WO2020107740A1 - 触控显示面板及触控显示装置 - Google Patents

触控显示面板及触控显示装置 Download PDF

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Publication number
WO2020107740A1
WO2020107740A1 PCT/CN2019/077155 CN2019077155W WO2020107740A1 WO 2020107740 A1 WO2020107740 A1 WO 2020107740A1 CN 2019077155 W CN2019077155 W CN 2019077155W WO 2020107740 A1 WO2020107740 A1 WO 2020107740A1
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Prior art keywords
layer
display panel
organic layer
panel according
touch
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PCT/CN2019/077155
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English (en)
French (fr)
Inventor
唐岳军
李雪云
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武汉华星光电技术有限公司
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Application filed by 武汉华星光电技术有限公司 filed Critical 武汉华星光电技术有限公司
Priority to US16/604,274 priority Critical patent/US11372499B2/en
Publication of WO2020107740A1 publication Critical patent/WO2020107740A1/zh

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Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/0416—Control or interface arrangements specially adapted for digitisers
    • G06F3/04164—Connections between sensors and controllers, e.g. routing lines between electrodes and connection pads
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/13338—Input devices, e.g. touch panels
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/0412—Digitisers structurally integrated in a display
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/844—Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/40—OLEDs integrated with touch screens
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/873—Encapsulations

Definitions

  • the present application relates to the field of display technology, in particular to a touch display panel and a touch display device.
  • in-cell touch is a form that is currently widely used. In-cell touch is to make a touch function layer on the outer surface of the packaging layer after the display package is completed, and then electrically connect the touch function layer to the touch chip through the flexible circuit board. The binding terminals of the touch function layer are electrically connected to the touch chip through the flexible circuit board.
  • the touch function and the display function generally need to be controlled by different chips, which causes a problem of a large number of chips used.
  • the touch function and the display function need to be controlled by different chips, which causes the problem of using a large number of chips. Connecting together is more difficult to achieve in structure.
  • This application provides a touch display panel, including:
  • Array substrate including the first trace
  • the light-emitting layer is provided on the array substrate;
  • An encapsulation layer disposed on the light-emitting layer, covering the light-emitting layer;
  • the touch function layer is arranged on the packaging layer
  • the touch function layer includes a second trace, the second trace is electrically connected to the first trace along an edge of the packaging layer, and the first trace and the second trace A connection end forms a connection end, and the edge of the packaging layer corresponding to the second trace is a stepped structure.
  • the encapsulation layer includes an organic layer and an inorganic layer, and the step structure is formed by a slope structure at the edge of the organic layer.
  • the encapsulation layer includes an alternating arrangement of multiple organic layers and multiple inorganic layers, and the step structure is formed by a slope structure at the edge of the organic layer.
  • the slope surfaces of the slope structure at the edge of the organic layer of each layer are in the same plane to form a single-layer step structure.
  • the slope surfaces of the slope structure at the edge of the organic layer of each layer are in different planes to form a multilayer step structure.
  • the length of the lower organic layer is greater than that of the adjacent upper organic layer to form a platform between adjacent two organic layers.
  • one or two adjacent layers or multiple adjacent organic layers are a group, and the slope of the slope structure at the edge of the organic layer in each group
  • the surfaces are in the same plane, and the slope surfaces of the slope structure of the edge of the organic layer between each group are in different planes to form a multi-layer step structure.
  • the lengths of the organic layers in the group of the lower layer are all longer than the organic layers in the group of the adjacent upper layer, so as to form a platform between the adjacent two groups.
  • the inorganic layer completely covers the organic layer and the slope structure at the edge of the organic layer.
  • the material of the inorganic layer is silicon nitride, aluminum nitride, zirconium nitride, titanium nitride, hafnium nitride, tantalum nitride, silicon oxide, aluminum oxide, titanium oxide, tin oxide , One or more of cerium oxide and silicon oxynitride.
  • the organic layer material is polymethyl methacrylate, phenol-based polymer derivative, propylene-based polymer, imino polymer, aryl ether-based polymer, amide-based polymer, fluorine-based One or more of a polymer, a paraxylene-based polymer, and a vinyl alcohol-based polymer.
  • the array substrate further includes a binding end, and the binding end is electrically connected to a chip integrated with a display control and touch control function.
  • connection end is electrically connected to the binding end.
  • connection end is parallel to the binding end.
  • connection end is composed of two segments respectively located on both sides of the end of the binding end.
  • connection end is composed of a section located on the side of the binding end.
  • connection end is perpendicular to the binding end.
  • connection end includes two sections perpendicular to each other, and the two sections of the connection end are parallel and perpendicular to the binding end, respectively.
  • the present application also provides a touch display device including the touch display panel as described above.
  • the technical solution provided in this application electrically connects the traces of the touch function layer to the traces on the array substrate along the step structure provided at the edge of the packaging layer, and then electrically connects to the integrated control display and
  • the touch function chip realizes the control of the display function and touch function of the touch display panel or touch display device, thereby reducing the number of chips used, and at the same time, the step structure at the edge of the packaging layer effectively relieves the touch function layer
  • the steepness with the array substrate is convenient for electrically connecting the traces on the touch function layer to the traces on the array substrate.
  • FIG. 1 is a schematic structural diagram of a touch display panel provided by an embodiment of this application.
  • FIG. 2 is a cross-sectional view of the touch display panel shown in FIG. 1 along A-A;
  • FIG. 3 is a cross-sectional view of the touch display panel shown in FIG. 1 along B-B;
  • FIGS. 4 to 7 are schematic structural diagrams of a touch display panel including an edge step structure of an encapsulation layer according to Embodiment 1 of the present application.
  • the touch display panel includes an array substrate, a light-emitting layer, an encapsulation layer, and a touch function layer, and a trace structure of the touch function layer along the edge of the package layer It is electrically connected to the wiring on the array substrate, and then is electrically connected to the chip with integrated control display and touch function through the bonding end, so as to control the display function and touch function of the touch display panel, thereby
  • the number of chips used is reduced, and at the same time, the stepped structure at the edge of the packaging layer effectively eases the steepness between the touch function layer and the array substrate, thereby facilitating the electrical conduction of the traces on the touch function layer to the array substrate Alignment.
  • FIG. 1 shows a connection terminal 106 formed by connecting a trace on the touch function layer 104 and a trace on the array substrate 101.
  • the connection terminal 106 is, for example, a line or a welding surface composed of a plurality of solder joints, and is disposed on the array substrate Four different positional relationships of the binding end 107 on 101, where the connection ends 106 in (a), (b), and (c) in FIG. 1 are located at both ends of the binding end 107 On both sides, the connecting end 106 of (a) in FIG. 1 is parallel to the binding end 107, the connecting end 106 of (b) in FIG.
  • connection end 106 of (c) in FIG. 1 is perpendicular to the binding end 107, and the connecting end 106 of (c) in FIG. 1 These are two sections perpendicular to each other, respectively parallel and perpendicular to the binding end 107; the connecting end 106 in (d) in FIG. 1 is located on the side of the binding end 107 and parallel to the binding end 107. It should be noted that, the positional relationship between the above-mentioned four connection ends 106 and the binding end 107 can be freely selected according to the installation position of the internal device of the display panel.
  • FIGS. 1 to 3 are cross-sectional views along A-A and B-B, respectively, and the touch display panel provided in this embodiment will be specifically described below with reference to FIGS. 1 to 3:
  • the touch display panel provided in this embodiment includes an array substrate 101, a light emitting layer 102, an encapsulation layer 103, and a touch function layer 104 that are arranged in this order.
  • the array substrate 101 is composed of a substrate 1011 and an array layer 1012 disposed on the substrate 1011.
  • the array layer 1012 includes at least a switching transistor TFT1, a driving transistor TFT2, a compensation circuit, and one or more capacitors arranged in an array.
  • the array substrate 101 further includes a first trace 1013 (a portion of the first trace 1013 coincides with the connection end 106); the light emitting layer 102 is disposed on the array substrate 101, and includes an anode, a light emitting material layer and Cathode; the encapsulation layer 103 covers the light emitting layer 102 and the array substrate 101; the touch function layer 104 is disposed on the encapsulation layer 103, the touch function layer 104 includes a second trace 105, The second trace 105 is electrically connected to the first trace 1013 along the edge 1031 of the encapsulation layer 103, and the connection between the first trace 1013 and the second trace 105 forms a connection end 106.
  • the edge 1031 of the packaging layer corresponding to the second trace 105 is a stepped structure.
  • the encapsulation layer 103 is composed of a multilayer inorganic layer 10311 and a multilayer organic layer 10312.
  • the inorganic layers 10311 and the organic layer 10312 are alternately arranged.
  • the encapsulation layer 103 The innermost layer and the outermost layer are both inorganic layers 10311, and the thickness of the single organic layer 10312 is much greater than the thickness of the inorganic layer 10311.
  • the edge of the organic layer 10312 is a slope structure, and the slope surfaces of the slope structure of each layer are in the same plane, thereby forming a single-layer step structure.
  • the second trace 105 of the touch function layer is electrically connected to the first trace 1013 (as shown in FIG.
  • connection terminal 106 is formed at the connection with the second trace 105.
  • the stepped structure effectively relieves the steepness between the touch function layer and the array substrate, thereby facilitating the electrical conduction of the traces on the touch function layer to the traces on the array substrate.
  • connection terminal 106 is electrically connected to the chip integrated with the control display and touch function through the binding terminal 107 (as shown in FIG. 1), so as to realize the display function and touch of the touch display panel through the same chip
  • the control function is used to control, without the need to separately set the touch chip, which reduces the number of chips used.
  • the encapsulation layer 103 is composed of a multilayer inorganic layer 10311 and a multilayer organic layer 10312.
  • the inorganic layers 10311 and the organic layer 10312 are alternately arranged.
  • the encapsulation layer 103 The innermost layer and the outermost layer are both inorganic layers 10311, and the thickness of the single organic layer 10312 is much greater than the thickness of the inorganic layer 10311.
  • the edge of the organic layer 10312 is a slope structure, each slope surface of the slope structure is in a different plane, and the length of the lower organic layer 10312 is greater than the length of the adjacent upper organic layer 10312, and A platform is formed at the inorganic layer 10311, thereby forming a multilayer step structure.
  • the second trace 105 of the touch function layer is electrically connected to the first trace 1013 (as shown in FIG. 3) on the array substrate 101 along the step structure, the first trace 1013
  • a connection terminal 106 is formed at the connection with the second trace 105.
  • the stepped structure effectively relieves the steepness between the touch function layer and the array substrate, thereby facilitating the electrical conduction of the traces on the touch function layer to the traces on the array substrate.
  • connection terminal 106 is electrically connected to the chip integrated with the control display and touch function through the binding terminal 107 (as shown in FIG. 1), so as to realize the display function and touch of the touch display panel through the same chip
  • the control function is used to control, without the need to separately set the touch chip, which reduces the number of chips used.
  • the encapsulation layer 103 is composed of a multilayer inorganic layer 10311 and a multilayer organic layer 10312.
  • the inorganic layers 10311 and the organic layer 10312 are alternately arranged.
  • the encapsulation layer 103 The innermost layer and the outermost layer are both inorganic layers 10311, and the thickness of the single organic layer 10312 is much greater than the thickness of the inorganic layer 10311.
  • the edge of the organic layer 10312 is a slope structure. Every two adjacent layers of the organic layer 10312 are a group. The slope surfaces of the slope structure of the edge of the organic layer in each group are in the same plane.
  • the slope surfaces of the slope structure at the edge of the organic layer are in different planes, and the length of the organic layer in the lower layer of the group is greater than the length of the organic layer in the adjacent upper layer of the group, and the inorganic layer 10311 between each group A platform is formed at this place, thereby forming a multi-layer step structure.
  • the second trace 105 of the touch function layer is electrically connected to the first trace 1013 (as shown in FIG. 3) on the array substrate 101 along the step structure, the first trace 1013 A connection terminal 106 is formed at the connection with the second trace 105.
  • the stepped structure effectively relieves the steepness between the touch function layer and the array substrate, thereby facilitating the electrical conduction of the traces on the touch function layer to the traces on the array substrate.
  • connection terminal 106 is electrically connected to the chip integrated with the control display and touch function through the binding terminal 107 (as shown in FIG. 1), so as to realize the display function and touch of the touch display panel through the same chip
  • the control function is used to control, without the need to separately set the touch chip, which reduces the number of chips used.
  • the encapsulation layer 103 is composed of a multi-layer inorganic layer 10311 and a multi-layer organic layer 10312.
  • the inorganic layers 10311 and the organic layer 10312 are alternately arranged.
  • the encapsulation layer 103 The innermost layer and the outermost layer are both inorganic layers 10311, and the thickness of the single organic layer 10312 is much greater than the thickness of the single inorganic layer 10311.
  • the edge of the organic layer 10312 is a slope structure, each slope surface of the slope structure is in a different plane, and the length of the lower organic layer 10312 is greater than the length of the adjacent upper organic layer 10312, and A platform is formed at the inorganic layer 10311, and the inorganic layer 10311 completely covers the organic layer 10312 and the slope structure at the edge thereof, thereby forming a multilayer step structure.
  • the second trace 105 of the touch function layer is electrically connected to the first trace 1013 (as shown in FIG. 3) on the array substrate 101 along the step structure, the first trace 1013
  • a connection terminal 106 is formed at the connection with the second trace 105.
  • the stepped structure effectively relieves the steepness between the touch function layer and the array substrate, thereby facilitating the electrical conduction of the traces on the touch function layer to the traces on the array substrate.
  • connection terminal 106 is electrically connected to the chip integrated with the control display and touch function through the binding terminal 107 (as shown in FIG. 1), so as to realize the display function and touch of the touch display panel through the same chip
  • the control function is used to control, without the need to separately set the touch chip, which reduces the number of chips used.
  • FIGS. 4 to 7 show the design of four step structures, it is not limited to the design of these four step structures, but can also be a combination design of any two or more step structures in FIGS. 4 to 7, for example :
  • the first organic layer of the encapsulation layer from the outside is the first group, and the second and third organic layers are the second group.
  • the remaining organic layers are alternately arranged in a manner similar to the first group and the second group, forming multiple In each group, the slope surface of the slope structure of the organic layer in each group is in the same plane, the slope surface of the slope structure of the organic layer in each group is in a different plane, and the length of the organic layer in the lower layer group is greater than that of the adjacent upper layer group The length of the inner organic layer, and a platform is formed at the inorganic layer between each group, thereby forming a multilayer step structure.
  • the inorganic layer materials in the examples provided by the present application are silicon nitride, aluminum nitride, zirconium nitride, titanium nitride, hafnium nitride, tantalum nitride, silicon oxide, aluminum oxide, titanium oxide, tin oxide, One or more of cerium oxide and silicon oxynitride, the organic layer material is polymethyl methacrylate, phenol-based polymer derivative, propylene-based polymer, imino polymer, aryl ether-based polymer, amide One or more of a base polymer, a fluorine base polymer, a paraxylene base polymer, and a vinyl alcohol base polymer.
  • This embodiment provides a touch display device including the touch display panel described in the first embodiment.
  • the touch display device may be an electroluminescence display device, such as: e-paper, mobile phone, tablet computer, TV, display, notebook computer, digital photo frame, navigator, etc., any product or component with touch display function .
  • the touch display device of this embodiment includes the touch display panel described in the first embodiment, it has the structural advantages of the touch display panel described in the first embodiment, that is, the touch function layer of the touch display device Wire, electrically connected to the trace on the array substrate along the step structure provided at the edge of the packaging layer, and then electrically connected to the chip integrated with the control display and touch function through the binding end, so that the touch display device
  • the display function and touch function can be controlled by the same chip, which reduces the number of chips used.
  • the stepped structure at the edge of the packaging layer effectively eases the steepness between the touch function layer and the array substrate, thereby facilitating the touch function
  • the traces on the layer are electrically connected to the traces on the array substrate.

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Abstract

本申请提供一种触控显示面板及触控显示装置，包括阵列基板、发光层、封装层和触控功能层，所述阵列基板包括第一走线，所述触控功能层包括第二走线，所述第二走线沿所述封装层边缘的台阶结构电性连接至所述第一走线，然后再通过绑定端电性连接至集成有控制显示和触控功能的芯片，实现对触控显示面板或触控显示装置的显示功能和触控功能的控制，从而减少了芯片的使用数量，同时，封装层边缘的台阶结构有效缓解了触控功能层与阵列基板之间的陡度，从而便于将触控功能层上的走线电性导通至阵列基板上的走线。

Description

触控显示面板及触控显示装置 技术领域
本申请涉及显示技术领域，尤其涉及触控显示面板及触控显示装置。
 背景技术
目前，触控技术已经广泛应用于各种显示器中，触控技术在显示器中的设置方法有多种，其中，外嵌式触控是目前应用较多的一种形式。外嵌式触控是在完成显示器封装后，在封装层外表面制作触控功能层，然后通过柔性电路板将触控功能层电性导通至触控芯片，因此在封装层边框位置需要设置触控功能层的绑定端子，通过柔性电路板电性连接至触控芯片。
外嵌式触控显示装置中，触控功能和显示功能一般需要采用不同的芯片进行控制，造成使用芯片数量多的问题。
 技术问题
外嵌式触控显示装置中，触控功能和显示功能需要采用不同的芯片进行控制，造成使用芯片数量多的问题，为了解决这个问题而将触控功能的控制端和显示功能的控制端直接连接在一起在结构上又较难实现。
 技术解决方案
为了解决上述技术问题，本申请提供的解决方案如下：
本申请提供了一种触控显示面板，包括：
阵列基板，包括第一走线；
发光层，设置于所述阵列基板上；
封装层，设置于所述发光层上，覆盖所述发光层；
触控功能层，设置于所述封装层上；
所述触控功能层包括第二走线，所述第二走线沿所述封装层的边缘电性连接至所述第一走线，所述第一走线与所述第二走线的连接处形成连接端，与所述第二走线相对应的所述封装层边缘为台阶结构。
在本申请的显示面板中，所述封装层包括有机层和无机层，所述台阶结构是由所述有机层边缘的斜坡结构形成。
在本申请的显示面板中，所述封装层包括多层有机层和多层无机层的交替排布，所述台阶结构是由所述有机层边缘的斜坡结构形成。
在本申请的显示面板中，所述多层有机层中，每一层所述有机层边缘的斜坡结构的斜坡面均处于同一平面，以形成单层台阶结构。
在本申请的显示面板中，所述多层有机层中，每一层所述有机层边缘的斜坡结构的斜坡面均处于不同平面，以形成多层台阶结构。
在本申请的显示面板中，所述多层有机层中，下层所述有机层的长度均大于相邻上层所述有机层，以在相邻两有机层之间形成平台。
在本申请的显示面板中，所述多层有机层中，一层或相邻两层或相邻多层所述有机层为一组，每组内的所述有机层边缘的斜坡结构的斜坡面处于同一平面，每组间的所述有机层边缘的斜坡结构的斜坡面处于不同平面，以形成多层台阶结构。
在本申请的显示面板中，下层所述组内的有机层的长度均大于相邻上层所述组内的有机层，以在相邻两组之间形成平台。
在本申请的显示面板中，所述无机层完全覆盖所述有机层及所述有机层边缘的斜坡结构。
在本申请的显示面板中，所述无机层的材料为氮化硅、氮化铝、氮化锆、氮化钛、氮化铪、氮化钽、氧化硅、氧化铝、氧化钛、氧化锡、氧化铈以及氮氧化硅中的一种或多种。
在本申请的显示面板中，所述有机层材料为聚甲基丙烯酸甲酯、苯酚基聚合衍生物、丙烯基聚合物、亚氨基聚合物、芳醚基聚合物、酰胺基聚合物、氟基聚合物、对二甲苯基聚合物、乙烯醇基聚合物中的一种或多种。
在本申请的显示面板中，所述阵列基板还包括绑定端，所述绑定端电性连接至集成有控制显示和触控功能的芯片。
在本申请的显示面板中，所述连接端电性连接至所述绑定端。
在本申请的显示面板中，所述连接端平行于所述绑定端。
在本申请的显示面板中，所述连接端由分别位于所述绑定端端点两侧的两段组成。
在本申请的显示面板中，所述连接端由位于所述绑定端侧面的一段组成。
在本申请的显示面板中，所述连接端垂直于所述绑定端。
在本申请的显示面板中，所述连接端包括相互垂直的两段，所述连接端的两段分别平行于和垂直于所述绑定端。
为了实现上述目的，本申请还提供了一种触控显示装置，所述触控显示装置包括如上所述的触控显示面板。
 有益效果
本申请提供的技术方案将触控功能层的走线，沿设置于封装层边缘的台阶结构电性连接至阵列基板上的走线，然后再通过绑定端电性连接至集成有控制显示和触控功能的芯片，实现对触控显示面板或触控显示装置的显示功能和触控功能的控制，从而减少了芯片的使用数量，同时，封装层边缘的台阶结构有效缓解了触控功能层与阵列基板之间的陡度，从而便于将触控功能层上的走线电性导通至阵列基板上的走线。
 附图说明
为了更清楚地说明实施例或现有技术中的技术方案，下面将对实施例或现有技术描述中所需要使用的附图作简单介绍，显而易见地，下面描述中的附图仅仅是本申请的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。
图1为本申请实施例提供的触控显示面板结构示意图；
图2为图1所示的触控显示面板沿A-A的截面视图；
图3为图1所示的触控显示面板沿B-B的截面视图；
图4至图7为本申请实施例一提供的包含封装层边缘台阶结构的触控显示面板结构示意图。
具体实施方式
以下各实施例的说明是参考附加的图示，用以例示本申请可用以实施的特定实施例。本申请所提到的方向用语，例如[上]、[下]、[前]、[后]、[左]、[右]、[内]、[外]、[侧面]等，仅是参考附加图式的方向。因此，使用的方向用语是用以说明及理解本申请，而非用以限制本申请。在图中，结构相似的单元是用以相同标号表示。
实施例一：
本实施例提供了一种触控显示面板，所述触控显示面板包括阵列基板、发光层、封装层和触控功能层，将所述触控功能层的走线沿封装层边缘的台阶结构电性导通至阵列基板上的走线，然后再通绑定端电性连接至集成有控制显示和触控功能的芯片，实现对触控显示面板的显示功能和触控功能的控制，从而减少了芯片的使用数量，同时，封装层边缘的台阶结构有效缓解了触控功能层与阵列基板之间的陡度，从而便于将触控功能层上的走线电性导通至阵列基板上的走线。
下面结合附图具体说明本实施例提供的触控显示面板：
图1-3为触控显示面板的整体结构示意图。图1示出了触控功能层104上的走线与阵列基板101上的走线连接形成的连接端106，连接端106例如是多个焊点组成的线或焊接面，与设置于阵列基板101上的绑定端107的四种不同位置关系，其中，图1中的 (a)、图1中的 (b) 和图1中的(c) 的连接端106位于绑定端107两端的两侧，图1中的 (a) 的连接端106平行于绑定端107，图1中的 (b) 的连接端106垂直于绑定端107，图1中的 (c) 的连接端106为相互垂直的两段，分别平行及垂直于绑定端107；图1中的 (d) 的连接端106位于绑定端107的侧面，且平行于绑定端107。需要说明的是，上述四种连接端106与绑定端107位置关系可以根据显示面板内部器件的设置位置自由选择其中的一种。
图2和图3分别是沿A-A和B-B的截面视图，下面结合图1至图3对本实施例提供的触控显示面板进行具体说明：
本实施例提供的触控显示面板包括依次设置的阵列基板101、发光层102、封装层103和触控功能层104。所述阵列基板101由基板1011和设置于所述基板1011上的阵列层1012组成，所述阵列层1012至少包括阵列排布的开关晶体管TFT1、驱动晶体管TFT2、补偿电路、一个或多个电容器，所述阵列基板101还包括第一走线1013（一部分所述第一走线1013与连接端106重合）；所述发光层102设置于所述阵列基板101上，并且包括阳极、发光材料层和阴极；所述封装层103覆盖所述发光层102和所述阵列基板101；所述触控功能层104设置于所述封装层103上，所述触控功能层104包括第二走线105，所述第二走线105沿所述封装层103的边缘1031电性导通至所述第一走线1013，所述第一走线1013与所述第二走线105的连接处形成连接端106，与所述第二走线105相对应的所述封装层边缘1031为台阶结构。
下面结合图4至图7分别说明所述封装层边缘1031的台阶结构的几种形成方式：
如图4所示，所述封装层103由多层无机层10311和多层有机层10312组成，所述无机层10311与所述有机层10312为交替排布，优选地，所述封装层103的最内层和最外层均为无机层10311，单层所述有机层10312的厚度远大于所述无机层10311的厚度。所述有机层10312的边缘为斜坡结构，且每一层所述斜坡结构的斜坡面均处于同一平面内，从而形成单层台阶结构。所述触控功能层的第二走线105沿所述台阶结构电性导通至所述阵列基板101上的第一走线1013（如图3中所示），所述第一走线1013与所述第二走线105的连接处形成连接端106。所述台阶结构有效缓解了触控功能层与阵列基板之间的陡度，从而便于将触控功能层上的走线电性导通至阵列基板上的走线。
所述连接端106通过所述绑定端107（如图1中所示）电性连接至集成有控制显示和触控功能的芯片，从而实现通过同一芯片对触控显示面板的显示功能和触控功能进行控制，无需单独设置触控芯片，减少了芯片的使用数量。
如图5所示，所述封装层103由多层无机层10311和多层有机层10312组成，所述无机层10311与所述有机层10312为交替排布，优选地，所述封装层103的最内层和最外层均为无机层10311，单层所述有机层10312的厚度远大于所述无机层10311的厚度。所述有机层10312的边缘为斜坡结构，每一层所述斜坡结构的斜坡面均处于不同平面内，且下层所述有机层10312的长度均大于相邻上层所述有机层10312的长度，并在所述无机层10311处形成平台，从而形成多层台阶结构。所述触控功能层的第二走线105沿所述台阶结构电性导通至所述阵列基板101上的第一走线1013（如图3中所示），所述第一走线1013与所述第二走线105的连接处形成连接端106。所述台阶结构有效缓解了触控功能层与阵列基板之间的陡度，从而便于将触控功能层上的走线电性导通至阵列基板上的走线。
所述连接端106通过所述绑定端107（如图1中所示）电性连接至集成有控制显示和触控功能的芯片，从而实现通过同一芯片对触控显示面板的显示功能和触控功能进行控制，无需单独设置触控芯片，减少了芯片的使用数量。
如图6所示，所述封装层103由多层无机层10311和多层有机层10312组成，所述无机层10311与所述有机层10312为交替排布，优选地，所述封装层103的最内层和最外层均为无机层10311，单层所述有机层10312的厚度远大于所述无机层10311的厚度。所述有机层10312的边缘为斜坡结构，每相邻两层所述有机层10312为一组，每组内的所述有机层边缘的斜坡结构的斜坡面处于同一平面，每组间的所述有机层边缘的斜坡结构的斜坡面处于不同平面，且下层所述组内的有机层的长度均大于相邻上层所述组内的有机层的长度，并在每组间的所述无机层10311处形成平台，从而形成多层台阶结构。所述触控功能层的第二走线105沿所述台阶结构电性导通至所述阵列基板101上的第一走线1013（如图3中所示），所述第一走线1013与所述第二走线105的连接处形成连接端106。所述台阶结构有效缓解了触控功能层与阵列基板之间的陡度，从而便于将触控功能层上的走线电性导通至阵列基板上的走线。
所述连接端106通过所述绑定端107（如图1中所示）电性连接至集成有控制显示和触控功能的芯片，从而实现通过同一芯片对触控显示面板的显示功能和触控功能进行控制，无需单独设置触控芯片，减少了芯片的使用数量。
如图7所示，所述封装层103由多层无机层10311和多层有机层10312组成，所述无机层10311与所述有机层10312为交替排布，优选地，所述封装层103的最内层和最外层均为无机层10311，单层所述有机层10312的厚度远大于单层所述无机层10311的厚度。所述有机层10312的边缘为斜坡结构，每一层所述斜坡结构的斜坡面均处于不同平面内，且下层所述有机层10312的长度均大于相邻上层所述有机层10312的长度，并在所述无机层10311处形成平台，且所述无机层10311完全覆盖所述有机层10312及其边缘的斜坡结构，从而形成多层台阶结构。所述触控功能层的第二走线105沿所述台阶结构电性导通至所述阵列基板101上的第一走线1013（如图3中所示），所述第一走线1013与所述第二走线105的连接处形成连接端106。所述台阶结构有效缓解了触控功能层与阵列基板之间的陡度，从而便于将触控功能层上的走线电性导通至阵列基板上的走线。
所述连接端106通过所述绑定端107（如图1中所示）电性连接至集成有控制显示和触控功能的芯片，从而实现通过同一芯片对触控显示面板的显示功能和触控功能进行控制，无需单独设置触控芯片，减少了芯片的使用数量。
虽然图4至图7的实施例示出了四种台阶结构的设计，但不仅限于这四种台阶结构设计，还可以是图4至图7中任意两种或多种台阶结构的组合设计，例如：封装层由外到内的第一层有机层为第一组，第二、三层有机层为第二组，余下的有机层以类似第一组和第二组的方式交替设置，形成多个组，每组内的有机层的斜坡结构的斜坡面处于同一平面，每组间的有机层的斜坡结构的斜坡面处于不同平面，且下层组内的有机层的长度均大于相邻上层组内有机层的长度，并在每组间的无机层处形成平台，从而形成多层台阶结构。
本申请提供的实施例中的所述无机层材料为氮化硅、氮化铝、氮化锆、氮化钛、氮化铪、氮化钽、氧化硅、氧化铝、氧化钛、氧化锡、氧化铈以及氮氧化硅中的一种或多种，所述有机层材料为聚甲基丙烯酸甲酯、苯酚基聚合衍生物、丙烯基聚合物、亚氨基聚合物、芳醚基聚合物、酰胺基聚合物、氟基聚合物、对二甲苯基聚合物、乙烯醇基聚合物中的一种或多种。
实施例二：
本实施例提供了一种触控显示装置，其包含实施例一所述的触控显示面板。
其中，所述触控显示装置可以是电致发光显示装置，例如：电子纸、手机、平板电脑、电视机、显示器、笔记本电脑、数码相框、导航仪等任何具有触控显示功能的产品或部件。本实施例的触控显示装置因为包含实施例一所述的触控显示面板，从而具有实施例一所述的触控显示面板的结构优势，即该触控显示装置的触控功能层的走线，沿设置于封装层边缘的台阶结构电性连接至阵列基板上的走线，然后再通过绑定端电性连接至集成有控制显示和触控功能的芯片，从而使触控显示装置的显示功能和触控功能可以用同一芯片进行控制，减少了芯片的使用数量，同时，封装层边缘的台阶结构有效缓解了触控功能层与阵列基板之间的陡度，从而便于将触控功能层上的走线电性导通至阵列基板上的走线。
综上所述，虽然本申请已以具体实施例揭露如上，但上述实施例并非用以限制本申请，本领域的普通技术人员，在不脱离本申请的精神和范围内，均可作各种更动与润饰，因此本申请的保护范围以权利要求界定的范围为准。

Claims (20)

  1. 一种触控显示面板，包括：
    阵列基板，包括第一走线；
    发光层，设置于所述阵列基板上；
    封装层，设置于所述发光层上，覆盖所述发光层；
    触控功能层，设置于所述封装层上；
    所述触控功能层包括第二走线，所述第二走线沿所述封装层的边缘电性连接至所述第一走线，所述第一走线与所述第二走线的连接处形成连接端，与所述第二走线相对应的所述封装层边缘为台阶结构。
  2. 根据权利要求1所述的显示面板，其中，所述封装层包括有机层和无机层，所述台阶结构是由所述有机层边缘的斜坡结构形成。
  3. 根据权利要求1所述的显示面板，其中，所述封装层包括多层有机层和多层无机层的交替排布，所述台阶结构是由所述有机层边缘的斜坡结构形成。
  4. 根据权利要求3所述的显示面板，其中，所述多层有机层中，每一层所述有机层边缘的斜坡结构的斜坡面均处于同一平面，以形成单层台阶结构。
  5. 根据权利要求3所述的显示面板，其中，所述多层有机层中，每一层所述有机层边缘的斜坡结构的斜坡面均处于不同平面，以形成多层台阶结构。
  6. 根据权利要求5所述的显示面板，其中，所述多层有机层中，下层所述有机层的长度均大于相邻上层所述有机层，以在相邻两有机层之间形成平台。
  7. 根据权利要求3所述的显示面板，其中，所述多层有机层中，一层或相邻两层或相邻多层所述有机层为一组，每组内的所述有机层边缘的斜坡结构的斜坡面处于同一平面，每组间的所述有机层边缘的斜坡结构的斜坡面处于不同平面，以形成多层台阶结构。
  8. 根据权利要求7所述的显示面板，其中，下层所述组内的有机层的长度均大于相邻上层所述组内的有机层，以在相邻两组之间形成平台。
  9. 根据权利要求2所述的显示面板，其中，所述无机层完全覆盖所述有机层及所述有机层边缘的斜坡结构。
  10. 根据权利要求3所述的显示面板，其中，所述无机层完全覆盖所述有机层及所述有机层边缘的斜坡结构。
  11. 根据权利要求2所述的显示面板，其中，所述无机层的材料为氮化硅、氮化铝、氮化锆、氮化钛、氮化铪、氮化钽、氧化硅、氧化铝、氧化钛、氧化锡、氧化铈以及氮氧化硅中的一种或多种。
  12. 根据权利要求2所述的显示面板，其中，所述有机层材料为聚甲基丙烯酸甲酯、苯酚基聚合衍生物、丙烯基聚合物、亚氨基聚合物、芳醚基聚合物、酰胺基聚合物、氟基聚合物、对二甲苯基聚合物、乙烯醇基聚合物中的一种或多种。
  13. 根据权利要求1所述的显示面板，其中，所述阵列基板还包括绑定端，所述绑定端电性连接至集成有控制显示和触控功能的芯片。
  14. 根据权利要求13所述的显示面板，其中，所述连接端电性连接至所述绑定端。
  15. 根据权利要求14所述的显示面板，其中，所述连接端平行于所述绑定端。
  16. 根据权利要求15所述的显示面板，其中，所述连接端由分别位于所述绑定端端点两侧的两段组成。
  17. 根据权利要求15所述的显示面板，其中，所述连接端由位于所述绑定端侧面的一段组成。
  18. 根据权利要求14所述的显示面板，其中，所述连接端垂直于所述绑定端。
  19. 根据权利要求14所述的显示面板，其中，所述连接端包括相互垂直的两段，所述连接端的两段分别平行于和垂直于所述绑定端。
  20. 一种触控显示装置，包括权利要求1所述的触控显示面板。
PCT/CN2019/077155 2018-11-30 2019-03-06 触控显示面板及触控显示装置 WO2020107740A1 (zh)

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