CN107527554B - 柔性显示面板及其制备方法、柔性显示装置 - Google Patents
柔性显示面板及其制备方法、柔性显示装置 Download PDFInfo
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- CN107527554B CN107527554B CN201710728987.2A CN201710728987A CN107527554B CN 107527554 B CN107527554 B CN 107527554B CN 201710728987 A CN201710728987 A CN 201710728987A CN 107527554 B CN107527554 B CN 107527554B
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- 238000002360 preparation method Methods 0.000 title abstract description 8
- 239000000758 substrate Substances 0.000 claims abstract description 48
- 230000008093 supporting effect Effects 0.000 claims abstract description 37
- 239000000463 material Substances 0.000 claims abstract description 25
- 230000001681 protective effect Effects 0.000 claims abstract description 9
- 239000003292 glue Substances 0.000 claims description 12
- 238000000034 method Methods 0.000 claims description 9
- 238000007641 inkjet printing Methods 0.000 claims description 3
- 238000004519 manufacturing process Methods 0.000 claims description 3
- 238000007650 screen-printing Methods 0.000 claims description 3
- 238000005266 casting Methods 0.000 claims description 2
- 238000002788 crimping Methods 0.000 abstract description 4
- 239000010408 film Substances 0.000 description 24
- 238000005516 engineering process Methods 0.000 description 9
- 239000011521 glass Substances 0.000 description 7
- 230000008569 process Effects 0.000 description 6
- 238000010438 heat treatment Methods 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 238000005520 cutting process Methods 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 229920003023 plastic Polymers 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 229920002457 flexible plastic Polymers 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 239000002923 metal particle Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 230000008719 thickening Effects 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 230000037303 wrinkles Effects 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
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- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/301—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements flexible foldable or roll-able electronic displays, e.g. thin LCD, OLED
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- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
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- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
- H10K77/10—Substrates, e.g. flexible substrates
- H10K77/111—Flexible substrates
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- H01L2224/14135—Covering only the peripheral area of the surface to be connected, i.e. peripheral arrangements
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- H01L2224/16227—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation the bump connector connecting to a bond pad of the item
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- H01L2224/27334—Manufacturing methods by local deposition of the material of the layer connector in solid form using preformed layer
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Abstract
本发明提供一种柔性显示面板,包括柔性基板;在所述柔性基板的背面形成有背面保护膜;在所述柔性基板和所述背面保护膜之间还设置有胶材;在所述柔性基板和所述背面保护膜之间且对应每个IC Bump位置处设置有支撑体;所述支撑体用于在所述胶材内支撑所述IC Bump。本发明还提供一种柔性显示面板的制备方法和柔性显示装置。本发明可以提高IC bonding后的平坦度,从而能够降低IC边缘处断线和压接不良等问题的产生。
Description
技术领域
本发明属于显示器件加工技术领域,具体涉及一种柔性显示面板及其制备方法、柔性显示装置。
背景技术
近年来,柔性显示的概念越来越深入显示市场,吸引消费者眼球。柔性显示的提出及应用颠覆了以前显示只能固定到一块平板上的概念,柔性显示以其轻薄、可弯曲、可变形、可客制化的优点,展现了多方面的市场应用。在穿戴、透明显示、家电及智能手机方面崭露头角。
实现柔性显示的关键技术可以分为两个大的方面:面板工艺和背板工艺。其中,柔性显示的面板工艺与平面显示的面板技术有一定的兼容工艺,技术量产度高;而柔性显示的背板工艺,在玻璃基板取下来之后,很难与原有平面显示技术的模组工艺兼容,在柔性基底上面进行工艺,开发难度大。
目前,背板工艺有两种方式。第一种方式是:在面板贴膜之后玻璃切割,再在玻璃上电路绑定(bonding),再将玻璃取下以及在柔性基板背面贴膜及功能膜的工艺;第二种方式是:在面板贴膜之后,先将大面积的玻璃取下以及并对柔性基板背面贴膜,再切割并在切割之后在柔性基板上进行电路绑定,然后贴附背面功能膜。两种开发方向的不同之处之一是绑定工艺是在玻璃上还是在柔性塑料基板上。其中,第二种方式在电路绑定需要加热加热,由于在电路绑定时柔性基板包括塑料基板、背面保护膜和连接二者的胶材,而各种材料的热膨胀系数、受力变形量不同,尤其是胶材在加热加压下会出现较明显的变形膨胀现象,进而在与IC Bump区压接位置胶材处出现变薄凹陷,而无Bump位置胶材被挤压至此而变厚,最终会导致背面保护膜出现褶皱,如图1中黑色框所示,从而会造成电路绑定的金属粒子压接不良或者IC边缘处断线的问题。
发明内容
本发明旨在至少解决现有技术中存在的技术问题之一,提出了一种柔性显示面板及其制备方法、柔性显示装置,可以提高IC bonding后的平坦度,能够降低IC边缘处断线和压接不良等问题的产生。
为解决上述问题之一,本发明提供了一种柔性显示面板,包括柔性基板;
在所述柔性基板的背面形成有背面保护膜;
在所述柔性基板和所述背面保护膜之间还设置有胶材;
在所述柔性基板和所述背面保护膜之间且对应每个IC Bump位置处设置有支撑体;
所述支撑体用于在所述胶材内支撑所述IC Bump。
优选地,所述支撑体为支撑条。
优选地,对应每个所述IC Bump,所述支撑条的数量为多个;
多个所述支撑条平行设置。
优选地,对应每个所述IC Bump,所述支撑条的数量为多个;
多个所述支撑条交叉设置形成网格结构。
优选地,所述柔性基板和所述背面保护膜之间形成一整层网格结构。
优选地,所述整层网格结构的每个格子大小一致。
优选地,在多个所述IC Bump沿预设图形间隔设置的情况下,所述支撑条沿所述预设图形设置。
优选地,所述支撑条的数量为多条;
多条所述支撑条平行设置。
优选地,每条支撑条包括交叉设置的多条子支撑条;
至少一条所述支撑条的交叉设置的多条子支撑条延伸与其他所述支撑条相交,以在该交叉区域形成网格。
优选地,所述支撑体采用喷墨打印、滴注、丝网印刷工艺中任意一种形成。
本发明还提供一种柔性显示装置,包括上文提供的柔性显示面板。
本发明还提供上文柔性基板的制备方法,包括以下步骤:
在所述柔性基板的背面制备支撑体,且所述支撑体对应每个ICBump位置处;
在具有支撑体的柔性基板的背面上贴附具有胶材的背面保护膜。
本发明还提供上文柔性基板的另一种制备方法,包括以下步骤:
制备具有支撑体、胶材的背面保护膜,所述支撑体对应每个ICBump位置处;
在所述柔性基板的背面贴附所述背面保护膜。
本发明具有以下有益效果:
本发明中,由于在柔性基板的背面的对应每个IC Bump位置处设置有支撑体,具有一定高度的支撑体能够在IC bonding加热加压时提供一定支撑,这样,胶材不会受到压力而外流,因而该IC Bump位置处对应的胶材不会发生被挤压下陷以及其他区域不会出现凸起,从而可以提高IC bonding后的平坦度,能够降低IC边缘处断线和压接不良等问题的产生。
附图说明
图1为现有的柔性显示面板在bonding位置的照片;
图2a为本发明实施例提供的柔性显示面板的俯视图;
图2b为沿图2a中A-A’的剖视图;
图3为图2b中支撑体的俯视图;
图4为IC的结构示意图
图5为在图4所示的情况下替换图2中支撑体的一种支撑体的结构示意图;
图6为在图4所示的情况下替换图2中支撑体的另一种支撑体的结构示意图;
图7为在图2情况下整版基板的支撑体的俯视图;
图8为整版基板的bonding区域的示意图;
图9为在图5和图8情况下整版基板的支撑体的俯视图。
具体实施方式
为使本领域的技术人员更好地理解本发明的技术方案,下面结合附图来对本发明提供的柔性显示面板及柔性显示装置进行详细描述。
下文中的IC Bump是指IC上与外界电路(例如,柔性基板的金属引线)的线路管脚。
实施例1
图2a为本发明实施例提供的柔性显示面板的俯视图;图2b为沿图2a中A-A’的剖视图;请一并参阅图2a和图2b,本发明实施例提供的柔性显示面板,包括柔性基板10;在柔性基板10的背面形成有背面保护膜11;在柔性基板10和背面保护膜11之间还设置有胶材12;在柔性基板10和背面保护膜11之间且对应每个IC Bump位置处设置有支撑体13;支撑体13用于在胶材12内支撑IC Bump。
本发明中,由于在柔性基板的背面的对应每个IC Bump位置处设置有支撑体13,具有一定高度的支撑体13能够在IC bonding加热加压时提供一定支撑,这样,胶材不会受到压力而外流,因而该IC Bump位置处对应的胶材不会发生被挤压下陷以及其他区域不会出现凸起,从而可以提高IC bonding后的平坦度,能够降低IC边缘处断线和压接不良等问题的产生。
在本实施例中,优选地,支撑体13为支撑条131,支撑条131的支撑面较大,能够很大程度有力地支撑。
进一步优选地,对应每个IC Bump,支撑条131的数量为多个;多个支撑条131交叉设置形成网格结构,如图3所示,采用网格结构的支撑体具有以下效果:其一,由于网格的格子具有在多个方向上具有支撑条131,因此,支撑效果好、稳定性好;其二,网格的格子能够很好地限制胶材避免其外流,从而更能够有利于显示面板背面的平坦度。当然,本发明并不局限于此,在实际应用中,也可以采用:对应每个IC Bump,支撑条131的数量为多个;多个支撑条131平行设置,同样能够更好且稳定地提供支撑力。
如图3所示,柔性基板10和背面保护膜11之间形成一整层网格结构,并且整层网格结构的每个格子大小一致,这样,制备过程较简单,需要通过设置仅在IC Bump位置设置网格。当然,本发明并不局限于此,在实际应用中:整层网络结构的格子大小不一致,只要能够保证每个IC Bump对应的格子的尺寸能够支撑该位置处施加的压力即可,对非IC Bump位置对应的格子的尺寸没有限制,如图4和图5所示,图4中IC的中心区域没有设置Bump,因此,图5中的中心区域的格子S1最大、四个拐角区域的格子S3最小、其他区域的格子S2处于中间,在该情况下,针对四个拐角区域,支撑体13为网格结构,对于其他区域,支撑体13为多个平行的支撑条131结构。
另外优选地,在多个IC Bump沿预设图形(如图4所示的四边形)间隔设置的情况下,支撑条131沿预设图形设置,如图6所示。
进一步优选地,如图6所示,支撑条131的数量为多条;多条支撑条131平行设置,这样,可以提高支撑力。
当然,在实际应用中,还可以优选地,每条支撑条131包括沿交叉设置的多条子支撑条,如图6所示,每个支撑条131包括两条水平子支撑条和两条竖直支撑条,每相邻两个在连接处交叉;至少一条支撑条131的交叉设置的多条子支撑条延伸与其他支撑条131相交,以在该交叉区域形成网格,最终如图5所示。
需要说明的是,本实施例中,支撑体13优选采用但不限于喷墨打印、滴注、丝网印刷工艺中的任意一种形成。
还需要说明的是,本实施例中,预设图形为四边形(包括长方形、正方形和不规则四边形),当然,本发明并不局限于此,在实际应用中,预设图形还可以为三角形、多边形、圆形、椭圆形等闭合形状,也可以为其他非闭合形状,例如,U型、T型等。
还需要说明的是,如图2所示,柔性显示基板还包括:位于柔性基板10上的缓冲层17、位于缓冲层17上的TFT、有机发光层和金属电极层(用标号14表示)、薄膜封装层15和保护膜16。
实施例2
本发明实施例提供上述实施例1提供的柔性显示面板的制备方法。具体地,针对完成面板工艺的面板,先将玻璃基板取下;接着在柔性基板10的背面制备支撑体13,如图7和图9所示;接着贴附具有胶材12的背面保护膜11;接着进行切割工艺,将整版基板(包括多个panel)切割为多个panel;接着,在每个panel的bonding区域贴附ACF胶,该胶内部包括导电粒子;接着,抓取IC并放在ACF胶上加热加压进行bonding,导电粒子在加热加压下压破,将Bump与柔性基板10上的金属排线101相连,整版基板的bonding区域如图8所示。
实施例3
本发明实施例提供的柔性显示面板的制备方法与上述实施例2相类似,区别在于:先制备具有支撑体、胶材的背面保护膜,所述支撑体对应每个IC Bump位置处;在所述柔性基板的背面贴附所述背面保护膜。
实施例4
本发明实施例还提供一种柔性显示装置,其包括上述实施例1提供的柔性显示面板。
当然,柔性显示装置还可以包括其他装置,例如,可将柔性显示面板卷起收纳的结构。
本发明实施例提供的柔性显示装置,由于包括上述实施例1提供的柔性显示面板,因此,可以提高柔性显示装置的品质。
可以理解的是,以上实施方式仅仅是为了说明本发明的原理而采用的示例性实施方式,然而本发明并不局限于此。对于本领域内的普通技术人员而言,在不脱离本发明的精神和实质的情况下,可以做出各种变型和改进,这些变型和改进也视为本发明的保护范围。
Claims (10)
1.一种柔性显示面板,其特征在于,包括柔性基板;
在所述柔性基板的背面形成有背面保护膜;
在所述柔性基板和所述背面保护膜之间还设置有胶材;
在所述柔性基板和所述背面保护膜之间且对应每个IC Bump位置处设置有支撑体;其中,所述IC Bump是指IC上与外界电路连接的线路管脚;
所述支撑体用于在所述胶材内支撑所述IC Bump。
2.根据权利要求1所述的柔性显示面板,其特征在于,所述支撑体为支撑条。
3.根据权利要求2所述的柔性显示面板,其特征在于,对应每个所述IC Bump,所述支撑条的数量为多个;
多个所述支撑条平行设置。
4.根据权利要求2所述的柔性显示面板,其特征在于,对应每个所述IC Bump,所述支撑条的数量为多个;
多个所述支撑条交叉设置形成网格结构。
5.根据权利要求2所述的柔性显示面板,其特征在于,在多个所述IC Bump沿预设图形间隔设置的情况下,所述支撑条沿所述预设图形设置。
6.根据权利要求5所述的柔性显示面板,其特征在于,所述支撑条的数量为多条;
多条所述支撑条平行设置。
7.根据权利要求6所述的柔性显示面板,其特征在于,每条支撑条包括交叉设置的多条子支撑条;
至少一条所述支撑条的交叉设置的多条子支撑条延伸与其他所述支撑条相交,以在该交叉区域形成网格。
8.根据权利要求1所述的柔性显示面板,其特征在于,所述支撑体采用喷墨打印、滴注、丝网印刷工艺中的任意一种形成。
9.一种柔性显示装置,其特征在于,包括权利要求1-8任意一项所述的柔性显示面板。
10.一种权利要求1-8任意一项所述的柔性显示面板的制备方法,其特征在于,包括以下步骤:
在柔性基板的背面制备支撑体,且所述支撑体对应每个IC Bump位置处;其中,所述ICBump是指IC上与外界电路连接的线路管脚;
在具有支撑体的柔性基板的背面上贴附具有胶材的背面保护膜;
或者,包括以下步骤:
制备具有支撑体、胶材的背面保护膜,所述支撑体对应每个IC Bump位置处;
在所述柔性基板的背面贴附所述背面保护膜。
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