WO2012147659A1 - 静電容量センサシートの製造方法及び静電容量センサシート - Google Patents
静電容量センサシートの製造方法及び静電容量センサシート Download PDFInfo
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- WO2012147659A1 WO2012147659A1 PCT/JP2012/060748 JP2012060748W WO2012147659A1 WO 2012147659 A1 WO2012147659 A1 WO 2012147659A1 JP 2012060748 W JP2012060748 W JP 2012060748W WO 2012147659 A1 WO2012147659 A1 WO 2012147659A1
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- detection electrode
- binder resin
- sensor sheet
- base material
- pattern layer
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
- G06F3/0446—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means using a grid-like structure of electrodes in at least two directions, e.g. using row and column electrodes
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R27/00—Arrangements for measuring resistance, reactance, impedance, or electric characteristics derived therefrom
- G01R27/02—Measuring real or complex resistance, reactance, impedance, or other two-pole characteristics derived therefrom, e.g. time constant
- G01R27/26—Measuring inductance or capacitance; Measuring quality factor, e.g. by using the resonance method; Measuring loss factor; Measuring dielectric constants ; Measuring impedance or related variables
- G01R27/2605—Measuring capacitance
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R3/00—Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments, e.g. of probe tips
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/0416—Control or interface arrangements specially adapted for digitisers
- G06F3/04164—Connections between sensors and controllers, e.g. routing lines between electrodes and connection pads
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
- G06F3/0445—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means using two or more layers of sensing electrodes, e.g. using two layers of electrodes separated by a dielectric layer
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
- G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
- G06F2203/04103—Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
- Y10T29/49162—Manufacturing circuit on or in base by using wire as conductive path
Definitions
- the present invention relates to a method for manufacturing a capacitance sensor sheet used for operations of audio devices, automobile mounted devices, and the like, and a capacitance sensor sheet, for example.
- the conventional capacitance sensor sheet includes first and second substrates that adhere to each other, and a conductive X pattern layer is conductive on the first substrate and conductive on the second substrate.
- a Y finger layer as a conductor is close to a selected portion of the X pattern layer or the Y pattern layer, the electrostatic capacity is formed. By detecting this change and outputting it to the control device, it functions to contribute to the operation of the on-vehicle equipment (see Patent Documents 1, 2, 3, 4, and 5).
- the first and second base materials each include an insulating base material layer and a silver nanowire-containing binder resin layer laminated on the surface of the base material layer, and are adhesively fixed by an insulating adhesive sheet. Yes.
- Each of the first and second substrates has an elongated tail portion protruding from the rear periphery of the substrate layer, and this tail portion is connected to the control device.
- the binder resin layer of the first base material is formed by applying a binder resin solution in which silver nanowires are dispersed on the surface of the base material layer, followed by drying and curing, and is formed as a part of the X pattern layer.
- the binder resin layer of the second substrate is formed by applying a binder resin solution in which silver nanowires are dispersed to the surface of the substrate layer and drying and curing it, and is formed on a part of the Y pattern layer. .
- the X pattern layer includes a plurality of X detection electrodes arranged in a row at a predetermined interval in the X direction and arranged in a row in the surface Y direction of the base material layer of the first base material.
- a conductive lead line is electrically overlapped and connected to the surface of the terminal X detection electrode, and this lead line is formed to extend on the tail portion of the first base material to be electrically connected to the control device. Conductive connection is established.
- Each X detection electrode is formed in a substantially diamond pattern, and functions to detect a change in capacitance when the user's finger comes close.
- a plurality of X detection electrodes are formed by etching the binder resin layer of the first base material, and a silver paste is printed on the surface of the base material layer of the first base material.
- a plurality of lead lines are formed by drying and curing.
- a plurality of Y detection electrodes arranged in a line in the surface X direction of the base material layer of the second base material are arranged in the Y direction at a predetermined interval, and a plurality of Y detection electrodes arranged in the surface X direction are arranged.
- a conductive lead line is electrically overlapped and connected to the surface of the Y detection electrode at the end, and this lead line is formed to extend to the tail portion through the through hole, and is electrically connected to the control device. Conductive connection.
- Each Y detection electrode is formed in a substantially diamond pattern, and detects a change in capacitance when a user's finger approaches.
- a Y pattern layer has a plurality of Y detection electrodes formed by etching the binder resin layer of the second base material, and the surface of the base material layer of the second base material.
- a silver paste is printed on and dried and cured to form a plurality of lead lines.
- the conventional capacitance sensor sheet is configured as described above, and uses silver nanowires dispersed in the binder resin layer for electrical conduction.
- the thick overcoat of the binder resin layer causes the silver resin from the binder resin layer to be silver.
- the nanowires protrude sufficiently and are not exposed, or the binder resin of the binder resin layer adheres to the surface of the silver nanowires to form an insulating film.
- the conductivity at the connection between the terminal X detection electrode or Y detection electrode and the lead line deteriorates, and sufficient conductivity is ensured. The problem of not being able to do arises.
- the present invention has been made in view of the above, and provides a method for manufacturing a capacitance sensor sheet and a capacitance sensor sheet that can improve the electrical conductivity in at least a connection portion between a detection electrode and a routing line of a pattern layer.
- the purpose is that.
- a binder resin layer containing conductive nanowires is formed on a base material layer having insulating properties, and a base material from which conductive nanowires partially protrude from the surface of the binder resin layer is formed.
- Etching process removes the binder resin in the protruding part of the conductive nanowire partially protruding from the detection electrode, By applying a conductive material to the base material layer of the base material and drying and curing it, a wiring line of the pattern layer having conductivity is formed, At least a part of the surface of the detection electrode of the pattern layer is connected to the routing line, and a protruding portion of the conductive nanowire from which the binder resin is removed is brought into contact with the connection portion.
- the surface etching process can be performed by either a dry etching method or a wet etching method.
- the surface etching processing can be performed by a plasma processing method, an ultraviolet processing method, or a corona processing method.
- the surface of all the detection electrodes in the pattern layer can be subjected to surface etching processing. Further, the surface of the detection electrode connected to the routing line can be subjected to surface etching processing.
- a conductive pattern layer is formed on an insulating base material layer, and a change in capacitance is detected when a conductor approaches the detection electrode of this pattern layer.
- the pattern layer includes a plurality of detection electrodes arranged on the base material layer and a lead line formed on the base material layer and connected to the plurality of detection electrodes, and the plurality of detection electrodes are electrically connected to the base material layer.
- a binder resin layer containing nanowires, partially projecting conductive nanowires from the surface, and processing this binder resin layer The binder resin in the protruding portion of the conductive nanowire partially protruding from the detection electrode is removed by subjecting at least the surface end portion of the detection electrode connected to the drawing line of the pattern layer to surface etching, and this binder resin The protruding portion of the conductive nanowire from which the metal is removed is brought into contact with the connection portion between the detection electrode and the routing line.
- the surface etching process can be performed by either a dry etching method or a wet etching method.
- the surface etching processing can be performed by a plasma processing method, an ultraviolet processing method, or a corona processing method.
- the surface of all the detection electrodes in the pattern layer can be subjected to surface etching processing. Further, the surface of the detection electrode connected to the routing line can be subjected to surface etching processing.
- the base material layer is made to be a pair of base material layers that are adhered to face each other, an X pattern layer is formed on one base material layer, the plurality of X detection electrodes are arranged in the X direction, and the other base material A Y pattern layer is formed on the layer, the plurality of Y detection electrodes are arranged in the Y direction, and at least the surface of the terminal X detection electrode connected to be overlapped with at least the routing line among the plurality of X detection electrodes of the X pattern layer It is also possible to subject the end portion to a surface etching process, and among the plurality of Y detection electrodes of the Y pattern layer, at least the surface end portion of the terminal Y detection electrode connected to be overlapped with the routing line can be subjected to a surface etching process. .
- the base material and the base material layer in the claims may be one sheet or a plurality of sheets. At least part of the surface of the binder resin layer is subjected to surface etching processing before and after being processed into a plurality of detection electrodes. Further, the pattern layer only needs to be subjected to surface etching processing on the surface end portion of the detection electrode connected to the routing line, the surface of the detection electrode connected to the routing line and its peripheral portion, the surface of all the detection electrodes, The peripheral edge portion may be subjected to surface etching processing.
- the surface edge of the detection electrode means an edge on the surface, and does not mean an edge of a surface orthogonal to the surface, a so-called edge.
- the detection electrode is preferably a diamond pattern that can efficiently use space, but does not particularly exclude a planar circle, rectangle, polygon, or the like. Further, various dry etching methods and wet etching methods correspond to the method for realizing the surface etching processing.
- the conductive nanowire partially protruding from the detection electrode is subjected to surface etching processing at least on the end portion of the detection electrode surface connected to the routing line, so that the insulating nanowire attached to the protrusion is insulated.
- the binder resin is removed, conductivity is ensured, and the connecting portion between the detection electrode and the routing line is electrically contacted as an auxiliary electrode. Therefore, the continuity at the connection portion between the detection electrode and the routing line is improved.
- the binder resin in the protruding portion of the conductive nanowire protruding from the detection electrode is removed, it is possible to improve the conductivity at the connection portion between at least the detection electrode and the routing line of the pattern layer. is there.
- the workability can be improved by eliminating the trouble of draining the etching solution and masking work. Can be expected. If the wet etching method is adopted, the selectivity is higher than that of the dry etching method, so that the economy can be improved.
- the surface etching process is performed by a plasma treatment method, an ultraviolet treatment method, or a corona treatment method, unnecessary damage to the detection electrode is prevented, and the operation speed is increased. Can be achieved. Further, if the plasma processing method is used, the activation effect on the surface of the detection electrode can be enhanced, the fine processing is facilitated, and precise cleaning is possible.
- the construction of the UV irradiation device is relatively simple compared to other devices, making maintenance and management easier and preventing the detection electrode from being adversely affected by heat. It becomes. Furthermore, if it processes by a corona treatment method, the improvement of clean property and adhesiveness can be anticipated.
- the capacitance sensor sheet according to the present embodiment is a first and second base material that adheres to each other.
- the binder resin 7 of the silver nanowire 4 protruding from the surface is removed, and the silver nanowire 4 is routed around the X detection electrode 11 or the Y detection electrode 21 and brought into contact with the connection portions 13 and 23 of the lines 12 and 22. Unishi to have.
- the first and second base materials 1 and 1A are made of an insulating base material layer 2 and a binder resin layer laminated on the surface of the base material layer 2. 3, conductive and low-resistance silver nanowires 4 protrude from the binder resin layer 3, and are stuck and fixed by an insulating adhesive sheet 5.
- the first base material 1 is positioned below and opposed to the second base material 1A, and an elongated tail portion 6 is formed so as to protrude from the rear periphery of the base material layer 2.
- the tail portion 6 serves as a control device. It is detachably connected via an electrical connector.
- the second base material 1A is located above the second base material 1 and has an elongated tail portion 6 protruding from the rear periphery of the base material layer 2.
- the tail portion 6 provides an electrical connector to the control device. It is detachably connected via.
- Each base material layer 2 is formed in a horizontally long planar rectangle by, for example, a polyethylene terephthalate excellent in heat resistance and strength, a polycarbonate transparent film, or the like, as shown in FIGS.
- the binder resin layer 3 is made of, for example, an acrylic resin, an epoxy resin, a polyimide resin, and the like, and is formed by laminating a binder resin solution impregnated with a large number of silver nanowires 4 on the surface of the base layer 2 and drying and curing it. It functions to fix the silver nanowire 4 to the base material layer 2. As shown in FIG. 3, the silver nanowire 4 irregularly and partially protrudes from the surface of the dried and cured binder resin layer 3, and the binder resin 7 of the binder resin layer 3 is insulatively coated on the protruding portion. Adhere as. Such a binder resin layer 3 forms a part of the X pattern layer 10 or the Y pattern layer 20 by laser processing or the like during the production of the capacitance sensor sheet.
- the lamination formation of the binder resin layer 3 is mainly performed by applying a binder resin solution in which silver nanowires 4 which are conductive ultrafine fibers are dispersed, but is not particularly limited.
- a dispersion containing silver nanowires 4 is coated on the entire surface of the base material layer 2 and dried, and a network of silver nanowires 4 is temporarily fixed on the entire surface of the base material layer 2.
- a liquid transparent insulating base material specifically, a binder resin such as an acrylic resin is applied on the silver nanowire 4, and the binder resin is heated or cured by irradiation with ultraviolet rays or an electron beam.
- the binder resin layer 3 in which the silver nanowires 4 are networked can be laminated.
- the pressure-sensitive adhesive sheet 5 is preferably transparent.
- the pressure-sensitive adhesive sheet 5 does not have a double-sided tape or a base material provided with a transparent pressure-sensitive adhesive material such as acrylic resin on both the front and back surfaces of a transparent base sheet made of polyethylene terephthalate or acrylic resin ( Substrate-less) Adhesive tape or the like is used, and these are adhesively fixed in a state of being sandwiched between the opposing base material layers 2 of the first and second base materials 1 and 1A.
- the X pattern layer 10 is formed by including a plurality of X detection electrodes 11 arranged in the Y direction, and lead lines 12 for the plurality of X detection electrodes 11. .
- the plurality of X detection electrodes 11 are arranged in a row in the surface Y direction of the surface of the base material layer 2 of the first base material 1 and are arranged in the X direction at predetermined intervals. Most of the plurality of X detection electrodes 11 are formed in a thin film having a substantially diamond pattern in plan view, and the remaining X detection electrodes 11 located at both ends of the row are formed in a thin film having a substantially half diamond pattern in plan view.
- the end of the X detection electrode 11 at the end of the column is electrically overlapped with the end of a conductive and elongated low-resistance lead line 12.
- the lead line 12 is extended to the tail portion 6 of the first base 1 and is electrically connected to the control device.
- a plurality of X detection electrodes 11 having conductivity are formed by processing the binder resin layer 3 in the first substrate 1, and the substrate layer 2 of the first substrate 1.
- a conductive material such as silver paste is screen-printed or gravure-printed on the surface, and dried and hardened to form a plurality of lead lines 12.
- At least the surface end portion of the terminal X detection electrode 11 connected to the end portion of the routing line 12 is a surface from the viewpoint of ensuring good conductivity with the routing line 12.
- Etching is processed.
- the surface etching processing include a dry etching method and a wet etching method including a plasma processing method, an ultraviolet processing method, a corona processing method, a laser processing method, a blast processing method, and the like.
- Either the dry etching method or the wet etching method may be used, but in the case of the wet etching method, it is preferable to employ the dry etching method because an etching solution discharge process and masking are required.
- the dry etching methods a plasma treatment method, an ultraviolet treatment method, and a corona treatment method are preferable from the viewpoint of preventing unnecessary damage and speeding up the operation.
- both direct plasma and reactive ion etching can be expected to be effective.
- reactive ion etching it is possible to set a wide range of processing conditions (processing time).
- the output of the plasma treatment is preferably in the range of 0.01 to 0.5 W / cm 2 .
- the processing output is less than 0.01 W / cm 2 , the effect of the surface etching process is not recognized.
- the processing output exceeds 0.5 W / cm 2 , the silver nanowire 4 of the binder resin layer 3 is used. This is because the resistance value increases significantly due to damage.
- W / cm 2 is the output per unit area of the electrode of the processing apparatus.
- the plasma treatment method is preferably performed in a treatment time of 30 seconds to 5 minutes in the case of direct plasma, and in a treatment time of 30 seconds to 10 minutes in the case of reactive ion etching. If this is earlier than this, sufficient effect of the surface etching process cannot be obtained. Conversely, if it is slower, the silver nanowire 4 of the binder resin layer 3 is damaged and the resistance value is significantly increased. Because it does. Further, oxygen, argon, a mixed system of oxygen and argon, or the like is used as a processing gas for plasma processing. Among these, the use of argon gas that can eliminate the risk of oxidation of the silver nanowire 4 is optimal.
- the light source used for ultraviolet ray irradiation has low energy in the high pressure mercury lamp (wavelength 365 nm), and is not suitable for the surface etching processing of the overcoat of the binder resin layer 3. It is preferable to use (for example, a wavelength of 185 nm or 254 nm).
- the illuminance of ultraviolet rays is preferably in the range of 10 to 300 mW / cm 2 . This is because the effect is not observed when the illuminance of ultraviolet rays is less than 10 mW / cm 2 , and conversely, when the illuminance of ultraviolet rays exceeds 300 mW / cm 2 , the silver nanowires 4 of the binder resin layer 3 are damaged. This is because there is a possibility that the resistance value is remarkably increased and the base material layer 2 and the overcoat layer are discolored (yellowed).
- the distance from the electrode of the treatment apparatus to the silver nanowire 4 is preferably in the range of 1 to 10 mm. This is based on the reason that when the distance is less than 1 mm, the silver nanowire 4 is damaged and the resistance value is significantly increased. Conversely, when the distance exceeds 10 mm, a sufficient effect cannot be expected.
- the processing output is preferably in the range of 0.2 to 20 W / cm. This is because the effect cannot be expected when the processing output is less than 0.2 W / cm, and conversely, when it exceeds 20 W / cm, the silver nanowire 4 is damaged and the resistance value is significantly increased. based on. W / cm is the output per unit length of the electrode.
- the X pattern layer 10 is relatively moved to perform the treatment on each of the plurality of X detection electrodes 11 for each column.
- This treatment is desirably performed at a speed of 0.1 to 20 m / min. . This is because if it is earlier than this, a sufficient effect cannot be obtained, and if it is later, the silver nanowire 4 is damaged and the resistance value is significantly increased.
- the wet etching method When the wet etching method is employed as the surface etching processing, it is preferable to use water or an aqueous solution as the etchant if the binder resin component is water-soluble. On the other hand, if the binder resin component is water-insoluble, an organic solution whose binder resin solubility parameter approximates may be used, and the concentration, immersion temperature, and immersion time may be appropriately adjusted according to the material and thickness.
- the wet etching method includes a dipping method, a spray method, and a spin method, and the most convenient dipping method is optimal.
- the silver nanowire 4 partially protruding from the surface end portion of the terminal X detection electrode 11 has an increased protruding range, and the insulating binder resin 7 attached to the protruding portion is removed.
- the conductivity is ensured, and the terminal X detection electrode 11 and the connecting portion 13 between the routing line 12 are electrically contacted as an auxiliary electrode (see FIG. 8).
- the Y pattern layer 20 is formed to include a plurality of Y detection electrodes 21 arranged in the X direction, and lead lines 22 for the plurality of Y detection electrodes 21. .
- the plurality of Y detection electrodes 21 are arranged in a line in the surface X direction of the second base material 1A facing the surface of the first base material 1, and are arranged in the Y direction at predetermined intervals.
- Most of the plurality of Y detection electrodes 21 are formed in a thin film having a substantially diamond pattern in a plan view, and the remaining Y detection electrodes 21 located at the ends of the columns are formed in a thin film having a substantially half diamond pattern in a plan view.
- a conductive thin and low resistance lead line 22 is electrically overlapped and connected to the surface end portion of the terminal Y detection electrode 21.
- the routing line 22 is exposed from the surface of the base material layer 2 in the second base material 1A to the upper surface, which is the back surface, through a through hole.
- the exposed routing line 22 is formed in the tail portion 6 so as to be electrically connected to the control device.
- a plurality of Y detection electrodes 21 having conductivity are formed by processing the binder resin layer 3 in the second substrate 1A, and the substrate layer 2 of the second substrate 1A.
- a conductive material such as silver paste is screen-printed or gravure-printed on the surface, and dried and hardened to form a plurality of lead lines 22.
- the surface end portion of the terminal Y detection electrode 21 connected to the end portion of the routing line 22 is in good condition with the routing line 22 as in the terminal X detection electrode 11.
- the surface etching processing is performed from the viewpoint of ensuring proper electrical conductivity.
- the silver nanowire 4 partially protruding from the end of the surface of the terminal Y detection electrode 21 has an increased protruding range, and the binder resin 7 attached to the protruding portion is removed to ensure conductivity.
- the terminal Y detection electrode 21 and the connection line 23 between the routing line 22 are electrically contacted as an auxiliary electrode.
- a base material layer 2 having a predetermined size is prepared, and the entire surface of the base material layer 2 is prepared.
- the binder resin solution in which the silver nanowires 4 are dispersed is applied by a coater and dried and cured, thereby forming a binder resin layer 3 and forming a part of the silver nanowires 4 irregularly from the surface of the binder resin layer 3.
- the first substrate 1 is manufactured by projecting.
- the binder resin solution can be prepared, for example, by dissolving the binder resin 7 in a predetermined solvent and uniformly dispersing a large number of silver nanowires 4.
- the second base 1A is also manufactured by repeating the same operation as the first base 1.
- the binder resin layer 3 of the first substrate 1 is processed to form a plurality of X detection electrodes 11 of the X pattern layer 10, and surface etching processing such as plasma treatment is performed on the surface end portion of the terminal X detection electrode 11.
- the binder resin 7 is removed from the projecting portions of the silver nanowires 4 partially projecting from the surface end by shaving (for example, shaving by about 10 nm).
- shaving for example, shaving by about 10 nm.
- masking is required for portions other than the end of the surface of the X detection electrode 11 at the end.
- the surface is applied to the entire surface of the plurality of X detection electrodes 11. Etching processing may be performed.
- a silver paste or the like is printed on the surface of the base material layer 2 of the first base material 1 to form a lead line 12, and the end of the lead line 12 is connected to the terminal X detection electrode 11. While connecting to the surface end portion, the protruding portion of the silver nanowire 4 partially protruding from the surface of the terminal X detection electrode 11 is brought into contact with the connecting portion 13.
- the binder resin layer 3 of the second substrate 1A is processed to form a plurality of Y detection electrodes 21 of the Y pattern layer 20, and surface etching is performed on the surface edge of the terminal Y detection electrode 21.
- the binder resin 7 is removed from the projecting portion of the silver nanowire 4 partially projecting from the surface by shaving by processing (for example, shaving by about 10 nm).
- the entire surface of the plurality of Y detection electrodes 21 may be subjected to surface etching processing.
- a silver paste or the like is printed on the surface of the base material layer 2 of the second base material 1A to form a lead line 22, and the end of this lead line 22 is the surface of the terminal Y detection electrode 21. While connecting to the end portion, the protruding portion of the silver nanowire 4 partially protruding from the surface of the terminal Y detection electrode 21 is brought into contact with the connecting portion 23.
- the X pattern layer 10 and the Y pattern layer 20 are thus formed on the base material layer 2 of the first and second base materials 1 and 1A, the pattern surfaces of the first and second base materials 1 and 1A are formed. Are adhered and fixed with an adhesive sheet 5 and a transparent protective cover 30 is laminated and adhered to at least the exposed upper surface of the first and second substrates 1 and 1A. Thereafter, a capacitive roller sheet can be manufactured by pressing and sliding a roller that can rotate to these, and cutting them into a predetermined size.
- Such a capacitance sensor sheet is installed, for example, as an operation means in an automobile-mounted device, and a user's finger approaches the selected X detection electrode 11 of the X pattern layer 10 or the Y detection electrode 21 of the Y pattern layer 20. Since the capacitance with the user's finger changes, the change in the capacitance is detected and output to the control device, which contributes to the operation of the on-vehicle equipment.
- the exposed range and number of the low-resistance silver nanowires 4 are increased and function as auxiliary electrodes, and the silver nanowires 4 contribute to conductivity, so that they are routed around the terminal X detection electrode 11 and the Y detection electrode 21. There is no possibility that the continuity at the connecting portions 13 and 23 with the lines 12 and 22 is deteriorated or that the contact resistance value is increased or unstable.
- the surface of the binder resin layer 3 is subjected to surface etching processing to remove at least the binder resin 7 attached to the silver nanowires 4. Therefore, the conductivity of the silver nanowire 4 can be reliably ensured. Moreover, since the fine silver nanowire 4 is used, even when transparency is required for the capacitance sensor sheet, no adverse effect is caused. Furthermore, if the probe is brought into contact with the surface of the binder resin layer 3, the resistance value can be easily measured.
- the X pattern layer 10 and the Y pattern layer 20 are subjected to surface etching processing after the processing of the binder resin layer 3, but the present invention is not limited to this.
- the surface of the binder resin layer 3 is subjected to a surface etching process before the binder resin layer 3 is processed, and then the X pattern layer 10 or the Y pattern layer 20 is formed by processing the binder resin layer 3. good.
- the plurality of X detection electrodes 11 and the Y detection electrodes 21 are simply shown. However, the clearance between the plurality of X detection electrodes 11 and the clearance between the Y detection electrodes 21 are the same shape. If each of them is filled, the processing area of etching can be greatly reduced. In this case, it is not necessary to remove the binder resin 7 over a wide range, the manufacturing operation can be speeded up and simplified, and waste of materials and the like can be reduced.
- the surface of the terminal X detection electrode 11 and its peripheral portion may be subjected to surface etching processing, or the surface of all the X detection electrodes 11 and its peripheral portion may be subjected to surface etching processing.
- the surface of the Y detection electrode 21 at the end and its peripheral portion may be subjected to surface etching processing, or the surface of all the Y detection electrodes 21 and the peripheral portion thereof may be subjected to surface etching processing.
- Example 1 A test capacitance sensor sheet is manufactured, and surface etching processing is applied to the surface edge of the detection electrode of the pattern layer by the plasma processing method, and a drawing line is superimposed on the surface edge of the surface etching processed detection electrode. The continuity between the surface end of the detection electrode and the lead line was measured.
- the test capacitance sensor sheet is prepared by preparing first and second substrates having a width of 20 cm, forming an X pattern layer on the substrate layer of the first substrate, and the first and second substrates. By adhering and fixing with a pressure-sensitive adhesive sheet, and pressing and sliding a rotatable 30 cm wide rubber roller on the first and second substrates, and the first and second substrates, and The pressure-sensitive adhesive sheet was pressed and brought into close contact, and then cut into a predetermined size for production.
- Each base material layer was formed by making a transparent polyethylene terephthalate film into a horizontally long planar rectangle.
- the binder resin layer was an acrylic resin, and the resin contained a large number of silver nanowires.
- the X pattern layer is formed by etching the binder resin layer of the first base material and arranging 12 continuous bands in the Y direction.
- the 12 bands are regarded as a plurality of X detection electrodes.
- Each of the X detection electrodes was formed by subjecting both ends of the surface of the X detection electrode to surface etching by a direct plasma treatment method and printing by superimposing silver paste drawing lines on both ends of the surface of each X detection electrode.
- Each X detection electrode has a length of 150 mm, a width of 5 mm, and a thickness of 30 nm.
- the direct plasma treatment method was performed under the conditions of a treatment gas of argon, a treatment output of 0.02 W / cm 2 , and a treatment time of 3 minutes.
- the rubber roller slid and pressed 10 times at a speed of 30 cm / sec.
- a pressure of 5 to 10 kg was applied with a line width of 30 cm.
- the resistance value (k ⁇ ) between the pair of routing lines is measured, and this measured value is initially measured at the connection between the surface end of the X detection electrode and the routing line. Resistance value (k ⁇ ) was used.
- the resistance value (k ⁇ ) between the pair of drawing lines is measured, and this measured value is measured as the resistance value at the connection portion between the surface end of the X detection electrode and the drawing line ( k ⁇ ). Then, the change rate (%) of the resistance value before and after pressing the rubber roller was determined from these resistance values. In addition, the average value, maximum value, minimum value, and standard deviation were determined from the measured values. When the conductivity was measured in this manner, the results are summarized in Table 1.
- Example 2 A capacitance sensor sheet for testing is manufactured, the surface end of the X detection electrode of the X pattern layer is subjected to surface etching processing by an ultraviolet treatment method, and the surface etching processing is applied to the surface end of the X detection electrode.
- the lines were overlapped and connected, and the conductivity between the surface end of the X detection electrode and the lead line was measured.
- the test capacitance sensor sheet was manufactured in the same configuration as in Example 1.
- the ultraviolet treatment method was carried out using a commercially available treatment apparatus, using a low-pressure mercury lamp as the light source, and under the conditions of ultraviolet illumination of 200 mW / cm 2 and treatment time of 2 minutes.
- the conductivity was also the same as in Example 1, and when the conductivity was measured, the results are summarized in Table 2.
- Example 3 A capacitance sensor sheet for testing is manufactured, and the surface end of the X detection electrode of the X pattern layer is subjected to surface etching processing by the corona treatment method, and is routed to the surface end of the X detection electrode subjected to the surface etching processing.
- the lines were overlapped and connected, and the conductivity between the surface end of the X detection electrode and the lead line was measured.
- the test capacitance sensor sheet was manufactured in the same configuration as in Example 1.
- the corona treatment method was carried out using a commercially available treatment device, with an output of 6 W, a relative moving speed of a plurality of X detection electrodes of 6 m / min, and a distance from the treatment device electrode to the silver nanowire of 4 mm. .
- the conductivity was also the same as in Example 1, and when the conductivity was measured, the results are summarized in Table 3.
- Comparative Example A test capacitance sensor sheet was manufactured, and the surface end portion of the X detection electrode of the X pattern layer was not subjected to surface etching processing, and a routing line was formed on the surface end portion of the untreated X detection electrode. They were connected in a stacked manner, and the conductivity between the surface end of the X detection electrode and the lead line was measured.
- the configuration and conductivity of the capacitance sensor sheet were the same as those in the example. After measuring the conductivity, the results are summarized in Table 4.
- the initial resistance value may not be stable regardless of the pressure contact sliding of the rubber roller. Further, compared with the examples, satisfactory average values, maximum values, minimum values, and standard deviations could not be obtained. According to this comparative example, it has been clarified that the conductivity at the connection portion between the X detection electrode and the routing line is deteriorated, resulting in an increase in resistance value and instability.
- the method for producing a capacitance sensor sheet and the capacitance sensor sheet according to the present invention can be used in the fields of audio equipment, home appliances, portable information devices, automobile mounted devices, and the like.
- First base material (base material) 1A Second base material (base material) 2 Base material layer 3 Binder resin layer 4 Silver nanowire (conductive nanowire) 7 Binder resin 10 X pattern layer (pattern layer) 11 X detection electrode (detection electrode) 12 Leading line 13 Connection part 20 Y pattern layer (pattern layer) 21 Y detection electrode (detection electrode) 22 Leading line 23 Connection part
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Abstract
Description
基材のバインダ樹脂層を加工して導電性を有するパターン層の複数の検出電極を形成する際、バインダ樹脂層の表面、あるいは複数の検出電極の少なくとも一部の検出電極の表面端部を表面エッチング加工処理することにより、検出電極から部分的に突出した導電性ナノワイヤの突出部におけるバインダ樹脂を除去し、
基材の基材層に導電材料を塗布して乾燥硬化させることにより、導電性を有するパターン層の引き回しラインを形成し、
パターン層の少なくとも一部の検出電極の表面端部と引き回しラインとを接続するとともに、この接続部には、バインダ樹脂が除去された導電性ナノワイヤの突出部を接触させることを特徴としている。
また、表面エッチング加工処理を、プラズマ処理法、紫外線処理法、又はコロナ処理法で施すことができる。
また、引き回しラインと接続される検出電極の表面を表面エッチング加工処理することが可能である。
パターン層は、基材層に配列される複数の検出電極と、基材層に形成されて複数の検出電極に接続される引き回しラインとを含み、複数の検出電極を、基材層に導電性ナノワイヤ含有のバインダ樹脂層を形成してその表面から導電性ナノワイヤを部分的に突出させ、このバインダ樹脂層を加工することにより形成し、
パターン層の少なくとも引き回しラインと接続される検出電極の表面端部を表面エッチング加工処理することにより、この検出電極から部分的に突出した導電性ナノワイヤの突出部におけるバインダ樹脂を除去し、このバインダ樹脂が除去された導電性ナノワイヤの突出部を検出電極と引き回しラインとの接続部に接触させるようにしたことを特徴としている。
また、表面エッチング加工処理を、プラズマ処理法、紫外線処理法、又はコロナ処理法で施すことができる。
また、引き回しラインと接続される検出電極の表面を表面エッチング加工処理することが可能である。
さらに、請求項5又は10記載の発明によれば、引き回しラインと接続される検出電極の表面を表面エッチング加工処理するので、導電性ナノワイヤの露出を防止することができ、導電性ナノワイヤの腐食防止が期待できる。
実施例1
試験用の静電容量センサシートを製造してそのパターン層の検出電極の表面端部に表面エッチング加工処理をプラズマ処理法により施し、表面エッチング加工処理した検出電極の表面端部に引き回しラインを重ねて接続し、検出電極の表面端部と引き回しラインとの導通性を測定した。
試験用の静電容量センサシートを製造してそのXパターン層のX検出電極の表面端部に表面エッチング加工処理を紫外線処理法により施し、表面エッチング加工処理したX検出電極の表面端部に引き回しラインを重ねて接続し、X検出電極の表面端部と引き回しラインとの導通性を測定した。
導通性についても実施例1と同様とし、導通性を測定したら、その結果を表2にまとめて記載した。
試験用の静電容量センサシートを製造してそのXパターン層のX検出電極の表面端部に表面エッチング加工処理をコロナ処理法により施し、表面エッチング加工処理したX検出電極の表面端部に引き回しラインを重ねて接続し、X検出電極の表面端部と引き回しラインとの導通性を測定した。
導通性についても実施例1と同様とし、導通性を測定したら、その結果を表3にまとめて記載した。
試験用の静電容量センサシートを製造してそのXパターン層のX検出電極の表面端部に表面エッチング加工処理を施さず、この未処理のX検出電極の表面端部に引き回しラインを重ねて接続し、X検出電極の表面端部と引き回しラインとの導通性を測定した。
静電容量センサシートの構成や導通性については実施例と同様とし、導通性を測定した後、その結果を表4にまとめた。
1A 第二の基材(基材)
2 基材層
3 バインダ樹脂層
4 銀ナノワイヤ(導電性ナノワイヤ)
7 バインダ樹脂
10 Xパターン層(パターン層)
11 X検出電極(検出電極)
12 引き回しライン
13 接続部
20 Yパターン層(パターン層)
21 Y検出電極(検出電極)
22 引き回しライン
23 接続部
Claims (11)
- 絶縁性を有する基材層に導電性ナノワイヤ含有のバインダ樹脂層が形成され、このバインダ樹脂層の表面から導電性ナノワイヤが部分的に突出する基材を使用することにより、静電容量センサシートを製造する静電容量センサシートの製造方法であって、
基材のバインダ樹脂層を加工して導電性を有するパターン層の複数の検出電極を形成する際、バインダ樹脂層の表面、あるいは複数の検出電極の少なくとも一部の検出電極の表面端部を表面エッチング加工処理することにより、検出電極から部分的に突出した導電性ナノワイヤの突出部におけるバインダ樹脂を除去し、
基材の基材層に導電材料を塗布して乾燥硬化させることにより、導電性を有するパターン層の引き回しラインを形成し、
パターン層の少なくとも一部の検出電極の表面端部と引き回しラインとを接続するとともに、この接続部には、バインダ樹脂が除去された導電性ナノワイヤの突出部を接触させることを特徴とする静電容量センサシートの製造方法。 - 表面エッチング加工処理を、ドライエッチング法とウェットエッチング法のいずれかの方法で施す請求項1記載の静電容量センサシートの製造方法。
- 表面エッチング加工処理を、プラズマ処理法、紫外線処理法、又はコロナ処理法で施す請求項1記載の静電容量センサシートの製造方法。
- パターン層の全ての検出電極の表面を表面エッチング加工処理する請求項1、2、又は3記載の静電容量センサシートの製造方法。
- 引き回しラインと接続される検出電極の表面を表面エッチング加工処理する請求項1、2、又は3記載の静電容量センサシートの製造方法。
- 絶縁性を有する基材層に導電性のパターン層を形成し、このパターン層の検出電極に導体が接近した場合に静電容量の変化を検出する静電容量センサシートであって、
パターン層は、基材層に配列される複数の検出電極と、基材層に形成されて複数の検出電極に接続される引き回しラインとを含み、複数の検出電極を、基材層に導電性ナノワイヤ含有のバインダ樹脂層を形成してその表面から導電性ナノワイヤを部分的に突出させ、このバインダ樹脂層を加工することにより形成し、
パターン層の少なくとも引き回しラインと接続される検出電極の表面端部を表面エッチング加工処理することにより、この検出電極から部分的に突出した導電性ナノワイヤの突出部におけるバインダ樹脂を除去し、このバインダ樹脂が除去された導電性ナノワイヤの突出部を検出電極と引き回しラインとの接続部に接触させるようにしたことを特徴とする静電容量センサシート。 - 表面エッチング加工処理を、ドライエッチング法とウェットエッチング法のいずれかの方法で施すようにした請求項6記載の静電容量センサシート。
- 表面エッチング加工処理を、プラズマ処理法、紫外線処理法、又はコロナ処理法で施すようにした請求項6記載の静電容量センサシート。
- パターン層の全ての検出電極の表面を表面エッチング加工処理するようにした請求項6、7、又は8記載の静電容量センサシート。
- 引き回しラインと接続される検出電極の表面を表面エッチング加工処理するようにした請求項6、7、又は8記載の静電容量センサシート。
- 基材層を対向して粘着される一対の基材層とし、一方の基材層にXパターン層を形成してその複数のX検出電極をX方向に配列するとともに、他方の基材層にYパターン層を形成してその複数のY検出電極をY方向に配列し、Xパターン層の複数のX検出電極のうち、少なくとも引き回しラインに重ねて接続される末端のX検出電極の表面端部を表面エッチング加工処理し、Yパターン層の複数のY検出電極のうち、少なくとも引き回しラインに重ねて接続される末端のY検出電極の表面端部を表面エッチング加工処理するようにした請求項6ないし10いずれかに記載の静電容量センサシート。
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Also Published As
Publication number | Publication date |
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KR101592661B1 (ko) | 2016-02-05 |
CN103492992B (zh) | 2016-08-17 |
JP2012237746A (ja) | 2012-12-06 |
CN103492992A (zh) | 2014-01-01 |
US20140035599A1 (en) | 2014-02-06 |
JP5730240B2 (ja) | 2015-06-03 |
KR20140014236A (ko) | 2014-02-05 |
US9541578B2 (en) | 2017-01-10 |
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