WO2018176631A1 - 柔性显示面板及其制造方法 - Google Patents

柔性显示面板及其制造方法 Download PDF

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Publication number
WO2018176631A1
WO2018176631A1 PCT/CN2017/088022 CN2017088022W WO2018176631A1 WO 2018176631 A1 WO2018176631 A1 WO 2018176631A1 CN 2017088022 W CN2017088022 W CN 2017088022W WO 2018176631 A1 WO2018176631 A1 WO 2018176631A1
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Prior art keywords
chip
boss
display panel
flexible
bonded
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PCT/CN2017/088022
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English (en)
French (fr)
Inventor
余赟
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武汉华星光电技术有限公司
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Priority to US15/540,549 priority Critical patent/US20180277572A1/en
Publication of WO2018176631A1 publication Critical patent/WO2018176631A1/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container

Definitions

  • the present invention relates to the field of display technologies, and in particular, to a flexible display panel and a method of fabricating the same.
  • the flexible substrate of the flexible display substrate is generally an organic high temperature resistant material such as polyimide (PI, Polyimide).
  • COG chip on glass
  • the other is that the chip is connected to the flexible display panel through a flexible circuit board (FPC), referred to as COF (Chip on Film) way.
  • FPC flexible circuit board
  • COG Compared to COF binding, COG has obvious advantages, including:
  • the chip's lead pitch can be made small to meet the current high-resolution pad.
  • the size of the traces in the area is getting smaller and smaller, and the size of the leads on the flexible circuit board is still not small;
  • the flexible display substrate device performs the COG-based binding chip, since the substrate is flexible, it is easy to cause line breakage and poor bonding when performing hard (IC)-soft (flexible panel) crimp bonding. .
  • the embodiment of the invention provides a flexible display panel and a manufacturing method thereof, which solves the problem that the flexible display substrate device in the prior art is prone to line breakage and poor binding when the COG mode is bound to the chip.
  • a technical solution adopted by the embodiment of the present invention is to provide a flexible display panel, wherein the flexible display panel includes a display area, a non-display area located at a periphery of the display area, and the non-display area The chip bonding area on the display area;
  • the chip bonding region includes a support substrate, an adhesive layer, a flexible substrate, an inorganic insulating layer, an anisotropic conductive film, and a chip which are sequentially stacked from bottom to top, and the upper surface of the inorganic insulating layer is provided with a bonded soldering disk
  • the chip corresponds to a position of the bonded bonding pad
  • the support substrate includes a body plate and a boss protruding from a surface of the body plate, the position of the boss corresponding to the position of the bonded bonding pad and the chip;
  • the support substrate is such that the adhesive layer forms a thick adhesive layer in a region between the flexible substrate and the main body plate without a boss, and the flexible substrate and the main body plate are provided with a boss
  • the intermediate region forms a thin bonding layer
  • the boss is used to provide support when the chip is bound to the bonded soldering disc, and the thin bonding layer is used to reduce the buffering distance when binding to improve the binding reliability;
  • the support substrate is made of polyethylene terephthalate
  • the flexible substrate is made of polyimide
  • another technical solution adopted by the embodiment of the present invention is to provide a flexible display panel including a display area, a non-display area located at the periphery of the display area, and a chip binding on the non-display area. region;
  • the chip bonding region includes a supporting substrate, an adhesive layer, a flexible substrate, an inorganic insulating layer, an anisotropic conductive film, and a chip which are sequentially stacked from bottom to top, and the upper surface of the inorganic insulating layer is provided with a bonded soldering plate, and the chip is tied The position of the fixed welding disc corresponds;
  • the support substrate comprises a main body plate and a boss protruding from the surface of the main body, and the position of the boss corresponds to the position of the bonding pad and the chip;
  • the adhesive layer forms a thick adhesive layer in a region between the flexible substrate and the main body plate without the boss; and forming a thin adhesive layer in a region between the flexible substrate and the main body plate provided with the boss;
  • the boss is used to provide support when the chip is bound to the bonded soldering disc, and the thin bonding layer is used to reduce the buffering distance when binding to improve the bonding reliability.
  • another technical solution adopted by the embodiment of the present invention is to provide a method for manufacturing a flexible display panel, which includes:
  • the chip is placed on the anisotropic conductive film and pressed and bonded to the position where the bonding pad and the boss are bonded.
  • the flexible display panel and the manufacturing method thereof provided by the embodiments of the present invention can improve the structure of the supporting substrate, so that the supporting substrate can play a good supporting role when binding.
  • the thin bonding layer is used to reduce the buffering distance when binding to improve the bonding reliability.
  • FIG. 1 is a schematic top plan view of a flexible display panel according to an embodiment of the present invention.
  • Figure 2 is a partially enlarged cross-sectional structural view showing a-a of the flexible display panel shown in Figure 1;
  • FIG. 3 is a flow chart showing a method of manufacturing a flexible display panel provided by the present invention.
  • FIG. 1 is a schematic top plan view of a flexible display panel according to an embodiment of the present invention.
  • an embodiment of the present invention provides a flexible display panel 10 including a display area 11 , a non-display area 12 located at the periphery of the display area 11 , and a chip bonding area located on the non-display area 12 . 13.
  • the structure of the display area 11 can be referred to the prior art, and the details of the invention are not described in this patent.
  • FIG. 2 is a partially enlarged cross-sectional structural view of the flexible display panel of FIG. 1 at a-a.
  • the chip bonding region 13 includes a support substrate 110, an adhesive layer 120, a flexible substrate 130, an inorganic insulating layer 140, and an anisotropic conductive film 150 which are laminated in this order from bottom to top (Anisotropic Conductive Film (ACF) and chip 160.
  • ACF Adisotropic Conductive Film
  • the upper surface of the inorganic insulating layer 140 is provided with a plurality of bonded soldering pads 145 (boding
  • the lower surface of the chip 160 is provided with a plurality of gold fingers 165, and the positions of the plurality of gold fingers 165 are in one-to-one correspondence with the positions of the plurality of bonded bonding pads 145.
  • the anisotropic conductive film 150 includes a resin 151 and a plurality of conductive particles 152 distributed in the resin 151.
  • the support substrate 110 includes a main body plate 111 and a boss 112 protruding from the upper surface of the main body plate 111.
  • the boss 112 has a rectangular shape, the position of the boss 112 and the position of the bonding pad 145 and the chip 160. Corresponding.
  • the support substrate 110 is such that the adhesive layer 120 forms a thick adhesive layer 121 in a region between the flexible substrate 130 and the main body plate 111 where the boss 112 is not provided, and the region between the flexible substrate 130 and the main body plate 111 is provided with the boss 112.
  • a thin bonding layer 122 is formed.
  • the boss 112 can provide good support when the gold fingers 165 of the chip 160 are bonded to the bonding pads 145 on the inorganic insulating layer 140, while the thin bonding layer 122 can be reduced.
  • the buffer distance at the time of binding increases the reliability of the binding.
  • the support substrate 110 is of a flat design, and the thickness of the adhesive layer 120 is the same in the bonded region and the unbonded region, and the anisotropic conductive film 150 is caused by the large deformation under pressure during bonding.
  • the conductive particles 152 are insufficiently stressed, which in turn causes the gold fingers 165 of the chip 160 to fail to make good electrical contact with the bonded pads 145.
  • the support substrate 110 may be made of polyethylene terephthalate (PET), which has a hardness greater than that of the flexible substrate, and may have a thickness of 25 micrometers to 50 micrometers. In a specific embodiment, the substrate 110 is supported. The thickness can be 25 microns, 30 microns, 35 microns, 40 microns, 45 microns or 50 microns, and the like.
  • the flexible substrate 130 is made of polyimide (PI) having a hardness smaller than that of the support substrate 110 and having a thickness of about 20 ⁇ m.
  • the inorganic insulating layer 140 includes a buffer layer 141 (BF), a gate insulating layer 142 (GI), and an interlayer insulating layer 143 (ILD) which are stacked from bottom to top, and the bonding pad 145 is provided. On the upper surface of the interlayer insulating layer 143.
  • FIG. 3 is a schematic flow chart of a method for manufacturing a flexible display panel provided by the present invention.
  • the present invention provides a method of manufacturing a flexible display panel, the method comprising the following steps:
  • a flexible substrate 130 is prepared on a carrier substrate and a device layer of the display region and a device layer of the non-display region are formed on the flexible substrate 130.
  • the preparation of the flexible substrate 130 can be carried out by a coating method having a thickness of about 20 ⁇ m.
  • the process of forming the device layer of the display region and the device layer of the non-display region can refer to the prior art, and since it does not involve the point of the invention, it is not described in detail in this patent.
  • the device layer of the non-display area specifically refers to the inorganic insulating layer 140, and a plurality of bonded bonding pads 145 are formed on the uppermost interlayer insulating layer 143 of the inorganic insulating layer 140.
  • an anisotropic conductive film 150 is attached to the bonded bonding pad 145.
  • the anisotropic conductive film 150 is used for compact bonding of the chip 160 in a subsequent process.
  • the support substrate 110 provided with the boss 112 is bonded to the flexible substrate 130 by the adhesive layer 120.
  • the bonding layer 120 is a transparent optical adhesive, and the position of the boss 112 corresponds to the position of the bonding pad 145.
  • the boss 112 can provide good support when the gold fingers 165 of the chip 160 are bonded to the bonded bonding pads 145 on the inorganic insulating layer 140, while the thickness of the thin bonding layer 122 is The buffering distance at the time of binding can be reduced to improve the binding reliability.
  • the flexible display panel 10 and the manufacturing method thereof provided by the embodiments of the present invention can improve the structure of the supporting substrate, so that the supporting substrate can play a good supporting role when binding, and at the same time, a thin stick.
  • the layering layer is used to reduce the buffering distance at the time of binding to improve the binding reliability.

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Abstract

提供一种柔性显示面板及其制造方法，柔性显示面板包括显示区域、非显示区域以及芯片绑定区域；芯片绑定区域（13）包括支撑基板（110）、粘结层（120）、柔性基板（130）、无机绝缘层（140）、各向异性导电膜（150）以及芯片（160），支撑基板（110）包括主体板（111）和凸台（112），凸台（112）用于在芯片（160）进行绑定时提供支撑以提升绑定可靠性。该柔性显示面板及其制造方法通过改进支撑基板（110）的结构使得支撑基板（110）在绑定时能够起到良好的支撑作用，极大地提高了芯片绑定的可靠性。

Description

柔性显示面板及其制造方法
【技术领域】
本发明涉及显示器技术领域，特别涉及一种柔性显示面板及其制造方法。
【背景技术】
随着显示技术的发展及用户需求的不断变化，柔性显示装置应用越来越广泛。柔性显示基板的柔性衬底较常用的是聚酰亚胺（PI，Polyimide）等有机耐高温材质。
目前柔性显示装置的芯片绑定方式主要有两种：
一种是芯片直接绑定（bonding）到柔性显示面板上，简称COG（chip on glass）方式；
另外一种是芯片通过柔性电路板（FPC）连接到柔性显示面板上，简称COF（Chip on film）方式。
相比与COF绑定方式，COG有明显优势，包括：
（1）首先把芯片直接绑定到面板上，不需要额外的柔性电路板，可以大大减少成本；
（2）芯片的引线间距（pitch）可以做到很小，满足现在高解析度pad 区走线尺寸越来越细的要求，而柔性电路板上引线尺寸还做不到很小；
（3）柔性电路板上引线长度较大，需要的绑定区面积增加，而芯片的引线长度较短可节约空间，缩小面板边框。
但是，在柔性显示基板装置进行COG方式绑定芯片时，由于基板是柔性的，在进行硬（IC）对软（柔性面板）压接绑定的时候很容易发生线路断裂、绑定不良等现象。
【发明内容】
本发明实施例提供一种柔性显示面板及其制造方法，以解决现有技术中柔性显示基板装置进行COG方式绑定芯片时易发生线路断裂、绑定不良现象的问题。
为解决上述技术问题，本发明实施例采用的一个技术方案是：提供一种柔性显示面板，其中，所述柔性显示面板包括显示区域、位于所述显示区域外围的非显示区域以及位于所述非显示区域上的芯片绑定区域；
所述芯片绑定区域包括由下至上依次层叠设置的支撑基板、粘结层、柔性基板、无机绝缘层、各向异性导电膜以及芯片，所述无机绝缘层的上表面设有绑定焊接盘，所述芯片与所述绑定焊接盘的位置相对应；
所述支撑基板包括主体板和凸出于所述主体板上表面的凸台，所述凸台的位置与所述绑定焊接盘和所述芯片的位置相对应；
所述支撑基板使得所述粘结层在所述柔性基板与所述主体板未设有凸台之间的区域形成厚粘结层，在所述柔性基板与所述主体板设有凸台之间的区域形成薄粘结层；
其中，所述凸台用于在所述芯片与所述绑定焊接盘进行绑定时提供支撑，同时所述薄粘结层用于缩小绑定时的缓冲距离以提升绑定可靠性；
其中，所述支撑基板采用聚对苯二甲酸乙二醇酯，所述柔性基板采用聚酰亚胺。
为解决上述技术问题，本发明实施例采用的另一个技术方案是：提供一种柔性显示面板，柔性显示面板包括显示区域、位于显示区域外围的非显示区域以及位于非显示区域上的芯片绑定区域；
芯片绑定区域包括由下至上依次层叠设置的支撑基板、粘结层、柔性基板、无机绝缘层、各向异性导电膜以及芯片，无机绝缘层的上表面设有绑定焊接盘，芯片与绑定焊接盘的位置相对应；
支撑基板包括主体板和凸出于主体板上表面的凸台，凸台的位置与绑定焊接盘和芯片的位置相对应；
支撑基板使得粘结层在柔性基板与主体板未设有凸台之间的区域形成厚粘结层，在柔性基板与主体板设有凸台之间的区域形成薄粘结层；
其中，凸台用于在芯片与绑定焊接盘进行绑定时提供支撑，同时薄粘结层用于缩小绑定时的缓冲距离以提升绑定可靠性。
为解决上述技术问题，本发明实施例采用的另一个技术方案是：提供一种柔性显示面板的制造方法，其中，包括：
在载体基板上制备柔性基板并在柔性基板上形成显示区的器件层和非显示区的器件层；
在非显示区的器件层上形成绑定焊接盘；
在绑定焊接盘上贴附各向异性导电膜；
将载体基板剥离；
利用粘结层将设有凸台的支撑基板与柔性基板贴合，其中凸台的位置与绑定焊接盘的位置相对应；
将芯片置于各向异性导电膜上并与绑定焊接盘和凸台的位置相对应再进行压紧绑定。
本发明的有益效果是：区别于现有技术的情况，本发明实施例提供的柔性显示面板及其制造方法通过改进支撑基板的结构使得支撑基板在绑定时能够起到良好的支撑作用，同时薄粘结层用于缩小绑定时的缓冲距离以提升绑定可靠性。
【附图说明】
为了更清楚地说明本发明实施例中的技术方案，下面将对实施例描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本发明的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图，其中：
图1是本发明实施例提供的柔性显示面板的简化俯视结构示意图；
图2是图1所示的柔性显示面板的a-a处的局部放大截面结构示意图；以及
图3是本发明实施供提供的柔性显示面板制造方法的流程示意图。
【具体实施方式】
下面将结合本发明实施例中的附图，对本发明实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅是本发明的一部分实施例，而不是全部的实施例。基于本发明中的实施例，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例，都属于本发明保护的范围。
请参阅图1，图1是本发明实施例提供的柔性显示面板的简化俯视结构示意图。
如图1所示，本发明实施例提供一种柔性显示面板10，该柔性显示面板10包括显示区域11、位于显示区域11外围的非显示区域12以及位于非显示区域12上的芯片绑定区域13。其中，显示区域11的结构可参阅现有技术，由于不涉及发明点所在，本专利中不作详述。
请一并参阅图2，图2是图1所示的柔性显示面板的a-a处的局部放大截面结构示意图。
如图2所示，芯片绑定区域13包括由下至上依次层叠设置的支撑基板110、粘结层120、柔性基板130、无机绝缘层140、各向异性导电膜150（Anisotropic Conductive Film，ACF）以及芯片160。
其中，无机绝缘层140的上表面设有多个绑定焊接盘145（boding pad），芯片160的下表面设有多个金手指165，多个金手指165的位置与多个绑定焊接盘145的位置一一对应。各向异性导电膜150包括树脂151和分布于树脂151内的多个导电粒子152。
在本发明实施例中，支撑基板110包括主体板111和凸出于主体板111上表面的凸台112，凸台112呈矩形体状，凸台112的位置与焊接盘145和芯片160的位置相对应。
支撑基板110使得粘结层120在柔性基板130与主体板111未设有凸台112之间的区域形成厚粘结层121，在柔性基板130与主体板111设有凸台112之间的区域形成薄粘结层122。
由于支撑基板110的特殊结构设计，使得凸台112能够在芯片160的金手指165与无机绝缘层140上的绑定焊接盘145进行绑定时提供良好的支撑，同时薄粘结层122能够缩小绑定时的缓冲距离进而提升绑定可靠性。
在现有技术中，支撑基板110为平整设计，粘结层120的厚度在绑定区和非绑定区相同，在绑定时会由于受压形变较大而导致各向异性导电膜150中的导电粒子152受力不够，进而导致芯片160的金手指165不能够与绑定焊接盘145形成良好的电接触。
在本发明实施例中，支撑基板110可采用聚对苯二甲酸乙二醇酯（PET），其硬度大于柔性基板，厚度可为25微米至50微米，在具体实施例中，支撑基板110的厚度可为25微米、30微米、35微米、40微米、45微米或50微米等。柔性基板130采用聚酰亚胺（PI），其硬度小于支撑基板110，厚度为20微米左右。
在本发明实施例中，无机绝缘层140包括由下至上依层叠设置的缓冲层141（BF）、栅极绝缘层142（GI）以及层间绝缘层143（ILD），绑定焊接盘145设于层间绝缘层143的上表面。
请一并参阅图3，图3是本发明实施供提供的柔性显示面板制造方法的流程示意图。
如图3所示，本发明提供一种柔性显示面板的制造方法，该方法包括以下步骤：
S110，在载体基板上制备柔性基板130并在柔性基板130上形成显示区的器件层和非显示区的器件层。在本步骤中，由于柔性基板130较薄，无法直接进行后续的十几道制程，因此需要先用玻璃基板作为载体基板。制备柔性基板130可采用涂布方式进行，涂布的厚度为20微米左右。形成显示区的器件层和非显示区的器件层的工艺可参考现有技术，由于不涉及发明点所在，本专利中不作详述
S120，在非显示区的器件层上形成绑定焊接盘145。在本步骤中，非显示区的器件层具体是指无机绝缘层140，在无机绝缘层140最上层的层间绝缘层143上形成多个绑定焊接盘145。
S130，在绑定焊接盘145上贴附各向异性导电膜150。在本步骤中，各向异性导电膜150用于后续制程中供芯片160进行压紧绑定。
S140，将载体基板剥离。
S150，利用粘结层120将设有凸台112的支撑基板110与柔性基板130贴合。在本步骤中，粘结层120为透明光学胶，凸台112的位置与绑定焊接盘145的位置相对应。
S160，将芯片160置于各向异性导电膜150上并与绑定焊接盘145和凸台112的位置相对应再进行压紧绑定。
由于支撑基板110的特殊结构设计，使得凸台112能够在芯片160的金手指165与无机绝缘层140上的绑定焊接盘145进行绑定时提供良好的支撑，同时薄粘结层122的厚度能够缩小绑定时的缓冲距离进而提升绑定可靠性。
综上所述，本领域技术人员容易理解，本发明实施例提供的柔性显示面板10及其制造方法通过改进支撑基板的结构使得支撑基板在绑定时能够起到良好的支撑作用，同时薄粘结层用于缩小绑定时的缓冲距离以提升绑定可靠性。
以上所述仅为本发明的实施例，并非因此限制本发明的专利范围，凡是利用本发明说明书及附图内容所作的等效结构或等效流程变换，或直接或间接运用在其他相关的技术领域，均同理包括在本发明的专利保护范围内。

Claims (11)

  1. 一种柔性显示面板，其中，所述柔性显示面板包括显示区域、位于所述显示区域外围的非显示区域以及位于所述非显示区域上的芯片绑定区域；
    所述芯片绑定区域包括由下至上依次层叠设置的支撑基板、粘结层、柔性基板、无机绝缘层、各向异性导电膜以及芯片，所述无机绝缘层的上表面设有绑定焊接盘，所述芯片与所述绑定焊接盘的位置相对应；
    所述支撑基板包括主体板和凸出于所述主体板上表面的凸台，所述凸台的位置与所述绑定焊接盘和所述芯片的位置相对应；
    所述支撑基板使得所述粘结层在所述柔性基板与所述主体板未设有凸台之间的区域形成厚粘结层，在所述柔性基板与所述主体板设有凸台之间的区域形成薄粘结层；
    其中，所述凸台用于在所述芯片与所述绑定焊接盘进行绑定时提供支撑，同时所述薄粘结层用于缩小绑定时的缓冲距离以提升绑定可靠性；
    其中，所述支撑基板采用聚对苯二甲酸乙二醇酯，所述柔性基板采用聚酰亚胺。
  2. 一种柔性显示面板，其中，所述柔性显示面板包括显示区域、位于所述显示区域外围的非显示区域以及位于所述非显示区域上的芯片绑定区域；
    所述芯片绑定区域包括由下至上依次层叠设置的支撑基板、粘结层、柔性基板、无机绝缘层、各向异性导电膜以及芯片，所述无机绝缘层的上表面设有绑定焊接盘，所述芯片与所述绑定焊接盘的位置相对应；
    所述支撑基板包括主体板和凸出于所述主体板上表面的凸台，所述凸台的位置与所述绑定焊接盘和所述芯片的位置相对应；
    所述支撑基板使得所述粘结层在所述柔性基板与所述主体板未设有凸台之间的区域形成厚粘结层，在所述柔性基板与所述主体板设有凸台之间的区域形成薄粘结层；
    其中，所述凸台用于在所述芯片与所述绑定焊接盘进行绑定时提供支撑，同时所述薄粘结层用于缩小绑定时的缓冲距离以提升绑定可靠性。
  3. 根据权利要求2所述的柔性显示面板，其中，所述支撑基板采用聚对苯二甲酸乙二醇酯。
  4. 根据权利要求2所述的柔性显示面板，其中，所述支撑基板的厚度为25微米至50微米。
  5. 根据权利要求2所述的柔性显示面板，其中，所述柔性基板采用聚酰亚胺。
  6. 根据权利要求2所述的柔性显示面板，其中，所述柔性基板的厚度为20微米。
  7. 根据权利要求2所述的柔性显示面板，其中，所述无机绝缘层包括由下至上依层叠设置的缓冲层、栅极绝缘层以及层间绝缘层，所述绑定焊接盘设于所述层间绝缘层的上表面。
  8. 根据权利要求2所述的柔性显示面板，其中，所述凸台呈矩形体状。
  9. 根据权利要求2所述的柔性显示面板，其中，所述各向异性导电膜包括树脂和分布于树脂内的多个导电粒子。
  10. 根据权利要求2所述的柔性显示面板，其中，所述绑定焊接盘为多个，所述芯片包括多个金手指，所述多个金手指的位置与所述多个绑定焊接盘的位置一一对应。
  11. 一种柔性显示面板的制造方法，其中，包括：
    在载体基板上制备柔性基板并在所述柔性基板上形成显示区的器件层和非显示区的器件层；
    在所述非显示区的器件层上形成绑定焊接盘；
    在所述绑定焊接盘上贴附各向异性导电膜；
    将所述载体基板剥离；
    利用粘结层将设有凸台的支撑基板与所述柔性基板贴合，其中所述凸台的位置与所述绑定焊接盘的位置相对应；
    将芯片置于所述各向异性导电膜上并与所述绑定焊接盘和所述凸台的位置相对应再进行压紧绑定。
PCT/CN2017/088022 2017-03-27 2017-06-13 柔性显示面板及其制造方法 WO2018176631A1 (zh)

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