WO2019210660A1 - 显示面板和显示装置 - Google Patents

显示面板和显示装置 Download PDF

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Publication number
WO2019210660A1
WO2019210660A1 PCT/CN2018/112460 CN2018112460W WO2019210660A1 WO 2019210660 A1 WO2019210660 A1 WO 2019210660A1 CN 2018112460 W CN2018112460 W CN 2018112460W WO 2019210660 A1 WO2019210660 A1 WO 2019210660A1
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area
display
display area
display panel
bonding
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PCT/CN2018/112460
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English (en)
French (fr)
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朱勇
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昆山国显光电有限公司
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Priority to US16/424,501 priority Critical patent/US20190279547A1/en
Publication of WO2019210660A1 publication Critical patent/WO2019210660A1/zh

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    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements

Definitions

  • the present disclosure relates to the field of display, and more particularly to display panels and display devices.
  • the display panel includes a display area and a non-display area disposed around the display area.
  • the non-display area is provided with a wiring area and a driving chip bonding area.
  • the design method of the existing driving chip bonding area and the like may cause the occupied area of the non-display area to be too large, and it is difficult to realize the narrow border display.
  • a display panel including a substrate and a flip chip
  • the substrate includes a display area for displaying information and a non-display area for setting a circuit disposed around the display area, the display area including an array of pixel units and a signal line connecting the pixel units ;
  • the pixel unit arranged in the array includes a row pixel unit arranged in a first direction and a column pixel unit arranged in a second direction, the first direction being perpendicular to the second direction;
  • the display area includes a first display area and a second display area, and the number of the pixel units in the first display area is smaller than the number of the pixel units in the second display area;
  • the non-display area includes a bonding area extending along the second direction to the first display area such that the number of pixel units per row in the first display area is smaller than the second The number of pixel units per row in the display area;
  • the flip chip is bonded to the bonding zone.
  • a lead line is disposed in the bonding area, and the lead line is connected to the signal line.
  • the lead wires are transparent traces.
  • the lead wires are electrically connected to the flip chip.
  • the flip chip is electrically connected to the lead wires by covering the lead wires.
  • a flexible circuit board is further included, and the flexible circuit board is provided with a driving element, and the flexible circuit board is electrically connected to the flip chip.
  • the flip chip is bent to a surface of the display panel facing away from the display area.
  • the signal line includes a data line or a scan line.
  • the bonding area when the signal line is a data line, the bonding area is located at an upper border or a lower border of the display panel; when the signal line is a scan line, the bonding area is located The first side frame or the second side frame of the display panel.
  • a display device comprising the display panel of the aforementioned aspect.
  • the foregoing display device further comprising a receiving area for accommodating a functional element, the receiving area comprising a top surface of the surface of the display panel facing away from the display area, the bonding area A projection in the display device overlaps a top surface of the receiving area.
  • the functional element includes at least one of a camera, a fingerprint recognition element, an iris recognition element, and an earpiece.
  • the display panel and the non-display area of the display device include a bonding area extending in a column direction arranged in the pixel unit to the display area.
  • the traces in the display area are conventionally disposed on the frame of the display panel, and are collectively disposed in a bonding area extending to the first display area, and are connected to the flip chip from the bonding area.
  • the display device provided by the present disclosure includes a receiving area for accommodating a functional component, the top surface of the receiving area overlapping with the orthographic projection of the bonding area on the display device, that is, the bonding area can accommodate the function in the space projected by the display device element.
  • the present disclosure utilizes the bonding area of the functional area accommodating area to bond the flip-chip film without occupying the space of the non-display area, thereby further increasing the area of the area usable for the display area and reducing the width of the frame.
  • FIG. 1 is a schematic view of a display panel in accordance with an embodiment of the present disclosure
  • FIG. 2 is a schematic view of a display panel in accordance with another embodiment of the present disclosure.
  • an embodiment of the present disclosure provides a display panel 100 including a substrate 110 and a flip chip 120 .
  • the substrate 110 includes a display area 130 and a non-display area 140.
  • the display area 130 includes a pixel unit 101 arranged in an array and a signal line 102 connecting the pixel units.
  • the pixel unit 101 arranged in the array includes a row pixel unit 101 arranged in the first direction D1 and a column pixel unit 101 arranged in a second direction D2 perpendicular to the first direction D1.
  • the display area 130 includes a first display area 131 and a second display area 132.
  • the number of pixel units 101 in the first display area 131 is smaller than the number of pixel units 101 in the second display area 132. It can be understood that the row, the column, the first direction, and the second direction are relative concepts. In other embodiments, the concepts of rows and columns can also be interchanged according to the direction of the display panel.
  • the non-display area 140 includes a bonding area 103, and the bonding area 103 extends along the second direction D2 to the first display area 131 such that the number of pixel units 101 in each row in the first display area 131 is smaller than that in the second display area 132. The number of row pixel units 101.
  • the flip chip 120 is bonded to the bonding zone 103.
  • the display area 130 is for displaying information
  • the non-display area 140 is for setting a driving circuit.
  • a bonding area 103 is disposed in the non-display area 140, and the bonding area 103 is an area reserved on the substrate 110.
  • the display area 130 and the non-display area 140 are different areas distributed on the substrate 110 according to functions, and the bonding area 103 is an area in the non-display area 130 for bonding circuits or components.
  • a pixel circuit and an OLED (Organic Light-Emitting Diode) device are not prepared on the bonding region 103, and thus are not displayed in the application.
  • the flip chip 120 is a flexible film provided with a driving chip. The flip chip 120 can be bonded to the bonding zone 103.
  • the non-display area 140 of the display panel 100 includes a bonding area 103 that extends in the column direction of the pixel arrangement into the first display area 131.
  • the display panel 100 generally includes a non-display area disposed around the display area, that is, a bezel, and the bonding area is one of the bezels. Since the bezel needs to bond the flip chip 120, the width of the bezel is too wide.
  • the bonding area 103 by extending the bonding area 103 into the first display area 131, the length of the bonding area 103 in the first direction is smaller than the length of the frame, and the width in the second direction is larger than the non-display area 140 except the bonding area.
  • the width of the other borders As such, the setting of the bonding area 103 can reduce the width of the other borders of the non-display area 140 except the bonding area, and increase the display area.
  • the substrate 110 has a first end and a second end opposite to the front surface of the display area 130.
  • the first end and the second end are located in the non-display area 140 with the display area 130 interposed therebetween.
  • the bonding zone 103 can be disposed at one end of the substrate 110. It will be appreciated that the first end and the second end are relative concepts, and in other embodiments, the first end and the second end are also interchangeable.
  • one end having the bonding area 103 is referred to as a first end
  • the end opposite to the end having the bonding area 103 is referred to as a second end.
  • a plurality of lead lines 104 are distributed in the bonding area 103, and a plurality of lead lines 104 are connected to each of the signal lines 102.
  • the lead wires 104 may be transparent traces. Since the area of the bonding area 103 in the direction in which the display device is projected can be used to set the function component, when the function component is the camera, the lead wire 104 is set as a transparent wire, which can meet the light transmission requirement of the camera and does not affect the camera. Shooting.
  • the lead wires 104 are distributed in the bonding region 103 and are electrically connected to the flip chip 120.
  • the flip chip 120 is connected to the lead line 104 in the bonding region 103, thereby connecting the signal line 102, and providing a display signal to the pixel unit 101 on the signal line 102.
  • the flip chip 120 can be connected to the lead line 104 by covering the lead wires 104. Covering contact area is large, and the wire performance is stable and the reliability is high. Of course, this embodiment is not limited to the connection mode of the cover, as long as the flip chip 120 is electrically connected to the lead line 104.
  • the lead wires 104 can be disposed, and the flip chip 120 can be bonded to connect the lead wires 104 to the flip chip 120.
  • the above arrangement saves the occupation of the position of other frames of the display panel 100, and realizes a narrow bezel display.
  • the display panel 100 further includes a flexible circuit board (not shown) electrically connected to the flip chip 120.
  • Peripheral driving components such as resistors and capacitors are disposed on the flexible circuit board.
  • the driver chip on the flip chip 120 is mated with the peripheral driving elements to generate a driving signal, and is supplied to the pixel unit 101 through the lead line 104. After the flip chip 120 is bonded to the bonding zone 103, it can be bent to the surface of the display panel 100 facing away from the display area 130, that is, the back surface of the display panel 100.
  • the signal line 102 may be a data line or a scan line.
  • the shape of the display panel 100 may be a rectangle having an unequal length and width.
  • the display panel may include an upper frame and a lower frame extending in the first direction, and a first side frame and a second side frame extending in the second direction.
  • the bonding area 103 may be located at the upper border or the lower border of the display panel 100.
  • the bonding area 103 may be located at the first side frame or the second side frame of the display panel 100.
  • the bonding zone 103 includes a bottom edge and side edges on both sides of the bottom plate, that is, the bonding zone 103 may be rectangular and rounded at a right angle of the rectangle.
  • the size and shape of the bonding area are not limited, and can be adjusted according to the actual production requirements.
  • the display panel 100 is generally rectangular in length and width, and can be rounded at the top corner. At a short edge end of the display panel 100, a bonding area 103 is provided, and the bonding area 103 may be located in the middle of the end of the display panel 100 or may be biased to one side.
  • the shape of the display panel 100 and the setting position of the bonding zone 103 can be designed according to the specifically assembled product, and are not limited by the embodiment.
  • the shape of the bonding zone 103 is also not limited, and is generally rectangular, rounded at a right angle, or may be other shapes such as a semicircle or the like.
  • the size of the bonding zone 103 is appropriately sized according to the actual production requirements of the product.
  • Yet another embodiment of the present disclosure also provides a display device including a package housing (not shown), and the foregoing display panel 100 is packaged in a package housing.
  • the display device also includes a receiving area for receiving functional elements.
  • the accommodating area is an area where the bonding area 103 is in the direction in which the display device is projected.
  • the functional component may be at least one of a camera, a fingerprint recognition component, an iris recognition component, and an earpiece.
  • the functional component includes the camera, since the substrate 110 and the lead-out line 104 are both transparent materials, and the bonding region 103 and the substrate 110 are made of the same material, the bonding region 103 and the lead-out line 104 do not affect the light transmission of the camera.
  • the display panel 100 and the display device provided by the embodiments of the present disclosure have a bonding area 103 reserved on the substrate, and no pixel unit and pixel circuit are disposed on the bonding area 103, which is not shown here. And the bonding area 103 extends in the second direction to the first display area, which can reduce the space of the occupied non-display area and reduce the width of the frame.
  • the lead wires 104 of the screen signal lines can be collectively disposed in the bonding region 103, and the flip chip 120 is bonded on the bonding region 103 such that the lead wires 104 are connected to the flip chip 120 in the bonding region 103.
  • the display device further includes a receiving area for accommodating the functional element, the receiving area being an area of the bonding area 103 in the direction in which the display device is projected.
  • the functional element can be located below the bonding zone 103.
  • the peripheral functional elements of the display panel are collectively disposed in the bonding area 103, and at the same time, the bonding lines are concentrated by the bonding area 103, so that the frame width of the display panel 100 can be reduced, and the narrow bezel display can be realized.

Abstract

本公开涉及一种显示面板，包括衬底和覆晶薄膜；所述衬底包括显示区和非显示区，所述显示区包括阵列排布的像素单元，所述像素单元包括沿第一方向延伸的行像素单元和沿第二方向延伸的列像素单元，所述第一方向与第二方向垂直。显示区包括第一显示区和第二显示区，非显示区包括邦定区，邦定区沿第二方向延伸至第一显示区，使得第一显示区内每行像素单元的数量小于第二显示区内每行像素单元的数量，所述覆晶薄膜邦定于所述邦定区。上述显示面板的邦定区沿第二方向延伸至第一显示区，可以减小邦定区占用的非显示区的空间，增大显示区的面积，实现窄边框显示。

Description

显示面板和显示装置 技术领域
本公开涉及显示领域，特别是涉及显示面板及显示装置。
背景技术
随着显示技术的不断发展，人们对显示屏的显示要求也越来越高，窄边框显示装置越来越受到人们的喜爱。通常，显示面板包括显示区和围绕显示区设置的非显示区。其中，非显示区中设有走线区和驱动芯片邦定区等。然而，现有驱动芯片邦定区等的设计方式，会导致非显示区占用面积过大，难以实现窄边框显示。
发明内容
基于此，有必要针对现有的驱动芯片邦定区设计方式导致非显示区占用面积过大的问题，提供一种显示面板和包括其的显示装置。
根据本公开的一个方面，提供了一种显示面板，包括衬底和覆晶薄膜；
所述衬底包括用于显示信息的显示区和设置于所述显示区周边的用于设置电路的非显示区，所述显示区包括阵列排布的像素单元和连接所述像素单元的信号线；
所述阵列排布的像素单元包括沿第一方向排列的行像素单元和沿第二方向排列的列像素单元，所述第一方向与所述第二方向垂直；
所述显示区包括第一显示区和第二显示区，所述第一显示区内的所述像素单元的数量小于所述第二显示区内的所述像素单元的数量；
所述非显示区包括邦定区，所述邦定区沿所述第二方向延伸至所述第一显示区，以使所述第一显示区内每行像素单元的数量小于所述第二显示区内每行像素单元的数量；
所述覆晶薄膜邦定于所述邦定区。
在其中一个实施例中，在前述显示面板中，所述邦定区内设有引出线，所述引出线对应连接所述信号线。
在其中一个实施例中，在前述显示面板中，所述引出线为透明走线。
在其中一个实施例中，在前述显示面板中，所述引出线电连接至所述覆晶薄膜。
在其中一个实施例中，在前述显示面板中，所述覆晶薄膜通过覆盖所述引出线的方式电连接所述引出线。
在其中一个实施例中，在前述显示面板中，还包括柔性电路板，所述柔性电路板上设置有驱动元件，所述柔性电路板与所述覆晶薄膜电连接。
在其中一个实施例中，在前述显示面板中，所述覆晶薄膜弯折至所述显示面板背离所述显示区的表面。
在其中一个实施例中，在前述显示面板中，所述信号线包括数据线或扫描线。
在其中一个实施例中，当所述信号线是数据线时，所述邦定区位于所述显示面板的上边框处或下边框处；当信号线是扫描线时，所述邦定区位于所述显示面板的第一侧边框处或第二侧边框处。
根据本公开的另一方面，提供了一种显示装置，包括前述方面的显示面板。
在其中一个实施例中，在前述显示装置中，还包括容纳区，用于容纳功能元件，所述容纳区包括位于所述显示面板背离所述显示区的表面的顶面，所述邦定区在所述显示装置中的投影与所述容纳区的顶面重叠。
在其中一个实施例中，在前述显示装置中，所述功能元件包括摄像头、指纹识别元件、虹膜识别元件、听筒中的至少一种。
上述显示面板及显示装置的非显示区包括邦定区，邦定区为沿像素单元排列的列方向延伸至显示区内。显示区内的走线由传统的分散设置于显示面板的边框，变为集中设置于延伸至第一显示区内的邦定区，并从邦定区连接至覆晶薄膜。从而可以减小邦定区占用的非显示区的空间，增大可用于显示区的区域的面积，减小边框宽度。且本公开提供的显示装置包括用于容纳功能元件的容纳区，容纳区的顶面与邦定区在显示装置上的正投影重叠，即，邦定区在显示装置正投影的空间可容纳功能元件。本公开利用功能元件容纳区的上方的邦定区邦定覆晶薄膜，不额外占用非显示区的空间，从而可以进一步增大可用于显示区的区域的面积，减小边框宽度。
附图说明
图1为根据本公开的一个实施例的显示面板的示意图；
图2为根据本公开的另一个实施例的显示面板的示意图。
具体实施方式
为使本公开的上述目的、特征和优点能够更加明显易懂，下面结合附图对本公开的具体实施方式做详细的说明。在下面的描述中阐述了很多具体细节以便于充分理解本公开。但是本公开能够以很多不同于在此描述的其它方式来实施，本领域技术人员可以在不违背本公开 内涵的情况下做类似改进，因此本公开不受下面公开的具体实施例的限制。
需要说明的是，当元件被称为“设置于”另一个元件，它可以直接在另一个元件上或者也可以存在居中的元件。当一个元件被认为是“连接”另一个元件，它可以是直接连接到另一个元件或者可能同时存在居中元件。本文所使用的术语“垂直的”、“水平的”、“左”、“右”以及类似的表述只是为了说明的目的，并不表示是唯一的实施方式。
除非另有定义，本文所使用的所有的技术和科学术语与属于本公开的技术领域的技术人员通常理解的含义相同。本文中所使用的术语只是为了描述具体的实施例的目的，不是在于限制本公开。
请参阅图1，本公开的一个实施例提供一种显示面板100，包括衬底110和覆晶薄膜120。衬底110包括显示区130和非显示区140。显示区130包括阵列排布的像素单元101和连接像素单元的信号线102。阵列排布的像素单元101包括沿第一方向D1排列的行像素单元101和沿与第一方向D1垂直的第二方向D2排列的列像素单元101。显示区130包括第一显示区131和第二显示区132。第一显示区131内的像素单元101的数量小于第二显示区132内的像素单元101的数量。可以理解的是，行、列、第一方向、第二方向都是相对的概念，在其他实施例中，行、列的概念也可根据显示面板的方向互换。
非显示区140包括邦定区103，且邦定区103沿第二方向D2延伸至第一显示区131，使得第一显示区131内每行像素单元101的数量小于第二显示区132内每行像素单元101的数量。同时，覆晶薄膜120邦定于邦定区103。
具体地，显示区130用于显示信息，非显示区140用于设置驱动电路。非显示区140内设置有邦定区103，邦定区103为衬底110上预留的区域。显示区130及非显示区140均为根据功能不同在衬底110上分布的不同区域，而邦定区103为非显示区130中用于邦定电路或元件的区域。在进行像素电路制备时，邦定区103上不制备像素电路和OLED(OrganicLight-Emitting Diode，有机发光二极管)器件，因此在应用中也不进行显示。覆晶薄膜120为设置有驱动芯片的柔性薄膜。覆晶薄膜120可邦定于邦定区103。
上述显示面板100的非显示区140包括邦定区103，邦定区沿像素排列的列方向延伸至第一显示区131内。显示面板100通常包括围绕显示区设置的非显示区，即边框，邦定区为其中一个边框。由于边框需要邦定覆晶薄膜120，导致边框宽度过宽。本实施例通过将邦定区103延伸至第一显示区131内，邦定区103在第一方向上的长度小于边框长度，而第二方向上的宽度大于非显示区140除邦定区以外的其他边框的宽度。如此，邦定区103的设置可以减小非显示区140除邦定区以外的其他边框宽度，增大显示面积。
请参阅图2，作为其中一个实施例，衬底110具有与显示区130的正面相对的第一端和 第二端。第一端与第二端位于非显示区140，且中间间隔有显示区130。其中，邦定区103可设置于衬底110的其中一端。可以理解的是，第一端和第二端是相对的概念，在其他实施例中，第一端和第二端也可以互换。在本实施例中，把具有邦定区103的一端称作第一端，与具有邦定区103的一端相对的一端为第二端。多条引出线104分布于邦定区103中，且多条引出线104对应连接每条信号线102。
优选地，引出线104可以是透明走线。由于邦定区103在显示装置正投影方向的区域可以用于设置功能元件，当所述功能元件为摄像头时，引出线104设置为透明走线，可满足摄像头的透光需求，不影响摄像头的拍摄。
引出线104分布于邦定区103中，且与覆晶薄膜120电连接。覆晶薄膜120与邦定区103中的引出线104连接，进而连接信号线102，并为信号线102上的像素单元101提供显示信号。覆晶薄膜120可通过覆盖引出线104的方式连接引出线104。覆盖接触面积大，且导线性能稳定，可靠性高。当然，本实施例并不仅限于覆盖的连接方式，只要覆晶薄膜120与引出线104电连接即可。
本实施例通过将邦定区103一区多用，既可设置引出线104，又可邦定覆晶薄膜120，将引出线104与覆晶薄膜120相连。上述设置方式节省了显示面板100其他边框的位置的占用，实现窄边框显示。
作为其中一个实施例，显示面板100还包括柔性电路板(未图示)，该柔性电路板电连接于覆晶薄膜120。柔性电路板上设置有电阻、电容等外围驱动元件。覆晶薄膜120上的驱动芯片与外围驱动元件配合，产生驱动信号，并通过引出线104提供至像素单元101。覆晶薄膜120邦定于邦定区103后，可弯折至显示面板100背离显示区130的表面，即显示面板100的背面。
作为其中一个实施例，信号线102可以是数据线也可以是扫描线。在本实施例中，显示面板100的形状可以为长宽不等的矩形。显示面板可以包括沿第一方向延伸的上边框和下边框，和沿第二方向延伸的第一侧边框和第二侧边框。当信号线102是数据线时，邦定区103可以位于显示面板100上边框处或下边框处。当信号线102是扫描线时，邦定区103可以位于显示面板100的第一侧边框处或第二侧边框处。
在本实施例中，邦定区103包括一底边以及位于底板两侧的侧边，即邦定区103可以为矩形，在矩形的直角出做倒圆角处理。当然，邦定区的尺寸、形状不限，可根据实际生产的产品需求做调整。
显示面板100一般为长宽不等矩形，在顶角处可做倒圆角处理。在显示面板100的一短边端部，设置有邦定区103，邦定区103的位置可以在显示面板100端部上的正中间，也可 以偏于一侧。当然，显示面板100的形状及邦定区103的设置位置可以根据具体组装的产品进行设计，不受本实施例的限制。邦定区103的形状也不受限制，一般为矩形，在直角处做倒圆角处理，也可以是其它形状，例如半圆形等。邦定区103的大小根据实际生产的产品需求做出合适的尺寸。
本公开的又一实施例还提供一种显示装置，包括封装外壳(未图示)，前述显示面板100封装于封装外壳内。
显示装置还包括容纳区，用于容纳功能元件。容纳区为邦定区103在显示装置正投影方向的区域。其中，功能元件可以是摄像头、指纹识别元件、虹膜识别元件、听筒中的至少一种。当功能元件包括摄像头时，由于衬底110和引出线104均为透明材质，且邦定区103与衬底110材质相同，故邦定区103和引出线104不会影响摄像头的透光。
本公开的实施例提供的显示面板100及显示装置在衬底上预留有邦定区103，在邦定区103上不设置像素单元及像素电路，此处不显示。且邦定区103沿第二方向延伸至第一显示区内，可以减小占用的非显示区的空间，减小边框的宽度。屏体信号线的引出线104可集中设置于邦定区103，并在邦定区103上邦定覆晶薄膜120，使得引出线104在邦定区103与覆晶薄膜120相连。同时，显示装置还包括用于容纳功能元件的容纳区，容纳区为邦定区103在显示装置正投影方向上的区域。功能元件可位于邦定区103的下方。将显示面板的外围功能元件统一集中设置于邦定区103，且同时利用邦定区103集中走线，可减小显示面板100的边框宽度，实现窄边框显示。
以上所述实施例的各技术特征可以进行任意的组合，为使描述简洁，未对上述实施例中的各个技术特征所有可能的组合都进行描述，然而，只要这些技术特征的组合不存在矛盾，都应当认为是本说明书记载的范围。
以上所述实施例仅表达了本公开的几种实施方式，其描述较为具体和详细，但并不能因此而理解为对公开的范围的限制。应当指出的是，对于本领域的普通技术人员来说，在不脱离本公开构思的前提下，还可以做出若干变形和改进，这些都属于本公开的保护范围。因此，本公开的保护范围应以所附权利要求为准。

Claims (12)

  1. 一种显示面板，包括衬底和覆晶薄膜；
    所述衬底包括用于显示信息的显示区和用于设置电路的非显示区，所述显示区包括阵列排布的像素单元和连接所述像素单元的信号线；
    所述阵列排布的像素单元包括沿第一方向排列的行像素单元和沿与第一方向垂直的第二方向排列的列像素单元；
    所述显示区包括第一显示区和第二显示区，所述第一显示区内的所述像素单元的数量小于所述第二显示区内的所述像素单元的数量；
    所述非显示区包括邦定区，所述邦定区沿所述第二方向延伸至所述第一显示区，以使所述第一显示区内每行像素单元的数量小于所述第二显示区内每行像素单元的数量；
    所述覆晶薄膜邦定于所述邦定区。
  2. 根据权利要求1所述的显示面板，其中，所述邦定区内设有引出线，所述引出线对应连接所述信号线。
  3. 根据权利要求2所述的显示面板，其中，所述引出线为透明走线。
  4. 根据权利要求2所述的显示面板，其中，所述邦定区上邦定覆晶薄膜，引出线在邦定区电连接所述覆晶薄膜。
  5. 根据权利要求4所述的显示面板，其中，所述覆晶薄膜通过覆盖所述引出线的方式电连接所述引出线。
  6. 根据权利要求1所述的显示面板，其中，还包括柔性电路板，所述柔性电路板上设置有外围驱动元件，所述柔性电路板与所述覆晶薄膜电连接，。
  7. 根据权利要求1所述的显示面板，其中，所述覆晶薄膜弯折至所述显示面板背离所述显示区的表面。
  8. 根据权利要求1所述的显示面板，其中，所述信号线包括数据线或扫描线。
  9. 根据权利要求1所述的显示面板，其中，当所述信号线是数据线时，所述邦定区位于所述显示面板的上边框处或下边框处；当信号线是扫描线时，所述邦定区位于所述显示面板的第一侧边框处或第二侧边框处。
  10. 一种显示装置，包括权利要求1所述的显示面板。
  11. 根据权利要求10所述的显示装置，其中，所述显示装置还包括容纳区，用于容纳功能元件，所述容纳区包括位于所述显示面板背离所述显示区的表面的顶面，所述邦定区在所述显示装置中的投影与所述容纳区的顶面重叠。
  12. 根据权利要求11所述的显示装置，其中，所述功能元件包括摄像头、指纹识别元件、 虹膜识别元件、听筒中的至少一种。
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CN112017533A (zh) * 2019-05-28 2020-12-01 陕西坤同半导体科技有限公司 显示面板、显示装置、及显示面板与电路板的邦定方法
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