JP2012099664A5

JP2012099664A5 -

Info

Publication number: JP2012099664A5
Application number: JP2010246631A
Authority: JP
Filing date: 2010-11-02
Publication date: 2013-05-16
Anticipated expiration: 2030-11-02

Description

以下、前記実施例１と同様にして、スクリーン版の四角開口部の大きさ（光半導体素子との面積割合）だけを変化させて、フィルム状の光半導体装置用接着剤が配置された光半導体装置用接着剤シートを得、それを用いた光半導体装置の製造方法の実施例３〜９について説明する。なお、各実施例中のスクリーン版の四角開口部の大きさ（接着剤面積）、素子との面積割合（光半導体装置の素子取付部に対する接着面積）、粘着力、硬化接着後のせん断接着強度、光半導体装置の製造効率、光吸収係数についてまとめた結果を表１に示す。なお、粘着力、硬化接着後のせん断接着強度、光吸収係数は上記の評価と同様にして求めた。 Hereinafter, in the same manner as in Example 1, only the size of the square opening of the screen plate (area ratio with respect to the optical semiconductor element) was changed, and the optical semiconductor in which the film-like adhesive for optical semiconductor devices was arranged adhesive to obtain a sheet for apparatus will be described in example 3-9 of the method of manufacturing an optical semiconductor device using the same. In addition, the size (adhesive area) of the square opening of the screen plate in each example, the area ratio with the element (adhesion area to the element mounting portion of the optical semiconductor device), the adhesive strength, and the shear bond strength after curing adhesion Table 1 shows a summary of the manufacturing efficiency and optical absorption coefficient of the optical semiconductor device. The adhesive strength, the shear bond strength after curing and the light absorption coefficient were determined in the same manner as in the above evaluation.

以上、本発明の光半導体装置用接着剤を用いず、従来法により光半導体装置を製造した比較例１は、ダイボンド剤のスタンピングが必要であり、本発明の光半導体装置用接着剤を使用した光半導体装置の製造時間よりも５倍の製造時間（製造効率１）がかかった。また、光半導体素子の貼り付け前に接着剤を完全硬化して硬化物とした比較例２では、光半導体装置を製造することができなかった。一方で、本発明の光半導体装置用接着剤を用いて光半導体装置を製造した実施例３〜９によれば、ダイボンド剤のスタンピングを省略することができ、比較例１に比べて１／５の製造時間（製造効率１／５）で光半導体装置を製造できることが明らかとなった。これにより、本発明の光半導体装置用接着剤、光半導体装置用接着剤シート及び光半導体装置の製造方法により、光半導体素子を光半導体装置の素子取付部に固定するまでの作業を効率よく行うことができ、光半導体装置の製造の生産性を高めることができることが明らかとなった。 As mentioned above, the comparative example 1 which manufactured the optical semiconductor device by the conventional method without using the adhesive agent for optical semiconductor devices of this invention requires the stamping of die-bonding agents, and used the adhesive agent for optical semiconductor devices of this invention. The manufacturing time (manufacturing efficiency 1) was five times longer than the manufacturing time of the optical semiconductor device. Further, in Comparative Example 2 in which the adhesive was completely cured before the optical semiconductor element was attached to obtain a cured product, the optical semiconductor device could not be manufactured. On the other hand, according to Example 3-9 was prepared an optical semiconductor device using the optical semiconductor device adhesive of the present invention, it is possible to omit the stamping die bonding agent, compared with Comparative Example 1 1/5 It became clear that an optical semiconductor device can be manufactured in the manufacturing time (production efficiency 1/5). Thus, the optical semiconductor element is fixed to the element mounting portion of the optical semiconductor device efficiently by the optical semiconductor device adhesive, the optical semiconductor device adhesive sheet, and the optical semiconductor device manufacturing method of the present invention. It has become clear that the productivity of manufacturing an optical semiconductor device can be increased.