TW201224106A - Adhesive for optical semiconductor devices, adhesive sheet for optical semiconductor devices, method for producing adhesive sheet for optical semiconductor devices, and method for producing optical semiconductor devices - Google Patents
Adhesive for optical semiconductor devices, adhesive sheet for optical semiconductor devices, method for producing adhesive sheet for optical semiconductor devices, and method for producing optical semiconductor devices Download PDFInfo
- Publication number
- TW201224106A TW201224106A TW100138703A TW100138703A TW201224106A TW 201224106 A TW201224106 A TW 201224106A TW 100138703 A TW100138703 A TW 100138703A TW 100138703 A TW100138703 A TW 100138703A TW 201224106 A TW201224106 A TW 201224106A
- Authority
- TW
- Taiwan
- Prior art keywords
- optical semiconductor
- semiconductor device
- adhesive
- sheet
- film
- Prior art date
Links
- 239000004065 semiconductor Substances 0.000 title claims abstract description 483
- 230000003287 optical effect Effects 0.000 title claims abstract description 458
- 239000000853 adhesive Substances 0.000 title claims abstract description 262
- 230000001070 adhesive effect Effects 0.000 title claims abstract description 259
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 77
- 239000000758 substrate Substances 0.000 claims abstract description 42
- 239000000463 material Substances 0.000 claims description 16
- 238000000034 method Methods 0.000 claims description 11
- 239000003795 chemical substances by application Substances 0.000 claims description 9
- 239000000203 mixture Substances 0.000 claims description 8
- 238000007650 screen-printing Methods 0.000 claims description 6
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 5
- 229910052760 oxygen Inorganic materials 0.000 claims description 5
- 239000001301 oxygen Substances 0.000 claims description 5
- 239000002313 adhesive film Substances 0.000 claims description 2
- 239000010408 film Substances 0.000 claims 2
- 239000012788 optical film Substances 0.000 claims 2
- 239000004793 Polystyrene Substances 0.000 claims 1
- 229920000642 polymer Polymers 0.000 claims 1
- 229920002223 polystyrene Polymers 0.000 claims 1
- 238000007639 printing Methods 0.000 claims 1
- 238000010626 work up procedure Methods 0.000 abstract description 3
- 230000031700 light absorption Effects 0.000 description 18
- 238000002834 transmittance Methods 0.000 description 13
- 239000007767 bonding agent Substances 0.000 description 10
- 230000000052 comparative effect Effects 0.000 description 10
- 239000004020 conductor Substances 0.000 description 10
- 239000007788 liquid Substances 0.000 description 9
- 238000011156 evaluation Methods 0.000 description 8
- 229920000139 polyethylene terephthalate Polymers 0.000 description 7
- 239000005020 polyethylene terephthalate Substances 0.000 description 7
- 125000006850 spacer group Chemical group 0.000 description 5
- 238000005259 measurement Methods 0.000 description 4
- 239000011342 resin composition Substances 0.000 description 4
- 239000002390 adhesive tape Substances 0.000 description 3
- 238000002788 crimping Methods 0.000 description 3
- 238000000605 extraction Methods 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 238000007789 sealing Methods 0.000 description 3
- 239000011230 binding agent Substances 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- -1 polyethylene terephthalate Polymers 0.000 description 2
- 229920002098 polyfluorene Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- LLLVZDVNHNWSDS-UHFFFAOYSA-N 4-methylidene-3,5-dioxabicyclo[5.2.2]undeca-1(9),7,10-triene-2,6-dione Chemical compound C1(C2=CC=C(C(=O)OC(=C)O1)C=C2)=O LLLVZDVNHNWSDS-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 1
- 239000005977 Ethylene Substances 0.000 description 1
- 241001024304 Mino Species 0.000 description 1
- 229920002675 Polyoxyl Polymers 0.000 description 1
- 206010036790 Productive cough Diseases 0.000 description 1
- KJTLSVCANCCWHF-UHFFFAOYSA-N Ruthenium Chemical compound [Ru] KJTLSVCANCCWHF-UHFFFAOYSA-N 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000000284 extract Substances 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 238000004382 potting Methods 0.000 description 1
- 239000002243 precursor Substances 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- 229910052707 ruthenium Inorganic materials 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 210000003802 sputum Anatomy 0.000 description 1
- 208000024794 sputum Diseases 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07
- H01L21/4814—Conductive parts
- H01L21/4871—Bases, plates or heatsinks
- H01L21/4875—Connection or disconnection of other leads to or from bases or plates
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
- C09J183/04—Polysiloxanes
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/22—Plastics; Metallised plastics
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
- C09J7/38—Pressure-sensitive adhesives [PSA]
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/40—Adhesives in the form of films or foils characterised by release liners
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
- H01L21/52—Mounting semiconductor bodies in containers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/0235—Method for mounting laser chips
- H01S5/02355—Fixing laser chips on mounts
- H01S5/0236—Fixing laser chips on mounts using an adhesive
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/01—Manufacture or treatment
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/8506—Containers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2467/00—Presence of polyester
- C09J2467/006—Presence of polyester in the substrate
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2483/00—Presence of polysiloxane
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Manufacturing & Machinery (AREA)
- Electromagnetism (AREA)
- Optics & Photonics (AREA)
- Adhesive Tapes (AREA)
- Led Device Packages (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Die Bonding (AREA)
- Semiconductor Lasers (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Dicing (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010246631A JP5485112B2 (ja) | 2010-11-02 | 2010-11-02 | 光半導体装置の製造方法 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW201224106A true TW201224106A (en) | 2012-06-16 |
Family
ID=46024181
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW100138703A TW201224106A (en) | 2010-11-02 | 2011-10-25 | Adhesive for optical semiconductor devices, adhesive sheet for optical semiconductor devices, method for producing adhesive sheet for optical semiconductor devices, and method for producing optical semiconductor devices |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JP5485112B2 (cg-RX-API-DMAC7.html) |
| KR (1) | KR20130124498A (cg-RX-API-DMAC7.html) |
| CN (1) | CN103201860A (cg-RX-API-DMAC7.html) |
| TW (1) | TW201224106A (cg-RX-API-DMAC7.html) |
| WO (1) | WO2012060053A1 (cg-RX-API-DMAC7.html) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20140339582A1 (en) * | 2011-06-07 | 2014-11-20 | Nobuo Matsumura | Resin sheet laminate, method for manufacturing the same and method for manufacturing led chip with phosphor-containing resin sheet |
| JP6072663B2 (ja) * | 2013-10-15 | 2017-02-01 | 信越化学工業株式会社 | 加熱硬化型導電性シリコーン組成物、該組成物からなる導電性接着剤、該組成物からなる導電性ダイボンド材、該ダイボンド材の硬化物を有する光半導体装置。 |
| KR102653341B1 (ko) | 2018-11-16 | 2024-04-02 | 삼성전자주식회사 | 마스크를 포함하는 마이크로 led 전사 장치 및 이를 이용한 마이크로 led 전사 방법 |
| CN113299577A (zh) * | 2020-02-21 | 2021-08-24 | 均华精密工业股份有限公司 | 粘晶机 |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07131076A (ja) * | 1993-11-08 | 1995-05-19 | Victor Co Of Japan Ltd | Ｌｅｄアレイ装置 |
| JP2002173652A (ja) * | 2000-12-06 | 2002-06-21 | Hitachi Chem Co Ltd | 接着フィルム、それを用いた半導体装置及び半導体装置の製造方法 |
| JP4368093B2 (ja) * | 2002-06-24 | 2009-11-18 | スリーエム イノベイティブ プロパティズ カンパニー | フィルム接着剤、半導体装置及びその製造方法 |
| KR101025404B1 (ko) * | 2002-06-24 | 2011-03-28 | 쓰리엠 이노베이티브 프로퍼티즈 컴파니 | 열 경화성 접착제 조성물, 물품, 반도체 장치 및 방법 |
| US7989840B2 (en) * | 2006-08-29 | 2011-08-02 | Toshiba Lighting & Technology Corporation | Illumination apparatus having a plurality of semiconductor light-emitting devices |
| JP2008091855A (ja) * | 2006-09-06 | 2008-04-17 | Toshiba Lighting & Technology Corp | 照明装置 |
| JP4925179B2 (ja) * | 2006-10-06 | 2012-04-25 | 新日鐵化学株式会社 | 接着剤付半導体素子の製造方法、及びその製造方法に用いる接着剤付フィルム |
-
2010
- 2010-11-02 JP JP2010246631A patent/JP5485112B2/ja active Active
-
2011
- 2011-10-07 CN CN2011800528888A patent/CN103201860A/zh active Pending
- 2011-10-07 WO PCT/JP2011/005650 patent/WO2012060053A1/ja not_active Ceased
- 2011-10-07 KR KR1020137010908A patent/KR20130124498A/ko not_active Withdrawn
- 2011-10-25 TW TW100138703A patent/TW201224106A/zh unknown
Also Published As
| Publication number | Publication date |
|---|---|
| KR20130124498A (ko) | 2013-11-14 |
| JP5485112B2 (ja) | 2014-05-07 |
| CN103201860A (zh) | 2013-07-10 |
| WO2012060053A1 (ja) | 2012-05-10 |
| JP2012099664A (ja) | 2012-05-24 |
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