WO2012060053A1 - 光半導体装置用接着剤、光半導体装置用接着剤シート、光半導体装置用接着剤シートの製造方法、及び光半導体装置の製造方法 - Google Patents

光半導体装置用接着剤、光半導体装置用接着剤シート、光半導体装置用接着剤シートの製造方法、及び光半導体装置の製造方法 Download PDF

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Publication number
WO2012060053A1
WO2012060053A1 PCT/JP2011/005650 JP2011005650W WO2012060053A1 WO 2012060053 A1 WO2012060053 A1 WO 2012060053A1 JP 2011005650 W JP2011005650 W JP 2011005650W WO 2012060053 A1 WO2012060053 A1 WO 2012060053A1
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WO
WIPO (PCT)
Prior art keywords
optical semiconductor
adhesive
semiconductor device
semiconductor devices
sheet
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2011/005650
Other languages
English (en)
French (fr)
Japanese (ja)
Inventor
嘉幸 塩野
市六　信広
岩田　充弘
利之 小材
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Shin Etsu Chemical Co Ltd
Original Assignee
Shin Etsu Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shin Etsu Chemical Co Ltd filed Critical Shin Etsu Chemical Co Ltd
Priority to CN2011800528888A priority Critical patent/CN103201860A/zh
Priority to KR1020137010908A priority patent/KR20130124498A/ko
Publication of WO2012060053A1 publication Critical patent/WO2012060053A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07
    • H01L21/4814—Conductive parts
    • H01L21/4871—Bases, plates or heatsinks
    • H01L21/4875—Connection or disconnection of other leads to or from bases or plates
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
    • C09J183/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/40—Adhesives in the form of films or foils characterised by release liners
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
    • H01L21/52—Mounting semiconductor bodies in containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/0235—Method for mounting laser chips
    • H01S5/02355—Fixing laser chips on mounts
    • H01S5/0236—Fixing laser chips on mounts using an adhesive
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/8506—Containers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2467/00—Presence of polyester
    • C09J2467/006—Presence of polyester in the substrate
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2483/00—Presence of polysiloxane

Definitions

  • the present invention relates to an adhesive for a semiconductor device, and more particularly to an adhesive for an optical semiconductor device and a method for manufacturing an optical semiconductor device using the same.
  • a liquid, paste-like curable adhesive (also referred to as a die bond agent) for bonding an optical semiconductor element to an element mounting portion, and a curable adhesive for sealing the optical semiconductor element from above.
  • Agents have been used.
  • an optical semiconductor device having a blue LED (light emission diode) element or an LED element that emits white light by performing wavelength conversion by light emission from an LED element having an emission wavelength equal to or less than a blue wavelength an optical semiconductor element is used.
  • Liquid and paste-like silicone adhesives have been used as curable adhesives for sealing from above.
  • Patent Document 1 liquid and pasty silicone materials are also used as the die bond agent, and the silicone die bond agent generally has low internal stress, excellent adhesiveness, and excellent light transmittance
  • Patent Document 2 a light emitting semiconductor device is produced by potting an epoxy / silicone hybrid resin composition and curing at 180 ° C. for 1 hour.
  • Patent Document 2 an epoxy / silicone hybrid resin composition is prepared. The object is bonded and sealed by injecting it into a cup, cavity, package recess or the like in which a light emitting element is arranged at the bottom by a dispenser or other method and curing it by heating or the like.
  • an optical semiconductor element 13 ′ such as an LED element is cut out in large quantities from one wafer 12 ′ by a dicer 11 ′ (Step 1 ′) and collected, but the optical semiconductor element 13 ′ has a large variation in emission wavelength. Each of the emission wavelengths is measured, and an operation called sorting is performed (step 2 ′). Next, the optical semiconductor elements 13 ′ sorted into the respective layers are bonded together on one adhesive tape 21 for each layer (Step 3 ′).
  • step 4-1 ′ an operation of picking up the optical semiconductor elements 13 ′ one by one from the adhesive tape 21 to which the optical semiconductor elements 13 ′ having the selected emission wavelength layer are attached is performed (step 4-1 ′) and arranged separately.
  • a liquid, paste-like die bonding agent 22 is applied to the element mounting portion 15 ′ in the optical semiconductor device 14 ′ thus prepared by stamping (step 4-2 ′), and the picked-up optical semiconductor element 13 ′ is applied to the element mounting portion 15 ′.
  • the die bonding agent 22 is cured by heating or the like, and the optical semiconductor element 13 ′ and the element mounting portion 15 ′ in the optical semiconductor device 14 ′ are cured and bonded (step 5 ′).
  • the above method for manufacturing an optical semiconductor device has a problem that it takes time because it is necessary to stamp a die bond agent on each of the element mounting portions of the optical semiconductor device.
  • This problem has been a problem that cannot be avoided as long as a liquid or paste die bond agent is applied and used. Therefore, from the viewpoint of high efficiency productivity and production cost reduction, there has been a demand for an optical semiconductor device adhesive that replaces the liquid and paste die bond agent and a method of manufacturing an optical semiconductor device using the same.
  • the present invention has been made to solve the above problems, and can efficiently manufacture an optical semiconductor device.
  • an optical semiconductor element including a light emission diode (hereinafter referred to as LED) and a laser diode (hereinafter referred to as LD).
  • An adhesive for an optical semiconductor device capable of efficiently performing the work until the element mounting portion (also referred to as a die, die or chip) is fixed to the element mounting portion of the optical semiconductor device, and improving the productivity of manufacturing the optical semiconductor device
  • An object of the present invention is to provide an adhesive sheet for an optical semiconductor device, a method for manufacturing the same, and a method for manufacturing an optical semiconductor device.
  • an optical semiconductor element cut out and sorted from a wafer is picked up from a base sheet, and the optical semiconductor element is mounted on an element mounting portion in an optical semiconductor device, and then the optical semiconductor element is mounted.
  • An adhesive for an optical semiconductor device used for curing and adhering a semiconductor element to the element mounting portion which is formed in a film shape, disposed on the base sheet, and can be peeled off from the base sheet.
  • the adhesive agent for optical semiconductor devices since it is shape
  • Adhesive can be pasted and further peeled off from the base sheet, so that the optical semiconductor element and the adhesive for the optical semiconductor device are both peeled off and picked up at the time of picking up and mounted directly on the element mounting portion. It can be cured and bonded via an adhesive for the device. Therefore, it is not necessary to stamp the die bonding agent on the element mounting portion, and the optical semiconductor device can be efficiently manufactured. In particular, the optical semiconductor device can be efficiently operated until it is fixed to the element mounting portion of the optical semiconductor device. It becomes an adhesive.
  • the adhesive for an optical semiconductor device has an area of 51% or more and 225% or less of an adhesion surface of the optical semiconductor element to the element mounting portion.
  • the adhesive for an optical semiconductor device has an area of 51% or more and 225% or less of the adhesion surface of the optical semiconductor element to the element mounting portion, sufficient adhesive strength can be obtained after curing. Since it can avoid covering an element attaching part unnecessarily, it is preferable.
  • an adhesive for optical semiconductor devices having an adhesive strength to an adherend of 20 kN / m 2 or more and 300 kN / m 2 or less.
  • the adhesive for an optical semiconductor device has an adhesive force of 20 kN / m 2 or more and 300 kN / m 2 or less when the optical semiconductor element is picked up from the base sheet, Since the adhesive for optical semiconductor devices is difficult to peel off, it is easy to pick up together, and the adhesive for optical semiconductor devices is easily peeled off from the base sheet during pickup, so that the optical semiconductor element and optical semiconductor device It is preferable because both the adhesive and the adhesive are easily picked up.
  • an adhesive for optical semiconductor devices containing 51% by mass or more of the silicone composition.
  • the optical semiconductor device manufactured using this adhesive for optical semiconductor devices is an optical semiconductor element. This is preferable because it provides an optical semiconductor device with good light extraction efficiency.
  • the semi-cured adhesive for an optical semiconductor device allows the optical semiconductor element to be pressure-bonded and pasted well, and the optical semiconductor element and the film-like adhesive for an optical semiconductor device are integrated together. This is preferable because it is easy to pick up.
  • the present invention provides an adhesive sheet for optical semiconductor devices, wherein a plurality of the adhesives for optical semiconductor devices are arranged on the base material sheet.
  • the adhesive sheet for optical semiconductor devices is one in which a plurality of adhesives for optical semiconductor devices are arranged on the base sheet, the adhesive sheet for optical semiconductor devices is placed on one sheet of adhesive sheet for optical semiconductor devices.
  • a plurality of optical semiconductor elements can be attached.
  • the optical semiconductor element and the optical semiconductor device adhesive are both peeled off and picked up at the time of pickup, and can be directly mounted on the element mounting portion and cured and bonded via the optical semiconductor device adhesive. It becomes. Therefore, it is not necessary to stamp the die bonding agent on the element mounting portion, and the optical semiconductor device can be efficiently manufactured.
  • the optical semiconductor device can be efficiently operated until it is fixed to the element mounting portion of the optical semiconductor device. It becomes an adhesive sheet.
  • the present invention provides a method for producing an adhesive sheet for optical semiconductor devices, wherein the plurality of adhesives for optical semiconductor devices are arranged on the base material sheet by screen printing.
  • the manufacturing method of the adhesive sheet for optical semiconductor devices enables high throughput of the manufacturing of the adhesive sheet for optical semiconductor devices, and the optical semiconductor element that is cured and bonded to the element mounting portion.
  • a screen plate having an appropriate pattern according to the bonding area By using a screen plate having an appropriate pattern according to the bonding area, a film-like adhesive for an optical semiconductor device having a uniform shape, area and thickness can be formed and arranged.
  • a method of manufacturing an optical semiconductor device by curing and bonding an optical semiconductor element cut and sorted from a wafer to an element mounting portion in the optical semiconductor device, the optical semiconductor device being cut and sorted from the wafer
  • a die-bonding step of curing the adhesive for curing and bonding the optical semiconductor element to the optical semiconductor device It provides a method of manufacturing an optical semiconductor device.
  • the film-form adhesive agent for optical semiconductor devices can be affixed on the surface adhere
  • the optical semiconductor element and the adhesive for the optical semiconductor device can be integrally peeled off and picked up, and the optical semiconductor element picked up in the die-bonding process is mounted on the element mounting portion as it is for the optical semiconductor device. It can be cured and bonded via an adhesive. Therefore, a die bonding agent stamping step on the element mounting portion is not required, and the optical semiconductor device can be efficiently manufactured.
  • the optical semiconductor capable of efficiently performing the work until it is fixed to the element mounting portion of the optical semiconductor device. It becomes the manufacturing method of an apparatus.
  • an optical semiconductor device can be efficiently manufactured, and in particular, an operation until the optical semiconductor element is fixed to the element mounting portion of the optical semiconductor device can be efficiently performed. It is possible to provide an adhesive for an optical semiconductor device, an adhesive sheet for an optical semiconductor device, a method for manufacturing the same, and a method for manufacturing an optical semiconductor device that can reduce the time for stamping the element mounting portion.
  • the optical semiconductor device adhesive the optical semiconductor device adhesive sheet, the optical semiconductor device adhesive sheet manufacturing method, and the optical semiconductor device manufacturing method according to the present invention will be described in detail. It is not limited. As described above, there has been a demand for an adhesive for an optical semiconductor device in place of a liquid or paste-like die bond agent and a method for manufacturing an optical semiconductor device using the same, from the viewpoint of high-efficiency productivity and production cost reduction.
  • an optical semiconductor device adhesive that is used to cure and bond the optical semiconductor element to the element mounting part after being mounted on a part, which is formed into a film and disposed on the base sheet If it is an adhesive for an optical semiconductor device characterized in that it can be peeled from the base sheet, it can efficiently produce an optical semiconductor device having an optical semiconductor element including an LED device, In particular, the work until the optical semiconductor element is fixed to the element mounting portion of the optical semiconductor device can be efficiently performed, and the time for stamping the die bonding agent to the element mounting portion is reduced. It found that the optical semiconductor device adhesive that can Rukoto, and completed the present invention.
  • the present inventors also provide a method of manufacturing an optical semiconductor device by curing and bonding an optical semiconductor element cut and sorted from a wafer to an element mounting portion in the optical semiconductor device, wherein the optical semiconductor device is cut and sorted from the wafer.
  • Affixing the optical semiconductor element to a film-like adhesive for an optical semiconductor device disposed on a base sheet, the optical semiconductor element attached together with the adhesive for a film-like optical semiconductor device A pick-up process for separating and picking up from the substrate sheet, and mounting the picked-up optical semiconductor element so that the film-like adhesive for an optical semiconductor device adheres to the element mounting portion.
  • an optical semiconductor device having an optical semiconductor element such as an LED device can be efficiently manufactured, and in particular, the optical semiconductor element is attached to the element of the optical semiconductor device.
  • the present invention has been completed by discovering that the method of manufacturing an optical semiconductor device can be efficiently performed up to the fixing to the part, and the time for stamping the die bond agent to the element mounting part can be reduced.
  • an optical semiconductor element cut out from a wafer and sorted is picked up from a base sheet, and the optical semiconductor element is mounted on an element mounting portion in an optical semiconductor device.
  • An adhesive for an optical semiconductor device used for curing and bonding to an optical semiconductor device, wherein the adhesive is formed into a film, is disposed on the base sheet, and can be peeled off from the base sheet.
  • An adhesive for an optical semiconductor device is provided.
  • the optical semiconductor element according to the present invention is an optical semiconductor element cut out from a wafer and sorted, and is not particularly limited as long as it is generally handled as an optical semiconductor element. it can.
  • Such optical semiconductor elements generally have large variations in light quantity, emission wavelength, etc., as a particular problem. For this reason, a sorting operation is performed in which the layers are classified for each emission wavelength and the like before being fixed to the optical semiconductor device. Since the sorting is performed by measuring the emission wavelength of each optical semiconductor element, the optical semiconductor element after sorting usually needs to be attached to an adhesive sheet or the like for each layer.
  • the optical semiconductor device according to the present invention is an optical semiconductor device in which the adhesive for an optical semiconductor device of the present invention is attached to the surface to be bonded to the device mounting portion after being cut out from the wafer and sorted. After being mounted on the inner element mounting portion, it is cured and bonded to the element mounting portion by the optical semiconductor device adhesive of the present invention. Accordingly, in the step of pasting the sorted optical semiconductor element to the adhesive for optical semiconductor devices on the base sheet, the sorted optical semiconductor element is stuck to each layer, and the adhesive for optical semiconductor devices It is possible to simultaneously press and paste the.
  • the substrate sheet according to the present invention is particularly suitable if the adhesive for optical semiconductor devices according to the present invention is disposed thereon and the adhesive for optical semiconductor devices according to the present invention can be peeled from the adhesive.
  • a base sheet for example, a PET separator in which a release agent is coated on a PET film can be used.
  • the optical semiconductor element cut out from the wafer and sorted is attached to an adhesive for an optical semiconductor device arranged on the base sheet, picked up from the base sheet, and an element mounting portion in the optical semiconductor device Mounted on.
  • the base material sheet is one from which the adhesive for optical semiconductor devices of the present invention can be peeled off, the adhesive for optical semiconductor devices is integrated with the picked-up optical semiconductor element from above the base material sheet. Peel off and pick up.
  • the element mounting portion in the optical semiconductor device of the present invention is a portion on which the optical semiconductor element is mounted.
  • the adhesive for an optical semiconductor device of the present invention is an adhesive for an optical semiconductor device used for curing and bonding the optical semiconductor element to an element mounting portion in the optical semiconductor device, and is formed into a film shape. It is arrange
  • the optical semiconductor element is mounted on the element mounting portion and cured and bonded via the adhesive for optical semiconductor devices of the present invention (die bonding). Process).
  • the adhesive for optical semiconductor devices of the present invention the optical semiconductor element can be cured and bonded without stamping the die bonding agent to the element mounting portion, and the work until fixing to the element mounting portion of the optical semiconductor device Can be performed efficiently, and the productivity of manufacturing the optical semiconductor device can be increased.
  • the adhesive for optical semiconductor devices of the present invention is formed into a film shape. Therefore, it is easy to form on a base material sheet and to peel easily.
  • the optical semiconductor element can be attached with a film of an adhesive for an optical semiconductor device having a uniform shape, area and thickness, the quality of the optical semiconductor device after curing and bonding is kept constant. It is.
  • the adhesive for an optical semiconductor device of the present invention is formed into a film shape, and the area thereof is preferably an area of 51% or more and 225% or less of an adhesive surface of the optical semiconductor element to the element mounting portion.
  • the area is preferably 71% or more and 200% or less.
  • a film area of 51% or more is preferable because sufficient adhesive strength can be obtained after curing, and a film area of 225% or less is preferable because unnecessary covering of the element mounting portion can be avoided.
  • the adhesive for optical semiconductor devices of the present invention is formed into a film shape, and the thickness thereof is preferably in the range of 1 ⁇ m to 150 ⁇ m, particularly preferably 3 ⁇ m to 100 ⁇ m. If the thickness is 1 ⁇ m or more, it is preferable because sufficient adhesive strength can be obtained after curing. If the thickness is 150 ⁇ m or less, the optical semiconductor device to which the optical semiconductor element is cured and bonded can be prevented from becoming too thick. preferable.
  • the adhesive for optical semiconductor devices arrange
  • the adhesive agent for optical semiconductor devices of this invention is arrange
  • the adhesive for optical semiconductor devices which can be peeled from the said base material sheet The adhesive for optical semiconductor devices of this invention can be peeled from the said base material sheet. Therefore, the adhesive for optical semiconductor devices is peeled off from the substrate sheet and picked up together with the picked optical semiconductor element. Thereafter, in the die bonding step, the optical semiconductor element is mounted on the element mounting portion via the optical semiconductor device adhesive of the present invention and cured and bonded.
  • the optical semiconductor element can be cured and bonded without stamping a die bond agent to the element mounting portion, and the operation until fixing to the element mounting portion of the optical semiconductor device is performed. Can be performed efficiently, and the productivity of manufacturing the optical semiconductor device can be increased.
  • the adhesive for optical semiconductor devices of the present invention can be peeled from the substrate sheet, and preferably has an adhesive strength to an adherend of 20 kN / m 2 or more and 300 kN / m 2 or less, and 30 kN / m 2 or more. More preferably, it is 200 kN / m 2 or less.
  • This adhesive strength is the adhesive strength in the adhesive test of JIS Z 3284 “Solder paste”. If it is 20 kN / m 2 or more, it is preferable that the optical semiconductor element and the film-like adhesive for an optical semiconductor device are easily picked up together when picking up from the base sheet, and 300 kN / m is preferable. If it is 2 or less, the adhesive for optical semiconductor devices is easy to peel off from the base sheet during pickup, which is preferable.
  • the adhesive for optical semiconductor devices of the present invention preferably contains 51% by mass to 100% by mass of the silicone composition.
  • the optical semiconductor device in which the optical semiconductor element is cured and bonded using the adhesive for optical semiconductor devices becomes an optical semiconductor device with good light extraction efficiency.
  • an appropriate amount of an adhesion assistant, a control agent, a curing catalyst, and a filler can be blended.
  • the light absorption coefficient of the adhesive for optical semiconductor devices of the present invention is preferably 1.0 ⁇ 10 4 / m or less.
  • the adhesive for optical semiconductor devices of the present invention is preferably in a semi-cured state.
  • This semi-cured state is a B-stage as defined in JIS K 6800 “Adhesive / Adhesion Terminology” (a cured intermediate of a thermosetting resin. The resin in this state softens when heated, It swells when it comes into contact with the solvent, but does not melt or dissolve completely).
  • the film-like adhesive for an optical semiconductor device is in a semi-cured state, the optical semiconductor element can be satisfactorily attached (crimped), and the optical semiconductor element and the film-like adhesive for an optical semiconductor device are integrated together. This is preferable because it is easy to pick up.
  • this invention provides the adhesive sheet for optical semiconductor devices characterized by arrange
  • FIG. 1 illustrates a top view of the adhesive sheet for an optical semiconductor device of the present invention
  • FIG. 2 illustrates a side view.
  • the adhesive sheet 3 for optical semiconductor devices of this invention arrange
  • the optical semiconductor elements cut out from the wafer and sorted are individually attached to a plurality of adhesives for optical semiconductor devices of the adhesive sheet for optical semiconductor devices (attaching step). Therefore, a plurality of optical semiconductor elements are bonded on one adhesive sheet for an optical semiconductor device. Further, at the time of picking up the optical semiconductor element, the adhesive for the optical semiconductor device is peeled off from the base sheet together with the optical semiconductor element and picked up (pickup process). Thereafter, in the process of mounting the optical semiconductor element on the element mounting portion and curing and bonding, the optical semiconductor element is mounted on the element mounting portion and cured and bonded via the adhesive for optical semiconductor devices of the present invention (die bonding). Process).
  • the optical semiconductor element can be cured and bonded without stamping a die bond agent to the element mounting portion, and fixed to the element mounting portion of the optical semiconductor device.
  • the work can be performed efficiently, and the productivity of manufacturing the optical semiconductor device can be increased.
  • the optical semiconductor element having a specific layer is the same adhesive for an optical semiconductor device. It can also be set as the usage form which affixes on a sheet
  • an adhesive sheet for an optical semiconductor device in which an optical semiconductor element for each layer is attached can be obtained.
  • the optical semiconductor device adhesive sheet to which the specific layer of the optical semiconductor element is bonded can be placed on the die bonder as it is, and the optical semiconductor elements having the specific layer can be collectively bonded to the element mounting portion.
  • Such usage is preferable from the viewpoint of productivity.
  • this invention provides the manufacturing method of the said adhesive sheet for optical semiconductor devices characterized by arrange
  • a film-like adhesive for an optical semiconductor device having a shape, an area, and a thickness can be formed.
  • the present invention also relates to a method of manufacturing an optical semiconductor device by curing and bonding an optical semiconductor element cut and sorted from a wafer to an element mounting portion in the optical semiconductor device, the optical semiconductor device being cut and sorted from the wafer
  • a die-bonding step of curing and bonding the optical semiconductor element to the optical semiconductor device.
  • FIG. 3B shows a flowchart of a conventional method for manufacturing an optical semiconductor device.
  • an optical semiconductor element 13 ' such as an LED element is cut out from the wafer 12' by the dicer 11 '(step 1'). Since the cut out optical semiconductor element 13 ′ has a large variation in light quantity, emission wavelength, etc., the emission wavelength is measured, sorted (by layer) (step 2 ′), and the optical semiconductor element 13 ′ sorted in each layer is An affixing process (process 3 ′) to be affixed on the adhesive sheet 21 for each layer is performed.
  • a pick-up step (step 4-1 ′) for picking up the attached optical semiconductor element 13 ′ from the adhesive sheet 21 of the selected light emission wavelength layer is performed, and at the same time, an optical semiconductor device 14 ′ arranged separately.
  • the die bonding agent 22 is applied to the inner element mounting portion 15 ′ by stamping (step 4-2 ′), and the picked-up optical semiconductor element 13 ′ is mounted on the element mounting portion 15 ′ via the die bonding agent 22.
  • a die-bonding step (step 5 ′) is performed in which is cured and bonded.
  • the above optical semiconductor device manufacturing method has a problem that it takes time to stamp the die bond agent (step 4-2 ′). This problem is caused by using a liquid, paste-like die bond agent. It was a problem that could not be avoided. Therefore, there has been a demand for an optical semiconductor device adhesive that replaces a liquid, paste-like die bond agent and a method of manufacturing an optical semiconductor device using the same.
  • FIG. 3A shows a flowchart of the method for manufacturing an optical semiconductor device of the present invention.
  • an optical semiconductor element 13 such as an LED element is cut out from the wafer 12 by the dicer 11 (step 1). Since the cut out optical semiconductor element 13 has a large variation in light quantity, emission wavelength, and the like, the emission wavelength is measured and sorted (step 2).
  • sorting by layer
  • an optical semiconductor element having a specific layer is attached to the same adhesive sheet for an optical semiconductor device, and an optical semiconductor element having a layer different from the specific layer is different from the optical semiconductor device. It can also be affixed to an adhesive sheet.
  • the adhesive sheet for optical semiconductor device to which the optical semiconductor element of the specific layer is bonded is directly installed on the die bonder, and the optical semiconductor elements having the specific layer are collectively bonded to the element mounting portion. This is preferable.
  • the optical semiconductor element 13 sorted in each layer is subjected to an attaching step (Step 3) to be attached to the film-like adhesive 1 for an optical semiconductor device disposed on the base sheet 2 for each layer.
  • an attaching step it is possible to simultaneously attach the sorted optical semiconductor element and to apply the adhesive for optical semiconductor device of the present invention on the optical semiconductor element.
  • the film-like adhesive for an optical semiconductor device can be made into a semi-cured state before this attaching step.
  • the method to make a semi-hardened state is not specifically limited, Performing using a hot-air circulation type oven is illustrated. Although it does not specifically limit as temperature dried using a hot-air circulation type oven, 40 to 150 degreeC is preferable and 40 to 140 degreeC is more preferable. If the temperature is 40 ° C. or higher, it is possible to suppress an increase in the time required for curing, and if the temperature is less than 150 ° C., it is preferable because the curing speed is too high to completely cure.
  • time to dry using a hot-air circulation type oven 10 second or more and less than 2 hours are preferable, and 10 second or more and 1 hour and a half or less are more preferable. If the time is 10 seconds or more, the optical semiconductor element can be satisfactorily attached (crimped), and the optical semiconductor element and the film-like adhesive for an optical semiconductor device can be easily picked up together. Moreover, since it can suppress that it hardens
  • the pasted optical semiconductor element 13 is peeled from the base sheet 2 together with the adhesive 1 for an optical semiconductor device. Then, a pick-up step (step 4) for picking up is performed, whereby the optical semiconductor element 13 to which the film-like adhesive 1 for optical semiconductor devices is adhered is picked up.
  • a die bonding step (step 5) is performed in which the optical semiconductor element 13 is cured and bonded to the optical semiconductor device 14 by curing. Thereby, the work up to fixing the optical semiconductor element to the element mounting portion of the optical semiconductor device can be efficiently performed without stamping the die bond agent, and the light that can increase the productivity of manufacturing the optical semiconductor device.
  • a method for manufacturing a semiconductor device is provided.
  • Example 1 and Example 2 of the adhesive sheet for optical semiconductor devices of the present invention will be described.
  • Example 1 KER-3000-M4 (manufactured by Shin-Etsu Chemical Co., Ltd.), which is a curable silicone composition, as an adhesive for optical semiconductor devices, PET separator as a base sheet, PET # 38x-41-3035, 38 ⁇ m (Takaline Corporation, Ltd.) Manufactured), 10 screens with 10 1mm x 1mm square openings arranged as a screen plate, a screen plate with a total of 100 openings regularly arranged at intervals of 0.5mm, manufactured by Mino Group as a screen printing machine A screen printer was used.
  • the adhesive sheet for an optical semiconductor device manufactured as in Example 1 is obtained by arranging a plurality of adhesives for an optical semiconductor device. Moreover, the adhesive for optical semiconductor devices on a base material sheet is shape
  • the adhesive strength of the optical semiconductor element was evaluated using the film-shaped adhesive for an optical semiconductor device of the adhesive sheet for an optical semiconductor device obtained in Example 1.
  • a blue LED element having an adhesive area of 1 mm ⁇ 1 mm is pressure-bonded to this film-like adhesive for an optical semiconductor device, and then lifted while grasping the element with tweezers.
  • the adhesive for an optical semiconductor device is easily peeled off from the PET separator. I was able to.
  • the film-like adhesive for an optical semiconductor device was picked up together with the optical semiconductor element while being adhered cleanly to one surface of the element (surface to be bonded to the element mounting portion).
  • this film-like optical semiconductor element with an adhesive for optical semiconductor devices was pressure-bonded so as to adhere to a silver-plated copper plate (corresponding to the element mounting portion) via the adhesive for film-like optical semiconductor devices. Thereafter, it was heated and cured in a hot air circulating oven at 150 ° C. for 2 hours to be cured and adhered.
  • the shear bond strength after cured bonding was 4 MPa. The shear bond strength was measured using a strength tester (manufactured by Daisy).
  • Example 2 Further, an optical semiconductor device in which a semi-cured film-like adhesive for an optical semiconductor device having a thickness of 10 ⁇ m is arranged in the same manner as in Example 1 except that the square opening of the screen plate to be used is 100 mm ⁇ 100 mm. An adhesive sheet was obtained. Subsequently, evaluation of adhesive strength and optical transparency of the adhesive for optical semiconductor devices on the base sheet was performed by the following methods.
  • T the light transmittance
  • R the reflectance at the boundary surface
  • t the thickness of the adhesive for optical semiconductor devices
  • ⁇ the light absorption coefficient
  • Subscripts 1 and 2 of thicknesses t 1 and t 2 and light transmittances T 1 and T 2 indicate adhesive sample numbers for optical semiconductor devices having different thicknesses.
  • the subscript t 1 was 10 ⁇ m
  • t 2 was 20 ⁇ m obtained by overlapping two t 1
  • the respective light transmittances T 1 and T 2 were measured.
  • the light absorption coefficient of the adhesive for optical semiconductor devices was 3.5 ⁇ 10 3 / m.
  • Example 1 In the same manner as in Example 1, only the size of the square opening of the screen plate (area ratio with respect to the optical semiconductor element) was changed, and the optical semiconductor in which the film-like adhesive for optical semiconductor devices was arranged Examples 3 to 8 of the method for producing an optical semiconductor device using the adhesive sheet for the device and using the same will be described.
  • the size (adhesive area) of the square opening of the screen plate in each example, the area ratio with the element (adhesion area to the element mounting portion of the optical semiconductor device), the adhesive strength, and the shear bond strength after curing adhesion Table 1 shows a summary of the manufacturing efficiency and optical absorption coefficient of the optical semiconductor device.
  • the adhesive strength, the shear bond strength after curing and the light absorption coefficient were determined in the same manner as in the above evaluation.
  • Example 3 An adhesive sheet for an optical semiconductor device was obtained in the same manner as in Example 1 except that the square opening of the screen plate used was 0.7 mm ⁇ 0.7 mm (49% area ratio with respect to the optical semiconductor element). Thereafter, 100 blue LED elements of 1 mm ⁇ 1 mm cut out from the wafer and sorted are attached to an adhesive for a film-like optical semiconductor device disposed on a base sheet, and the attached blue LED elements are formed into a film.
  • the optical semiconductor device adhesive was cured and the blue LED element was cured and bonded to the optical semiconductor device to produce an optical semiconductor device having a blue LED element.
  • the shear bond strength after cured bonding was 3.5 MPa.
  • the adhesive force of the film-form adhesive for optical semiconductor devices was 30 kN / m ⁇ 2 >, and the light absorption coefficient was 3.5 * 10 ⁇ 3 > / m.
  • the production efficiency was 1/5 when the time required for the following Comparative Example 1 was taken as the production efficiency 1.
  • Example 4 The adhesive sheet for optical semiconductor devices was obtained in the same manner as in Example 1 except that the square opening of the screen plate used was 1.5 mm ⁇ 1.5 mm (area ratio with optical semiconductor element 225%). Further, an optical semiconductor device having a blue LED element was manufactured in the same manner as in Example 3. The shear bond strength after cured bonding was 4.5 MPa. Moreover, the adhesive force of the film-form adhesive for optical semiconductor devices was 30 kN / m ⁇ 2 >, and the light absorption coefficient was 3.5 * 10 ⁇ 3 > / m. The production efficiency was 1/5.
  • Example 5 An adhesive sheet for optical semiconductor devices was obtained in the same manner as in Example 1 except that the square opening of the screen plate used was 0.6 mm ⁇ 0.6 mm (area ratio with optical semiconductor element 36%). Further, an optical semiconductor device having a blue LED element was manufactured in the same manner as in Example 3. The shear bond strength after cured bonding was 1.5 MPa. Moreover, the adhesive force of the film-form adhesive for optical semiconductor devices was 30 kN / m ⁇ 2 >, and the light absorption coefficient was 3.5 * 10 ⁇ 3 > / m. The production efficiency was 1/5.
  • Example 6 An adhesive sheet for an optical semiconductor device was obtained in the same manner as in Example 1 except that the square opening of the screen plate to be used was 1.6 mm ⁇ 1.6 mm (area ratio with the optical semiconductor element was 256%). Further, an optical semiconductor device having a blue LED element was manufactured in the same manner as in Example 3. At this time, when a blue LED element of 1 mm ⁇ 1 mm was pressure-bonded and lifted while grasping the element with tweezers, the outer peripheral portion was bent when peeling the adhesive for optical semiconductor devices from the PET separator, and 10% could not be peeled cleanly there were. The shear bond strength after curing and bonding was 4.7 MPa. Moreover, the adhesive force of the film-form adhesive for optical semiconductor devices was 30 kN / m ⁇ 2 >, and the light absorption coefficient was 3.5 * 10 ⁇ 3 > / m. The production efficiency was 1/5.
  • Example 7 Example 1 (square opening 1 mm ⁇ 1 mm, area ratio with optical semiconductor element 100%), except that the adhesive for an optical semiconductor device printed with a PET separator in a hot air circulation oven at 120 ° C. was dried for 90 seconds In the same manner as above, an adhesive sheet for optical semiconductor devices was obtained. Further, an optical semiconductor device having a blue LED element was manufactured in the same manner as in Example 3. The shear bond strength after cured bonding was 3.5 MPa. Moreover, the adhesive force of the film-form adhesive for optical semiconductor devices was 35 kN / m ⁇ 2 >, and the light absorption coefficient was 3.5 * 10 ⁇ 3 > / m. The production efficiency was 1/5.
  • Example 8 Example 1 (square opening 1 mm ⁇ 1 mm, area ratio with optical semiconductor element 100%) except that the adhesive for an optical semiconductor device printed with the PET separator in an 80 ° C. hot air circulation oven was dried for 20 minutes.
  • an adhesive sheet for optical semiconductor devices was obtained.
  • an optical semiconductor device having a blue LED element was manufactured in the same manner as in Example 3.
  • the shear bond strength after cured bonding was 5 MPa.
  • the adhesive force of the film-form adhesive agent for optical semiconductor devices was 50 kN / m ⁇ 2 >, and the light absorption coefficient was 3.5 * 10 ⁇ 3 > / m.
  • the production efficiency was 1/5.
  • Example 9 Example 1 (square opening 1 mm ⁇ 1 mm, area ratio with optical semiconductor element 100%), except that the adhesive for an optical semiconductor device printed together with the PET separator in an 80 ° C. hot air circulation oven was dried for 15 minutes In the same manner as above, an adhesive sheet for optical semiconductor devices was obtained. Further, an optical semiconductor device having a blue LED element was manufactured in the same manner as in Example 3. The shear bond strength after curing and bonding was 4.2 MPa. Moreover, the adhesive force of the film-form adhesive for optical semiconductor devices was 300 kN / m ⁇ 2 >, and the light absorption coefficient was 3.5 * 10 ⁇ 3 > / m. The production efficiency was 1/5.
  • Example 2 The 10 ⁇ m-thick semi-cured adhesive for optical semiconductor devices produced in Example 1 was completely cured at 150 ° C. for 2 hours to obtain a cured product.
  • a blue LED element of 1 mm ⁇ 1 mm is attached to a 1 mm ⁇ 1 mm (100% area ratio with respect to the element) blue LED element (crimping) and then lifted while grasping the element with tweezers, for an optical semiconductor device
  • the adhesive did not stick to one surface of the blue LED element at all, and could not be peeled off from the base sheet. For this reason, the production efficiency could not be calculated.
  • the shear bond strength after curing and adhesion was not measured, and the adhesive strength was 1 kN / m 2 . Since it could not be peeled from the base material sheet, the light absorption coefficient could not be measured.
  • the comparative example 1 which manufactured the optical semiconductor device by the conventional method without using the adhesive agent for optical semiconductor devices of this invention requires the stamping of die-bonding agents, and used the adhesive agent for optical semiconductor devices of this invention.
  • the manufacturing time (manufacturing efficiency 1) was five times longer than the manufacturing time of the optical semiconductor device.
  • Example 2 in which the adhesive was completely cured before the optical semiconductor element was attached to obtain a cured product, the optical semiconductor device could not be manufactured.
  • stamping of the die bond agent can be omitted, and 1/5 compared with Comparative Example 1. It became clear that an optical semiconductor device can be manufactured in the manufacturing time (production efficiency 1/5).
  • the optical semiconductor element is fixed to the element mounting portion of the optical semiconductor device efficiently by the optical semiconductor device adhesive, the optical semiconductor device adhesive sheet, and the optical semiconductor device manufacturing method of the present invention. It has become clear that the productivity of manufacturing an optical semiconductor device can be increased.
  • the present invention is not limited to the above embodiment.
  • the above-described embodiment is an exemplification, and the present invention has any configuration that has substantially the same configuration as the technical idea described in the claims of the present invention and exhibits the same function and effect. Are included in the technical scope.

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PCT/JP2011/005650 2010-11-02 2011-10-07 光半導体装置用接着剤、光半導体装置用接着剤シート、光半導体装置用接着剤シートの製造方法、及び光半導体装置の製造方法 Ceased WO2012060053A1 (ja)

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CN2011800528888A CN103201860A (zh) 2010-11-02 2011-10-07 光半导体装置用粘着剂、光半导体装置用粘着剂薄片、光半导体装置用粘着剂薄片的制造方法及光半导体装置的制造方法
KR1020137010908A KR20130124498A (ko) 2010-11-02 2011-10-07 광반도체 장치용 접착제, 광반도체 장치용 접착제 시트, 광반도체 장치용 접착제 시트의 제조 방법, 및 광반도체 장치의 제조 방법

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US20140339582A1 (en) * 2011-06-07 2014-11-20 Nobuo Matsumura Resin sheet laminate, method for manufacturing the same and method for manufacturing led chip with phosphor-containing resin sheet
JP6072663B2 (ja) * 2013-10-15 2017-02-01 信越化学工業株式会社 加熱硬化型導電性シリコーン組成物、該組成物からなる導電性接着剤、該組成物からなる導電性ダイボンド材、該ダイボンド材の硬化物を有する光半導体装置。
KR102653341B1 (ko) 2018-11-16 2024-04-02 삼성전자주식회사 마스크를 포함하는 마이크로 led 전사 장치 및 이를 이용한 마이크로 led 전사 방법
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JP2004026953A (ja) * 2002-06-24 2004-01-29 Three M Innovative Properties Co フィルム接着剤、半導体装置及びその製造方法
JP2008091855A (ja) * 2006-09-06 2008-04-17 Toshiba Lighting & Technology Corp 照明装置
JP2008098215A (ja) * 2006-10-06 2008-04-24 Nippon Steel Chem Co Ltd 接着剤付半導体素子の製造方法、及びその製造方法に用いる接着剤付フィルム
JP2010219562A (ja) * 2006-08-29 2010-09-30 Toshiba Lighting & Technology Corp 照明装置

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KR101025404B1 (ko) * 2002-06-24 2011-03-28 쓰리엠 이노베이티브 프로퍼티즈 컴파니 열 경화성 접착제 조성물, 물품, 반도체 장치 및 방법

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JP2002173652A (ja) * 2000-12-06 2002-06-21 Hitachi Chem Co Ltd 接着フィルム、それを用いた半導体装置及び半導体装置の製造方法
JP2004026953A (ja) * 2002-06-24 2004-01-29 Three M Innovative Properties Co フィルム接着剤、半導体装置及びその製造方法
JP2010219562A (ja) * 2006-08-29 2010-09-30 Toshiba Lighting & Technology Corp 照明装置
JP2008091855A (ja) * 2006-09-06 2008-04-17 Toshiba Lighting & Technology Corp 照明装置
JP2008098215A (ja) * 2006-10-06 2008-04-24 Nippon Steel Chem Co Ltd 接着剤付半導体素子の製造方法、及びその製造方法に用いる接着剤付フィルム

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