WO2023065488A1 - 一种显示模组及无缝拼接显示装置 - Google Patents

一种显示模组及无缝拼接显示装置 Download PDF

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Publication number
WO2023065488A1
WO2023065488A1 PCT/CN2021/137117 CN2021137117W WO2023065488A1 WO 2023065488 A1 WO2023065488 A1 WO 2023065488A1 CN 2021137117 W CN2021137117 W CN 2021137117W WO 2023065488 A1 WO2023065488 A1 WO 2023065488A1
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WO
WIPO (PCT)
Prior art keywords
display
display panel
array substrate
compensation
frame
Prior art date
Application number
PCT/CN2021/137117
Other languages
English (en)
French (fr)
Inventor
肖军城
赵斌
李吉
韦宏权
Original Assignee
Tcl华星光电技术有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tcl华星光电技术有限公司 filed Critical Tcl华星光电技术有限公司
Priority to US17/621,252 priority Critical patent/US20240036374A1/en
Publication of WO2023065488A1 publication Critical patent/WO2023065488A1/zh

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Classifications

    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G09F9/302—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements characterised by the form or geometrical disposition of the individual elements
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/13336—Combining plural substrates to produce large-area displays, e.g. tiled displays
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/133388—Constructional arrangements; Manufacturing methods with constructional differences between the display region and the peripheral region
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/136—Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
    • G02F1/1362—Active matrix addressed cells
    • G02F1/136209—Light shielding layers, e.g. black matrix, incorporated in the active matrix substrate, e.g. structurally associated with the switching element
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/136—Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
    • G02F1/1362—Active matrix addressed cells
    • G02F1/136222—Colour filters incorporated in the active matrix substrate
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/136—Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
    • G02F1/1362—Active matrix addressed cells
    • G02F1/136286—Wiring, e.g. gate line, drain line
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10128—Display
    • H05K2201/10136—Liquid Crystal display [LCD]

Definitions

  • the present application relates to the field of display technology, in particular to a display module and a seamless splicing display device.
  • LED splicing can achieve seamless splicing display, the LED resolution is low and cannot meet the 8K resolution.
  • LCD splicing LCD technology is mature, with low cost and high yield, and is the main force in the splicing market.
  • there is a frame on the LCD screen When each LCD screen is spliced, there is a black splicing gap between the frames of adjacent LCD screens at the splicing point.
  • the picture signal is input, the frame part cannot be displayed, resulting in the picture being split. affect the display effect.
  • the present application provides a display module and a seamless splicing display device, which can solve the seamless splicing of the display device.
  • a display module comprising:
  • a display panel including a central display area and a frame area adjacent to the central display area, the display panel is provided with a frame drive circuit and an array substrate drive circuit;
  • a compensation display component disposed on the display panel, located in the frame area, and electrically connected to the frame drive circuit;
  • the metal wiring is located on the side of the display panel and connected to the frame driving circuit and the array substrate driving circuit.
  • the frame driving circuit has conductive leads, and the conductive leads extend to the side surface of the display panel and are connected to the metal traces.
  • the display panel includes an array substrate and a color filter substrate disposed opposite to the array substrate, and the compensation display component and the frame driving circuit are arranged on the color filter substrate away from the array substrate
  • the outer surface of the array substrate driving circuit is arranged on the side of the array substrate facing the color filter substrate.
  • a black matrix layer is provided on the surface of the color filter substrate close to the array substrate, the black matrix layer is located in the frame area, and the compensation display component on the color filter substrate The orthographic projection is located within the orthographic projection range of the black matrix layer on the color filter substrate.
  • the display module includes a protective layer, the metal traces are divided into bonded wires and non-bonded wires, and the protective layer is disposed on the non-bonded wires of the metal traces surface.
  • the display module includes a flexible circuit board and a driver chip, a part of the flexible circuit board is arranged on the side of the metal wiring away from the display panel, and is connected to the bonding wire.
  • the other part of the flexible circuit board is arranged on the side of the display panel away from the compensation display component and is electrically connected with the driving chip by binding wires.
  • a seamless splicing display device including at least two display modules, at least two display modules are spliced, wherein the display modules include:
  • a display panel including a central display area and a frame area adjacent to the central display area, the display panel is provided with a frame drive circuit and an array substrate drive circuit;
  • a compensation display component disposed on the display panel, located in the frame area, and electrically connected to the frame drive circuit;
  • the metal wiring is located on the side of the display panel and connected to the frame driving circuit and the array substrate driving circuit.
  • the frame driving circuit includes a driving part for driving the compensation display component and a conductive lead connected to the compensation display component, one end of the metal trace is connected to the conductive lead, and the other is connected to the conductive lead. One end is connected to the driving part.
  • the display panel includes an array substrate and a color filter substrate disposed opposite to the array substrate, and the compensation display component and the conductive leads are disposed on a side of the color filter substrate away from the array substrate.
  • the driving part and the array substrate driving circuit are arranged on the side of the array substrate facing the color filter substrate.
  • the compensation display component includes a plurality of micro-light emitting units and a plurality of sets of positive and negative electrodes, the plurality of micro-light emitting units and the plurality of sets of positive and negative electrodes are arranged in the frame area, each of the The micro light emitting unit is connected with a set of positive and negative electrodes, and each set of positive and negative electrodes is electrically connected with the conductive lead.
  • a black matrix layer is provided on the surface of the color filter substrate close to the array substrate, the black matrix layer is located in the frame area, and the compensation display component on the color filter substrate The orthographic projection is located within the orthographic projection range of the black matrix layer on the color filter substrate.
  • the metal trace is L-shaped, and the metal trace extends from the side of the display panel to the surface of the conductive lead.
  • the display module includes a protective layer, the metal wiring is divided into bonded wires and non-bonded wires, and the protective layer is set on the non-bonded wires of the metal wires. the surface of the line.
  • the seamless splicing display device includes a flexible circuit board, a driver chip and a protective layer, and a part of the flexible circuit board is arranged on the side of the metal wiring away from the display panel, and electrically connected to the metal wiring, the other part of the flexible circuit board is arranged on the side of the display panel away from the compensation display component and electrically connected to the driving chip, and the protective layer covers the Part of the surface of the flexible printed circuit board is sandwiched between two adjacent display modules.
  • the protective layer is a combination of an adhesive layer and a protective film, and the adhesive layers included in the protective layer on the surface of the flexible circuit board included in the two display modules that are spliced in each phase are bonded to each other .
  • a compensation display component is set in the frame area of the display panel included in the display module, and the frame driving of the compensation display component is controlled.
  • the circuit is arranged on the surface of the display panel, the side of the display panel is provided with metal traces, and the metal traces are electrically connected to the compensation display component and the frame drive circuit, thereby simplifying the control circuit of the compensation display component structure, and can make the thickness of the display module thinner.
  • FIG. 1 is a schematic cross-sectional structure diagram of a display module provided by the present application.
  • Fig. 2 is a specific cross-sectional structural schematic diagram of a display module provided for the present application
  • Fig. 3 is a schematic diagram of the splicing of display modules forming a seamless splicing display device according to an embodiment of the present application
  • Fig. 4 is a top view of the display module of the present application forming a seamless splicing display device
  • Fig. 5 is a top view of a display module forming a seamless splicing display device according to another embodiment of the present application.
  • Fig. 6 is a top view of a display module forming a seamless splicing display device according to another embodiment of the present application.
  • FIG. 7 is a schematic flowchart of a method for manufacturing a seamlessly tiled display device according to an embodiment of the present application.
  • FIG. 1 is a frameless display module 100 provided by the present application.
  • the display module 100 can be used in electronic devices.
  • the electronic device can be a smartphone, a tablet personal computer, a mobile phone, a video phone, an e-book reader, a desktop PC, a laptop ( laptop PC), netbook computer, workstation, server, personal digital assistant, portable media player multimedia player), MP3 player, mobile medical machine, camera, game console, digital camera, car navigation system, electronic billboard, automatic teller machine or wearable device (wearable device).
  • the frameless display module 100 includes: a display panel 1 , a compensation display component 2 and metal wires 3 .
  • the display panel 1 has a central display area AA and a frame area NA.
  • the central display area AA is an area where the pixel units of the display panel 1 generate pictures;
  • the frame area NA is adjacent to the central display area AA and is located on the peripheral side of the central display area AA.
  • the compensation display component 2 is arranged on the display panel 1, located in the frame area NA, the display panel 1 is provided with a frame drive circuit 101 for controlling the compensation display component 2, and is also provided with a display
  • the module 100 includes an array substrate driving circuit 103 for driving the pixel units.
  • the metal wiring 3 is located on the side of the display panel 1 , one end is connected to the frame driving component 2 , and the other end is connected to the frame driving circuit 101 and the array substrate driving circuit 103 .
  • the frame drive circuit 101 for driving and controlling the compensation display component 2 is arranged on the display panel 1, and the side of the display panel 1 is provided with metal wiring 3, and the metal wiring 3 It is electrically connected with the compensation display component 2 and the frame drive circuit 101, so that the frame drive circuit 101 is electrically connected with the array substrate drive circuit 103 included in the display panel 1 through the metal wiring 3, so that there is no need to attach a separate compensation
  • the control circuit of the display component 2 can not only reduce the thickness of the display module 100, but also reduce the attachment deviation; and because the array substrate driving circuit 103 and the frame driving circuit 101 are integrated, the control of the display module 100 can be simplified Circuit configuration.
  • the display module 200 capable of realizing borderless display includes: a display panel 1 , a compensation display component 2 , metal wires 3 , a protective layer 4 , a flexible circuit board 5 , a driver chip 6 and a protective layer 7 .
  • the display panel 1 is a liquid crystal display panel, which includes an array substrate 10 and a color filter substrate 12 disposed opposite to each other.
  • a thin film transistor layer is formed on the side of the array substrate 10 close to the color filter substrate 12, and the thin film transistor layer includes a thin film transistor and an array substrate driving circuit 103 for realizing normal display of the liquid crystal display panel.
  • the array substrate driving circuit 103 is used to drive the pixel units 110 in the central display area AA to display.
  • the pixel unit 110 can be individually arranged on the surface of the array substrate 10 by RGB light-emitting elements sequentially, or can be formed on the surface of the array substrate 10 after being packaged by RGB light-emitting elements.
  • the pixel unit 110 is a package formed by light emitting elements of RGB three primary colors.
  • forming the thin film transistor layer also includes forming the border driving circuit 101 for driving the compensation display component 2 in the border area NA, which can simplify the process flow of the driving circuit of the compensation display component 2 .
  • the frame driving circuit 101 includes a driving part 102 formed on the array substrate 10 for driving the compensation display component 2 and a conductive lead 20 located on the outer surface 122 of the color filter substrate 12 .
  • the frame driving circuit 101 extends to be flush with the side of the display panel 1 .
  • the conductive leads 20 extend to the side of the color filter substrate 12
  • the driving part 102 extends to the side of the array substrate 10 .
  • the driving part 102 is formed together.
  • Liquid crystals are disposed in the liquid crystal layer 14 , and the liquid crystal layer 14 may further include spacer columns (not shown in the figure).
  • the array substrate 10 is used to provide an electric field effect, and the liquid crystal is deflected at different angles under the electric field effect, thereby changing the path of light passing through the liquid crystal layer 14, and then combined with the color filter of the light by the color filter substrate 12
  • the effect of light makes the display panel 1 present a color picture; it should be understood that the liquid crystal display panel 1 is a passive light-emitting display panel, which requires a backlight module to provide a backlight source to achieve preset luminous brightness and luminous color.
  • the color filter substrate 12 includes an inner surface 120 facing the array substrate 10 , the inner surface 120 is provided with a black matrix layer 121 and a color resist layer (not shown) formed between the black matrix layers 121 .
  • the color color resistance layer includes multiple color resistances arranged in an array, and the multiple color resistances can include red color resistance, green color resistance and blue color resistance.
  • the red color resistance filters the light passing through it into red, and the green color resistance passes through it. It filters light in green, and the blue color block filters the light that passes through it in blue.
  • the black matrix layer 121 is located in the frame area NA, and the position of the outer surface 122 of the color filter substrate 12 corresponding to the black matrix layer 121 is used for setting the frame display component 2 . That is, the orthographic projection of the compensation display component 2 on the color filter substrate 12 is within the range of the orthographic projection of the black matrix layer 121 on the color filter substrate 12 . Therefore, the compensation display component 2 does not occupy the space of the central display area, so that all the light emitted by the pixel unit 110 can be emitted from the central display area AA.
  • the compensation display component 2 includes multiple sets of positive and negative electrodes 123 located in the frame area NA and multiple micro-light emitting units 22 connected to the multiple sets of positive and negative electrodes 123 .
  • Each set of positive and negative electrodes 123 needs to be electrically connected to the conductive lead 20 .
  • the micro light emitting unit 22 includes mini-LED or micro-LED.
  • Each micro-light-emitting unit 22 is a package (PKG) formed by packaging three primary-color light-emitting diodes or a package formed by a single-color light-emitting diode.
  • the micro light-emitting unit 22 can be formed by surface mount technology (SMT).
  • the thickness of the compensation display assembly 2 of the present application is thinner, thereby reducing the size of the display module. 200 thickness, and reduce the attachment deviation. In this way, there is no requirement for a narrow frame for the frame width of the display panel 1 , so that the frame design of the display panel 1 is simpler.
  • the distance between the centers of adjacent pixel units 110 of the display panel 1 is P1
  • the micro-light-emitting units 22 in the frame area NA are closest to the central display area AA.
  • the metal wiring 3 is located on the side of the display panel 1 for conducting the frame driving circuit 101 and compensating the display component 2 .
  • the metal traces 3 are electrically connected to the conductive leads 20 .
  • the metal wiring 3 is also electrically connected to the array substrate driving circuit 103 .
  • the metal wires 3 are formed by printing conductive paste, curing and patterning.
  • the metal wires 3 are silver wires formed by curing silver paste.
  • the metal wiring 3 is L-shaped. Specifically, the metal wiring 3 extends upward from the end face of the array substrate driving circuit 103 and the end face of the bezel driving circuit 101 to the side of the sealant 16, the side of the black matrix layer 121, and the side of the color filter substrate 12 until covering On the surface of the conductive lead 20 included in the compensation display component 2 , to realize electrical connection with the compensation display component 2 .
  • the metal traces 3 include binding wires (not shown in the figure) and non-binding wires, the binding wires are used to bind the flexible circuit board 5, and the non-binding wires refer to metal traces 3 other than the binding wires part.
  • the protection layer 4 covers the surface of the non-bonded wires, and the protection layer 4 is used to isolate the metal wires 3 from water and oxygen, so as to protect the metal wires 3 .
  • the black protective layer 4 on the one hand, the black protective layer 4 is used to protect the metal wires 3 , and on the other hand, it can also absorb the light in the boundary, so as to avoid reflection and affect the viewing effect.
  • only the protective layer 4 at the bent end of the metal wiring 3 is shown. It can be understood that the metal wiring 3 on the side is not used to bind the part of the flexible circuit board. Covered with protective layer 4.
  • a part of the flexible circuit board 5 is arranged on the side of the metal wiring 3 away from the display panel 1, and is electrically connected with the metal wiring, and the other part of the flexible circuit board 5 A part is disposed on the side of the display panel 1 away from the compensation display component 2 and is electrically connected to the driving chip 6 .
  • the driver chip 6 and the control chip are located at the far end of the flexible circuit board 5, the driver chip 6 is used to drive the display panel 1 and/or compensate the display component 2 for display, and the control chip is used to control the driver chip 6 .
  • the protection layer 7 covers the surface of the flexible circuit board 5 .
  • the protection layer 7 is used to protect the flexible circuit board 5 to avoid damage during bending.
  • the working principle of the display module 200 is: the side of the display panel 1 is provided with a metal wire 3, and the compensation display component 2 provided on the surface of the array substrate 10 and the color filter substrate 12 is electrically connected by using the metal wire 3, And the surface of the metal wiring 3 is bound with a flexible circuit board 5, and the display of the pixel unit 110 in the central display area AA and the compensation display component 2 in the border area NA can be driven separately or simultaneously through the driving chip on the flexible circuit board 5
  • the frameless display of the display module 200 is realized.
  • the present application also provides a seamless splicing display device 300 .
  • the seamless splicing display device 300 includes a plurality of display modules 200, and the plurality of display modules 200 are arranged to be spliced with each other.
  • the protective layer 7 is a combination of an adhesive layer and a protective film.
  • the protective film included in the protective layer is removed, so that the flexible circuit boards included in the two display modules 200 that are spliced in each phase
  • the adhesive layers included in the protective layer 7 on the surface of 5 are bonded to each other.
  • a good water and oxygen barrier capability is achieved, thereby preventing water vapor and oxygen from entering the display module 200 and electronic components such as the positive and negative electrodes 123 inside the display module 200. Etc. erosion.
  • the distance between the centers of adjacent pixel units 110 is P1
  • the frame area NA of the display module 200 is provided with more than one column or more than one row to compensate the display component 2
  • the two groups of the micro-light emitting units that are adjacent to the frame area NA of the two display modules 200 spliced in each phase
  • the frame area NA includes at least one splicing edge 112, the splicing edge 112 is a side edge that is spliced with another display module 200, and the compensation display component 2 is disposed on the surface of the splicing edge 112. . It can be understood that, if a frameless display effect is to be achieved, a compensation display component 2 may also be provided on other sides of the frame area NA except the splicing side 112 .
  • each display module 200 includes a splicing side 112 , and the compensation display component 2 is arranged on the splicing side 112 to obtain an Nx1 rectangular seamless display device.
  • each display module 200 has two splicing sides 112, and a compensation display component 2 is set on the surface of each splicing side 112, so that a seamless display of a 2x2 square can be achieved device.
  • the display modules 200 in the first row and the second column and the display modules 200 in the second row and the second column are respectively three splicing sides 112, and the four peripheral display modules 200 are respectively Two splicing sides 112 are included, and a compensating display component 2 is arranged at the position of each splicing side 112 to obtain a 2x3 seamless display device.
  • the display module 200 in the middle of the 9 display modules 200 includes 4 splicing sides 112, and the compensation display components 2 are respectively arranged on the 4 splicing sides 112, and the center
  • the four display modules 200 adjacent to the display module 200 respectively include three splicing sides 112, and the four display modules 200 at the four corners respectively include two splicing sides 112, and the position of each splicing side 112
  • a 3x3 matrix seamless display device can be obtained.
  • the number of splicing sides 112 required to be included in the display module 200 can be selected according to the size of the display devices to be spliced, so as to realize seamless splicing.
  • the frame area NA only shows one column of compensation display components 2
  • the frame area NA may include multiple columns of compensation display components 2 .
  • the spacing between the compensation display components 2 in the frame area NA is equal to the spacing between the pixel units 110 of the display panel 1 .
  • the present invention also provides a method for manufacturing a seamlessly tiled display device 300, which includes the following steps:
  • Step 1 providing an array substrate 10 .
  • the array substrate 10 includes a thin film transistor layer, which includes thin film transistors, an array substrate driving circuit 103 for realizing normal display of the liquid crystal display panel, and a frame driving circuit 101 for driving the compensation display component 2 .
  • the frame driving circuit 101 and the array substrate driving circuit 103 are formed at the same time, so that there is no need to separately attach and compensate the control circuit of the display assembly 2, which not only reduces the thickness of the display module 100, but also reduces the attachment deviation;
  • the array substrate driving circuit 103 and the frame driving circuit 101 are integrated, the structure of the control circuit of the display module 100 can be simplified.
  • Step 2 Provide the color filter substrate 12 , and arrange multiple sets of positive and negative electrodes 123 and conductive leads 20 connected to the positive and negative electrodes 123 on the frame area of the outer surface 122 of the color filter substrate 12 .
  • the outer surface 122 referred to here refers to the surface of the color filter substrate 12 away from the array substrate 10 when it is subsequently fixed with the array substrate 10 to form the display panel 1 .
  • Step 3 Fix the array substrate 10 and the color filter substrate 12 with the frame glue 16 to form an intermediate structure.
  • a liquid crystal layer 14 and support columns are disposed between the color filter substrate 12 and the array substrate 10 and inside the sealant 16 .
  • Step 4 Use the cutting device 8 to cut the intermediate structure to reveal the frame driving circuit 101 and the array substrate driving circuit 103 , so as to facilitate the subsequent electrical connection of the metal wires 3 thereto.
  • Step 5 use the grinding device 9 to grind the end faces of the frame drive circuit 101 and the array substrate drive circuit 103 and use the laser device 11 to clean the ground surface after grinding.
  • the purpose of grinding is to reduce the roughness of the side surface of the intermediate structure. It is controlled to be less than 5um, so as to transfer the metal wiring 3 to the side of the intermediate structure in the next step.
  • Step 6 Form metal traces 3 at preset positions on the side surface of the intermediate structure, and form a protection layer 4 on the surface of the bent end of the metal traces 3 .
  • Both ends of the metal wire 3 are respectively connected to the frame driving circuit 101, the array substrate driving circuit 103, and the conductive lead 20, and the metal wire 3 is used to electrically conduct the array substrate 10 and the conductive wire 20, and then the flexible circuit board can pass through
  • the driver chip on 5 controls the display of the central display area AA and the display of the frame area NA.
  • the metal traces 3 are formed by printing conductive paste on the side surface of the display panel 1 and then curing and patterning by the curing device 13 .
  • the metal wires 3 are silver wires formed after the silver paste is cured and patterned.
  • the metal wiring 3 is L-shaped. The bent end of the metal wire 3 is formed on the surface of the conductive lead 20 , and the surface of the non-bonded wire of the metal wire is formed with a protective layer 4 .
  • Step 7 Install the compensation display component 2 on the positive and negative electrodes 123 in the frame area of the outer surface 122 of the color filter substrate 12 through surface mount technology or mass transfer process, so that the compensation display component 2 includes micro
  • the light emitting unit 22 is electrically connected to the conductive lead 20 on the outer surface 122 of the color filter substrate 12 .
  • the micro light emitting unit 22 includes mini-LED or micro-LED.
  • Each micro-light-emitting unit 22 is a package (PKG) formed by packaging three primary-color light-emitting diodes or a package formed by a single-color light-emitting diode.
  • Step 8 Provide a flexible circuit board 5, so that the flexible circuit board 5 is bound to the binding wire of the metal wiring 3 on the side of the display module 200, and the far end of the flexible circuit board 5 is set There are driver chip 6 and control chip. And the other side of the flexible circuit board 5 is fixed to the PCB, so that the signal of the display module 200 can be input and output.
  • Step 9 Provide at least two of the display modules 200 to be spliced together to obtain the seamlessly spliced display device 300 . Then, through the signal synchronization processing of the system, the picture missing due to the presence of black frames around the display module 200 is displayed by the micro-light emitting unit 22 by using the compensation display component 2 to realize a true seamless display effect.
  • the display modules 100 and 200 provided by this application are seamlessly spliced display devices 300 formed by the display module 200, and the compensation display component 2 is set in the frame area NA of the display panel 1, and the compensation display
  • the frame drive circuit 101 for component 2 to perform display control is arranged on the array substrate 10, that is, the array substrate drive circuit 103 and the frame drive circuit 101 are integrated, which can simplify the control circuit structure of the display modules 100 and 200; 2
  • the thickness of the frame area NA of the display panel 1 is only the thickness of the light-emitting unit, and no additional circuit board is required to control it, so that the thickness of the display modules 100 and 200 can be made thinner; since the compensation display module 2 is through the surface
  • the placement process is formed, so that the attachment deviation can be reduced. In this way, there is no requirement for a narrow frame for the frame width of the display panel 1 , so that the frame design of the display panel 1 is simpler.

Abstract

一种显示模组（100）及无缝拼接显示装置，显示模组（100）包括：显示面板（1），包括中心显示区（AA）以及与中心显示区（AA）相邻的边框区（NA），显示面板（1）上设有边框驱动电路（101）和阵列基板驱动电路（103）；补偿显示组件（2），位于边框区（NA），并与边框驱动电路（101）电连接；以及金属走线（3），位于显示面板（1）的侧面，连接于边框驱动电路（101）与阵列基板驱动电路（103）。

Description

一种显示模组及无缝拼接显示装置 技术领域
本申请涉及显示技术领域，尤其涉及一种显示模组及无缝拼接显示装置。
 背景技术
随着显示技术的发展，8K大屏时代来临。大屏幕拼接需求越来越强烈。目前市面上大屏幕拼接，主要分为两类，LED拼接和LCD拼接。虽然LED拼接可以做到无缝拼接显示，但LED分辨率较低，无法满足8K分辨率。对于LCD拼接， LCD技术发展成熟，成本低，良率高，是拼接市场的主力。但LCD显示屏存在边框，当各个LCD显示屏拼接后，相邻的LCD显示屏之间的边框在拼接处存在黑色的拼接缝隙，在画面信号输入时，边框部分无法显示，导致画面被割裂，影响显示效果。
 技术问题
对于LCD显示器，虽然可以通过压缩边框，实现窄边框显示，目前市面最小的拼接拼缝可以做到0.88mm，但拼接拼缝还是无法避免，无法满足无缝拼接的效果。因此，现有技术存在缺陷，急需解决。
 技术解决方案
本申请提供一种显示模组及无缝拼接显示装置，能够解决显示装置的无缝拼接。
一种显示模组，包括：
显示面板，包括中心显示区以及与所述中心显示区相邻的边框区，所述显示面板上设有边框驱动电路和阵列基板驱动电路；
补偿显示组件，设置于所述显示面板上，位于所述边框区，并与所述边框驱动电路电连接；以及
金属走线，位于所述显示面板的侧面，连接于所述边框驱动电路与所述阵列基板驱动电路。
在其中一些实施例中，所述边框驱动电路具有导电引线，所述导电引线延伸至所述显示面板的所述侧面，并与所述金属走线连接。
在其中一些实施例中，所述显示面板包括阵列基板和与所述阵列基板相对设置的彩膜基板，所述补偿显示组件和所述边框驱动电路设置于所述彩膜基板背离所述阵列基板的外表面，所述阵列基板驱动电路设置于所述阵列基板朝向所述彩膜基板的一侧。
在其中一些实施例中，所述补偿显示组件包括多个微发光单元和多组正负电极，所述多个微发光单元和所述多组正负电极设置于所述边框区，每个所述微发光单元与一组正负电极连接，每组所述正负电极电性连接于所述导电引线；所述显示面板包括多个像素单元，相邻的所述像素单元的中心之间的距离为P1，所述微发光单元与所述中心显示区最邻近的像素单元之间的间距为P2，P2= P1。
在其中一些实施例中，所述彩膜基板靠近所述阵列基板的表面上设有黑矩阵层，所述黑矩阵层位于所述边框区，所述补偿显示组件在所述彩膜基板上的正投影位于所述黑矩阵层在所述彩膜基板上的正投影范围内。
在其中一些实施例中，所述显示模组包括保护层，所述金属走线被划分为绑定线及非绑定线，所述保护层设置于所述金属走线的非绑定线的表面。
在其中一些实施例中，所述显示模组包括软性电路板和驱动芯片，所述软性电路板的一部分设置于所述金属走线背离所述显示面板的一侧，并与所述绑定线电连接，所述软性电路板的另一部分设置于所述显示面板背离所述补偿显示组件的一侧并与所述驱动芯片电连接绑定线。
一种无缝拼接显示装置，其中，包括至少两个显示模组，至少两个所述显示模组拼接设置，其中，所述显示模组包括：
显示面板，包括中心显示区以及与所述中心显示区相邻的边框区，所述显示面板上设有边框驱动电路和阵列基板驱动电路；
补偿显示组件，设置于所述显示面板上，位于所述边框区，并与所述边框驱动电路电连接；以及
金属走线，位于所述显示面板的侧面，连接于所述边框驱动电路与所述阵列基板驱动电路。
在其中一些实施例中，所述边框驱动电路包括用于驱动所述补偿显示组件的驱动部分以及与所述补偿显示组件相连的导电引线，所述金属走线的一端连接所述导电引线，另一端连接所述驱动部分。
在其中一些实施例中，所述显示面板包括阵列基板和与所述阵列基板相对设置的彩膜基板，所述补偿显示组件和所述导电引线设置于所述彩膜基板背离所述阵列基板的外表面，所述驱动部分及所述阵列基板驱动电路设置于所述阵列基板朝向所述彩膜基板的一侧。
在其中一些实施例中，所述补偿显示组件包括多个微发光单元和多组正负电极，所述多个微发光单元和所述多组正负电极设置于所述边框区，每个所述微发光单元与一组正负电极连接，每组所述正负电极电性连接于所述导电引线。
在其中一些实施例中，所述显示面板包括多个像素单元，相邻的所述像素单元的中心之间的距离为P1，所述微发光单元与所述中心显示区最邻近的所述像素单元之间的间距为P2，P2= P1。
在其中一些实施例中，所述彩膜基板靠近所述阵列基板的表面上设有黑矩阵层，所述黑矩阵层位于所述边框区，所述补偿显示组件在所述彩膜基板上的正投影位于所述黑矩阵层在所述彩膜基板上的正投影范围内。
在其中一些实施例中，所述金属走线为L形状，所述金属走线自所述显示面板的侧面延伸至位于所述导电引线的表面。
在其中一些实施例中，所述显示模组包括保护层，所述金属走线被划分为绑定线及非绑定线，所述保护层设置于所述金属走线的所述非绑定线的表面。
在其中一些实施例中，所述无缝拼接显示装置包括软性电路板、驱动芯片和防护层，所述软性电路板的一部分设置于所述金属走线背离所述显示面板的一侧，并与所述金属走线电连接，所述软性电路板的另一部分设置于所述显示面板背离所述补偿显示组件的一侧并与所述驱动芯片电连接，所述防护层覆盖于所述软性电路板的部分表面并夹设于相邻两个所述显示模组之间。
在其中一些实施例中，所述防护层是粘结层与保护膜的结合，每相拼接的两个显示模组包括的软性电路板表面的所述防护层包括的粘结层相互粘结。
在其中一些实施例中，所述显示面板包括多个像素单元，相邻的所述像素单元的中心之间的距离为P1，相邻两个所述显示模组上的所述补偿显示组件中心之间的距离为P3，其中，P3= P1。
 有益效果
本申请提供的显示模组及由所述显示模组形成的无缝拼接显示装置，在显示模组包括的显示面板的边框区设置补偿显示组件，且对所述补偿显示组件进行控制的边框驱动电路设置在所述显示面板的表面上，所述显示面板侧面设置有金属走线，金属走线与所述补偿显示组件及所述边框驱动电路电连接，从而，简化了补偿显示组件的控制电路结构，且能使显示模组的厚度更薄。
 附图说明
为了更清楚地说明本申请实施例中的技术方案，下面将对实施例描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本申请的一些实施例，对于本领域技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其它的附图。
图1为本申请提供的一种显示模组的剖面结构示意图；
图2是为本申请提供的一种显示模组的具体剖面结构示意图；
图3是本申请实施例提供的显示模组形成无缝拼接显示装置的拼接示意图；
图4是本申请的显示模组形成无缝拼接显示装置的俯视图；
图5是本申请又一实施例提供的显示模组形成无缝拼接显示装置的俯视图；
图6是本申请又一实施例提供的显示模组形成无缝拼接显示装置的俯视图；
图7为本申请实施例提供的无缝拼接显示装置的制造方法的流程示意图。
 本发明的实施方式
下面将结合本申请实施例中的附图，对本申请实施例中的技术方案进行清楚、完整地描述。显然，所描述的实施例仅仅是本申请一部分实施例，而不是全部的实施例。基于本申请中的实施例，本领域技术人员在没有作出创造性劳动前提下所获得的所有其他实施例，都属于本申请保护的范围。
在本申请的描述中，需要理解的是，术语“上”、“下”等指示的方位或位置关系为基于附图所示的方位或位置关系，仅是为了便于描述本申请和简化描述，而不是指示或暗示所指的装置或元件必须具有特定的方位、以特定的方位构造和操作，因此不能理解为对本申请的限制。此外，术语“第一”、“第二”仅用于描述目的，而不能理解为指示或暗示相对重要性或者隐含指明所指示的技术特征的数量。由此，限定有“第一”、“第二”的特征可以明示或者隐含地包括一个或者更多个所述特征。在本申请的描述中，“多个”的含义是两个或两个以上，除非另有明确具体的限定。
本申请可以在不同实施中重复参考数字和/或参考字母，这种重复是为了简化和清楚的目的，其本身不指示所讨论各种实施方式和/或设置之间的关系。
请参阅图1，图1为本申请提供的一种能实现无边框的显示模组100，所述显示模组100可以用于电子装置中。电子装置可以为智能手机(smartphone)、平板电脑(tablet personal computer)、移动电话(mobile phone)、视频电话机、电子书阅读器(e-book reader)、台式计算机(desktop PC)、手提电脑(laptop PC)、上网本(netbook computer)、工作站(workstation)、服务器、个人数字助理(personal digital assistant)、便携式媒体播放器(portable multimedia player)、MP3播放器、移动医疗机器、照相机、游戏机、数码相机、车载导航仪、电子广告牌、自动取款机或可穿戴设备(wearable device)中的至少一个。
能实现无边框的显示模组100包括：显示面板1、补偿显示组件2及金属走线3。
具体地，所述显示面板1具有中心显示区AA和边框区NA。所述中心显示区AA是所述显示面板1的像素单元产生画面的区域；所述边框区NA与所述中心显示区AA邻接且位于中心显示区AA的周侧。
所述补偿显示组件2设置于所述显示面板1上，位于所述边框区NA，所述显示面板1上设置有对所述补偿显示组件2进行控制的边框驱动电路101，还设置有对显示模组100包括的像素单元进行驱动的阵列基板驱动电路103。
所述金属走线3位于所述显示面板1的侧面，一端连接于边框驱动组件2，另一端连接于所述边框驱动电路101与所述阵列基板驱动电路103。
本申请提供的显示模组100，对所述补偿显示组件2进行驱动控制的边框驱动电路101设置在所述显示面板1上，所述显示面板1侧面设置有金属走线3，金属走线3与所述补偿显示组件2及所述边框驱动电路101电连接，从而，边框驱动电路101与设置在显示面板1包括的阵列基板驱动电路103通过金属走线3电连接，从而无需单独贴附补偿显示组件2的控制电路，不仅可以减小显示模组100的厚度，而且能够减小贴附偏差；并且由于将阵列基板驱动电路103和边框驱动电路101集成设置，可以简化显示模组100的控制电路结构。
下面以显示模组200为例进行具体说明。能实现无边框显示的显示模组200包括：显示面板1，补偿显示组件2、金属走线3、保护层4、软性电路板5、驱动芯片6以及防护层7。
具体地，请参阅图2，在本申请中，所述显示面板1是液晶显示面板，其包括相对设置的阵列基板10、彩膜基板12、设置于所述阵列基板10和彩膜基板12之间的液晶层14、以及围绕液晶层14设置的框胶16。
所述阵列基板10靠近彩膜基板12的一侧形成有薄膜晶体管层，薄膜晶体管层中包括薄膜晶体管以及用于实现液晶显示面板正常显示的阵列基板驱动电路103。
所述阵列基板驱动电路103用于对驱动中心显示区AA的像素单元110进行显示。所述像素单元110可以是由RGB三原色的发光件分别依次单独设置于阵列基板10的表面，也可以是由RGB三原色的发光件形成封装体后形成于阵列基板10的表面。在本实施例中，所述像素单元110是由RGB三原色的发光件形成的封装体。
在本实施例中，在形成薄膜晶体管层的时候还包括形成用于对边框区NA的补偿显示组件2进行驱动的边框驱动电路101，可以简化补偿显示组件2的驱动电路的工艺流程。所述边框驱动电路101包括形成于所述阵列基板10上的用于驱动补偿显示组件2的驱动部分102以及位于彩膜基板12的外表面122的导电引线20。所述边框驱动电路101延伸至与所述显示面板1的侧面平齐。具体地，是所述导电引线20延伸至所述彩膜基板12的侧面，所述驱动部分102是沿伸至阵列基板10的侧面。在形成薄膜晶体管层的时候，是一并形成驱动部分102。
所述液晶层14内设置有液晶，液晶层14还可包括隔垫柱（图未示）。所述阵列基板10用于提供电场作用，所述液晶在电场作用下产生不同角度的偏转，进而改变光线穿过所述液晶层14的路径，然后结合所述彩膜基板12对光线的彩色滤光作用，使所述显示面板1呈现出彩色画面；应当理解的是，液晶显示面板1是被动发光型显示面板，其需要背光模组提供背光源实现预设的发光亮度和发光颜色。
所述彩膜基板12包括面向阵列基板10的内表面120，所述内表面120设置有黑矩阵层121、形成于黑矩阵层121之间的彩色色阻层(图未示)。彩色色阻层包括阵列设置的多个色阻，多个色阻可以包括红色色阻、绿色色阻和蓝色色阻，红色色阻将穿过其的光线过滤为红色，绿色色阻将穿过其的光线过滤为绿色，蓝色色阻将穿过其的光线过滤为蓝色。
在本实施例中，所述黑矩阵层121位于所述边框区NA，所述彩膜基板12的外表面122对应黑矩阵层121的位置用于设置边框显示组件2。也即，补偿显示组件2在所述彩膜基板12的正投影位于所述黑矩阵层121在所述彩膜基板12上的正投影范围内。从而，补偿显示组件2不占用中心显示区的空间，从而能使像素单元110发出的光均能从中心显示区AA出射。
在本实施例中，所述补偿显示组件2包括多个位于边框区NA的多组正负电极123及与多组正负电极123连接的多个微发光单元22。每组所述正负电极123需电性连接于所述导电引线20。所述微发光单元22包括mini-LED或micro-LED。每个微发光单元22为3个三原色发光二极管封装后形成的封装体（PKG）或者为单色发光二极管形成的封装体。微发光单元22可通过表面贴装技术（SMT）形成，相比现有技术的在边框区NA贴附LED灯板，本申请的补偿显示组件2的厚度更薄，从而能减小显示模组200的厚度，以及减小贴附偏差。如此，也对于显示面板1的边框宽度没有窄边框的需求，从而对于显示面板1的边框设计更简单。
在本实施例中，所述显示面板1的相邻的所述像素单元110的中心之间的距离为P1，所述边框区NA内的所述微发光单元22与所述中心显示区AA最邻近的像素单元110之间的间距为P2，P2=P1。如此设置，能使中心显示区AA的画面与边框区NA的画面的颜色一致，实现显示模组200的高分辨率。
所述金属走线3位于所述显示面板1的侧面以用于导通边框驱动电路101及补偿显示组件2。所述金属走线3与所述导电引线20电连接。在本实施例中，所述金属走线3还与阵列基板驱动电路103电性连接。所述金属走线3是通过印刷导电浆、再经过固化以及图案化制程后形成。优选地，所述金属走线3为银浆固化形成的银线。
在本实施例中，所述金属走线3为L形状。具体地，所述金属走线3自所述阵列基板驱动电路103的端面、边框驱动电路101的端面向上延伸至框胶16的侧面、黑矩阵层121的侧面以及彩膜基板12的侧面直至覆盖于所述补偿显示组件2包括的导电引线20的表面，以实现与补偿显示组件2电连接。
所述金属走线3包括绑定线（图未示）以及非绑定线，绑定线是用于绑定软性电路板5，非绑定线是指金属走线3除绑定线以外的部分。
在本实施例中，保护层4覆盖于非绑定线的表面，保护层4用于使金属走线3隔绝水氧，以保护金属走线3。尤其是黑色的保护层4，黑色的保护层4一方面用于保护金属走线3，另一方面还能吸收界的光线，避免产生反射而影响观看效果。在本实施例中，仅示意了所述金属走线3弯折的一端的保护层4，可以理解的是，侧面的金属走线3未用于绑定软性电路板的部分，也均涂覆了保护层4。
在本实施例中，软性电路板5的一部分设置于所述金属走线3背离所述显示面板1的一侧，并与所述金属走线电连接，所述软性电路板5的另一部分设置于所述显示面板1背离所述补偿显示组件2的一侧并与所述驱动芯片6电连接。
驱动芯片6及控制芯片（图未示）位于所述软性电路板5的远端，驱动芯片6用于驱动显示面板1及/或补偿显示组件2进行显示，控制芯片用于控制驱动芯片6。
防护层7覆盖于所述软性电路板5的表面。防护层7用于保护软性电路板5，避免弯折时受损伤。
所述显示模组200的工作原理是：所述显示面板1侧面设置有金属走线3，利用金属走线3将阵列基板10与彩膜基板12表面设置的补偿显示组件2电性导通，且金属走线3的表面绑定有软性电路板5，通过软性电路板5上的驱动芯片能分别或者同时驱动中心显示区AA的像素单元110的显示及边框区NA的补偿显示组件2的显示，实现了显示模组200的无边框显示。
请参阅图3，本申请还提供一种无缝拼接显示装置300。无缝拼接显示装置300包括多个显示模组200，多个显示模组200相互拼接设置。
在本实施方式中，防护层7是粘结层与保护膜的结合，在拼接的时候，移除防护层包括的保护膜，使每相拼接的两个显示模组200包括的软性电路板5表面的所述防护层7包括的粘结层相互粘结。通过防护层7包括的粘结层对拼接缝隙的密封，实现了良好的水氧阻隔能力，从而避免水汽以及氧气进入显示模组200内部对显示模组200内部的正负电极123等电子元器件等的侵蚀。
在本实施例中，当显示模组200的边框区NA只设置一列或者一行补偿显示组件时，相邻的所述像素单元110的中心之间的距离为P1，相邻的两个显示模组200上的补偿显示组件2的中心之间的距离为P3，P3= P1。当显示模组200的边框区NA设置不止一列或者不止一行补偿显示组件2时，每相拼接的两个所述显示模组200的所述边框区NA的最邻近的两组所述微发光单元22的中心之间的距离为P3，P3=P1，也即边框区NA的微发光单元22之间的间距与所述显示面板1的中心显示区AA的所述像素单元110的中心之间的距离相等。也即，通过使显示模组200的像素间距与边框区NA的微发光单元22包括的LED的间隔相等，使画面过度自然，能实现真正的等间距的无缝拼接。
在本实施例中，所述边框区NA包括至少一个拼接边112，拼接边112是与另一个显示模组200相拼接的侧边，所述补偿显示组件2设置于所述拼接边112的表面。可以理解，如果要实现无边框的显示效果，还可以在边框区NA的除拼接边112的其它边也设置补偿显示组件2。
请参阅图4，当要实现Nx1拼接，每个显示模组200包括1个拼接边112，将补偿显示组件2设置于所述拼接边112，可得到Nx1的长方形的无缝显示装置。
请参阅图5，当要实现2x2拼接，每个显示模组200的拼接边112为2个，且在每个拼接边112的表面设置补偿显示组件2，可实现得到2x2的正方形的无缝显示装置。
当要实现2x3拼接时，第一行、第二列的显示模组200及第二行第二列的显示模组200分别为3个拼接边112，而外围的4个显示模组200分别是包括2个拼接边112，在每个拼接边112的位置设置补偿显示组件2，便得到2x3的无缝显示装置。
请参阅图6，当要实现3x3拼接时，9个显示模组200最中间的一个显示模组200包括4个拼接边112，将补偿显示组件2分别设置于4个拼接边112，与中心的显示模组200相邻的4个显示模组200分别包括3个拼接边112，而4个角落处的4个显示模组200分别是包括2个拼接边112，并每个拼接边112的位置设置补偿显示组件2，便可得到3x3的矩阵式无缝显示装置。
也即，可以根据需要拼接的显示装置的尺寸，来选择显示模组200所需包括的拼接边112的数量，以实现无缝拼接。
以上实施例中，边框区NA均是仅示意了一列补偿显示组件2，在其它实施方式中，边框区NA可以包括多列补偿显示组件2。边框区NA的补偿显示组件2之间的间距与显示面板1的像素单元110之间的间距相等。
请参阅图7，本发明还提供一种无缝拼接显示装置300的制造方法，其包括如下步骤：
第一步：提供阵列基板10。所述阵列基板10包括形成薄膜晶体管层，形成薄膜晶体管层包括薄膜晶体管以及用于实现液晶显示面板正常显示的阵列基板驱动电路103以及包括有对补偿显示组件2进行驱动的边框驱动电路101。本实施例中，边框驱动电路101与阵列基板驱动电路103同时形成，从而无需单独贴附补偿显示组件2的控制电路，不仅可以减小显示模组100的厚度，而且能够减小贴附偏差；并且由于将阵列基板驱动电路103和边框驱动电路101集成设置，可以简化显示模组100的控制电路结构。
第二步：提供彩膜基板12，在彩膜基板12的外表面122的边框区设置多组正负电极123以及与正负电极123连接的导电引线20。其中，此处所指的外表面122是指后续与阵列基板10固定形成显示面板1时彩膜基板12的背离所述阵列基板10的表面。
第三步：将阵列基板10、彩膜基板12通过框胶16固定形成中间结构。所述彩膜基板12与阵列基板10之间、框胶16内侧设置有液晶层14及支撑柱。
第四步：利用切割装置8对所述中间结构进行切割，以显露出所述边框驱动电路101及阵列基板驱动电路103，便于后续能使金属走线3与其电性连接。
第五步：利用研磨装置9对所述边框驱动电路101及阵列基板驱动电路103的端面进行研磨以及研磨后利用激光装置11对研磨的表面进行清洁，研磨的目的是将中间结构侧面的粗糙度控制在小于5um，以便于下一步转印金属走线3于中间结构的侧面。
第六步：在中间结构的侧表面的预设位置形成金属走线3，及在所述金属走线3弯折端的表面形成保护层4。所述金属走线3的两端分别连接边框驱动电路101、阵列基板驱动电路103与导电引线20，利用金属走线3电性导通阵列基板10与导电引线20，后续能通过软性电路板5上的驱动芯片控制中心显示区AA的显示及边框区NA的显示。在本实施方式中，所述金属走线3是通过在显示面板1的侧表面印刷导电浆、再经过固化装置13的固化以及图案化制程后形成。优选地，所述金属走线3为银浆固化及图案化后形成的银线。优选地，所述金属走线3为L形状。所述金属走线3弯折端形成在导电引线20的表面，金属走线的非绑定线的表面形成有保护层4。
第七步：通过表面贴装技术或者巨量转移工艺在所述彩膜基板12的外表面122的边框区的正负电极123上安装补偿显示组件2，使所述补偿显示组件2包括的微发光单元22与彩膜基板12外表面122的导电引线20电连接。微发光单元22包括mini-LED或micro-LED。每个微发光单元22为3个三原色发光二极管封装后形成的封装体（PKG）或者为单色发光二极管形成的封装体。
在本实施例中，将RGB三颗芯片封装为一颗PKG，在本实施方式中，所述显示面板1包括若干像素单元110，相邻的所述像素单元110的中心之间的距离为P1，所述边框区NA内的所述微发光单元22与所述中心显示区AA最邻近的像素单元110之间的间距为P2，P2= P1。
第八步：提供软性电路板5，使软性电路板5与所述显示模组200的侧面的金属走线3的绑定线进行绑定，所述软性电路板5的远端设置有驱动芯片6及控制芯片。且使软性电路板5的另一面与PCB板固定，从而使所述显示模组200的信号能实现输入及输出。
第九步：提供至少两个所述显示模组200，使其相互拼接，得到所述无缝拼接显示装置300。然后通过系统的信号同步处理，利用补偿显示组件2将由显示模组200周围黑框存在而缺失的画面通过微发光单元22显示出来，实现真正意义上的无缝显示效果。
在本实施例中，每相拼接的两个所述显示模组200的所述边框区NA的最邻近的两组所述微发光单元22的中心之间的距离为P3，P3=P1，也即边框区NA的微发光单元22之间的间距与所述显示面板1的中心显示区AA的所述像素单元110的中心之间的距离相等。也即，通过使显示模组200的像素间距与边框区NA的微发光单元22包括的LED的间隔相等，使画面过度自然，能实现真正的等间距的无缝拼接。
综上所述，本申请提供的显示模组100、200由显示模组200形成的无缝拼接显示装置300，在显示面板1的边框区NA设置补偿显示组件2，且将对所述补偿显示组件2进行显示控制的边框驱动电路101设置在所述阵列基板10上，也即将阵列基板驱动电路103和边框驱动电路101集成设置，可以简化显示模组100、200的控制电路结构；补偿显示组件2在显示面板1的边框区NA上的厚度仅为发光单元的厚度，无需额外设置电路板对其控制，从而能使显示模组100、200的厚度更薄；由于补偿显示组件2是通过表面贴装工艺形成，从而能减小贴附偏差，如此，也对于显示面板1的边框宽度没有窄边框的需求，从而对于显示面板1的边框设计更简单。
综上所述，虽然本发明已以优选实施例揭露如上，但上述优选实施例并非用以限制本发明，本领域的普通技术人员，在不脱离本发明的精神和范围内，均可作各种更动与润饰，因此本发明的保护范围以权利要求界定的范围为准。

Claims (20)

  1. 一种显示模组，其中，包括：
    显示面板，包括中心显示区以及与所述中心显示区相邻的边框区，所述显示面板上设有边框驱动电路和阵列基板驱动电路；
    补偿显示组件，设置于所述显示面板上，位于所述边框区，并与所述边框驱动电路电连接；以及
    金属走线，位于所述显示面板的侧面，连接于所述边框驱动电路与所述阵列基板驱动电路。
  2. 根据权利要求1所述的显示模组，其中，所述边框驱动电路包括用于驱动所述补偿显示组件的驱动部分以及与所述补偿显示组件相连的导电引线，所述金属走线的一端连接所述导电引线，另一端连接所驱动部分。
  3. 根据权利要求2所述的显示模组，其中，所述显示面板包括阵列基板和与所述阵列基板相对设置的彩膜基板，所述补偿显示组件和所述导电引线设置于所述彩膜基板背离所述阵列基板的外表面，所述驱动部分及所述阵列基板驱动电路设置于所述阵列基板朝向所述彩膜基板的一侧。
  4. 根据权利要求3所述的显示模组，其中，所述补偿显示组件包括多个微发光单元和多组正负电极，所述多个微发光单元和所述多组正负电极设置于所述边框区，每个所述微发光单元与一组正负电极连接，每组所述正负电极电性连接于所述导电引线。
  5. 根据权利要求4所述的显示模组，其中，所述显示面板包括多个像素单元，相邻的所述像素单元的中心之间的距离为P1，所述微发光单元与所述中心显示区最邻近的所述像素单元之间的间距为P2，P2= P1。
  6. 根据权利要求3所述的显示模组，其中，所述彩膜基板靠近所述阵列基板的表面上设有黑矩阵层，所述黑矩阵层位于所述边框区，所述补偿显示组件在所述彩膜基板上的正投影位于所述黑矩阵层在所述彩膜基板上的正投影范围内。
  7. 根据权利要求2所述的显示模组，其中，所述金属走线为L形状，所述金属走线自所述显示面板的侧面延伸至所述导电引线的表面。
  8. 根据权利要求7所述的显示模组，其中，所述显示模组包括保护层，所述金属走线被划分为绑定线及非绑定线，所述保护层设置于所述金属走线非绑定线的表面。
  9. 根据权利要求8所述的显示模组，其中，所述显示模组包括软性电路板和驱动芯片，所述软性电路板的一部分设置于所述金属走线背离所述显示面板的一侧并与所述绑定线电连接，所述软性电路板的另一部分设置于所述显示面板背离所述补偿显示组件的一侧并与所述驱动芯片电连接。
  10. 一种无缝拼接显示装置，其中，包括至少两个显示模组，至少两个所述显示模组拼接设置，其中，所述显示模组包括：
    显示面板，包括中心显示区以及与所述中心显示区相邻的边框区，所述显示面板上设有边框驱动电路和阵列基板驱动电路；
    补偿显示组件，设置于所述显示面板上，位于所述边框区，并与所述边框驱动电路电连接；以及
    金属走线，位于所述显示面板的侧面，连接于所述边框驱动电路与所述阵列基板驱动电路。
  11. 根据权利要求10所述的无缝拼接显示装置，其中，所述边框驱动电路包括用于驱动所述补偿显示组件的驱动部分以及与所述补偿显示组件相连的导电引线，所述金属走线的一端连接所述导电引线，另一端连接所述驱动部分。
  12. 根据权利要求11所述的无缝拼接显示装置，其中，所述显示面板包括阵列基板和与所述阵列基板相对设置的彩膜基板，所述补偿显示组件和所述导电引线设置于所述彩膜基板背离所述阵列基板的外表面，所述驱动部分及所述阵列基板驱动电路设置于所述阵列基板朝向所述彩膜基板的一侧。
  13. 根据权利要求12所述的无缝拼接显示装置，其中，所述补偿显示组件包括多个微发光单元和多组正负电极，所述多个微发光单元和所述多组正负电极设置于所述边框区，每个所述微发光单元与一组正负电极连接，每组所述正负电极电性连接于所述导电引线。
  14. 根据权利要求13所述的无缝拼接显示装置，其中，所述显示面板包括多个像素单元，相邻的所述像素单元的中心之间的距离为P1，所述微发光单元与所述中心显示区最邻近的所述像素单元之间的间距为P2，P2= P1。
  15. 根据权利要求13所述的无缝拼接显示装置，其中，所述彩膜基板靠近所述阵列基板的表面上设有黑矩阵层，所述黑矩阵层位于所述边框区，所述补偿显示组件在所述彩膜基板上的正投影位于所述黑矩阵层在所述彩膜基板上的正投影范围内。
  16. 根据权利要求12所述的无缝拼接显示装置，其中，所述金属走线为L形状，所述金属走线自所述显示面板的侧面延伸至位于所述导电引线的表面。
  17. 根据权利要求11所述的无缝拼接显示装置，其中，所述显示模组包括保护层，所述金属走线被划分为绑定线及非绑定线，所述保护层设置于所述金属走线的所述非绑定线的表面。
  18. 根据权利要求16所述的无缝拼接显示装置，其中，所述无缝拼接显示装置包括软性电路板、驱动芯片和防护层，所述软性电路板的一部分设置于所述金属走线背离所述显示面板的一侧，并与所述金属走线电连接，所述软性电路板的另一部分设置于所述显示面板背离所述补偿显示组件的一侧并与所述驱动芯片电连接，所述防护层覆盖于所述软性电路板的部分表面并夹设于相邻两个所述显示模组之间。
  19. 根据权利要求18所述的无缝拼接显示装置，其中，所述防护层是粘结层与保护膜的结合，每相拼接的两个显示模组包括的软性电路板表面的所述防护层包括的粘结层相互粘结。
  20. 根据权利要求10所述的无缝拼接显示装置，其中，所述显示面板包括多个像素单元，相邻的所述像素单元的中心之间的距离为P1，相邻两个所述显示模组上的所述补偿显示组件中心之间的距离为P3，其中，P3= P1。
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