WO2013078674A1 - 液晶面板的软板上芯片构造的卷带基板以及使用此卷带基板的液晶面板 - Google Patents

液晶面板的软板上芯片构造的卷带基板以及使用此卷带基板的液晶面板 Download PDF

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Publication number
WO2013078674A1
WO2013078674A1 PCT/CN2011/083362 CN2011083362W WO2013078674A1 WO 2013078674 A1 WO2013078674 A1 WO 2013078674A1 CN 2011083362 W CN2011083362 W CN 2011083362W WO 2013078674 A1 WO2013078674 A1 WO 2013078674A1
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Prior art keywords
liquid crystal
crystal panel
chip
tape substrate
package unit
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PCT/CN2011/083362
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English (en)
French (fr)
Inventor
林柏伸
廖良展
张勇
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深圳市华星光电技术有限公司
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Priority to US13/379,860 priority Critical patent/US20130141686A1/en
Publication of WO2013078674A1 publication Critical patent/WO2013078674A1/zh

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    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1345—Conductors connecting electrodes to cell terminals
    • G02F1/13452—Conductors connecting driver circuitry and terminals of panels
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/4985—Flexible insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • the present invention relates to the field of liquid crystal display technology, and in particular to a tape substrate having a soft on-chip structure of a liquid crystal panel.
  • the prior art Chip On Film (COF) type package structure basically adopts on-load automatic bonding (Tape Automated Bonding, TAB) technology performs thermal compression packaging of the driver chip and performs tape winding and tape feeding in a roll.
  • TAB on-load automatic bonding
  • the chip structure of each of the flexible boards can be sequentially cut from the tape substrate and electrically connected between the transparent circuit on the glass substrate of a liquid crystal panel and a driving circuit board.
  • the glass substrate and the driving circuit board may include one or several soft board chip structures. The higher the resolution of the liquid crystal panel, the more the number of chip structures used on the soft board.
  • the prior art has the following problems: since the width of the tape substrate is limited, and the number of leads at the output is continuously increased, the wiring of the output terminals is more and more complicated, and the spacing between the leads of the adjacent output ends is smaller and smaller. This causes an abnormality in signal transmission and affects the picture quality of the LCD panel.
  • An object of the present invention is to provide a tape substrate having a chip-on-chip configuration of a liquid crystal panel, so as to solve the problem in the prior art that the width of the tape substrate is limited, and the output terminal leads to an increase, resulting in an output terminal lead.
  • the wiring is more and more complicated, and the spacing between the leads of adjacent output terminals is getting smaller and smaller, which causes abnormal signal transmission and affects the technical problem of the picture display quality of the liquid crystal panel.
  • Another object of the present invention is to provide a liquid crystal panel to solve the problem in the prior art that the width of the tape substrate is limited, and the number of leads at the output end is increased, resulting in more and more complicated wiring of the output terminals, and adjacent outputs.
  • the spacing between the end leads is getting smaller and smaller, which causes an abnormality in signal transmission and affects the technical problem of the picture display quality of the liquid crystal panel.
  • the invention constructs a tape substrate of a soft-on-chip structure of a liquid crystal panel, the tape substrate comprising:
  • a package unit having a plurality of chip-on-board structures disposed on the substrate body and arranged along a long axis direction of the tape substrate, the package unit including an input end lead, an output end lead, a first side, and a first The two sides, the first side edge and the second side edge are along the long axis direction of the tape substrate, and are located on both sides of the tape substrate:
  • the output end leads are connected to the second side, and the output end leads extend from the second side into the package unit and have a bent structure.
  • the input lead is connected to the first side or the second side.
  • a bent structure of the output end lead forms a first bending angle, and the first bending angle is 90 degrees.
  • the input terminal is connected to the first side.
  • the input terminal is connected to the second side.
  • the input terminal leads extend from the first side or the second side of the connection to the package unit and have a bent structure.
  • the bending structure has a second bending angle, and the second bending angle is 90 degrees.
  • Another object of the present invention is to provide a tape substrate having a chip-on-chip configuration of a liquid crystal panel, so as to solve the problem in the prior art that the width of the tape substrate is limited, and the output terminal leads to an increase, resulting in an output terminal lead.
  • the wiring is more and more complicated, and the spacing between adjacent output terminals is getting smaller and smaller, which causes abnormal signal transmission and affects the technical problem of the picture quality of the liquid crystal panel.
  • the present invention has been constructed as a tape substrate having a chip-on-chip structure of a liquid crystal panel, the tape substrate being arranged in a package direction of a plurality of chip structures on a soft board along a long axis direction thereof, the package unit
  • the output lead is connected to the second side, and the output lead extends from the second side into the package unit and has a bent structure.
  • the bent structure of the output end lead is bent, and the bent structure forms a first bending angle, and the first bending The angle is 90 degrees.
  • the input terminal is connected to the first side.
  • the input terminal leads extend from the first side of the connection thereof to the package unit and have a bent structure, and the curve is bent.
  • the structure has a second bending angle and the second bending angle is 90 degrees.
  • the input terminal is connected to the second side.
  • the input terminal leads extend from the second side of the connection thereof to the package unit and have a bent structure, and the bend is bent.
  • the structure has a second bending angle and the second bending angle is 90 degrees.
  • Another object of the present invention is to provide a liquid crystal panel to solve the problem in the prior art that the width of the tape substrate is limited, and the number of leads at the output end is increased, resulting in more and more complicated wiring of the output terminals, and adjacent outputs.
  • the spacing between the end leads is getting smaller and smaller, which causes an abnormality in signal transmission and affects the technical problem of the picture display quality of the liquid crystal panel.
  • the present invention constructs a liquid crystal panel, which includes:
  • a driving circuit board wherein the second substrate is electrically connected by a package unit configured by a plurality of chip-on-board devices, wherein each of the package units includes an input end lead, an output end lead, a first side, and a second side.
  • the first side and the second side are located on opposite sides of each of the package units, and the length direction of the driving chip is perpendicular to the long axis direction of the driving circuit board:
  • the output end leads are connected to the second side, and the output end leads extend from the second side into the package unit and have a bent structure.
  • the bent structure of the output end lead is bent, and the bent structure forms a first bending angle, and the first bending angle is 90 degrees.
  • the input terminal is connected to the first side.
  • the input end lead extends from the first side of the connection thereof into the package unit and has a bent structure, and the bent structure has a second bending angle, The second bending angle is 90 degrees.
  • the input terminal is connected to the second side.
  • the input terminal leads extend from the second side of the connection thereof to the package unit and have a bent structure, and the bent structure has a second bending angle, The second bending angle is 90 degrees.
  • the present invention connects the output end leads of each package unit to the second side, wherein the second side edge is located on one side of the tape substrate along the long axis direction of the tape substrate, by the above manner Therefore, the cut COF is no longer limited by the width of the tape substrate, and the width of the COF can be flexibly increased according to the wiring requirements on the large-sized liquid crystal panel, thereby ensuring the spacing between the leads of adjacent output terminals, thereby avoiding the phase difference.
  • the signal between the adjacent output terminals is too small, and the output leads are bent from the second side to the package unit, especially in a bent structure, which simplifies the wiring of the output leads. .
  • FIG. 1 is a structural view showing a first preferred embodiment of a tape substrate having a soft-on-chip structure of a liquid crystal panel according to the present invention
  • FIG. 2 is a structural view showing a second preferred embodiment of a tape substrate of a soft-board structure of a liquid crystal panel according to the present invention
  • FIG. 3 is a structural view showing a third preferred embodiment of a tape substrate having a chip-on-board structure of a liquid crystal panel according to the present invention.
  • FIG. 4 is a structural view showing a fourth preferred embodiment of a tape substrate of a soft-board structure of a liquid crystal panel according to the present invention.
  • FIG. 5 is an assembled top view of a liquid crystal panel of the present invention, a corresponding soft board chip structure of FIG. 3, and a preferred embodiment of the driving circuit board;
  • Figure 6 is a side view showing the assembly of the liquid crystal panel of the present invention, the corresponding chip structure of the soft board of Figure 3, and the preferred embodiment of the driving circuit board.
  • FIG. 1 is a structural diagram of a first preferred embodiment of a tape substrate of a soft-board chip structure of a liquid crystal panel according to the present invention.
  • the tape substrate 10 includes a package unit 11 having a plurality of soft-on-chip structures arranged along the substrate body 101 and the long-axis direction M1, and a package unit 12 .
  • the package unit 11 and the package unit 12 are disposed on the substrate body 101.
  • the package unit is disposed on the take-up substrate 10 before being cut.
  • the tape substrate 10 generally refers to a flexible circuit board (flexible Circuit board) generally comprises a flexible polymer layer and a lead layer (not shown) sandwiched between the flexible polymer layers.
  • the package unit 11 includes an input lead 111 (a relatively thick line in the drawing), an output lead 112 (a relatively thin line in the drawing), and includes The first side 113 and the second side 114 on both sides of the take-up substrate 10 are located along the long-axis direction M1 of the take-up substrate 10.
  • the input lead 111 is connected to the first side 113 and the output lead 112 is connected to the second side 114.
  • the input terminal lead 111 and the output end lead 112 are all part of the lead layer of the tape substrate 10 .
  • the output lead 112 is from the second side 114 . It is extended in the package unit 11 and has a bent structure.
  • the output end lead 112 has a bent structure, and may of course be a multi-channel bent structure, which is not enumerated here.
  • the output end lead 112 is bent to form a first bending angle ⁇ 1,
  • the first bending angle ⁇ 1 is 90 degrees, and may of course be other angles, which are not enumerated here.
  • the input lead 111 extends from the first side 113 into the package unit 11 and has a bent structure.
  • the input lead 111 has a bent structure. It can also be a multi-turn structure, which is not listed here.
  • the input end lead 111 is bent to form a second bending angle ⁇ 2, Preferably, the second bending angle ⁇ 2 is 90 degrees. Of course, other angles may be used, as long as the space of the packaging unit 11 can be reasonably utilized, and are not enumerated here.
  • FIG. 2 is a structural diagram of a second preferred embodiment of a tape substrate of a soft-board structure of a liquid crystal panel according to the present invention.
  • the tape substrate 20 shown in FIG. 2 includes a package unit 21 and a package unit 22 which are arranged in a plurality of soft on-board structures arranged along the substrate body 201 and the major axis direction M1.
  • the package unit 21 includes an input lead 211 (a relatively thick line in the drawing), an output lead 212 (a relatively thin line in the drawing), and further includes a longitudinal axis M1 along the tape substrate 20 a first side 213 and a second side 214 on both sides of the tape substrate 20.
  • the input lead 211 (relatively thicker line in the drawing) and the output lead 212 ( The relatively thin lines in the illustration are all connected to the second side 214.
  • the input lead 211 and the output lead 212 extend from the second side 214 into the package unit 21 and are each bent, preferably A bent structure.
  • the output end lead 212 is bent to form a first bending angle ⁇
  • the first bending angle ⁇ 1 is 90 degrees
  • the input end lead 211 is bent to form a second bending angle ⁇ 2
  • the second bending angle ⁇ 2 is 90 degree.
  • the output leads of each package unit are respectively connected to the second side, wherein the second side is located on the main body of the tape substrate along the long axis direction of the main body of the web substrate
  • the cut COF is no longer limited by the width of the tape substrate, and the width of the COF can be flexibly increased according to the wiring requirements on the large-sized liquid crystal panel (ie, along the length of the tape substrate)
  • the axial direction M1) ensures the spacing between the leads of adjacent output terminals, avoiding signal anomalies caused by too small a spacing between adjacent output terminals.
  • the output end lead is bent from the second side to the package unit, and is in a bent structure, so that the wiring of the output end lead is more compact.
  • FIG. 3 is a view showing the structure of a third preferred embodiment of the tape substrate of the soft-board structure of the liquid crystal panel of the present invention.
  • the tape substrate 10 includes a package unit 11 having a plurality of soft-on-chip structures arranged along the substrate body 101 and the long-axis direction M1, and a package unit 12 .
  • the package units 11 and 12 are disposed on the substrate body 101.
  • the package unit is disposed on the take-up substrate 10 before being cut.
  • the tape substrate 10 generally refers to a flexible circuit board (flexible Circuit board), which generally comprises a flexible polymer layer and a lead layer (not shown) sandwiched between the layers of the flexible polymer.
  • the package unit 11 includes an input lead 111 (a relatively thick line in the drawing), an output lead 112 (a relatively thin line in the drawing), and includes The first side 113 and the second side 114 on both sides of the take-up substrate 10 are located along the long-axis direction M1 of the take-up substrate 10.
  • the input lead 111 is connected to the first side 113 and the output lead 112 is connected to the second side 114.
  • the input terminal lead 111 and the output end lead 112 are all part of the lead layer of the tape substrate 10 .
  • the package unit 11 further includes a driving chip 31 whose active surface faces downward, and Gold bumps (not shown) of its active surface are bonded to the inner ends of the input terminal lead 111 and the output terminal lead 112 by thermocompression bonding.
  • the tape substrate 10 extends in the long axis direction M1
  • the driving chip 31 extends along the length direction M2 thereof.
  • M1 and M2 are perpendicular to each other. Since the package unit has been described in detail in FIG. 1, it will not be described again here.
  • the input side lead and the output end lead of each package unit are respectively connected to the first side and the second side, wherein the first side and the second side edge are taped
  • the long axis direction of the substrate is located on both sides of the main body of the tape substrate.
  • the output end lead is bent from the second side to the package unit, and is in a bent structure, so that the wiring of the output end lead is more compact.
  • FIG. 4 is a structural diagram of a fourth preferred embodiment of a tape substrate of a soft-board structure of a liquid crystal panel according to the present invention.
  • FIG. 4 is a structural diagram corresponding to FIG. 2, that is, the driving chip 41 is added on the basis of that shown in FIG. 2.
  • the difference from the third preferred embodiment shown in FIG. 3 is that in the embodiment shown in FIG. 4, the input terminal leads 211 (relatively thick lines in the drawing) and the output terminal leads 212 ( The relatively thin lines in the illustration are all connected to the second side 214.
  • the structure of the liquid crystal panel, the chip structure on the soft board and the structure of the driving circuit board corresponding to the third preferred embodiment shown in FIG. 3 will be described below with reference to FIG. 5 and FIG. 6.
  • FIG. 5 is an assembled top view of a liquid crystal panel, a chip structure on a soft board, and a driving circuit board according to a preferred embodiment of the present invention
  • FIG. 6 is a schematic diagram of a liquid crystal panel and a chip on a soft board according to the present invention
  • the driving circuit board 51 is further included, and the liquid crystal panel 52 includes a first substrate 521 and a second substrate 522, and a transparent circuit on the second substrate 522 ( The figure is not shown) the drive circuit board 51 is electrically connected by a package unit constructed by a plurality of on-board chips.
  • the package unit in FIG. 5 and FIG. 6 is cut according to the tape substrate constructed on the soft board of the liquid crystal panel of FIG.
  • the package unit 11 is connected to the drive circuit board 51 through the input terminal lead 111, and the second substrate 522 of the liquid crystal display 52 is connected through the output end lead 112.
  • the package unit 11 includes an input end lead 111, an output end lead 112, a first side 113, and a second side 114.
  • the first side 113 and the second side 114 are located in the package unit. 11 along both sides of the length direction M1, the length direction M2 of the driving chip 31 is perpendicular to the long-axis direction M1 of the driving circuit board, and the input terminal lead 111 is connected to the first side 113, the output The end lead 112 is connected to the second side 114, and the output end lead 112 extends from the second side 114 into the package unit 11 and has a bent structure. Referring to FIG. 5 and FIG.
  • the first side 113 is connected to the driving circuit board 51 , so that the input lead 111 is electrically connected to the driving circuit board 51;
  • the transparent circuit on the second substrate 522 is further configured to electrically connect the output terminal 112 to the transparent circuit on the second substrate 522.

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Abstract

液晶面板（52）的软板上芯片构造的卷带基板（10，20）以及使用此卷带基板（10，20）的液晶面板（52），所述卷带基板（10，20）沿其长轴方向（M1）排列多个软板上芯片构造的封装单元（11，12，21，22），每个封装单元（11，12，21，22）内，封装单元（11，12，21，22）的输出端引线（112，212）连接至封装单元（11，12，21，22）的第二侧边（114，214），且所述输出端引线（112，212）从所述第二侧边（114，214）向所述封装单元（11，12，21，22）内延伸并呈弯折结构。

Description

[根据细则37.2由ISA制定的发明名称]　液晶面板的软板上芯片构造的卷带基板以及使用此卷带基板的液晶面板 技术领域
本发明涉及液晶显示技术领域，特别是涉及一种液晶面板的软板上芯片构造的卷带基板。
 背景技术
随着液晶技术的不断发展，对液晶面板内各部件的要求越来越高。
现有技术的软板上芯片（Chip On Film，COF）型封装构造基本上都采用带载自动键合（Tape Automated Bonding，TAB）技术进行驱动芯片的热压合封装，并以成卷的方式进行卷带和送带的。在使用时，每一软板上芯片构造可依序自卷带基板被切割下来，并电性连接于一液晶面板的玻璃基板上的透明电路与一驱动电路板之间。玻璃基板与驱动电路板之间可包含一个或数个软板上芯片构造，液晶面板的分辨率愈大，使用的软板上芯片构造的颗数就愈多。
然而，现有技术存在以下问题：由于卷带基板的宽度受限，而输出端引线的不断增加，导致输出端引线的布线越来越复杂，相邻输出端引线之间的间距越来越小，使得信号传输出现异常，影响液晶面板的画面显示质量。
 技术问题
本发明的一个目的在于提供一种液晶面板的软板上芯片构造的卷带基板，以解决现有技术中由于卷带基板的宽度受限，而输出端引线的不断增加，导致输出端引线的布线越来越复杂，相邻输出端引线之间的间距越来越小，使得信号传输出现异常，影响液晶面板的画面显示质量的技术问题。
本发明的又一个目的在于提供一种液晶面板，以解决现有技术中由于卷带基板的宽度受限，而输出端引线的不断增加，导致输出端引线的布线越来越复杂，相邻输出端引线之间的间距越来越小，使得信号传输出现异常，影响液晶面板的画面显示质量的技术问题。
 技术解决方案
发明构造了一种液晶面板的软板上芯片构造的卷带基板，所述卷带基板包括：
基板本体；以及
多个软板上芯片构造的封装单元，设置于所述基板本体上，沿所述卷带基板的长轴方向排列，所述封装单元包括输入端引线、输出端引线、第一侧边及第二侧边，第一侧边及第二侧边是沿所述卷带基板的长轴方向，且位于所述卷带基板两侧：
其中，在每个封装单元内，所述输出端引线连接至所述第二侧边，且所述输出端引线从所述第二侧边向所述封装单元内延伸并呈一道弯折结构，所述输入端引线连接至所述第一侧边或者所述第二侧边。
在本发明的液晶面板的软板上芯片构造的卷带基板中，所述输出端引线的一道弯折结构形成第一弯折角度，所述第一弯折角度为90度。
在本发明的液晶面板的软板上芯片构造的卷带基板中，所述输入端引线连接至所述第一侧边。
在本发明的液晶面板的软板上芯片构造的卷带基板中，所述输入端引线连接至所述第二侧边。
在本发明的液晶面板的软板上芯片构造的卷带基板中，所述输入端引线从其连接的第一侧边或者第二侧边向所述封装单元内延伸并呈一道弯折结构，且该道弯折结构具有第二弯折角度，所述第二弯折角度为90度。
本发明的另一个目的在于提供一种液晶面板的软板上芯片构造的卷带基板，以解决现有技术中由于卷带基板的宽度受限，而输出端引线的不断增加，导致输出端引线的布线越来越复杂，相邻输出端引线之间的间距越来越小，使得信号传输出现异常，影响液晶面板的画面显示质量的技术问题。
为解决上述问题，本发明构造了一种液晶面板的软板上芯片构造的卷带基板，所述卷带基板沿其长轴方向排列多个软板上芯片构造的封装单元，所述封装单元包括驱动芯片、输入端引线和输出端引线，还包括沿所述卷带基板的长轴方向位于所述卷带基板两侧的第一侧边和第二侧边，所述驱动芯片的长度方向垂直于所述卷带基板的长轴方向；
在每个封装单元内，所述输出端引线连接至所述第二侧边，且所述输出端引线从所述第二侧边向所述封装单元内延伸并呈弯折结构。
在本发明的液晶面板的软板上芯片构造的卷带基板中，所述输出端引线的弯折结构为一道弯折，且该弯折结构形成第一弯折角度，所述第一弯折角度为90度。
在本发明的液晶面板的软板上芯片构造的卷带基板中，所述输入端引线连接至所述第一侧边。
在本发明的液晶面板的软板上芯片构造的卷带基板中，所述输入端引线从其连接的第一侧边向所述封装单元内延伸并呈一道弯折结构，且该道弯折结构具有第二弯折角度，所述第二弯折角度为90度。
在本发明的液晶面板的软板上芯片构造的卷带基板中，所述输入端引线连接至所述第二侧边。
在本发明的液晶面板的软板上芯片构造的卷带基板中，所述输入端引线从其连接的第二侧边向所述封装单元内延伸并呈一道弯折结构，且该道弯折结构具有第二弯折角度，所述第二弯折角度为90度。
本发明的又一个目的在于提供一种液晶面板，以解决现有技术中由于卷带基板的宽度受限，而输出端引线的不断增加，导致输出端引线的布线越来越复杂，相邻输出端引线之间的间距越来越小，使得信号传输出现异常，影响液晶面板的画面显示质量的技术问题。
为解决上述问题，本发明构造了一种液晶面板，：所述液晶面板包括：
第一基板；
第二基板；
驱动电路板，通过数个软板上芯片构造的封装单元来电性连接所述第二基板，其中每一所述封装单元包括输入端引线、输出端引线、第一侧边及第二侧边，第一侧边及第二侧边是位于每一所述封装单元的两侧，所述驱动芯片的长度方向垂直于所述驱动电路板的长轴方向：
其中，在每个封装单元内，所述输出端引线连接至所述第二侧边，且所述输出端引线从所述第二侧边向所述封装单元内延伸并呈弯折结构。
在本发明的液晶面板中，所述输出端引线的弯折结构为一道弯折，且该弯折结构形成第一弯折角度，所述第一弯折角度为90度。
在本发明的液晶面板中，所述输入端引线连接至所述第一侧边。
在本发明的液晶面板中，所述输入端引线从其连接的第一侧边向所述封装单元内延伸并呈一道弯折结构，且该道弯折结构具有第二弯折角度，所述第二弯折角度为90度。
在本发明的液晶面板中，所述输入端引线连接至所述第二侧边。
在本发明的液晶面板中，所述输入端引线从其连接的第二侧边向所述封装单元内延伸并呈一道弯折结构，且该道弯折结构具有第二弯折角度，所述第二弯折角度为90度。
 有益效果
本发明相对于现有技术，通过将每个封装单元的输出端引线分别连接至第二侧边，其中，第二侧边沿卷带基板的长轴方向位于卷带基板的一侧，通过上述方式，使得裁剪出来的COF不再受卷带基板宽度的限制，能够根据大尺寸的液晶面板上的布线要求灵活地增加COF的宽度，保证了相邻输出端引线之间的间距，避免了由于相邻输出端引线之间的间距过小造成的信号异常；而且，输出端引线从第二侧边向封装单元延伸后呈弯折结构，尤其是呈一道弯折结构，简化了输出端引线的布线。
 附图说明
图1为本发明中液晶面板的软板上芯片构造的卷带基板的第一较佳实施例的结构图；
图2为本发明中液晶面板的软板上芯片构造的卷带基板的第二较佳实施例的结构图；
图3为本发明中液晶面板的软板上芯片构造的卷带基板的第三较佳实施例的结构图；
图4为本发明中液晶面板的软板上芯片构造的卷带基板的第四较佳实施例的结构图；
图5为本发明中液晶面板，图3对应的软板上芯片构造，以及驱动电路板的较佳实施例的组装上视图；以及
图6为本发明中液晶面板，图3对应的软板上芯片构造，以及驱动电路板的较佳实施例的组装侧视图。
 本发明的最佳实施方式
以下各实施例的说明是参考附加的图式，用以例示本发明可用以实施的特定实施例。
请参阅图1，图1为本发明中液晶面板的软板上芯片构造的卷带基板的第一较佳实施例的结构图。
所述卷带基板10包括沿基板本体101以及长轴方向M1排列的多个软板上芯片构造的封装单元11、封装单元12…。封装单元11、封装单元12是设置于所述基板本体101上。在未切割之前，封装单元均设置于所述卷带基板10上。所述卷带基板10通常是指一柔性电路板(flexible circuit board)，其一般包含可挠性聚合物层及引线层（图未示出），所述引线层夹于所述可挠性聚合物层之间。
请继续参阅图1，以封装单元11为例，封装单元11包括有输入端引线111（图示中相对较粗的线条）、输出端引线112（图示中相对较细的线条），还包括沿所述卷带基板10的长轴方向M1位于所述卷带基板10两侧的第一侧边113和第二侧边114。在图1所示的实施例中，所述输入端引线111连接至所述第一侧边113，所述输出端引线112连接至所述第二侧边114。其中，所述输入端引线111和所述输出端引线112皆为所述卷带基板10的引线层的一部份。
请继续参阅图1，所述输出端引线112从所述第二侧边114 向所述封装单元11内延伸并呈弯折结构，优选的，所述输出端引线112呈一道弯折结构，当然也可以是多道弯折结构，此处不一一列举。所述输出端引线112弯折后形成第一弯折角度θ１， 优选的，所述第一弯折角度θ １为90度，当然也可以是其他的角度，此处不一一列举。
请继续参阅图1，所述输入端引线111从所述第一侧边113向所述封装单元11内延伸并呈弯折结构，优选的，所述输入端引线111呈一道弯折结构，当然也可以是多道弯折结构，此处不一一列举。所述输入端引线111弯折后形成第二弯折角度θ 2，优选的，所述第二弯折角度θ 2为90度，当然也可以是其他的角度，只要能够合理的利用所述封装单元11的空间即可，此处不一一列举。
请参阅图2，图2为本发明中液晶面板的软板上芯片构造的卷带基板的第二较佳实施例的结构图。
与图1所示的第一较佳实施例相同，图2所示的卷带基板20包括沿基板本体201以及长轴方向M1排列的多个软板上芯片构造的封装单元21、封装单元22…。封装单元21包括有输入端引线211（图示中相对较粗的线条）、输出端引线212（图示中相对较细的线条），还包括沿所述卷带基板20的长轴方向M1位于所述卷带基板20两侧的第一侧边213和第二侧边214。
与图1所示的第一较佳实施例的不同之处在于，在图2所示的实施例中，所述输入端引线211（图示中相对较粗的线条）和输出端引线212（图示中相对较细的线条）均连接至所述第二侧边214。
图2所示的实施例中，所述输入端引线211和所述输出端引线212从所述第二侧边214向所述封装单元21内延伸并均呈弯折结构，优选的，均呈一道弯折结构。所述输出端引线212弯折后形成第一弯折角度θ １，优选的，所述第一弯折角度θ １为90度；所述输入端引线211弯折后形成第二弯折角度θ 2，优选的，所述第二弯折角度θ 2为90度。
在图1和图2所示的实施例中，通过将每个封装单元的输出端引线分别连接至第二侧边，其中，第二侧边沿卷带基板主体的长轴方向位于卷带基板主体的一侧，通过上述方式，使得裁剪出来的COF不再受卷带基板宽度的限制，能够根据大尺寸的液晶面板上的布线要求灵活地增加COF的宽度（即沿所述卷带基板的长轴方向M1），保证了相邻输出端引线之间的间距，避免了由于相邻输出端引线之间的间距过小造成的信号异常。
而且，输出端引线从第二侧边向封装单元延伸后呈弯折结构，尤其是呈一道弯折结构，使得输出端引线的布线更加简洁。
请参阅图3，图3是本发明中液晶面板的软板上芯片构造的卷带基板的第三较佳实施例的结构。
所述卷带基板10包括沿基板本体101以及长轴方向M1排列的多个软板上芯片构造的封装单元11、封装单元12…。封装单元11、12是设置于基板本体101上。在未切割之前，封装单元均设置于所述卷带基板10上。所述卷带基板10通常是指一柔性电路板(flexible circuit board)，其一般包含至可挠性聚合物层及一引线层（图未示出），所述引线层夹于所述至可挠性聚合物层之间。
请继续参阅图1，以封装单元11为例，封装单元11包括有输入端引线111（图示中相对较粗的线条）、输出端引线112（图示中相对较细的线条），还包括沿所述卷带基板10的长轴方向M1位于所述卷带基板10两侧的第一侧边113和第二侧边114。在图1所示的实施例中，所述输入端引线111连接至所述第一侧边113，所述输出端引线112连接至所述第二侧边114。其中，所述输入端引线111和所述输出端引线112皆为所述卷带基板10的引线层的一部份。
请参阅图3，与图1所示的实施例不同之处在于，在图3所示的实施例中，封装单元11还包括驱动芯片31，所述驱动芯片31的有源表面朝下，且其有源表面的金凸块（图未示出）通过热压合结合于所述输入端引线111及输出端引线112的内端上。
在图3所示的实施例中，所述卷带基板10沿长轴方向M1延伸，所述驱动芯片31沿其长度方向M2延伸， M1和M2相互垂直。鉴于封装单元在图1已有详细的描述，此处不再赘述。
在图3所示的实施例中，通过将每个封装单元的输入端引线和输出端引线分别连接至第一侧边和第二侧边，其中，第一侧边和第二侧边沿卷带基板的长轴方向位于卷带基板主体的两侧，通过上述方式，使得裁剪出来的COF不再受卷带基板宽度的限制，能够根据大尺寸的液晶面板上的布线要求灵活地增加COF的宽度，保证了相邻输出端引线之间的间距，避免了由于相邻输出端引线之间的间距过小造成的信号异常。
而且，输出端引线从第二侧边向封装单元延伸后呈弯折结构，尤其是呈一道弯折结构，使得输出端引线的布线更加简洁。
请参阅图4，图4为本发明中液晶面板的软板上芯片构造的卷带基板的第四较佳实施例的结构图。
其中，图4为对应图2的结构图，即在图2所示的基础上增加驱动芯片41。与图3所示的第三较佳实施例的不同之处在于，在图4所示的实施例中，所述输入端引线211（图示中相对较粗的线条）和输出端引线212（图示中相对较细的线条）均连接至所述第二侧边214。
下面结合图5和图6说明图3所示的第三较佳实施例对应的液晶面板、软板上芯片构造及驱动电路板的结构，图4所示的第四较佳实施例的原理结构类似，可相互参考。
请参阅图5和图6，图5为本发明中液晶面板、软板上芯片构造及驱动电路板的较佳实施例的组装上视图；图6为本发明中液晶面板、软板上芯片构造及驱动电路板的较佳实施例的组装侧视图。
在图5和图6所示的组装结构中,包括驱动电路板51，还包括液晶面板52，液晶面板52包括第一基板521和第二基板522，所述第二基板522上的透明电路（图未示出）通过数个软板上芯片构造的封装单元来电性连接驱动电路板51。其中，图5和图6中的封装单元为按照图3中液晶面板的软板上芯片构造的卷带基板切割而来。
以封装单元11为例，请一并参阅图3，封装单元11通过输入端引线111连结驱动电路板51，通过输出端引线112连接液晶显示器52的第二基板522。
其中，请参阅图3，封装单元11包括输入端引线111、输出端引线112、第一侧边113及第二侧边114，第一侧边113及第二侧边114是位于所述封装单元11沿长度方向M1的两侧，所述驱动芯片31的长度方向M2垂直于所述驱动电路板的长轴方向M1，所述输入端引线111连接至所述第一侧边113，所述输出端引线112连接至所述第二侧边114，且所述输出端引线112从所述第二侧边114向所述封装单元11内延伸并呈弯折结构。请参阅图5和图6，所述第一侧边113连接所述驱动电路板51，进而使得所述输入端引线111电性连接所述驱动电路板51；所述第二侧边114连接所述第二基板522上的透明电路，进而使得所述输出端引线112电性连接所述第二基板522上的透明电路。
综上所述，虽然本发明已以优选实施例揭露如上，但上述优选实施例并非用以限制本发明，本领域的普通技术人员，在不脱离本发明的精神和范围内，均可作各种更动与润饰，因此本发明的保护范围以权利要求界定的范围为准。
 本发明的实施方式
工业实用性
序列表自由内容

Claims (15)

  1. 一种液晶面板的软板上芯片构造的卷带基板，包括：
    基板本体；以及
    多个软板上芯片构造的封装单元，设置于所述基板本体上，沿所述卷带基板的长轴方向排列，所述封装单元包括输入端引线、输出端引线、第一侧边及第二侧边，所述第一侧边及所述第二侧边是沿所述卷带基板的所述长轴方向，且位于所述卷带基板两侧；
    其中，在每个封装单元内，所述输出端引线连接至所述第二侧边，且所述输出端引线从所述第二侧边向所述封装单元内延伸并呈一道弯折结构，所述输入端引线连接至所述第一侧边或者所述第二侧边。
  2. 根据权利要求1所述的液晶面板的软板上芯片构造的卷带基板，其中所述输出端引线的一道弯折结构形成第一弯折角度，所述第一弯折角度为90度。
  3. 根据权利要求2所述的液晶面板的软板上芯片构造的卷带基板，其中所述输入端引线从其连接的第一侧边或者第二侧边向所述封装单元内延伸并呈一道弯折结构，且该道弯折结构具有第二弯折角度，所述第二弯折角度为90度。
  4. 一种液晶面板的软板上芯片构造的卷带基板，包括：
    基板本体；以及
    多个软板上芯片构造的封装单元，设置于所述基板本体上，沿所述卷带基板的长轴方向排列，所述封装单元包括驱动芯片、输入端引线和输出端引线、第一侧边及第二侧边，所述第一侧边及所述第二侧边是沿所述卷带基板的长轴方向，且位于所述卷带基板两侧，所述驱动芯片的长度方向垂直于所述卷带基板的长轴方向；
    其中，在每个封装单元内，所述输出端引线连接至所述第二侧边，且所述输出端引线从所述第二侧边向所述封装单元内延伸并呈弯折结构。
  5. 根据权利要求4所述的液晶面板的软板上芯片构造的卷带基板，其中所述输出端引线的弯折结构为一道弯折，且该弯折结构形成第一弯折角度，所述第一弯折角度为90度。
  6. 根据权利要求5所述的液晶面板的软板上芯片构造的卷带基板，其中所述输入端引线连接至所述第一侧边。
  7. 根据权利要求6所述的液晶面板的软板上芯片构造的卷带基板，其特征在于，所述输入端引线从其连接的第一侧边向所述封装单元内延伸并呈一道弯折结构，且该道弯折结构具有第二弯折角度，所述第二弯折角度为90度。
  8. 根据权利要求5所述的液晶面板的软板上芯片构造的卷带基板，其中所述输入端引线连接至所述第二侧边。
  9. 根据权利要求8所述的液晶面板的软板上芯片构造的卷带基板，其特征在于，所述输入端引线从其连接的第二侧边向所述封装单元内延伸并呈一道弯折结构，且该道弯折结构具有第二弯折角度，所述第二弯折角度为90度。
  10. 一种液晶面板，包括：
    第一基板；
    第二基板；
    驱动电路板，通过数个软板上芯片构造的封装单元来电性连接所述第二基板，其中每一所述封装单元包括输入端引线、输出端引线、第一侧边及第二侧边，所述第一侧边及所述第二侧边是位于每一所述封装单元的两侧，所述驱动芯片的长度方向垂直于所述驱动电路板的长轴方向：
    其中，在每个封装单元内，所述输出端引线连接至所述第二侧边，且所述输出端引线从所述第二侧边向所述封装单元内延伸并呈弯折结构。
  11. 根据权利要求10所述的液晶面板，其中所述输出端引线的弯折结构为一道弯折，且该弯折结构形成第一弯折角度，所述第一弯折角度为90度。
  12. 根据权利要求11所述的液晶面板，其中所述输入端引线连接至所述第一侧边。
  13. 根据权利要求12所述的液晶面板，其中所述输入端引线从其连接的第一侧边向所述封装单元内延伸并呈一道弯折结构，且该道弯折结构具有第二弯折角度，所述第二弯折角度为90度。
  14. 根据权利要求11所述的液晶面板，其中所述输入端引线连接至所述第二侧边。
  15. 根据权利要求14所述的液晶面板，其中所述输入端引线从其连接的第二侧边向所述封装单元内延伸并呈一道弯折结构，且该道弯折结构具有第二弯折角度，所述第二弯折角度为90度。
PCT/CN2011/083362 2011-12-01 2011-12-02 液晶面板的软板上芯片构造的卷带基板以及使用此卷带基板的液晶面板 WO2013078674A1 (zh)

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