WO2019200654A1 - 显示面板及其显示装置 - Google Patents

显示面板及其显示装置 Download PDF

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Publication number
WO2019200654A1
WO2019200654A1 PCT/CN2018/087851 CN2018087851W WO2019200654A1 WO 2019200654 A1 WO2019200654 A1 WO 2019200654A1 CN 2018087851 W CN2018087851 W CN 2018087851W WO 2019200654 A1 WO2019200654 A1 WO 2019200654A1
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WO
WIPO (PCT)
Prior art keywords
binding
pad
pad unit
bonding pad
concave
Prior art date
Application number
PCT/CN2018/087851
Other languages
English (en)
French (fr)
Inventor
周阳
Original Assignee
武汉华星光电半导体显示技术有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 武汉华星光电半导体显示技术有限公司 filed Critical 武汉华星光电半导体显示技术有限公司
Priority to US16/114,172 priority Critical patent/US10546912B2/en
Publication of WO2019200654A1 publication Critical patent/WO2019200654A1/zh

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/131—Interconnections, e.g. wiring lines or terminals

Definitions

  • the present application relates to the field of display technologies, and in particular, to a display panel and a display device thereof.
  • the screen of an OLED display panel is simply divided into an active area (active area, Abbreviated as "AA”) and peripheral lead bonding ("OLB”), where the binding area exists in the OLB area (Bonding) Pad).
  • the peripheral circuit includes an integrated circuit IC, a flip chip COF, a flexible circuit board FPC or a printed circuit board PCB, and is bound to a corresponding binding area of the display panel by an anisotropic conductive film ACF, thereby realizing an external signal pair of the peripheral circuit. Displays the display control of the screen display area.
  • the binding pad of the binding area is designed for the binding process, two main factors are considered: 1.
  • the spacing between the two regions; the area of the overlapping area overlap needs to be large enough to capture more conductive particles, so that the upper and lower electrodes are turned on, and the spacing between the pad pads is large enough to make the adjacent bonding pad Pad There will be no short circuit between.
  • the binding pad Pad shape and arrangement widely used in the binding area of the OLED display screen are usually regular rectangles, and such a binding pad Pad if you want to form a small pin center distance Fine
  • the pitch design brings great challenges and challenges to the process and design of the display panel.
  • the present application provides a display panel and a display device thereof, which can increase the overlapping area of the display panel and the peripheral circuit, and ensure the spacing between the bonding pads, thereby effectively improving the production yield of the bonding process and reducing the cost.
  • a technical solution adopted by the present application is to provide a display device, the display device including the display panel including a display area and a non-display area disposed around the display area, the non-display area a binding area including a peripheral circuit, wherein the binding pad of the binding area includes a binding pad body, a first binding pad unit and a second binding pad unit disposed on opposite sides of the binding pad body, Wherein the side of the first binding pad unit and the second binding pad unit facing away from the binding pad body is set as a concave and convex edge, and the first binding pad unit and the second binding layer
  • the concave and convex edges of the fixing pad unit are alternately disposed; wherein the concave and convex edge has a shape of a square shape, a zigzag shape or a wave shape, the display panel further includes a flexible circuit board, and the flexible circuit board is coupled with the The zone is bound, and the flexible circuit board is electrically connected to the binding pad.
  • a display panel the display panel includes a display area and a non-display area disposed around the display area, and the non-display area includes a peripheral circuit.
  • a binding pad wherein the binding pad of the binding zone comprises a binding pad body, a first binding pad unit and a second binding pad unit disposed on opposite sides of the binding pad body, wherein a side of the first binding pad unit and the second binding pad unit facing away from the binding pad body is disposed as a concave and convex edge, and the first binding pad unit and the second binding pad unit
  • the bump edges are alternately set.
  • a display device including a display panel, the display panel including a display area and a non-display area disposed around the display area,
  • the non-display area includes a binding area of the peripheral circuit; wherein the binding pad of the binding area includes a binding pad body, a first binding pad unit disposed on both sides of the binding pad body, and a second binding a padding unit, wherein a side of the first pad unit and the second pad unit facing away from the binding pad body is disposed as a concave and convex edge, and the first bonding pad unit and the The concave and convex edges of the second binding pad unit are alternately arranged.
  • the utility model has the beneficial effects that the display panel and the display device thereof are provided, and the surface of the overlapping area of the display panel and the peripheral circuit can be increased by the embossing processing of the binding pad of the binding area, and the binding pad is ensured.
  • the spacing between the two can effectively improve the production yield of the bonding process and reduce the cost.
  • FIG. 1 is a schematic structural view of a first embodiment of a display panel of the present application
  • FIG. 2 is a schematic structural view of an embodiment of a binding zone of FIG. 1;
  • FIG. 3 is a schematic structural view of an embodiment of the binding pad of FIG. 1;
  • FIG. 4 is a schematic structural view of the binding pad of FIG. 1 when pressed together with a peripheral circuit
  • FIG. 5 is a schematic structural view of a binding pad in a second embodiment of the display panel of the present application.
  • FIG. 6 is a schematic structural view of a binding pad in a third embodiment of the display panel of the present application.
  • FIG. 7 is a schematic structural view of a fourth embodiment of a display panel of the present application.
  • FIG. 8 is a schematic structural view of an embodiment of a display device of the present application.
  • FIG. 1 is a schematic structural view of a first embodiment of a display panel of the present application
  • FIG. 2 is a schematic structural view of a binding area of FIG. 1
  • FIG. 3 is a schematic structural view of the binding pad of FIG. 4 is a schematic structural view of the binding pad of FIG. 1 when pressed together with a peripheral circuit.
  • the display panel 10 includes a display area AA and a non-display area 12 disposed around the display area, and the non-display area 12 includes a binding area 13 of the peripheral circuit 14.
  • the binding pad 103 of the binding area 13 includes a binding pad body 130, a first binding pad unit 110 and a second binding pad unit 120 disposed on opposite sides of the binding pad body 130, wherein the first binding The side faces of the pad unit 110 and the second pad unit 120 facing away from the pad body 130 are disposed as concave and convex edges, and the concave and convex edges of the first pad unit 110 and the second pad unit 120 are alternately disposed.
  • the binding area 13 is disposed below the display area AA, and the first binding pad unit 110 and the second binding pad unit 120 are respectively disposed on the left and right sides of the binding pad main body 130, but are not for the present application. limited.
  • the overlap area of the display panel 100 in contact with the peripheral circuit 14 can be increased, and the spacing between the bonding pads 103 can be ensured, thereby effectively improving the binding. Production yield of the process, reducing costs.
  • the first binding pad unit 110 includes a plurality of first convex bonding pad units 111 and a plurality of first concave bonding pad units 112, and the second bonding pad unit 120 includes a plurality of second convex portions. a bonding pad unit 121 and a plurality of second concave bonding pad units 122; wherein the first convex bonding pad unit 111 and the second concave bonding pad unit 122 are equal in number, the first concave bonding pad unit 112 and the first The number of the two convex bond pad units 121 is equal.
  • the number of the first convex bond pad unit 111 and the first concave bond pad unit 112 are equal or unequal, and the number thereof may be odd or even.
  • the number of the first convex bonding pad unit 111 and the first concave bonding pad unit 112 are not equal, but may be preferably equal in number, depending on the length of the binding piece and the first convex bonding pad. The ratio of the length of the unit is determined and will not be described here.
  • the first convex bonding pad unit 111 and the first concave bonding pad unit 112 have the same length, and the first bonding pad unit 110 and the second bonding pad unit 120 have the same width.
  • the binding area 130 includes a plurality of bonding pads 103, wherein the spacing between the first bonding pad unit 110 of the plurality of bonding pads 103 and the second bonding pad unit 120 of the adjacent bonding pads is equal. More specifically, the spacing or distance between the first concave bonding pad unit 112 of the plurality of bonding pads 103 and the second convex bonding pad unit 121 of the adjacent bonding pad 103 is equal, so that the adjacent bonding pads The spacing between them is not affected by the embossing.
  • the present application exemplifies the shape of the concave and convex edges of the binding pad 103 as a square shape compared with the rectangular binding pad in the prior art.
  • the width of the bonding pad 103 is d1
  • the spacing between the bonding pads 103 is d2
  • the width of the bonding pad of the peripheral circuit is b
  • the width of the peripheral circuit and the bonding pad is not bonded
  • the binding is
  • the length of the pad 103 is L; in the case where the width d1 and the spacing d2 of the bonding pad are not changed, the area of the overlapping area of the rectangular bonding pad in the prior art is:
  • the area of the overlap area of the binding pad of the present application is:
  • S2 L*(b-a)+S ⁇ , where S ⁇ is the convex edge area of the binding pad 103 side, and S ⁇ >0;
  • the width of the binding pad 103 is d1
  • the width of the binding pad body 130 is d13
  • the width of the first bonding pad unit 110 is d11
  • the width of the second bonding pad unit 120 is d12
  • the range of the width d11 of the binding pad main body 130 can be set to 20%d1 ⁇ d11 ⁇ 50%d1; further, the range of the width d11 of the binding pad main body 130 is set to 30%d1 ⁇ d11 ⁇ 40%. D1.
  • the area of the overlap area of the binding pad of the present application is:
  • the solution of the present application can increase the area of the overlap area of the display panel 100 in contact with the peripheral circuit 14 to about 50%, greatly increasing the area of the overlap area of the display panel 100 in contact with the peripheral circuit 14, and due to the unevenness of the bonding pad 103.
  • the spacing between the edges is constant, but the width of the bonding pad 103 is increased a lot, so that the bonding pads of the peripheral circuit and the binding pads of the display panel 100 can be more deviated in the process, so that The upper and lower overlapping areas are too small to lead to production yield, so the production yield of the bonding process can be effectively improved, the cost can be reduced, or the process difficulty can be reduced.
  • the width of the bonding pad 103 can be reduced, thereby increasing the number of faces of the binding area, thereby reducing the solder joint pitch and improving the resolution. rate.
  • the display panel 100 further includes a flexible circuit board bound to the binding area 13, the flexible circuit board is electrically connected to the bonding pad 103; the flexible circuit board display panel 100 further includes an integrated chip IC, an integrated chip IC Integrated on a flexible circuit board.
  • the flexible circuit board and the bonding pad 103 are electrically connected by an anisotropic conductive film ACF.
  • the anisotropic conductive film is a conductive electrode that connects the electrode between the flexible circuit board and the bonding pad 103 to make it conductive.
  • the anisotropic conductive film has the characteristics of continuous processing and extremely low material loss, and is a display. A more commonly used product in panels.
  • the flexible circuit board is a product form of the peripheral circuit, but it is not limited.
  • FIG. 6 is a schematic structural view of a binding pad in a second embodiment of the display panel of the present application
  • FIG. 6 is a schematic structural view of a binding pad in the third embodiment of the display panel of the present application.
  • the display panels of the second embodiment and the third embodiment are substantially the same as those of the first embodiment, except that the binding pad 203 in the display panel 200 has a concave and convex edge.
  • the shape of the binding pad 303 in the display panel 300 is wavy.
  • the shape of the concave and convex edge is not limited to one of a square shape, a zigzag shape, or a wave shape, and may include other regular or irregular concave and convex edges, such as a sinusoidal waveform, a parallelogram, an arrow shape, an S shape, and the like;
  • the shape of the edge may also be at least one of a square shape, a zigzag shape, or a wave shape, that is, a combination of a plurality of patterns, as long as the concave and convex edge structure is formed, and details are not described herein again.
  • FIG. 7 is a schematic structural diagram of a binding pad in a fourth embodiment of the display panel of the present application.
  • the display panel of the fourth embodiment is substantially the same as the structure of the first embodiment.
  • the plurality of binding pads 403 further includes a tilting bond pad 404 having an inclined angle.
  • the center connection line of the first binding pad unit and the second binding pad unit of the tilt binding pad 404 is parallel to the center line of the tilt binding pad body 430.
  • the tilting bond pads 404 are disposed on both sides of the bonding pad 403, and the tilting direction thereof is not limited.
  • the tilt binding pad 404 has a certain inclination angle with respect to the bonding pad 403, the tilting of the center line of the first binding pad unit 410 and the second bonding pad unit 420 of the bonding pad 404 and the tilt binding pad body 430
  • the center line is parallel, and it is not limited whether the first binding pad unit 410 and the second binding pad unit 420 need to be tilted at the same time.
  • the first binding pad unit 410 and the second binding layer of the binding pad 404 are tilted according to actual conditions.
  • the pad unit 420 can be tilted at the same time, or not tilted at the same time, but cannot be tilted sometimes without tilting.
  • the display area AA of the display panel 100 is roughly: an array layer (Array) is first formed on the flexible substrate.
  • the flexible substrate may be a combination of one or more of PI (polyimide), PEI (polyetherimide), PPS (polyphenylene sulfide), PAR (polyarylate), etc., and may be transparent, Can be opaque.
  • the array layer (Array) can use a-Si (amorphous silicon), LTPS (low temperature polysilicon), Oxide An (oxide semiconductor) or the like is used as an active layer.
  • the array layer (Array) usually includes a buffer layer, an active layer or an active layer (active). Layer), gate insulating layer (GI), gate layer (Gate), interlayer insulating layer (ILD), source/drain layer (S/D), flat layer (PLN), anode layer (Anode), pixel definition layer (PDL), support layer (PS) layer, and the like.
  • the method and the process for preparing the display panel can be referred to in the prior art. The present application is not limited herein.
  • a metal layer (S/D) to be deposited in the bonding region is prepared simultaneously with the source and drain layers of the display region AA, and is bound by a process such as exposure, development, etching, and the like.
  • the binding pad forming the above-mentioned desired concave and convex edge shape can be obtained by using the image on the exposure MASK to obtain a binding pad of different shape edges (Bonding) Pad), the edge convex shape includes but is not limited to a square shape, a zigzag shape or a wave shape.
  • FIG. 8 is a schematic structural diagram of an embodiment of a display device of the present application.
  • the display device 10 includes a housing 101 and the above-described display panel 100.
  • the display device 10 in the present application includes a display panel 100, which is the display panel in any of the above embodiments of the present application.
  • the structure of the display panel 100 is described above, and details are not described herein again.
  • the display device 10 provided by the present application may be any product or component having a display function, such as a mobile phone, a tablet computer, a television, a display, a notebook computer, a digital photo frame, a navigator, and the like.
  • the present application provides a display panel and a display device thereof, and by performing a roughening process on a binding pad of a binding area, an overlapping area of a display panel in contact with a peripheral circuit can be increased, and The spacing between the bonding pads is ensured, so that the production yield of the bonding process can be effectively improved and the cost can be reduced.

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  • Microelectronics & Electronic Packaging (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
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Abstract

本申请公开了一种显示面板及其显示装置，该显示面板包括显示区和围绕显示区设置的非显示区，非显示区包括外围电路的绑定区；其中，绑定区的绑定垫包括绑定垫主体、设置在绑定垫主体两侧的第一绑定垫单元和第二绑定垫单元，其中，第一绑定垫单元和第二绑定垫单元背向绑定垫主体的侧边设置为凹凸边缘，且第一绑定垫单元和第二绑定垫单元的凹凸边缘呈交替设置。通过上述方式，对绑定区的绑定垫进行凹凸化处理，可以增加显示面板与外围电路接触的重叠区面积，并且保证绑定垫之间的间距，从而可以有效提高绑定制程的生产良率，减低成本。

Description

显示面板及其显示装置
【技术领域】
本申请涉及显示技术领域，特别是涉及一种显示面板及其显示装置。
【背景技术】
随着电子产品向高分辨率、便携式发展，导致显示面板与元器件连接的焊点间距（Pad Pitch）越来越小，这对显示面板产品的设计与生产带来了机遇和挑战。
通常情况，OLED显示面板的屏幕简单地分为显示区（active area, 简称“AA”）和外围电路压合区（outer lead bonding，简称“OLB”），其中OLB区域存在绑定区（Bonding Pad）。而外围电路包括集成电路IC、覆晶薄膜COF、柔性电路板FPC或者印刷电路板PCB等通过异方性导电胶膜ACF绑定到显示面板相应的绑定区，从而实现外围电路的外部信号对显示屏幕显示区的显示控制。
由于绑定区的绑定垫Pad的设计对于绑定制程来说主要考虑两个方面因素：一、外围电路与显示面板绑定的重叠区overlap和绑定垫Pad 之间的间距；二、重叠区overlap的面积需要足够大从而捕捉到更多的导电粒子，使得上下电极导通，并且绑定垫Pad之间的间距足够大从而使得相邻的绑定垫Pad之间不会短路。而目前广泛应用到OLED显示屏幕的绑定区的绑定垫Pad形状和排布通常都是规则矩形，而这样的绑定垫Pad如果想形成小引脚中心距Fine pitch设计，会对显示面板的制程和设计带来较大的考验和挑战。
【发明内容】
本申请提供一种显示面板及其显示装置，可以增加显示面板与外围电路接触的重叠区面积，并且保证绑定垫之间的间距，从而可以有效提高绑定制程的生产良率，减低成本。
为解决上述技术问题，本申请采用的一个技术方案是：提供一种显示装置，所述显示装置包括所述显示面板包括显示区和围绕所述显示区设置的非显示区，所述非显示区包括外围电路的绑定区；其中，所述绑定区的绑定垫包括绑定垫主体、设置在所述绑定垫主体两侧的第一绑定垫单元和第二绑定垫单元，其中，所述第一绑定垫单元和所述第二绑定垫单元背向所述绑定垫主体的侧边设置为凹凸边缘，且所述第一绑定垫单元和所述第二绑定垫单元的凹凸边缘呈交替设置；其中，所述凹凸边缘的形状为方形、锯齿形或者波浪形中的一种，所述显示面板还包括柔性电路板，所述柔性电路板与所述绑定区绑定，所述柔性电路板与所述绑定垫电连接。
为解决上述技术问题，本申请采用的另一个技术方案是：提供一种显示面板，所述显示面板包括显示区和围绕所述显示区设置的非显示区，所述非显示区包括外围电路的绑定区；其中，所述绑定区的绑定垫包括绑定垫主体、设置在所述绑定垫主体两侧的第一绑定垫单元和第二绑定垫单元，其中，所述第一绑定垫单元和所述第二绑定垫单元背向所述绑定垫主体的侧边设置为凹凸边缘，且所述第一绑定垫单元和所述第二绑定垫单元的凹凸边缘呈交替设置。
为解决上述技术问题，本申请采用的又一个技术方案是：提供一种显示装置，所述显示装置包括显示面板，所述显示面板包括显示区和围绕所述显示区设置的非显示区，所述非显示区包括外围电路的绑定区；其中，所述绑定区的绑定垫包括绑定垫主体、设置在所述绑定垫主体两侧的第一绑定垫单元和第二绑定垫单元，其中，所述第一绑定垫单元和所述第二绑定垫单元背向所述绑定垫主体的侧边设置为凹凸边缘，且所述第一绑定垫单元和所述第二绑定垫单元的凹凸边缘呈交替设置。
本申请的有益效果是：提供一种显示面板及其显示装置，通过对绑定区的绑定垫进行凹凸化处理，可以增加显示面板与外围电路接触的重叠区面积，并且保证绑定垫之间的间距，从而可以有效提高绑定制程的生产良率，减低成本。
【附图说明】
图1是本申请显示面板第一实施例的结构示意图；
图2是图1中绑定区一实施方式的结构示意图；
图3是图1中绑定垫一实施方式的的结构示意图；
图4是图1中绑定垫与外围电路压合时的结构示意图；
图5是本申请显示面板第二实施例中绑定垫的结构示意图;
图6是本申请显示面板第三实施例中绑定垫的结构示意图;
图7是本申请显示面板第四实施例的结构示意图;
图8是本申请显示装置一实施方式的结构示意图。
【具体实施方式】
下面将结合本申请实施例中的附图，对本申请实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅是本申请的一部分实施例，而不是全部的实施例。基于本申请中的实施例，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例，都属于本申请保护的范围。
请一并参阅图1至图4，图1为本申请显示面板第一实施例的结构示意图，图2是图1中绑定区的结构示意图，图3是图1中绑定垫的结构示意图，图4是图1中绑定垫与外围电路压合时的结构示意图。
如图1和图2所示，该显示面板10包括显示区AA和围绕显示区设置的非显示区12，非显示区12包括外围电路14的绑定区13。
其中，绑定区13的绑定垫103包括绑定垫主体130、设置在绑定垫主体130两侧的第一绑定垫单元110和第二绑定垫单元120，其中，第一绑定垫单元110和第二绑定垫单元120背向绑定垫主体130的侧边设置为凹凸边缘，且第一绑定垫单元110和第二绑定垫单元120的凹凸边缘呈交替设置。为了方便直观理解，绑定区13设置在显示区AA的下方，第一绑定垫单元110和第二绑定垫单元120分别设置在绑定垫主体130的左右侧，但并不是对本申请的限定。
本申请通过对绑定区13的绑定垫103进行凹凸化处理，可以增加显示面板100与外围电路14接触的重叠区面积，并且保证绑定垫103之间的间距，从而可以有效提高绑定制程的生产良率，减低成本。
具体的，参见图3，第一绑定垫单元110包括多个第一凸绑定垫单元111和多个第一凹绑定垫单元112，第二绑定垫单元120包括多个第二凸绑定垫单元121和多个第二凹绑定垫单元122；其中，第一凸绑定垫单元111和第二凹绑定垫单元122的数量相等，第一凹绑定垫单元112和第二凸绑定垫单元121的数量相等。第一凸绑定垫单元111和第一凹绑定垫单元112的数量相等或者不相等，其数量也可以为奇数或偶数。而在本实施例中，第一凸绑定垫单元111和第一凹绑定垫单元112的数量不相等，而可以优选为数量相等，具体依据绑定片的长度和第一凸绑定垫单元的长度的比例确定，在此不再赘述。其中，第一凸绑定垫单元111和第一凹绑定垫单元112的长度相等，第一绑定垫单元110和第二绑定垫单元120的宽度相等。
绑定区130包括多个绑定垫103，其中，多个绑定垫103的第一绑定垫单元110与相邻绑定垫的第二绑定垫单元120之间的间距相等。更具体的，即多个绑定垫103的第一凹绑定垫单元112与相邻绑定垫103的第二凸绑定垫单元121之间的间距或者距离相等，使得相邻绑定垫之间的间距不受凹凸化的影响。
参见图4，本实施例中，相对现有技术中的矩形绑定垫，本申请以绑定垫103的凹凸边缘的形状为方形举例说明。首先，设绑定垫103的宽度为d1，绑定垫103之间的间距为d2，外围电路的贴合垫的宽度为b，外围电路与绑定垫未贴合的宽度为a，绑定垫103的长度为L；在不改变绑定垫的宽度d1和间距d2的情况下，原现有技术中的矩形绑定垫重叠区的面积为：
S1=L*(b-a)；
本申请绑定垫重叠区的面积为：
S2=L*(b-a)+S^，其中，S^为绑定垫103一侧的凸起边缘面积，且S^＞0；
从而可以得出，S2＞S1，即增加了显示面板100与外围电路14接触的重叠区面积。
再者，设绑定垫103的宽度为d1，设绑定垫主体130的宽度为d13，设第一绑定垫单元110的宽度为d11，设第二绑定垫单元120的宽度为d12；在实际应用中，可以将绑定垫主体130宽度d11的范围设为20%d1≤d11≤50%d1；进一步的，绑定垫主体130宽度d11的范围设为30%d1≤d11≤40%d1。
以一理想状态的情况举例说明，当d11= d12= d13=0.5b时，即绑定垫主体宽度d13为绑定垫宽度d1的三分之一时，因实际绑定制程原因，实际中显示面板100与外围电路14接触的重叠区只有一半重合时，原现有技术中的矩形绑定垫重叠区的面积为：
S1=L*(b-0.5b)=0.5Lb；
本申请绑定垫重叠区的面积则为：
S2=L*(b-0.5b)+ 0.5L*(b-0.5b)=0.75Lb；
因此，本申请的方案可以将显示面板100与外围电路14接触的重叠区面积提高至50%左右，大大提高了显示面板100与外围电路14接触的重叠区面积，并且由于绑定垫103的凹凸边缘之间的间距不变，但绑定垫103的宽度却增加了不少，从而能够让外围电路的压合垫与显示面板100的绑定垫在制程中能够偏差更大，从而不会因为上下重叠区域过小而导致生产良率，因此可以有效提高绑定制程的生产良率，减低成本，或者降低工艺难度。反过来推理一下，当不增加显示面板100与外围电路14接触的重叠区面积时，可以降低绑定垫103的宽度，从而可以提升绑定区的面取数，进而可以减少焊点间距提高分辨率。
更进一步的，显示面板100还包括柔性电路板，柔性电路板与绑定区13绑定，柔性电路板与绑定垫103电连接；柔性电路板显示面板100还包括集成芯片IC，集成芯片IC集成在柔性电路板上。柔性电路板与绑定垫103通过异方性导电胶膜ACF电连接。异方性导电胶膜是利用导电粒子连接柔性线路板与绑定垫103两者之间的电极使之成为导通，异方性导电膜具有可以连续加工且极低材料损失的特性，是显示面板中较普遍使用的产品。其中，柔性电路板是外围电路的一种产品形式，但并不是限定。
请参阅图5 和图6，图5是本申请显示面板第二实施例中绑定垫的结构示意图，图6是本申请显示面板第三实施例中绑定垫的结构示意图。
如图5和图6所示，第二实施例和第三实施例的显示面板与第一实施例的结构基本相同，不同的是，第二实施例显示面板200中的绑定垫203凹凸边缘的形状为锯齿形；第三实施例显示面板300中的绑定垫303凹凸边缘的形状为波浪形。在此，凹凸边缘的形状不限于方形、锯齿形或者波浪形中的一种，还可以包括其他规则或者不规则的凹凸边缘，如正弦波形、平行四边形、箭头形、S形等；其中，凹凸边缘的形状还可以是方形、锯齿形或者波浪形中的至少一种，即还可以是多种图形的组合，只要形成凹凸边缘结构即可，在此不再赘述。
请参阅图7，图7是本申请显示面板第四实施例中绑定垫的结构示意图。
如图7所示，第四实施例的显示面板与第一实施例的结构基本相同，不同的是，本实施例中，多个绑定垫403还包括具有倾斜角度的倾斜绑定垫404，倾斜绑定垫404的第一绑定垫单元及第二绑定垫单元的中心连接线与倾斜绑定垫主体430的中心线平行。
通常情况下，倾斜绑定垫404设置在绑定垫403的两侧，其倾斜方向不限定。当倾斜绑定垫404相对绑定垫403具有一定倾斜角度时，其倾斜绑定垫404的第一绑定垫单元410及第二绑定垫单元420的中心线与倾斜绑定垫主体430的中心线平行即可，并不限定第一绑定垫单元410及第二绑定垫单元420是否需要同时倾斜，依据实际情况，倾斜绑定垫404的第一绑定垫单元410及第二绑定垫单元420可以同时倾斜，或者同时都不倾斜，但不能有时而倾斜时而不倾斜的情况。
通常情况下，显示面板100的显示区AA制程大致为：在柔性基板上首先形成阵列层（Array）。其中，柔性基板可为PI（聚酰亚胺）、PEI（聚醚酰亚胺）、PPS（聚苯硫醚）、PAR（聚芳酯）等一种或几种的组合，可以透明，也可以非透明。
阵列层（Array）可以使用a-Si (非晶硅)、LTPS（低温多晶硅）、Oxide (氧化物半导体)等作为有源层。并且，阵列层（Array）通常结构上包括缓冲层（buffer）、有源层或者活性层（active layer）、栅极绝缘层（GI）、栅极层（Gate）、层间绝缘层（ILD）、源漏层（S/D）、平坦层（PLN）、阳极层（Anode）、像素定义层（PDL）、支撑层（PS）层等。其中，各个层的制备方法及过程可以参照现有技术中制备显示面板的方法及工艺，此处本申请不做限定。
在显示面板100各个层的制备过程中，需要沉积在绑定区的金属层（S/D），是与显示区AA的源漏层同时制作，并且通过曝光、显影、蚀刻等工艺在绑定区形成上述所需凹凸边缘形状的绑定垫，利用曝光MASK上的图像不同，可以得到不同形状边缘的绑定垫（Bonding pad），边缘凸起形状包括但不局限于方形、锯齿形或者波浪形等。
请参阅图8，图8是本申请显示装置一实施方式的结构示意图。
如图8所示，该显示装置10包括壳体101以及上述的显示面板100。本申请中的显示装置10包括显示面板100，该显示面板100为本申请上述任一实施例中的显示面板。其中，显示面板100的结构参见上文，此处不再赘述。
本申请所提供的显示装置10可以为：手机、平板电脑、电视机、显示器、笔记本电脑、数码相框、导航仪等任何具有显示功能的产品或部件。
综上所述，本领域技术人员容易理解，本申请提供显示面板及其显示装置，通过对绑定区的绑定垫进行凹凸化处理，可以增加显示面板与外围电路接触的重叠区面积，并且保证绑定垫之间的间距，从而可以有效提高绑定制程的生产良率，减低成本。
以上所述仅为本申请的实施方式，并非因此限制本申请的专利范围，凡是利用本申请说明书及附图内容所作的等效结构或等效流程变换，或直接或间接运用在其他相关的技术领域，均同理包括在本申请的专利保护范围内。

Claims (20)

  1. 一种显示装置，其中，所述显示装置包括显示面板，所述显示面板包括显示区和围绕所述显示区设置的非显示区，所述非显示区包括外围电路的绑定区；其中，所述绑定区的绑定垫包括绑定垫主体、设置在所述绑定垫主体两侧的第一绑定垫单元和第二绑定垫单元，其中，所述第一绑定垫单元和所述第二绑定垫单元背向所述绑定垫主体的侧边设置为凹凸边缘，且所述第一绑定垫单元和所述第二绑定垫单元的凹凸边缘呈交替设置；
    其中，所述凹凸边缘的形状为方形、锯齿形或者波浪形中的一种，所述显示面板还包括柔性电路板，所述柔性电路板与所述绑定区绑定，所述柔性电路板与所述绑定垫电连接。
  2. 根据权利要求1所述的显示装置，其中，所述绑定区包括多个所述绑定垫，其中，多个所述绑定垫的第一绑定垫单元与相邻所述绑定垫的第二绑定垫单元之间的间距相等。
  3. 根据权利要求2所述的显示装置，其中，多个所述绑定垫包括具有倾斜角度的倾斜绑定垫，所述倾斜绑定垫的所述第一绑定垫单元及所述第二绑定垫单元的中心连接线与所述倾斜绑定垫主体的中心线平行。
  4. 根据权利要求1所述的显示装置，其中，所述第一绑定垫单元包括多个第一凸绑定垫单元和多个第一凹绑定垫单元，所述第二绑定垫单元包括多个第二凸绑定垫单元和多个第二凹绑定垫单元；其中，所述第一凸绑定垫单元和所述第二凹绑定垫单元的数量相等，所述第一凹绑定垫单元和所述第二凸绑定垫单元的数量相等。
  5. 根据权利要求4所述的显示装置，其中，所述第一凸绑定垫单元和所述第一凹绑定垫单元的数量相等或者不相等。
  6. 根据权利要求1所述的显示装置，其中，所述显示面板还包括集成芯片，所述集成芯片集成在所述柔性电路板上。
  7. 根据权利要求1所述的显示装置，其中，所述柔性电路板与所述绑定垫通过异方性导电胶膜电连接。
  8. 一种显示面板，其中，所述显示面板包括显示区和围绕所述显示区设置的非显示区，所述非显示区包括外围电路的绑定区；其中，
    所述绑定区的绑定垫包括绑定垫主体、设置在所述绑定垫主体两侧的第一绑定垫单元和第二绑定垫单元，其中，所述第一绑定垫单元和所述第二绑定垫单元背向所述绑定垫主体的侧边设置为凹凸边缘，且所述第一绑定垫单元和所述第二绑定垫单元的凹凸边缘呈交替设置。
  9. 根据权利要求8所述的显示面板，其中，所述凹凸边缘的形状为方形、锯齿形或者波浪形中的一种。
  10. 根据权利要求8所述的显示面板，其中，所述绑定区包括多个所述绑定垫，其中，多个所述绑定垫的第一绑定垫单元与相邻所述绑定垫的第二绑定垫单元之间的间距相等。
  11. 根据权利要求10所述的显示面板，其中，多个所述绑定垫包括具有倾斜角度的倾斜绑定垫，所述倾斜绑定垫的所述第一绑定垫单元及所述第二绑定垫单元的中心连接线与所述倾斜绑定垫主体的中心线平行。
  12. 根据权利要求8所述的显示面板，其中，所述第一绑定垫单元包括多个第一凸绑定垫单元和多个第一凹绑定垫单元，所述第二绑定垫单元包括多个第二凸绑定垫单元和多个第二凹绑定垫单元；其中，所述第一凸绑定垫单元和所述第二凹绑定垫单元的数量相等，所述第一凹绑定垫单元和所述第二凸绑定垫单元的数量相等。
  13. 根据权利要求12所述的显示面板，其中，所述第一凸绑定垫单元和所述第一凹绑定垫单元的数量相等或者不相等。
  14. 根据权利要求8所述的显示面板，其中，所述显示面板还包括柔性电路板，所述柔性电路板与所述绑定区绑定，所述柔性电路板与所述绑定垫电连接。
  15. 根据权利要求14所述的显示面板，其中，所述显示面板还包括集成芯片，所述集成芯片集成在所述柔性电路板上。
  16. 根据权利要求14所述的显示面板，其中，所述柔性电路板与所述绑定垫通过异方性导电胶膜电连接。
  17. 一种显示装置，其中，所述显示装置包括显示面板，所述显示面板包括显示区和围绕所述显示区设置的非显示区，所述非显示区包括外围电路的绑定区；其中，所述绑定区的绑定垫包括绑定垫主体、设置在所述绑定垫主体两侧的第一绑定垫单元和第二绑定垫单元，其中，所述第一绑定垫单元和所述第二绑定垫单元背向所述绑定垫主体的侧边设置为凹凸边缘，且所述第一绑定垫单元和所述第二绑定垫单元的凹凸边缘呈交替设置。
  18. 根据权利要求17所述的显示装置，其中，所述凹凸边缘的形状为方形、锯齿形或者波浪形中的一种。
  19. 根据权利要求17所述的显示装置，其中，所述绑定区包括多个所述绑定垫，其中，多个所述绑定垫的第一绑定垫单元与相邻所述绑定垫的第二绑定垫单元之间的间距相等。
  20. 根据权利要求17所述的显示装置，其中，所述第一绑定垫单元包括多个第一凸绑定垫单元和多个第一凹绑定垫单元，所述第二绑定垫单元包括多个第二凸绑定垫单元和多个第二凹绑定垫单元；其中，所述第一凸绑定垫单元和所述第二凹绑定垫单元的数量相等，所述第一凹绑定垫单元和所述第二凸绑定垫单元的数量相等。
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