JP2019192216A - タッチパネル及びその直接パターニング方法 - Google Patents
タッチパネル及びその直接パターニング方法 Download PDFInfo
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- JP2019192216A JP2019192216A JP2019036476A JP2019036476A JP2019192216A JP 2019192216 A JP2019192216 A JP 2019192216A JP 2019036476 A JP2019036476 A JP 2019036476A JP 2019036476 A JP2019036476 A JP 2019036476A JP 2019192216 A JP2019192216 A JP 2019192216A
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- metal nanowire
- film layer
- touch sensing
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- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
- G06F3/0445—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means using two or more layers of sensing electrodes, e.g. using two layers of electrodes separated by a dielectric layer
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
- G06F3/0446—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means using a grid-like structure of electrodes in at least two directions, e.g. using row and column electrodes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
- H05K2203/0786—Using an aqueous solution, e.g. for cleaning or during drilling of holes
- H05K2203/0793—Aqueous alkaline solution, e.g. for cleaning or etching
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Abstract
Description
本出願は、2018年3月2日に出願され、参照として本明細書に組み込まれる中国出願201810175902.7号に対する優先権を主張する。
本開示のいくつかの実施形態によれば、表示領域内のタッチセンシング電極の耐久性は向上している。一方、低インピーダンスの電路(electrical path)が、ボンディングパッドと、外部基板の電極パッドとの間の直接接触構造によって形成される。さらに、本開示のいくつかの実施形態によれば、タッチ電極の直接パターニング方法は、新規のタッチパネル構造の製造を提供する。
以下の実施形態は、詳細な説明のため、添付された図面と共に開示される。説明を明確にするために、多くの実施の詳細が以下の記載で説明される。しかしながら、これらの実施の詳細は本発明を限定することを意図するものではないと理解されるべきである。すなわち、これらの実施の詳細は本発明の実施形態の一部では必要ない。さらに、図面を簡略化するため、いくつかの従来の構造および要素は模式図で示されている。
Claims (17)
- タッチパネルを形成するための直接パターニング方法であって、
表示領域および周辺領域を備える基板を提供し、前記周辺領域内には周辺回路が配置され、前記周辺回路はボンディングパッドを有し、
前記表示領域および前記周辺領域内に金属ナノワイヤー層を配置し、前記金属ナノワイヤー層は複数の金属ナノワイヤーを含み、
前記金属ナノワイヤー層上に予備硬化膜層としての材料を予備硬化し、
前記予備硬化膜層上にネガ型感光層を配置し、
除去領域および保存領域を画定するために前記ネガ型感光層を露光し、かつ、前記周辺回路に電気的に接続されたタッチセンシング電極が前記表示領域上に製造され、前記周辺領域内の前記ボンディングパッドが露出されるように、現像液を用いて前記除去領域内の前記ネガ型感光層、前記予備硬化膜層および前記金属ナノワイヤー層を除去するフォトリソグラフィ工程を行い、前記タッチセンシング電極は前記予備硬化膜層および前記金属ナノワイヤー層を含み、前記保存領域内の前記予備硬化膜層および前記金属ナノワイヤー層は前記ネガ型感光層によって被覆され、並びに、
膜層としての前記予備硬化膜層を硬化する工程を含む、
タッチパネルの直接パターニング方法。 - 前記除去領域内の前記金属ナノワイヤー層を完全に除去するための後処理工程をさらに含む、請求項1に記載の直接パターニング方法。
- 前記後処理工程は、前記除去領域内の前記金属ナノワイヤー層を完全に除去するために、機械的な方法において有機溶液またはアルカリ溶液を用いることを含む、請求項2に記載の直接パターニング方法。
- 前記後処理工程は、前記除去領域内の前記金属ナノワイヤー層を完全に除去するため、接着剤を用いることを含む、請求項2に記載の直接パターニング方法。
- 前記後処理工程は、前記除去領域内の前記金属ナノワイヤー層を完全に除去するため、マイクロ波放射工程または紫外線照射工程を用いることを含む、請求項2に記載の直接パターニング方法。
- 前記ネガ型感光層の感光性は、前記予備硬化膜層の感光性より高い、請求項1に記載の直接パターニング方法。
- 前記ネガ型感光層と、前記予備硬化膜層および前記金属ナノワイヤー層を含む複合構造との間の密着強度は、前記基板と、前記予備硬化膜層および前記金属ナノワイヤー層を含む複合構造との間の密着強度よりも高い、請求項1に記載の直接パターニング方法。
- 表示領域および周辺領域を備える基板と、
前記基板上に積層された金属ナノワイヤー層、膜層およびネガ型感光層と、
前記周辺領域上に配置された周辺回路と、を備え、
前記周辺回路はボンディングパッドを有し、前記ネガ型感光層は前記ネガ型感光層の露光後に画定された除去領域および保存領域を含み、タッチセンシング電極を画定し、かつ、ボンディングパッドを露出させるため、前記除去領域内の前記ネガ型感光層、前記膜層および前記金属ナノワイヤー層は除去され、前記タッチセンシング電極は前記周辺回路に電気的に接続される、タッチパネル。 - 前記金属ナノワイヤー層は、複数の金属ナノワイヤーが前記保存領域内の前記膜層中に埋め込まれ、前記複数の金属ナノワイヤーが導電性ネットワークを形成し、前記タッチセンシング電極は前記表示領域内の前記膜層および前記金属ナノワイヤーで形成され、前記タッチセンシング電極はフォトリソグラフィ工程の後に残存する前記ネガ型感光層の第2部分によって被覆される、請求項8に記載のタッチパネル。
- 前記ネガ型感光層の感光性は、前記膜層の感光性よりも高い、請求項8に記載のタッチパネル。
- 前記膜層の厚さが約200nm〜400nmの範囲である、請求項8に記載のタッチパネル。
- 前記金属ナノワイヤー層および前記周辺回路は、前記表示領域および前記周辺領域の境界面に接続構造を形成する、請求項8に記載のタッチパネル。
- 前記タッチセンシング電極は前記周辺領域まで延在し、かつ、前記周辺回路を被覆し、前記ボンディングパッドは前記タッチセンシング電極によって被覆されない、請求項8に記載のタッチパネル。
- 前記タッチセンシング電極は、第1電極および第2電極を有し、前記第1電極と前記第2電極との間に非導電性領域が形成される、請求項8に記載のタッチパネル。
- 前記非導電性領域は間隙であるか、または、前記非導電性領域はパーコレーション閾値より低い濃度を有する前記金属ナノワイヤーを含む、請求項14に記載のタッチパネル。
- 前記周辺回路は第1外周電極および第2外周電極を含み、非導電性領域が前記第1外周電極と前記第2外周電極との間に形成される、請求項8に記載のタッチパネル。
- 前記非導電性領域は間隙であるか、または、前記非導電性領域はパーコレーション閾値より低い濃度を有する前記金属ナノワイヤーを含む、請求項16に記載のタッチパネル。
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2022035945A (ja) * | 2020-08-20 | 2022-03-04 | カンブリオス フィルム ソリューションズ(シアメン) コーポレーション | 積層構造体の製造方法、積層構造体、及びタッチセンサ |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106293255B (zh) * | 2016-09-27 | 2017-07-28 | 京东方科技集团股份有限公司 | 一种触控基板及触控显示装置 |
CN110221731B (zh) * | 2018-03-02 | 2023-03-28 | 宸鸿光电科技股份有限公司 | 触控面板的直接图案化方法及其触控面板 |
KR102654597B1 (ko) * | 2019-07-25 | 2024-04-04 | 동우 화인켐 주식회사 | 터치센서 및 이를 포함하는 윈도우 적층체, 화상 표시 장치 |
CN110689996A (zh) * | 2019-09-24 | 2020-01-14 | 深圳市善柔科技有限公司 | 银纳米线导电薄膜及其制备方法和触控器件 |
CN112860091A (zh) * | 2019-11-26 | 2021-05-28 | 英属维尔京群岛商天材创新材料科技股份有限公司 | 触控面板及其制作方法 |
CN111029390B (zh) * | 2019-12-23 | 2022-05-27 | 武汉天马微电子有限公司 | 一种显示面板、其驱动方法及显示装置 |
CN111028987B (zh) * | 2019-12-23 | 2021-12-28 | 合肥微晶材料科技有限公司 | 一种纳米银线导电膜及其作为触控传感器电极层的制作方法 |
TWI747376B (zh) * | 2020-07-13 | 2021-11-21 | 大陸商宸美(廈門)光電有限公司 | 薄膜感測器及觸控顯示器 |
TWI813893B (zh) * | 2020-07-31 | 2023-09-01 | 大陸商宸美(廈門)光電有限公司 | 觸控面板及其裝置 |
US11294518B1 (en) | 2020-09-15 | 2022-04-05 | Tpk Advanced Solutions Inc. | Touch panel and device thereof |
TWI795005B (zh) * | 2021-09-30 | 2023-03-01 | 大陸商宸美(廈門)光電有限公司 | 觸控面板及其製造方法 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20160246415A1 (en) * | 2015-02-25 | 2016-08-25 | Samsung Display Co., Ltd. | Touch panel and method of manufacturing the same |
JP2018014329A (ja) * | 2005-08-12 | 2018-01-25 | シーエーエム ホールディング コーポレーション | ナノワイヤーに基づく透明導電体 |
JP2019153289A (ja) * | 2018-03-02 | 2019-09-12 | 宸鴻光電科技股▲分▼有限公司Tpk Touch Solutions Inc. | タッチパネルの直接パターニング方法およびそのタッチパネル |
Family Cites Families (44)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7279254B2 (en) * | 2005-05-16 | 2007-10-09 | Eastman Kodak Company | Method of making an article bearing a relief image using a removable film |
EP2133744B1 (en) * | 2007-04-04 | 2011-07-13 | Asahi Kasei E-materials Corporation | Photosensitive resin composition |
KR101596985B1 (ko) * | 2009-01-29 | 2016-02-23 | 도레이 카부시키가이샤 | 수지 조성물 및 이것을 이용한 표시 장치 |
WO2011104372A1 (en) | 2010-02-26 | 2011-09-01 | Micronic Mydata AB | Method and apparatus for performing pattern alignment |
KR20120032734A (ko) * | 2010-09-29 | 2012-04-06 | 삼성모바일디스플레이주식회사 | 터치스크린패널 및 그 제조방법 |
JP5730240B2 (ja) * | 2011-04-25 | 2015-06-03 | 信越ポリマー株式会社 | 静電容量センサシートの製造方法及び静電容量センサシート |
WO2013084283A1 (ja) * | 2011-12-05 | 2013-06-13 | 日立化成株式会社 | タッチパネル用電極の保護膜の形成方法、感光性樹脂組成物及び感光性エレメント |
US9253892B2 (en) * | 2012-04-13 | 2016-02-02 | Wistron Corporation | Peripheral circuit of touch panel and manufacturing method thereof |
JP6170288B2 (ja) * | 2012-09-11 | 2017-07-26 | 富士フイルム株式会社 | 転写材料、静電容量型入力装置の製造方法および静電容量型入力装置、並びに、これを備えた画像表示装置 |
KR102085964B1 (ko) * | 2012-11-30 | 2020-03-09 | 삼성디스플레이 주식회사 | 플렉서블 터치 스크린 패널 및 이의 제조방법 |
KR102052165B1 (ko) * | 2012-11-30 | 2019-12-05 | 삼성디스플레이 주식회사 | 터치스크린 패널의 제조방법 |
KR102056928B1 (ko) * | 2013-01-16 | 2019-12-18 | 삼성디스플레이 주식회사 | 터치스크린 패널 및 그의 제조방법 |
KR102057666B1 (ko) * | 2013-02-19 | 2019-12-23 | 삼성디스플레이 주식회사 | 터치 스크린 패널 및 그 제조 방법 |
JP2014206936A (ja) * | 2013-04-15 | 2014-10-30 | 富士フイルム株式会社 | タッチパネル用導電シートの製造方法、および、タッチパネル用導電シート |
US20160179234A1 (en) * | 2013-07-03 | 2016-06-23 | Amosense Co., Ltd. | Touch sensor for touch screen panel, manufacturing method thereof, and touch screen panel including same |
KR102222194B1 (ko) * | 2013-10-17 | 2021-03-04 | 엘지이노텍 주식회사 | 터치 윈도우 및 이를 포함하는 디스플레이 장치 |
KR102212953B1 (ko) * | 2014-03-06 | 2021-02-08 | 엘지이노텍 주식회사 | 터치 윈도우 및 이를 포함하는 터치 디바이스 |
WO2015160377A1 (en) * | 2014-04-16 | 2015-10-22 | Wrostix Technologies Llc | Structure for pixelated self-capacitance |
KR101586739B1 (ko) * | 2014-07-31 | 2016-01-20 | 동우 화인켐 주식회사 | 필름 터치 센서 및 그의 제조 방법 |
TWI541709B (zh) * | 2014-08-04 | 2016-07-11 | 平面自發光型觸控開關 | |
CN204256699U (zh) * | 2014-08-16 | 2015-04-08 | 长鸿光电(厦门)有限公司 | 触控面板 |
EP3223120B1 (en) * | 2014-11-20 | 2020-09-30 | Dongwoo Fine-Chem Co., Ltd. | Film touch sensor and manufacturing method therefor |
KR20160066634A (ko) * | 2014-12-02 | 2016-06-13 | 삼성디스플레이 주식회사 | 터치 패널 및 그 제조방법 |
KR20160071735A (ko) * | 2014-12-12 | 2016-06-22 | 동우 화인켐 주식회사 | 필름 터치 센서 및 그의 제조 방법 |
KR102263975B1 (ko) * | 2014-12-16 | 2021-06-11 | 삼성디스플레이 주식회사 | 터치 패널 및 그 제조방법 |
JP6027633B2 (ja) * | 2015-01-13 | 2016-11-16 | 日本写真印刷株式会社 | タッチ入力センサの製造方法及び感光性導電フィルム |
KR102297878B1 (ko) * | 2015-01-16 | 2021-09-03 | 삼성디스플레이 주식회사 | 터치 패널 및 그 제조 방법 |
TWI548587B (zh) * | 2015-01-26 | 2016-09-11 | 國立臺灣大學 | 奈米金屬線圖案化之方法,使用該方法製備而成之圖案化奈米金屬線電極以及包含該圖案化奈米金屬線電極做為材料之電晶體元件 |
KR102448570B1 (ko) * | 2015-02-03 | 2022-09-28 | 삼성디스플레이 주식회사 | 터치 패널 및 그 제조 방법 |
KR102266707B1 (ko) * | 2015-02-04 | 2021-06-22 | 삼성디스플레이 주식회사 | 터치패널 제조방법 |
WO2016151908A1 (ja) * | 2015-03-26 | 2016-09-29 | 富士フイルム株式会社 | タッチパネル |
CN106293172B (zh) * | 2015-05-20 | 2024-04-30 | 安徽精卓光显技术有限责任公司 | 触控面板及其制作方法 |
JP6042486B1 (ja) * | 2015-05-29 | 2016-12-14 | 日本写真印刷株式会社 | タッチセンサの製造方法及びタッチセンサ |
KR102544560B1 (ko) * | 2015-10-22 | 2023-06-19 | 삼성디스플레이 주식회사 | 터치 스크린 패널 및 이의 형성 방법 |
KR102337695B1 (ko) * | 2015-12-18 | 2021-12-09 | 동우 화인켐 주식회사 | 필름 터치 센서 |
JP6633387B2 (ja) * | 2015-12-22 | 2020-01-22 | デクセリアルズ株式会社 | 透明導電膜、構造体、及び情報入力装置、並びに電極の製造方法 |
JP2019517053A (ja) * | 2016-04-05 | 2019-06-20 | スリーエム イノベイティブ プロパティズ カンパニー | 金属相互連結部への向上した接着性を有するナノワイヤ接触パッド |
CN106873840B (zh) * | 2017-02-16 | 2019-10-08 | 业成科技(成都)有限公司 | 单片式触控面板结构及其制造方法 |
TWI748063B (zh) * | 2017-03-06 | 2021-12-01 | 南韓商東友精細化工有限公司 | 電極連接結構、觸控感測器和影像顯示裝置 |
CN110221731B (zh) * | 2018-03-02 | 2023-03-28 | 宸鸿光电科技股份有限公司 | 触控面板的直接图案化方法及其触控面板 |
CN208077142U (zh) * | 2018-03-02 | 2018-11-09 | 宸鸿光电科技股份有限公司 | 触控面板 |
CN110554789B (zh) * | 2018-05-30 | 2023-09-01 | 英属维京群岛商天材创新材料科技股份有限公司 | 双面电极及其图案化方法 |
CN110609631A (zh) * | 2018-06-15 | 2019-12-24 | 凯姆控股有限公司 | 触控面板及其制作方法 |
CN111610871A (zh) * | 2019-02-25 | 2020-09-01 | 英属维尔京群岛商天材创新材料科技股份有限公司 | 电极结构及其触控面板 |
-
2018
- 2018-03-02 CN CN201810175902.7A patent/CN110221731B/zh active Active
- 2018-07-16 TW TW107209580U patent/TWM572493U/zh unknown
- 2018-07-16 TW TW107124525A patent/TWI705305B/zh active
-
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- 2019-02-27 US US16/287,452 patent/US10802398B2/en active Active
- 2019-02-28 JP JP2019036476A patent/JP6821729B2/ja active Active
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Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2018014329A (ja) * | 2005-08-12 | 2018-01-25 | シーエーエム ホールディング コーポレーション | ナノワイヤーに基づく透明導電体 |
US20160246415A1 (en) * | 2015-02-25 | 2016-08-25 | Samsung Display Co., Ltd. | Touch panel and method of manufacturing the same |
KR20160104189A (ko) * | 2015-02-25 | 2016-09-05 | 삼성디스플레이 주식회사 | 터치 패널 및 그 제조 방법 |
JP2019153289A (ja) * | 2018-03-02 | 2019-09-12 | 宸鴻光電科技股▲分▼有限公司Tpk Touch Solutions Inc. | タッチパネルの直接パターニング方法およびそのタッチパネル |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2022035945A (ja) * | 2020-08-20 | 2022-03-04 | カンブリオス フィルム ソリューションズ(シアメン) コーポレーション | 積層構造体の製造方法、積層構造体、及びタッチセンサ |
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JP6821729B2 (ja) | 2021-01-27 |
US20190271912A1 (en) | 2019-09-05 |
US10802398B2 (en) | 2020-10-13 |
TW201939166A (zh) | 2019-10-01 |
CN110221731B (zh) | 2023-03-28 |
TWM572493U (zh) | 2019-01-01 |
TWI705305B (zh) | 2020-09-21 |
CN110221731A (zh) | 2019-09-10 |
US11422463B2 (en) | 2022-08-23 |
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