JP5485112B2 - 光半導体装置の製造方法 - Google Patents

光半導体装置の製造方法 Download PDF

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Publication number
JP5485112B2
JP5485112B2 JP2010246631A JP2010246631A JP5485112B2 JP 5485112 B2 JP5485112 B2 JP 5485112B2 JP 2010246631 A JP2010246631 A JP 2010246631A JP 2010246631 A JP2010246631 A JP 2010246631A JP 5485112 B2 JP5485112 B2 JP 5485112B2
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JP
Japan
Prior art keywords
optical semiconductor
adhesive
semiconductor device
sheet
mounting portion
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Active
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JP2010246631A
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English (en)
Japanese (ja)
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JP2012099664A5 (cg-RX-API-DMAC7.html
JP2012099664A (ja
Inventor
嘉幸 塩野
信広 市六
充弘 岩田
利之 小材
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Shin Etsu Chemical Co Ltd
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Shin Etsu Chemical Co Ltd
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Filing date
Publication date
Application filed by Shin Etsu Chemical Co Ltd filed Critical Shin Etsu Chemical Co Ltd
Priority to JP2010246631A priority Critical patent/JP5485112B2/ja
Priority to CN2011800528888A priority patent/CN103201860A/zh
Priority to KR1020137010908A priority patent/KR20130124498A/ko
Priority to PCT/JP2011/005650 priority patent/WO2012060053A1/ja
Priority to TW100138703A priority patent/TW201224106A/zh
Publication of JP2012099664A publication Critical patent/JP2012099664A/ja
Publication of JP2012099664A5 publication Critical patent/JP2012099664A5/ja
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Publication of JP5485112B2 publication Critical patent/JP5485112B2/ja
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07
    • H01L21/4814—Conductive parts
    • H01L21/4871—Bases, plates or heatsinks
    • H01L21/4875—Connection or disconnection of other leads to or from bases or plates
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
    • C09J183/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/40—Adhesives in the form of films or foils characterised by release liners
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
    • H01L21/52—Mounting semiconductor bodies in containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/0235—Method for mounting laser chips
    • H01S5/02355—Fixing laser chips on mounts
    • H01S5/0236—Fixing laser chips on mounts using an adhesive
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/8506—Containers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2467/00—Presence of polyester
    • C09J2467/006—Presence of polyester in the substrate
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2483/00—Presence of polysiloxane

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Manufacturing & Machinery (AREA)
  • Electromagnetism (AREA)
  • Optics & Photonics (AREA)
  • Adhesive Tapes (AREA)
  • Led Device Packages (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Die Bonding (AREA)
  • Semiconductor Lasers (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Dicing (AREA)
JP2010246631A 2010-11-02 2010-11-02 光半導体装置の製造方法 Active JP5485112B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2010246631A JP5485112B2 (ja) 2010-11-02 2010-11-02 光半導体装置の製造方法
CN2011800528888A CN103201860A (zh) 2010-11-02 2011-10-07 光半导体装置用粘着剂、光半导体装置用粘着剂薄片、光半导体装置用粘着剂薄片的制造方法及光半导体装置的制造方法
KR1020137010908A KR20130124498A (ko) 2010-11-02 2011-10-07 광반도체 장치용 접착제, 광반도체 장치용 접착제 시트, 광반도체 장치용 접착제 시트의 제조 방법, 및 광반도체 장치의 제조 방법
PCT/JP2011/005650 WO2012060053A1 (ja) 2010-11-02 2011-10-07 光半導体装置用接着剤、光半導体装置用接着剤シート、光半導体装置用接着剤シートの製造方法、及び光半導体装置の製造方法
TW100138703A TW201224106A (en) 2010-11-02 2011-10-25 Adhesive for optical semiconductor devices, adhesive sheet for optical semiconductor devices, method for producing adhesive sheet for optical semiconductor devices, and method for producing optical semiconductor devices

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2010246631A JP5485112B2 (ja) 2010-11-02 2010-11-02 光半導体装置の製造方法

Publications (3)

Publication Number Publication Date
JP2012099664A JP2012099664A (ja) 2012-05-24
JP2012099664A5 JP2012099664A5 (cg-RX-API-DMAC7.html) 2013-05-16
JP5485112B2 true JP5485112B2 (ja) 2014-05-07

Family

ID=46024181

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2010246631A Active JP5485112B2 (ja) 2010-11-02 2010-11-02 光半導体装置の製造方法

Country Status (5)

Country Link
JP (1) JP5485112B2 (cg-RX-API-DMAC7.html)
KR (1) KR20130124498A (cg-RX-API-DMAC7.html)
CN (1) CN103201860A (cg-RX-API-DMAC7.html)
TW (1) TW201224106A (cg-RX-API-DMAC7.html)
WO (1) WO2012060053A1 (cg-RX-API-DMAC7.html)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20140339582A1 (en) * 2011-06-07 2014-11-20 Nobuo Matsumura Resin sheet laminate, method for manufacturing the same and method for manufacturing led chip with phosphor-containing resin sheet
JP6072663B2 (ja) * 2013-10-15 2017-02-01 信越化学工業株式会社 加熱硬化型導電性シリコーン組成物、該組成物からなる導電性接着剤、該組成物からなる導電性ダイボンド材、該ダイボンド材の硬化物を有する光半導体装置。
KR102653341B1 (ko) 2018-11-16 2024-04-02 삼성전자주식회사 마스크를 포함하는 마이크로 led 전사 장치 및 이를 이용한 마이크로 led 전사 방법
CN113299577A (zh) * 2020-02-21 2021-08-24 均华精密工业股份有限公司 粘晶机

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07131076A (ja) * 1993-11-08 1995-05-19 Victor Co Of Japan Ltd Ｌｅｄアレイ装置
JP2002173652A (ja) * 2000-12-06 2002-06-21 Hitachi Chem Co Ltd 接着フィルム、それを用いた半導体装置及び半導体装置の製造方法
JP4368093B2 (ja) * 2002-06-24 2009-11-18 スリーエム イノベイティブ プロパティズ カンパニー フィルム接着剤、半導体装置及びその製造方法
KR101025404B1 (ko) * 2002-06-24 2011-03-28 쓰리엠 이노베이티브 프로퍼티즈 컴파니 열 경화성 접착제 조성물, 물품, 반도체 장치 및 방법
US7989840B2 (en) * 2006-08-29 2011-08-02 Toshiba Lighting & Technology Corporation Illumination apparatus having a plurality of semiconductor light-emitting devices
JP2008091855A (ja) * 2006-09-06 2008-04-17 Toshiba Lighting & Technology Corp 照明装置
JP4925179B2 (ja) * 2006-10-06 2012-04-25 新日鐵化学株式会社 接着剤付半導体素子の製造方法、及びその製造方法に用いる接着剤付フィルム

Also Published As

Publication number Publication date
KR20130124498A (ko) 2013-11-14
CN103201860A (zh) 2013-07-10
WO2012060053A1 (ja) 2012-05-10
JP2012099664A (ja) 2012-05-24
TW201224106A (en) 2012-06-16

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