WO2012172603A1 - ワークの精密貼合装置、およびワークの精密貼合方法 - Google Patents
ワークの精密貼合装置、およびワークの精密貼合方法 Download PDFInfo
- Publication number
- WO2012172603A1 WO2012172603A1 PCT/JP2011/003421 JP2011003421W WO2012172603A1 WO 2012172603 A1 WO2012172603 A1 WO 2012172603A1 JP 2011003421 W JP2011003421 W JP 2011003421W WO 2012172603 A1 WO2012172603 A1 WO 2012172603A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- bonding
- work
- workpiece
- workpieces
- roller
- Prior art date
Links
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B43/00—Operations specially adapted for layered products and not otherwise provided for, e.g. repairing; Apparatus therefor
- B32B43/006—Delaminating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B38/00—Ancillary operations in connection with laminating processes
- B32B38/18—Handling of layers or the laminate
- B32B38/1825—Handling of layers or the laminate characterised by the control or constructional features of devices for tensioning, stretching or registration
- B32B38/1833—Positioning, e.g. registration or centering
- B32B38/1841—Positioning, e.g. registration or centering during laying up
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C63/00—Lining or sheathing, i.e. applying preformed layers or sheathings of plastics; Apparatus therefor
- B29C63/02—Lining or sheathing, i.e. applying preformed layers or sheathings of plastics; Apparatus therefor using sheet or web-like material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/78—Means for handling the parts to be joined, e.g. for making containers or hollow articles, e.g. means for handling sheets, plates, web-like materials, tubular articles, hollow articles or elements to be joined therewith; Means for discharging the joined articles from the joining apparatus
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
- G02B27/62—Optical apparatus specially adapted for adjusting optical elements during the assembly of optical systems
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B30/00—Optical systems or apparatus for producing three-dimensional [3D] effects, e.g. stereoscopic images
- G02B30/20—Optical systems or apparatus for producing three-dimensional [3D] effects, e.g. stereoscopic images by providing first and second parallax images to an observer's left and right eyes
- G02B30/22—Optical systems or apparatus for producing three-dimensional [3D] effects, e.g. stereoscopic images by providing first and second parallax images to an observer's left and right eyes of the stereoscopic type
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/20—Displays, e.g. liquid crystal displays, plasma displays
- B32B2457/202—LCD, i.e. liquid crystal displays
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B38/00—Ancillary operations in connection with laminating processes
- B32B38/18—Handling of layers or the laminate
- B32B38/1858—Handling of layers or the laminate using vacuum
Definitions
- the present invention relates to a workpiece precision laminating apparatus and a workpiece precision laminating method for precisely laminating a sheet-like workpiece to a flat workpiece, for example.
- the precision bonding apparatus which concerns on this invention is used in order to bond in the state which aligned the 3D film precisely, for example with respect to the liquid crystal substrate for 3D television, or a plasma substrate.
- 3D televisions have become widespread, but most of them are three-dimensionalized by a frame sequential method in which the screen is viewed with dedicated glasses.
- the right-eye image and the left-eye image that have passed through the 3D film are viewed by alternately opening and closing the right-eye lens and the left-eye lens of the glasses at high speeds so that different images are recognized by the left and right eyes.
- a right eye display unit corresponding to a pixel column forming an image for the right eye and a left eye display unit corresponding to a pixel column forming an image for the left eye are alternately formed.
- the left and right display units are attached to the substrate so as to correctly correspond to the pixel columns provided on the substrate.
- the present applicant has applied for the bonding apparatus of Patent Document 1 first.
- the 1st bonding stand which supports one work and the 2nd bonding stand which supports the other work are made to face up and down, and the work of the 1st bonding stand side is the 2nd bonding stand side.
- Both workpieces are bonded by pressing with a bonding roller.
- the first bonding table has a vacuum chamber and a breathable silk screen stretched on the opening surface of the vacuum chamber, and a workpiece support table for supporting the previous bonding roller or workpiece is provided inside the first bonding table. is there.
- a position table for positioning is provided at two positions on the left and right sides of each workpiece, the positional deviation of each position indication is captured as an image with a CCD camera, and a bonding table that supports the upper workpiece according to the image deviation state.
- the black circle position display is positioned within the circular area of the white circle position display, thereby positioning both workpieces.
- the variation in positioning accuracy between the workpieces is 100 to 200 ⁇ m with respect to the reference position.
- JP 2010-94910 A (paragraph numbers 0019 to 0021, FIG. 2) JP 2009-280338 A (paragraph number 0033, FIGS. 6 to 8)
- a pair of workpieces can be positioned and bonded by an automated alignment apparatus.
- This type of alignment apparatus can be applied without problems when it is an object to be bonded such as a polarizing sheet or an antireflection film that does not impair the function of the workpiece even if there is a slight misalignment.
- bonding workpieces that require precise positioning accuracy of 10 ⁇ m ( ⁇ 5 ⁇ m) or less, it is difficult to obtain sufficient positioning accuracy.
- the 3D film when a 3D film is bonded to a liquid crystal substrate or a plasma substrate, the 3D film must be bonded to the substrate in a state where the right-eye display unit and the left-eye display unit correctly correspond to the pixel rows on the substrate side.
- the objective of this invention is providing the precision bonding apparatus which can be bonded in the state which positioned the workpiece
- the purpose of the present invention is to allow the workpieces to be pressed with the laminating roller, meandering in the middle of the laminating, or to be misaligned.
- the object is to provide a work precision bonding apparatus and a work precision bonding method that can improve the yield without causing any problems.
- the object of the present invention is to accurately bond a 3D film particularly to a liquid crystal substrate or a plasma substrate to improve the yield, and to provide a precision workpiece bonding apparatus that can greatly contribute to the cost reduction of equipment for generating 3D images. It is to provide a precision bonding method for workpieces.
- the precision bonding apparatus for workpieces supports the lower suction cup 7 that supports the first workpiece W1 at the bonding position, and the second workpiece W2 to be bonded, and the second workpiece W2 is bonded to the previous stage.
- An upper suction cup 8 that moves between the position Z1, the bonding position Z2, and the carry-out position Z3 is provided.
- the first workpiece W1 and the second workpiece W2 are provided with positioning indications 5R, 5L, P1, and P2 with high positional accuracy.
- the lower suction cup 7 includes a plurality of work support bases 10 and terminal support bases 18 that adsorb the first work W1, a bonding roller 11 that bonds the first work W1 and the second work W2, and a terminal support base 18.
- a first alignment device 12 that adjusts the front-rear position is provided.
- the upper suction cup 8 is provided with a suction stand 44 for sucking and fixing the second workpiece W2 and a second alignment device 45 for adjusting the front-rear position and the left-right position of the suction stand 44.
- the CCD camera C6, C7 detects the position shift based on the positioning indications 5R, 5L, P1, P2 of both the workpieces W1, W2, and based on the detection result, the second alignment device 45 detects the position of the suction table 44. Is adjusted to position both workpieces W1 and W2.
- the positional shift of the first workpiece W1 is monitored by the positional shift monitoring camera C8, and the front and rear ends of the end support 18 are changed according to the positional shift state.
- the first workpiece W1 and the second workpiece W2 are bonded together while correcting the position with the first alignment device 12 and simultaneously correcting the left and right positions of the slide table 48 with the second alignment device 45.
- the first work W1 is made of a 3D film
- the second work W2 is formed by either a liquid crystal substrate or a plasma substrate.
- a group of display units 5R that allow the passage of the image for the right eye and a group of display units 5L that allow the passage of the image for the left eye are alternately arranged in a straight line. It is formed.
- One of the right eye display 5R and the left eye display 5L located near the center of the first work W1, and one of the specific pixel columns P1 and P2 provided near the center of the second work W2. Is positioned and the workpieces W1 and W2 are bonded together.
- the first work W1 is made of a 3D film
- the second work W2 is formed by either a liquid crystal substrate or a plasma substrate.
- a positioning mark is formed in the process of bonding the 3D film in the vicinity of the front and rear centers of the left and right side edges of the first work W1.
- a positioning mark corresponding to the mark is formed in the pasting process in the vicinity of the front and rear centers of the left and right side edges of the second workpiece W2.
- the pair of marks are positioned to bond the workpieces W1 and W2.
- a start end support 17 that adsorbs the start end of the first workpiece W1 is disposed adjacent to the start end of the plurality of workpiece support bases 10.
- the laminating roller 11 is disposed between the work support base 10 and the start end support base 17.
- work support base 10 is arrange
- the start end support 17 in a state in which the bonding start end of the first workpiece W1 is adsorbed is moved in a direction away from the bonding end by accompanying the bonding roller 11 and the both workpieces W1 and W2 are moved.
- the first workpiece W1 is suction-fixed by the plurality of workpiece support bases 10 and the terminal support base 18, and the second workpiece W2 to be bonded is suction-fixed by the suction base 44.
- both the workpieces W1 and W2 are bonded by the bonding roller 11 in a state where the workpieces W1 and W2 are directly opposed at the bonding position Z2.
- the images of the positioning displays 5R, 5L, P1, and P2 of both the works W1 and W2 are captured by the CCD cameras C6 and C7, and the positional deviation between the works W1 and W2 is detected.
- the position of the suction table 44 is adjusted by the second alignment device 45 based on the detection result to position both the workpieces W1 and W2.
- the position shift of the first work W1 is monitored by the position shift monitoring camera C8, and the end support 18 is moved according to the position shift state.
- the first workpiece W1 and the second workpiece W2 are bonded together while correcting the front-rear position with the first alignment device 12 and simultaneously correcting the left-right position of the slide table 48 with the second alignment device 45.
- the bonding roller 11 in the bonding process of bonding the first work W1 and the second work W2 with the bonding roller 11, the bonding roller 11 in a state where the first work W1 is pressed closer to the bonding start end.
- the start end pasting process which moves the start end support stand 17 which adsorbs the pasting start end of the 1st work W1 in the direction away from the pasting end, and pastes the pasting start end of both works W1 and W2.
- the main bonding process for moving the bonding roller 11 from the bonding start end to the vicinity of the bonding terminal and the terminal support 18 that adsorbs the bonding terminal of the first work W1 are moved along with the bonding roller 11 and moved. Both the workpieces W1 and W2 are bonded through an end bonding process of bonding the bonding ends of both the workpieces W1 and W2.
- positioning indications 5R, 5L, P1, and P2 with high positional accuracy are provided on each of the first workpiece W1 and the second workpiece W2, and these positioning indications 5R, 5L, P1, and so on.
- the image of P2 is captured by the CCD cameras C6 and C7 so that the positions of both the workpieces W1 and W2 can be accurately specified.
- the position of the suction table 44 is adjusted by the second alignment device 45 in accordance with the positional deviation state of the positioning indications 5R, 5L, P1, and P2, so that both the workpieces W1 and W2 can be accurately positioned.
- the precision bonding apparatus of the present invention it is possible to bond the workpieces W1 and W2 in a precisely positioned state as compared with the conventional bonding apparatus of this type. Further, when both the workpieces W1 and W2 are bonded, the positional deviation of the first workpiece W1 is monitored by the positional deviation monitoring camera C8, and the front and rear positions of the end support 18 are determined by the first alignment device 12 according to the positional deviation state. Both the workpieces W1 and W2 can be bonded while correcting the left and right positions of the slide table 48 with the second alignment device 45 at the same time.
- the workpieces W1 and W2 can be precisely pasted together, and the pasting failure based on the meandering of the first workpiece W1 or the like. Can be eliminated and the yield of the bonded body can be improved.
- the right-eye display unit 5R and the left-eye display unit 5L are used as positioning indications for the first work W1
- the pixel columns P1 and P2 are used as the positioning display of the second workpiece W2
- both the workpieces W1 and W2 can be precisely positioned and bonded with the same accuracy as the formation accuracy of the left and right display portions 5R and 5L or the formation accuracy of the pixel rows P1 and P2.
- the yield can be improved by appropriately bonding the 3D film to the liquid crystal substrate or the plasma substrate, it can greatly contribute to the cost reduction of the device that generates the 3D image.
- the positioning marks can be formed in any shape or color as necessary, and can be formed in a shape or structure that is clearly different from the display portions 5R and 5L and the pixel columns P1 and P2. The position can be specified and the misalignment can be corrected more easily.
- the start end support 17 in a state where the start end of the bonding is adsorbed is moved along with the bonding roller 11, and the start end of the first workpiece W1 is bonded to the bonding roller 11. It is possible to properly bond the bonding start ends of both the workpieces W1 and W2 by restricting the movement of the workpieces W1 and W2. Moreover, when the termination
- the CCD cameras C6 and C7 capture the images of the positioning displays 5R, 5L, P1, and P2 of both the workpieces W1 and W2, and detect the positional deviation between the workpieces W1 and W2. To do. Further, the position of the suction table 44 is adjusted by the second alignment device 45 in accordance with the positional deviation state of the positioning indications 5R, 5L, P1, and P2, so that both the workpieces W1 and W2 can be accurately positioned. Therefore, according to the precision bonding method of this invention, compared with this kind of conventional bonding method, it can bond in the state which positioned both the workpiece
- the positional shift of the first workpiece W1 is monitored by the positional shift monitoring camera C8, and the front and rear positions of the end support base 18 are set according to the positional shift state.
- the workpieces W1 and W2 can be bonded together while correcting the left and right positions of the slide table 48 with the second alignment device 45 at the same time. Therefore, even when the first workpiece W1 meanders or is displaced in the middle of the pasting, both the workpieces W1 and W2 can be pasted properly and precisely, and based on the meandering of the first workpiece W1. Bonding failure can be eliminated and the yield of the bonded body can be improved.
- or FIG. 9 shows the Example of the precision bonding apparatus which concerns on this invention.
- “front / rear / left / right / upper / lower” follows the crossing arrows shown in FIGS. 1 and 2 and the front / rear / left / right / upper / lower notation displayed near the arrows.
- the precision bonding apparatus includes a bonding processing unit 1 disposed in the center, a supply line 2 of the first workpiece W1 disposed behind the bonding processing unit 1, and a left side of the bonding processing unit 1.
- positioned at the right side of the bonding process part 1 are comprised.
- the bonding processing unit 1 includes a lower suction cup 7 that supports the first workpiece W1 at the bonding position, an upper suction cup 8 that is disposed above the lower suction cup 7 and supports the second workpiece W2 to be bonded, and the upper It is configured by an imaging unit or the like disposed above the suction cup 8.
- the first workpiece W1 is made of a 3D film, and as shown in FIG. 6, a display unit 5R for the right eye and a display unit 5L for the left eye are alternately formed in a multistage array on the film surface.
- the second workpiece W2 is composed of a liquid crystal substrate (or plasma substrate) that generates a 3D image, and an RGB pixel column P1 that generates an image for the right eye and an RGB pixel column that generates an image for the left eye on the plate surface.
- P2 is alternately formed in a multistage array to form a matrix.
- one of the right-eye display unit 5R and the left-eye display unit 5L is used as a positioning display for the first workpiece W1, and any one of the right-eye pixel column P1 and the left-eye pixel column P2 is used. One of them is used as a positioning display for the second workpiece W2.
- a plurality of work support bases 10 for sucking and fixing the first work W ⁇ b> 1 by vacuum pressure, and the first work W ⁇ b> 1 released from the suction by the work support base 10 are pressed and bonded to the second work W ⁇ b> 2.
- a bonding roller 11 and a first alignment device 12 that adjusts the front-rear position of the workpiece support 10 are provided.
- a lifting shaft 13 is fixed in front of and behind the lower surface of the work support base 10, and the lifting shaft 13 is guided by a guide cylinder 15 fixed to a base 14 so as to be slidable up and down.
- the work support 10 is formed in a hollow box shape, and a group of suction holes are formed on the upper surface thereof.
- an elevating structure 16 for raising and lowering the work support base 10 is provided in the front-rear center of the lower surface of the work support base 10.
- the elevating structure 16 is composed of a pinion, a rack, a motor that rotationally drives the pinion, and the like, and the work support 10 is moved up and down between an upper bonding position and a lower retraction position.
- the lower suction cup 7 includes a start end support base 17 that adsorbs the bonding start end of the first work W1 and an end support base 18 that adsorbs the bonding end of the first work W1. is there.
- These support bases 17 and 18 are formed in a hollow box shape like the previous work support base 10, and a group of suction holes are formed on the upper surface thereof, so that the first work W1 can be sucked and held at a vacuum pressure. .
- the laminating roller 11 is rotatably supported by a pair of front and rear roller brackets 21.
- the roller bracket 21 is supported by a roller frame 23 guided by a pair of front and rear guide rails 22 via a pair of front and rear air cylinders 24. Thereby, the laminating roller 11 is moved up and down by the air cylinder 24 to the upper laminating position and the lower standby position. If necessary, the laminating roller 11 can be inclined with respect to the horizontal plane by varying the amount of elevation of the front and rear air cylinders 24.
- the roller frame 23 is reciprocated between a bonding start end and a bonding end of the first workpiece W1 by rotating and driving a ball screw shaft 25 disposed on the base 14 by a motor 26.
- a female screw body 27 corresponding to the ball screw shaft 25 is fixed to the roller frame 22.
- the aforementioned starting end support 17 is fixed to the upper surface of a gate-shaped base frame 28 that is guided and supported by a guide rail 21 so as to be slidable to the left and right. It is held at the home position shown.
- the end support 18 is guided and supported by a guide rail 32 provided on the adjustment frame 31 so as to be slidable back and forth.
- the ball screw shaft 33 provided between the adjustment frame 31 and the end support base 18 is rotationally driven by a motor 34, thereby adjusting the position in the front-rear direction on the bonding end side of the first workpiece W1.
- the first alignment device 12 includes the end support base 18, the guide rail 32, the ball screw shaft 33, and the mechanism units such as the motor 34.
- the first alignment device 12 includes a misalignment monitoring camera C8 and a control device (not shown) that controls the operation of the mechanism unit based on the position detection result of the camera C8. The position of the bonding end portion of the first workpiece W1 supported by the end support base 18 can be adjusted back and forth.
- the adjustment frame 31 In order to move the adjustment frame 31 in the left-right direction corresponding to the work size, the adjustment frame 31 is slidably guided by the guide rails 22 provided at the front and rear of the base 14. Further, the ball screw shaft 36 arranged on the base 14 is rotationally driven by a motor 37, whereby the adjustment frame 31 can be moved in the left-right direction. A female screw body 38 corresponding to the ball screw shaft 36 is fixed to the adjustment frame 31. A misalignment monitoring camera C8 is provided on the lower surface side of the front and rear central portion of the end support base 18. A tension state suitable for bonding the first work W1 placed on the work support 10 by moving the end support 18 in a direction away from the work support 10 via the adjustment frame 31 with the ball screw shaft 36. Can be retained.
- the upper suction cup 8 includes a square frame-shaped upper frame 42 that is movably guided and supported by a pair of front and rear guide rails 41, and a linear motor that drives the upper frame 42 in the left-right direction along the guide rails 41 ( Motor) 43, suction table 44 supported by upper frame 42, second alignment device 45, and the like.
- the guide rail 41 is provided on the mount 46 that straddles the lower suction cup 7, and by driving the linear motor 43, the entire upper suction cup 8 is bonded to the pre-bonding position Z 1, the bonding position Z 2, and the unloading position Z 3. Can be moved to.
- a table for mounting the first workpiece W1 and a table for mounting the bonding body W3 are provided at the pre-bonding position Z1 and the unloading position Z3.
- the suction table 44 is supported by a slide table 48 having a pair of left and right support arms 47, and the slide table 48 is supported by a pair of left and right guide rails 49 provided on the upper frame 42 so as to be slidable back and forth.
- the ball screw shaft 50 disposed on the upper frame 42 can be rotated by a motor 51.
- a female screw body 52 that meshes with the ball screw shaft 50 is fixed to the suction table 44.
- the second alignment device 45 includes an upper frame 42, a guide rail 41, a linear motor 43, a guide rail 49 that adjusts the front-rear position of the suction table 44, and a mechanism unit such as a ball screw shaft 50, a motor 51, and a female screw body 52. ing. Further, the second alignment device 45 includes a control device (not shown) that controls the operation of the mechanism unit based on the position detection results of CCD cameras C6 and C7, which will be described later. Can be adjusted back and forth and left and right.
- the suction table 44 includes a group of corner light projection holes 53 for capturing images of the corners of the workpieces W1 and W2, and the front and rear centers of the left and right side ends of the workpieces W1 and W2.
- a group of central light projecting holes 54 for capturing an image of a part is formed in a vertically penetrating manner.
- a hole corresponding to the central projection hole 54 is also formed in the support arm 47 located on the upper right side of the suction table 44. The reason why a large number of the corner light projecting holes 53 and the central light projecting holes 54 are formed in this way is to cope with the difference in work size.
- work W2 is adsorb
- CCD cameras C1 to C3 for capturing the position of the second workpiece W2 placed at the pre-bonding position Z1 as an image are arranged in the imaging unit.
- CCD cameras C4 to C7 for taking the position of the first work W1 placed at the bonding position Z2 as an image are arranged.
- the positional deviation monitoring camera C8 described above is composed of a CCD camera similar to the previous camera.
- four CCD cameras C9 to C12 are arranged on the lower surface side of the bonded body W3 in order to inspect the bonding accuracy of the bonded body W3 placed at the carry-out position Z3.
- a camera support base 55 is provided in the imaging unit as shown in FIG.
- the camera support base 55 in FIG. 5 supports the CCD cameras C4 to C7 provided corresponding to the bonding position Z2.
- the camera support base 55 includes a square frame-shaped base frame 56, a fixed frame 57 fixed on the base frame 56, a movable frame 58 slidably guided and supported by the base frame 56, and the fixed frame 57 and the movable frame 58. And a movable table 59 that is slidably guided back and forth.
- the CCD cameras C1 to C3 provided corresponding to the pre-bonding position Z1 and the CCD cameras C9 to C12 provided corresponding to the carry-out position Z3 are also supported by the camera support base, respectively. Since it has the same structure as the camera support base 55, its description is omitted.
- the first workpiece W1 is supplied from the supply line 2 to the bonding position Z2 by a first workpiece supply device (not shown).
- the first work supply device adjusts the position of the first work W1 so that the corner of the first work W1 is located at the center of the CCD cameras C4 to C5.
- the first work W1 is adsorbed by the work support base 10, the start end support base 17, and the end support base 18.
- the first work supply device sucks the left and right side edges of the first work W1 with a pair of suction tools, and moves the pair of suction tools away from each other to remove the slack in the first state.
- the workpiece W1 can be supplied to the bonding position Z2.
- the second workpiece W2 is supplied from the supply line 3 to the pre-bonding position Z1 by a second workpiece supply device (not shown).
- a second workpiece supply device (not shown).
- the second work W2 is bonded.
- the upper frame 42 is moved to the pre-bonding position Z1, and the second work W2 is sucked by the suction table 44 that has been lowered.
- the CCD camera C3 confirms that the position of the specified pixel row P1 near the center provided on the liquid crystal substrate is located at the center of the image. Thereby, it can confirm that parts other than the corner part of the 2nd workpiece
- the protective film that covers the surface of each workpiece W1 and W2 is peeled off by a peeling device (not shown).
- the suction table 44 is lowered again as shown in FIG. 6C, so that both workpieces W1 and W2 are slightly bonded to each other. Face up and down through. Further, for example, the position of the specified pixel row P1 (Nth from the corner) on the right-eye display unit 5R is positioned in the vicinity of the center of the first workpiece W1, for example, with respect to the display unit 5R for the right eye.
- the mechanism part of the second alignment device 45 is operated so as to coincide with each other, and both the workpieces W1 and W2 are positioned.
- positioning can be accurately performed with accuracy equivalent to the formation accuracy of the display unit 5R and the pixel row P1, and variations in positioning accuracy are within ⁇ 5 ⁇ m. Can fit inside.
- the laminating roller 11 is raised to the laminating position and both the workpieces W1 and W2 are bonded.
- the first work W1 and the second work W2 are bonded through a starting edge bonding process, a main bonding process, and a terminal bonding process.
- the bonding roller 11 in the starting end bonding process is located at a position slightly shifted to the bonding end side from the bonding start ends of both the workpieces W1 and W2.
- the laminating roller 11 is raised to the laminating position, the first workpiece W1 is pressed against the second workpiece W2, and the start support 17 is accompanied by the laminating roller 11 as shown in FIG.
- the bonding start ends of both workpieces W1 and W2 are bonded by moving in a direction away from the bonding end.
- the piston rod of the air cylinder 29 moves right following the base frame 28. In this way, when the bonding start end of the first workpiece W1 is stuck in the state where it is adsorbed by the start support base 17, the bonding start end of the first workpiece W1 is restricted from being displaced by the bonding roller 11. , The bonding start end of both the workpieces W1 and W2 can always be properly bonded.
- the moving direction of the pasting roller 11 is switched in the reverse direction as shown in FIG. 8, and the main pasting process in which the pasting roller 11 moves toward the pasting end. Transition.
- the base frame 28 of the starting end support 17 is returned to the home position by the air cylinder 29.
- the work support 10 is sequentially lowered from the upper bonding position to the lower retreating position, and the bonding roller 11 passes. Evacuate from area.
- the position shift of the first workpiece W1 is monitored by the position shift monitoring camera C8 provided on the end support base 18, and the position of the first work W1 is changed according to the position shift state. Bonding is performed while adjusting with the first alignment device 12 and the second alignment device 45.
- the misalignment monitoring camera C8 monitors misalignment between the right-eye display unit 5R serving as the position reference and the specified pixel row P1, and when misalignment occurs, the mechanism of the first alignment device 12 is detected.
- the terminal support 18 is operated at the same time, and at the same time, the left and right positions of the slide table 48 are corrected by the second alignment device 45 and moved in a direction to correct the positional deviation.
- the display unit 5R and the identified pixel row P1 correctly correspond as shown in FIG.
- the 1st work W1 and the 2nd work W2 can be pasted up in the state to do. That is, both the workpieces W1 and W2 can be precisely bonded while correcting the meandering or displacement movement of the first workpiece W1.
- the terminal support 18 is moved along with the bonding roller 11, and the bonding terminal of the first workpiece W1 is adsorbed by the terminal support 18. Paste as it is. Thereby, it can regulate that the pasting end of the 1st work W1 is shifted and moved by pasting roller 11, and can paste the pasting end of both works W1 and W2 appropriately.
- the bonding accuracy of the bonding body W3 is confirmed by the CCD cameras C9 to C12, and the bonding body W3 determined to be non-defective is sent to the unloading line 4 by the work unloading device. Thereafter, a series of pasting processes are repeatedly performed to paste the first work W1 and the second work W2, but the supply operation of each work W1 and W2 and the confirmation of the bonding accuracy at the carry-out position Z3, etc. It can be performed in parallel with the bonding process.
- the precision bonding method for workpieces according to the present invention can suitably bond both workpieces W1 and W2 according to the following process.
- the second workpiece W2 is supplied to the pre-bonding position Z1, the process of adsorbing by the adsorption table 44, The process of peeling the protective film covering the surfaces of both workpieces W1 and W2 with a peeling device
- the suction table 44 is lowered, and both the workpieces W1 and W2 are vertically aligned through a slight bonding gap;
- the CCD cameras C6 and C7 detect misalignment of both the workpieces W1 and W2, and based on the detection result, the second alignment device 45 adjusts the position of the suction table
- the process of positioning to Both the workpieces W1 and W2 can be bonded through the process of bonding the first workpiece W1 and the second workpiece W2 with the bonding roller 11.
- the positional shift of the first workpiece W1 is monitored by the positional shift monitoring camera C8, and the front and rear positions of the end support base 18 are determined by the first alignment device 12 according to the positional shift state.
- Both the workpieces W1 and W2 can be precisely bonded by correcting and bonding the first workpiece W1 and the second workpiece W2 while simultaneously correcting the left and right positions of the slide table 48 with the second alignment device 45.
- the pasting roller 11 in a state of pressing the first workpiece W1 near the bonding start end and the starting end support 17 that adsorbs the bonding start end of the first workpiece W1 are moved in a direction away from the bonding end,
- the starting end bonding process of bonding the bonding start ends of the workpieces W1 and W2 A main pasting process for moving the pasting roller 11 from the past end to the vicinity of the past end;
- the end support 18 that adsorbs the bonding end of the first workpiece W1 is moved along with the bonding roller 11, and the terminal bonding process of bonding the bonding ends of both the workpieces W1 and W2 is performed. Both works W1 and W2 can be bonded.
- both the workpieces W1 and W2 are precisely positioned by using the display portion 5R formed on the 3D film and the specific pixel column formed on the substrate for positioning display.
- a positioning mark positioning display
- the first workpiece W1 is bonded to the bonding position Z2 from the supply line 2 by the first workpiece supply device. It forms in the state supplied to.
- a positioning mark (positioning display) corresponding to the previous mark is pasted in the vicinity of the front and rear centers of the left and right side edges of the second workpiece W2, and more specifically, the second workpiece W2 is supplied by the second workpiece supply device.
- Both workpieces W1 and W2 are bonded while positioning the pair of marks.
- the positioning marks can be formed by printing, laser marking, holes, crossing lines, etc., and the positional accuracy is preferably within a variation range of several ⁇ m.
- the first alignment device 12 and the second alignment device 45 correct the misalignment.
- work W1 can be corrected by raising / lowering the air cylinder 24 which supports each separately, and inclining the bonding roller 11 diagonally.
- the positional shift of the first workpiece W1 is monitored by the positional shift monitoring camera C8, and the termination is performed according to the positional shift state.
- the first workpiece W1 and the second workpiece W2 may be bonded together while correcting the front / rear position of the support table 18 with the first alignment device 12 and simultaneously correcting the left / right position of the slide table 48 with the inclined bonding roller 11.
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Liquid Crystal (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
Description
本発明の目的は、貼合ローラで押付け操作されるワークが貼合途中に蛇行し、あるいは位置ずれすることがあったとしても、ワークどうしを精密に貼合することができ、従って貼合不良をほとんど生じることもなく歩留まりを向上できるワークの精密貼合装置と、ワークの精密貼合方法を提供することにある。
本発明の目的は、とくに3Dフィルムを液晶基板やプラズマ基板に対して適正に貼合して歩留まりを向上でき、3D画像を生成する機器の低コスト化に大きく寄与できるワークの精密貼合装置と、ワークの精密貼合方法を提供することにある。
第1ワークW1を貼合位置Z2へ供給し、ワーク支持台10、始端支持台17、終端支持台18で第1ワークW1を吸着する過程と、
第2ワークW2を貼合前段位置Z1に供給したのち、吸着台44で吸着する過程と、
両ワークW1・W2の表面を覆う保護フィルムを剥離装置で剥離する過程と、
上フレーム42を貼合位置Z2の真上まで移動させたのち、吸着台44を下降操作して、両ワークW1・W2を僅かな貼合隙間を介して上下に正対させる過程と、
貼合位置Z2において、CCDカメラC6・C7で両ワークW1・W2の位置ずれを検出し、検出結果に基づき第2アライメント装置45で吸着台44の位置を調整して両ワークW1・W2を精密に位置決めする過程と、
第1ワークW1と第2ワークW2を貼合ローラ11で貼合する過程とを経て両ワークW1・W2を貼合できる。
両ワークW1・W2を貼合する過程においては、位置ずれ監視カメラC8で第1ワークW1の位置ずれを監視し、位置ずれ状態に応じて終端支持台18の前後位置を第1アライメント装置12で矯正し、同時にスライド台48の左右位置を第2アライメント装置45で矯正しながら、第1ワークW1と第2ワークW2を貼合することにより、両ワークW1・W2を精密に貼合できる。
第1ワークW1の貼合始端寄りを押付けた状態の貼合ローラ11と、第1ワークW1の貼合始端を吸着する始端支持台17とを、貼合終端から離れる向きに移動させて、両ワークW1・W2の貼合始端を貼合する始端貼合過程と、
貼合ローラ11を貼合始端から貼合終端の近傍まで移動させる主貼合過程と、
第1ワークW1の貼合終端を吸着する終端支持台18を貼合ローラ11に同行して移動させて、両ワークW1・W2の貼合終端を貼合する終端貼合過程とを経て、
両ワークW1・W2を貼合することができる。
W2 第2ワーク
Z1 貼合前段位置
Z2 貼合位置
Z3 搬出位置
7 下吸盤
8 上吸盤
10 ワーク支持台
11 貼合ローラ
12 第1アライメント装置
17 始端支持台
18 終端支持台
Claims (6)
- 第1ワーク(W1)を貼合位置において支持する下吸盤(7)と、
貼合対象となる第2ワーク(W2)を支持して、第2ワーク(W2)を貼合前段位置(Z1)、貼合位置(Z2)、搬出位置(Z3)へ移送する上吸盤(8)とを備えており、
第1ワーク(W1)および第2ワーク(W2)には、それぞれ位置精度が高い位置決め表示(5R・5L・P1・P2)が設けられており、
下吸盤(7)には、第1ワーク(W1)を吸着する複数のワーク支持台(10)および終端支持台(18)と、第1ワーク(W1)と第2ワーク(W2)を貼合する貼合ローラ(11)と、終端支持台(18)の前後位置を調整する第1アライメント装置(12)とが設けられおり、
上吸盤(8)には、第2ワーク(W2)を吸着固定する吸着台(44)と、吸着台(44)の前後位置、および左右位置を調整する第2アライメント装置(45)とが設けられており、
貼合位置(Z2)において、CCDカメラ(C6・C7)で両ワーク(W1・W2)の位置決め表示(5R・5L・P1・P2)に基づき位置ずれを検出し、検出結果に基づき第2アライメント装置(45)で吸着台(44)の位置を調整して両ワーク(W1・W2)が位置決めされており、
第1ワーク(W1)と第2ワーク(W2)を貼合ローラ(11)で貼合する状態において、位置ずれ監視カメラ(C8)で第1ワーク(W1)の位置ずれを監視し、位置ずれ状態に応じて終端支持台(18)の前後位置を第1アライメント装置(12)で矯正し、同時にスライド台(48)の左右位置を第2アライメント装置(45)で矯正しながら、第1ワーク(W1)と第2ワーク(W2)を貼合することを特徴とするワークの精密貼合装置。 - 第1ワーク(W1)が3Dフィルムからなり、第2ワーク(W2)が液晶基板とプラズマ基板とのいずれか一方で形成されており、
第1ワーク(W1)には、右目用の画像の通過を許す一群の表示部(5R)と、左目用の画像の通過を許す一群の表示部(5L)とが直線列状に交互に形成してあり、
第1ワーク(W1)の中央部付近に位置する右目表示部(5R)と左目表示部(5L)とのいずれか一方と、第2ワーク(W2)の中央付近に設けられた特定のピクセル列(P1・P2)のいずれか一方とを位置決めして両ワーク(W1・W2)の貼合を行う請求項1に記載のワークの精密貼合装置。 - 第1ワーク(W1)が3Dフィルムからなり、第2ワーク(W2)が液晶基板とプラズマ基板とのいずれか一方で形成されており、
第1ワーク(W1)の左右側縁の前後中央付近に、位置決め用のマークが3Dフィルムの貼合過程で形成されており、
第2ワーク(W2)の左右側縁の前後中央付近に、前記マークと対応する位置決め用のマークが貼合過程で形成されており、
前記一対のマークを位置決めして両ワーク(W1・W2)の貼合を行なう請求項1に記載のワークの精密貼合装置。 - 複数のワーク支持台(10)の貼合始端に隣接して第1ワーク(W1)の貼合始端を吸着する始端支持台(17)が配置されて、ワーク支持台(10)と始端支持台(17)との間に貼合ローラ(11)が配置されており、
複数のワーク支持台(10)の貼合終端に隣接して第1ワーク(W1)の貼合終端を吸着する終端支持台(18)が配置されており、
第1ワーク(W1)の貼合始端を吸着した状態の始端支持台(17)を、貼合ローラ(11)に同行して貼合終端から離れる向きへ移動させて両ワーク(W1・W2)の貼合始端を貼合し、
第1ワーク(W1)の貼合終端を吸着した状態の終端支持台(18)を、貼合ローラ(11)に同行して移動させて両ワーク(W1・W2)の貼合終端を貼合する請求項1から3のいずれかひとつに記載のワークの精密貼合装置。 - 第1ワーク(W1)を複数のワーク支持台(10)および終端支持台(18)で吸着固定し、貼合対象となる第2ワーク(W2)を吸着台(44)で吸着固定し、貼合位置(Z2)において両ワーク(W1・W2)を正対させた状態で、貼合ローラ(11)で両ワーク(W1・W2)を貼合する精密貼合方法であって、
貼合位置(Z2)において、CCDカメラ(C6・C7)で両ワーク(W1・W2)の位置決め表示(5R・5L・P1・P2)の画像を取り込んで、両ワーク(W1・W2)の位置ずれを検出し、検出結果に基づき第2アライメント装置(45)で吸着台(44)の位置を調整して両ワーク(W1・W2)が位置決めされており、
第1ワーク(W1)と第2ワーク(W2)を貼合ローラ(11)で貼合する過程において、位置ずれ監視カメラ(C8)で第1ワーク(W1)の位置ずれを監視し、位置ずれ状態に応じて終端支持台(18)の前後位置を第1アライメント装置(12)で矯正し、同時にスライド台(48)の左右位置を第2アライメント装置(45)で矯正しながら、第1ワーク(W1)と第2ワーク(W2)を貼合することを特徴とするワークの精密貼合方法。 - 第1ワーク(W1)と第2ワーク(W2)を貼合ローラ(11)で貼合する貼合過程において、
第1ワーク(W1)の貼合始端寄りを押付けた状態の貼合ローラ(11)と、第1ワーク(W1)の貼合始端を吸着する始端支持台(17)とを、貼合終端から離れる向きに移動させて、両ワーク(W1・W2)の貼合始端を貼合する始端貼合過程と、
貼合ローラ(11)を貼合始端から貼合終端の近傍まで移動させる主貼合過程と、
第1ワーク(W1)の貼合終端を吸着する終端支持台(18)を貼合ローラ(11)に同行して移動させて、両ワーク(W1・W2)の貼合終端を貼合する終端貼合過程とを経て、
両ワーク(W1・W2)を貼合する請求項5に記載のワークの精密貼合方法。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013520304A JP5710761B2 (ja) | 2011-06-15 | 2011-06-15 | ワークの精密貼合装置、およびワークの精密貼合方法 |
CN201180033966.XA CN103003070B (zh) | 2011-06-15 | 2011-06-15 | 工件的精密粘合装置以及工件的精密粘合方法 |
PCT/JP2011/003421 WO2012172603A1 (ja) | 2011-06-15 | 2011-06-15 | ワークの精密貼合装置、およびワークの精密貼合方法 |
KR1020137001297A KR101808629B1 (ko) | 2011-06-15 | 2011-06-15 | 공작물의 정밀 접합 장치, 및 공작물의 정밀 접합 방법 |
TW101119286A TWI505936B (zh) | 2011-06-15 | 2012-05-30 | 工件的精密貼合裝置,及工件的精密貼合方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/JP2011/003421 WO2012172603A1 (ja) | 2011-06-15 | 2011-06-15 | ワークの精密貼合装置、およびワークの精密貼合方法 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2012172603A1 true WO2012172603A1 (ja) | 2012-12-20 |
Family
ID=47356634
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2011/003421 WO2012172603A1 (ja) | 2011-06-15 | 2011-06-15 | ワークの精密貼合装置、およびワークの精密貼合方法 |
Country Status (5)
Country | Link |
---|---|
JP (1) | JP5710761B2 (ja) |
KR (1) | KR101808629B1 (ja) |
CN (1) | CN103003070B (ja) |
TW (1) | TWI505936B (ja) |
WO (1) | WO2012172603A1 (ja) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5311527B1 (ja) * | 2013-04-04 | 2013-10-09 | 株式会社Fuk | 貼付装置 |
JP5339393B1 (ja) * | 2013-05-07 | 2013-11-13 | 株式会社Fuk | 貼付装置 |
JP2015039862A (ja) * | 2013-08-23 | 2015-03-02 | クライムプロダクツ株式会社 | ワークを湾曲状に貼合する貼合装置、および貼合方法 |
WO2018079158A1 (ja) * | 2016-10-26 | 2018-05-03 | 旭硝子株式会社 | 積層体の製造方法 |
CN109001923A (zh) * | 2018-07-27 | 2018-12-14 | 苏州精濑光电有限公司 | 一种面板预对位方法 |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6404586B2 (ja) * | 2014-03-31 | 2018-10-10 | 平田機工株式会社 | 製造方法及び製造装置 |
CN204137371U (zh) * | 2014-09-18 | 2015-02-04 | 弘森电子(上海)有限公司 | 一种网版式贴膜装置 |
JP6566386B2 (ja) * | 2014-11-25 | 2019-08-28 | Agc株式会社 | 基板の貼合装置及び貼合方法並びに電子デバイスの製造方法 |
JP6788406B2 (ja) * | 2016-07-15 | 2020-11-25 | 株式会社Screenラミナテック | 貼付装置および貼付方法 |
TWI634953B (zh) * | 2017-03-28 | 2018-09-11 | 財團法人工業技術研究院 | 點膠裝置及方法 |
CN109531984A (zh) * | 2018-11-18 | 2019-03-29 | 湖南宽洋科技有限公司 | 一种手机屏幕出厂用自动封膜装置 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH03157615A (ja) * | 1989-11-15 | 1991-07-05 | Shinetsu Eng Kk | 液晶表示板用ガラス基板の貼合せ方法及びその貼合せ装置 |
JP2007033537A (ja) * | 2005-07-22 | 2007-02-08 | Sharp Corp | 可撓性表示素子の製造装置およびその素子の製造方法 |
JP2008139523A (ja) * | 2006-12-01 | 2008-06-19 | Hitachi High-Technologies Corp | 光学フィルム貼付け方法、光学フィルム貼付け装置、及び表示用パネルの製造方法 |
JP2009280338A (ja) * | 2008-05-21 | 2009-12-03 | Kuraimu Prod Kk | ワーク貼合装置およびワーク貼合方法 |
JP2010008811A (ja) * | 2008-06-27 | 2010-01-14 | Nec Lcd Technologies Ltd | 位置合わせ用マーカ、それを用いた表示装置およびその製造方法 |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1796105A (zh) * | 2002-06-11 | 2006-07-05 | 富士通株式会社 | 制造粘合基板的方法和装置 |
TWI245944B (en) * | 2002-12-19 | 2005-12-21 | Fujitsu Ltd | Panel bonding method and device |
JP2004341279A (ja) * | 2003-05-16 | 2004-12-02 | Dainippon Printing Co Ltd | カラーフィルタの製造装置、カラーフィルタの製造方法、及びカラーフィルタ |
JP5117109B2 (ja) * | 2006-08-17 | 2013-01-09 | 株式会社アルバック | 貼り合せ基板の製造方法、及び貼り合せ基板製造装置 |
JP4870046B2 (ja) * | 2007-08-06 | 2012-02-08 | クライムプロダクツ株式会社 | 板ガラスの貼合方法およびその装置 |
CN103258762B (zh) * | 2007-08-10 | 2016-08-03 | 株式会社尼康 | 基板贴合装置及基板贴合方法 |
JP5376196B2 (ja) | 2007-12-05 | 2013-12-25 | 株式会社リコー | 粉体搬送装置、および画像形成装置 |
JP5134496B2 (ja) * | 2008-10-16 | 2013-01-30 | クライムプロダクツ株式会社 | ワーク貼合装置 |
-
2011
- 2011-06-15 CN CN201180033966.XA patent/CN103003070B/zh active Active
- 2011-06-15 KR KR1020137001297A patent/KR101808629B1/ko active IP Right Grant
- 2011-06-15 JP JP2013520304A patent/JP5710761B2/ja active Active
- 2011-06-15 WO PCT/JP2011/003421 patent/WO2012172603A1/ja active Application Filing
-
2012
- 2012-05-30 TW TW101119286A patent/TWI505936B/zh active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH03157615A (ja) * | 1989-11-15 | 1991-07-05 | Shinetsu Eng Kk | 液晶表示板用ガラス基板の貼合せ方法及びその貼合せ装置 |
JP2007033537A (ja) * | 2005-07-22 | 2007-02-08 | Sharp Corp | 可撓性表示素子の製造装置およびその素子の製造方法 |
JP2008139523A (ja) * | 2006-12-01 | 2008-06-19 | Hitachi High-Technologies Corp | 光学フィルム貼付け方法、光学フィルム貼付け装置、及び表示用パネルの製造方法 |
JP2009280338A (ja) * | 2008-05-21 | 2009-12-03 | Kuraimu Prod Kk | ワーク貼合装置およびワーク貼合方法 |
JP2010008811A (ja) * | 2008-06-27 | 2010-01-14 | Nec Lcd Technologies Ltd | 位置合わせ用マーカ、それを用いた表示装置およびその製造方法 |
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5311527B1 (ja) * | 2013-04-04 | 2013-10-09 | 株式会社Fuk | 貼付装置 |
KR101479036B1 (ko) | 2013-04-04 | 2015-01-05 | 가부시키가이샤 후쿠 | 부착 장치 |
JP5339393B1 (ja) * | 2013-05-07 | 2013-11-13 | 株式会社Fuk | 貼付装置 |
JP2015039862A (ja) * | 2013-08-23 | 2015-03-02 | クライムプロダクツ株式会社 | ワークを湾曲状に貼合する貼合装置、および貼合方法 |
WO2018079158A1 (ja) * | 2016-10-26 | 2018-05-03 | 旭硝子株式会社 | 積層体の製造方法 |
JPWO2018079158A1 (ja) * | 2016-10-26 | 2019-09-12 | Agc株式会社 | 積層体の製造方法 |
CN109001923A (zh) * | 2018-07-27 | 2018-12-14 | 苏州精濑光电有限公司 | 一种面板预对位方法 |
CN109001923B (zh) * | 2018-07-27 | 2021-03-23 | 苏州精濑光电有限公司 | 一种面板预对位方法 |
Also Published As
Publication number | Publication date |
---|---|
CN103003070A (zh) | 2013-03-27 |
TWI505936B (zh) | 2015-11-01 |
JP5710761B2 (ja) | 2015-04-30 |
TW201309481A (zh) | 2013-03-01 |
KR101808629B1 (ko) | 2018-01-18 |
CN103003070B (zh) | 2015-08-19 |
JPWO2012172603A1 (ja) | 2015-02-23 |
KR20140027041A (ko) | 2014-03-06 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP5710761B2 (ja) | ワークの精密貼合装置、およびワークの精密貼合方法 | |
US9289970B2 (en) | Apparatus and method for peeling protective film and method for fabricating stereoscopic image display device | |
JP4870046B2 (ja) | 板ガラスの貼合方法およびその装置 | |
CN107831598B (zh) | 一种光栅精确对位贴合方法及其装置 | |
JP5897208B2 (ja) | パネル取り付け装置 | |
CN110873974B (zh) | 一种光电显示玻璃基板对位贴合设备 | |
CN110654596A (zh) | 一种自动对位偏贴机 | |
KR20080100583A (ko) | 구동용 회로기판의 본딩장치 및 그 방법 | |
KR102058364B1 (ko) | 기판 본딩 접합장치 | |
JP2016069264A (ja) | カバーガラスの貼合装置 | |
KR101318178B1 (ko) | 편광판 부착장치 | |
CN114677926A (zh) | 一种微显示器的贴合系统及贴合方法 | |
JP5793457B2 (ja) | 転写方法および転写装置 | |
JP5798017B2 (ja) | 転写装置、アライメント方法および転写方法 | |
CN114694525B (zh) | 一种微显示器贴合系统及方法 | |
TW201344808A (zh) | 組裝裝置 | |
KR101194341B1 (ko) | 시트 재단장치 | |
JP5829499B2 (ja) | アライメント方法およびパターン形成方法 | |
JP3344060B2 (ja) | 板状部材の位置合わせ方法及びその装置とそれを用いた液晶画面の製造方法 | |
KR101297379B1 (ko) | 편광판 부착장치 | |
KR101467239B1 (ko) | 테이프 부착장치 | |
JP5793410B2 (ja) | パターン形成装置 | |
KR101421281B1 (ko) | 필름 부착 장치 및 이를 이용한 필름 부착 방법 | |
KR102064720B1 (ko) | 기판 본딩 접합장치 | |
CN115367188B (zh) | 贴膜设备及贴膜方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
ENP | Entry into the national phase |
Ref document number: 20137001297 Country of ref document: KR Kind code of ref document: A |
|
121 | Ep: the epo has been informed by wipo that ep was designated in this application |
Ref document number: 11867614 Country of ref document: EP Kind code of ref document: A1 |
|
ENP | Entry into the national phase |
Ref document number: 2013520304 Country of ref document: JP Kind code of ref document: A |
|
NENP | Non-entry into the national phase |
Ref country code: DE |
|
122 | Ep: pct application non-entry in european phase |
Ref document number: 11867614 Country of ref document: EP Kind code of ref document: A1 |