WO2012005271A1 - 透明導電性フィルムおよび製造方法 - Google Patents
透明導電性フィルムおよび製造方法 Download PDFInfo
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- WO2012005271A1 WO2012005271A1 PCT/JP2011/065406 JP2011065406W WO2012005271A1 WO 2012005271 A1 WO2012005271 A1 WO 2012005271A1 JP 2011065406 W JP2011065406 W JP 2011065406W WO 2012005271 A1 WO2012005271 A1 WO 2012005271A1
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- hard coat
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/02—Physical, chemical or physicochemical properties
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B9/00—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
- B32B9/002—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising natural stone or artificial stone
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/18—Manufacture of films or sheets
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
- C08J7/04—Coating
- C08J7/042—Coating with two or more layers, where at least one layer of a composition contains a polymer binder
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
- C08J7/04—Coating
- C08J7/043—Improving the adhesiveness of the coatings per se, e.g. forming primers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
- C08J7/04—Coating
- C08J7/044—Forming conductive coatings; Forming coatings having anti-static properties
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
- C08J7/04—Coating
- C08J7/046—Forming abrasion-resistant coatings; Forming surface-hardening coatings
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
- G06F3/0443—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means using a single layer of sensing electrodes
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
- G06F3/0445—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means using two or more layers of sensing electrodes, e.g. using two layers of electrodes separated by a dielectric layer
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
- G06F3/0446—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means using a grid-like structure of electrodes in at least two directions, e.g. using row and column electrodes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
- H01B5/14—Non-insulated conductors or conductive bodies characterised by their form comprising conductive layers or films on insulating-supports
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
- H05K3/0064—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a polymeric substrate
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/30—Properties of the layers or laminate having particular thermal properties
- B32B2307/302—Conductive
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2367/00—Characterised by the use of polyesters obtained by reactions forming a carboxylic ester link in the main chain; Derivatives of such polymers
- C08J2367/02—Polyesters derived from dicarboxylic acids and dihydroxy compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2433/00—Characterised by the use of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Derivatives of such polymers
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/10—Transparent films; Clear coatings; Transparent materials
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K2323/00—Functional layers of liquid crystal optical display excluding electroactive liquid crystal layer characterised by chemical composition
- C09K2323/04—Charge transferring layer characterised by chemical composition, i.e. conductive
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
- G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
- G06F2203/04103—Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/10—Methods of surface bonding and/or assembly therefor
Definitions
- the present invention relates to a transparent conductive film, and in particular, a transparent conductive film in which a hard coat layer, a transparent dielectric layer, and a transparent conductive layer having a controlled refractive index are laminated in this order on a substrate formed of a transparent plastic film.
- the present invention relates to a film and a manufacturing method thereof.
- a transparent conductive film in which a transparent and conductive thin film is laminated on a transparent plastic film substrate is used for applications that use the conductivity, such as flat panels such as liquid crystal displays, smartphones, car navigation systems, and digital cameras. Widely used in touch panels.
- Touch panels include optical type, ultrasonic type, electromagnetic induction type, capacitance type, resistive film type, etc., depending on the position detection method.
- a resistive film type touch panel has a structure in which a transparent conductive film and a glass layered with a transparent conductor layer (indium tin oxide (hereinafter abbreviated as “ITO”)) are opposed to each other via a dot spacer. Yes.
- ITO indium tin oxide
- the transparent conductive layer (ITO) on the counter glass substrate and the transparent conductive layer (ITO) of the transparent conductive film are connected at the point where there is no dot spacer, and the position is determined. Yes. For this reason, there is a problem in the lifetime due to the strength reduction of dot spacers and ITO.
- a capacitive touch panel has a transparent conductor layer patterned on a substrate, detects the capacitance of the finger by touching it with a finger, etc. A change occurs in the resistance value with respect to the transparent conductor layer thus formed, and two-dimensional position information is accurately detected. Because of its structure, it is characterized by no moving parts, is highly reliable, has a long life, and is excellent in optical characteristics such as transparency.
- the touch panel may perform predetermined patterning on the transparent conductive layer of the transparent conductive film in order to detect the input position.
- the optical characteristics of the pattern portion (portion where the transparent conductor layer or the like is present) and the non-pattern portion (pattern opening portion where the transparent conductor layer or the like is removed) are clarified by patterning, which may deteriorate the appearance of the display element. is there.
- a transparent conductor layer is formed on the front surface of the display unit, so that a good appearance is required even when the transparent conductor layer is patterned (patterned).
- a transparent conductive film As a conventional transparent conductive film, a conductive layer forming film, a conductive layer, and an undercoat layer made of a metal oxide formed between the conductive layer forming film and the conductive layer (excluding those having conductivity) And a single metal element contained in the metal oxide formed between the undercoat layer and the conductive layer forming film or two or more kinds of metal elements including at least one kind contained in the metal oxide
- a transparent conductive film provided with a metal layer made of an alloy (Patent Document 1, paragraph 0007).
- a silicon layer having a thickness of 1 nm, a zinc oxide-tin oxide layer having a thickness of 60 nm, a silicon oxide layer having a thickness of 45 nm, and an ITO layer having a thickness of 30 nm were sequentially laminated on one surface of the PET film.
- a configuration is disclosed (for example, see Patent Document 1).
- Another transparent conductive film is a transparent conductive film in which at least a high refractive index layer, a low refractive index layer, and a transparent conductive layer are provided on one surface of a transparent plastic film, There is a transparent conductive film in which a hard coat layer is provided on the other surface, and a hard coat layer is provided between the transparent plastic film and the high refractive index layer (see, for example, Patent Document 2).
- this invention makes it a subject to provide the transparent conductive film of a multilayer structure with which the pattern shape of the transparent conductor layer as a conductive layer is not conspicuous, and favorable visibility, and its manufacturing method.
- the present inventors have intensively studied to solve the above problems. As a result, by optimizing the thickness (film thickness) and refractive index of each layer in the hard coat layer, transparent dielectric layer, and transparent conductor layer of the transparent conductive film, the optical characteristics of the pattern part and the non-pattern part As a result, the present invention was completed.
- the transparent conductive film according to the first aspect of the present invention is laminated on one surface of a base material 11, for example, as shown in FIG. First hard coat layer 12; first transparent dielectric layer 13 laminated on the surface of first hard coat layer 12 opposite to the substrate 11 side; and first transparent dielectric layer 13 And a first transparent conductor layer 14 laminated on a surface opposite to the first hard coat layer 12 side.
- the substrate 11 has a film thickness of 2 to 250 ⁇ m.
- the first hard coat layer 12 is formed of a curable resin containing an inorganic oxide, and has a refractive index of 1.40 to 1.90 and a film thickness of 0.5 to 6 ⁇ m.
- the first transparent dielectric layer 13 is made of an inorganic material and has a refractive index of 1.30 to 1.50 and a film thickness of 10 to 50 nm.
- the first transparent dielectric layer 13 is laminated as necessary.
- the first transparent conductor layer 14 is formed of at least one selected from the group consisting of inorganic oxide, metal, and carbon, is patterned, and has a thickness of 10 nm to 2 ⁇ m.
- patterning means forming a predetermined shape on the transparent conductor layer by an etching method, a laser ablation method, screen printing, or the like.
- a transparent conductive film is provided with the part (pattern part: P) which has a transparent conductor layer by patterning, and the part (non-pattern part: NP) which does not have a transparent conductor layer.
- the hard coat layer is formed of a curable resin containing an inorganic oxide, a desired refractive index can be easily obtained by adjusting the kind and amount of the inorganic oxide to be contained.
- the hard coat layer is formed of a curable resin, it prevents a low molecular weight substance such as an oligomer from eluting from a base material formed of a polymer resin by a heat treatment or the like during the manufacturing process. The influence on the layer can be suppressed.
- the transparent conductive film according to the second aspect of the present invention is the transparent conductive film according to the first aspect of the present invention, wherein the substrate 11 is made of polyethylene terephthalate, polyethylene naphthalate, triacetyl cellulose, and polycarbonate. It is formed of at least one selected from the group consisting of The curable resin that forms the first hard coat layer 12 is an ultraviolet curable resin.
- the first transparent dielectric layer 13 laminated as necessary is formed of silicon oxide (SiO 2 ).
- the first transparent conductor layer 14 is formed of at least one selected from the group consisting of indium tin oxide, indium zinc oxide, gallium-added zinc oxide, aluminum-added zinc oxide, silver, copper, and carbon.
- the first transparent conductor layer When patterning is performed on the first transparent conductor layer by etching using an acid solution, the first transparent conductor layer is provided with the first transparent dielectric layer and is formed of silicon dioxide having high acid resistance. Deterioration of the hard coat layer can be prevented. Furthermore, when the first transparent dielectric layer is provided, the number of layers of the transparent conductive film is increased, so that the refractive index of the entire transparent conductive film can be easily adjusted.
- the transparent conductive film according to the third aspect of the present invention is the transparent conductive film according to the first aspect or the second aspect of the present invention.
- the hard coat layers are laminated on both surfaces of the base material, it is possible to suppress deformation (for example, curl or the like) of the base material formed of the polymer resin during the heat treatment. Furthermore, when the second hard coat layer does not contain an inorganic oxide, productivity of the material can be improved because the labor for preparing the material can be saved. Furthermore, the manufacturing cost of the hard coat layer can be reduced.
- the transparent conductive film according to the fourth aspect of the present invention is the transparent conductive film according to the third aspect of the present invention, wherein the second hard coat layer 12 ′ is the same as the first hard coat layer 12.
- the second hard coat layer 12 ′ is the same as the first hard coat layer 12.
- the inorganic oxide and the curable resin are the same as the first hard coat layer 12.
- the first and second hard coat layers can be manufactured using the same material, and thus productivity can be improved.
- the transparent conductive film according to the fifth aspect of the present invention is the same as the transparent conductive film according to the fourth aspect of the present invention, for example, as shown in FIG.
- the second hard coat layer 12 ' has a refractive index of 1.40 to 1.90 and a film thickness of 0.5 to 6 ⁇ m.
- the second transparent dielectric layer 13 ′ laminated as necessary is made of an inorganic material and has a refractive index of 1.30 to 1.50 and a film thickness of 10 to 50 nm.
- the second transparent conductor layer 14 ' is formed of at least one selected from the group consisting of inorganic oxide, metal, and carbon, is patterned, and has a thickness of 10 nm to 2 ⁇ m.
- the patterns of the transparent conductor layers 14 and 14 ′ can have different shapes, a transparent conductive film suitable for a projected capacitive touch panel can be obtained.
- An image display device is, for example, as shown in FIG. 5, a touch panel having a transparent conductive film according to any one of the first to fifth aspects of the present invention. 43; and an image panel 41 provided on the opposite side to the first hard coat layer 12 of the transparent conductive film.
- the touch panel since the touch panel includes a transparent conductive film in which the pattern shape of the transparent conductor layer is not conspicuous, it is possible to obtain an image display device with improved display visibility on the image panel.
- the transparent conductive film manufacturing method according to the seventh aspect of the present invention is, for example, as shown in FIG. 6, by wet coating on one surface of a transparent substrate 11 formed of a film-like polymer resin.
- the substrate 11 has a film thickness of 2 to 250 ⁇ m.
- the hard coat layer 12 is formed of a curable resin containing an inorganic oxide, and has a refractive index of 1.40 to 1.90 and a film thickness of 0.5 to 6 ⁇ m.
- the transparent dielectric layer 13 laminated as required is formed of an inorganic material and has a refractive index of 1.30 to 1.50 and a film thickness of 10 to 50 nm.
- the transparent conductor layer 14 is made of an inorganic oxide and has a thickness of 10 nm to 2 ⁇ m.
- the hard coat layer is formed of a curable resin containing an inorganic oxide, a hard coat layer having a desired refractive index can be easily manufactured by adjusting the kind and amount of the inorganic oxide to be contained. be able to.
- the hard coat layer is formed of a curable resin, it prevents the low molecular weight substances such as oligomers from eluting from the base material formed of the polymer resin by heat treatment during the manufacturing process.
- the hard coat layer can be laminated at a line speed of several tens of meters per minute (for example, about 20 m / min) by using a wet coating method, the hard coat layer can be manufactured in large quantities, and the production efficiency can be increased.
- the transparent conductive film of the present invention is applied to the transparent conductor layer by adjusting the refractive index and film thickness of the transparent conductor layer, the transparent dielectric layer laminated as necessary, and the hard coat layer.
- the pattern shape can be made inconspicuous. Therefore, a transparent conductive film having a multilayer structure and good visibility can be obtained.
- FIG. 1 is a diagram showing a layer configuration of Examples 1 to 6 and Comparative Examples 1 to 4.
- FIG. 1 illustrates the layer structure of the transparent conductive film 10 formed in multiple layers, and the thickness of each layer is exaggerated.
- the transparent conductive film 10 includes a transparent plastic substrate 11 as a substrate, a hard coat layer 12, a transparent dielectric layer 13 and a transparent conductor layer 14 as necessary.
- a hard coat layer 12 is laminated on one surface of the transparent plastic substrate 11 (upper side of the transparent plastic substrate 11 in FIG. 1).
- a transparent dielectric layer 13 is further laminated on the hard coat layer 12 as necessary.
- a transparent conductor layer 14 is further laminated on the transparent dielectric layer 13. In this way, the transparent conductive film 10 is configured in multiple layers.
- the transparent plastic substrate 11 refers to a transparent substrate 11 formed of a film-like polymer resin.
- various plastic films having transparency can be used as a film-like polymer resin.
- the material for the plastic film having transparency include, for example, polyester resins, acetate resins, polyethersulfone resins, polycarbonate resins, polyamide resins, polyimide resins, polyolefin resins, (meth) acrylic resins, Examples thereof include polyvinyl chloride resins, polyvinylidene chloride resins, polystyrene resins, polyvinyl alcohol resins, polyarylate resins, polyphenylene sulfide resins, and norbornene resins.
- polyethylene terephthalate PET
- polyethylene naphthalate triacetyl cellulose
- polyether sulfone polycarbonate
- polyarylate polyether ether ketone
- Polyethylene terephthalate and polyethylene naphthalate are more preferred because they are excellent in mechanical strength, dimensional stability, heat resistance, chemical resistance, optical properties, etc., and smoothness and handling properties of the film surface.
- Polycarbonate is more preferred because it is excellent in transparency, impact resistance, heat resistance, dimensional stability, and flammability. In consideration of price and availability, polyethylene terephthalate is particularly preferable.
- the film thickness of the transparent plastic substrate 11 is 2 to 250 ⁇ m, preferably 10 to 200 ⁇ m, and particularly preferably 20 to 190 ⁇ m. If the film thickness of the transparent plastic substrate 11 is less than 2 ⁇ m, the mechanical strength of the substrate is insufficient, and operations such as formation of the transparent conductor layer 14 and pattern formation of the transparent conductive film 10 become difficult. On the other hand, if the film thickness exceeds 250 ⁇ m, the thickness of the touch panel is increased, which makes it unsuitable for mobile devices such as mobile phones and portable music terminals.
- the transparent plastic substrate 11 is an easy-adhesion process (a process of applying an easy-adhesive in-line when forming a transparent plastic substrate, and improves the adhesion between the transparent plastic substrate and the hard coat layer), Primer coating treatment (This is a treatment to apply a primer coating agent offline after forming a transparent plastic substrate, improving the adhesion between the transparent plastic substrate and the hard coat layer), corona discharge treatment, flame treatment, UV irradiation It is preferable to perform surface activation treatment such as treatment, electron beam irradiation treatment, ozone treatment, glow discharge treatment, and sputtering treatment. By the surface activation treatment, the adhesion of the hard coat layer 12 provided on the substrate to the transparent plastic substrate 11 can be improved.
- a hard coat layer 12 mainly composed of a curable resin is provided on the transparent plastic substrate 11.
- the hard coat layer 12 makes it possible to prevent optical interference of the transparent plastic substrate 11, prevent curling, impart chemical resistance, and prevent precipitation of low-molecular substances such as oligomers.
- the hard coat layer 12 is formed by laminating a curable resin on the transparent plastic substrate 11 and curing the obtained coating film.
- a wet coating method in which a resin dissolved in a solvent is uniformly coated.
- a gravure coating method, a die coating method, or the like can be used as the wet coating method.
- a gravure coating method a gravure roll with an uneven engraving process on the surface is dipped in the coating liquid, and the coating liquid adhering to the convex and concave parts on the surface of the gravure roll is scraped off with a doctor blade and stored accurately in the concave part. And transferring to the base material.
- a low viscosity liquid can be thinly coated by the gravure coating method.
- the die coating method is a method in which coating is performed while pressurizing and extruding a liquid from a coating head called a die.
- the die coating method enables highly accurate coating. Further, since the liquid is not exposed to the outside air during application, the concentration of the application liquid is hardly changed by drying.
- Other wet coating methods include spin coating, bar coating, reverse coating, roll coating, slit coating, dipping, spray coating, kiss coating, reverse kiss coating, air knife coating, and curtain coating. Method, lot coat method and the like.
- the method of laminating can be appropriately selected according to the required film thickness from these methods. Furthermore, by using the wet coating method, since it can be laminated at a line speed of several tens of meters per minute (for example, about 20 m / min), it can be manufactured in large quantities and the production efficiency can be increased.
- the curable resin is a resin that is cured by heating, ultraviolet irradiation, electron beam irradiation, or the like.
- the curable resin include silicone resin, acrylic resin, methacrylic resin, epoxy resin, melamine resin, polyester resin, and urethane resin.
- an ultraviolet curable resin is preferable from the viewpoint of productivity.
- the ultraviolet curable resin is usually used by adding a photopolymerization initiator.
- the photopolymerization initiator include various benzoin derivatives, benzophenone derivatives, phenyl ketone derivatives, and the like.
- the addition amount of the photopolymerization initiator is preferably 1 to 5 parts by weight with respect to 100 parts by weight of the ultraviolet curable resin.
- curable resin is used as a coating liquid, it is preferable that it is liquid before hardening.
- the concentration of the curable resin component of the coating solution can be appropriately selected by adjusting the viscosity according to a lamination method such as a wet coating method.
- the concentration is preferably 5 to 80% by weight, more preferably 10 to 60% by weight.
- the diluting solvent for example, methyl isobutyl ketone can be used.
- An inorganic oxide is added to the hard coat layer coating solution in order to adjust the refractive index of the hard coat layer 12 after curing.
- the inorganic oxide material contained in the hard coat layer include SiO 2 , Al 2 O 3 , SnO 2 , ZrO 2 , TiO 2 , and complex oxides thereof.
- a material in which a plurality of inorganic oxides are mixed may be used.
- the average particle diameter of the inorganic oxide is preferably in the range of 1 to 100 nm.
- the addition amount of the inorganic oxide is affected by the specific gravity and the like, but is preferably 5 to 50% by weight, more preferably 10 to 40% by weight of the resin solid content.
- the refractive index of the hard coat layer 12 is 1.40 to 1.90, preferably 1.55 to 1.80.
- the refractive index is less than 1.40, the difference in refractive index from the transparent dielectric layer 13 is small. Therefore, when the transparent conductor layer 14 is patterned, the optical characteristics of the pattern portion and the non-pattern portion are It becomes larger and the pattern portion tends to be visible.
- the refractive index exceeds 1.90, for example, when PET is used for the transparent plastic substrate 11, the difference in refractive index from the transparent plastic substrate 11 becomes large. The visibility of 10 decreases.
- the film thickness of the hard coat layer 12 is 0.5 to 6 ⁇ m, preferably 0.5 to 1.5 ⁇ m.
- the film thickness is less than 0.5 ⁇ m, it becomes difficult to form a cross-linked structure of the curable resin, resulting in a decrease in durability and chemical resistance.
- the film thickness exceeds 6 ⁇ m, the film thickness becomes too thick, so that transparency such as total light transmittance is lowered.
- the curing process for curing the curable resin examples include curing processes such as heating, ultraviolet irradiation, and electron beam irradiation.
- the coating film is usually heated in the range of 70 to 200 ° C. for several tens of minutes to remove the diluting solvent remaining in the coating film, followed by a curing treatment. It is preferable to carry out.
- the heating may be usually performed at a heating temperature of 80 to 250 ° C., preferably 100 to 200 ° C. At this time, heating may be performed for 30 to 90 minutes when an oven is used, and heating for 5 to 30 minutes when a hot plate is used.
- ultraviolet rays having a wavelength of 200 to 400 nm from a UV lamp for example, a high pressure mercury lamp, an ultrahigh pressure mercury lamp, a metal halide lamp, and a high power metal halide lamp
- a UV lamp for example, a high pressure mercury lamp, an ultrahigh pressure mercury lamp, a metal halide lamp, and a high power metal halide lamp
- the coating solution may be irradiated with a low energy electron beam from a self-shielding low energy electron accelerator of 300 keV or less.
- the transparent dielectric layer 13 NaF, BaF 2, LiF , include inorganic materials such as MgF 2, CaF 2, SiO 2 . Of these, SiO 2 is preferable. Since SiO 2 has high acid resistance, deterioration of the hard coat layer 12 can be prevented when the transparent conductor layer 14 is patterned by etching with an acid solution or the like.
- a dry process such as a sputtering method, a vacuum deposition method or an ion plating method, or a wet method for forming a transparent dielectric layer by applying silica sol or the like.
- the method can be appropriately selected according to the required film thickness. It is preferable to use a dry process because a film having a thickness of several nanometers can be produced and a uniform and excellent smooth film can be produced. In particular, it is preferable to select a sputtering target (film formation material) with high purity because a film with less dust and particles can be formed. Further, it is preferable to use silica sol because film formation is easy.
- the refractive index of the transparent dielectric layer 13 is 1.30 to 1.50, preferably 1.40 to 1.50.
- the refractive index is less than 1.30, the film is porous. Therefore, when the transparent conductor layer 14 is laminated, it becomes difficult for the transparent conductor layer 14 to be a uniform film, resulting in a decrease in electrical characteristics. .
- the refractive index exceeds 1.50, the difference in refractive index from the transparent conductor layer 14 becomes small. Therefore, when the transparent conductor layer 14 is patterned, the optical characteristics of the pattern part and the non-pattern part It becomes difficult to bring close.
- the film thickness of the transparent dielectric layer 13 is 10 to 50 nm, preferably 15 to 45 nm, and particularly preferably 20 to 30 nm. If it is less than 10 nm, the film becomes discontinuous and the stability of the film decreases. On the other hand, when the film thickness exceeds 50 nm, a decrease in transparency occurs.
- the material of the transparent conductor layer 14 includes zinc oxide, tin oxide, aluminum oxide, titanium oxide, indium oxide, indium tin oxide (ITO), indium zinc oxide (IZO), gallium-added zinc oxide, fluorine-added tin oxide, antimony Addition tin oxide, aluminum addition zinc oxide (AZO), silicone addition zinc oxide, silver, copper, carbon, etc. are mentioned.
- the surface resistance value of the transparent conductor layer 14 is preferably within a range of 10 to 1000 ⁇ / ⁇ , and more preferably within a range of 30 to 500 ⁇ / ⁇ .
- the film thickness of the transparent conductor layer 14 is preferably 10 to 300 nm, more preferably 20 to 200 nm, in order to obtain a continuous film having this surface resistance value.
- the transparent conductor layer 14 may be formed by a wet method using a coating liquid containing an inorganic oxide as a main component, a sputtering method, an ion plating method, an electron beam evaporation method, a chemical vapor deposition method ( Dry process such as CVD). It is preferable to use a dry process because a film having a thickness of several nanometers can be produced and a uniform and excellent smooth film can be produced. In particular, it is preferable to select a sputtering target (film formation material) with high purity because a film with less dust and particles can be formed.
- the ratio of tin and indium in the deposited ITO can be changed by changing the ratio of tin oxide and indium oxide in the target material.
- the refractive index optical characteristics
- ITO, IZO, silver, copper, carbon, or the like can be made into a paint and applied, heat-dried, or fused to easily form a film by printing or the like.
- the transparent conductor layer 14 is etched and patterned. Patterning can form various patterns according to the use to which the transparent conductive film 10 is applied.
- a mask portion having a desired pattern shape is formed on the surface of the transparent conductor layer 14, and after removing the exposed portion with an etching solution or the like, the mask portion is dissolved with an alkaline solution or the like to be patterned.
- An acid is preferably used as the etching solution. Examples of the acid include inorganic acids such as hydrogen chloride, hydrogen bromide, nitric acid, sulfuric acid and phosphoric acid, organic acids such as acetic acid and oxalic acid, and mixtures thereof, and aqueous solutions thereof.
- the patterning method is not limited to this, and methods such as a laser ablation method and a screen printing method may be used.
- the pattern shape may be, for example, a diamond shape as shown in (a) and (b) of FIG. However, the shape is not limited to this, and may be a triangle or a rectangle. Note that the patterns shown in FIGS. 2A and 2B are electrically connected in the directions of the arrows, respectively.
- at least one metal oxide selected from the group consisting of indium tin oxide, indium zinc oxide, gallium-doped zinc oxide, and aluminum-doped zinc oxide is used for the transparent conductor layer 14.
- annealing can be performed within a range of 100 to 150 ° C. to improve crystallization. The higher the crystallinity of the transparent conductor layer 14, the better the conductivity. Therefore, the transparent plastic substrate 11 preferably has a heat resistance of 150 ° C. or higher.
- the transparent conductive film 20 further includes a hard coat layer 12 ′ on the surface opposite to the hard coat layer 12 side of the transparent plastic substrate 11 shown in FIG. Thereby, since the transparent plastic base material 11 becomes the structure pinched
- the material, film thickness, refractive index, and contained inorganic oxide of the hard coat layer 12 ′ may be the same as or different from the hard coat layer 12. Furthermore, the inorganic oxide may not be contained. For example, if the material and the content are the same as those of the hard coat layer 12 and the film thickness is made thicker than that of the hard coat layer 12, film formation is facilitated and workability can be improved.
- Transparent conductive film 30 With reference to FIG. 4, the transparent conductive film 30 which concerns on the 3rd Embodiment of this invention is demonstrated.
- the transparent conductive film 30 is formed on the surface of the transparent plastic substrate 11 shown in FIG. 1 opposite to the hard coat layer 12 side, further on the hard coat layer 12 ′, if necessary, the transparent dielectric layer 13 ′, and transparent conductive material.
- a body layer 14 ' is provided.
- the hard coat layer 12 ′ is laminated on the other surface of the transparent plastic substrate 11 (under the transparent plastic substrate 11 in FIG. 4).
- a transparent dielectric layer 13 ′ is further laminated below the hard coat layer 12 ′ as necessary.
- a transparent conductor layer 14 ′ is further laminated under the transparent dielectric layer 13 ′.
- each layer is comprised so that it may become symmetrical on both surfaces of the transparent plastic base material 11.
- FIG. The patterns of the transparent conductor layers 14 and 14 'formed on both sides of the transparent plastic substrate 11 may be the same, but more preferably have different shapes.
- the pattern shown in FIG. 2A is formed on the transparent conductor layer 14.
- the pattern shown in FIG. 2B is formed so as not to overlap with the pattern of FIG.
- the patterns (a) and (b) are formed so that the directions of electrical connection intersect (including orthogonal).
- the transparent dielectric layer 13 and the transparent dielectric layer 13 ′ may include both layers as necessary, or may include either one layer or not.
- the material, film thickness, and refractive index of the transparent dielectric layer 13 ′ may be the same as or different from those of the transparent dielectric layer 13, respectively.
- the material, film thickness, and refractive index of the transparent conductor layer 14 ′ may be the same as or different from those of the transparent conductor layer 14, respectively.
- the structure of each layer is not limited to the transparent conductive films 10, 20, and 30, and it is good also as another structure.
- the image display device 40 includes an image panel 41 that displays an image projected by mechanical processing, a shield layer 42, a touch panel 43 having the transparent conductive film 30 according to the present invention, and a protective layer 44.
- a shield layer 42 is laminated on an image panel 41 such as a liquid crystal display, and a touch panel 43 is placed so that the patterned transparent conductor layer 14 (see FIG. 4) is on the upper side.
- a protective layer 44 that protects the touch panel 43 is placed on the touch panel 43.
- the image display apparatus using the transparent conductive film of the present invention is not limited to the image display apparatus 40, and may be a display apparatus having another configuration.
- a plurality of transparent conductive films 10 or a plurality of transparent conductive films 20 may be laminated and used.
- two transparent conductive films 10 may be used with the transparent conductor layer 14 facing up.
- a pattern shown in FIG. 2A may be formed on the transparent conductor layer 14 positioned above.
- the pattern shown in FIG. 2B may be formed on the transparent conductor layer 14 positioned below so as not to overlap the pattern of FIG.
- the touch panel includes an optical type, an ultrasonic type, an electromagnetic induction type, a capacitance type, a resistance film type, and the like depending on the position detection method.
- the transparent conductive film of the present invention can be used with any type of touch panel. Especially, since the pattern shape given to the transparent conductor layer is not conspicuous, it is suitable for a capacitive touch panel.
- a hard coat layer 12 is laminated by wet coating on one surface of a transparent substrate 11 formed of a film-like polymer resin (S01).
- a transparent dielectric layer 13 is laminated on the surface of the hard coat layer 12 opposite to the substrate 11 side as necessary (S02).
- the transparent conductor layer 14 is laminated on the surface of the transparent dielectric layer 13 opposite to the hard coat layer 12 side (S03).
- the transparent conductor layer 14 is patterned (S04).
- the hard coat layer 12 is a curable resin containing an inorganic oxide and has a refractive index of 1.40 to 1.90 and a film thickness of 0.5 to 6 ⁇ m.
- the transparent dielectric layer 13 is made of an inorganic material and has a refractive index of 1.30 to 1.50 and a film thickness of 10 to 50 nm.
- the transparent conductor layer 14 is made of zinc oxide, tin oxide, aluminum oxide, titanium oxide, indium oxide, indium tin oxide (ITO), indium zinc oxide (IZO), gallium-added zinc oxide, fluorine-added tin oxide, antimony-added tin oxide.
- inorganic oxides such as aluminum-added zinc oxide (AZO) and silicone-added zinc oxide, metals such as silver and copper, and carbon, and has a film thickness of 10 nm to 2 ⁇ m. Is done. Then, it is patterned into a predetermined shape.
- the hard coat layer since the hard coat layer is laminated by the wet coating method, it can be laminated at a line speed of several tens of meters per minute (for example, about 20 m / min), and the production efficiency can be increased.
- the hard coat layer is formed of a curable resin containing an inorganic oxide, the refractive index of the hard coat layer can be easily adjusted by adjusting the type and amount of the inorganic oxide to be contained. .
- the characteristic measurement method and effect evaluation method in the present invention are as follows.
- Total light transmittance Based on JIS-K7361, total light transmittance was measured using NDH-5000 manufactured by Nippon Denshoku Industries Co., Ltd.
- the surface resistance ( ⁇ / ⁇ ) of the ITO film was measured by a four-terminal method using MCP-T610 manufactured by Mitsubishi Chemical Analytech Co., Ltd.
- the film thickness of the transparent plastic substrate 11 was measured with a Nikon micro gauge thickness meter MF-501.
- the thickness of the other layers was measured by observing a cross section with a scanning electron microscope SU70 manufactured by Hitachi, Ltd.
- the refractive index of each layer was measured using an Abbe refractometer manufactured by Atago.
- Pattern opening part Place the transparent conductive film sample on the black plate with the transparent conductor layer side facing up, and evaluate whether the pattern part and the non-pattern part (pattern opening part) can be visually determined according to the following criteria. did. ⁇ : Difficult to distinguish between a pattern portion and a non-pattern portion (pattern opening). (Triangle
- hard coat layer coating solution (a2) 100 parts by weight of acrylic ultraviolet curable resin (DIC Corporation: Unidic 17-824-9), 150 parts by weight of colloidal zirconia (Nissan Chemical Co., Ltd .: Nanouse OZ-S30K) and 420 parts by weight of methyl isobutyl ketone Were mixed to prepare a hard coat layer coating solution (a2).
- a hard coat layer coating liquid (a3) was prepared by mixing 100 parts by weight of an acrylic ultraviolet curable resin (DIC Co., Ltd .: Unidic 17-824-9) and 150 parts by weight of methyl isobutyl ketone.
- the coating liquid (a3) does not contain colloidal zirconia.
- Example 1 (Formation of hard coat layer (A1))
- the hard coat layer coating solution (a1) is applied to one surface of a transparent plastic substrate made of a polyethylene terephthalate film (hereinafter referred to as PET film) having a film thickness of 125 ⁇ m so that the film thickness becomes 0.8 ⁇ m after UV curing. Then, a hard coat layer (A1) was formed.
- PET film polyethylene terephthalate film
- Example 2 (Formation of hard coat layer (A2)) A hard coat layer (A2) was formed in the same manner as in the hard coat layer (A1) of Example 1, except that the hard coat layer coating liquid (a1) was changed to the hard coat layer coating liquid (a2). .
- the film thickness of the hard coat layer (A2) was 0.9 ⁇ m.
- a hard coat layer (B2) was formed in the same manner as in the hard coat layer (B1) of Example 1, except that the hard coat layer coating liquid (a1) was changed to the hard coat layer coating liquid (a2). .
- the film thickness of the hard coat layer (B2) was 1.4 ⁇ m.
- Example 3 (Formation of hard coat layer (A3)) The hard coat of Example 1 except that the acrylic UV curable resin used in the hard coat layer coating solution (a1) was changed to an acrylate UV curable resin (Pertron XJC-0563-FL). The same operation as in the layer (A1) was performed to form a hard coat layer (A3).
- the film thickness of the hard coat layer (A3) was 0.8 ⁇ m.
- Example 4 (Formation of hard coat layer (A4)) The hard coat of Example 1 except that the acrylic UV curable resin used in the hard coat layer coating liquid (a1) was changed to an acrylate UV curable resin (manufactured by Toyo Ink Manufacturing Co., Ltd .: Rioduras TYT80-01). The same operation as that for the layer (A1) was performed to form a hard coat layer (A4).
- the film thickness of the hard coat layer (A4) was 0.8 ⁇ m.
- Example 1 (Formation of hard coat layer (B5)) A hard coat layer (B5) was formed in the same manner as in Example 1 except that the hard coat layer (A1) was not provided in Example 1. The film thickness of the hard coat layer (B5) was 1.5 ⁇ m.
- a hard coat layer (A6) was formed in the same manner as in the hard coat layer (A1) of Example 1, except that the hard coat layer coating liquid (a1) was changed to the hard coat layer coating liquid (a3). .
- the film thickness of the hard coat layer (A6) was 0.8 ⁇ m.
- a hard coat layer (B6) was formed in the same manner as in the hard coat layer (B1) of Example 1, except that the hard coat layer coating liquid (a1) was changed to the hard coat layer coating liquid (a3). .
- the film thickness of the hard coat layer (B6) was 1.3 ⁇ m.
- a transparent conductor layer was formed on the transparent dielectric layer by sputtering using a target of 98% by mass of indium oxide and 2% by mass of tin oxide. An ITO film having a thickness of 30 nm was obtained. Next, after a predetermined patterned photoresist film was formed on the ITO film, it was immersed in a hydrochloric acid solution, and the ITO film was etched to form a pattern. After patterning the ITO film, the ITO film is heated at 150 ° C. for 90 minutes to crystallize the ITO film portion, and transparent conductive films of Examples 1 to 4 and Comparative Examples 1 to 2 are obtained. It was.
- FIG. 7 shows the layer structure of the ITO transparent conductive films of Examples 1 to 4 and Comparative Examples 1 and 2.
- Table 1 shows the experimental results of the ITO transparent conductive films of Examples 1 to 4 and Comparative Examples 1 and 2.
- Example 5 and Comparative Example 3 In Example 5 and Comparative Example 3, the transparent dielectric layer (SiO 2 ) is not used in Example 4 and Comparative Example 2, and the transparent conductor layer is formed of silver. (Formation of silver / transparent conductor layer) On the hard coat layers (A4) and (A6) of Example 4 and Comparative Example 2, a coating solution containing silver nanoparticles (Silver Nanparticle Ink, manufactured by Sigma-Aldrich Japan) was applied using a bar coater. The obtained coating film was dried at 120 ° C. for 60 seconds to form a transparent conductor layer.
- a coating solution containing silver nanoparticles Silver Nanparticle Ink, manufactured by Sigma-Aldrich Japan
- FIG. 7 shows the layer structure of the silver transparent conductive film of Example 5 and Comparative Example 3.
- Table 2 shows the experimental results (refractive index) of the silver transparent conductive films of Example 5 and Comparative Example 3.
- Example 6 and Comparative Example 4 In Example 6 and Comparative Example 4, the transparent dielectric layer (SiO 2 ) is not provided in Example 4 and Comparative Example 2, and the transparent conductor layer is formed of carbon. (Formation of carbon / transparent conductor layer) On the hard coat layers (A4) and (A6) of Example 4 and Comparative Example 2, a coating solution containing carbon nanoparticles (EP TDL-2MIBK, Mitsubishi Materia Kasei Co., Ltd.) was applied using a bar coater. did. The obtained coating film was dried at 120 ° C. for 60 seconds to form a transparent conductor layer.
- EP TDL-2MIBK Mitsubishi Materia Kasei Co., Ltd.
- FIG. 7 shows the layer structure of the carbon transparent conductive film of Example 6 and Comparative Example 4.
- Table 3 shows the experimental results (refractive index) of the carbon transparent conductive films of Example 6 and Comparative Example 4.
- the transparent conductive films described in Examples 1 to 4 that satisfy the scope of the present invention emphasize the difference between the pattern portion and the non-pattern portion even when the transparent conductor layer is patterned. It never happened. Therefore, when arrange
- a transparent conductive film (Comparative Example 1) having an inappropriate layer structure and a transparent conductive film (Comparative Example 2) provided with a hard coat layer not containing an inorganic oxide have visibility because the pattern portion is visible. inferior.
- the transparent conductive film of the present invention has a configuration in which a hard coat layer / transparent dielectric layer / transparent conductor layer are laminated in this order, and the thickness and refractive index of each layer are controlled. Therefore, when the transparent conductor layer is patterned, the difference in optical characteristics between the pattern portion (the portion where the transparent conductor layer is present) and the non-pattern portion (the pattern opening portion where the transparent conductor layer is removed) is greatly reduced. Can be small. Therefore, even if it uses for a touch panel and it arrange
- the hard coat layer contains an inorganic oxide
- the refractive index of the hard coat layer can be easily adjusted by adjusting the type and amount of the inorganic oxide. Furthermore, since the variation of the refractive index of the hard coat layer can be increased by adjusting the kind and amount of the inorganic oxide, the options for the refractive index of the transparent dielectric layer and the transparent conductor layer as the upper layer can be expanded. Furthermore, when the hard coat layer is laminated on both surfaces of the transparent plastic substrate, curling of the transparent plastic substrate can be extremely suppressed.
- the transparent conductive film of the present invention has a small optical property difference between the pattern portion and the non-pattern portion of the transparent conductor layer, and when placed on the front surface of a display body such as a touch panel, it has excellent transparency and visibility. It is particularly suitable as a transparent conductive film for a touch panel.
Abstract
Description
そこで、本発明は、導電層としての透明導電体層のパターン形状が目立たず、視認性が良好な、多層構造の透明導電性フィルムおよびその製造方法を提供することを課題とする。
なお、「パターン化」とは、エッチング法、レーザーアブレーション法、スクリーン印刷等により、透明導電体層に所定の形状を形成することをいう。パターン化により透明導電性フィルムは、透明導電体層を有する部分(パターン部:P)と、透明導電体層を有しない部分(非パターン部:NP)を備える。
図1を参照して、本発明の第1の実施の形態に係る透明導電性フィルム10について説明する。なお、図1は多層に構成された透明導電性フィルム10の層構成を説明するものであり、各層の厚みは誇張されている。透明導電性フィルム10は、基材としての透明プラスチック基材11と、ハードコート層12と、必要に応じて透明誘電体層13と、透明導電体層14を備える。図1に示すように、透明プラスチック基材11の一方の面(図1では透明プラスチック基材11の上側)には、ハードコート層12が積層される。ハードコート層12上にはさらに必要に応じて透明誘電体層13が積層される。透明誘電体層13上にはさらに透明導電体層14が積層される。このように、透明導電性フィルム10は多層に構成される。
透明プラスチック基材11とは、フィルム状の高分子樹脂で形成された透明な基材11をいう。透明プラスチック基材11には、フィルム状の高分子樹脂として透明性を有する各種のプラスチックフィルムを用いることができる。透明性を有するプラスチックフィルムの材料としては、例えば、ポリエステル系樹脂、アセテート系樹脂、ポリエーテルスルホン系樹脂、ポリカーボネート系樹脂、ポリアミド系樹脂、ポリイミド系樹脂、ポリオレフィン系樹脂、(メタ)アクリル系樹脂、ポリ塩化ビニル系樹脂、ポリ塩化ビニリデン系樹脂、ポリスチレン系樹脂、ポリビニルアルコール系樹脂、ポリアリレート系樹脂、ポリフェニレンサルファイド系樹脂、ノルボルネン系樹脂等の樹脂が挙げられる。具体的には、ポリエチレンテレフタレート(PET)、ポリエチレンナフタレート、トリアセチルセルロース、ポリエーテルスルホン、ポリカーボネート、ポリアリレート、ポリエーテルエーテルケトン等が好ましい。なお、ポリエチレンテレフタレートおよびポリエチレンナフタレートは、機械的強度、寸法安定性、耐熱性、耐薬品性、光学特性等、およびフィルム表面の平滑性やハンドリング性に優れているためより好ましい。ポリカーボネートは、透明性、耐衝撃性、耐熱性、寸法安定性、燃焼性に優れているためより好ましい。価格・入手の容易さをも考慮すると、ポリエチレンテレフタレートが特に好ましい。
ハードコート層12は、透明プラスチック基材11上に硬化性樹脂を積層し、得られた塗膜を硬化させることで形成される。硬化性樹脂の積層には、溶媒に溶解させた樹脂を均一にコーティングするウェットコーティング法を用いることが好ましい。ウェットコーティング法としては、グラビアコート法やダイコート法等を用いることができる。グラビアコート法は、表面に凸凹の彫刻加工が施されたグラビアロールを塗布液に浸し、グラビアロール表面の凸凹部に付着した塗布液をドクターブレードで掻き落とし凹部に液を貯めることで正確に計量し、基材に転移させる方式である。グラビアコート法により、低粘度の液を薄くコーティングすることができる。ダイコート法は、ダイと呼ばれる塗布用ヘッドから液を加圧して押出しながらコーティングする方式である。ダイコート法により、高精度なコーティングが可能となる。さらに、塗布時に液が外気にさらされないため、乾きによる塗布液の濃度変化などが起こりにくい。その他のウェットコーティング法としては、スピンコート法、バーコート法、リバースコート法、ロールコート法、スリットコート法、ディッピング法、スプレーコート法、キスコート法、リバースキスコート法、エアーナイフコート法、カーテンコート法、ロットコート法などを挙げることができる。積層する方法は、これらの方法から必要とする膜厚に応じて適宜選択することができる。さらに、ウェットコーティング法を用いることにより、毎分数十メートルのライン速度(例えば約20m/分)で積層できるため、大量に製造でき、生産効率を上げることができる。
[透明誘電体層13]
透明誘電体層13の材料としては、NaF、BaF2、LiF、MgF2、CaF2、SiO2などの無機物が挙げられる。これらのなかでも、SiO2であることが好ましい。SiO2は耐酸性が高いため、透明導電体層14を酸溶液等によりエッチングしてパターン化する場合に、ハードコート層12の劣化を防ぐことができる。
透明導電体層14の材料としては、酸化亜鉛、酸化錫、酸化アルミニウム、酸化チタン、酸化インジウム、酸化インジウム錫(ITO)、酸化インジウム亜鉛(IZO)、ガリウム添加酸化亜鉛、フッ素添加酸化錫、アンチモン添加酸化錫、アルミニウム添加酸化亜鉛(AZO)、シリコーン添加酸化亜鉛、銀、銅、カーボンなどが挙げられる。
透明導電体層14に酸化インジウム錫、酸化インジウム亜鉛、ガリウム添加酸化亜鉛、アルミニウム添加酸化亜鉛からなる群から選ばれた少なくとも1種の金属酸化物を使用する場合には、パターン化した後、導電性を向上させるために、100~150℃の範囲内でアニール処理を施して結晶化を向上させることができる。透明導電体層14の結晶性が高いほど導電性が良好となる。そのため、透明プラスチック基材11は150℃以上の耐熱性を有することが好ましい。
図3を参照して、本発明の第2の実施の形態に係る透明導電性フィルム20について説明する。透明導電性フィルム20は、図1に示す透明プラスチック基材11のハードコート層12側とは反対側の面に、さらにハードコート層12’を備える。これにより、透明プラスチック基材11はハードコート層12と12’に挟まれた構成となるので、透明プラスチック基材11がカールするのをより抑制することができる。
ハードコート層12’の材料、膜厚、屈折率、含有する無機酸化物は、それぞれハードコート層12と同一であってもよく、または異なってもよい。さらに、無機酸化物を含有しなくてもよい。例えば、材料と含有物をハードコート層12と同一にし、膜厚をハードコート層12よりも厚くすると、成膜し易く作業性を向上させることができる。
図4を参照して、本発明の第3の実施の形態に係る透明導電性フィルム30について説明する。透明導電性フィルム30は、図1に示す透明プラスチック基材11のハードコート層12側とは反対側の面に、さらにハードコート層12’、必要に応じて透明誘電体層13’、透明導電体層14’を備える。図4に示すように、ハードコート層12’は透明プラスチック基材11の他方の面(図4では透明プラスチック基材11の下側)に積層される。ハードコート層12’の下にはさらに必要に応じて透明誘電体層13’が積層される。透明誘電体層13’の下にはさらに透明導電体層14’が積層される。このように、透明プラスチック基材11の両面に対称となるように各層が構成される。
透明プラスチック基材11の両側に形成された透明導電体層14および14’の各パターンは、同一でもよいが、異なる形状であることがより好ましい。例えば、透明導電体層14には、図2(a)に示すパターンを形成する。透明導電体層14’には、図2(b)に示すパターンを、(a)のパターンと重なりがでないように形成する。このとき、(a)と(b)のパターンは、電気的接続の方向が交差(直交を含む)するように形成される。このように、透明導電体層14と14’のパターンを組んで構成することにより、投影型静電容量方式のタッチパネルに好適となるため、好ましい。
なお、透明誘電体層13と透明誘電体層13’は、必要に応じて両層を備えてもよく、どちらか1層のみを備えてもよく、備えなくてもよい。また、透明誘電体層13’の材料、膜厚、屈折率は、それぞれ透明誘電体層13と同一であってもよく、または異なってもよい。さらに、透明導電体層14’の材料、膜厚、屈折率は、それぞれ透明導電体層14と同一であってもよく、または異なってもよい。
また、各層の構成は、透明導電性フィルム10、20、30に限定されるものではなく、他の構成としてもよい。
図5を参照して、本発明の第4の実施の形態に係る画像表示装置40について説明する。画像表示装置40は、機械的処理により映し出された像を表示する画像パネル41と、シールド層42と、本発明に係る透明導電性フィルム30を有するタッチパネル43と、保護層44とを備える。図5に示すように、液晶ディスプレイ等の画像パネル41上にシールド層42が積層され、さらにパターン化された透明導電体層14(図4参照)が上側になるようにタッチパネル43が載置される。さらに、タッチパネル43上にはタッチパネル43を保護する保護層44が載置される。なお、本発明の透明導電性フィルムを用いた画像表示装置は、画像表示装置40に限定されるものではなく、他の構成の表示装置であってもよい。例えば、本発明の透明導電性フィルム10および20を用いてもよい。さらに、複数の透明導電性フィルム10、または複数の透明導電性フィルム20を、それぞれ積層して用いてもよい。例えば、透明導電性フィルム10を、透明導電体層14を上にした状態で2枚重ねにして用いてもよい。その場合、上方に位置した透明導電体層14には、図2(a)に示すパターンを形成してもよい。さらに、下方に位置した透明導電体層14には、図2(b)に示すパターンを、(a)のパターンと重なりがでないように形成してもよい。このとき、(a)と(b)のパターンを、電気的接続の方向が交差(直交を含む)するように形成することが好ましい。このように、2枚の透明導電性フィルム10を重ね、2層の透明導電体層14のパターンを組んで構成してもよい。
さらに、タッチパネルには、位置検出の方式により、光学式、超音波式、電磁誘導式、静電容量式、抵抗膜式などがある。本発明の透明導電性フィルムは、いずれの方式のタッチパネルでも使用することができる。中でも、透明導電体層に施されたパターン形状が目立たないため、静電容量式のタッチパネルに好適である。
図6を参照して、本発明の第5の実施の形態に係る透明導電性フィルムの製造方法について説明する。まず、フィルム状の高分子樹脂で形成された透明な基材11の一方の面にウェットコーティング法によりハードコート層12を積層する(S01)。次に、ハードコート層12の基材11側とは反対側の面に必要に応じて透明誘電体層13を積層する(S02)。次に、透明誘電体層13のハードコート層12側とは反対側の面に透明導電体層14を積層する(S03)。最後に、透明導電体層14をパターン化する(S04)。基材11には、2~250μmの膜厚を有するフィルムを用いる。なお、本製造方法は、硬化性樹脂に無機酸化物を含有させる工程をさらに備える。そのため、ハードコート層12は、無機酸化物を含有した硬化性樹脂で、1.40~1.90の屈折率および0.5~6μmの膜厚を有するように形成される。透明誘電体層13は、無機物で、1.30~1.50の屈折率および10~50nmの膜厚を有するように形成される。透明導電体層14は、酸化亜鉛、酸化錫、酸化アルミニウム、酸化チタン、酸化インジウム、酸化インジウム錫(ITO)、酸化インジウム亜鉛(IZO)、ガリウム添加酸化亜鉛、フッ素添加酸化錫、アンチモン添加酸化錫、アルミニウム添加酸化亜鉛(AZO)、シリコーン添加酸化亜鉛などの無機酸化物、銀および銅などの金属、カーボンからなる群から選ばれた少なくとも1種で、10nm~2μmの膜厚を有するように形成される。その後、所定の形状にパターン化される。なお、本製造方法は、ハードコート層をウェットコーティング法により積層するため、毎分数十メートルのライン速度(例えば約20m/分)で積層でき、生産効率を上げることができる。さらに、ハードコート層は、無機酸化物を含有した硬化性樹脂で形成されるため、含有させる無機酸化物の種類や量を調整することでハードコート層の屈折率を容易に調整することができる。
本発明における特性の測定方法および効果の評価方法は次のとおりである。
JIS-K7361に準拠し、日本電色工業(株)製NDH-5000を用いて、全光線透過率を測定した。
JIS-Z8729に準拠し、日本電色工業(株)製SD5000を用いて、パターン部と非パターン部の透過光のL*、a*、b*値を測定し、色差ΔE*を算出した。色差ΔE*は、パターン部と非パターン部のL*、a*、b*値の差、ΔL*、Δa*、Δb*を自乗して足し合わせ、その平方根をとることで算出した(ΔE≧0)。このΔE*の値が小さいほどパターン部が見えにくくなる。
四端子法により、三菱化学アナリテック(株)製MCP-T610を用いて、ITO膜の表面抵抗(Ω/□)を測定した。
透明プラスチック基材11の膜厚は、ニコン製マイクロゲージ式厚み計MF-501にて測定した。その他の層の厚みについては、日立製作所製の走査型電子顕微鏡SU70により断面観察して測定した。
各層の屈折率は、アタゴ社製のアッベ屈折率計を用いて測定した。
黒い板の上に、透明導電性フィルムのサンプルを透明導電体層側が上になるように置き、目視によりパターン部と非パターン部(パターン開口部)の判別ができるか否かを下記基準で評価した。
○:パターン部と非パターン部(パターン開口部)の判別が困難。
△:パターン部と非パターン部(パターン開口部)とをわずかに判別できる。
×:パターン部と非パターン部(パターン開口部)とをはっきりと判別できる。
(ハードコート層塗布液(a1)の調製)
アクリル系紫外線硬化性樹脂(DIC(株)製:ユニディック 17-824-9)100重量部、コロイダルジルコニア(日産化学(株)製:ナノユース OZ-S30K)63重量部とメチルイソブチルケトン460重量部を混合してハードコート層塗布液(a1)を調製した。
アクリル系紫外線硬化性樹脂(DIC(株)製:ユニディック 17-824-9)100重量部、コロイダルジルコニア(日産化学(株)製:ナノユース OZ-S30K)150重量部とメチルイソブチルケトン420重量部を混合してハードコート層塗布液(a2)を調製した。
アクリル系紫外線硬化性樹脂(DIC(株)製:ユニディック17-824-9)100重量部、メチルイソブチルケトン 150重量部を混合してハードコート層塗布液(a3)を調製した。塗布液(a3)は、コロイダルジルコニアを含まない。
[実施例1]
(ハードコート層(A1)の形成)
膜厚125μmのポリエチレンテレフタレートフィルム(以下、PETフィルムという)からなる透明プラスチック基材の一方の面に、UV硬化後に膜厚が0.8μmになるように、ハードコート層塗布液(a1)を塗布し、ハードコート層(A1)を形成した。
ハードコート層(A1)が形成されたPETフィルムの、ハードコート層(A1)が形成された面とは反対側の面に、UV硬化後に膜厚1.2μmになるように、ハードコート層塗布液(a1)を、バーコーターを用いて塗布した。以後は、ハードコート層(A1)の形成と同様の方法で形成した。
(ハードコート層(A2)の形成)
ハードコート層塗布液(a1)をハードコート層塗布液(a2)に変えた以外は、実施例1のハードコート層(A1)と同様の操作を行って、ハードコート層(A2)を形成した。ハードコート層(A2)の膜厚は0.9μmであった。
ハードコート層塗布液(a1)をハードコート層塗布液(a2)に変えた以外は、実施例1のハードコート層(B1)と同様の操作を行って、ハードコート層(B2)を形成した。ハードコート層(B2)の膜厚は1.4μmであった。
(ハードコート層(A3)の形成)
ハードコート層塗布液(a1)で用いたアクリル系紫外線硬化性樹脂をアクリレート系紫外線硬化性樹脂(ペルノックス(株)製:ペルトロンXJC-0563-FL)に変えた以外は、実施例1のハードコート層(A1)と同様の操作を行って、ハードコート層(A3)を形成した。ハードコート層(A3)の膜厚は0.8μmであった。
ハードコート層塗布液(a1)で用いたアクリル系紫外線硬化性樹脂をアクリレート系紫外線硬化性樹脂(ペルノックス(株)製:ペルトロンXJC-0563-FL)に変えた以外は、実施例1のハードコート層(B1)と同様の操作を行って、ハードコート層(B3)を形成した。ハードコート層(B3)の膜厚は1.3μmであった。
(ハードコート層(A4)の形成)
ハードコート層塗布液(a1)で用いたアクリル系紫外線硬化性樹脂をアクリレート系紫外線硬化性樹脂(東洋インキ製造(株)製:リオデュラスTYT80-01)に変えた以外は、実施例1のハードコート層(A1)と同様の操作を行って、ハードコート層(A4)を形成した。ハードコート層(A4)の膜厚は0.8μmであった。
ハードコート層塗布液(a1)で用いたアクリル系紫外線硬化性樹脂をアクリレート系紫外線硬化性樹脂(東洋インキ製造(株)製:リオデュラスTYT80-01)に変えた以外は、実施例1のハードコート層(B1)と同様の操作を行って、ハードコート層(B4)を形成した。ハードコート層(B4)の膜厚は1.5μmであった。
(ハードコート層(B5)の形成)
実施例1においてハードコート層(A1)を設けなかったこと以外は、実施例1と同様の操作を行って、ハードコート層(B5)を形成した。ハードコート層(B5)の膜厚は、1.5μmであった。
(ハードコート層(A6)の形成)
ハードコート層塗布液(a1)をハードコート層塗布液(a3)に変えた以外は、実施例1のハードコート層(A1)と同様の操作を行って、ハードコート層(A6)を形成した。ハードコート層(A6)の膜厚は0.8μmであった。
ハードコート層塗布液(a1)をハードコート層塗布液(a3)に変えた以外は、実施例1のハードコート層(B1)と同様の操作を行って、ハードコート層(B6)を形成した。ハードコート層(B6)の膜厚は1.3μmであった。
(SiO2/透明誘電体層の形成)
実施例1~4および比較例1~2の透明誘電体層は、ハードコート層(A1)~(A6)上に、Siターゲット材料を用い、アルゴンおよび酸素の混合ガス雰囲気下で反応性スパッタリング法により形成した。膜厚30nm、屈折率1.45のSiO2の薄膜を得た。
次いで、透明誘電体層上に、酸化インジウム98質量%、酸化錫2質量%のターゲットを用い、スパッタリング法により透明導電体層を形成した。膜厚30nmのITO膜を得た。次いで、ITO膜上に所定のパターン化されたフォトレジスト膜を形成した後、塩酸溶液に浸漬し、ITO膜のエッチングを行い、パターンの形成を行った。ITO膜のパターン化後、このITO膜を150℃、90分間の条件で加熱処理をして、ITO膜部分を結晶化し、実施例1~4、比較例1~2の透明導電性フィルムを得た。
図7に実施例1~4、比較例1~2のITO透明導電性フィルムの層構成を示す。また、実施例1~4、比較例1~2のITO透明導電性フィルムの実験結果を表1に示す。
[実施例5、比較例3]
実施例5および比較例3は、実施例4および比較例2において透明誘電体層(SiO2)を有さず、透明導電体層を銀で形成したものである。
(銀/透明導電体層の形成)
実施例4および比較例2のハードコート層(A4)および(A6)上に、銀ナノ粒子を含有する塗布液 (Silver Nanparticle Ink, シグマ-アルドリッチ ジャパン製)を、バーコーターを用いて塗布した。得られた塗膜を120℃で60秒間乾燥し、透明導電体層を形成した。
図7に実施例5、比較例3の銀透明導電性フィルムの層構成を示す。また、実施例5、比較例3の銀透明導電性フィルムの実験結果(屈折率)を表2に示す。
[実施例6、比較例4]
実施例6および比較例4は、実施例4および比較例2において透明誘電体層(SiO2)を有さず、透明導電体層をカーボンで形成したものである。
(カーボン/透明導電体層の形成)
実施例4および比較例2のハードコート層(A4)および(A6)上に、カーボンナノ粒子を含有する塗布液(EP TDL-2MIBK,三菱マテリア化成(株))を、バーコーターを用いて塗布した。得られた塗膜を120℃で60秒間乾燥し、透明導電体層を形成した。
図7に実施例6、比較例4のカーボン透明導電性フィルムの層構成を示す。また、実施例6、比較例4のカーボン透明導電性フィルムの実験結果(屈折率)を表3に示す。
11、11’ 基材、透明プラスチック基材
12、12’ ハードコート層
13、13’ 透明誘電体層
14、14’ 透明導電体層
40 画像表示装置
41 画像パネル
42 シールド層
43 タッチパネル
44 保護層
Claims (7)
- [規則91に基づく訂正 15.11.2011]
フィルム状の高分子樹脂で形成された透明な基材と;
前記基材の一方の面に積層された第1のハードコート層と;
前記第1のハードコート層の前記基材側とは反対側の面に必要に応じて積層される第1の透明誘電体層と;
前記第1の透明誘電体層の前記第1のハードコート層側とは反対側の面に積層された第1の透明導電体層とを備え;
前記基材は、2~250μmの膜厚を有し、
前記第1のハードコート層は、無機酸化物を含有した硬化性樹脂で形成され、1.40~1.90の屈折率および0.5~6μmの膜厚を有し、
前記第1の透明誘電体層は、無機物で形成され、1.30~1.50の屈折率および10~50nmの膜厚を有し、
前記第1の透明導電体層は、無機酸化物、金属、カーボンからなる群から選ばれた少なくとも1種で形成され、パターン化されているとともに、10nm~2μmの膜厚を有する、
透明導電性フィルム。 - 前記基材は、ポリエチレンテレフタレート、ポリエチレンナフタレート、トリアセチルセルロース、およびポリカーボネートからなる群から選ばれた少なくとも1種で形成され、
前記第1のハードコート層を形成する硬化性樹脂は、紫外線硬化性樹脂であり、
前記必要に応じて積層される第1の透明誘電体層は、酸化珪素(SiO2)で形成され、
前記第1の透明導電体層は、酸化インジウム錫、酸化インジウム亜鉛、ガリウム添加酸化亜鉛、アルミニウム添加酸化亜鉛、銀、銅、カーボンからなる群から選ばれた少なくとも1種で形成される、
請求項1に記載の透明導電性フィルム。 - 前記基材の他方の面に積層された第2のハードコート層を備え;
前記第2のハードコート層は、硬化性樹脂で形成された、
請求項1または請求項2に記載の透明導電性フィルム。 - 前記第2のハードコート層は、前記第1のハードコート層と同一の、無機酸化物および硬化性樹脂で形成された、
請求項3に記載の透明導電性フィルム。 - 前記第2のハードコート層の前記基材側とは反対側の面に必要に応じて積層される第2の透明誘電体層と;
前記第2の透明誘電体層の前記第2のハードコート層側とは反対側の面に積層された第2の透明導電体層とを備え;
前記第2のハードコート層は、1.40~1.90の屈折率および0.5~6μmの膜厚を有し、
前記必要に応じて積層される第2の透明誘電体層は、無機物で形成され、1.30~1.50の屈折率および10~50nmの膜厚を有し、
前記第2の透明導電体層は、無機酸化物、金属、カーボンからなる群から選ばれた少なくとも1種で形成され、パターン化されているとともに、10nm~2μmの膜厚を有する、
請求項4に記載の透明導電性フィルム。 - 請求項1~請求項5のいずれか1項に記載の透明導電性フィルムを有するタッチパネルと;
前記透明導電性フィルムの第1のハードコート層と反対の側に設けられた、画像パネルとを備えた;
画像表示装置。 - フィルム状の高分子樹脂で形成された透明な基材の一方の面にウェットコーティング法によりハードコート層を積層する工程と;
必要に応じて、前記ハードコート層の前記基材側とは反対側の面に透明誘電体層を積層する工程と;
前記透明誘電体層の前記ハードコート層側とは反対側の面に透明導電体層を積層する工程と;
前記透明導電体層をパターン化する工程とを備え;
前記基材は、2~250μmの膜厚を有し、
前記ハードコート層は、無機酸化物を含有した硬化性樹脂で形成され、1.40~1.90の屈折率および0.5~6μmの膜厚を有し、
必要に応じて積層される前記透明誘電体層は、無機物で形成され、1.30~1.50の屈折率および10~50nmの膜厚を有し、
前記透明導電体層は、無機酸化物で形成され、10nm~2μmの膜厚を有する、
透明導電性フィルムの製造方法。
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US9860981B2 (en) | 2018-01-02 |
TW201213136A (en) | 2012-04-01 |
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US20130113757A1 (en) | 2013-05-09 |
JPWO2012005271A1 (ja) | 2013-09-05 |
CN102985898A (zh) | 2013-03-20 |
CN102985898B (zh) | 2016-06-01 |
KR101826379B1 (ko) | 2018-02-06 |
KR20130036277A (ko) | 2013-04-11 |
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