WO2017201892A1 - 显示器、多段电路板及其制造方法 - Google Patents

显示器、多段电路板及其制造方法 Download PDF

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Publication number
WO2017201892A1
WO2017201892A1 PCT/CN2016/095768 CN2016095768W WO2017201892A1 WO 2017201892 A1 WO2017201892 A1 WO 2017201892A1 CN 2016095768 W CN2016095768 W CN 2016095768W WO 2017201892 A1 WO2017201892 A1 WO 2017201892A1
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WO
WIPO (PCT)
Prior art keywords
circuit board
film
wire
pad
segment
Prior art date
Application number
PCT/CN2016/095768
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English (en)
French (fr)
Inventor
黄笑宇
Original Assignee
深圳市华星光电技术有限公司
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Application filed by 深圳市华星光电技术有限公司 filed Critical 深圳市华星光电技术有限公司
Priority to US15/303,470 priority Critical patent/US20170347452A1/en
Publication of WO2017201892A1 publication Critical patent/WO2017201892A1/zh

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/148—Arrangements of two or more hingeably connected rigid printed circuit boards, i.e. connected by flexible means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/147—Structural association of two or more printed circuits at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1345—Conductors connecting electrodes to cell terminals
    • G02F1/13452—Conductors connecting driver circuitry and terminals of panels
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/368—Assembling printed circuits with other printed circuits parallel to each other
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10128—Display
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10287—Metal wires as connectors or conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10363—Jumpers, i.e. non-printed cross-over connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits

Definitions

  • the present invention relates to the field of circuit boards for displays, and more particularly to a display, a multi-segment circuit board, and a method of fabricating the same.
  • TFT-LCD Thin Film Transistor Liquid Crystal Display, thin film transistor liquid crystal display
  • the main driving principle of TFT-LCD is: the system board connects R/G/B compression signal, control signal and power through the wire to the connector on the PCB circuit board, and the data passes through TCON on the PCB circuit board (Timing After the IC (chip) is processed, it is connected to the display area via the PCB circuit board, so that the LCD obtains the required power and signals.
  • the technical problem to be solved by the present invention is to provide a display, a multi-segment circuit board and a manufacturing method thereof, which can save the manufacturing cost of a multi-segment circuit board.
  • a technical solution adopted by the present invention is to provide a multi-segment circuit board including at least a first circuit board, a second circuit board, and a connection for connecting the first circuit board and the second circuit board.
  • the wire film, the wire film comprises two films and at least one wire encapsulated between the two films, the first circuit board and the second circuit board are connected by at least one wire, and the film is a film substrate of a COF flip chip.
  • the multi-segment circuit board further includes a conductive colloid, and two ends of the wire film are respectively connected to the first circuit board and the second circuit board through the conductive colloid.
  • the conductive colloid is an anisotropic conductive film, and the anisotropic conductive film is respectively adhered to both ends of the wire film.
  • the anisotropic conductive film comprises a resin and conductive particles, and the wires transmit signals to the first circuit board and the second circuit board through the conductive particles, respectively.
  • the first circuit board is provided with at least one first pad
  • the second circuit board is provided with at least one second pad
  • the first pad is connected to the corresponding second pad by a wire.
  • another technical solution adopted by the present invention is to provide a method for manufacturing a multi-segment circuit board, which comprises: packaging at least one wire between two films to form a wire film, and providing at least a a circuit board and a second circuit board, wherein the film is a film substrate of a COF flip chip; the first circuit board and the second circuit board are connected by using a wire film, and at least one wire is to be the first circuit board and the second circuit board Board connection.
  • connecting the first circuit board and the second circuit board by using the wire film, and connecting the first circuit board and the second circuit board by the at least one wire comprises: passing the two ends of the wire film through the conductive glue and the first circuit respectively The board is connected to the second board.
  • the connecting the two ends of the wire film to the first circuit board and the second circuit board through the conductive adhesive body respectively comprises: bonding the two ends of the wire film to the first circuit board and the second circuit board by using the anisotropic conductive film Hehe.
  • a display including a multi-segment circuit board including at least a first circuit board, a second circuit board, and a first circuit board and a The wire film of the two circuit board, the wire film comprises two films and at least one wire encapsulated between the two films, the first circuit board and the second circuit board are connected by at least one wire, and the film is a COF flip chip Film substrate.
  • the multi-segment circuit board further includes a conductive colloid, and two ends of the wire film are respectively connected to the first circuit board and the second circuit board through the conductive colloid.
  • the conductive colloid is an anisotropic conductive film, and the anisotropic conductive film is respectively adhered to both ends of the wire film.
  • the anisotropic conductive film comprises a resin and conductive particles, and the wires transmit signals to the first circuit board and the second circuit board through the conductive particles, respectively.
  • the first circuit board is provided with at least one first pad
  • the second circuit board is provided with at least one second pad
  • the first pad is connected to the corresponding second pad by a wire.
  • the present invention provides a multi-segment circuit board including at least a first circuit board, a second circuit board, and a wire film for connecting the first circuit board and the second circuit board.
  • the wire film comprises two films and at least one wire encapsulated between the two films, the first circuit board and the second circuit board are connected by at least one wire, and the film is a film substrate of a COF flip chip, which is covered by COF.
  • the film substrate of the crystalline film and the wires encapsulated therein are connected to the first circuit board and the second circuit board, which can save the cost of the connector and the FFC flexible cable, and can save the manufacturing cost of the multi-segment circuit board.
  • FIG. 1 is a schematic structural view of a preferred embodiment of a multi-segment circuit board of the present invention
  • Figure 2 is a cross-sectional view showing the A-A direction of the wire film of the present invention.
  • Figure 3 is a schematic cross-sectional view of the wire film of the present invention in the B-B direction;
  • FIG. 4 is a flow chart of a preferred embodiment of a method of fabricating a multi-segment circuit board of the present invention.
  • FIG. 1 is a schematic structural view of a preferred embodiment of a multi-segment circuit board according to the present invention.
  • the multi-segment circuit board includes: a first circuit board 11 and a second circuit board 12, a wire film 13 and a conductive paste 14.
  • the wire film 13 is used to connect the first circuit board 11 and the second circuit board 12.
  • FIG. 2 is a schematic cross-sectional view of the wire film of the present invention in the A-A direction.
  • the wire film 13 includes two films 131 and at least one wire 132 enclosed between the two films 131.
  • the first circuit board 11 and the second circuit board 12 are connected and electrically connected by the at least one wire 132, and the film 131 is COF (chip On film, a film-coated film.
  • the number of the wires 132 is preferably three, and may be other numbers in other embodiments.
  • the multi-segment circuit board preferably includes only the first circuit board 11 and the second circuit board 12, and may further include a third circuit board (not shown) and a fourth circuit board (not shown in other embodiments). And so on, or include a larger number of boards, these boards can also be connected by a similar wire film.
  • the multi-segment circuit board includes four circuit boards, the first circuit board 11 and the second circuit board 12 are connected to each other through the wires 132 of the wire film 13, and the second circuit board and the third circuit board are connected by a wire film.
  • the third circuit board and the fourth circuit board are connected by a wire film connection.
  • the first circuit board 11 is provided with at least one first pad 111
  • the second circuit board 12 is provided with at least one second pad 121.
  • the first pad 111 is connected and electrically connected to the corresponding second pad 121 through the wire 132. .
  • FIG. 3 is a cross-sectional view of the wire film of the present invention in the B-B direction.
  • both ends of the wire film 13 are connected to the first circuit board 11 and the second circuit board 12 through the conductive paste 14 respectively.
  • the conductive paste 14 is an anisotropic conductive film 14, that is, ACF (Anisotropic Conductive Film, an anisotropic conductive film), the anisotropic conductive film 14 is bonded to both ends of the wire film 13, respectively.
  • the wire 132 is electrically connected to the first pad 111 or the second pad 121 through the conductive paste 14 , and the two ends of the wire film 13 are respectively fixed to the first circuit board 11 and the second circuit board 12 through the conductive paste 14 .
  • the first circuit board 11 and the second circuit board 12 are turned on, and on the other hand, the first circuit board 11 and the second circuit board 12 are flexibly connected together by the wire film 13.
  • the wire 132 and the first pad 111 as an example, the film 131 of the wire film 13 adjacent to the first pad 111 is provided with an opening 15 corresponding to the first pad 111, and the opening 15 partially exposes the wire 132.
  • the conductive film 14 is in contact with the exposed portion of the wire 132 on one side, and is in contact with the first pad 111 on the other side, thereby electrically connecting the wire 132 to the first pad 111.
  • the wire film 13 is first cleaned near the surface of the film 131 of the first pad 111, and then attached to the first circuit board 11 through the anisotropic conductive film 14, and then pressed.
  • the wire 132 is similar to the case of the second pad 121 and will not be described herein.
  • the wires 132 packaged between the same two films 131 are a plurality of side by side, for example, three in parallel in this embodiment, since the anisotropic conductive film 14 is non-conductive in a direction parallel to the surface of the board, The conduction is performed only in a direction perpendicular to the board, and therefore, the plurality of wires 132 are not short-circuited to each other, and the conduction between the wires 132 and the first pads 111 and the second pads 121 is not affected.
  • the conductive paste 14 may also be other conductive pastes 14.
  • the anisotropic conductive film 14 includes a resin and conductive particles, and the wires 132 transmit signals to the first circuit board 11 and the second circuit board 12 through the conductive particles, respectively.
  • FIG. 4 is a flow chart of a preferred embodiment of a method for fabricating a multi-segment circuit board of the present invention.
  • the method of manufacturing the multi-segment circuit board includes the following steps:
  • Step S11 Forming at least one wire between the two films to form a wire film, and providing at least a first circuit board and a second circuit board.
  • the film 131 is a film substrate of a COF flip chip. Encapsulating at least one of the wires 132 between the two films 131 to form the wire film 13 includes pressing at least one wire 132 between the two films 131 to form a wire film 13.
  • Step S12 connecting the first circuit board and the second circuit board by using a wire film, and connecting at least one wire to connect the first circuit board and the second circuit board.
  • step S12 the first circuit board 11 and the second circuit board 12 are connected by the wire film 13, and the connection of the first circuit board 11 and the second circuit board 12 by at least one wire 132 includes: the wire film 13 Both ends are connected to the first circuit board 11 and the second circuit board 12 through the conductive paste 14 respectively.
  • connecting the two ends of the wire film 13 to the first circuit board 11 and the second circuit board 12 through the conductive paste 14 respectively comprises: respectively, respectively, the two ends of the wire film 13 and the first circuit by using the anisotropic conductive film 14 The board 11 and the second circuit board 12 are attached.
  • the first circuit board 11 is provided with at least one first pad 111
  • the second circuit board 12 is provided with at least one second pad 121
  • the two ends of the wire film 13 are respectively connected to the first circuit board 11 and the second circuit board 12.
  • the specific process of bonding may include: cleaning the surface of the wire film 13 at which the film 131 of the wire film 13 adjacent to the first pad 111 and the second pad 121 corresponds to the first pad 111 and the second pad 121
  • An opening 15 is formed respectively, and the opening 15 partially exposes the wire 132; the two ends of the wire film 13 are respectively attached to the first circuit board 11 and the second circuit board 12 through the anisotropic conductive film 14, and the wire film 13 is Both ends are pressed together with the first circuit board 11 and the second circuit board 12.
  • the embodiment of the present invention further provides a display comprising the multi-segment circuit board described in any one of the above embodiments.
  • the display is a curved display.
  • the display includes other parts in addition to the multi-segment circuit board, such as a display panel, a backlight module, and the like.
  • the above multi-segment circuit board can be used for other displays in addition to curved displays. The invention is not limited thereto.
  • the present invention provides a multi-segment circuit board comprising at least a first circuit board, a second circuit board, and a wire film for connecting the first circuit board and the second circuit board, the wire film comprising two films and being packaged between the two films At least one wire, the first circuit board and the second circuit board are connected by at least one wire, the film is a film substrate of a COF flip chip, and the film substrate of the COF flip chip is connected with the wire encapsulated therein.
  • the circuit board and the second circuit board can save the cost of the connector and the FFC flexible cable, and can save the manufacturing cost of the multi-segment circuit board.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Nonlinear Science (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Chemical & Material Sciences (AREA)
  • Mathematical Physics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Combinations Of Printed Boards (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Wire Bonding (AREA)
  • Liquid Crystal (AREA)

Abstract

提供了一种显示器、多段电路板及其制造方法，该多段电路板至少包括第一电路板（11）、第二电路板（12）以及用于连接第一电路板和第二电路板的导线薄膜（13），导线薄膜包括两张薄膜（131）和封装在两张薄膜之间的至少一根导线（132），第一电路板和第二电路板通过至少一根导线连接，薄膜为COF覆晶薄膜的薄膜基材。还提供了一种显示器和一种多段电路板的制造方法。通过上述方式，能够节省多段电路板的制造成本。

Description

显示器、多段电路板及其制造方法
【技术领域】
本发明涉及显示器的电路板技术领域，特别是涉及一种显示器、多段电路板及其制造方法。
【背景技术】
TFT-LCD（Thin Film Transistor Liquid Crystal Display，薄膜晶体管液晶显示器）是当前平板显示的主要品种之一，已经成为了现代IT、视讯产品中重要的显示平台。TFT-LCD的主要驱动原理为：系统主板将R/G/B压缩信号、控制信号及动力通过线材与PCB电路板上的连接器相连接，数据经过PCB电路板上的TCON（Timing Controller，时序控制器）IC（芯片）处理后，经PCB电路板与显示区连接，从而使得LCD获得所需的电源、信号。
随着曲面电视的普及，TFT-LCD的曲面应用日趋增多，因为面板的弯曲，可能会造成PCB电路板上的元件脱焊等不良现象。为了避免PCB电路板弯曲造成的不良，一种解决方案为将PCB分为多段，再通过连接器和FFC（排线）将各段PCB电路板进行连接。而这些连接器和排线的成本通常较高，不利于成本控制。
因此，需要提供一种显示器、多段电路板及其制造方法，以解决上述技术问题。
【发明内容】
本发明主要解决的技术问题是提供一种显示器、多段电路板及其制造方法，能够节省多段电路板的制造成本。
为解决上述技术问题，本发明采用的一个技术方案是：提供一种多段电路板，多段电路板至少包括第一电路板、第二电路板以及用于连接第一电路板和第二电路板的导线薄膜，导线薄膜包括两张薄膜和封装在两张薄膜之间的至少一根导线，第一电路板和第二电路板通过至少一根导线连接，薄膜为COF覆晶薄膜的薄膜基材。
其中，多段电路板进一步包括导电胶体，导线薄膜的两端分别通过导电胶体与第一电路板和第二电路板连接。
其中，导电胶体为异方性导电胶膜，异方性导电胶膜分别与导线薄膜的两端进行贴合。
其中，异方性导电胶膜包括树脂和导电粒子，导线通过导电粒子分别与第一电路板和第二电路板传输信号。
其中，第一电路板设置有至少一个第一焊盘，第二电路板设置有至少一个第二焊盘，第一焊盘通过导线与对应的第二焊盘连接。
为解决上述技术问题，本发明采用的另一个技术方案是：提供一种多段电路板的制造方法，制造方法包括：将至少一根导线封装在两张薄膜之间形成导线薄膜，并提供至少第一电路板和第二电路板，其中薄膜为COF覆晶薄膜的薄膜基材；利用导线薄膜将第一电路板和第二电路板连接，并使至少一根导线将第一电路板和第二电路板连接。
其中，将至少一根导线封装在两张薄膜之间形成导线薄膜包括：将至少一根导线压合在两张薄膜之间形成导线薄膜。
其中，利用导线薄膜将第一电路板和第二电路板连接，并使至少一根导线将第一电路板和第二电路板连接包括：将导线薄膜的两端分别通过导电胶体与第一电路板和第二电路板连接。
其中，将导线薄膜的两端分别通过导电胶体与第一电路板和第二电路板连接包括：利用异方性导电胶膜将导线薄膜的两端分别与第一电路板和第二电路板贴合。
为解决上述技术问题，本发明采用的又一个技术方案是：提供一种显示器包括多段电路板，该多段电路板至少包括第一电路板、第二电路板以及用于连接第一电路板和第二电路板的导线薄膜，导线薄膜包括两张薄膜和封装在两张薄膜之间的至少一根导线，第一电路板和第二电路板通过至少一根导线连接，薄膜为COF覆晶薄膜的薄膜基材。
其中，多段电路板进一步包括导电胶体，导线薄膜的两端分别通过导电胶体与第一电路板和第二电路板连接。
其中，导电胶体为异方性导电胶膜，异方性导电胶膜分别与导线薄膜的两端进行贴合。
其中，异方性导电胶膜包括树脂和导电粒子，导线通过导电粒子分别与第一电路板和第二电路板传输信号。
其中，第一电路板设置有至少一个第一焊盘，第二电路板设置有至少一个第二焊盘，第一焊盘通过导线与对应的第二焊盘连接。
本发明的有益效果是：区别于现有技术的情况，本发明通过设置多段电路板至少包括第一电路板、第二电路板以及用于连接第一电路板和第二电路板的导线薄膜，导线薄膜包括两张薄膜和封装在两张薄膜之间的至少一根导线，第一电路板和第二电路板通过至少一根导线连接，薄膜为COF覆晶薄膜的薄膜基材，利用COF覆晶薄膜的薄膜基材和封装在其中的导线连接第一电路板和第二电路板，可以节省连接器及FFC柔性电缆的成本，能够节省多段电路板的制造成本。
【附图说明】
图1是本发明多段电路板优选实施例的结构示意图；
图2是本发明导线薄膜的A-A方向横截面示意图；
图3是本发明导线薄膜的B-B方向横截面示意图；
图4是本发明多段电路板的制造方法优选实施例的流程图。
【具体实施方式】
请参阅图1，图1是本发明多段电路板优选实施例的结构示意图。在本实施例中，多段电路板包括：第一电路板11和第二电路板12、导线薄膜13以及导电胶体14。
导线薄膜13用于连接第一电路板11和第二电路板12。
请进一步参阅图2，图2是本发明导线薄膜的A-A方向横截面示意图。导线薄膜13包括两张薄膜131和封装在两张薄膜131之间的至少一根导线132，第一电路板11和第二电路板12通过该至少一根导线132连接并导通，薄膜131为COF（chip on film，覆晶薄膜）覆晶薄膜的薄膜基材。如图1和图2所示，在本实施例中，导线132优选为三根，在其他实施例中也可以为其他数量。
在本实施例中，多段电路板优选为仅包括第一电路板11和第二电路板12，在其他实施例中还可以包括第三电路板（图未示）、第四电路板（图未示）等等，或者包括更多个数的电路板，这些电路板之间也可以是用类似的导线薄膜连接。例如，当多段电路板包括四个电路板时，第一电路板11和第二电路板12之间通过导线薄膜13的导线132连接导通，第二电路板和第三电路板通过导线薄膜连接导通，第三电路板和第四电路板通过导线薄膜连接导通。
第一电路板11设置有至少一个第一焊盘111，第二电路板12设置有至少一个第二焊盘121，第一焊盘111通过导线132与对应的第二焊盘121连接并导通。
请进一步参阅图3，图3是本发明导线薄膜的B-B方向横截面示意图。优选地，导线薄膜13的两端分别通过导电胶体14与第一电路板11和第二电路板12连接。更为优选地，导电胶体14为异方性导电胶膜14，即ACF (Anisotropic Conductive Film，异方性导电胶膜)，异方性导电胶膜14分别与导线薄膜13的两端进行贴合。导线132与第一焊盘111或者第二焊盘121通过导电胶体14导通，同时，导线薄膜13的两端分别与第一电路板11和第二电路板12通过导电胶体14贴合固定，一方面导通第一电路板11和第二电路板12，另一方面第一电路板11和第二电路板12通过导线薄膜13柔性连接在一起。以导线132与第一焊盘111为例来说，导线薄膜13靠近第一焊盘111的薄膜131在对应于第一焊盘111处设置有开口15，开口15将导线132部分外露，异方性导电胶膜14一面与导线132外露的部分接触，另一面与第一焊盘111接触，从而将导线132与第一焊盘111导通。在本实施例中，先将导线薄膜13靠近第一焊盘111的薄膜131表面进行清洗，然后通过异方性导电胶膜14与第一电路板11进行贴附，然后进行压合。导线132与第二焊盘121的情况类似，此处不再赘述。
当封装在同样两张薄膜131之间的导线132为并排的多根时，例如在本实施例中为并排的三根，由于异方性导电胶膜14在平行于电路板表面的方向不导电，仅在垂直于电路板的方向上导电，因此，多根导线132之间彼此不会短路，且又不影响导线132与第一焊盘111和第二焊盘121之间的导通。在其他实施例中，导电胶体14还可以是其他的导电胶体14。
优选地，异方性导电胶膜14包括树脂和导电粒子，导线132通过导电粒子分别与第一电路板11和第二电路板12传输信号。
请参阅图4，图4是本发明多段电路板的制造方法优选实施例的流程图。在本实施例中，多段电路板的制造方法包括以下步骤：
步骤S11：将至少一根导线封装在两张薄膜之间形成导线薄膜，并提供至少第一电路板和第二电路板。
在步骤S11中，薄膜131为COF覆晶薄膜的薄膜基材。将至少一根导线132封装在两张薄膜131之间形成导线薄膜13包括：将至少一根导线132压合在两张薄膜131之间形成导线薄膜13。
步骤S12：利用导线薄膜将第一电路板和第二电路板连接，并使至少一根导线将第一电路板和第二电路板连接。
在步骤S12中，利用导线薄膜13将第一电路板11和第二电路板12连接，并使至少一根导线132将第一电路板11和第二电路板12连接包括：将导线薄膜13的两端分别通过导电胶体14与第一电路板11和第二电路板12连接。优选地，将导线薄膜13的两端分别通过导电胶体14与第一电路板11和第二电路板12连接包括：利用异方性导电胶膜14将导线薄膜13的两端分别与第一电路板11和第二电路板12贴合。第一电路板11设置有至少一个第一焊盘111，第二电路板12设置有至少一个第二焊盘121，将导线薄膜13的两端分别与第一电路板11和第二电路板12贴合的具体流程可以包括：对导线薄膜13表面进行清洗，在导线薄膜13靠近第一焊盘111和第二焊盘121的薄膜131在对应于第一焊盘111和第二焊盘121处分别形成开口15，开口15将导线132部分外露；将导线薄膜13的两端分别通过异方性导电胶膜14贴附在第一电路板11和第二电路板12上，将导线薄膜13的两端与第一电路板11和第二电路板12压合。
本发明实施例还提供一种显示器包括上述任意一个实施例所描述的多段电路板，优选地，显示器为曲面显示器。可以理解显示器除了包括多段电路板还包括其他的部分，例如显示面板、背光模组等。上述多段电路板除了应用于曲面显示器，也可以用于其他的显示器。本发明对此不做限定。
本发明通过设置多段电路板至少包括第一电路板、第二电路板以及用于连接第一电路板和第二电路板的导线薄膜，导线薄膜包括两张薄膜和封装在两张薄膜之间的至少一根导线，第一电路板和第二电路板通过至少一根导线连接，薄膜为COF覆晶薄膜的薄膜基材，利用COF覆晶薄膜的薄膜基材和封装在其中的导线连接第一电路板和第二电路板，可以节省连接器及FFC柔性电缆的成本，能够节省多段电路板的制造成本。
以上所述仅为本发明的实施方式，并非因此限制本发明的专利范围，凡是利用本发明说明书及附图内容所作的等效结构或等效流程变换，或直接或间接运用在其他相关的技术领域，均同理包括在本发明的专利保护范围内。

Claims (14)

  1. 一种多段电路板，其中，所述多段电路板至少包括第一电路板、第二电路板以及用于连接所述第一电路板和所述第二电路板的导线薄膜，所述导线薄膜包括两张薄膜和封装在所述两张薄膜之间的至少一根导线，所述第一电路板和所述第二电路板通过所述至少一根导线连接，所述薄膜为COF覆晶薄膜的薄膜基材。
  2. 根据权利要求1所述的多段电路板，其中，所述多段电路板进一步包括导电胶体，所述导线薄膜的两端分别通过所述导电胶体与所述第一电路板和所述第二电路板连接。
  3. 根据权利要求2所述的多段电路板，其中，所述导电胶体为异方性导电胶膜，所述异方性导电胶膜分别与所述导线薄膜的两端进行贴合。
  4. 根据权利要求3所述的多段电路板，其中，所述异方性导电胶膜包括树脂和导电粒子，所述导线通过所述导电粒子分别与所述第一电路板和所述第二电路板传输信号。
  5. 根据权利要求1所述的多段电路板，其中，所述第一电路板设置有至少一个第一焊盘，所述第二电路板设置有至少一个第二焊盘，所述第一焊盘通过所述导线与对应的所述第二焊盘连接。
  6. 一种多段电路板的制造方法，其中，所述制造方法包括：
    将至少一根导线封装在两张薄膜之间形成导线薄膜，并提供至少第一电路板和第二电路板，其中所述薄膜为COF覆晶薄膜的薄膜基材；
    利用所述导线薄膜将所述第一电路板和所述第二电路板连接，并使所述至少一根导线将所述第一电路板和所述第二电路板连接。
  7. 根据权利要求6所述的制造方法，其中，所述将至少一根导线封装在两张薄膜之间形成导线薄膜包括：
    将至少一根导线压合在两张薄膜之间形成导线薄膜。
  8. 根据权利要求6所述的制造方法，其中，利用所述导线薄膜将所述第一电路板和所述第二电路板连接，并使所述至少一根导线将所述第一电路板和所述第二电路板连接包括：
    将导线薄膜的两端分别通过导电胶体与所述第一电路板和第二电路板连接。
  9. 根据权利要求8所述的制造方法，其中，将导线薄膜的两端分别通过导电胶体与所述第一电路板和所述第二电路板连接包括：
    利用异方性导电胶膜将导线薄膜的两端分别与所述第一电路板和所述第二电路板贴合。
  10. 一种显示器，其中，所述显示器包括多段电路板，所述多段电路板至少包括第一电路板、第二电路板以及用于连接所述第一电路板和所述第二电路板的导线薄膜，所述导线薄膜包括两张薄膜和封装在所述两张薄膜之间的至少一根导线，所述第一电路板和所述第二电路板通过所述至少一根导线连接，所述薄膜为COF覆晶薄膜的薄膜基材。
  11. 根据权利要求10所述的显示器，其中，所述多段电路板进一步包括导电胶体，所述导线薄膜的两端分别通过所述导电胶体与所述第一电路板和所述第二电路板连接。
  12. 根据权利要求11所述的显示器，其中，所述导电胶体为异方性导电胶膜，所述异方性导电胶膜分别与所述导线薄膜的两端进行贴合。
  13. 根据权利要求12所述的显示器，其中，所述异方性导电胶膜包括树脂和导电粒子，所述导线通过所述导电粒子分别与所述第一电路板和所述第二电路板传输信号。
  14. 根据权利要求10所述的显示器，其中，所述第一电路板设置有至少一个第一焊盘，所述第二电路板设置有至少一个第二焊盘，所述第一焊盘通过所述导线与对应的所述第二焊盘连接。
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