WO2019200907A1 - Led点阵显示屏 - Google Patents

Led点阵显示屏 Download PDF

Info

Publication number
WO2019200907A1
WO2019200907A1 PCT/CN2018/115972 CN2018115972W WO2019200907A1 WO 2019200907 A1 WO2019200907 A1 WO 2019200907A1 CN 2018115972 W CN2018115972 W CN 2018115972W WO 2019200907 A1 WO2019200907 A1 WO 2019200907A1
Authority
WO
WIPO (PCT)
Prior art keywords
dot matrix
layer
matrix display
display screen
led
Prior art date
Application number
PCT/CN2018/115972
Other languages
English (en)
French (fr)
Inventor
王俊凯
Original Assignee
广州视源电子科技股份有限公司
广州视睿电子科技有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 广州视源电子科技股份有限公司, 广州视睿电子科技有限公司 filed Critical 广州视源电子科技股份有限公司
Publication of WO2019200907A1 publication Critical patent/WO2019200907A1/zh

Links

Images

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes

Definitions

  • the present application relates to the field of display device technology, for example, to an LED dot matrix display screen.
  • the Touch Screen allows the user to operate the host by simply touching the icon or text on the computer display with a finger, thus eliminating keyboard and mouse operations and making human-computer interaction more straightforward.
  • the touch display is mainly used for lobby information inquiry, guiding office, electronic games, ordering songs, multimedia teaching, and ticket/train ticket pre-sale in public places.
  • the products are mainly divided into capacitive touch screen and resistive touch. Screen and surface acoustic wave touch screen three categories.
  • the related Light Emitting Diode (LED) dot matrix display can be very large in size, but it uses conventional surface mount technology (SMD) and chip on board (Chips on Board). , COB) packaging process for packaging, the surface of the LED dot matrix display after packaging has the problem of unevenness and rough surface, there is no way to achieve touch writing on its surface.
  • SMD surface mount technology
  • Chip on Board Chip on Board
  • the embodiment of the present application provides an LED dot matrix display screen, which has a simple structure, large size, touchable writing, and low cost.
  • An embodiment of the present application provides an LED dot matrix display, comprising a PCB substrate, a writing touch layer, and LED lamp beads spaced apart on the PCB substrate; the writing touch layer is filled in a gap between the LED lamp beads And covering the LED lamp bead; the writing touch layer is away from a side of the PCB substrate as a first side, and the first side is a high hardness surface.
  • the first side has a hardness greater than 4 h.
  • a side surface of the writing touch layer and the PCB substrate abutting each other is a second side surface, and the hardness of the second side surface is lower than the hardness of the first side surface.
  • the writing touch layer includes a filling layer and a reinforcing layer disposed on a side of the filling layer away from the PCB substrate, the LED lamp bead being embedded in the filling layer, the first side Provided on a side of the reinforcing layer away from the filling layer.
  • the reinforcing layer is any one of the following: a hardness reinforcing film, a glass cover plate, and a transparent plastic plate.
  • an infrared touch frame is disposed around the LED dot matrix display.
  • the writing touch layer comprises a filling layer, and the LED lamp bead is embedded in the filling layer, and the filling layer is sequentially provided with a capacitance film and a cover plate.
  • a plurality of grooves are disposed on the PCB substrate, the LED lamp beads are fixed in the grooves, and the LED lamp beads do not protrude from the grooves, and the filling layer is filled. a gap between the groove and the LED lamp bead.
  • the LED lamp bead protrudes from the PCB substrate.
  • the filling layer is an encapsulant.
  • the beneficial effect of the embodiment of the present application is that the flatness of the surface of the LED dot matrix display screen is higher by filling the gap between the LED lamp beads through the writing touch layer, and the first side of the filling layer writing touch layer is high.
  • the hardness surface can make the LED dot matrix display realize touch writing.
  • the LED dot matrix display can also be very large and low in cost, so it can meet the requirements of large-size, low-cost display touch writing.
  • FIG. 1 is a schematic structural diagram of an LED dot matrix display screen according to an embodiment of the present application.
  • FIG. 2 is a schematic structural diagram of an LED dot matrix display screen according to another embodiment of the present application.
  • FIG. 3 is a schematic structural diagram of an LED dot matrix display screen according to still another embodiment of the present application.
  • connection In the description of the present application, the terms “connected”, “connected”, and “fixed” are to be understood broadly, and may be either a fixed connection, a detachable connection, or an integral, unless otherwise specifically defined and defined. It can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, which can be the internal connection of two elements or the interaction of two elements.
  • intermediate medium which can be the internal connection of two elements or the interaction of two elements.
  • the first feature "on” or “under” the second feature may include direct contact of the first and second features, and may also include first and second features, unless otherwise specifically defined and defined. It is not in direct contact but through additional features between them.
  • the first feature “above”, “above” and “above” the second feature includes the first feature directly above and above the second feature, or merely indicating that the first feature level is higher than the second feature.
  • the first feature “below”, “below” and “below” the second feature includes the first feature directly below and below the second feature, or merely the first feature level being less than the second feature.
  • an embodiment of the present application provides a dot matrix display screen, which includes a printed circuit board (PCB) substrate 1 , a writing touch layer, and an interval disposed on the PCB substrate 1 .
  • the flatness of the surface of the display screen is high, and the first side of the writing touch layer is a high hardness surface, so that the LED dot matrix display can realize touch writing.
  • LED dot matrix display can also be very large and low cost, so it can meet the requirements of large-size, low-cost LED dot matrix display touch writing.
  • the writing touch layer comprises a filling layer 3 and a reinforcing layer 4, wherein the LED lamp bead 2 is wrapped in the filling layer 3, and the reinforcing layer 4 is made of a material having a hardness of more than 4 h, so that the writing touch layer is The first side forms a high hardness surface for easy touch writing.
  • the reinforcing layer 4 is a hardness-enhancing film disposed on the filling layer 3.
  • the hardness-enhancing film is made of a material such as silica gel or a mixture of silica, and has a hardness of up to 6 hours.
  • the reinforcing layer 4 may also be a glass cover or a transparent plastic, such as an acrylic sheet, disposed on the first side of the filling layer 3.
  • the reinforcing layer 4 is made of tempered glass. Tempered glass gives the display a high degree of clarity and durability.
  • the writing touch layer includes only the filling layer 3, and the high hardness surface of the first side is formed by pre-forming the filling layer 3.
  • the filling layer 3 is a glue layer capable of filling the plastic LED lamp bead 2, and the first side of the rubber layer is changed in hardness by heat treatment, and the hardness is up to 4 hours, and the first side of the hardness standard can be Achieve touch writing.
  • the LED lamp bead 2 protrudes from the surface of the PCB substrate 1, and the filling layer 3 fills the gap between the LED lamp bead 2 and wraps the LED lamp bead 2
  • a layer structure having a certain thickness is formed on the surface of the PCB substrate 1.
  • the filling layer 3 may be flush with the top of the LED bead 2 or higher than the top of the LED bead 2.
  • the LED lamp bead 2 can also be fixed within the PCB substrate 1. As shown in FIG. 3, a plurality of grooves are disposed on the PCB substrate 1, the LED lamp bead 2 is fixed in the groove, and the LED lamp bead 2 does not protrude from the groove, and the writing touch layer is filled with the groove and the LED lamp bead 2 The gap between them. Similarly, the top of the LED bead 2 can be flush with the notch of the groove or lower than the notch of the groove, and after the writing touch layer fills the groove, the LED bead 2 is encapsulated in the filling layer 3, so that The surface of the PCB substrate 1 is flush.
  • the LED lamp bead 2 is not limited to the above-described embodiment and does not protrude from the PCB substrate 1 , and may be disposed to partially protrude from the PCB substrate 1 , that is, the first side of the filling layer 3 and the LED lamp bead 2 protrude from the PCB substrate.
  • the surface of 1 is flush or protrudes beyond the surface of the PCB substrate 1 of the LED lamp bead 2.
  • the adhesive layer 5 is added on the first side, and then the reinforcing layer 4 is provided, as shown in FIGS. 2 and 3.
  • the adhesive layer 5 is an epoxy layer or a silicone layer.
  • Conventional displays can be classified into SMD (Surface Mount Device) and COB (Chip On Board Package) according to the placement process.
  • SMD package is to fix the LED lamp beads with conductive adhesive and insulating glue on the pads of the lamp holder, and then connect the pins of the LED lamp beads to the pads by wires, and finally encapsulated with epoxy or silicone;
  • COB package The LED lamp bead is fixed on the pad of the PCB board lamp bead through the conductive adhesive and the insulating glue, and the lead of the LED lamp bead is connected with the pad by the lead wire, and finally encapsulated with epoxy resin or silicone.
  • the gap between the LED lamp beads 2 is filled with the filling layer 3, so that the LED lamp bead 2 is encapsulated in the filling layer 3, and further on the filling layer 3. Evenly applying the adhesive layer 5 can make the surface of the display screen have a good flatness.
  • the production of the display screen provided in the present application eliminates the dot-shaped package for each LED lamp bead 2 relative to the COB process, and directly uses the writing touch layer to perform the LED lamp bead 2 after the fixed soldering test on the PCB substrate 1.
  • the integrated package can fill the gap between the LED lamp beads 2 to achieve the flatness of the display surface, and can realize the packaging of the single LED lamp bead 2, thereby improving the production speed.
  • an infrared touch frame is disposed outside the LED dot matrix display, and an infrared emitting component and an infrared receiving component are disposed on the infrared touch frame, and the infrared emitting component is opposite to the infrared receiving component, and is emitted parallel to the filling layer. Touch the infrared light on the first side of 3.
  • the first side can realize touch writing, that is, the touch infrared rays fill the entire first side.
  • the first side can also realize touch writing locally, and only needs to adjust the area covered by the touch infrared.
  • the local area realizes touch writing in order to reduce the manufacturing cost and reduce the manufacturing difficulty, because if the size of the display screen is very large, the area that the operator can touch is limited, and only needs to be set to be touchable in the area that the operator can operate. It is not necessary to set the entire display screen to touchable writing, which reduces manufacturing costs and manufacturing difficulty.
  • the display screen can also be a capacitive touch screen.
  • the writing touch layer comprises a filling layer 3 enclosing the LED lamp bead 2, and the filling layer 3 is provided with a capacitor film and a reinforcing plate in sequence, and the reinforcing plate is a glass cover plate.
  • an identification chip for identifying a fingerprint or palm print is disposed between the first side of the filling layer 3 and the reinforcing layer 4.
  • the identification chip is arranged to facilitate the identification of the user's identity by the terminal of the display.
  • the filling layer 3 is an encapsulant.
  • the encapsulant is an epoxy resin or a silicone.
  • the display screen is not limited to a dot matrix display, but may also be a small pitch LED, a Micro LED or an OLED.
  • an embodiment or the like means that a specific feature, structure, material or characteristic of the embodiment is included in at least one embodiment or example of the present application.
  • the schematic representation of the above terms does not necessarily refer to the same embodiment.

Landscapes

  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Human Computer Interaction (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Led Device Packages (AREA)

Abstract

LED点阵显示屏，包括PCB基板（1）、书写触摸层以及间隔设置在PCB基板（1）上的LED灯珠（2）；书写触摸层填充于LED灯珠（2）之间的间隙并包覆LED灯珠（2）；书写触摸层远离PCB基板（1）的一侧面为第一侧面，第一侧面为高硬度表面。

Description

LED点阵显示屏
本申请要求在2018年04月17日提交中国专利局、申请号为201820551285.1的中国专利申请的优先权，该申请的全部内容通过引用结合在本申请中。
技术领域
本申请涉及显示设备技术领域，例如涉及一种LED点阵显示屏。
背景技术
触摸显示器(Touch Screen)可以让使用者只需用手指轻轻地触碰计算机显示屏上的图符或文字就能实现对主机操作，这样摆脱了键盘和鼠标操作，使人机交互更为直截了当。触摸显示器主要应用于公共场所的大厅信息查询、引导办公、电子游戏、点歌点菜、多媒体教学、以及机票/火车票预售等，其产品主要分为电容式触控屏、电阻式触控屏和表面声波触摸屏三类。
随着科技的发展，目前人们对大屏幕的触摸显示器的需求量越来越高，但是相关的触摸显示器在屏幕尺寸做大后成本非常高，且存在大尺寸设计的瓶颈。
而相关的发光二极管(Light Emitting Diode，LED)点阵显示屏虽然可以做到尺寸非常大，但是由于其采用常规的表面贴装器件(Surface Mount Technology，SMD)和板上芯片封装(Chips on Board，COB)封装工艺进行封装，封装后的LED点阵显示屏的表面存在凹凸不平、表面比较粗糙的问题，没有办法在其表面实现触摸书写。
发明内容
本申请实施例提供了一种LED点阵显示屏，其结构简单，尺寸大，可触摸书写，以及成本低。
本申请实施例提供一种LED点阵显示屏，包括PCB基板、书写触摸层以及间隔设置在所述PCB基板上的LED灯珠；所述书写触摸层填充于所述LED灯珠之间的间隙并包覆所述LED灯珠；所述书写触摸层远离所述PCB基板的一侧面为第一侧面，所述第一侧面为高硬度表面。
在一实施例中，所述第一侧面的硬度大于4h。
在一实施例中，所述书写触摸层与所述PCB基板相互抵接的一侧面为第二 侧面，所述第二侧面的硬度低于所述第一侧面的硬度。
在一实施例中，所述书写触摸层包括填充层和设置在所述填充层远离所述PCB基板的一侧面的加强层，所述LED灯珠嵌入所述填充层内，所述第一侧面设置在所述加强层远离所述填充层的一侧面。
在一实施例中，所述加强层为以下任意一种：硬度加强膜、玻璃盖板和透明的塑料板。
在一实施例中，所述LED点阵显示屏的四周设置有红外触摸框。
在一实施例中，所述书写触摸层包括填充层，所述LED灯珠嵌入所述填充层内，所述填充层上依次设置电容膜和盖板。
在一实施例中，所述PCB基板上设置多个凹槽，所述LED灯珠固定在所述凹槽内，且所述LED灯珠不凸出于所述凹槽，所述填充层充满所述凹槽与所述LED灯珠之间的间隙。
在一实施例中，所述LED灯珠凸出于所述PCB基板。
在一实施例中，所述填充层为封装胶。
本申请实施例的有益效果为：通过将LED灯珠之间的间隙通过书写触摸层填充，使得LED点阵显示屏的表面的平整度较高，且填充层书写触摸层的第一侧面为高硬度表面，可以使LED点阵显示屏实现触摸书写，另外，LED点阵显示屏还可以做到非常大，且成本较低，因此可以满足大尺寸、低成本的显示屏的触摸书写的要求。
附图概述
下面根据附图和实施例对本申请作进一步详细说明。
图1为本申请一实施例所述的LED点阵显示屏的结构示意图。
图2为本申请另一实施例所述的LED点阵显示屏的结构示意图。
图3为本申请又一实施例所述的LED点阵显示屏的结构示意图。
图中：
1、PCB基板；2、LED灯珠；3、填充层；4、加强层；5、粘胶层。
具体实施方式
下面将结合附图对本申请实施例的技术方案作进一步的详细描述，显然，所描述的实施例仅仅是本申请一部分实施例，而不是全部的实施例。基于本申 请中的实施例，本领域技术人员在没有作出创造性劳动前提下所获得的所有其他实施例，都属于本申请保护的范围。
在本申请的描述中，除非另有明确的规定和限定，术语“相连”、“连接”、“固定”应做广义理解，例如，可以是固定连接，也可以是可拆卸连接，或成一体；可以是机械连接，也可以是电连接；可以是直接相连，也可以通过中间媒介间接相连，可以是两个元件内部的连通或两个元件的相互作用关系。对于本领域的普通技术人员而言，可以具体情况理解上述术语在本申请中的具体含义。
在本申请中，除非另有明确的规定和限定，第一特征在第二特征之“上”或之“下”可以包括第一和第二特征直接接触，也可以包括第一和第二特征不是直接接触而是通过它们之间的另外的特征接触。而且，第一特征在第二特征“之上”、“上方”和“上面”包括第一特征在第二特征正上方和斜上方，或仅仅表示第一特征水平高度高于第二特征。第一特征在第二特征“之下”、“下方”和“下面”包括第一特征在第二特征正下方和斜下方，或仅仅表示第一特征水平高度小于第二特征。
如图1所示，本申请实施例提供一种点阵显示屏，此LED点阵显示屏包括印制电路板(Printed Circuit Board，PCB)基板1、书写触摸层以及间隔设置在PCB基板1上的LED灯珠2；书写触摸层填充于LED灯珠2之间的间隙并包覆LED灯珠2；书写触摸层远离PCB基板1的一侧面为第一侧面，第一侧面为高硬度表面。通过将LED灯珠2之间的间隙通过书写触摸层填充，使得显示屏的表面的平整度较高，且书写触摸层的第一侧面为高硬度表面，可以使LED点阵显示屏实现触摸书写，另外，LED点阵显示屏还可以做到非常大，且成本较低，因此可以满足大尺寸、低成本的LED点阵显示屏的触摸书写的要求。
在本实施例中，书写触摸层包括填充层3和加强层4，其中，LED灯珠2被包裹在填充层3内，加强层4采用硬度大于4h的材料制成，以使书写触摸层的第一侧面形成高硬度表面，便于实现触摸书写。
在一实施例中，加强层4为设置在填充层3上的硬度加强膜，硬度加强膜为采用硅胶、二氧化硅混合物等材质制成，其硬度可达6h。
在其他实施例中，加强层4还可以为设置在填充层3的第一侧面的玻璃盖板或者透明的塑料，例如亚克力板。在一实施例中，加强层4采用钢化玻璃制成。钢化玻璃可以使显示屏具有较高的清晰度和耐用性。
在本申请的一个实施例中，书写触摸层仅包括填充层3，第一侧面的高硬度表面是通过对填充层3进行预处理成型。在一实施例中，填充层3为可灌装塑 封LED灯珠2的胶层，胶层的第一侧面采用加热处理的方式改变硬度，硬度可达4h，达到此硬度标准的第一侧面可以实现触摸书写。
在本申请的一个实施例中，如图1或图2所示，LED灯珠2凸出于PCB基板1的表面，填充层3填充LED灯珠2之间的间隙和包裹LED灯珠2后在PCB基板1的表面形成具有一定厚度的层面结构。
在一实施例中，填充层3可与LED灯珠2的顶部平齐，也可以高于LED灯珠2的顶部。
在其他实施例中，LED灯珠2还可以固定在PCB基板1内。如图3所示，PCB基板1上设置多个凹槽，LED灯珠2固定在凹槽内，且LED灯珠2不凸出于凹槽，书写触摸层充满凹槽与LED灯珠2之间的间隙。同样，LED灯珠2的顶部可以平齐于凹槽的槽口，或者低于凹槽的槽口，在书写触摸层填满凹槽后，LED灯珠2被封装在填充层3内，使得PCB基板1表面平齐。另外，LED灯珠2不限于上述实施例的不凸出于PCB基板1，还可以设置为部分凸出于PCB基板1，即填充层3的第一侧面与LED灯珠2凸出于PCB基板1的表面平齐或者超过LED灯珠2凸出于PCB基板1的表面。
当然，为了增加平整度，提高组装后的显示屏的触摸效果，在填充填充层3后在第一侧面增设粘胶层5，然后再设置加强层4，如图2和图3所示。在一实施例中，粘胶层5为环氧树脂层或有机硅层。
常规的显示屏按照贴装工艺可分为SMD(表面贴装器件)和COB(板上芯片封装)。SMD封装是将LED灯珠用导电胶和绝缘胶固定在灯珠支架的焊盘上，然后采用引线将LED灯珠的引脚与焊盘连接，最后用环氧树脂或硅胶包封；COB封装是将LED灯珠通过导电胶和绝缘胶固定在PCB板灯珠位的焊盘上，采用引线将LED灯珠的引脚与焊盘连接，最后用环氧树脂或有机硅胶包封。
如图2所示，在本申请中，通过将LED灯珠2之间的间隙利用填充层3填平，以使LED灯珠2被封装在填充层3内，再在填充层3上进一步的均匀敷设粘胶层5，可使得显示屏的表面具有较好的平整度。并且，本申请中提供的显示屏的制作相对于COB工艺省去对每一个LED灯珠2的点状封装，直接采用书写触摸层对PCB基板1上固定焊合测试后的LED灯珠2进行一体封装，既可填平LED灯珠2之间的间隙实现显示屏表面的平整度，又可实现对单颗LED灯珠2的封装，提升了生产速度。
在本申请的另一个实施例中，LED点阵显示屏外设置红外触摸框，红外触 摸框上设置红外发射部件和红外接收部件，红外发射部件与红外接收部件相对设置，并发射出平行于填充层3的第一侧面的触摸红外线。
在本实施例中，第一侧面均可实现触摸书写，即触摸红外线布满整个第一侧面。
需要说明的是，第一侧面还可以局部实现触摸书写，只需要调整触摸红外线覆盖的区域即可。局部区域实现触摸书写是为了降低制造成本和降低制造难度，因为如果显示屏的尺寸非常大，那么操作者可触控的区域也是有限的，只需要在操作者可以操作的区域设置为可触摸书写，不用将整个显示屏设置为可触摸书写，降低了制造成本和制造难度。
在其他实施例中，显示屏还可以为电容触摸屏。在一实施例中，书写触摸层包括包裹LED灯珠2的填充层3，填充层3上依次设置电容膜和加强板，加强板为玻璃盖板。
在本申请的又一个实施例中，在填充层3的第一侧面和加强层4之间设置用于识别指纹或掌纹的识别芯片。识别芯片的设置可便于显示屏的终端对使用者的身份进行识别。
在本实施例中，填充层3为封装胶，在一实施例中，封装胶为环氧树脂或有机硅。
显示屏不限于为点阵显示屏，还可以为小间距LED、Micro LED或OLED等。
于本文的描述中，需要理解的是，术语“上”等方位或位置关系为基于附图所示的方位或位置关系，仅是为了便于描述和简化操作，而不是指示或暗示所指的装置或元件必须具有特定的方位、以特定的方位构造和操作，因此不能理解为对本申请的限制。
在本说明书的描述中，参考术语“一实施例”等的描述意指结合该实施例的具体特征、结构、材料或者特点包含于本申请的至少一个实施例或示例中。在本说明书中，对上述术语的示意性表述不一定指的是相同的实施例。
此外，应当理解，虽然本说明书按照实施方式加以描述，但并非每个实施方式仅包含一个独立的技术方案，说明书的这种叙述方式仅仅是为清楚器件，本领域技术人员应当将说明书作为一个整体，各实施例中的技术方案也可以适当组合，形成本领域技术人员可以理解的其他实施方式。

Claims (10)

  1. 一种LED点阵显示屏，包括印制电路板PCB基板、书写触摸层以及间隔设置在所述PCB基板上的LED灯珠；所述书写触摸层填充于所述LED灯珠之间的间隙并包覆所述LED灯珠；所述书写触摸层远离所述PCB基板的一侧面为第一侧面，所述第一侧面为高硬度表面。
  2. 根据权利要求1所述的LED点阵显示屏，其中，所述第一侧面的硬度大于4h。
  3. 根据权利要求1所述的LED点阵显示屏，其中，所述书写触摸层与所述PCB基板相互抵接的一侧面为第二侧面，所述第二侧面的硬度低于所述第一侧面的硬度。
  4. 根据权利要求1所述的LED点阵显示屏，其中，所述书写触摸层包括填充层和设置在所述填充层远离所述PCB基板的一侧面的加强层，所述LED灯珠嵌入所述填充层内，所述第一侧面设置在所述加强层远离所述填充层的一侧面。
  5. 根据权利要求4所述的LED点阵显示屏，其中，所述加强层为以下任意一种：硬度加强膜、玻璃盖板和透明的塑料板。
  6. 根据权利要求1至5任一项所述的LED点阵显示屏，其中，所述LED点阵显示屏的四周设置有红外触摸框。
  7. 根据权利要求1至5任一项所述的LED点阵显示屏，其中，所述书写触摸层包括填充层，所述LED灯珠嵌入所述填充层内，所述填充层上依次设置电容膜和盖板。
  8. 根据权利要求1至5任一项所述的LED点阵显示屏，其中，所述PCB基板上设置多个凹槽，所述LED灯珠固定在所述凹槽内，且所述LED灯珠不凸出于所述凹槽，所述填充层充满所述凹槽与所述LED灯珠之间的间隙。
  9. 根据权利要求1至5任一项所述的LED点阵显示屏，其中，所述LED灯珠凸出于所述PCB基板。
  10. 根据权利要求1至5任一项所述的LED点阵显示屏，其中，所述填充层为封装胶。
PCT/CN2018/115972 2018-04-17 2018-11-16 Led点阵显示屏 WO2019200907A1 (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201820551285.1U CN208368052U (zh) 2018-04-17 2018-04-17 Led点阵显示屏
CN201820551285.1 2018-04-17

Publications (1)

Publication Number Publication Date
WO2019200907A1 true WO2019200907A1 (zh) 2019-10-24

Family

ID=64931964

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2018/115972 WO2019200907A1 (zh) 2018-04-17 2018-11-16 Led点阵显示屏

Country Status (2)

Country Link
CN (1) CN208368052U (zh)
WO (1) WO2019200907A1 (zh)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111312098A (zh) * 2020-04-23 2020-06-19 大连集思特科技有限公司 一种透明触控led显示屏
CN111338513A (zh) * 2020-04-23 2020-06-26 大连集思特科技有限公司 一种led触控显示屏
CN112767848B (zh) * 2021-01-12 2022-07-26 深圳市艾比森光电股份有限公司 一种led显示模组及其制作方法
CN114035699B (zh) * 2021-03-10 2023-03-28 重庆康佳光电技术研究院有限公司 Led触摸芯片及其制备方法和显示装置
WO2022193087A1 (zh) * 2021-03-15 2022-09-22 深圳市艾比森光电股份有限公司 阻燃型显示模组及显示屏

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060012578A1 (en) * 2004-07-14 2006-01-19 Fujitsu Limited Panel unit capable of avoiding contact between electrically conductive bodies thereon
CN104156132A (zh) * 2014-08-26 2014-11-19 深圳市通普科技有限公司 基于led屏的电容式感应互动触控装置
CN104516589A (zh) * 2014-12-30 2015-04-15 广州视声电子实业有限公司 一种触摸显示装置及其操控方法
CN206258849U (zh) * 2016-12-15 2017-06-16 深圳市赛元微电子有限公司 一种具有led显示功能的电容触控按键器件
CN107390962A (zh) * 2017-08-16 2017-11-24 祝小军 一种电磁电容双触摸无边框超窄超薄的教育触摸一体机
CN206758044U (zh) * 2017-05-17 2017-12-15 深圳市东陆科技有限公司 一种显示屏

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060012578A1 (en) * 2004-07-14 2006-01-19 Fujitsu Limited Panel unit capable of avoiding contact between electrically conductive bodies thereon
CN104156132A (zh) * 2014-08-26 2014-11-19 深圳市通普科技有限公司 基于led屏的电容式感应互动触控装置
CN104516589A (zh) * 2014-12-30 2015-04-15 广州视声电子实业有限公司 一种触摸显示装置及其操控方法
CN206258849U (zh) * 2016-12-15 2017-06-16 深圳市赛元微电子有限公司 一种具有led显示功能的电容触控按键器件
CN206758044U (zh) * 2017-05-17 2017-12-15 深圳市东陆科技有限公司 一种显示屏
CN107390962A (zh) * 2017-08-16 2017-11-24 祝小军 一种电磁电容双触摸无边框超窄超薄的教育触摸一体机

Also Published As

Publication number Publication date
CN208368052U (zh) 2019-01-11

Similar Documents

Publication Publication Date Title
WO2019200907A1 (zh) Led点阵显示屏
US12111990B2 (en) Display device and input-sensing member
TWI313431B (en) Transparent touch panel
TWI390280B (zh) 觸控面板顯示器與觸控顯示裝置
WO2019129265A1 (zh) 指纹识别模组及电子设备
TWI476656B (zh) 觸控面板及其製造方法
TWI536217B (zh) 觸控顯示裝置
CN108416280A (zh) 显示模组和显示装置
CN104421771B (zh) 发光二极管组件以及包括该组件的液晶显示装置
US20170228075A1 (en) Pressure sensing display and manufacturing method thereof
US7642479B2 (en) Touch pad structure
CN105278737A (zh) 触摸面板
TW201346998A (zh) 觸控顯示面板
US11163415B2 (en) Touch display module, touch display device and electronic device
US10338708B2 (en) Flexible touch screen, method for manufacturing the same and touch device
KR102349591B1 (ko) 터치 방식 표시장치 및 터치 감지방법
TWI685775B (zh) 觸控模組及觸控模組的操作方法
TW201504900A (zh) 觸控顯示裝置
TWI521395B (zh) 觸控式電子裝置以及組裝此觸控式電子裝置之方法
US20170338074A1 (en) Package structure of display panel, connecting board, package method and display device
TW202042202A (zh) 顯示裝置
TW201537404A (zh) 觸控顯示裝置及其製作方法
CN203406217U (zh) 一种按键背光灯光源均衡散光的按键组件
CN110880544B (zh) 一种用于玻璃基板的芯片及其制作方法
KR20170093627A (ko) 터치 윈도우

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 18915422

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 18915422

Country of ref document: EP

Kind code of ref document: A1