal wiring 4 are respectively connected to the input port and the output port, and the wiring paths are respectively directed to the both edges of the COF baseband 1 , and further utilize the side of the circuit chip 2 (IC Die ) as a wiring area, so that The size of the circuit chip 2 can be more reasonable, and the entire COF package structure is more compact and reasonable. If the number of circuit input ports and output ports of the circuit chip 2 (IC Die ) is small, consider setting the port only on the side of the circuit chip 2 (IC Die) corresponding to both edges of the COF baseband 1 to reduce the routing path and Avoid bending the routing path.
  • the circuit chip 2 (IC Die) is arranged parallel to the direction of the COF baseband 1.
  • the shape of the circuit chip 2 (IC Die) may also be a rectangle, and the long side thereof is parallel to the edge of the COF baseband 1, so that the COF package structure can be used according to the COF package structure.
  • the number of the output wiring 4 on the OLB side and the number of the input side wiring 3 on the PCB side and the arrangement requirements adjust the aspect ratio of the circuit chip 2 (IC Die), and set the corresponding input port and output port, which can be adapted to the input end.
  • the need of wiring 3 and output wiring 4 can be adapted to solve the bending stress problem.
  • the length of the rectangle can be appropriately increased to adapt to the line arrangement.
  • the increase in length allows the circuit chip 2 (IC Die) to provide a longer range of positive pressure in the direction of the COF base tape 1, thereby solving or reducing the influence of the bending stress problem caused by the tape winding mode (TAB) package. .

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  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Nonlinear Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Optics & Photonics (AREA)
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Abstract

一种COF封装单元及COF封装卷带，所述COF封装单元包括：COF基带（1）、封装于，所述COF基带（1）上的电路芯片（2）、与所述电路芯片（2）相连接的输入端布线（3）和输出端布线（4），所述输入端布线（3）和输出端布线（4）分别在所述COF基带（1）的两边缘设置有输入端子和输出端子。由于输入端子和输出端子沿COF基带（1）的边缘排布，根据输入端布线和输出端布线的排布需要，设置单个COF封装单元的长度，使得COF基带能够有足够的区域进行布线，以适应于大尺寸液晶面板的需要，从而合理的整合利用资源，提高了设备利用率，节约了材料的采购成本。

Description

一种 COF封装单元及 COF封装卷带
【技术领域】
本发明涉及液晶显示领域， 更具体的说， 涉及一种 C0F封装单元及 C0F 封装卷带。
【背景技术】
COF ( Chip On Film , 芯片软膜构装技术）技术广泛应用在液晶显示领域； 通常搭载于液晶显示装置的驱动器上， 用于封装电路芯片 （IC Die )。
卷带式 （TAB )封装生产的 COF是以成卷的方式进行卷带和送带的， 如图 1所示， COF基带 1卷绕在卷轮 101中， 由卷轮 101进行送带。封装完成的 COF 结构如图 2所示， COF封装结构包括： COF基带 1、 封装在 COF基带 1上的电 路芯片 2、 将电路芯片 2与输入端子和输出端子（图中未示出）连接起来的输入 端布线 3和输出端布线 4, 输入端子和输出端子（图中未示出）分别设置在 COF 基带 1的两切边 7上。 电路芯片 2为长方形，其短边平行于 COF基带 1的走向， 而输入端布线 3和输出端布线 4也是沿着 COF基带 1的走向设置在电路芯片 2 的两端。 由于液晶面板尺寸越做越大， 从而导致液晶面板上 OLB ( Out Leader Bonding ) 侧的走线越来越多， COF的布线也随之增加， 常规的 COF基带 1的 宽度为 35mm或 48mm, 已很难具有足够的空间在 OLB侧排布 （ pitch ) 大量的 输出端布线 4, 同时 COF基带 1作为上游材料， 要对其作出调整将 4艮困难。
【发明内容】
本发明所要解决的技术问题是提供一种以现有 COF基带材料生产适应于大 尺寸液晶面板的 COF封装单元及封装卷带。
本发明一种 COF封装单元的目的是通过以下技术方案来实现的： 一种 COF 封装单元， 包括： COF基带、 封装于所述 COF基带上的电路芯片、 与所述电路 芯片相连接的输入端布线和输出端布线， 所述输入端布线和输出端布线分别在 所述 COF基带的两边缘设置有输入端子和输出端子。
优选的， 所述电路芯片上至少两个侧边设置有输入端口和输出端口， 所述 输入端布线与所述输入端口连接， 所述输出端布线和所述输出端口连接。 具有 足够的端口设置空间， 若输入端口和输出端口数量较多， 可根据需要在多个侧 边设置端口， 有利于布线的需要以及工艺的方便。
所述电路芯片对应于 COF基带的两边缘的侧边分别设置有输入端口和输出 端口。 根据芯片的大小、 电路需求及输入端布线和输出端布线的数量， 若数量 较少， 可设置在对应于 COF基带边缘的两侧边， 使得布线路径无需折弯， 布线 的长度也较短， 进而节约材料和工艺。
优选的， 所述电路芯片的形状为正方形。 正方形的电路芯片， 可以对基带 的走向方向提供更宽的正压力， 从而解决了卷带方式引起的弯折应力问题， 从 而单个 COF封装单元在使用时可以更平整， 避免 COF封装发生翘曲现象。
优选的， 所述电路芯片的输入端口和输出端口分别设置在其两个对应于所 述 COF基带边缘的侧边上。 可以根据输入端布线和输出端布线数量的需要， 选 择相应的侧边设置布线，若数量较少，可选择两个对应于 COF基带边缘的侧边， 以使输入端布线和输出端布线的路径较短， 节约工艺步骤和布线材料。
优选的， 所述电路芯片的输入端口和输出端口分别设置在其 4 个侧边上。 对于输入端布线和输出端布线数量较多的芯片， 可以同时在 4 个侧边设置输入 端口和输出端口， 从而充分的利用了电路芯片侧边作为布线区域， 使电路芯片 的大小更趋于合理。
优选的， 所述电路芯片平行于所述 COF封装基带的走向。 便于输入端布线 和输出端布线的设置， 并且正方形的芯片形状提供范围更广的正压力， 解决了 卷带方式引起的弯折应力问题。
优选的， 所述电路芯片的长边对应于所述 COF基带的边缘， 所述电路芯片 的形状为长方形， 所述电路芯片的长边对应于所述 COF基带的边缘， 所述电路 芯片的输入端口和输出端口分别设置在电路芯片的两长边上。 长方形电路芯片 的两长边较长， 适合设置较多的输入端口和输出端口以及具有较为宽广的布线 区域， 并且长方形电路芯片有利于提供 COF基带走向上的更广范围的正压力， 以减小弯折应力对 COF封装单元的影响。
本发明一种 COF封装卷带的目的是通过以下技术方案来实现的： 一种 COF 封装卷带， 包括了任一上述的 COF封装单元。
本发明由于将 COF封装单元的输入端子和输出端子沿着 COF基带的边缘排 布设置， 进而可以根据需要， 设置单个 COF封装结构的长度， 在用于一些大尺 寸液晶面板时， 输入端布线和输出端布线的数量较多， 特别是输出端布线以及 与之相连的输出端子在 COF基带边缘排布的区域就较长， 从而可以根据输出端 子以及输出端布线的数量将单个 COF封装单元的长度加长，使得 COF基带能够 有足够的区域进行布线和输出端子的设置， 以适应于各种大尺寸液晶面板的需 要， 同时， 在不需要改变 COF基带宽度的情况下， 即不需要改变上游材料， 就 可以利用现有材料达到符合大尺寸液晶面板需要的 COF,合理的整合利用资源， 提高了设备利用率， 节约了材料的采购成本， 增加经济效益。
【附图说明】
图 1是现有卷带方式进行基带的送带的示意图，
图 2是现有 COF封装方式的示意图，
图 3是本发明实施例示意图。
其中： 1、 COF基带； 2、 电路芯片； 3、 输入端布线； 4、 输出端布线； 7、 切边； 30、 PCB侧； 40、 OLB侧； 101、 卷轮。
【具体实施方式】
下面结合附图和较佳的实施例对本发明作进一步说明。
如图 2所示， 以卷带方式 （TAB )封装的 COF封装单元的结构包括： COF 基带 1、 封装在 COF基带 1上的电路芯片 2、 将电路芯片 2与输入端子和输出 端子（图中未示出）连接起来的输入端布线 3和输出端布线 4, 输入端子和输出 端子（图中未示出）分别设置在 COF基带 1的两切边 7上。 如图 3所示为本发 明所提出的技术方案， 与图 2所示现有技术不同的是， 输入端布线 3和输出端 布线 4分别沿着 COF基带 1的边缘排布设置， 即输入端子和输出端子分别沿着 COF基带 1的边缘排布， 输入端布线 3和输出端布线 4分别于输入端子和输出 端子连接， 其也是沿着 COF基带 1 的边缘排布。 在本发明中， 将 COF基带 1 的两边缘分别作为 PCB侧的输入端子和 OLB侧的输出端子设置区； 这样，在用 于大尺寸的液晶面板时， 需要在 OLB侧排布大量的布线， 布线区域需求较宽， 输出端子排布较长， 避免了使用常规的 COF基带 1 (常规基带通常为 35mm或 48mm的宽度）对布线区域和输出端子排布的限制， 避免了以切边 7作为输入端 子和输出端子的设置区而造成没有足够的空间在 OLB侧排布（pitch ) 大量的输 出端布线 4; 而沿着 COF基带 1两侧边缘排布的输入端子和输出端子则不受其 COF基带 1宽度的限制， 只需根据布线的要求及输入端子和输出端子的数量确 定单个 COF封装单元的长度便可，合理的整合利用资源，提高了设备的利用率， 增加经济效益； 同时不需要改变作为上游材料 COF基带 1， 节约上游材料的采 购成本。
如图 3所示为本发明的实施例， 输入端布线 3和输出端布线 4分别设置在 COF基带 1的两侧边缘沿着边缘排布并分别与输入端子和输出端子 （图中未示 出） 连接， 输入端子和输出端子由输入端布线 3和输出端布线 4在 COF基带 1 的两侧边缘排布形成， 即 COF基带 1的边缘两侧分别作为 PCB侧和 OLB侧进 行布线； 同时， 电路芯片 2 ( IC Die )封装在 COF基带 1上， 其形状为正方形， 其平行于 COF基带 1的走向设置，正方形形状有利于其对 COF基带 1的走向上 提供范围更广的正压力， 从而解决卷带方式 （TAB )封装带来的弯折应力问题。 电路芯片 2 ( IC Die ) 的四个侧边分别设置有输入端口和输出端口， 输入端布线 3和输出端布线 4分别与输入端口和输出端口连接， 布线路径分别朝向着 COF 基带 1的两边缘， 进而充分利用电路芯片 2 ( IC Die ) 的侧边作为布线区域， 使 得电路芯片 2的大小可以更合理， 并且使得整个 COF封装结构更紧凑合理。 若 电路芯片 2 ( IC Die ) 的电路输入端口和输出端口数量较少 , 可考虑将端口只设 置在电路芯片 2 ( IC Die )对应于 COF基带 1两边缘的侧边， 以减少布线的路径 和避免布线路径弯折。 电路芯片 2 ( IC Die ) 平行于 COF基带 1的走向设置， 此外， 电路芯片 2 ( IC Die ) 的形状也可以为长方形， 而其长边平行于 COF 基带 1的边缘， 这样可以根据 COF封装结构 OLB侧的输出端布线 4以及 PCB 侧的输入端布线 3数量及排布的需要， 调整电路芯片 2 ( IC Die ) 的长宽比例， 设置相应的输入端口和输出端口， 既可以适应于输入端布线 3 和输出端布线 4 排布的需要， 又可以适应于解决弯折应力问题的需要， 比如若 OLB侧的输出端 布线 4较多， 可以适当提高长方形的长度， 以适应于线路排布的需要， 同时， 长度增加使得电路芯片 2 ( IC Die )在 COF基带 1的走向上提供更加长的范围的 正压力， 从而解决或减小卷带方式（TAB )封装带来的弯折应力问题影响。
以上内容是结合具体的优选实施方式对本发明所作的进一步详细说明， 不 能认定本发明的具体实施只局限于这些说明。 对于本发明所属技术领域的普通 技术人员来说， 在不脱离本发明构思的前提下， 还可以做出若千简单推演或替 换， 都应当视为属于本发明的保护范围。

Claims

权利要求
1、 一种 COF封装单元， 包括： C0F基带、 封装于所述 C0F基带上的 电路芯片、 与所述电路芯片相连接的输入端布线和输出端布线， 所述输入 端布线和输出端布线分别在所述 COF基带的两边缘设置有输入端子和输出 端子。
2、 如权利要求 1所述的一种 COF封装单元， 其特征在于， 所述电路 芯片上至少两个侧边设置有输入端口和输出端口， 所述输入端布线与所述 输入端口连接， 所述输出端布线和所述输出端口连接。
3、 如权利要求 2所述的一种 COF封装单元， 其特征在于， 所述电路 芯片对应于 COF基带的两边缘的侧边分别设置有输入端口和输出端口。
4、 如权利要求 2所述的一种 COF封装单元， 其特征在于， 所述电路 芯片的形状为正方形。
5、 如权利要求 4所述的一种 COF封装单元， 其特征在于， 所述电路 芯片的输入端口和输出端口分别设置在其两个对应于所述 COF基带边缘的 侧边上。
6、 如权利要求 5所述的一种 COF封装单元， 其特征在于， 所述电路 芯片的输入端口和输出端口分别设置在其 4个侧边上。
7、 如权利要求 4所述的一种 COF封装单元， 其特征在于， 所述电路 芯片平行于所述 COF封装基带的走向。
8、 如权利要求 2所述的一种 COF封装单元， 其特征在于， 所述电路 芯片的形状为长方形， 所述电路芯片的长边对应于所述 COF基带的边缘， 所述电路芯片的输入端口和输出端口分别设置在电路芯片的两长边上。
9、 一种 COF封装卷带， 包括如权利要求 1所述的 COF封装单元， 所 述 COF封装单元， 包括： COF基带、 封装于所述 COF基带上的电路芯片、 与所述电路芯片相连接的输入端布线和输出端布线， 所述输入端布线和输 出端布线分别在所述 COF基带的两边缘设置有输入端子和输出端子。
10、 如权利要求 9所述的一种 COF封装卷带， 其特征在于， 所述电路 芯片上至少两个侧边设置有输入端口和输出端口， 所述输入端布线与所述 输入端口连接， 所述输出端布线和所述输出端口连接。
11、 如权利要求 10所述的一种 COF封装卷带， 其特征在于， 所述电 路芯片对应于 COF基带的两边缘的侧边分别设置有输入端口和输出端口。
12、 如权利要求 10所述的一种 COF封装卷带， 其特征在于， 所述电 路芯片的形状为正方形。
13、 如权利要求 12所述的一种 COF封装卷带， 其特征在于， 所述电 路芯片的输入端口和输出端口分别设置在其两个对应于所述 COF基带边缘 的侧边上。
14、 如权利要求 13所述的一种 COF封装卷带， 其特征在于， 所述电 路芯片的输入端口和输出端口分别设置在其 4个侧边上。
15、 如权利要求 12所述的一种 COF封装卷带， 其特征在于， 所述电 路芯片平行于所述 COF封装基带的走向。
16、 如权利要求 10所述的一种 COF封装卷带， 其特征在于， 所述电 路芯片的形状为长方形，所述电路芯片的长边对应于所述 COF基带的边缘， 所述电路芯片的输入端口和输出端口分别设置在电路芯片的两长边上。
PCT/CN2011/081923 2011-11-04 2011-11-08 一种cof封装单元及cof封装卷带 WO2013063817A1 (zh)

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