WO2014026490A1 - 一种印制线路板压合结构及压合方法 - Google Patents

一种印制线路板压合结构及压合方法 Download PDF

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WO2014026490A1
WO2014026490A1 PCT/CN2013/075221 CN2013075221W WO2014026490A1 WO 2014026490 A1 WO2014026490 A1 WO 2014026490A1 CN 2013075221 W CN2013075221 W CN 2013075221W WO 2014026490 A1 WO2014026490 A1 WO 2014026490A1
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conductive
printed circuit
circuit board
conduction
circuit boards
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PCT/CN2013/075221
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English (en)
French (fr)
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傅雪峰
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广东欧珀移动通信有限公司
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0221—Insulating particles having an electrically conductive coating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads

Definitions

  • the present invention relates to the field of printed circuit boards, and in particular to a printed circuit board pressing structure and a pressing method.
  • connectors are often used to solve the problem, or by making soft and hard bonded boards.
  • the connector design method increases the structural design difficulty and the connector cost, while the soft and hard combination board method is mature and reliable, but the cost of the soft and hard combination board is pure hard or soft due to the limitation of the manufacturing process. The board is expensive above 50.
  • the present invention provides a a printed circuit board pressing structure and a pressing method.
  • the pressing structure is formed by adding a conductive adhesive composed of a conductive particle and a resin adhesive between two circuit boards of a printed circuit board, and pressurizing and heating the conductive adhesive. In a way, the conductive particles are broken, and the parts with gold fingers on the two circuit boards are connected to achieve the purpose of signal communication between the boards.
  • the printed circuit board press-fit structure reduces the cost due to the addition of the connector, reduces the structural design difficulty, and reduces the cost of the soft-hard bonded board mode.
  • the technical solution of the present invention is as follows: a printed circuit board pressing structure,
  • the utility model comprises two circuit boards, wherein the two circuit boards are discontinuously provided with opposite gold fingers, and conductive glue composed of conductive particles and a resin adhesive is distributed between the two circuit boards, and the conductive plate is pressed and heated to make the conductive The particles are broken at the opposite positions of the gold fingers on the two circuit boards, and are pressed together to form a conduction, and the conductive particles at the position without the gold fingers are not broken and do not form conduction.
  • the conductive adhesive is an isogonal conductive adhesive, which is called Anisotropic Conductive Film, or ACF for short.
  • the glue is a semi-transparent polymer continuous material having the following three characteristics of conduction, conduction and insulation, and is electrically conductive in the Z direction, and is non-conductive in the X and Y directions, that is, vertical conduction and horizontal insulation.
  • the resin adhesive is a polyimide resin and a filler acrylic or epoxy resin.
  • the structure of the conductive particles includes an inner core, an intermediate layer and an outer layer,
  • the inner core is made of epoxy resin
  • the middle layer is made of metal or alloy
  • the outer layer is made of insulating coating, which is epoxy resin particles.
  • the conductive particles are 3 to 10 um, and the intermediate layer of the particles is made of metal powder nickel (Ni) or gold (Au). , gold plating on nickel, or silver tin alloy.
  • the two circuit boards are soft and soft boards, or soft boards and hard boards, or soft boards and glass.
  • the method for preparing the printed circuit board pressing structure comprises the following steps:
  • Step A) Take out the isogonal conductive paste stored at -5 to +5 °C, and let it stand naturally at room temperature for 1 hour;
  • Step B) Steps A) the resulting square conductive paste is pre-applied to one of the circuit boards to align the opposite gold fingers on the two circuit boards;
  • Step C) Pressurize the two boards to 0.2-0.3MPA and heat to 150-180 °C for 20-30 In seconds, the conductive particles of the isogonal conductive paste are ruptured at positions where there are gold fingers, and are pressed together to form a conduction, and the conductive particles at the position without the gold fingers are not broken, and no conduction is formed, that is, the printing is obtained.
  • the circuit board is pressed together.
  • the beneficial effects of the invention are: the printed circuit board pressing structure of the invention By adding a conductive paste composed of conductive particles and a resin adhesive between the gold fingers of the two circuit boards of the printed circuit board, the conductive particles are ruptured by heating and heating the conductive paste, and the two circuit boards are formed. The parts with the golden fingers are connected to achieve the purpose of signal communication between the boards.
  • the printed circuit board press-fit structure reduces the cost due to the addition of the connector, reduces the structural design difficulty, and reduces the cost of the soft-hard bonded board mode.
  • the preparation method is simple and suitable for popularization and application.
  • FIG. 1 is a schematic structural view of a printed circuit board according to the present invention before pressing.
  • Figure 2 is a printed circuit board press-fit structure according to the present invention.
  • Fig. 3 is a schematic view showing the structure of the conductive particles of the present invention.
  • a printed circuit board press-fit structure includes two circuit boards 1 and 2
  • the opposite gold fingers 3 are discontinuously disposed on the two circuit boards, and the conductive adhesives 6 composed of the conductive particles 4 and the resin adhesive 5 are distributed between the two circuit boards, and the conductive particles are pressed and heated by the circuit board.
  • the opposite positions of the gold fingers 3 on the two circuit boards are broken and pressed together to form a conduction, and the conductive particles 4 are not broken at the position without the gold fingers, and no conduction is formed.
  • the conductive adhesive is an isogonal conductive adhesive, referred to as ACF adhesive, and is called Anisotropic Conductive Film.
  • ACF adhesive is an isogonal conductive adhesive
  • Anisotropic Conductive Film The semi-transparent polymer continuous material having the following three characteristics of conduction, conduction and insulation is electrically conductive in the Z direction, and is non-conductive in the X and Y directions, that is, vertical conduction and horizontal insulation.
  • the resin adhesive is PI And filler acrylic.
  • the structure of the conductive particles 4 includes an inner core 41, an intermediate layer 42 and an outer layer 43.
  • the inner core is made of resin
  • the middle layer is metal
  • the outer layer is made of insulating coating.
  • the conductive particles are 3 um
  • the intermediate layer of the particles is made of gold on nickel.
  • the two circuit boards are a soft board and a soft board.
  • the method for preparing the printed circuit board pressing structure comprises the following steps:
  • Step A) Take out the conductive paste stored at -5 to +5 °C, and let it stand naturally at room temperature for 1 hour;
  • Step B) pre-applying the square conductive adhesive obtained in step A) to one of the circuit boards, and aligning the opposite gold fingers on the two circuit boards, see the figure. 2 ;
  • Step C) Pressurize the two boards to 0.2MPA and heat to 180 °C for 20 In seconds, the conductive particles of the isogonal conductive paste are ruptured at positions where there are gold fingers, and are pressed together to form a conduction, and the conductive particles at the position without the gold fingers are not broken, and no conduction is formed, that is, the printing is obtained.
  • the circuit board is pressed together.
  • a printed circuit board press-fit structure includes two circuit boards 1 and 2
  • the opposite gold fingers 3 are discontinuously disposed on the two circuit boards, and the conductive adhesives 6 composed of the conductive particles 4 and the resin adhesive 5 are distributed between the two circuit boards, and the conductive particles are pressed and heated by the circuit board.
  • the opposite positions of the gold fingers 3 on the two circuit boards are broken and pressed together to form a conduction, and the conductive particles 4 are not broken at the position without the gold fingers, and no conduction is formed.
  • the conductive adhesive is an isogonal conductive adhesive, referred to as ACF adhesive, and is called Anisotropic Conductive Film.
  • the semi-transparent polymer continuous material having the following three characteristics of conduction, conduction and insulation is electrically conductive in the Z direction, and is non-conductive in the X and Y directions, that is, vertical conduction and horizontal insulation.
  • the resin adhesive is PI And filler acrylic.
  • the structure of the conductive particles comprises an inner core, an intermediate layer and an outer layer, wherein the inner core is made of a resin material, the middle layer is a metal, and the outer layer is an insulating coating.
  • the conductive particles are 10um
  • the middle layer of the particles is made of gold on nickel.
  • the two circuit boards are a soft board and a soft board.
  • the method for preparing the printed circuit board pressing structure comprises the following steps:
  • Step A) Take out the conductive paste stored at -5 to +5 °C, and let it stand naturally at room temperature for 1 hour;
  • Step B) pre-applying the conductive adhesive obtained in step A) to one of the circuit boards, and aligning the opposite gold fingers on the two circuit boards, see FIG. ;
  • Step C) Pressurize the two boards to 0.3MPA and heat to 150 °C for 30 In seconds, the conductive particles of the isogonal conductive paste are ruptured at positions where there are gold fingers, and are pressed together to form a conduction, and the conductive particles at the position without the gold fingers are not broken, and no conduction is formed, that is, the printing is obtained.
  • the circuit board is pressed together.

Abstract

提供一种印刷线板压合结构，包括两块电路板（1，2），通过压合的方式使两块电路板（1，2）上的金手指（3）部位相接，所述金手指（3）之间分布有导电粒子（4）和树脂黏着剂（5）组成的导电胶（6），通过对导电胶（6）加压，加热，使导电粒子（4）在相互有金手指（3）的位置破裂，挤压在一起，形成导通，而无金手指（3）的位置导电粒子（4）不破裂，不形成导通。而印刷线路板（1，2）压合结构降低因为增加连接器而增加的成本，降低结构设计难度和降低了软硬结合板方式而增加的成本。

Description

一种印制线路板压合结构及压合方法
技术领域
本发明涉及 印制线路板技术领域，具体地，涉及一种印制线路板压合结构及压合方法。
背景技术
在当今一些通信数码产品中，印制线路板连接中，经常用连接器方式解决，或者是通过制作软硬结合板的形式达到互连。但是用连接器的方式，增加结构设计难度和连接器成本，而软硬结合板的方式虽然技术较成熟可靠，但软硬结合板因为制作工艺的限制，它的成本是单纯的硬板或者软板要贵出大概 50% 以上。
而成本往往是通信数码产品设计中必须面对的首要问题，无成本优势，就可能没有竞争优势。同时随之通信数码产品的轻薄化，结构设计难度越来越大，若增加连接器的使用，必然会牺牲产品厚度，强度以及难度。
发明内容
为此，本发明提供了一种 印制线路板压合结构及压合方法，该压合结构通过在印制电路板的两块电路板之间加入导电粒子和树脂黏着剂组成的导电胶，通过对导电胶加压、加热的方式，使导电粒子破裂，并使两电路板上有金手指的部位相接，以达到板间信号连通的目的。该印制线路板压合结构降低因为增加连接器而增加的成本，降低结构设计难度和降低了软硬结合板方式而增加的成本。
本发明的技术方案如下：一种印制线路板压合结构 , 包括两块电路板，两块电路板上不连续设有相对的金手指，两块电路板之间分布有导电粒子和树脂黏着剂组成的导电胶，通过对电路板加压、加热，使导电粒子在两块电路板上的金手指相对的位置破裂，挤压在一起，形成导通，而无金手指的位置导电粒子不破裂，不形成导通。
所述导电胶为异方形导电胶，全称为 Anisotropic Conductive Film ，简称 ACF 胶，为同时具有接着、导电、绝缘三特性之半透明高分子连续材料，其在 Z 方向上导电， X 、 Y 方向上不导电，即垂直导通、水平绝缘。
所述树脂黏着剂为聚酰亚胺树脂和填充物亚克力或环氧树脂。
所述导电粒子的结构包括内芯，中间层和外层，其 中内芯为环氧树脂材质，中间层为金属或合金，外层为绝缘涂层，为环氧树脂粒子。
所述导电粒子为 3 ～ 10um ，粒子的中间层材质为金属粉镍 (Ni) 、金 (Au) 、镍上镀金、或银锡合金。
所述两块电路板为软板和软板，或软板和硬板，或软板和玻璃。
所述的 印制线路板压合结构的制备方法，包括如下步骤：
步骤 A ）将存储于 -5 ～ +5 ℃ 的异方形导电胶取出，常温下自然放置 1 小时；步骤 B ）将步骤 A ）所得异方形导电胶预贴于其中一块电路板上，将两块电路板上相对的金手指对齐；
步骤 C ）对两块电路板加压至 0.2-0.3MPA 、加热至 150-180 ℃，持续 20-30 秒，使异方形导电胶的导电粒子在相互有金手指的位置破裂，挤压在一起，形成导通，而无金手指的位置导电粒子不破裂，不形成导通，即得到所述印制线路板压合结构。
本发明的有益效果为：本发明所述 印制线路板压合结构 通过在印制电路板的两块电路板的金手指之间加入导电粒子和树脂黏着剂组成的导电胶，通过对导电胶加压、加热的方式，使导电粒子破裂，并使两电路板上有金手指的部位相接，以达到板间信号连通的目的。该印制线路板压合结构降低因为增加连接器而增加的成本，降低结构设计难度和降低了软硬结合板方式而增加的成本。其制备方法简单，适于推广应用。
附图说明
图 1 、本发明所述印制线路板压合前结构示意图。
图 2 、本发明所述印制线路板压合结构。
图 3 、本发明所述导电粒子的结构示意图。
具体实施方式
实施例 1 ：
参照图 1 和图 2 ， 一种印制线路板压合结构 , 包括两块电路板 1 和 2 ，两块电路板上不连续设有相对的金手指 3 ，两块电路板之间分布有导电粒子 4 和树脂黏着剂 5 组成的导电胶 6 ，通过对电路板加压、加热，使导电粒子 4 在两块电路板上的金手指 3 相对的位置破裂，挤压在一起，形成导通，而无金手指的位置导电粒子 4 不破裂，不形成导通。
所述导电胶为异方形导电胶，简称 ACF 胶，全称为 Anisotropic Conductive Film ，为同时具有接着、导电、绝缘三特性之半透明高分子连续材料，其在 Z 方向上导电， X 、 Y 方向上不导电，即垂直导通、水平绝缘。所述树脂黏着剂为 PI 和填充物亚克力。
参照图 3 ， 所述导电粒子 4 的结构包括内芯 41 ，中间层 42 和外层 43 ，其中内芯为树脂材质，中间层为金属，外层为绝缘涂层。所述导电粒子为 3um ，粒子的中间层材质为镍上镀金。所述两块电路板为软板和软板。
所述的 印制线路板压合结构的制备方法，包括如下步骤：
步骤 A ）将存储于 -5 ～ +5 ℃ 的导电胶取出，常温下自然放置 1 小时；
步骤 B ）将步骤 A ）所得异方形导电胶预贴于其中一块电路板上，将两块电路板上相对的金手指对齐，参见图 2 ；
步骤 C ）对两块电路板加压至 0.2MPA 、加热至 180 ℃，持续 20 秒，使异方形导电胶的导电粒子在相互有金手指的位置破裂，挤压在一起，形成导通，而无金手指的位置导电粒子不破裂，不形成导通，即得到所述印制线路板压合结构。
实施例 2 ：
参照图 1 和图 2 ， 一种印制线路板压合结构 , 包括两块电路板 1 和 2 ，两块电路板上不连续设有相对的金手指 3 ，两块电路板之间分布有导电粒子 4 和树脂黏着剂 5 组成的导电胶 6 ，通过对电路板加压、加热，使导电粒子 4 在两块电路板上的金手指 3 相对的位置破裂，挤压在一起，形成导通，而无金手指的位置导电粒子 4 不破裂，不形成导通。
所述导电胶为异方形导电胶，简称 ACF 胶，全称为 Anisotropic Conductive Film ，为同时具有接着、导电、绝缘三特性之半透明高分子连续材料，其在 Z 方向上导电， X 、 Y 方向上不导电，即垂直导通、水平绝缘。所述树脂黏着剂为 PI 和填充物亚克力。所述导电粒子的结构包括内芯，中间层和外层，其中内芯为树脂材质，中间层为金属，外层为绝缘涂层。所述导电粒子为 10um ，粒子的中间层材质为镍上镀金。所述两块电路板为软板和软板。
所述的 印制线路板压合结构的制备方法，包括如下步骤：
步骤 A ）将存储于 -5 ～ +5 ℃ 的导电胶取出，常温下自然放置 1 小时；
步骤 B ）将步骤 A ）所得导电胶预贴于其中一块电路板上，将两块电路板上相对的金手指对齐，参见图 2 ；
步骤 C ）对两块电路板加压至 0.3MPA 、加热至 150 ℃，持续 30 秒，使异方形导电胶的导电粒子在相互有金手指的位置破裂，挤压在一起，形成导通，而无金手指的位置导电粒子不破裂，不形成导通，即得到所述印制线路板压合结构。
以上内容是结合具体的优选实施方式对本发明所作的进一步详细说明，不能认定本发明的具体实施只局限于这些说明。对于本发明所属技术领域的普通技术人员来说，在不脱离本发明构思的前提下，其架构形式能够灵活多变，可以派生系列产品。只是做出若干简单推演或替换，都应当视为属于本发明由所提交的权利要求书确定的专利保护范围。

Claims (7)

  1. 一种印制线路板压合结构 , 包括两块电路板，两块电路板上不连续设有相对的金手指，其特征在于，两块电路板之间分布有导电粒子和树脂黏着剂组成的导电胶，通过对电路板加压、加热，使导电粒子在两块电路板上的金手指相对的位置破裂，挤压在一起，形成导通，而无金手指的位置导电粒子不破裂，不形成导通。
  2. 如权利要求1所述的 印制线路板压合结构，其特征在于，所述导电胶为异方形导电胶，全称为 Anisotropic Conductive Film ，简称 ACF 胶，为同时具有接着、导电、绝缘三特性之半透明高分子连续材料，其在 Z 方向上导电， X 、 Y 方向上不导电，即垂直导通、水平绝缘。
  3. 如权利要求1所述的印制线路板压合结构，其特征在于，所述树脂黏着剂为聚酰亚胺树脂和填充物亚克力或环氧树脂。
  4. 如权利要求1所述的 印制线路板压合结构，其特征在于，所述导电粒子的结构包括内芯，中间层和外层，其 中内芯为环氧树脂材质，中间层为金属或合金，外层为绝缘涂层，为环氧树脂粒子。
  5. 如权利要求1所述的 印制线路板压合结构，其特征在于，所述导电粒子为 3 ～ 10um ，粒子的中间层材质为金属粉镍 (Ni) 、金 (Au) 、镍上镀金、或银锡合金。
  6. 如权利要求1所述的 印制线路板压合结构，其特征在于，所述两块电路板为软板和软板，或软板和硬板，或软板和玻璃。
  7. 如权利要求1所述的 印制线路板压合结构的制备方法，其特征在于，包括如下步骤：
    步骤 A ）将存储于 -5 ～ +5 ℃ 的导电胶取出，常温下自然放置 1 小时；
    步骤 B ）将步骤 A ）所得导电胶预贴于其中一块电路板上，将两块电路板上相对的金手指对齐；
    步骤 C ）对两块电路板加压至 0.2-0.3MPA 、加热至 150-180 ℃，持续 20-30 秒，使异方形导电胶的导电粒子在相互有金手指的位置破裂，挤压在一起，形成导通，而无金手指的位置导电粒子不破裂，不形成导通，即得到所述印制线路板压合结构。
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