WO2012147480A1 - 電子部品モジュールの製造方法及び電子部品モジュール - Google Patents

電子部品モジュールの製造方法及び電子部品モジュール Download PDF

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Publication number
WO2012147480A1
WO2012147480A1 PCT/JP2012/059305 JP2012059305W WO2012147480A1 WO 2012147480 A1 WO2012147480 A1 WO 2012147480A1 JP 2012059305 W JP2012059305 W JP 2012059305W WO 2012147480 A1 WO2012147480 A1 WO 2012147480A1
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WIPO (PCT)
Prior art keywords
electronic component
bumps
component module
substrate
bare
Prior art date
Application number
PCT/JP2012/059305
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English (en)
French (fr)
Inventor
紳弥 清野
祥明 佐竹
Original Assignee
株式会社村田製作所
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Publication date
Application filed by 株式会社村田製作所 filed Critical 株式会社村田製作所
Priority to KR1020137027639A priority Critical patent/KR101489146B1/ko
Priority to EP12775989.2A priority patent/EP2704185A4/en
Priority to JP2013511987A priority patent/JP5626460B2/ja
Priority to CN201280020504.9A priority patent/CN103493191B/zh
Publication of WO2012147480A1 publication Critical patent/WO2012147480A1/ja
Priority to US14/062,767 priority patent/US9532495B2/en
Priority to US15/353,362 priority patent/US10177108B2/en

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    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
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Definitions

  • the present invention relates to a method for manufacturing an electronic component module in which a plurality of external terminals of an electronic component are respectively joined to a plurality of bumps provided on one surface of a substrate, and an electronic component module manufactured by the manufacturing method.
  • Patent Document 1 discloses a bump forming method for bonding a semiconductor device to a substrate via a bump.
  • FIG. 1 is a schematic cross-sectional view showing a conventional method for manufacturing an electronic component module.
  • a metal paste 4 is discharged from an ink head 3 on a surface electrode 10 of a substrate 9 and dried to form bumps 6.
  • the bare IC 1 is mounted on the substrate 9 and is pressed and heated to deform the bumps 6 to join the external terminals 2 and mount the bare IC 1 on the substrate 9. To do.
  • the deformed bump 6 goes around to the side surface of the bare IC 1 and the surface electrode 10 of the substrate 9 and the internal wiring of the bare IC 1 become conductive. There was a fear. Therefore, the electronic component module manufactured by the conventional manufacturing method described above may deteriorate the characteristics of the bare IC 1.
  • FIG. 2 is a cross-sectional view showing a configuration of an electronic component module manufactured by a conventional manufacturing method.
  • the joint 7 between the external terminal 2 of the bare IC 1 and the surface electrode 10 of the substrate 9 goes around the side of the bare IC 1, and the joint 7 and the side of the bare IC 1 Touch.
  • the internal wiring is often exposed on the side surface of the bare IC 1.
  • the joint portion 7 and the side surface of the bare IC 1 are in contact with each other, the surface electrode 10 of the substrate 9 and the internal wiring of the bare IC 1 are electrically connected, so that the characteristics of the bare IC 1 are deteriorated.
  • the present invention has been made in view of such circumstances, and a method of manufacturing an electronic component module in which joints between a plurality of external terminals of an electronic component and a surface electrode of a substrate do not contact the side surface of the electronic component.
  • An object of the present invention is to provide an electronic component module manufactured by the manufacturing method.
  • an electronic component module manufacturing method includes an electronic component module manufacturing method in which a plurality of external terminals of an electronic component are respectively bonded to a plurality of bumps provided on one surface of a substrate.
  • the plurality of bumps are configured with a thick portion that is a thick portion and a thin portion that is a thin portion, and the thick portion corresponds when the electronic component is viewed in plan view.
  • the thin-walled portion is positioned on the center side of the electronic component of each external terminal, and the thin-walled portion is positioned on the opposite side of the center side of the electronic component of each corresponding external terminal.
  • the plurality of bumps are composed of a thick portion that is a thick portion and a thin portion that is a thin portion.
  • the thin-walled portion of the corresponding external terminal of the electronic component is positioned so that the thick-walled portion is positioned on the center side of the corresponding external terminal. It is formed on one surface of the substrate so as to be located on the side opposite to the center side.
  • a plurality of joints obtained by deforming a plurality of formed bumps and joining a plurality of external terminals have a height opposite to the center side of the electronic component than the height of the center side of the electronic component when the electronic component is viewed in plan view. Since the joint is not in contact with the side surface of the electronic component and the internal wiring is exposed on the side surface of the electronic component due to the dicer cut, the characteristics of the electronic component are There is no deterioration.
  • the height of the joint portion on the side opposite to the center side of the electronic component is lower than the height on the center side of the electronic component when the electronic component is viewed in plan view. Even if the junction does not contact the side surface of the electronic component and the internal wiring is exposed on the side surface of the electronic component due to the dicer cut, the characteristics of the electronic component are deteriorated. There is nothing to do.
  • the plurality of bumps are formed by an ink jet method.
  • the plurality of bumps are formed by the ink jet method, it is possible to easily form the thin portion and the thick portion having different thicknesses by adjusting the number of discharges of the metal paste. Moreover, the thin part to the thick part can be formed at a stretch, and the manufacturing cost can be reduced.
  • an electronic component module includes a substrate, a plurality of bumps provided on one surface of the substrate, an electronic component having a plurality of external terminals, and a plurality of the components.
  • the plurality of joints are the electrons in a plan view of the electronic component. It is characterized in that the height on the opposite side to the center side of the electronic component is lower than the height on the center side of the component.
  • the plurality of joints are formed so that the height on the opposite side of the center side of the electronic component is lower than the height on the center side of the electronic component when the electronic component is viewed in plan view. Even when the joint does not contact the side surface of the electronic component and the internal wiring is exposed on the side surface of the electronic component due to dicer cutting, the characteristics of the electronic component do not deteriorate.
  • the plurality of bumps are arranged in pairs so as to face each other across the center when the electronic component is viewed in plan.
  • the plurality of bumps are arranged in pairs so as to face each other across the center when the electronic component is viewed in plan view. Since the deformation state of the plurality of bumps can be made uniform, it is possible to prevent the bonding strength from being biased.
  • the plurality of bumps are composed of a thick portion that is a thick portion and a thin portion that is a thin portion.
  • the thin-walled portion of the corresponding external terminal of the electronic component is positioned so that the thick-walled portion is positioned on the center side of the corresponding external terminal. It is formed on one surface of the substrate so as to be located on the side opposite to the center side.
  • a plurality of joints obtained by deforming a plurality of formed bumps and joining a plurality of external terminals have a height opposite to the center side of the electronic component than the height of the center side of the electronic component when the electronic component is viewed in plan view. Since the joint is not in contact with the side surface of the electronic component and the internal wiring is exposed on the side surface of the electronic component due to the dicer cut, the characteristics of the electronic component are There is no deterioration.
  • FIG. 3 is a cross-sectional view showing the configuration of the electronic component module according to the embodiment of the present invention before mounting the bare IC.
  • the surface electrode 10 is provided on one surface of the substrate 9, and the bumps 6 are formed on the surface electrode 10 in a step shape.
  • the bump 6 includes a thin portion 61 that is a thin portion and a thick portion 62 that is a thick portion.
  • the thin-walled portion 61 is positioned at the center of the corresponding external terminal 2 when the electronic component is viewed in plan view. 2 is formed on one surface of the substrate 9 so as to be located on the side opposite to the center side when the electronic component is viewed in plan.
  • a bare IC which is an electronic component with external terminals, is mounted will be described as an example.
  • FIG. 4 is a cross-sectional view showing the configuration of the electronic component module according to the embodiment of the present invention.
  • the bump 6 is deformed and the portion where the external terminal 2 is joined is used as the joint 7.
  • the joint portion 7 is formed such that the height on the opposite side to the center side when the bear IC 1 is viewed in plan is lower than the height of the center side when the bear IC 1 is viewed in plan. Therefore, the deformed bump 6 does not reach the side surface of the bare IC 1. As a result, chipping occurs during the dicer cut of the bare IC 1, and even if the internal wiring is exposed on the side surface of the bare IC 1, the surface electrode 10 of the substrate 9 and the internal wiring of the bare IC 1 may be electrically connected. In addition, the characteristics of the bare IC 1 are not deteriorated.
  • FIG. 5 is an enlarged cross-sectional view showing a part of the substrate 9.
  • the substrate 9 is formed of a flexible resin, and a surface electrode 10 is provided on one surface of the substrate 9 as shown in FIG.
  • the surface electrode 10 is configured by applying an Au plating 101 on a nickel layer 102 and a copper layer 103 which are bases.
  • Bumps 6 are formed in a desired shape on the Au plating 101 by discharging a metal paste from the ink head.
  • a metal paste For example, an Ag paste is used as the metal paste.
  • the method of forming the bumps 6 is not limited to the ink jet method.
  • the bumps 6 may be formed by a screen printing method.
  • the screen printing method it is necessary to form the thin portion 61 and then dry it once to replace the screen plate, and then form the thick portion 62 in a part of the thin portion 61.
  • the bumps 6 are formed by the ink jet method, the thin portion 61 to the thick portion 62 can be formed all at once, and the manufacturing cost can be reduced.
  • the external terminal 2 of the bare IC 1 has an inverted truncated cone shape, and is formed by an Au wire bump on an Al pad that is an external electrode of the bare IC 1.
  • the outer diameter of the Au wire bump is 85 ⁇ m and the height is 25 ⁇ m.
  • an Au plating bump, a Cu wire bump, or a Cu plating bump may be used.
  • the external terminal 2 may be formed in a disk shape by a plating bump.
  • FIG. 6 is a schematic cross-sectional view showing the method for manufacturing the electronic component module according to the embodiment of the present invention.
  • the metal paste 4 is discharged from the ink head 3 onto the surface electrode 10 of the substrate 9 to form a thin portion 61 as shown in FIG. 6B.
  • the metal paste 4 is discharged while moving the table on which the ink head 3 or the substrate 9 is placed.
  • An Ag paste is used as the metal paste 4, and one dot of the Ag paste discharged from the ink head 3 is 1 pl (1 ⁇ 10 ⁇ 15 m 3 ).
  • a thin part 61 having a thickness of 20 ⁇ m is formed by discharging the metal paste 4 twice while moving the table on which the ink head 3 is placed in the horizontal direction (left and right direction in FIG. 6). is doing.
  • a thick portion 62 is formed. Also for the thick portion 62, the metal paste 4 is discharged eight times while moving the table on which the ink head 3 is placed in the horizontal direction. Thereby, a bump 6 having a thickness of 100 ⁇ m at the center when the bare IC 1 is viewed in plan is formed. Then, the formed bump 6 is dried. Since the discharged metal paste 4 is a fine droplet, it can be naturally dried without using a special drying apparatus.
  • the ratio of the thickness of the thick part 62 to the thickness of the thin part 61 is about 5: 1.
  • the ratio is not particularly limited to this, and the bare IC 1 is mounted when the bare IC 1 is mounted. If the bump 6 deformed to the side surface does not go around, for example, 2: 1 may be used.
  • the width in the horizontal direction (left-right direction in FIG. 6) is 50 ⁇ m for the thick portion 62 and 100 ⁇ m for the thin portion 61 in the present embodiment, but is not particularly limited thereto.
  • the width of 62 may be 10 ⁇ m.
  • the bare IC 1 is mounted on the substrate 9 and pressed and heated to deform the bumps 6 to join the external terminals 2, and the bare IC 1 is mounted on the substrate 9. To do.
  • the center of the external terminal 2 of the bare IC 1 is aligned so that it does not overlap the thick portion 62. This makes it difficult for the deformed bump 6 to go around the side surface of the bare IC 1.
  • FIG. 7 is a plan perspective view showing the arrangement of the bumps 6 in the electronic component module according to the embodiment of the present invention.
  • the external terminals 2 of the bare IC 1 are indicated by white circles, and the bumps 6 are hatched.
  • the plurality of bumps 6 are arranged in pairs so as to face each other across the center 71 when the bare IC 1 is viewed in plan.
  • the thick portions 62 of the bumps 6 are formed in pairs so as to face each other across the center 71 when the bare IC 1 is viewed in plan. Accordingly, when the bare IC 1 is mounted, the pressing force can be balanced and the deformation state of the plurality of bumps 6 can be made uniform, so that it is possible to prevent the bonding strength from being biased in advance. It becomes possible.
  • the bump 6 is not limited to a rectangular shape in plan view as shown in FIG.
  • FIG. 8 is a plan perspective view showing the arrangement of the bumps 6 when the shapes of the bumps 6 in the electronic component module according to the embodiment of the present invention are different.
  • a bump having a substantially elliptical shape with a thin portion 61 having a substantially elliptical shape in plan view and a thick portion 62 having a substantially elliptical shape in plan view. 6 may be configured.
  • the bumps 6 are arranged in pairs so as to face each other across the center 71 when the bare IC 1 is viewed in plan.
  • the thick portions 62 of the bumps 6 are formed in pairs so as to face each other across the center 71 when the bare IC 1 is viewed in plan.
  • FIG. 9 is a perspective plan view showing the arrangement of the bumps 6 when the bare IC 1 has two external terminals 2 in the electronic component module according to the embodiment of the present invention.
  • the external terminals 2 are often rectangular in plan view from the viewpoint of stably mounting the bare IC 1.
  • the step-like bump 6 is formed so that the thick portion 62 is located on the center side and the thin portion 61 is located on the opposite side when the bare IC 1 is viewed in plan from the center line in the longitudinal direction of the external terminal 2. Therefore, the same effect can be expected.
  • the plurality of joints 7 obtained by deforming the formed plurality of bumps 6 and joining the plurality of external terminals 2 are higher than the height on the center side when the bare IC 1 is viewed in plan view. Since the height on the opposite side to the center side when the bare IC 1 is viewed in plan view is formed to be lower, the joint portion 7 does not come into contact with the side surface of the bare IC 1, and the side surface of the bare IC 1 is obtained by dicer cutting. Even if the internal wiring is exposed, the characteristics of the bare IC 1 are not deteriorated.
  • the bump 6 is formed in a two-step shape including the thick portion 62 and the thin portion 61, but is not particularly limited to two steps.
  • FIG. 10 is a cross-sectional view showing the configuration before mounting the bare IC 1 when the shape of the bump 6 is different in the electronic component module according to the embodiment of the present invention.
  • FIG. 10A shows an example in which the bump 6 is formed in a three-step staircase having a thick portion, an intermediate portion, and a thin portion.
  • the bare IC 1 is formed so as to be thicker as it is closer to the center when viewed in plan.
  • the thickness becomes thicker as it is closer to the center when the bare IC 1 is viewed in plan view.
  • An inclined bump 6 may be formed.
  • the present invention is not limited to the above embodiment, and various changes and improvements can be made within the scope of the gist of the present invention.
  • an electronic component module in which an electronic component such as a bare IC is mounted on a substrate but also an electronic component module in which a medium-sized electronic component incorporating a small-sized electronic component is mounted on a substrate.
  • an electronic component module in which a small-sized electronic component is resin-sealed together with a substrate and then an electromagnetic wave shield portion is formed on the top surface or side surface can be manufactured by applying the present invention.

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Abstract

　電子部品の複数の外部端子と基板の表面電極との接合部が、電子部品の側面に接触することがない、電子部品モジュールの製造方法及び該製造方法で製造された電子部品モジュールを提供する。　複数のバンプ６を厚さの厚い部分である厚肉部と厚さが薄い部分である薄肉部とで構成し、電子部品を平面視した場合に、厚肉部は、対応するそれぞれの外部端子２の、電子部品の中央側に位置するように、薄肉部は、対応するそれぞれの外部端子２の、電子部品の中央側と反対側に位置するように、基板の一方の面にそれぞれ形成する。形成した複数のバンプ６を変形させて複数の外部端子２を接合した複数の接合部７を、電子部品を平面視した場合の電子部品の中央側の高さより電子部品の中央側と反対側の高さの方が低くなるよう形成する。

Description

電子部品モジュールの製造方法及び電子部品モジュール
　本発明は、基板の一方の面に設けてある複数のバンプに、電子部品の複数の外部端子をそれぞれ接合する電子部品モジュールの製造方法及び該製造方法で製造された電子部品モジュールに関する。
　特許文献１には、基板にバンプを介して半導体装置を接合するバンプの形成方法が開示してある。図１は、従来の電子部品モジュールの製造方法を示す模式断面図である。図１（ａ）に示すように、特許文献１では、基板９の表面電極１０上に、インクヘッド３から金属ペースト４を吐出して乾燥させて、バンプ６を形成する。
　次に、図１（ｂ）に示すように、ベアＩＣ（外部端子付き電子部品）１の外部端子２が基板９のバンプ６にそれぞれ対向するように位置合わせする。そして、図１（ｃ）に示すように、ベアＩＣ１を基板９上に搭載して加圧・加熱することにより、バンプ６を変形させて外部端子２を接合し、ベアＩＣ１を基板９に実装する。
特開２００４－２２８３７５号公報
　上述した従来の製造方法では、例えばバンプ６の厚さが厚く形成された場合、変形したバンプ６がベアＩＣ１の側面にまで回り込み、基板９の表面電極１０とベアＩＣ１の内部配線とが導通するおそれがあった。したがって、上述した従来の製造方法で製造した電子部品モジュールは、ベアＩＣ１の特性が劣化するおそれがあった。
　図２は、従来の製造方法で製造した電子部品モジュールの構成を示す断面図である。バンプ６の厚さが厚く形成された場合には、ベアＩＣ１の外部端子２と基板９の表面電極１０との接合部７がベアＩＣ１の側面にまで回り込み、接合部７とベアＩＣ１の側面とが接触する。ベアＩＣ１のダイサーカット時にチッピングが生じた場合、ベアＩＣ１の側面では内部配線がむき出しになることが多い。この場合、接合部７とベアＩＣ１の側面とが接触したときには、基板９の表面電極１０とベアＩＣ１の内部配線とが導通することにより、ベアＩＣ１の特性が劣化する。
　本発明は斯かる事情に鑑みてなされたものであり、電子部品の複数の外部端子と基板の表面電極との接合部が、電子部品の側面に接触することがない、電子部品モジュールの製造方法及び該製造方法で製造された電子部品モジュールを提供することを目的とする。
　上記目的を達成するために本発明に係る電子部品モジュールの製造方法は、基板の一方の面に設けてある複数のバンプに、電子部品の複数の外部端子をそれぞれ接合する電子部品モジュールの製造方法において、複数の前記バンプを厚さが厚い部分である厚肉部と厚さが薄い部分である薄肉部とで構成し、前記電子部品を平面視した場合に、前記厚肉部は、対応するそれぞれの前記外部端子の、前記電子部品の中央側に位置するように、前記薄肉部は、対応するそれぞれの前記外部端子の、前記電子部品の中央側と反対側に位置するように、前記基板の一方の面にそれぞれ形成する工程と、形成した複数の前記バンプを変形させて複数の前記外部端子を接合した複数の接合部を、前記電子部品を平面視した場合の前記電子部品の中央側の高さより前記電子部品の中央側と反対側の高さの方が低くなるよう形成する工程とを含むことを特徴とする。
　上記構成では、複数のバンプを厚さが厚い部分である厚肉部と厚さが薄い部分である薄肉部とで構成してある。そして、電子部品を平面視した場合に、厚肉部は、対応するそれぞれの外部端子の、電子部品の中央側に位置するように、薄肉部は、対応するそれぞれの外部端子の、電子部品の中央側と反対側に位置するように、基板の一方の面に形成する。形成した複数のバンプを変形させて複数の外部端子を接合した複数の接合部を、電子部品を平面視した場合の電子部品の中央側の高さより電子部品の中央側と反対側の高さの方が低くなるよう形成するので、接合部が電子部品の側面に接触することがなく、ダイサーカットにより電子部品の側面に内部配線がむき出しになっている場合であっても、電子部品の特性が劣化することがない。
　また、本発明に係る電子部品モジュールの製造方法は、複数の前記バンプを階段状に形成することが好ましい。
　上記構成では、複数のバンプを階段状に形成するので、接合部を、電子部品を平面視した場合の電子部品の中央側の高さより電子部品の中央側と反対側の高さの方が低くなるよう形成することができ、接合部が電子部品の側面に接触することがなく、ダイサーカットにより電子部品の側面に内部配線がむき出しになっている場合であっても、電子部品の特性が劣化することがない。
　また、本発明に係る電子部品モジュールの製造方法は、複数の前記バンプを、インクジェット法により形成することが好ましい。
　上記構成では、複数のバンプを、インクジェット法により形成するので、金属ペーストの吐出回数を調整することにより厚さの異なる薄肉部と厚肉部とを容易に形成することができる。また、薄肉部から厚肉部までを一気に形成することができ、製造コストを低減することが可能となる。
　次に、上記目的を達成するために本発明に係る電子部品モジュールは、基板と、該基板の一方の面に設けてある複数のバンプと、複数の外部端子を有する電子部品と、複数の前記バンプを変形させて複数の前記外部端子を接合した複数の接合部の周囲を封止する樹脂とを備える電子部品モジュールにおいて、複数の前記接合部は、前記電子部品を平面視した場合の前記電子部品の中央側の高さより前記電子部品の中央側と反対側の高さの方が低くなるよう形成してあることを特徴とする。
　上記構成では、複数の接合部は、電子部品を平面視した場合の電子部品の中央側の高さより電子部品の中央側と反対側の高さの方が低くなるよう形成してあることにより、接合部が電子部品の側面に接触することがなく、ダイサーカットにより電子部品の側面に内部配線がむき出しになっている場合であっても、電子部品の特性が劣化することがない。
　また、本発明に係る電子部品モジュールは、複数の前記バンプは、前記電子部品を平面視した場合の中心を挟んで対向する位置に、それぞれ一対となるように配置してあることが好ましい。
　上記構成では、複数のバンプは、電子部品を平面視した場合の中心を挟んで対向する位置に、それぞれ一対となるように配置してあるので、電子部品を実装した場合に、押圧力のバランスをとることができ、複数のバンプの変形具合を均等にすることができるので、接合強度に偏りが生じることを未然に防止することが可能となる。
　上記構成によれば、複数のバンプを厚さの厚い部分である厚肉部と厚さが薄い部分である薄肉部とで構成してある。そして、電子部品を平面視した場合に、厚肉部は、対応するそれぞれの外部端子の、電子部品の中央側に位置するように、薄肉部は、対応するそれぞれの外部端子の、電子部品の中央側と反対側に位置するように、基板の一方の面に形成する。形成した複数のバンプを変形させて複数の外部端子を接合した複数の接合部を、電子部品を平面視した場合の電子部品の中央側の高さより電子部品の中央側と反対側の高さの方が低くなるよう形成するので、接合部が電子部品の側面に接触することがなく、ダイサーカットにより電子部品の側面に内部配線がむき出しになっている場合であっても、電子部品の特性が劣化することがない。
従来の電子部品モジュールの製造方法を示す模式断面図である。 従来の製造方法で製造した電子部品モジュールの構成を示す断面図である。 本発明の実施の形態に係る電子部品モジュールの、ベアＩＣ実装前の構成を示す断面図である。 本発明の実施の形態に係る電子部品モジュールの構成を示す断面図である。 基板の一部を示す拡大断面図である。 本発明の実施の形態に係る電子部品モジュールの製造方法を示す模式断面図である。 本発明の実施の形態に係る電子部品モジュールにおけるバンプの配置を示す平面透視図である。 本発明の実施の形態に係る電子部品モジュールにおけるバンプの形状が異なる場合の、バンプの配置を示す平面透視図である。 本発明の実施の形態に係る電子部品モジュールにおけるベアＩＣの外部端子が２個である場合の、バンプの配置を示す平面透視図である。 本発明の実施の形態に係る電子部品モジュールの、バンプの形状が異なる場合の、ベアＩＣ実装前の構成を示す断面図である。
　以下、本発明の実施の形態について、図面を参照しながら詳細に説明する。
　図３は、本発明の実施の形態に係る電子部品モジュールの、ベアＩＣ実装前の構成を示す断面図である。図３に示すように、基板９の一方の面に表面電極１０を設けてあり、バンプ６は、表面電極１０上に階段状に形成されている。
　すなわち、バンプ６は、厚さが薄い部分である薄肉部６１と、厚さが厚い部分である厚肉部６２とで構成されている。厚肉部６２は、電子部品を実装する場合に、対応するそれぞれの外部端子２の、電子部品を平面視した場合の中央側に位置するように、薄肉部６１は、対応するそれぞれの外部端子２の、電子部品を平面視した場合の中央側と反対側に位置するように、基板９の一方の面にそれぞれ形成してある。以下、外部端子付きの電子部品であるベアＩＣを実装する場合を例に説明する。
　図４は、本発明の実施の形態に係る電子部品モジュールの構成を示す断面図である。ベアＩＣ１の外部端子２が基板９のバンプ６にそれぞれ対向するように位置合わせした後、ベアＩＣ１を基板９上に搭載して加圧・加熱することにより、図４に示すようにバンプ６を変形させて外部端子２を接合し、ベアＩＣ１を基板９に実装する。
　本実施の形態では、バンプ６を変形させて、外部端子２を接合した部分を接合部７としている。接合部７は、ベアＩＣ１を平面視した場合の中央側の高さよりベアＩＣ１を平面視した場合の中央側と反対側の高さの方が低くなるよう形成してある。したがって、変形したバンプ６がベアＩＣ１の側面にまで回り込むことがない。これにより、ベアＩＣ１のダイサーカット時にチッピングが生じ、ベアＩＣ１の側面で内部配線がむき出しになっている場合であっても、基板９の表面電極１０とベアＩＣ１の内部配線とが導通することがなく、ベアＩＣ１の特性が劣化することがない。
　以下、本実施の形態に係る電子部品モジュールの製造方法について具体的に説明する。図５は、基板９の一部を示す拡大断面図である。基板９はフレキシブルな樹脂で形成されており、図５に示すように、基板９の一方の面に表面電極１０が設けられている。表面電極１０は、下地であるニッケル層１０２、銅層１０３の上に、Ａｕメッキ１０１を施して構成されている。
　Ａｕメッキ１０１の上に、インクヘッドから金属ペーストを吐出することによりバンプ６を所望の形状に形成する。金属ペーストとしては、例えばＡｇペーストを用いる。吐出回数を調整することにより厚さの異なる薄肉部６１と厚肉部６２とを容易に形成することができる。
　もちろん、バンプ６の形成方法は、インクジェット法に限定されるものではない。例えば、スクリーン印刷法でバンプ６を形成しても良い。スクリーン印刷法でバンプ６を形成する場合、薄肉部６１を形成した後、一旦乾燥させ、スクリーン版を取り換えてから薄肉部６１の一部に厚肉部６２を形成する必要がある。しかし、インクジェット法でバンプ６を形成する場合には、薄肉部６１から厚肉部６２までを一気に形成することができ、製造コストを低減することが可能となる。
　また、ベアＩＣ１の外部端子２は、逆円錐台形状であり、ベアＩＣ１の外部電極であるＡｌパッド上にＡｕワイヤバンプにより形成されている。本実施の形態では、Ａｕワイヤバンプの外径は８５μｍ、高さは２５μｍである。なお、Ａｕワイヤバンプの代わりに、Ａｕめっきバンプ、Ｃｕワイヤバンプ、Ｃｕめっきバンプを用いても良い。また、外部端子２は、めっきバンプにより円盤形状に形成しても良い。
　図６は、本発明の実施の形態に係る電子部品モジュールの製造方法を示す模式断面図である。図６（ａ）に示すように、まず基板９の表面電極１０上に、インクヘッド３から金属ペースト４を吐出し、図６（ｂ）に示すように薄肉部６１を形成する。具体的にはインクヘッド３又は基板９を載置してあるテーブルを移動させながら、金属ペースト４を吐出する。金属ペースト４としてＡｇペーストを用い、インクヘッド３から吐出されるＡｇペーストの１ドットは１ｐｌ（１×１０-15 ｍ3 ）である。本実施の形態では、インクヘッド３を載置してあるテーブルを水平方向（図６の左右方向）へ移動させながら金属ペースト４を２回吐出することにより、厚さ２０μｍの薄肉部６１を形成している。
　次に、図６（ｃ）に示すように、厚肉部６２を形成する。厚肉部６２についても、インクヘッド３を載置してあるテーブルを水平方向へ移動させながら金属ペースト４を８回吐出する。これにより、ベアＩＣ１を平面視した場合の中央側における厚さが１００μｍのバンプ６を形成している。そして、形成したバンプ６を乾燥させる。吐出される金属ペースト４が微小滴であるため、特段の乾燥装置を用いずに自然乾燥させることもできる。
　本実施の形態では、厚肉部６２の厚さと薄肉部６１の厚さとの比率が約５：１となっているが、特にこれに限定されるものではなく、ベアＩＣ１の実装時にベアＩＣ１の側面に変形したバンプ６が回り込まなければ、例えば２：１であっても良い。また、水平方向（図６の左右方向）の幅は、本実施の形態では厚肉部６２が５０μｍ、薄肉部６１が１００μｍとしているが、特にこれに限定されるものではなく、例えば厚肉部６２の幅が１０μｍであっても良い。
　形成したバンプ６を乾燥させた後、ベアＩＣ（外部端子付き電子部品）１の外部端子２が基板９のバンプ６にそれぞれ対向するように位置合わせする。そして、図６（ｄ）に示すように、ベアＩＣ１を基板９上に搭載して加圧・加熱することにより、バンプ６を変形させて外部端子２を接合し、ベアＩＣ１を基板９に実装する。なお、ベアＩＣ１の外部端子２の中心が、厚肉部６２と重ならないよう位置合わせする。これにより、変形したバンプ６がベアＩＣ１の側面に回り込みにくくなる。
　図７は、本発明の実施の形態に係る電子部品モジュールにおけるバンプ６の配置を示す平面透視図である。ベアＩＣ１の外部端子２を白丸印で示しており、バンプ６にはハッチングが施してある。複数のバンプ６は、ベアＩＣ１を平面視した場合の中心７１を挟んで対向する位置に、それぞれ一対となるように配置してある。
　また、バンプ６の厚肉部６２は、ベアＩＣ１を平面視した場合の中心７１を挟んで対向する位置に、それぞれ一対となるように形成されている。したがって、ベアＩＣ１を実装した場合に、押圧力のバランスをとることができ、複数のバンプ６の変形具合を均等にすることができるので、接合強度に偏りが生じることを未然に防止することが可能となる。
　なお、バンプ６は、図７に示すように、平面視した形状が矩形であることに限定されるものではない。図８は、本発明の実施の形態に係る電子部品モジュールにおけるバンプ６の形状が異なる場合の、バンプ６の配置を示す平面透視図である。図８に示すように、平面視した形状が略楕円形である薄肉部６１と、平面視した形状が略楕円形である厚肉部６２とで、平面視した形状が略楕円形であるバンプ６を構成しても良い。この場合もバンプ６は、ベアＩＣ１を平面視した場合の中心７１を挟んで対向する位置に、それぞれ一対となるように配置してある。また、バンプ６の厚肉部６２は、ベアＩＣ１を平面視した場合の中心７１を挟んで対向する位置に、それぞれ一対となるように形成されている。
　また、外部端子２の数も特に制約があるものではなく、最低限２個あれば足りる。図９は、本発明の実施の形態に係る電子部品モジュールにおけるベアＩＣ１の外部端子２が２個である場合の、バンプ６の配置を示す平面透視図である。
　図９に示すように、外部端子２が２個である場合には、ベアＩＣ１を安定して実装するという観点から外部端子２は、平面視した形状が矩形であることが多い。そして、外部端子２の長手方向の中心線よりもベアＩＣ１を平面視した場合の中央側に厚肉部６２が、反対側に薄肉部６１が位置するように、階段状のバンプ６を形成することにより、同様の効果が期待できる。
　図６に戻って、最後に図６（ｅ）に示すように、接合部７の周囲を絶縁樹脂８で封止して、電子部品モジュールとして完成する。
　以上のように本実施の形態によれば、形成した複数のバンプ６を変形させて複数の外部端子２を接合した複数の接合部７を、ベアＩＣ１を平面視した場合の中央側の高さよりベアＩＣ１を平面視した場合の中央側と反対側の高さの方が低くなるよう形成してあるので、接合部７がベアＩＣ１の側面に接触することがなく、ダイサーカットによりベアＩＣ１の側面に内部配線がむき出しになっている場合であっても、ベアＩＣ１の特性が劣化することがない。
　なお、上述した実施の形態では、バンプ６が厚肉部６２と薄肉部６１との２段の階段状に形成されているが、特に２段に限定されるものではない。図１０は、本発明の実施の形態に係る電子部品モジュールの、バンプ６の形状が異なる場合の、ベアＩＣ１実装前の構成を示す断面図である。
　図１０（ａ）では、バンプ６を厚肉部、中間部、薄肉部の３段の階段状に形成した場合の例を示している。もちろん、ベアＩＣ１を平面視した場合の中央側に近いほど厚さが厚くなるように形成してあることは言うまでもない。また、インクヘッド３から吐出する金属ペースト４の量を精緻に制御できるのであれば、図１０（ｂ）に示すように、ベアＩＣ１を平面視した場合の中央側に近いほど厚さが厚くなるよう傾斜したバンプ６を形成しても良い。
　また、本発明は上記実施の形態に限定されるものではなく、本発明の趣旨の範囲内であれば多種の変更、改良等が可能である。例えばベアＩＣのような電子部品を基板に実装した電子部品モジュールだけでなく、小型サイズの電子部品を内蔵した中型サイズの電子部品を基板に実装した電子部品モジュールであっても良い。一例としては、小型サイズの電子部品を基板と共に樹脂封止した後、天面や側面に電磁波シールド部を形成した電子部品モジュールも、本発明を適用して製造することができる。
　１　ベアＩＣ（外部端子付き電子部品）
　２　外部端子
　４　金属ペースト
　６　バンプ
　７　接合部
　８　絶縁樹脂
　９　基板
　１０　表面電極
　６１　薄肉部
　６２　厚肉部

Claims (5)

  1. 　基板の一方の面に設けてある複数のバンプに、電子部品の複数の外部端子をそれぞれ接合する電子部品モジュールの製造方法において、
    　複数の前記バンプを厚さが厚い部分である厚肉部と厚さが薄い部分である薄肉部とで構成し、前記電子部品を平面視した場合に、前記厚肉部は、対応するそれぞれの前記外部端子の、前記電子部品の中央側に位置するように、前記薄肉部は、対応するそれぞれの前記外部端子の、前記電子部品の中央側と反対側に位置するように、前記基板の一方の面にそれぞれ形成する工程と、
    　形成した複数の前記バンプを変形させて複数の前記外部端子を接合した複数の接合部を、前記電子部品を平面視した場合の前記電子部品の中央側の高さより前記電子部品の中央側と反対側の高さの方が低くなるよう形成する工程と
    　を含むことを特徴とする電子部品モジュールの製造方法。
  2. 　複数の前記バンプを階段状に形成することを特徴とする請求項１に記載の電子部品モジュールの製造方法。
  3. 　複数の前記バンプを、インクジェット法により形成することを特徴とする請求項１又は２に記載の電子部品モジュールの製造方法。
  4. 　基板と、
    　該基板の一方の面に設けてある複数のバンプと、
    　複数の外部端子を有する電子部品と、
    　複数の前記バンプを変形させて複数の前記外部端子を接合した複数の接合部の周囲を封止する樹脂と
    　を備える電子部品モジュールにおいて、
    　複数の前記接合部は、前記電子部品を平面視した場合の前記電子部品の中央側の高さより前記電子部品の中央側と反対側の高さの方が低くなるよう形成してあることを特徴とする電子部品モジュール。
  5. 　複数の前記バンプは、前記電子部品を平面視した場合の中心を挟んで対向する位置に、それぞれ一対となるように配置してあることを特徴とする請求項４に記載の電子部品モジュール。
PCT/JP2012/059305 2011-04-27 2012-04-05 電子部品モジュールの製造方法及び電子部品モジュール WO2012147480A1 (ja)

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JP5626460B2 (ja) 2014-11-19
US9532495B2 (en) 2016-12-27
US20140049922A1 (en) 2014-02-20
CN103493191B (zh) 2017-09-26
KR101489146B1 (ko) 2015-02-03
CN103493191A (zh) 2014-01-01
EP2704185A4 (en) 2014-10-29
US10177108B2 (en) 2019-01-08
US20170084566A1 (en) 2017-03-23
EP2704185A1 (en) 2014-03-05
JPWO2012147480A1 (ja) 2014-07-28

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