WO2021000457A1 - 显示面板及其制作方法 - Google Patents

显示面板及其制作方法 Download PDF

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Publication number
WO2021000457A1
WO2021000457A1 PCT/CN2019/112117 CN2019112117W WO2021000457A1 WO 2021000457 A1 WO2021000457 A1 WO 2021000457A1 CN 2019112117 W CN2019112117 W CN 2019112117W WO 2021000457 A1 WO2021000457 A1 WO 2021000457A1
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WO
WIPO (PCT)
Prior art keywords
layer
wiring
insulating layer
display panel
substrate
Prior art date
Application number
PCT/CN2019/112117
Other languages
English (en)
French (fr)
Inventor
尹炳坤
Original Assignee
武汉华星光电技术有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 武汉华星光电技术有限公司 filed Critical 武汉华星光电技术有限公司
Priority to US16/623,720 priority Critical patent/US11493810B2/en
Publication of WO2021000457A1 publication Critical patent/WO2021000457A1/zh

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Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/133305—Flexible substrates, e.g. plastics, organic film
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1345—Conductors connecting electrodes to cell terminals
    • G02F1/13452—Conductors connecting driver circuitry and terminals of panels
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1343—Electrodes
    • G02F1/134309—Electrodes characterised by their geometrical arrangement
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1345—Conductors connecting electrodes to cell terminals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
    • H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
    • H01L27/1218—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs with a particular composition or structure of the substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
    • H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
    • H01L27/124—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs with a particular composition, shape or layout of the wiring layers specially adapted to the circuit arrangement, e.g. scanning lines in LCD pixel circuits
    • H01L27/1244—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs with a particular composition, shape or layout of the wiring layers specially adapted to the circuit arrangement, e.g. scanning lines in LCD pixel circuits for preventing breakage, peeling or short circuiting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
    • H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
    • H01L27/1259—Multistep manufacturing methods
    • H01L27/1262—Multistep manufacturing methods with a particular formation, treatment or coating of the substrate
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/136—Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
    • G02F1/1362—Active matrix addressed cells
    • G02F1/136222—Colour filters incorporated in the active matrix substrate
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/136—Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
    • G02F1/1362—Active matrix addressed cells
    • G02F1/136286—Wiring, e.g. gate line, drain line
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10128—Display
    • H05K2201/10136—Liquid Crystal display [LCD]

Definitions

  • the invention relates to the field of display, in particular to a display panel and a manufacturing method thereof.
  • the flexible liquid crystal display is made of flexible materials such as polyimide (PI) or polyethylene terephthalate (PET) due to the thin film transistor (TFT) and color film substrate (CF) substrate materials , Deformation, it is easier to realize the reflex of the non-display area, but the metal electrode of the existing design is one layer, which is prone to fracture of the metal electrode when bending, which affects signal transmission.
  • PI polyimide
  • PET polyethylene terephthalate
  • TFT thin film transistor
  • CF color film substrate
  • the object of the present invention is to provide a display panel and a manufacturing method thereof, which solves the problem of cracks or fractures of metal electrodes in the bending area.
  • an embodiment of the present invention provides a display panel, which is provided with a bending area and a non-bending area located on both sides of the bending area.
  • the display panel includes a flexible substrate, The first wiring layer, the insulating layer and the second wiring layer.
  • the first wiring layer is provided on one side of the flexible base substrate; the first wiring layer includes a plurality of first wirings; the insulating layer is provided on the first wiring layer away from One side of the flexible base substrate; at least two vias penetrating the insulating layer are provided on the insulating layer corresponding to each first trace, the vias are provided adjacent to the bending area The position of the non-bending area at both ends; the second wiring layer is provided on the side of the insulating layer of the bending area away from the first wiring layer; the second wiring layer includes a plurality of first wiring layers Two wires; the second wires and the first wires are arranged in one-to-one correspondence; the second wires extend and pass through the via holes to be electrically connected to the first wires.
  • the flexible base substrate includes a flexible base layer and a buffer layer.
  • the buffer layer is arranged on a side of the flexible substrate layer facing the first wiring layer.
  • an organic layer is further provided between the insulating layer and the second wiring layer, and the via hole penetrates the insulating layer and the organic layer at the same time.
  • the material of the flexible substrate layer includes polyimide.
  • the non-bending area includes a display area for display, and the display area includes a transparent electrode layer, a liquid crystal layer, and a color filter substrate that are stacked.
  • the transparent electrode layer is provided on the side of the insulating layer away from the first wiring layer;
  • the liquid crystal layer is provided on the side of the transparent electrode layer away from the insulating layer;
  • the color filter substrate is provided On the side of the liquid crystal layer away from the transparent electrode layer, the color filter substrate is connected to the transparent electrode layer through a sealant to seal the liquid crystal layer.
  • the non-bending area includes a binding area for binding an external circuit
  • the binding area includes a flexible circuit board electrically connected to the first wiring layer; the flexible circuit board includes at least one Integrated circuit (IC).
  • IC Integrated circuit
  • the present invention also provides a manufacturing method of a display panel, including the steps:
  • An insulating layer is fabricated on the side of the first wiring layer away from the flexible base substrate; at least two via holes penetrating the insulating layer are provided on the insulating layer, and the via holes are provided in the bending The location of the non-bending area near both ends of the area; and
  • a plurality of second traces are fabricated on the side of the insulating layer in the bending area away from the first trace layer to form a second trace layer; the second trace and the first trace are one by one Correspondingly provided; the second wiring extends and passes through the via hole to be electrically connected to the first wiring.
  • the manufacturing steps of the flexible base substrate include:
  • a buffer layer is fabricated on the flexible base substrate.
  • the insulating layer further includes a step of making an organic layer, which is on the side of the insulating layer in the bending area away from the first wiring layer
  • the organic layer is fabricated, and the via hole is provided on the organic layer, and the via hole penetrates the insulating layer and the organic layer at the same time.
  • non-bending area includes a display area for display, and the display area further includes the steps:
  • a liquid crystal layer is filled between the transparent electrode layer and the color filter substrate, and the liquid crystal layer is sealed by a sealant.
  • the beneficial effect of the present invention is to provide a display panel and a manufacturing method thereof.
  • the second wiring layer is disposed on the flexible base substrate in the bending area, and the through hole and the lower layer
  • the first wiring layer is connected to transmit signals.
  • the flexible substrate can buffer the stress generated by the bending of the second wiring layer, and can increase the bending radius of the second wiring layer in the bending area This avoids cracks or fractures caused by excessive local stress caused by excessive deformation of the second wiring layer, so that the metal electrode is not prone to fracture when it is bent.
  • FIG. 1 is a schematic diagram of the structure of a display panel in an embodiment of the present invention
  • FIG. 2 is a schematic diagram of the structure of the bending area in FIG. 1 after bending;
  • FIG. 3 is a schematic diagram of the structure of the color filter substrate in the embodiment of the present invention.
  • FIG. 4 is a manufacturing flow chart of a display panel in an embodiment of the present invention.
  • Fig. 5 is a production flow chart of the flexible substrate in the embodiment of the present invention.
  • Fig. 6 is a flow chart of making the display area in the embodiment of the present invention.
  • a display panel 100 which defines a bending area 10 and a non-bending area 20 located on both sides of the bending area 10.
  • the bending area 20 includes a display area 21 for display and a binding area 22 for binding external circuits.
  • the display panel 100 includes a flexible base substrate 1, a first wiring layer 2, an insulating layer 3 and a second wiring layer 4 that are stacked.
  • the first wiring layer 2 is provided on one side of the flexible base substrate 1; the first wiring layer 2 includes a plurality of first wirings; the insulating layer 3 is provided on the first
  • the wiring layer 2 is on the side facing away from the flexible base substrate 1; at least two vias 30 penetrating the insulating layer 3 are provided on the insulating layer 3 corresponding to each first wiring.
  • the hole 30 is provided at a position near the non-bending area 20 at both ends of the bending area 10; the shape of the via hole 30 includes one or a combination of a circle, a square, a diamond, and an ellipse; the second wiring layer 4
  • the insulating layer 3 provided in the bending area 10 is on the side facing away from the first wiring layer 2; the second wiring layer 4 includes a plurality of second wirings; the second wirings and The first traces are arranged in one-to-one correspondence; the second traces fill the vias 30 and are electrically connected to the first traces, that is, the second traces 4 fill the vias 30 and
  • the first wiring layer 2 is electrically connected.
  • the material of the first wiring layer 2 and the second wiring layer 4 is metal.
  • the second wiring layer 4 is arranged on the flexible base substrate 1 in the bending area 10, and is communicated with the lower first wiring layer 2 through the via 30
  • the signal that is, the first wiring layer 2 and the second wiring layer 4 form a metal electrode in a bridging manner.
  • the flexible base substrate 1 can buffer the stress generated by the bending of the second wiring layer 4, and can increase the second wiring layer 4 in the bending area.
  • the bending radius of 10 avoids cracks or fractures caused by excessive local stress caused by excessive deformation of the second wiring layer 4, so that the metal electrode is not prone to fracture when it is bent.
  • the flexible base substrate 1 includes a flexible base layer 11 and a buffer layer 12.
  • the material of the flexible substrate layer 11 is polyimide; the buffer layer 12 is provided on the side of the flexible substrate layer 11 facing the first wiring layer 2; the material of the buffer layer 12 It is one of SiNx and SiOx or a stack combination of both.
  • an organic layer 5 is further provided between the insulating layer 3 and the second wiring layer 4, and the via hole 30 penetrates the insulating layer 3 and the organic layer 5 at the same time.
  • the display area 21 includes a transparent electrode layer 6, a liquid crystal layer 7 and a color filter substrate 8 that are stacked.
  • the transparent electrode layer 6 is provided on the side of the insulating layer 3 away from the first wiring layer 2; the material of the transparent electrode layer 6 includes indium tin oxide (ITO); the liquid crystal layer 7 is provided On the side of the transparent electrode layer 6 away from the insulating layer 3; the color filter substrate 8 is provided on the side of the liquid crystal layer 7 away from the transparent electrode layer 6, the color filter substrate 8 is connected to the transparent electrode layer 6 through a sealant The transparent electrode layer 6 connects and seals the liquid crystal layer 7.
  • ITO indium tin oxide
  • the color filter substrate 8 includes a polyimide substrate 81, a color resist layer 82 on the polyimide substrate 81, and a protective layer 83 on the color resist layer 82.
  • One side of the protective layer 83 is connected to the liquid crystal layer 7; wherein the color resist layer 82 includes a black matrix and a red color resist, a green color resist, and a blue color resist located between the black matrix.
  • the color filter substrate 8 is a prior art, and its detailed structural features are not repeated here, but the description of the structure of the color filter substrate 8 provided above is not intended to limit the claimed invention. The scope, but only represents the preferred embodiment of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative work shall fall within the protection scope of the present invention.
  • the bonding area 22 includes a flexible circuit board 9 electrically connected to the first wiring layer 2; the flexible circuit board 9 includes at least one integrated circuit.
  • one embodiment of the present invention provides a manufacturing method of the display panel 100, including steps S1-S4.
  • Step S1 Provide a flexible base substrate 1.
  • Step S2 Making a plurality of first wirings on one side of the flexible base substrate 1 to form the first wiring layer 2; the material of the first wiring layer 2 is metal.
  • Step S3 fabricate an insulating layer 3 on the side of the first wiring layer 2 away from the flexible base substrate 1; provide at least two vias 30 passing through the insulating layer 3 on the insulating layer 3, so The via hole 30 is provided at a position of the bending area 10 adjacent to the non-bending area 20 at both ends.
  • the shape of the via hole 30 includes one or a combination of a circle, a square, a diamond, and an ellipse.
  • the purpose of providing the via hole 30 in this embodiment is to realize that the second wiring layer 4 fills the via hole 30 and is electrically connected to the first wiring layer 2, and the shape of the via hole 30 is not strict limited.
  • Step S4 On the side of the insulating layer 3 of the bending area 10 that faces away from the first wiring layer 2, a plurality of second wirings are made to form the second wiring layer 4;
  • the first wires are arranged in one-to-one correspondence; the second wires extend and pass through the via holes 30 to be electrically connected to the first wires, that is, the second wire layers 4 extend and pass through the
  • the via hole 30 is electrically connected to the first wiring layer 2.
  • the material of the second wiring layer 4 is metal.
  • the manufacturing steps of the flexible base substrate 1 include:
  • Step S11 providing a glass substrate, coating polyimide on the glass substrate, and baking and curing to form the flexible base substrate 1;
  • Step S12 depositing one or a stack combination of SiNx and SiOx on the flexible base substrate 1 by chemical vapor deposition to form a buffer layer.
  • the step S31 of making an organic layer 5 is further included, which is in the bending area 10
  • the organic layer 5 is formed on the side of the insulating layer 3 away from the first wiring layer 2, and the via 30 is provided on the organic layer 5, and the via 30 penetrates the insulating layer 3 at the same time And the organic layer 5.
  • the non-bending area 20 includes a display area 21 for display, and the display area 21 further includes the steps after completing step S4:
  • Step S51 fabricating a transparent electrode layer 6 on the side of the insulating layer 3 away from the first wiring layer 2; the material of the transparent electrode layer 6 includes indium tin oxide;
  • Step S52 fabricate a color filter substrate 8 through coating, drying, exposure, development, and curing processes, and arrange the color filter substrate 8 and the transparent electrode layer 6 opposite to each other;
  • Step S53 Fill the liquid crystal layer 7 between the transparent electrode layer 6 and the color filter substrate 8, and seal the liquid crystal layer 7 with a sealant.
  • the non-bending area 20 includes a binding area 22 for binding an external circuit
  • the binding area 22 further includes the step of: in the first wiring layer after step S4 is completed.
  • the flexible circuit board 9 is bound on top to realize the electrical connection between the flexible circuit board 9 and the first wiring layer 2; wherein, the flexible circuit board 9 includes at least one integrated circuit.
  • the beneficial effect of the present invention is to provide a display panel and a manufacturing method thereof, by providing the second wiring layer on the flexible base substrate in the bending area, and passing through the via hole and the lower layer
  • the first wiring layer connects and transmits signals.
  • the flexible substrate can buffer the stress generated by the bending of the second wiring layer, and can increase the bending radius of the second wiring layer in the bending area This avoids cracks or fractures caused by excessive local stress caused by excessive deformation of the second wiring layer, so that the metal electrode is not prone to fracture when it is bent.

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  • Physics & Mathematics (AREA)
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Abstract

一种显示面板及其制作方法。该显示面板（100）设有弯折区（10）和非弯折区（20），该显示面板（100）包括层叠设置的柔性衬底基板（1）、第一走线层（2）、绝缘层（3）和第二走线层（4）。该第一走线层（2）包括多个第一走线；在与每一第一走线相对应的该绝缘层（3）上设置至少两个贯穿该绝缘层（3）的过孔（30），该过孔（30）设于该弯折区（10）临近两端非弯折区（20）的位置；该第二走线层（4）包括多个第二走线；该第二走线与该第一走线一一对应设置；该第二走线延伸并穿过该过孔（30）与该第一走线电连接。该显示面板（100）的制作方法包括步骤：提供一柔性衬底基板（1）、制作第一走线层（2）、制作绝缘层（3）和制作第二走线层（4）。

Description

显示面板及其制作方法 技术领域
本发明涉及显示领域，尤其涉及一种显示面板及其制作方法。
 背景技术
当前的移动终端市场上，针对高屏占比的设计需求越来越高；如何在液晶显示屏设计上压缩非显示区边框成为各家厂商设计的焦点。将非显示区反折至显示屏侧面或背面的设计，成为当前高屏占比设计的热点。
柔性液晶显示屏由于薄膜晶体管（TFT）、彩膜基板（CF）衬底材料为聚酰亚胺(PI)或聚乙二醇对苯二甲酸酯(PET)等柔软的材料制成可弯曲、变形，较容易实现非显示区反折，但现有设计的金属电极为一层，其在弯曲时易发生金属电极断裂而影响信号传输。
因此，如何提供一种新型的显示面板及其制作方法，以降低金属电极发生破裂或断裂的风险，是本领域技术人员亟需解决的技术问题。
 技术问题
本发明的目的在于，提供一种显示面板及其制作方法，其解决了金属电极在弯折区发生破裂或断裂的问题。
 技术解决方案
为了解决上述问题，本发明一实施例中提供一种显示面板，设有弯折区和位于所述弯折区两侧的非弯折区，所述显示面板包括层叠设置的柔性衬底基板、第一走线层、绝缘层和第二走线层。具体的，所述第一走线层设于所述柔性衬底基板的一面；所述第一走线层包括多个第一走线；所述绝缘层设于所述第一走线层背离所述柔性衬底基板的一面；在与每一第一走线相对应的所述绝缘层上设置至少两个贯穿所述绝缘层的过孔，所述过孔设于所述弯折区临近两端非弯折区的位置；所述第二走线层设于所述弯折区的所述绝缘层背离所述第一走线层的一面；所述第二走线层包括多个第二走线；所述第二走线与所述第一走线一一对应设置；所述第二走线延伸并穿过所述过孔与所述第一走线电连接。
进一步地，所述柔性衬底基板包括柔性衬底层和缓冲层。所述缓冲层设于所述柔性衬底层朝向所述第一走线层的一侧。
进一步地，在所述绝缘层和所述第二走线层之间还设有有机层，所述过孔同时贯穿所述绝缘层和所述有机层。
进一步地，所述柔性衬底层的材料包括聚酰亚胺。
进一步地，所述非弯折区包括用于显示的显示区，所述显示区包括层叠设置的透明电极层、液晶层和彩膜基板。具体的，所述透明电极层设于所述绝缘层背离所述第一走线层的一面；所述液晶层设于所述透明电极层背离所述绝缘层的一面；所述彩膜基板设于所述液晶层背离所述透明电极层的一面，所述彩膜基板通过密封胶与所述透明电极层连接并密封所述液晶层。
进一步地，所述非弯折区包括用于绑定外接电路的绑定区，所述绑定区包括与所述第一走线层电连接的柔性电路板；所述柔性电路板包括至少一集成电路（IC）。
本发明还提供一种显示面板的制作方法，包括步骤：
提供一柔性衬底基板；
在所述柔性衬底基板的一面制作多个第一走线构成第一走线层；
在所述第一走线层背离所述柔性衬底基板的一面制作绝缘层；在所述绝缘层上设置至少两个贯穿所述绝缘层的过孔，所述过孔设于所述弯折区临近两端非弯折区的位置；以及
在所述弯折区的所述绝缘层背离所述第一走线层的一面制作多个第二走线构成第二走线层；所述第二走线与所述第一走线一一对应设置；所述第二走线延伸并穿过所述过孔与所述第一走线电连接。
进一步地，所述柔性衬底基板的制作步骤包括：
提供一玻璃基板，在所述玻璃基板上涂布聚酰亚胺，并烘烤固化形成所述柔性衬底基板；以及
在所述柔性衬底基板上制作缓冲层。
进一步地，在制作所述绝缘层和制作所述第二走线层之间还包括制作有机层步骤，其为在所述弯折区的所述绝缘层背离所述第一走线层的一面制作所述有机层，在所述有机层上设置所述过孔，所述过孔同时贯穿所述绝缘层和所述有机层。
进一步地，所述非弯折区包括用于显示的显示区，在所述显示区还包括步骤：
在所述绝缘层背离所述第一走线层的一面制作透明电极层；
通过涂布、干燥、曝光、显影、固烤工艺制作彩膜基板，并将所述彩膜基板与所述透明电极层相对设置；以及
在所述透明电极层和所述彩膜基板之间填充液晶层，并通过密封胶密封所述液晶层。
 有益效果
本发明的有益效果在于，提供一种显示面板及其制作方法，通过在所述弯折区将所述第二走线层设置于所述柔性衬底基板上，并通过过孔与下层的所述第一走线层连通传输信号。在所述弯折区弯折时所述柔性衬底基板可以缓冲所述第二走线层弯折产生的应力，并且可增加所述第二走线层在所述弯折区的弯折半径，避免因为所述第二走线层形变过大而导致局部应力过大而产生裂纹或断裂，从而使得金属电极在弯折时不易发生断裂。
 附图说明
图1为本发明实施例中的一种显示面板结构示意图；
图2为本发明为图1中的所述弯折区弯折后的结构示意图；
图3为本发明实施例中所述彩膜基板的结构示意图；
图4为本发明实施例中的一种显示面板的制作流程图；
图5为本发明实施例中所述柔性衬底基板的制作流程图；
图6为本发明施例中所述显示区的制作流程图。
图中部件标识如下：
1、柔性衬底基板，2、第一走线层，3、绝缘层，4、第二走线层，
5、有机层，6、透明电极层，7、液晶层，8、彩膜基板，9、柔性电路板，
10、弯折区，11、柔性衬底层，12、缓冲层，20、非弯折区，21、显示区，
22、绑定区，30、过孔，81、聚酰亚胺基板，82色阻层，83、保护层，
100、显示面板。
 本发明的实施方式
本发明所提到的方向用语，例如「上」、「下」、「前」、「后」、「左」、「右」、「内」、「外」、「侧面」等，仅是附图中的方向，本文所使用的方向用语是用来解释和说明本发明，而不是用来限定本发明的保护范围。
此外，还应注意的是，在一些可替代的实现方式中，本文中所描述的所有方法的步骤可不按顺序发生。例如，示出为连续的两个步骤可实际上大致同时执行，或者这两个步骤可有时以相反的顺序执行。
请参阅图1、图2所示，本发明其中一实施例中提供一种显示面板100，定义有弯折区10和位于所述弯折区10两侧的非弯折区20，所述非弯折区20包括用于显示的显示区21和用于绑定外接电路的绑定区22。
所述显示面板100包括层叠设置的柔性衬底基板1、第一走线层2、绝缘层3和第二走线层4。具体的，所述第一走线层2设于所述柔性衬底基板1的一面；所述第一走线层2包括多个第一走线；所述绝缘层3设于所述第一走线层2背离所述柔性衬底基板1的一面；在与每一第一走线相对应的所述绝缘层3上设置至少两个贯穿所述绝缘层3的过孔30，所述过孔30设于所述弯折区10临近两端非弯折区20的位置；所述过孔30的形状包括圆形、方形、菱形、椭圆形之一或组合；所述第二走线层4设于所述弯折区10的所述绝缘层3背离所述第一走线层2的一面；所述第二走线层4包括多个第二走线；所述第二走线与所述第一走线一一对应设置；所述第二走线填充所述过孔30与所述第一走线电连接，亦即所述第二走线层4填充所述过孔30与所述第一走线层2电连接。其中，所述第一走线层2和所述第二走线层4的材料为金属。
本实施例中，通过在所述弯折区10设置所述第二走线层4于所述柔性衬底基板1上，并通过过孔30与下层的所述第一走线层2连通传输信号，即所述第一走线层2和所述第二走线层4以桥接方式构成金属电极。在所述弯折区10弯折时所述柔性衬底基板1可以缓冲所述第二走线层4弯折产生的应力，并且可增加所述第二走线层4在所述弯折区10的弯折半径，避免因为所述第二走线层4形变过大而导致局部应力过大而产生裂纹或断裂，从而使得金属电极在弯折时不易发生断裂。
请参阅图1所示，在本实施例中，所述柔性衬底基板1包括柔性衬底层11和缓冲层12。具体的，所述柔性衬底层11的材料为聚酰亚胺；所述缓冲层12设于所述柔性衬底层11朝向所述第一走线层2的一侧；所述缓冲层12的材料为SiNx、SiOx中的一种或两者的堆栈组合。
在本实施例中，在所述绝缘层3和所述第二走线层4之间还设有有机层5，所述过孔30同时贯穿所述绝缘层3和所述有机层5。
在本实施例中，所述显示区21包括层叠设置的透明电极层6、液晶层7和彩膜基板8。具体的，所述透明电极层6设于所述绝缘层3背离所述第一走线层2的一面；所述透明电极层6的材料包括氧化铟锡（ITO）；所述液晶层7设于所述透明电极层6背离所述绝缘层3的一面；所述彩膜基板8设于所述液晶层7背离所述透明电极层6的一面，所述彩膜基板8通过密封胶与所述透明电极层6连接并密封所述液晶层7。
请参阅图3所示，所述彩膜基板8包括聚酰亚胺基板81、位于所述聚酰亚胺基板81上的色阻层82、位于所述色阻层82上的保护层83，所述保护层83一侧与所述液晶层7连接；其中所述色阻层82包括黑色矩阵及位于所述黑色矩阵之间的红色色阻、绿色色阻及蓝色色阻。值得说明的是，所述彩膜基板8为现有技术，其详细的结构特征在此不做赘述，但上述提供的所述彩膜基板8结构的描述并非旨在限制要求保护的本发明的范围，而是仅仅表示本发明的优选实施例。基于本发明中的实施例，本领域普通技术人员在没有作出创造性劳动前提下所获得的所有其他实施例，都属于本发明保护的范围。
在本实施例中，所述绑定区22包括与所述第一走线层2电连接的柔性电路板9；所述柔性电路板9包括至少一集成电路。
请参阅图4所示，本发明其中一实施例中提供一种显示面板100的制作方法，包括步骤S1-S4。
步骤S1：提供一柔性衬底基板1。
步骤S2：在所述柔性衬底基板1的一面制作多个第一走线构成第一走线层2；所述第一走线层2的材料为金属。
步骤S3：在所述第一走线层2背离所述柔性衬底基板1的一面制作绝缘层3；在所述绝缘层3上设置至少两个贯穿所述绝缘层3的过孔30，所述过孔30设于所述弯折区10临近两端非弯折区20的位置。所述过孔30的形状包括圆形、方形、菱形、椭圆形之一或组合。本实施例设置所述过孔30的目的为实现所述第二走线层4填充所述过孔30与所述第一走线层2电连接，对所述过孔30的形状不做严格限定。
步骤S4：在所述弯折区10的所述绝缘层3背离所述第一走线层2的一面制作多个第二走线构成第二走线层4；所述第二走线与所述第一走线一一对应设置；所述第二走线延伸并穿过所述过孔30与所述第一走线电连接，亦即所述第二走线层4延伸并穿过所述过孔30与所述第一走线层2电连接。所述第二走线层4的材料为金属。
请参阅图5所示，在本实施例中，所述柔性衬底基板1的制作步骤包括：
步骤S11：提供一玻璃基板，在所述玻璃基板上涂布聚酰亚胺，并烘烤固化形成所述柔性衬底基板1；以及
步骤S12：在所述柔性衬底基板1上通过化学气相沉积方式沉积SiNx、SiOx中的一种或两者的堆栈组合形成制作缓冲层。
请参阅图4所示，在本实施例中，在制作所述绝缘层3和制作所述第二走线层4之间还包括制作有机层5步骤S31，其为在所述弯折区10的所述绝缘层3背离所述第一走线层2的一面制作所述有机层5，在所述有机层5上设置所述过孔30，所述过孔30同时贯穿所述绝缘层3和所述有机层5。
请参阅图6所示，在本实施例中，所述非弯折区20包括用于显示的显示区21，在所述显示区21在完成步骤S4之后还包括步骤：
步骤S51：在所述绝缘层3背离所述第一走线层2的一面制作透明电极层6；所述透明电极层6的材料包括氧化铟锡；
步骤S52：通过涂布、干燥、曝光、显影、固烤工艺制作彩膜基板8，并将所述彩膜基板8与所述透明电极层6相对设置；以及
步骤S53：在所述透明电极层6和所述彩膜基板8之间填充液晶层7，并通过密封胶密封所述液晶层7。
在本实施例中，所述非弯折区20包括用于绑定外接电路的绑定区22，在所述绑定区22在完成步骤S4之后还包括步骤：在所述第一走线层2上绑定柔性电路板9，实现所述柔性电路板9与所述第一走线层2电连接；其中，所述柔性电路板9包括至少一集成电路。
本发明的有益效果在于，提供一种显示面板及其制作方法，通过在所述弯折区设置所述第二走线层于所述柔性衬底基板上，并通过过孔与下层的所述第一走线层连通传输信号。在所述弯折区弯折时所述柔性衬底基板可以缓冲所述第二走线层弯折产生的应力，并且可增加所述第二走线层在所述弯折区的弯折半径，避免因为所述第二走线层形变过大而导致局部应力过大而产生裂纹或断裂，从而使得金属电极在弯折时不易发生断裂。
以上所述仅是本发明的优选实施方式，应当指出，对于本技术领域的普通技术人员，在不脱离本发明原理的前提下，还可以做出若干改进和润饰，这些改进和润饰也应视为本发明的保护范围。

Claims (10)

  1. 一种显示面板，设有弯折区和位于所述弯折区两侧的非弯折区，其中，所述显示面板包括：
    柔性衬底基板；
    第一走线层，设于所述柔性衬底基板的一面；所述第一走线层包括多个第一走线；
    绝缘层，设于所述第一走线层背离所述柔性衬底基板的一面；在与每一第一走线相对应的所述绝缘层上设置至少两个贯穿所述绝缘层的过孔，所述过孔设于所述弯折区临近两端非弯折区的位置；
    第二走线层，设于所述弯折区的所述绝缘层背离所述第一走线层的一面；所述第二走线层包括多个第二走线；所述第二走线与所述第一走线一一对应设置；所述第二走线延伸并穿过所述过孔与所述第一走线电连接。
  2. 根据权利要求1所述的显示面板，其中，所述柔性衬底基板包括：
    柔性衬底层；以及
    缓冲层，设于所述柔性衬底层朝向所述第一走线层的一侧。
  3. 根据权利要求2所述的显示面板，其中，所述柔性衬底层的材料包括聚酰亚胺。
  4. 根据权利要求1所述的显示面板，其中，在所述绝缘层和所述第二走线层之间还设有有机层，所述过孔同时贯穿所述绝缘层和所述有机层。
  5. 根据权利要求1所述的显示面板，其中，所述非弯折区包括用于显示的显示区，所述显示区包括
    透明电极层，设于所述绝缘层背离所述第一走线层的一面；
    液晶层，设于所述透明电极层背离所述绝缘层的一面；以及
    彩膜基板，设于所述液晶层背离所述透明电极层的一面，所述彩膜基板通过密封胶与所述透明电极层连接并密封所述液晶层。
  6. 根据权利要求1所述的显示面板，其中，所述非弯折区包括用于绑定外接电路的绑定区，所述绑定区包括
    柔性电路板，与所述第一走线层电连接；
    其中，所述柔性电路板包括至少一集成电路。
  7. 一种显示面板的制作方法，其包括步骤：
    提供一柔性衬底基板；
    在所述柔性衬底基板的一面制作多个第一走线构成第一走线层；
    在所述第一走线层背离所述柔性衬底基板的一面制作绝缘层；在所述绝缘层上设置至少两个贯穿所述绝缘层的过孔，所述过孔设于所述弯折区临近两端非弯折区的位置；以及
    在所述弯折区的所述绝缘层背离所述第一走线层的一面制作多个第二走线构成第二走线层；所述第二走线与所述第一走线一一对应设置；所述第二走线延伸并穿过所述过孔与所述第一走线电连接。
  8. 一种如权利要求7所述的显示面板的制作方法，其中，所述柔性衬底基板的制作步骤包括：
    提供一玻璃基板，在所述玻璃基板上涂布聚酰亚胺，并烘烤固化形成所述柔性衬底基板；以及
    在所述柔性衬底基板上制作缓冲层。
  9. 一种如权利要求7所述的显示面板的制作方法，其中，在制作所述绝缘层和制作所述第二走线层之间还包括制作有机层步骤：
    在所述弯折区的所述绝缘层背离所述第一走线层的一面制作所述有机层，在所述有机层上设置所述过孔，所述过孔同时贯穿所述绝缘层和所述有机层。
  10. 一种如权利要求7所述的显示面板的制作方法，其中，所述非弯折区包括用于显示的显示区，在所述显示区还包括步骤：
    在所述绝缘层背离所述第一走线层的一面制作透明电极层；
    通过涂布、干燥、曝光、显影、固烤工艺制作彩膜基板，并将所述彩膜基板与所述透明电极层相对设置；以及
    在所述透明电极层和所述彩膜基板之间填充液晶层，并通过密封胶密封所述液晶层。
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