WO2020168906A1 - 显示面板及其制备方法、显示装置 - Google Patents

显示面板及其制备方法、显示装置 Download PDF

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Publication number
WO2020168906A1
WO2020168906A1 PCT/CN2020/074315 CN2020074315W WO2020168906A1 WO 2020168906 A1 WO2020168906 A1 WO 2020168906A1 CN 2020074315 W CN2020074315 W CN 2020074315W WO 2020168906 A1 WO2020168906 A1 WO 2020168906A1
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WIPO (PCT)
Prior art keywords
substrate
pad
display panel
display area
circuit layer
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PCT/CN2020/074315
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English (en)
French (fr)
Inventor
刘晓霞
李飞
谢扶政
杨俊辉
张家祥
王康
Original Assignee
京东方科技集团股份有限公司
成都京东方光电科技有限公司
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Application filed by 京东方科技集团股份有限公司, 成都京东方光电科技有限公司 filed Critical 京东方科技集团股份有限公司
Priority to US16/959,228 priority Critical patent/US20210104594A1/en
Publication of WO2020168906A1 publication Critical patent/WO2020168906A1/zh

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/131—Interconnections, e.g. wiring lines or terminals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/02—Bonding areas ; Manufacturing methods related thereto
    • H01L24/03—Manufacturing methods
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/02—Bonding areas ; Manufacturing methods related thereto
    • H01L24/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L24/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554—External layer
    • H01L2224/0556—Disposition
    • H01L2224/0557—Disposition the external layer being disposed on a via connection of the semiconductor or solid-state body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49838—Geometry or layout
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/4985—Flexible insulating substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10128—Display
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K2102/00—Constructional details relating to the organic devices covered by this subclass
    • H10K2102/301—Details of OLEDs
    • H10K2102/311—Flexible OLED
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/1201—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
    • H10K77/10—Substrates, e.g. flexible substrates
    • H10K77/111—Flexible substrates

Definitions

  • the invention relates to a display panel, a preparation method thereof, and a display device.
  • the mainstream solution adopted by the full screen is the PAD BENDING solution, which uses a flexible substrate and/or flexible circuit board (FCB) bent on the outside of the substrate to make the circuit on the side of the substrate and Connect the wires on the other side of the substrate. Since the flexible circuit board is folded back to the other side of the substrate, its frame width can be reduced to the distance between the pad and the bent part of the flexible circuit board.
  • FCB flexible circuit board
  • the present invention provides the following technical solutions.
  • a display panel including:
  • the substrate includes a display area and a non-display area at least on one side of the display area, and a via hole is provided in the non-display area;
  • the pad is located on the side of the substrate away from the circuit layer, the orthographic projection of the pad on the substrate covers the orthographic projection of the via on the substrate, and the circuit layer It is connected to the pad through the via hole.
  • the number of the vias is multiple, the multiple traces correspond to the multiple vias one-to-one, and each trace is connected to the pad through its corresponding via.
  • the number of the vias is multiple and the number of the vias is less than the number of the wires, each of the vias corresponds to one or more wires, and each wire passes through the corresponding wires.
  • the hole is connected to the pad.
  • the plurality of vias extend in a direction parallel to the edge of the display area.
  • the multiple wiring lines include multiple data lines.
  • the non-display area is arranged around the display area.
  • the display panel further includes:
  • the circuit component is located on the side of the pad away from the substrate, and is bonded and connected to the pad.
  • the circuit component includes one or more of an integrated circuit, a circuit board, a flexible circuit board, and a chip on film.
  • the substrate is a flexible substrate
  • the display panel further includes a protective layer disposed on a side of the substrate away from the circuit layer, and the protective layer is provided with a gap to avoid the pad.
  • the orthographic projection of the protective layer on the substrate does not cover the orthographic projection of the pad on the substrate.
  • a display device includes the above display panel.
  • a method for manufacturing a display panel includes:
  • a circuit layer is provided on one side of the substrate, the circuit layer includes a plurality of wires, and the plurality of wires extend from the display area of the substrate to the non-display area;
  • a pad is provided on the side of the substrate away from the circuit layer, the orthographic projection of the pad on the substrate covers the orthographic projection of the via on the substrate, and the circuit layer passes The via hole is connected to the pad.
  • the substrate is a flexible substrate
  • the method further includes:
  • a protective layer is provided on the side of the substrate away from the circuit layer, and the protective layer is provided with a gap to avoid the pad.
  • the method further includes:
  • a circuit component is provided on the side of the protective layer away from the substrate.
  • FIG. 1 is a schematic structural diagram of one side of a display panel according to an embodiment of the present invention.
  • FIG. 2 is a schematic diagram of a cross-sectional structure of a frame area of a display panel according to an embodiment of the present invention
  • FIG. 3 is a schematic diagram of the structure of a frame area on one side of a display panel according to an embodiment of the present invention.
  • FIG. 4 is a schematic structural diagram of a frame area on one side of a display panel according to an embodiment of the present invention.
  • FIG. 5 is a schematic diagram of the structure of a frame area on one side of a display panel according to an embodiment of the present invention.
  • FIG. 6 is a flowchart of a method for manufacturing a display panel according to an embodiment of the present invention.
  • FIG. 7 is a flowchart of a manufacturing method of a display panel according to an embodiment of the present invention.
  • an embodiment of the present invention provides a display panel.
  • the display panel includes a substrate 1, and the substrate 1 includes a display area and a non-display area at least on one side of the display area.
  • the display area of the substrate 1 is shown as an AA area surrounded by a dotted line, and the non-display area is shown to be on the upper side of the display area.
  • 2 is a schematic diagram of a cross-sectional structure of a frame area of a display panel according to an embodiment of the present invention.
  • the display panel further includes a circuit layer 3 on one side of the substrate 1.
  • 3 is a schematic diagram of the structure of the frame area on one side of the display panel according to the embodiment of the present invention.
  • the circuit layer includes a plurality of wires 31 extending from the display area to the non-display area.
  • a via 11 is provided in the non-display area of the substrate 1.
  • the via hole 11 penetrates the substrate 1.
  • the display panel includes a pad 2 located on the side of the substrate 1 away from the circuit layer, and the orthographic projection of the pad 2 on the substrate 1 covers the via 11 on the substrate. Orthographic projection on 1.
  • the circuit layer 3 is connected to the pad 2 through the via hole 11.
  • the pads 2 and the circuit layer 3 are respectively arranged on both sides of the substrate 1.
  • the substrate 1 is provided with via holes 11, and the wiring 31 of the circuit layer 3 on the side of the substrate 1 passes through the via holes 11. Connect to pad 2 on the other side. Therefore, the display panel can realize a narrow frame.
  • the frame can be designed to be narrower.
  • the circuit on one side of the substrate is bonded and connected with the pad on the other side through the bent flexible circuit board.
  • the frame width of the display panel also includes an area for bending, the reduction range of the frame of this solution will be limited.
  • the frame width d of the display panel of the present invention is significantly smaller than that of the display panel in the related art bending solution due to the omission of the bending part outside the frame. Border width.
  • the increase of the bending process makes the manufacturing process more complicated. Unlike this, the display panel of the present invention does not require a bending process, and only the via hole 11 is formed on the substrate 1, so the manufacturing process is also very simple. In addition, since the front surface of the cell does not need to be provided with the connection area between the pad and the flexible bending part, the layout rate of the display panel module of the present invention is also high.
  • the non-display area is arranged around the display area AA.
  • the non-display area may be located at least on one side of the display area AA.
  • the via hole 11 extends in a direction parallel to the edge of the display area.
  • each via 11 corresponds to one or more wires 31, and each wire 31 is connected to the pad 2 through the corresponding via 11.
  • the multiple wires 31 may be prepared by a patterning process.
  • the specific steps may include: depositing a metal layer covering the via 11 on the substrate 1; and forming a pattern of the multiple wires 31 through the patterning process, so that The multiple wires 31 are not in contact with each other, and each wire 31 includes a connection part filled in the via hole 11 for connection with the pad 2.
  • the wiring layer 3 may also include a thin film transistor (TFT) array layer, and the multiple wirings 31 may specifically include multiple data lines, for example, gate signal lines and/or data signal lines of the TFT array.
  • TFT thin film transistor
  • the via 11 corresponds to all the wires 31.
  • the via hole 11 may have a strip shape and extend along the edge of the display area.
  • each wire 31 can be arranged along the extending direction of the via hole 11 to facilitate the patterning of the wire 31.
  • each via hole 11 may correspond to several wires 31.
  • each of the via holes 11 is strip-shaped, and the two via holes 11 extend along the edge of the display area and are adjacent to each other.
  • the wiring 31 can be divided into two groups, corresponding to the two via holes 11 respectively.
  • each group of wires 31 are arranged adjacently, and each group of wires 31 is connected to the pad 2 through a corresponding via hole 11. This way of connecting more than two vias 11 can reduce the risk of short circuits between the wires 31.
  • the substrate 1 has a plurality of vias 11 corresponding to the plurality of wires 31 one-to-one, and each wire 31 passes through a corresponding via 11 and is connected to the solder. Disk 2 is connected.
  • each wire 31 can be connected to the pad 2 through a single via 11, which can effectively avoid the risk of short circuits between the wires 31.
  • a plurality of via holes 11 may be arranged in sequence along the edge of the display area to facilitate the patterning of the wiring 31.
  • the display panel provided by the embodiment of the present invention may further include a circuit component 4 disposed on the side of the pad 2 away from the substrate 1, and the circuit component 4 is bonded and connected to the pad 2.
  • Bound connection refers to a connection method that forms an electrical connection between two components through welding, bonding, adhesion, etc.
  • the circuit component 4 may include one or more of an integrated circuit (IC), a circuit board (PCB), a flexible circuit board (FPC), and a chip on film (COF).
  • IC integrated circuit
  • PCB circuit board
  • FPC flexible circuit board
  • COF chip on film
  • the substrate 1 may be a flexible material, such as polyimide. Compared with glass substrates, flexible substrates are thinner and easier to make vias.
  • vias can be prepared on the substrate through a patterning process.
  • the “patterning process” or “patterning” described in the embodiments of the present invention refers to the process of preparing a structure pattern by one or several steps of glue coating, exposure, etching, and development.
  • the display panel may further include a protective layer 5 disposed on the side of the substrate 1 away from the circuit layer 3.
  • the protective layer 5 is provided with a gap 51 that avoids the pad 2.
  • the orthographic projection of the protective layer 5 on the substrate 1 does not cover the orthographic projection of the pad 2 on the substrate. That is, there is no protective layer 5 at the position where the pad 2 is provided, thereby allowing the pad 3 to be bonded and connected to the circuit component 4 on the side of the protective layer 5 away from the substrate 1.
  • the pad 2 is disposed on the substrate 1 and is located at the gap 51 of the protective layer 5.
  • the circuit assembly 4 includes a main circuit board (MFPC) 41 and a chip on film (COF) 42.
  • the MFPC 41 is arranged on the side of the protective layer 5 away from the substrate 1, and is bonded and connected to the pad 2 through the COF 42.
  • the display panel in the embodiment of the present invention may be a flexible display panel.
  • this embodiment is only an example of the preferred solution of the present invention and does not constitute a limitation.
  • the display panel of the present invention can also be a rigid display panel, and its substrate can also be a glass material.
  • the display panel provided by the present invention may further include an OLED display unit 6, a touch control component 7 and a polarizer 8 arranged on the side of the substrate 1 away from the circuit components in sequence.
  • the embodiment of the present invention may also include a cover 9 or an encapsulation layer disposed on the side of the substrate 1 away from the circuit assembly.
  • the touch component 7, the polarizer 8 and the cover plate 9 can be sequentially attached to the substrate.
  • the touch control component 7 and the polarizer 8 can be disposed on the cover plate 9 first, and then a transparent adhesive (OCA) is used to bond the cover plate 9 and the substrate.
  • OCA transparent adhesive
  • An embodiment of the present invention also provides a display device, which includes the display panel in any of the foregoing embodiments.
  • the display frame of the display device is narrow and can realize full-screen display.
  • the display device can be applied to any product or component with a display function, such as a mobile phone, a tablet computer, a television, a monitor, a notebook computer, a digital photo frame, a navigator, and so on. Since the principle of solving the problems of the display device is similar to that of the above-mentioned display panel, the implementation of the display device can refer to the implementation of the above-mentioned display panel, and the repetition will not be repeated.
  • a display function such as a mobile phone, a tablet computer, a television, a monitor, a notebook computer, a digital photo frame, a navigator, and so on.
  • an embodiment of the present invention also provides a manufacturing method of the display panel. As shown in Figure 6, the method includes the following steps:
  • Step 101 setting a via hole in a non-display area of the substrate
  • Step 102 Disposing a circuit layer on one side of the substrate, the circuit layer including a plurality of wires extending from a display area to a non-display area of the substrate;
  • Step 103 a pad is provided on the side of the substrate away from the circuit layer, the orthographic projection of the pad on the substrate covers the orthographic projection of the via on the substrate, and the circuit layer is connected to the pad through the via.
  • the pad 2 and the circuit layer 3 are respectively arranged on both sides of the substrate 1.
  • the substrate 1 is provided with via holes 11, and the The wiring 31 of the circuit layer 3 is connected to the pad 2 on the other side through the via 11. Therefore, the display panel can realize a narrow frame.
  • the display panel does not require a flexible bending part, which saves a bending area. Therefore, the frame can be designed to be narrower.
  • the frame width d in FIG. 1 is significantly smaller than the frame width in the related bending process.
  • the display panel does not need a bending process, and only the via hole 11 is formed on the substrate 1, so the manufacturing process is also very simple.
  • the front surface of the cell does not need to be provided with the connection area between the pad and the flexible bending part, the cell layout rate is also high.
  • the wiring can be made in one step in step 102, or can be made in two steps.
  • the first step is to make the pattern of the traces before forming the via hole on the substrate (before step 101)
  • the second step is to form the via hole on the substrate ( After step 101)
  • the via is filled with a conductive material, and the connection portion of each trace is formed in the via through an etching process.
  • the substrate may be a flexible material, such as polyimide. Compared with glass substrates, flexible substrates are thinner and easier to make vias.
  • the preparation method provided by the embodiment of the present invention may further include the following steps:
  • a protective layer is provided on the side of the substrate away from the circuit layer 3, and the protective layer is provided with a gap to avoid the pad.
  • the pad 2 is disposed on the substrate 1 and is located at the gap 51 of the protective layer 5.
  • the method further includes the following step: arranging circuit components on the side of the protective layer away from the substrate 1.
  • the circuit assembly 4 includes a main circuit board (MFPC) 41 and a chip on film (COF) 42.
  • the MFPC 41 is disposed on the side of the protective layer 5 away from the substrate 1, and is welded with the COF 42 Disk 2 bind connection.
  • the following takes a flexible OLED display panel as an example to illustrate the method for manufacturing the display panel provided in the embodiment of the present invention. As shown in Figure 7, the process of the method includes:
  • Step 201 forming a flexible substrate on a glass substrate
  • Step 202 setting a via hole in a non-display area of the flexible substrate
  • Step 203 providing a circuit layer on one side of the substrate, the circuit layer including a plurality of wires extending from the display area of the substrate to the non-display area;
  • a display unit is arranged on the circuit layer, and the display unit may include structures such as an anode, a light-emitting layer, and a cathode that are sequentially stacked;
  • Step 205 peel off the glass substrate, and arrange a protective layer on the side of the flexible substrate away from the circuit layer, and the protective layer is provided with a gap to avoid the pad area;
  • Step 206 setting a pad on the side of the substrate away from the circuit layer, the orthographic projection of the pad on the substrate covers the orthographic projection of the via hole on the substrate, and the circuit layer is connected to the pad through the via hole;
  • step 207 the touch unit and the polarizer are sequentially attached to the display unit, integrated cutting to obtain an independent module, and then the cover is attached to the module;
  • a circuit component is arranged on the side of the protective layer away from the substrate, and the circuit component is bonded and connected to the pad.
  • the wiring layer may further include a TFT array
  • the multiple wiring lines may specifically include data lines, such as gate signal lines and/or data signal lines.
  • the flow of the above method steps of the embodiment of the present invention is exemplary, and the order of executing each step can be changed as needed.
  • the order of execution of each step can be adjusted, or two or more steps can be performed in parallel.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)

Abstract

本发明涉及显示面板及其制备方法和显示装置。显示面板包括：衬底，包括显示区和至少位于所述显示区一侧的非显示区，在所述非显示区设有过孔；线路层，位于所述衬底的一侧，所述线路层包括多条走线，所述多条走线从所述显示区延伸到所述非显示区；焊盘，位于所述衬底的远离所述线路层的一侧，所述焊盘在所述衬底上的正投影覆盖所述过孔在所述衬底上的正投影，所述线路层通过所述过孔与所述焊盘相连。

Description

显示面板及其制备方法、显示装置
相关申请的交叉引用
本申请要求于2019年2月18日递交的中国专利申请201910120314.8号的优先权，在此全文引用上述中国专利申请公开的内容以作为本申请的一部分。
技术领域
本发明涉及显示面板及其制备方法、显示装置。
背景技术
目前全面屏已经成为电子产品的潮流，特别是智能手机产品，无论是显示配件厂商还是整机厂商，都在为扩大显示占比而努力。目前，全面屏采用的主流方案是焊盘部弯折(PAD BENDING)方案，即利用在衬底外侧弯折的柔性基材和/或柔性电路板(FCB)使衬底一侧的电路与衬底另一侧的线路连接起来。由于柔性线路板反折至衬底的另一侧，从而其边框宽度可以缩小至焊盘与柔性线路板的弯折部分之间的距离。
发明内容
本发明提供以下技术方案。
一种显示面板，包括：
衬底，包括显示区和至少位于所述显示区一侧的非显示区，在所述非显示区设有过孔；
线路层，位于所述衬底的一侧，所述线路层包括多条走线，所述多条走线从所述显示区延伸到所述非显示区；
焊盘，位于所述衬底的远离所述线路层的一侧，所述焊盘在所述衬底上的正投影覆盖所述过孔在所述衬底上的正投影，所述线路层通过所述过孔与所述焊盘相连。
可选的，所述过孔的数量为多个，所述多条走线与所述多个过孔一一对应，每条走线通过与其对应的过孔与所述焊盘相连。
可选的，所述过孔的数量为多个并且所述过孔的数量小于所述走线的数量，每个所述过孔对应一条或多条走线，每条走线通过对应的过孔与所述焊盘相连。
可选的，所述多个过孔沿平行于所述显示区的边沿方向延伸。
可选的，所述多条走线包括多条数据线。
可选的，所述非显示区围绕所述显示区设置。
可选的，所述显示面板还包括：
电路组件，位于所述焊盘远离所述衬底的一侧，与所述焊盘绑定连接。
可选的，所述电路组件包括集成电路、电路板、软性线路板、覆晶薄膜中的一个或几个。
可选的，所述衬底为柔性衬底；
所述显示面板还包括设置于所述衬底的远离所述线路层一侧的保护层，所述保护层设有避开所述焊盘的缺口。
可选的，所述保护层在所述衬底上的正投影不覆盖所述焊盘在所述衬底上的正投影。
一种显示装置，包括上述显示面板。
一种显示面板的制备方法，包括：
在衬底的非显示区设置过孔；
在衬底的一侧设置线路层，所述线路层包括多条走线，所述多条走线从所述衬底的显示区延伸到所述非显示区；
在衬底的远离所述线路层的一侧设置焊盘，所述焊盘在所述衬底上的正投影覆盖所述过孔在所述衬底上的正投影，且所述线路层通过所述过孔与所述焊盘相连。
可选的，所述衬底为柔性衬底；
所述在衬底的远离所述线路层的一侧设置焊盘之前，还包括：
在所述衬底的远离所述线路层的一侧设置保护层，所述保护层设有避开所述焊盘的缺口。
可选的，所述在衬底的远离所述线路层的一侧设置保护层之后，还包括：
在所述保护层的远离所述衬底的一侧设置电路组件。
附图说明
图1为本发明实施例的显示面板的一侧的结构示意图；
图2为本发明实施例的显示面板的边框区域的剖面结构示意图；
图3为本发明实施例的显示面板的一侧的边框区域的结构示意图；
图4为本发明实施例的显示面板的一侧的边框区域的结构示意图；
图5为本发明实施例的显示面板的一侧的边框区域的结构示意图；
图6为本发明实施例的显示面板的制备方法流程图；和
图7为本发明实施例的显示面板的制备方法流程图。
具体实施方式
下面将结合附图，对本发明实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅仅是本发明一部分实施例，而不是全部的实施例。基于本发明中的实施例，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例，都属于本发明保护的范围。
如图1-图5所示，本发明实施例提供了一种显示面板。该显示面板包括衬底1，该衬底1包括显示区和至少位于所述显示区一侧的非显示区。在图1中，衬底1的显示区以虚线包围的AA区域示出，并且非显示区被示出为在显示区的上侧。图2为本发明实施例的显示面板的边框区域的剖面结构示意图。如图2所示，该显示面板还包括位于衬底1的一侧的线路层3。图3为本发明实施例的显示面板的一侧的边框区域的结构示意图。如图3所示，该线路层包括从显示区延伸到非显示区的多条走线31。另外，如图2和图3所示，在衬底1的非显示区中设有过孔11。如本领域技术人员可以理解的，过孔11穿过衬底1。此外，如图2所示，该显示面板包括位于衬底1的远离所述线路层的一侧的焊盘2，并且该焊盘2在衬底1上的正投影覆盖过孔11在衬底1上的正投影。如图2和图3所示，线路层3通过过孔11与焊盘2相连。
在上述显示面板中，焊盘2和线路层3分别设置于衬底1的两侧，衬底1上设有过孔11，衬底1一侧的线路层3的走线31通过过孔11与另一侧的焊盘2连接。从而，该显示面板可以实现窄边框。
具体来说，由于本发明的该显示面板无需柔性弯折部，去掉了弯折区域，因此，边框可以设计的更窄。例如，在相关技术的弯折方案中，通过弯折的柔性线路板将衬底一侧的电路与另一侧的焊盘绑定连接。然而，虽然这一定程度上缩小了边框宽度，但是由于该显示面板的边框宽度中还包括用于弯折的区域，因此，该方案的边框缩小范围会受到限制。然而，如图1中本发明的显示面板边框宽度d所示，由于省去了边框外侧的弯折部分，本发明的显示面板的边框宽度d明显小于相关技术的弯折方案中的显示面板的边框宽度。
此外，在相关技术的弯折方案中，弯折工艺的增加使得制作过程也较复杂。与此不同，本发明的显示面板无需弯折工艺，只在衬底1上制备过孔11即可，因此制备工艺也很简单。另外，由于模组(cell)正面不需要设置焊盘和柔性弯折部的连接区域，因此，本发明的显示面板模组的排版率也较高。
一种具体的实施例中，本发明的显示面板中，在衬底1的一侧，非显示区围绕显示区AA设置。本领域技术人员可以理解，非显示区可以至少位于显示区AA的一侧上。此外，过孔11沿平行于显示区的边沿方向延伸。
如图3和图4所示，在本公开的一种具体的实施例中，衬底1上设有多个过孔11，且过孔11的数量小于走线31的数量。因此，每个过孔11对应一个或多个条走线31，每条走线31通过对应的过孔11与焊盘2相连。
多条走线31可以通过构图工艺制备，示例性的，具体步骤可以包括：沉积金属层，该金属层覆盖衬底1上的过孔11；通过构图工艺形成多条走线31的图形，使得多条走线31之间互不接触，且每条走线31包括填充于过孔11内的连接部，用于与焊盘2连接。具体的，线路层3还可以包括薄膜晶体管(TFT)阵列层，并且多条走线31具体可以包括多条数据线，例如，TFT阵列的栅极信号线和/或数据信号线。
示例性的，如图3所示，当衬底1上仅具有一个过孔11时，该过孔11与所有走线31对应。具体的，该过孔11可以呈条形，且沿显示区域的边沿延伸。进一步的，每条走线31可沿过孔11的延伸方向排列，以利于走线31的图形化。
示例性的，当衬底1上具有几个过孔11时，每个过孔11可以对应若干条走线31。如图4所示，以两个为例，每个过孔11呈条形，两个过孔11沿显示区域的边沿延伸且相邻。此时，走线31可分为两组，分别与两个过孔11对应。在这种情况下，每组走线31相邻设置，且每组走线31通过对应的一个过孔11与焊盘2相连。这种采用两个以上过孔11进行连通的方式可以降低走线31之间短路的风险。
如图5所示，一种具体的实施例中，衬底1上具有与多条走线31一一对应的多个过孔11，每条走线31通过与其对应的一个过孔11与焊盘2相连。采用过孔11与走线31一一对应的方式，每个走线31可以通过单独的一个过孔11与焊盘2连接，该种方式可以有效避免走线31之间短路的风险。示例性的，多个过孔11可以沿显示区的边沿依次排列、以利于走线31的图形化。
如图1和图2所示，本发明实施例提供的显示面板还可以包括设置于焊盘2远离衬底1的一侧的电路组件4，该电路组件4与焊盘2绑定连接。绑定连接指的是通过焊接、键合、粘合等方式，在两个组件之间形成电连接的连接方式。
示例性的，该电路组件4可以包括集成电路(IC)、电路板(PCB)、软性线路板(FPC)、覆晶薄膜(COF)中的一个或几个。
一种具体的实施例中，衬底1可以为柔性材料，如聚酰亚胺。相对于玻璃衬底，柔性衬底厚度薄、更易于制作过孔。
示例性的，可以通过构图工艺在衬底上制备过孔。具体的，本发明各实施例中所述的“构图工艺”或者“图形化”，即采用涂胶、曝光、刻蚀、显影等步骤中的一步或几步制备形成结构图案的工艺过程。
如图2所示，进一步的，显示面板还可以包括设置于衬底1的远离线路层3一侧的保护层5。该保护层5设有避开焊盘2的缺口51。换句话说，保护层5在衬底1上的正投影不覆盖焊盘2在衬底上的正投影。即，在具有焊盘2的位置处不具有保护层5，从而允许焊盘3与保护层5的远离衬底1一侧的电路组件4绑定连接。示例性的，如图2所示，焊盘2设置于衬底1上，且位于保护层5的缺口51处。
如图1所示，电路组件4包括主电路板(MFPC)41和覆晶薄膜(COF)42。MFPC 41设置于保护层5远离衬底1的一侧，并通过COF 42与焊盘2绑定连接。
本发明实施例中的显示面板可以为柔性显示面板，但是，该实施例仅是对于本发明优选方案的举例，并不构成限制。在实际应用中，本发明的显示面板也可以为刚性显示面板，其衬底也可以为玻璃材料。
如图2所示，一种具体的实施例中，本发明提供的显示面板还可以包括依次设置于衬底1的远离电路组件一侧的OLED显示单元6、触控组件7和偏光片8。
进一步的，本发明实施例还可以包括设置于衬底1的远离电路组件一侧的盖板9或者封装层。
示例性的，当采用盖板9封装时，可以将触控组件7、偏光片8和盖板9依次贴合至衬底上。或者，可以将触控组件7和偏光片8先设置于盖板9上，然后再采用透明粘合剂(OCA)将盖板9与衬底之间贴合。
本发明实施例还提供一种显示装置，该显示装置包括上述任一实施例中的显示面板。该显示装置的显示边框较窄，可以实现全面屏显示。
具体的，该显示装置可以应用于手机、平板电脑、电视机、显示器、笔记本电脑、数码相框、导航仪等任何具有显示功能的产品或部件。由于该显示装置解决问题的原理与上述显示面板相似，因此该显示装置的实施可以参见上述显示面板的实施，重复之处不再赘述。
基于上述显示面板，本发明实施例还提供一种显示面板的制备方法。如图6所示，该方法包括以下步骤：
步骤101，在衬底的非显示区设置过孔；
步骤102，在衬底的一侧设置线路层，该线路层包括多条走线，该多条走线从衬底的显示区延伸到非显示区；
步骤103，在衬底的远离所述线路层的一侧设置焊盘，焊盘在衬底上的正投影覆盖过孔在衬底上的正投影，且线路层通过过孔与焊盘相连。
上述制备方法获得的显示面板中，如图1和2所示，焊盘2和线路层3分别设置于衬 底1的两侧，衬底1上设有过孔11，衬底1一侧的线路层3的走线31通过过孔11与另一侧的焊盘2连接。从而，该显示面板可以实现窄边框。并且，该显示面板无需柔性弯折部，节省了弯折区域，因此，边框可以设计的更窄，如图1中的边框宽度d明显小于相关的弯折工艺中的边框宽度。再者，相对于相关技术的显示面板，该显示面板无需弯折工艺，只在衬底1上制备过孔11即可，因此制备工艺也很简单。另外，由于模组(cell)正面不需要设置焊盘和柔性弯折部的连接区域，因此，cell的排版率也较高。
一种具体的实施例中，走线可以在步骤102中一次制作完成，也可以分为两步骤制作。示例性的，当采用两步制作时，第一步是在衬底上形成过孔之前(步骤101之前)，先制作走线的图形，第二步则是在衬底上形成过孔之后(步骤101之后)，采用导电材料填充过孔，并通过刻蚀工艺在过孔内形成每根走线的连接部。
一种具体的实施例中，衬底可以为柔性材料，如聚酰亚胺。相对于玻璃衬底，柔性衬底厚度薄、更易于制作过孔。
进一步的，步骤103之前，即在衬底的远离线路层的一侧设置焊盘之前，本发明实施例提供的制备方法还可以包括以下步骤：
在衬底的远离线路层3的一侧设置保护层，该保护层设有避开焊盘的缺口。示例性的，如图2所述，焊盘2设置于衬底1上，且位于保护层5的缺口51处。
进一步的，在衬底的远离线路层3的一侧设置保护层之后，还包括以下步骤：在保护层的远离衬底1的一侧设置电路组件。示例性的，如图1所示，电路组件4包括主电路板(MFPC)41和覆晶薄膜(COF)42.MFPC 41设置于保护层5远离衬底1的一侧，并通过COF42与焊盘2绑定连接。
具体的，下面以柔性OLED显示面板为例，对于本发明实施例提供的显示面板制备方法进行举例说明。如图7所示，该方法的流程包括：
步骤201，在玻璃基板上形成柔性衬底；
步骤202，在柔性衬底的非显示区域中设置过孔；
步骤203，在衬底的一侧设置线路层，该线路层包括多条走线，该多条走线从所述衬底的显示区延伸到所述非显示区；
步骤204，在线路层上设置显示单元，该显示单元可以包括依次层叠的阳极、发光层和阴极等结构；
步骤205，剥离玻璃基板，在柔性衬底的远离线路层的一侧设置保护层，该保护层设有避开焊盘区域的缺口；
步骤206，在衬底的远离线路层的一侧设置焊盘，该焊盘在衬底上的正投影覆盖过孔 在衬底上的正投影，并且线路层通过过孔与焊盘相连；
步骤207，在显示单元上依次贴合触控单元和偏光片，一体化切割以获得独立的模组，然后在模组上贴合盖板；
步骤208，在保护层的远离衬底的一侧设置电路组件，该电路组件与焊盘绑定连接。
示例性的，线路层还可以包括TFT阵列，多条走线具体可以包括数据线，例如栅极信号线和/或数据信号线。
本发明的实施例的以上方法步骤的流程是示例性的，并且执行各个步骤的顺序可以根据需要变化。例如，各个步骤执行的先后顺序可以调整，或者两个或多个步骤可以并行进行。
显然，本领域的技术人员可以对本发明实施例进行各种改动和变型而不脱离本发明的精神和范围。这样，倘若本发明的这些修改和变型属于本发明权利要求及其等同技术的范围之内，则本发明也意图包含这些改动和变型在内。

Claims (14)

  1. 一种显示面板，包括：
    衬底，包括显示区和至少位于所述显示区一侧的非显示区，在所述非显示区设有过孔；
    线路层，位于所述衬底的一侧，所述线路层包括多条走线，所述多条走线从所述显示区延伸到所述非显示区；
    焊盘，位于所述衬底的远离所述线路层的一侧，所述焊盘在所述衬底上的正投影覆盖所述过孔在所述衬底上的正投影，所述线路层通过所述过孔与所述焊盘相连。
  2. 如权利要求1所述的显示面板，其中，所述过孔的数量为多个，所述多条走线与所述多个过孔一一对应，每条走线通过与其对应的过孔与所述焊盘相连。
  3. 如权利要求1所述的显示面板，其中，所述过孔的数量为多个并且所述过孔的数量小于所述走线的数量，每个所述过孔对应一条或多条走线，每条走线通过对应的过孔与所述焊盘相连。
  4. 如权利要求2所述的显示面板，其中，所述多个过孔沿平行于所述显示区的边沿方向延伸。
  5. 如权利要求1所述的显示面板，其中，所述多条走线包括多条数据线。
  6. 如权利要求1-5任一项所述的显示面板，其中，所述非显示区围绕所述显示区设置。
  7. 如权利要求1-5任一项所述的显示面板，还包括：
    电路组件，位于所述焊盘远离所述衬底的一侧，与所述焊盘绑定连接。
  8. 如权利要求7所述的显示面板，其中，所述电路组件包括集成电路、电路板、软性线路板、覆晶薄膜中的一个或几个。
  9. 如权利要求1-5任一项所述的显示面板，其中，所述衬底为柔性衬底；
    所述显示面板还包括设置于所述衬底的远离所述线路层一侧的保护层，所述保护层设有避开所述焊盘的缺口。
  10. 如权利要求9所述的显示面板，其中，所述保护层在所述衬底上的正投影不覆盖所述焊盘在所述衬底上的正投影。
  11. 一种显示装置，包括权利要求1-10任一项所述的显示面板。
  12. 一种显示面板的制备方法，包括：
    在衬底的非显示区设置过孔；
    在衬底的一侧设置线路层，所述线路层包括多条走线，所述多条走线从所述衬底的显示区延伸到所述非显示区；
    在衬底的远离所述线路层的一侧设置焊盘，所述焊盘在所述衬底上的正投影覆盖所述过孔在所述衬底上的正投影，且所述线路层通过所述过孔与所述焊盘相连。
  13. 如权利要求12所述的制备方法，其中，所述衬底为柔性衬底；
    所述在衬底的远离所述线路层的一侧设置焊盘之前，还包括：
    在所述衬底的远离所述线路层的一侧设置保护层，所述保护层设有避开所述焊盘的缺口。
  14. 如权利要求13所述的制备方法，其中，所述在衬底的远离所述线路层的一侧设置保护层之后，还包括：
    在所述保护层的远离所述衬底的一侧设置电路组件。
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Publication number Priority date Publication date Assignee Title
CN109860254A (zh) * 2019-02-18 2019-06-07 京东方科技集团股份有限公司 显示面板及其制备方法、显示装置
CN110262702B (zh) * 2019-07-30 2022-05-10 昆山国显光电有限公司 一种显示面板及显示装置
CN110579916A (zh) * 2019-08-22 2019-12-17 武汉华星光电技术有限公司 一种显示面板及其制备方法、显示装置
CN110515499B (zh) * 2019-08-30 2023-06-20 京东方科技集团股份有限公司 一种触控面板及触控显示装置
CN111292614B (zh) * 2020-01-15 2022-07-12 京东方科技集团股份有限公司 显示模组、显示装置
CN113129770A (zh) * 2020-01-16 2021-07-16 重庆康佳光电技术研究院有限公司 显示背板、显示设备以及拼接显示设备
CN111583883B (zh) * 2020-05-29 2022-03-15 上海中航光电子有限公司 一种集成驱动板、显示装置及制作方法
KR20220041270A (ko) * 2020-09-24 2022-04-01 삼성디스플레이 주식회사 표시 장치 및 그 제조 방법
CN113193013B (zh) * 2021-04-14 2022-08-23 武汉华星光电半导体显示技术有限公司 阵列基板、显示面板及显示装置

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20150028363A1 (en) * 2013-07-24 2015-01-29 Samsung Display Co., Ltd. Chip-on-film package and display device including the same
CN107946339A (zh) * 2016-10-13 2018-04-20 三星显示有限公司 显示装置
CN109860254A (zh) * 2019-02-18 2019-06-07 京东方科技集团股份有限公司 显示面板及其制备方法、显示装置

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102066087B1 (ko) * 2013-05-28 2020-01-15 엘지디스플레이 주식회사 플렉서블 표시장치 및 그의 제조방법
CN107479757B (zh) * 2017-08-25 2020-07-14 上海天马微电子有限公司 显示面板和显示装置
CN108155220B (zh) * 2018-01-29 2019-08-02 武汉华星光电半导体显示技术有限公司 显示装置的制造方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20150028363A1 (en) * 2013-07-24 2015-01-29 Samsung Display Co., Ltd. Chip-on-film package and display device including the same
CN107946339A (zh) * 2016-10-13 2018-04-20 三星显示有限公司 显示装置
CN109860254A (zh) * 2019-02-18 2019-06-07 京东方科技集团股份有限公司 显示面板及其制备方法、显示装置

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