WO2014183366A1 - 显示面板以及具有该显示面板的显示装置 - Google Patents

显示面板以及具有该显示面板的显示装置 Download PDF

Info

Publication number
WO2014183366A1
WO2014183366A1 PCT/CN2013/084442 CN2013084442W WO2014183366A1 WO 2014183366 A1 WO2014183366 A1 WO 2014183366A1 CN 2013084442 W CN2013084442 W CN 2013084442W WO 2014183366 A1 WO2014183366 A1 WO 2014183366A1
Authority
WO
WIPO (PCT)
Prior art keywords
array substrate
display panel
circuit board
printed circuit
chip
Prior art date
Application number
PCT/CN2013/084442
Other languages
English (en)
French (fr)
Inventor
解红军
Original Assignee
京东方科技集团股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 京东方科技集团股份有限公司 filed Critical 京东方科技集团股份有限公司
Priority to US14/241,620 priority Critical patent/US9543366B2/en
Publication of WO2014183366A1 publication Critical patent/WO2014183366A1/zh

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/147—Structural association of two or more printed circuits at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/148—Arrangements of two or more hingeably connected rigid printed circuit boards, i.e. connected by flexible means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10128—Display
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10674—Flip chip
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10681—Tape Carrier Package [TCP]; Flexible sheet connector
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/131—Interconnections, e.g. wiring lines or terminals

Definitions

  • Embodiments of the present invention relate to the field of display technologies, and in particular, to a display panel and a display device having the same. Background technique
  • AMOLED active matrix organic light emitting diode
  • the AMOLED display panel mainly includes an array substrate, a chip on film (COF, Chip On Film), and a printed circuit board (PCB).
  • the array substrate has a display area for display and a connection area (Fan Out) located at the periphery of the display area. The end of the lead in the display area is located in the connection area.
  • the flip chip is provided with leads and chips on one side, and the leads of the connection regions of the array substrate are connected to the printed circuit board through the leads and the chips.
  • the conventional AMOLED display panel is prepared by first attaching a side of the flip chip 200 provided with the chip 201 to the connection region 400 of the array substrate 100, wherein the connection region 400 is formed on the array substrate 100 and a step difference between the encapsulation layers 101; the other end of the face of the flip chip 200 is attached to the printed circuit board 300; then the flip chip 200 is wrapped by 180 degrees to place the printed circuit board 300 on the array substrate
  • the back surface of 100 i.e., the side that is not illuminated
  • the chip 201 on the flip chip 200 faces the side away from the array substrate 100.
  • the frame of the display device needs to leave enough space, not only to place the flip-chip film 200, but also to place the plastic frame and the iron frame, thereby causing the frame of the display device to be too wide.
  • the distance between the printed circuit board 300 and the array substrate 100 is at least equal to the diameter of the wraparound area of the flip chip 200, so the printed circuit board 300 cannot be placed close to the array substrate 100, thereby causing the thickness of the display device to be excessive. problem.
  • the trace of the surface is a horizontal line
  • the printed circuit board 300 is away from the array substrate 100.
  • the traces of the faces are vertical lines (here, the traces perpendicular to the paper surface are referred to as vertical lines; the traces perpendicular to the vertical lines and parallel to the board are referred to as transverse lines).
  • the vertical lines are primarily used to transfer signals between the various electronic components 301 of the printed circuit board 300
  • the horizontal lines are primarily used to connect the electronic components 301 to the binding pins.
  • the electronic component 301 is generally disposed on the side away from the array substrate 100, but this causes space to compete with the vertical line, resulting in wiring difficulties. Summary of the invention
  • Embodiments of the present invention provide a display panel that reduces the width of a bezel and a display device having the same, which can solve at least one of the above technical problems.
  • a display panel comprising: an array substrate, a printed circuit board, and a flip chip; wherein the chip is disposed on the first surface of the flip chip, and one end of the first surface is attached a connection region of the array substrate, the other end of the first surface is attached to the printed circuit board, and the first surface of the flip chip is facing the array substrate, and the connection region is located at a far side of the array substrate (ie, facing away from the light exit surface) side.
  • the flip chip of the present invention is provided with the first side of the chip facing the array substrate (that is, the chip is located inside the flip chip), and one end of the first surface is connected to the connection region of the array substrate, and the other end is printed with the circuit
  • the boards are connected so that they do not need to be wound and connected, and the chip faces the array substrate, so that the width of the frame of the display device can be reduced.
  • the display panel may be a bottom-emitting AMOLED display panel.
  • the printed circuit board may be disposed on a side of the array substrate that is away from the light exit surface.
  • a flip chip may be attached to a side of the printed circuit board remote from the array substrate, and electronic components of the printed circuit board may be disposed at the face of the printed circuit board.
  • the traces of the printed circuit board facing the face of the array substrate can be used to transfer signals between the electronic components of the printed circuit board.
  • Embodiments of the present invention also provide a display device including the above display panel.
  • DRAWINGS 1 is a schematic view showing an AMOLED display panel in the prior art
  • FIG. 2 is a schematic view showing an AMOLED display panel of Embodiment 1 of the present invention
  • FIG. 3 is a schematic view showing a modification of the embodiment shown in FIG. 2;
  • FIG. 4 is a schematic view showing an organic light emitting diode disposed on an array substrate. detailed description
  • the embodiment provides a display panel, and the display panel includes: an array substrate
  • the printed circuit board 300 and the flip chip 200 are disposed on the first surface of the flip chip 200. One end of the first surface is attached to the connection region 400 of the array substrate 100, and the other end of the first surface is attached.
  • the connection region 400 is located on a side of the array substrate 100 that is away from the light exit surface.
  • the connection region 400 that is, in a manner of being attached internally (i.e., the chip faces the array substrate), and the other end of the first surface is attached to the printed circuit board 300.
  • the method of the embodiment can place the printed circuit board 300 on the back surface of the array substrate 100 without wrapping the flip chip 200 by 180 degrees. Since such a design does not have a wrap area, it can be made. The frame of the display panel is narrowed, and the radius of the wrap is removed, so that the display device can be made thinner, which is advantageous for the thin design.
  • the chip on the flip chip 200 201 does not touch the traces on the connection area 400.
  • the flip chip is still wound, but it is wound inward (ie, folded in the direction of the array substrate), and can also serve to narrow the frame, but display The thickness of the device is still too large.
  • the display panel may be an AMOLED display panel.
  • the backlight surface of the array substrate 100 of the display panel is provided with an encapsulation layer 101, and the area of the array substrate 100 is larger than the area of the encapsulation layer 101, and the connection region 400 may be located at a step difference between the array substrate 100 and the encapsulation layer 101.
  • the above display panel may be a bottom-emitting AMOLED display panel.
  • the organic light emitting diode 500 can be disposed on the array substrate 100, and the organic light emitting diode 500 is generally packaged An anode 501, a cathode 502, and a "light emitting layer" sandwiched between the two electrodes are included.
  • the "light-emitting layer” may also be composed of a plurality of different layers; the “light-emitting layer” includes at least one organic electroluminescent material layer (EML) 505, and may further include: between the organic electroluminescent material layer 505 and the cathode 502 layer Electron transport layer 506 (ETL) and electron injection layer (EIL) 507; hole injection layer (HIL) 503 and hole transport layer (HTL) 504 located between layers of organic electroluminescent material layer 505 and anode 501 .
  • ETL organic electroluminescent material layer
  • EIL electron injection layer
  • HIL hole injection layer
  • HTL hole transport layer
  • connection region 400 Since the structure of the lead or the like on the array substrate 100 is disposed on the surface away from the light-emitting surface in the AMOLED display panel that emits light at the bottom, the direction of the connection region 400 satisfies the requirements of the embodiment. However, it should be understood that for other types of display panels, the structure of the present embodiment can be applied as long as the connection region 400 is located on the side of the array substrate 100 that is away from the light exit surface.
  • the printed circuit board 300 may be disposed on a side of the array substrate 100 that is away from the display surface (i.e., the side on which the array substrate 100 does not emit light). Thus, the printed circuit board 300 does not block light and does not occupy the area of the display area.
  • the flip chip 200 may be attached to a side of the printed circuit board 300 remote from the array substrate 100, and the electronic component 301 of the printed circuit board 300 is also disposed on the surface.
  • the trace of the side of the printed circuit board 300 away from the array substrate 100 is a horizontal line, and signals are transmitted between the printed circuit boards 300, that is, the traces are vertical lines, and the electronic parts 301 of the printed circuit board 300 are never present.
  • the problem of competing for space with the vertical line makes the layout of the board easier, and the printed circuit board 300 can be made narrower, thereby reducing the cost.
  • the flip chip 200 is attached to the surface of the printed circuit board 300 on which the electronic component 301 is disposed, the electronic component 301 is closer to the flip chip 200, so that the filtering effect of the capacitor and the like is better, and the printing is improved.
  • the performance of the circuit board 300 since the flip chip 200 is attached to the surface of the printed circuit board 300 on which the electronic component 301 is disposed, the electronic component 301 is closer to the flip chip 200, so that the filtering effect of the capacitor and the like is better, and the printing is improved.
  • the performance of the circuit board 300 is performed by the circuit board 300.
  • the embodiment provides a display device including the above display panel.
  • the display device can be: OLED panel, mobile phone, tablet computer, television, display, notebook computer, digital photo frame, navigator and the like with any display product or component.
  • the display device of this embodiment has the display panel of Embodiment 1, so that the frame of the display device is narrower and thinner.
  • the display device of the embodiment may further include other conventional structures such as a power supply unit and the like. It is to be understood that the above embodiments are merely exemplary embodiments employed to explain the principles of the invention, but the invention is not limited thereto. For those of ordinary skill in the art Various modifications and improvements can be made without departing from the spirit and scope of the invention, and such modifications and improvements are also considered to be within the scope of the invention.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electroluminescent Light Sources (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)

Abstract

一种显示面板和具有该显示面板的显示装置。该显示面板包括阵列基板（100），印刷电路板（300），覆晶薄膜（200）。该覆晶薄膜（200）的一端贴附在阵列基板（100）的连接区（400），另一端贴附在印刷电路板（300）上，并且覆晶薄膜（200）设置有芯片（201）的一面朝向阵列基板（100）。连接区（400）位于阵列基板（100）远离出光面的一侧。

Description

显示面板以及具有该显示面板的显示装置 技术领域
本发明的实施例涉及显示技术领域， 具体地涉及一种显示面板以及具有 该显示面板的显示装置。 背景技术
平板显示器为目前主要流行的显示器。 在平板显示器当中， 有源矩阵有 机发光二极管（AMOLED )显示装置更由于其具有外形轻薄、 省电以及无辐 射等特点而被广泛地应用于电脑屏幕、 移动电话等电子产品上。
AMOLED显示面板主要包括阵列基板、覆晶薄膜（COF, Chip On Film ) 和印刷电路板（PCB ) 。 阵列基板具有用于进行显示的显示区和位于显示区 外围的连接区（Fan Out )。 显示区中引线的端头位于连接区中。 覆晶薄膜在 一面设有引线和芯片， 通过这些引线和芯片将阵列基板的连接区的引线连接 到印刷电路板。
如图 1所示，传统的 AMOLED显示面板的制备包括：先将覆晶薄膜 200 的设置有芯片 201的一面贴附在阵列基板 100的连接区 400上面， 其中连接 区 400形成在阵列基板 100与封装层 101之间的段差处； 再将覆晶薄膜 200 的该面的另一端贴附在印刷电路板 300上；然后将覆晶薄膜 200绕折 180度， 使印刷电路板 300设置在阵列基板 100后面 （也就是不发光的一面） ， 此时 覆晶薄膜 200上的芯片 201朝向远离阵列基板 100的一侧。 在组装显示面板 时不仅要保证覆晶薄膜 200的存在空间，更要保证覆晶薄膜 200上的芯片 201 的安全， 芯片 201不能受到挤压并且不能碰到金属。 由于覆晶薄膜 200的绕 折区的存在， 所以显示装置的边框就要留出足够的空间， 不仅要放置覆晶薄 膜 200, 还要放置胶框和铁框， 从而导致显示装置的边框过宽； 同时， 印刷 电路板 300与阵列基板 100之间的距离至少要等于覆晶薄膜 200的绕折区的 直径， 所以印刷电路板 300不能靠近阵列基板 100设置， 从而导致显示装置 的厚度过大的问题。
另外， 由于覆晶薄膜 200贴附在印刷电路板 300的朝向阵列基板 100的 一面， 所以该面的走线为横向线， 印刷电路板 300的远离阵列基板 100的一 面的走线为竖向线（这里， 将垂直于纸面的走线称为竖向线； 与竖向线垂直 并且平行于电路板的走线称为横向线） 。 竖向线主要用于在印刷电路板 300 的各电子零件 301之间传递信号， 横向线主要用于将电子零件 301连接到绑 定脚位。 为了避免印刷电路板上的电子零件 301受损， 电子零件 301—般设 置在远离阵列基板 100的一面， 但这样其就与竖向线发生空间争抢， 造成布 线困难。 发明内容
本发明的实施例提供一种减小边框宽度的显示面板以及具有该显示面板 的显示装置， 可以解决以上存在的至少一个技术问题。
根据本发明的一个方面， 提供了一种显示面板， 包括： 阵列基板、 印刷 电路板、 覆晶薄膜， 其中芯片设置在覆晶薄膜的第一面上， 所述第一面的一 端贴附在阵列基板的连接区， 所述第一面的另一端贴附在印刷电路板上， 并 且覆晶薄膜的第一面朝向阵列基板， 连接区位于阵列基板的远离 （即背对） 出光面的一侧。
由于本发明的覆晶薄膜的设置有芯片的第一面朝向阵列基板 (也就是芯 片位于覆晶薄膜的内侧）， 并且该第一面的一端与阵列基板的连接区连接， 另 一端与印刷电路板连接， 所以其无需绕折连接， 而且芯片朝向阵列基板， 从 而可以减小显示装置的边框的宽度。
在实施例中， 显示面板可以为 AMOLED显示面板。
在实施例中， 显示面板可以为底部发光的 AMOLED显示面板。
在实施例中， 印刷电路板可以设置在阵列基板的远离出光面的一侧。 在实施例中， 覆晶薄膜可以贴附于印刷电路板的远离阵列基板一面， 并 且印刷电路板的电子零件可以设置在印刷电路板的该面处。
在实施例中， 印刷电路板的朝向阵列基板的面上的走线可以用于在印刷 电路板的电子零件之间传递信号。
本发明的实施例还提供一种显示装置， 包括上述的显示面板。
根据本发明的实施例， 由于覆晶薄膜无需绕折， 所以显示装置的边框变 窄。 附图说明 图 1为示出现有技术中的 AMOLED显示面板的示意图；
图 2为示出本发明的实施例 1的 AMOLED显示面板的示意图； 图 3为示出图 2所示的实施例的一种变型的示意图； 以及
图 4为示出设置在阵列基板上的有机发光二极管的示意图。 具体实施方式
为使本领域技术人员更好地理解本发明的技术方案， 下面结合附图和具 体实施方式对本发明作进一步详细描述。
实施例 1:
如图 2所示， 本实施例提供一种显示面板， 该显示面板包括： 阵列基板
100、 印刷电路板 300、 覆晶薄膜 200, 芯片 201设置在覆晶薄膜 200的第一 面上， 第一面的一端贴附在阵列基板 100的连接区 400, 第一面的另一端贴 附在印刷电路板 300上， 并且覆晶薄膜 200的第一面朝向阵列基板 100, 连 接区 400位于阵列基板 100的远离出光面的一侧。
覆晶薄膜 200的第一面的一端贴附在连接区 400, 也就是以内贴附的方 式（即芯片朝向阵列基板）， 第一面的另一端与印刷电路板 300贴附连接。 和 现有技术相比较， 本实施例的方式无需将覆晶薄膜 200绕折 180度就可以将 印刷电路板 300安放在阵列基板 100的背面， 由于这样的设计不存在绕折区 域， 所以可以使显示面板的边框变窄， 同时去除了绕折半径， 可以将显示装 置做得更薄， 有利于薄型化设计。 由于绝缘胶或封框胶覆盖在阵列基板 100 与封装层 101 (封装层 101可以为一片单独的基板， 也可以为封装盖）对盒 处以及连接区 400上，所以覆晶薄膜 200上的芯片 201不会接触到连接区 400 上的走线。
当然， 如果采取如图 3所示的形式， 覆晶薄膜仍然被绕折， 但是为向内 绕折（即向阵列基板的方向绕折 ), 也可以起到使边框变窄的作用，但是显示 装置的厚度仍然过大。
优选地， 该显示面板可以为 AMOLED显示面板。 该显示面板的阵列基 板 100的背光面设置有封装层 101 ,并且阵列基板 100的面积大于封装层 101 面积， 连接区 400可以位于阵列基板 100与封装层 101之间的段差处。
如图 4所示， 上述显示面板可以为底部发光的 AMOLED显示面板。 有 机发光二极管 500可以设置在阵列基板 100上， 有机发光二极管 500—般包 括阳极 501、 阴极 502以及夹在这两个电极之间的 "发光层"。 "发光层" 也 可以由多个不同的层组成； "发光层" 至少包括一个有机电致发光材料层 ( EML ) 505, 还可以包括： 位于有机电致发光材料层 505与阴极 502层之 间的电子传输层 506 ( ETL )和电子注入层 ( EIL ) 507; 位于有机电致发光 材料层 505与阳极 501层之间的空穴注入层 ( HIL ) 503和空穴传输层（ HTL ) 504等。 由于在底部发光的 AMOLED显示面板中， 阵列基板 100上的引线 等结构设置在其远离出光面的面上， 所以其连接区 400的方向正好满足本实 施例的要求。 但应当理解， 对于其他类型的显示面板， 只要其连接区 400位 于阵列基板 100的远离出光面的一侧， 也能应用本实施例的结构。
在实施例中， 印刷电路板 300可以设置在阵列基板 100的远离显示面的 一侧（即阵列基板 100不发光的一面）。 因而， 印刷电路板 300不会挡光， 不 会占据显示区的面积。
在实施例中， 覆晶薄膜 200可以贴附于印刷电路板 300的远离阵列基板 100的一面， 印刷电路板 300的电子零件 301也设置在该面。 此时， 印刷电 路板 300的远离阵列基板 100的一面的走线为横向线， 并且印刷电路板 300 间传递信号， 也就是走线为竖向线， 从而不存在印刷电路板 300的电子零件 301 与竖向线争抢空间的问题， 使电路板的布局布线更加容易， 印刷电路板 300可以制作得更窄， 从而降低成本。
同时， 由于覆晶薄膜 200贴附在印刷电路板 300的设置有电子零件 301 的面上， 这使得电子零件 301离覆晶薄膜 200更近， 从而电容等零件的滤波 作用更好， 改进了印刷电路板 300的性能。
实施例 2:
本实施例提供一种显示装置， 包括上述显示面板。 该显示装置可以为： OLED面板、 手机、 平板电脑、 电视机、 显示器、 笔记本电脑、 数码相框、 导航仪等任何具有显示功能的产品或部件。
本实施例的显示装置具有实施例 1中的显示面板， 从而该显示装置的边 框更窄， 厚度更薄。
当然， 本实施例的显示装置还可以包括其他常规结构， 如电源单元等。 可以理解的是， 以上实施方式仅仅是为了说明本发明的原理而采用的示 例性实施方式， 然而本发明并不局限于此。 对于本领域内的普通技术人员而 言， 在不脱离本发明的精神和实质的情况下， 可以做出各种变型和改进， 这 些变型和改进也视为本发明的保护范围。

Claims

权利要求书
1.一种显示面板， 包括： 阵列基板、 印刷电路板、 覆晶薄膜， 其中芯片 设置在所述覆晶薄膜的第一面上， 所述第一面的一端贴附在所述阵列基板的 连接区， 所述第一面的另一端贴附在所述印刷电路板上， 并且所述覆晶薄膜 的所述第一面朝向所述阵列基板， 所述连接区位于所述阵列基板的远离出光 面的一侧。
2.根据权利要求 1所述的显示面板， 其中：
所述显示面板为有源矩阵有机发光二极管 （AMOLED )显示面板。
3.根据权利要求 2所述的显示面板， 其中：
所述显示面板为底部发光的 AMOLED显示面板。
4.根据权利要求 1至 3中任一项所述的显示面板， 其中：
所述印刷电路板位于所述阵列基板的远离出光面的一侧。
5.根据权利要求 1-4中任一项所述的显示面板， 其中：
所述覆晶薄膜贴附于所述印刷电路板的远离所述阵列基板的一面， 且所 述印刷电路板的电子零件设置在所述印刷电路板的该面处。
6.根据权利要求 1-5中任一项所述的显示面板， 其中：
所述印刷电路板的朝向所述阵列基板的面上的走线用于在所述印刷电路 板的电子零件之间传递信号。
7.—种显示装置， 包括权利要求 1至 6中任一项所述的显示面板。
PCT/CN2013/084442 2013-05-15 2013-09-27 显示面板以及具有该显示面板的显示装置 WO2014183366A1 (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US14/241,620 US9543366B2 (en) 2013-05-15 2013-09-27 Display panel and display apparatus having the same

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201310179052.5 2013-05-15
CN201310179052.5A CN103325317B (zh) 2013-05-15 2013-05-15 一种显示面板及其显示装置

Publications (1)

Publication Number Publication Date
WO2014183366A1 true WO2014183366A1 (zh) 2014-11-20

Family

ID=49194028

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2013/084442 WO2014183366A1 (zh) 2013-05-15 2013-09-27 显示面板以及具有该显示面板的显示装置

Country Status (2)

Country Link
CN (1) CN103325317B (zh)
WO (1) WO2014183366A1 (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110783489A (zh) * 2019-10-31 2020-02-11 京东方科技集团股份有限公司 一种显示面板及其制备方法、显示装置

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9543366B2 (en) 2013-05-15 2017-01-10 Boe Technology Group Co., Ltd. Display panel and display apparatus having the same
CN103325317B (zh) * 2013-05-15 2015-04-15 京东方科技集团股份有限公司 一种显示面板及其显示装置
CN105575275A (zh) * 2016-03-07 2016-05-11 京东方科技集团股份有限公司 显示面板及显示面板的制备方法、显示装置
CN105826353B (zh) * 2016-03-25 2019-08-16 京东方科技集团股份有限公司 覆晶薄膜和显示装置
CN105870159B (zh) * 2016-06-07 2018-07-17 京东方科技集团股份有限公司 一种有机发光二极管显示面板、显示装置及制作方法
WO2019041237A1 (zh) * 2017-08-31 2019-03-07 华为技术有限公司 一种显示屏及移动终端
TWI711199B (zh) * 2018-09-11 2020-11-21 啟端光電股份有限公司 微發光二極體顯示面板
CN109471277B (zh) * 2018-11-23 2024-02-20 深圳市美视达技术有限公司 一种方便组装的显示器
CN111402755A (zh) * 2020-05-28 2020-07-10 上海天马微电子有限公司 显示面板及显示装置

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20030037167A (ko) * 2001-11-02 2003-05-12 엘지.필립스 엘시디 주식회사 액정 표시 장치
KR20030067128A (ko) * 2002-02-07 2003-08-14 비오이 하이디스 테크놀로지 주식회사 게이트 피씨비가 없는 액정표시장치
CN101477261A (zh) * 2009-01-24 2009-07-08 矽创电子股份有限公司 模块化触控面板
CN102881710A (zh) * 2011-07-13 2013-01-16 三星电子株式会社 触摸屏面板有源矩阵有机发光二极管显示装置
CN103325317A (zh) * 2013-05-15 2013-09-25 京东方科技集团股份有限公司 一种显示面板及其显示装置
CN203311768U (zh) * 2013-05-15 2013-11-27 京东方科技集团股份有限公司 一种显示面板及其显示装置

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101021624A (zh) * 2006-04-18 2007-08-22 乐金电子（南京）等离子有限公司 信号线连接装置及利用信号线连接装置的平板显示装置
KR101345172B1 (ko) * 2008-07-18 2013-12-27 엘지디스플레이 주식회사 전기영동 표시소자
DE102010034062B3 (de) * 2010-08-11 2012-02-02 Robert Walter Huber Anzeigevorrichtung und Verfahren und Vorrichtung zur Herstellung einer Anzeigevorrichtung

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20030037167A (ko) * 2001-11-02 2003-05-12 엘지.필립스 엘시디 주식회사 액정 표시 장치
KR20030067128A (ko) * 2002-02-07 2003-08-14 비오이 하이디스 테크놀로지 주식회사 게이트 피씨비가 없는 액정표시장치
CN101477261A (zh) * 2009-01-24 2009-07-08 矽创电子股份有限公司 模块化触控面板
CN102881710A (zh) * 2011-07-13 2013-01-16 三星电子株式会社 触摸屏面板有源矩阵有机发光二极管显示装置
CN103325317A (zh) * 2013-05-15 2013-09-25 京东方科技集团股份有限公司 一种显示面板及其显示装置
CN203311768U (zh) * 2013-05-15 2013-11-27 京东方科技集团股份有限公司 一种显示面板及其显示装置

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110783489A (zh) * 2019-10-31 2020-02-11 京东方科技集团股份有限公司 一种显示面板及其制备方法、显示装置
CN110783489B (zh) * 2019-10-31 2022-11-01 京东方科技集团股份有限公司 一种显示面板及其制备方法、显示装置

Also Published As

Publication number Publication date
CN103325317A (zh) 2013-09-25
CN103325317B (zh) 2015-04-15

Similar Documents

Publication Publication Date Title
WO2014183366A1 (zh) 显示面板以及具有该显示面板的显示装置
CN108766994B (zh) 有机发光显示面板和有机发光显示装置
TWI547789B (zh) 顯示器模組及系統應用
US11925088B2 (en) Foldable display apparatus
KR101955465B1 (ko) 표시 장치
US11508651B2 (en) Chip-on-film packages and display apparatuses including the same
JP2007080522A5 (zh)
US7538343B2 (en) Organic light emitting display (OLED)
WO2018176780A1 (zh) 一种显示面板、显示装置及显示面板的制作方法
WO2019019235A1 (zh) 触控式oled显示面板以及显示装置
WO2021190034A1 (zh) 显示基板、其制备方法及显示装置
TWM569939U (zh) Display panel
CN111668279A (zh) 显示面板和显示装置
KR101084241B1 (ko) 유기 발광 표시 장치
US20210335981A1 (en) Display panel, manufacturing method thereof and related display device
KR20200085835A (ko) 터치 디스플레이 패널, 플렉서블 디스플레이 장치 및 터치 디스플레이 패널을 제조하는 방법
EP3226321B1 (en) Organic electroluminescence device and manufacturing method thereof, and display device
WO2020103349A1 (zh) Oled显示装置及其制作方法
KR102037871B1 (ko) 유기발광다이오드 표시장치
WO2020103241A1 (zh) 一种oled显示器
US8198809B2 (en) Organic electroluminescence device and electronic device having the same
WO2020107740A1 (zh) 触控显示面板及触控显示装置
US9543366B2 (en) Display panel and display apparatus having the same
CN203311768U (zh) 一种显示面板及其显示装置
US11706956B2 (en) Display device having side surface connection pads

Legal Events

Date Code Title Description
WWE Wipo information: entry into national phase

Ref document number: 14241620

Country of ref document: US

121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 13884869

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

32PN Ep: public notification in the ep bulletin as address of the adressee cannot be established

Free format text: NOTING OF LOSS OF RIGHTS PURSUANT TO RULE 112(1) EPC

122 Ep: pct application non-entry in european phase

Ref document number: 13884869

Country of ref document: EP

Kind code of ref document: A1