CN101399247A - Cof封装及用于cof封装的载带基板 - Google Patents
Cof封装及用于cof封装的载带基板 Download PDFInfo
- Publication number
- CN101399247A CN101399247A CNA2008100858430A CN200810085843A CN101399247A CN 101399247 A CN101399247 A CN 101399247A CN A2008100858430 A CNA2008100858430 A CN A2008100858430A CN 200810085843 A CN200810085843 A CN 200810085843A CN 101399247 A CN101399247 A CN 101399247A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/4985—Flexible insulating substrates
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/12—Mountings, e.g. non-detachable insulating substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49838—Geometry or layout
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/50—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor for integrated circuit devices, e.g. power bus, number of leads
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3011—Impedance
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- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Geometry (AREA)
- Semiconductor Integrated Circuits (AREA)
- Wire Bonding (AREA)
Abstract
Description
Claims (13)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007-247503 | 2007-09-25 | ||
JP2007247503A JP4588748B2 (ja) | 2007-09-25 | 2007-09-25 | Cofパッケージ |
JP2007247503 | 2007-09-25 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN101399247A true CN101399247A (zh) | 2009-04-01 |
CN101399247B CN101399247B (zh) | 2012-10-10 |
Family
ID=40470747
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2008100858430A Active CN101399247B (zh) | 2007-09-25 | 2008-03-21 | Cof封装及用于cof封装的载带基板 |
Country Status (5)
Country | Link |
---|---|
US (1) | US8058713B2 (zh) |
JP (1) | JP4588748B2 (zh) |
KR (1) | KR101493759B1 (zh) |
CN (1) | CN101399247B (zh) |
TW (1) | TWI428071B (zh) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102608777A (zh) * | 2011-11-04 | 2012-07-25 | 深圳市华星光电技术有限公司 | 一种cof封装单元及cof封装卷带 |
WO2012167488A1 (zh) * | 2011-06-09 | 2012-12-13 | 深圳市华星光电技术有限公司 | Cof、cof载带及液晶电视的驱动电路 |
WO2013056456A1 (zh) * | 2011-10-18 | 2013-04-25 | 深圳市华星光电技术有限公司 | 覆晶薄膜的面板结构 |
US11121119B2 (en) | 2019-03-27 | 2021-09-14 | Powerchip Semiconductor Manufacturing Corporation | Semiconductor package |
WO2021258736A1 (zh) * | 2020-06-22 | 2021-12-30 | 深圳市全洲自动化设备有限公司 | Cof 驱动模块、 cof 显示模组及前两者的制造方法 |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4472737B2 (ja) * | 2007-08-31 | 2010-06-02 | Okiセミコンダクタ株式会社 | 半導体装置、半導体素子及び基板 |
JP4540697B2 (ja) | 2007-08-31 | 2010-09-08 | Okiセミコンダクタ株式会社 | 半導体装置 |
KR101692956B1 (ko) * | 2010-09-20 | 2017-01-04 | 삼성전자 주식회사 | 테이프 패키지 |
KR101951956B1 (ko) * | 2012-11-13 | 2019-02-26 | 매그나칩 반도체 유한회사 | 반도체 패키지용 연성회로기판 |
KR102212323B1 (ko) | 2014-02-10 | 2021-02-04 | 삼성디스플레이 주식회사 | 표시 장치 |
KR102243669B1 (ko) | 2015-01-26 | 2021-04-23 | 삼성전자주식회사 | 칩 온 필름 패키지 및 이를 포함하는 디스플레이 장치 |
KR102508527B1 (ko) | 2016-07-01 | 2023-03-09 | 삼성전자주식회사 | 필름형 반도체 패키지 |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3207743B2 (ja) * | 1996-03-22 | 2001-09-10 | シャープ株式会社 | フレキシブル配線基板の端子構造およびそれを用いたicチップの実装構造 |
JP3648596B2 (ja) * | 2000-10-17 | 2005-05-18 | カシオ計算機株式会社 | 半導体チップの接合構造およびその構造を備えた表示装置 |
JP3696512B2 (ja) * | 2001-02-13 | 2005-09-21 | シャープ株式会社 | 表示素子駆動装置およびそれを用いた表示装置 |
JP3544970B2 (ja) * | 2002-09-30 | 2004-07-21 | 沖電気工業株式会社 | Cofテープキャリア、半導体素子、半導体装置 |
JP4271435B2 (ja) * | 2002-12-09 | 2009-06-03 | シャープ株式会社 | 半導体装置 |
JP4252518B2 (ja) * | 2004-09-07 | 2009-04-08 | シャープ株式会社 | 半導体装置 |
JP4109689B2 (ja) * | 2004-09-29 | 2008-07-02 | 三井金属鉱業株式会社 | Cof用フレキシブルプリント配線板の製造方法 |
KR100652519B1 (ko) * | 2005-07-18 | 2006-12-01 | 삼성전자주식회사 | 듀얼 금속층을 갖는 테이프 배선기판 및 그를 이용한 칩 온필름 패키지 |
JP4786976B2 (ja) * | 2005-09-13 | 2011-10-05 | パナソニック株式会社 | 配線基板及びその製造方法、並びに半導体装置 |
JP4806313B2 (ja) * | 2006-08-18 | 2011-11-02 | Nec液晶テクノロジー株式会社 | テープキャリア、液晶表示装置用テープキャリア、及び液晶表示装置 |
-
2007
- 2007-09-25 JP JP2007247503A patent/JP4588748B2/ja active Active
-
2008
- 2008-03-20 US US12/052,172 patent/US8058713B2/en active Active
- 2008-03-20 KR KR20080025839A patent/KR101493759B1/ko active IP Right Grant
- 2008-03-21 CN CN2008100858430A patent/CN101399247B/zh active Active
- 2008-07-18 TW TW097127444A patent/TWI428071B/zh active
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2012167488A1 (zh) * | 2011-06-09 | 2012-12-13 | 深圳市华星光电技术有限公司 | Cof、cof载带及液晶电视的驱动电路 |
WO2013056456A1 (zh) * | 2011-10-18 | 2013-04-25 | 深圳市华星光电技术有限公司 | 覆晶薄膜的面板结构 |
CN102608777A (zh) * | 2011-11-04 | 2012-07-25 | 深圳市华星光电技术有限公司 | 一种cof封装单元及cof封装卷带 |
WO2013063817A1 (zh) * | 2011-11-04 | 2013-05-10 | 深圳市华星光电技术有限公司 | 一种cof封装单元及cof封装卷带 |
US8780577B2 (en) | 2011-11-04 | 2014-07-15 | Shenzhen China Star Optoelectronics Technology Co., Ltd. | COF packaging unit and COF packaging tape |
US11121119B2 (en) | 2019-03-27 | 2021-09-14 | Powerchip Semiconductor Manufacturing Corporation | Semiconductor package |
WO2021258736A1 (zh) * | 2020-06-22 | 2021-12-30 | 深圳市全洲自动化设备有限公司 | Cof 驱动模块、 cof 显示模组及前两者的制造方法 |
Also Published As
Publication number | Publication date |
---|---|
US8058713B2 (en) | 2011-11-15 |
TW200915946A (en) | 2009-04-01 |
JP4588748B2 (ja) | 2010-12-01 |
KR20090031806A (ko) | 2009-03-30 |
KR101493759B1 (ko) | 2015-02-16 |
JP2009081173A (ja) | 2009-04-16 |
US20090079047A1 (en) | 2009-03-26 |
TWI428071B (zh) | 2014-02-21 |
CN101399247B (zh) | 2012-10-10 |
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C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
ASS | Succession or assignment of patent right |
Owner name: OKI SEMICONDUCTOR CO., LTD. Free format text: FORMER OWNER: OKI ELECTRIC INDUSTRY CO., LTD. Effective date: 20131127 |
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C41 | Transfer of patent application or patent right or utility model | ||
C56 | Change in the name or address of the patentee | ||
CP03 | Change of name, title or address |
Address after: Kanagawa Patentee after: LAPIS SEMICONDUCTOR Co.,Ltd. Address before: Tokyo, Japan Patentee before: OKI Semiconductor Corp. |
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TR01 | Transfer of patent right |
Effective date of registration: 20131127 Address after: Tokyo, Japan Patentee after: OKI Semiconductor Corp. Address before: Tokyo, Japan Patentee before: Oki Electric Industry Co.,Ltd. |