JP2012099664A5 - - Google Patents
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- Publication number
- JP2012099664A5 JP2012099664A5 JP2010246631A JP2010246631A JP2012099664A5 JP 2012099664 A5 JP2012099664 A5 JP 2012099664A5 JP 2010246631 A JP2010246631 A JP 2010246631A JP 2010246631 A JP2010246631 A JP 2010246631A JP 2012099664 A5 JP2012099664 A5 JP 2012099664A5
- Authority
- JP
- Japan
- Prior art keywords
- optical semiconductor
- semiconductor device
- adhesive
- manufacturing
- optical
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 230000003287 optical effect Effects 0.000 description 22
- 239000004065 semiconductor Substances 0.000 description 21
- 239000000853 adhesive Substances 0.000 description 11
- 230000001070 adhesive effect Effects 0.000 description 9
- 238000004519 manufacturing process Methods 0.000 description 9
- 230000000052 comparative effect Effects 0.000 description 3
- 239000007767 bonding agent Substances 0.000 description 2
- VZSRBBMJRBPUNF-UHFFFAOYSA-N 2-(2,3-dihydro-1H-inden-2-ylamino)-N-[3-oxo-3-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)propyl]pyrimidine-5-carboxamide Chemical compound C1C(CC2=CC=CC=C12)NC1=NC=C(C=N1)C(=O)NCCC(N1CC2=C(CC1)NN=N2)=O VZSRBBMJRBPUNF-UHFFFAOYSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 230000031700 light absorption Effects 0.000 description 1
Priority Applications (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010246631A JP5485112B2 (ja) | 2010-11-02 | 2010-11-02 | 光半導体装置の製造方法 |
| CN2011800528888A CN103201860A (zh) | 2010-11-02 | 2011-10-07 | 光半导体装置用粘着剂、光半导体装置用粘着剂薄片、光半导体装置用粘着剂薄片的制造方法及光半导体装置的制造方法 |
| KR1020137010908A KR20130124498A (ko) | 2010-11-02 | 2011-10-07 | 광반도체 장치용 접착제, 광반도체 장치용 접착제 시트, 광반도체 장치용 접착제 시트의 제조 방법, 및 광반도체 장치의 제조 방법 |
| PCT/JP2011/005650 WO2012060053A1 (ja) | 2010-11-02 | 2011-10-07 | 光半導体装置用接着剤、光半導体装置用接着剤シート、光半導体装置用接着剤シートの製造方法、及び光半導体装置の製造方法 |
| TW100138703A TW201224106A (en) | 2010-11-02 | 2011-10-25 | Adhesive for optical semiconductor devices, adhesive sheet for optical semiconductor devices, method for producing adhesive sheet for optical semiconductor devices, and method for producing optical semiconductor devices |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010246631A JP5485112B2 (ja) | 2010-11-02 | 2010-11-02 | 光半導体装置の製造方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2012099664A JP2012099664A (ja) | 2012-05-24 |
| JP2012099664A5 true JP2012099664A5 (cg-RX-API-DMAC7.html) | 2013-05-16 |
| JP5485112B2 JP5485112B2 (ja) | 2014-05-07 |
Family
ID=46024181
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2010246631A Active JP5485112B2 (ja) | 2010-11-02 | 2010-11-02 | 光半導体装置の製造方法 |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JP5485112B2 (cg-RX-API-DMAC7.html) |
| KR (1) | KR20130124498A (cg-RX-API-DMAC7.html) |
| CN (1) | CN103201860A (cg-RX-API-DMAC7.html) |
| TW (1) | TW201224106A (cg-RX-API-DMAC7.html) |
| WO (1) | WO2012060053A1 (cg-RX-API-DMAC7.html) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20140339582A1 (en) * | 2011-06-07 | 2014-11-20 | Nobuo Matsumura | Resin sheet laminate, method for manufacturing the same and method for manufacturing led chip with phosphor-containing resin sheet |
| JP6072663B2 (ja) * | 2013-10-15 | 2017-02-01 | 信越化学工業株式会社 | 加熱硬化型導電性シリコーン組成物、該組成物からなる導電性接着剤、該組成物からなる導電性ダイボンド材、該ダイボンド材の硬化物を有する光半導体装置。 |
| KR102653341B1 (ko) | 2018-11-16 | 2024-04-02 | 삼성전자주식회사 | 마스크를 포함하는 마이크로 led 전사 장치 및 이를 이용한 마이크로 led 전사 방법 |
| CN113299577A (zh) * | 2020-02-21 | 2021-08-24 | 均华精密工业股份有限公司 | 粘晶机 |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07131076A (ja) * | 1993-11-08 | 1995-05-19 | Victor Co Of Japan Ltd | Ｌｅｄアレイ装置 |
| JP2002173652A (ja) * | 2000-12-06 | 2002-06-21 | Hitachi Chem Co Ltd | 接着フィルム、それを用いた半導体装置及び半導体装置の製造方法 |
| JP4368093B2 (ja) * | 2002-06-24 | 2009-11-18 | スリーエム イノベイティブ プロパティズ カンパニー | フィルム接着剤、半導体装置及びその製造方法 |
| KR101025404B1 (ko) * | 2002-06-24 | 2011-03-28 | 쓰리엠 이노베이티브 프로퍼티즈 컴파니 | 열 경화성 접착제 조성물, 물품, 반도체 장치 및 방법 |
| US7989840B2 (en) * | 2006-08-29 | 2011-08-02 | Toshiba Lighting & Technology Corporation | Illumination apparatus having a plurality of semiconductor light-emitting devices |
| JP2008091855A (ja) * | 2006-09-06 | 2008-04-17 | Toshiba Lighting & Technology Corp | 照明装置 |
| JP4925179B2 (ja) * | 2006-10-06 | 2012-04-25 | 新日鐵化学株式会社 | 接着剤付半導体素子の製造方法、及びその製造方法に用いる接着剤付フィルム |
-
2010
- 2010-11-02 JP JP2010246631A patent/JP5485112B2/ja active Active
-
2011
- 2011-10-07 CN CN2011800528888A patent/CN103201860A/zh active Pending
- 2011-10-07 WO PCT/JP2011/005650 patent/WO2012060053A1/ja not_active Ceased
- 2011-10-07 KR KR1020137010908A patent/KR20130124498A/ko not_active Withdrawn
- 2011-10-25 TW TW100138703A patent/TW201224106A/zh unknown
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