CN103201860A - 光半导体装置用粘着剂、光半导体装置用粘着剂薄片、光半导体装置用粘着剂薄片的制造方法及光半导体装置的制造方法 - Google Patents

光半导体装置用粘着剂、光半导体装置用粘着剂薄片、光半导体装置用粘着剂薄片的制造方法及光半导体装置的制造方法 Download PDF

Info

Publication number
CN103201860A
CN103201860A CN2011800528888A CN201180052888A CN103201860A CN 103201860 A CN103201860 A CN 103201860A CN 2011800528888 A CN2011800528888 A CN 2011800528888A CN 201180052888 A CN201180052888 A CN 201180052888A CN 103201860 A CN103201860 A CN 103201860A
Authority
CN
China
Prior art keywords
optical semiconductor
adhesive
semiconductor device
semiconductor devices
sheet
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN2011800528888A
Other languages
English (en)
Chinese (zh)
Inventor
塩野嘉幸
市六信広
岩田充弘
小材利之
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shin Etsu Chemical Co Ltd
Original Assignee
Shin Etsu Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shin Etsu Chemical Co Ltd filed Critical Shin Etsu Chemical Co Ltd
Publication of CN103201860A publication Critical patent/CN103201860A/zh
Pending legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07
    • H01L21/4814—Conductive parts
    • H01L21/4871—Bases, plates or heatsinks
    • H01L21/4875—Connection or disconnection of other leads to or from bases or plates
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
    • C09J183/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/40—Adhesives in the form of films or foils characterised by release liners
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
    • H01L21/52—Mounting semiconductor bodies in containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/0235—Method for mounting laser chips
    • H01S5/02355—Fixing laser chips on mounts
    • H01S5/0236—Fixing laser chips on mounts using an adhesive
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/8506—Containers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2467/00—Presence of polyester
    • C09J2467/006—Presence of polyester in the substrate
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2483/00—Presence of polysiloxane

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Manufacturing & Machinery (AREA)
  • Electromagnetism (AREA)
  • Optics & Photonics (AREA)
  • Adhesive Tapes (AREA)
  • Led Device Packages (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Die Bonding (AREA)
  • Semiconductor Lasers (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Dicing (AREA)
CN2011800528888A 2010-11-02 2011-10-07 光半导体装置用粘着剂、光半导体装置用粘着剂薄片、光半导体装置用粘着剂薄片的制造方法及光半导体装置的制造方法 Pending CN103201860A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2010-246631 2010-11-02
JP2010246631A JP5485112B2 (ja) 2010-11-02 2010-11-02 光半導体装置の製造方法
PCT/JP2011/005650 WO2012060053A1 (ja) 2010-11-02 2011-10-07 光半導体装置用接着剤、光半導体装置用接着剤シート、光半導体装置用接着剤シートの製造方法、及び光半導体装置の製造方法

Publications (1)

Publication Number Publication Date
CN103201860A true CN103201860A (zh) 2013-07-10

Family

ID=46024181

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2011800528888A Pending CN103201860A (zh) 2010-11-02 2011-10-07 光半导体装置用粘着剂、光半导体装置用粘着剂薄片、光半导体装置用粘着剂薄片的制造方法及光半导体装置的制造方法

Country Status (5)

Country Link
JP (1) JP5485112B2 (cg-RX-API-DMAC7.html)
KR (1) KR20130124498A (cg-RX-API-DMAC7.html)
CN (1) CN103201860A (cg-RX-API-DMAC7.html)
TW (1) TW201224106A (cg-RX-API-DMAC7.html)
WO (1) WO2012060053A1 (cg-RX-API-DMAC7.html)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104559825A (zh) * 2013-10-15 2015-04-29 信越化学工业株式会社 加热固化型导电性硅酮组合物、导电性粘着剂、导电性芯片粘合材料、光半导体装置
CN113299577A (zh) * 2020-02-21 2021-08-24 均华精密工业股份有限公司 粘晶机
US11152245B2 (en) 2018-11-16 2021-10-19 Samsung Electronics Co., Ltd. LED transfer device comprising mask and micro LED transferring method using the same

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20140339582A1 (en) * 2011-06-07 2014-11-20 Nobuo Matsumura Resin sheet laminate, method for manufacturing the same and method for manufacturing led chip with phosphor-containing resin sheet

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07131076A (ja) * 1993-11-08 1995-05-19 Victor Co Of Japan Ltd Ｌｅｄアレイ装置
JP2002173652A (ja) * 2000-12-06 2002-06-21 Hitachi Chem Co Ltd 接着フィルム、それを用いた半導体装置及び半導体装置の製造方法
CN1662624A (zh) * 2002-06-24 2005-08-31 3M创新有限公司 可热固化粘合剂组合物,制品,半导体器械和方法
JP2008098215A (ja) * 2006-10-06 2008-04-24 Nippon Steel Chem Co Ltd 接着剤付半導体素子の製造方法、及びその製造方法に用いる接着剤付フィルム

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4368093B2 (ja) * 2002-06-24 2009-11-18 スリーエム イノベイティブ プロパティズ カンパニー フィルム接着剤、半導体装置及びその製造方法
US7989840B2 (en) * 2006-08-29 2011-08-02 Toshiba Lighting & Technology Corporation Illumination apparatus having a plurality of semiconductor light-emitting devices
JP2008091855A (ja) * 2006-09-06 2008-04-17 Toshiba Lighting & Technology Corp 照明装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07131076A (ja) * 1993-11-08 1995-05-19 Victor Co Of Japan Ltd Ｌｅｄアレイ装置
JP2002173652A (ja) * 2000-12-06 2002-06-21 Hitachi Chem Co Ltd 接着フィルム、それを用いた半導体装置及び半導体装置の製造方法
CN1662624A (zh) * 2002-06-24 2005-08-31 3M创新有限公司 可热固化粘合剂组合物,制品,半导体器械和方法
JP2008098215A (ja) * 2006-10-06 2008-04-24 Nippon Steel Chem Co Ltd 接着剤付半導体素子の製造方法、及びその製造方法に用いる接着剤付フィルム

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104559825A (zh) * 2013-10-15 2015-04-29 信越化学工业株式会社 加热固化型导电性硅酮组合物、导电性粘着剂、导电性芯片粘合材料、光半导体装置
CN104559825B (zh) * 2013-10-15 2017-12-15 信越化学工业株式会社 加热固化型导电性硅酮组合物、导电性粘着剂、导电性芯片粘合材料、光半导体装置
US11152245B2 (en) 2018-11-16 2021-10-19 Samsung Electronics Co., Ltd. LED transfer device comprising mask and micro LED transferring method using the same
CN113299577A (zh) * 2020-02-21 2021-08-24 均华精密工业股份有限公司 粘晶机

Also Published As

Publication number Publication date
KR20130124498A (ko) 2013-11-14
JP5485112B2 (ja) 2014-05-07
WO2012060053A1 (ja) 2012-05-10
JP2012099664A (ja) 2012-05-24
TW201224106A (en) 2012-06-16

Similar Documents

Publication Publication Date Title
CN103154146B (zh) 含荧光体片材、使用其的led发光装置及其制造方法
JP5862066B2 (ja) 蛍光体含有シート、それを用いたｌｅｄ発光装置およびその製造方法
CN102061136B (zh) 树脂密封用粘合带及树脂密封型半导体装置的制造方法
TWI544662B (zh) 半導體裝置及其製造方法
JP6641997B2 (ja) 積層体およびそれを用いた発光装置の製造方法
TWI693730B (zh) 發光裝置的製造方法
WO2014002784A1 (ja) 樹脂シート積層体およびそれを用いた半導体発光素子の製造方法
JP2014022704A (ja) 蛍光体含有樹脂シートと発光装置及びその製造方法
JP5860289B2 (ja) Ｌｅｄ装置の製造方法
CN101300687A (zh) 在led上层压包含磷光体的密封剂膜
CN103311414A (zh) 荧光封装片、发光二极管装置及其制造方法
CN103811645A (zh) 覆盖有荧光体层的光半导体元件及其制造方法、光半导体装置及其制造方法
CN103531697A (zh) 覆有密封层的半导体元件、其制造方法及半导体装置
CN103474563A (zh) 用于光半导体的光反射部件和用于安装光半导体的基板以及使用光反射部件的光半导体器件
WO2014203793A1 (ja) 発光装置、その製造のための封止フィルム積層体、および発光装置の製造方法
CN101599442A (zh) 发光二极管的制造方法
CN103201860A (zh) 光半导体装置用粘着剂、光半导体装置用粘着剂薄片、光半导体装置用粘着剂薄片的制造方法及光半导体装置的制造方法
CN102110747A (zh) 倒装芯片式发光二极管模块的制造方法
CN105637660A (zh) 层叠体及使用所述层叠体的发光装置的制造方法
JP3994498B2 (ja) 半導体装置の製造方法
JP5896214B2 (ja) 半導体装置の製造方法
JP2013103959A (ja) 半導体用接着シート
KR20120081809A (ko) 형광체 도포 방법 및 형광체 도포 장치
JP6512258B2 (ja) 発光装置
US11749787B2 (en) Forming a multicolor phosphor-converted LED array

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C02 Deemed withdrawal of patent application after publication (patent law 2001)
WD01 Invention patent application deemed withdrawn after publication

Application publication date: 20130710