WO2011145618A1 - Dispositif de refroidissement à ébullition - Google Patents

Dispositif de refroidissement à ébullition Download PDF

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Publication number
WO2011145618A1
WO2011145618A1 PCT/JP2011/061320 JP2011061320W WO2011145618A1 WO 2011145618 A1 WO2011145618 A1 WO 2011145618A1 JP 2011061320 W JP2011061320 W JP 2011061320W WO 2011145618 A1 WO2011145618 A1 WO 2011145618A1
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WO
WIPO (PCT)
Prior art keywords
heat
plate
refrigerant
heat receiving
receiving member
Prior art date
Application number
PCT/JP2011/061320
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English (en)
Japanese (ja)
Inventor
有仁 松永
吉川　実
坂本　仁
Original Assignee
日本電気株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日本電気株式会社 filed Critical 日本電気株式会社
Priority to US13/698,149 priority Critical patent/US20130056178A1/en
Priority to CN2011800203157A priority patent/CN102869943A/zh
Priority to JP2012515893A priority patent/JPWO2011145618A1/ja
Publication of WO2011145618A1 publication Critical patent/WO2011145618A1/fr

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
    • F28F13/18—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by applying coatings, e.g. radiation-absorbing, radiation-reflecting; by surface treatment, e.g. polishing
    • F28F13/185—Heat-exchange surfaces provided with microstructures or with porous coatings
    • F28F13/187—Heat-exchange surfaces provided with microstructures or with porous coatings especially adapted for evaporator surfaces or condenser surfaces, e.g. with nucleation sites
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0283—Means for filling or sealing heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • the present invention relates to a boiling cooler that suppresses heat generation of an LSI or IC by utilizing a phase change phenomenon of a refrigerant such as boiling or liquefaction, particularly in an electronic device equipped with an LSI or IC.
  • LSIs and ICs used in electronic devices such as computers are acceleratingly increasing with each generation. Furthermore, in recent years, there has been an increasing demand for smaller and thinner devices. For this reason, the heat generation density of LSI and IC tends to increase further in the future. In order to operate these LSIs and ICs stably at high speed, it is necessary to control the operating temperature below a certain temperature. A cooling method is employed in accordance with the heat generation amount of these LSIs and ICs. However, when a device is reduced in size and thickness, a cooler such as a heat sink mounted on an LSI or IC cannot secure a size corresponding to the amount of heat generated.
  • a boiling cooler including a heat receiving plate 3, a heat transfer means 4, and a heat sink 5 as shown in FIG. 11 has been proposed.
  • the small heat receiving plate 3 is disposed on a heating element 2 such as an LSI or an IC installed on the substrate 1 and absorbs heat from the heating element 2.
  • the heat absorbed by the heat receiving plate 3 is transported via the heat transfer means 4 to the heat sink 5 mounted on the board 1 wider than the heating element 2.
  • the heat transfer means 4 a metal having high thermal conductivity such as aluminum or copper may be used. However, it is preferable to use the heat pipe 6 having better heat transfer performance as the heat transfer means 4.
  • the heat pipe 6 utilizes a phase change phenomenon in which the refrigerant is vaporized by the heat receiving plate 3 in contact with the heating element 2, and the vaporized refrigerant is liquefied by the heat radiating plate 7 provided below the heat sink 5. The heat pipe 6 uses this phase change phenomenon to transfer heat generated in the heating element 2 such as an LSI or an IC to the heat sink 5.
  • the structure of the heat pipe 6 will be described with reference to a schematic sectional view of FIG.
  • the heat pipe 6 includes a hollow tubular container 8 made of a metal having high thermal conductivity such as aluminum and copper, and a refrigerant sealed in the container 8.
  • One end of the heat pipe 6 is connected to a heat receiving plate 3 that is in contact with the heating element 2 such as an LSI or an IC.
  • a heat radiating plate 7 in contact with the heat sink 5 serving as a cooler is connected to the other end of the heat pipe 6.
  • the refrigerant changes phase from liquid to gas, while in the heat sink 7, the refrigerant changes phase from gas to liquid.
  • the pressure on the heat receiving plate 3 side becomes high, and the vaporized refrigerant generated in the heat receiving plate 3 moves to the heat radiating plate 7 side.
  • the liquid refrigerant generated on the heat radiating plate 7 side returns to the heat receiving plate 3 by passing through a fine mesh called a wick 9 attached to the inner surface of the heat pipe 6.
  • the mesh gap is very narrow.
  • the heat pipe 6 when the liquefied refrigerant generated in the heat radiating plate 7 is returned to the heat receiving plate 3, the heat pipe 6 passes through the fine mesh-like wick 9, so that the heat transport amount cannot be increased. Therefore, it is difficult to cool the heating element 2 having a large amount of heat.
  • Patent Document 1 proposes a boiling cooler in which a refrigerant is boiled by a heat receiving plate, and a liquid generated by the heat radiating plate is refluxed by gravity.
  • This heat transport using boiling is characterized by a large heat transport capability because it uses more refrigerant than the heat pipe and recirculates by gravity.
  • the loop-shaped flow path is formed in the flat plate. With this configuration, the flow path through which the gaseous refrigerant passes and the liquid refrigerant generated in the heat radiating plate recirculate, so that the flow path is separated, reducing pressure loss due to collision between the two and increasing the equivalent thermal conductivity.
  • Patent Document 2 the area where the heat receiving plate comes into contact with the refrigerant is increased by placing a boiling promoting structure on the heat receiving plate, the boiling is promoted by improving the heat transfer coefficient transmitted from the heat generating part to the refrigerant, and the equivalent thermal conductivity. Is increasing.
  • the heat radiation wall is provided with a fin having a notch partially, and the equivalent thermal conductivity is increased by increasing the surface area for condensation and enhancing the condensation effect.
  • Patent Document 4 shows a configuration in which corrugated fins having low heights are arranged in two stages (or three or more stages), and the corrugated fins are joined with their positions aligned so that heat can be transferred to each other. Has been.
  • chevron-shaped first fins are arranged on the inner sides of the heat receiving plate and the heat radiating plate, respectively, and chevron-shaped second fins are arranged on the inner side of the first fins through a support member such as a wire mesh. The configuration shown is shown.
  • Japanese Unexamined Patent Publication No. 2006-344636 Japanese Unexamined Patent Publication No. 07-161888 Japanese Unexamined Patent Publication No. 2000-74536 Japanese Unexamined Patent Publication No. 01-209356 Japanese Unexamined Patent Publication No. 11-31768
  • Patent Document 1 if a structure in which the flow path of the boiling cooling gas and the liquid refrigerant is divided as a method for improving the equivalent thermal conductivity of the flat plate boiling cooler, the flat cooling plate using boiling cooling is adopted. There is a problem that the design becomes complicated. That is, if it is going to divide a flow path, it will be necessary to adjust a flow path finely for every apparatus, and versatility will be impaired.
  • An example of the object of the present invention is to provide a boiling cooler that can efficiently dissipate heat with a simple configuration and can be applied to LSIs and ICs that generate large amounts of heat.
  • the boiling cooler of the present invention includes a chamber, a heat sink, a heat receiving member, and a heat radiating member.
  • the chamber includes a heat conduction plate in which a heating element is provided on the outer surface, and a sealed space that is provided inside the heat conduction plate and is filled with a refrigerant that changes phase between liquid and gas.
  • the heat sink is provided on the outer surface of the heat conducting plate.
  • the heat receiving member is provided on an inner surface of the heat conducting plate so as to face the heat generating member with the heat conducting plate interposed therebetween, and transmits heat generated by the heat generating member to the refrigerant.
  • the heat dissipating member is provided on the inner surface of the heat conducting plate, receives heat transferred by the refrigerant, and dissipates heat to the heat sink.
  • the heat receiving member and the heat radiating member are spaced apart from each other in the surface direction of the heat conducting plate. The heat receiving member is immersed in the liquid coolant.
  • the heat generated in the heating element is transported to the heat sink by changing the phase of the refrigerant sealed in the sealed space of the chamber to a liquid / gas between the heat receiving member and the heat radiating member gas.
  • the heat receiving member and the heat radiating member are disposed apart from each other in the surface direction of the heat conducting plate. That is, the heat receiving member and the heat radiating member are disposed in a positional relationship that does not face each other. Therefore, the movement of the refrigerant that is a gas in the heat receiving member is not hindered, and the heat conduction efficiency can be maintained high. Therefore, it is possible to efficiently dissipate heat with a simple configuration, and it is possible to deal with LSIs and ICs that generate a large amount of heat.
  • FIGS. 1 to 3 show a boiling cooler 20 according to a first embodiment of the present invention.
  • a heating element 10 such as an LSI or an IC is joined to the boiling cooler 20. More specifically, the heating element 10 is joined to the heat receiving plate 22 of the boiling cooler 20 with a heat conductive grease or a heat conductive sheet. At this time, the heating element 10 may be welded with solder.
  • the boiling cooler 20 has a hollow chamber 24 having a flat plate shape.
  • the chamber 24 includes a side wall portion 21 formed in a rectangular frame shape, a heat receiving plate (heat conducting plate) 22 covering the upper opening 21A of the side wall portion 21, and a heat radiating plate (heat conducting plate) covering the lower opening 21B of the side wall portion 21. Plate) 23.
  • the side wall 21 of the chamber 24 is provided with a refrigerant inlet 21C for injecting the refrigerant C into the sealed space.
  • the chamber 24 may be formed by separately manufacturing the side wall portion 21, the heat receiving plate 22, and the heat radiating plate 23 and then bonding them by brazing or the like. Alternatively, the chamber 24 may be formed by integrally molding either the heat receiving plate 22 or the heat radiating plate 23 with the side wall portion 21.
  • the O-ring 25 may be disposed around the upper opening 21A and the lower opening 21B of the side wall portion 21.
  • the upper opening 21A and the lower opening 21B may be blocked by the heat radiating plate 23 and the heat receiving plate 22 via the O-ring 25, and the heat radiating plate 23 and the heat receiving plate 22 may be attached to the side wall portion 21 with screws or the like.
  • the heat receiving plate 22 and the heat radiating plate 23 can be easily detached. As a result, it is possible to improve workability when mounting a heating element 22 and a heat sink 28 described later.
  • a heating element 10 such as an LSI or an IC serving as a heat source is disposed on the outer surface of the sealed space of the heat receiving plate 22 .
  • a heat receiving member 26 is fixed to the inner surface of the heat receiving plate 22 where the heating element 10 is disposed. The heat receiving member 26 transmits the heat generated in the heating element 10 to the refrigerant C.
  • each fin of the heat receiving member 26 has been subjected to a surface roughening process having a surface roughness in the range of 1 ⁇ m to 100 ⁇ m.
  • a surface roughening process having a surface roughness in the range of 1 ⁇ m to 100 ⁇ m.
  • a heat radiating member 27 for removing heat from the vaporized refrigerant C2 is provided inside the heat radiating plate 23 .
  • the heat radiating member 27 is disposed away from the heat receiving member 26 in the surface direction of the heat receiving plate 22 and the heat radiating plate 23 (that is, the direction perpendicular to the thickness direction of the heat receiving plate 22 and the heat radiating plate 23). . That is, the heat dissipation member 27 is disposed so as not to face the heat receiving member 26.
  • a heat sink 28 as a cooler is provided on the outer surface of the heat radiating plate 23 where the heat radiating member 27 is disposed.
  • the coolant C filled in the chamber 24 may be easily available water.
  • an organic refrigerant having insulation as the refrigerant C. This is because, when the refrigerant C leaks, etc., when the refrigerant C touches the electronic component or the substrate, the electronic component or the substrate is not affected and can be reused.
  • many organic refrigerants have a surface tension smaller than that of water and a boiling point smaller than that of water. For this reason, it is possible to suppress the heat generating body 10 to temperature lower than the boiling point of water.
  • the refrigerant C sealed in the chamber 24 is saturated vapor pressure by being evacuated, and has a boiling point in a normal temperature environment.
  • the saturated vapor pressure is a maximum pressure generated in a space at a certain temperature in a sealed space where only a substance such as water exists.
  • the liquid refrigerant C1 and the gas refrigerant C2 coexist in the sealed space in the chamber 24.
  • the liquid refrigerant C1 exists in the lower part of the sealed space, and the gas refrigerant C2 exists in the upper part of the sealed space.
  • the heating element 10 such as LSI or IC generates heat
  • the heat reaches the heat receiving member 26 in the chamber 24 via the heat receiving plate 22 and heats the liquid refrigerant C1 around the heat receiving member 26.
  • the heated refrigerant C1 reaches the boiling point, bubbles are formed with an acute shape as a nucleus.
  • the droplets generated by the condensation in the heat radiating member 27 are recirculated to the liquid refrigerant C1 existing below the heat radiating member 27 and further transported to the heat receiving member 26, so that the liquid refrigerant C1 becomes the gaseous refrigerant C2 again. And phase change.
  • the heat taken away from the gaseous refrigerant C1 by the heat radiating member 27 is radiated to the air or the like via the heat sink 28 attached to the outer surface of the chamber 24.
  • the gas generated in the heat receiving member 26 may be deprived of heat by the heat radiating member 27 present in the immediate vicinity to generate droplets.
  • the heat receiving member 26 and the heat radiating member 27 are arranged in a positional relationship that does not face each other. For this reason, the movement of the gas generated in the heat receiving member 26 is not hindered, and as a result, a decrease in heat conduction efficiency can be prevented.
  • the refrigerant C sealed in the sealed space of the chamber 24 is changed into a liquid / gas phase between the heat receiving member 26 and the heat radiating member 27. I am letting. Thereby, the heat generated in the heating element 10 can be efficiently transported to the heat sink 28. Further, the heat receiving member 26 and the heat radiating member 27 are spaced apart from each other in the surface direction of the heat receiving plate 22 and the heat radiating plate 23. That is, the heat receiving member 26 and the heat radiating member 27 are arranged in a positional relationship that does not face each other.
  • the heat receiving member 26 preferably has a large surface area in contact with the refrigerant C, but the surface area in contact with the liquid refrigerant C is not necessarily proportional to the boiling performance. It has been confirmed that when the pin fins of the first embodiment are rectangular fins 30, the surface area in contact with the refrigerant C is reduced, but the boiling performance is not significantly reduced. In terms of productivity, the rectangular fin 30 is more advantageous than the pin fin.
  • the rectangular fin 30 may be formed integrally with the heat receiving plate 22 by cutting or forging. Alternatively, a rectangular parallelepiped member of the rectangular fin 30 may be separately manufactured and then welded to the heat receiving plate 22 by brazing or the like, and then the surface may be roughened from about 1 ⁇ m to several hundreds of ⁇ m. Such a rectangular fin 30 may also be applied to the heat radiating member 27 connected to the heat sink 28.
  • the heat receiving member 26 is a plurality of columnar pin fins having a rough surface on the heat receiving plate 22 on which the heating element 10 is disposed. As shown in FIG. 5, the heat receiving member 26 may be constituted by a rectangular parallelepiped heat radiation block 31 having a rough surface.
  • the chamber 24 is arranged to be horizontal, but the invention is not limited to this.
  • the boiling cooler 20 may be arranged vertically as shown in FIG. That is, the heat receiving member 26 and the heat radiating member 27 may be positioned so that the normal lines of the heat receiving member 26 and the heat radiating member 27 are orthogonal to the heat receiving plate 22 and the heat radiating plate 23 in the vertical direction. Also in this case, at least the heat receiving member 26 of the heat receiving member 26 and the heat radiating member 27 is immersed in the liquid refrigerant C1. With such a configuration, the degree of freedom in design can be increased.
  • the heat conductive plate 32 is made of, for example, metal.
  • the heat of the heating element 10 is transferred from the heat receiving member 26 to the heat radiating member 27 by transferring the metal, and a synergistic effect combined with heat transport through the refrigerant C can be exhibited.
  • the heat receiving and radiating member 32 may be manufactured by cutting or forging. Or you may attach the heat-receiving member 26 and the fin of the heat radiating member 27 which were produced separately by brazing.
  • the sealing plate 33 disposed so as to face the heat conductive plate 32 may be made of aluminum or copper having good heat conductivity, or may be made of a resin such as acrylic in consideration of productivity.
  • the chamber 24 is arranged to be horizontal, but the invention is not limited to this.
  • the boiling cooler 10 is arranged vertically as shown in FIGS. 9 and 10, and the buffer tank 40 is arranged in the upper position thereof. Also good.
  • the heat receiving member 26 connected to the heating element 10 must be immersed in the liquid refrigerant C1.
  • the liquid refrigerant C1 is mostly occupied in the internal space of the chamber 24, the volume of the liquid refrigerant C1 is increased by vaporizing the liquid refrigerant C1 into the gas refrigerant C2 due to the phase change in the heat receiving member 26. .
  • the pressure in the chamber 24 rises more than necessary. In this case, since the boiling point of the refrigerant C increases, the heating element 10 may not be cooled to a predetermined temperature.
  • the buffer tank 40 shown in FIGS. 8 to 10 serves as an evacuation site for the gaseous refrigerant C2.
  • the buffer tank 40 is disposed so as to protrude above the heat sink 23.
  • a buffer space for accommodating the gaseous refrigerant C2 is formed inside the buffer tank 40.
  • the buffer tank 40 is arranged above the heat sink 23 in the vertical direction and above the heat sink 28.
  • the heat receiving member 26 connected to the heating element 10 is disposed at a position facing the buffer tank 40.
  • the gas generated by the heat receiving member 26 can be stored in the internal space of the buffer tank 40 installed on the upper part of the heat sink 23.
  • an increase in internal pressure in the chamber 24 can be suppressed, and a cooling effect can be brought out even for the heating element 10 installed on the upper portion of the chamber 24.
  • the amount of heat of the heating element 10 is large, it is necessary that a large amount of liquid refrigerant C2 exists near the heat receiving member 26 because the amount of boiling liquid refrigerant C2 is large. In that case, by storing the refrigerant C in a part of the buffer tank 40 to supplement the insufficient refrigerant C, it is possible to cope with the heating element 10 having a large calorific value.
  • the present invention can be applied to a boiling cooler. According to this boiling cooler, heat generation of LSI and IC can be suppressed by utilizing a phase change phenomenon of refrigerant such as boiling and liquefaction.
  • Heating element 20 Boiling cooler 21 Side plate 22 Heat receiving plate 23 Heat sink 24 chambers 26 Heat receiving member 27 Heat dissipation member 28 Heat sink 32 Heat conduction plate C1 (C) Liquid refrigerant C2 (C) Gaseous refrigerant

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Thermal Sciences (AREA)
  • Sustainable Development (AREA)
  • Power Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

L'invention concerne un dispositif de refroidissement à ébullition comprenant une chambre, un dissipateur thermique, un élément récepteur de chaleur et un élément libérateur de chaleur. La chambre comprend une plaque de transfert de chaleur et un espace hermétique. Un élément de chauffage est placé sur la surface extérieure de la plaque de transfert de chaleur, et l'espace hermétique est formé à l'intérieur de la plaque de transfert de chaleur et est rempli d'un réfrigérant dont l'état change entre liquide et gazeux. Le dissipateur de chaleur est placé sur la surface extérieure de la plaque de transfert de chaleur. L'élément récepteur de chaleur est placé sur la surface intérieure de la plaque de transfert de chaleur de façon à faire face à l'élément de chauffage, la plaque de transfert de chaleur étant placée entre les deux, et l'élément récepteur de chaleur transfère la chaleur produite par l'élément de chauffage au réfrigérant. L'élément libérateur de chaleur est placé sur la surface intérieure de la plaque de transfert de chaleur et reçoit la chaleur transférée du réfrigérant afin de la libérer dans le dissipateur thermique. L'élément récepteur de chaleur et l'élément libérateur de chaleur sont séparés l'un de l'autre dans la direction de la surface de la plaque de transfert de chaleur. L'élément récepteur de chaleur est immergé dans le réfrigérant liquide.
PCT/JP2011/061320 2010-05-19 2011-05-17 Dispositif de refroidissement à ébullition WO2011145618A1 (fr)

Priority Applications (3)

Application Number Priority Date Filing Date Title
US13/698,149 US20130056178A1 (en) 2010-05-19 2011-05-17 Ebullient cooling device
CN2011800203157A CN102869943A (zh) 2010-05-19 2011-05-17 沸腾冷却装置
JP2012515893A JPWO2011145618A1 (ja) 2010-05-19 2011-05-17 沸騰冷却器

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2010115539 2010-05-19
JP2010-115539 2010-05-19

Publications (1)

Publication Number Publication Date
WO2011145618A1 true WO2011145618A1 (fr) 2011-11-24

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PCT/JP2011/061320 WO2011145618A1 (fr) 2010-05-19 2011-05-17 Dispositif de refroidissement à ébullition

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US (1) US20130056178A1 (fr)
JP (1) JPWO2011145618A1 (fr)
CN (1) CN102869943A (fr)
WO (1) WO2011145618A1 (fr)

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JP2015103798A (ja) * 2013-11-27 2015-06-04 旭徳科技股▲ふん▼有限公司 放熱基板
WO2018030478A1 (fr) * 2016-08-10 2018-02-15 古河電気工業株式会社 Chambre à vapeur
JP2020063895A (ja) * 2018-09-14 2020-04-23 古河電気工業株式会社 冷却装置および冷却装置を用いた冷却システム
WO2020196331A1 (fr) * 2019-03-22 2020-10-01 日立化成株式会社 Structure de refroidissement
WO2020196332A1 (fr) * 2019-03-22 2020-10-01 日立化成株式会社 Structure de refroidissement
WO2020209138A1 (fr) * 2019-04-11 2020-10-15 古河電気工業株式会社 Dispositif de refroidissement
WO2020213464A1 (fr) * 2019-04-18 2020-10-22 古河電気工業株式会社 Dissipateur thermique
JP2021135003A (ja) * 2020-02-27 2021-09-13 三菱重工業株式会社 冷却装置
JPWO2020196334A1 (ja) * 2019-03-22 2021-10-21 昭和電工マテリアルズ株式会社 冷却構造体

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JPWO2016075838A1 (ja) * 2014-11-14 2017-10-19 株式会社ＥｘａＳｃａｌｅｒ 電子機器の冷却システム、及び冷却方法
WO2017037860A1 (fr) * 2015-08-31 2017-03-09 株式会社ＥｘａＳｃａｌｅｒ Système de refroidissement pour véhicule électrique
US10262920B1 (en) * 2016-12-05 2019-04-16 Xilinx, Inc. Stacked silicon package having a thermal capacitance element
CN110869689B (zh) * 2017-07-28 2021-12-14 古河电气工业株式会社 吸液芯结构体及收纳有吸液芯结构体的热管
CN109413929B (zh) * 2017-08-16 2020-11-24 鹏鼎控股(深圳)股份有限公司 散热板及其制造方法
US10381562B1 (en) * 2018-05-17 2019-08-13 Qualcomm Incorporated Method and apparatus for cooling of an electronic device
CN109673131B (zh) * 2018-12-05 2020-12-15 浙江欧托电气有限公司 一种新能源充电装置主板水冷板翅控温装置
AT522831B1 (de) * 2019-08-08 2023-05-15 Dau Gmbh & Co Kg Luftwärmetauscher sowie Verfahren zu dessen Herstellung und damit ausgestatteter Elektronikaufbau
CN110736972B (zh) * 2019-11-15 2022-03-04 上海禾赛科技有限公司 激光雷达的散热结构和激光雷达
CN112902715A (zh) * 2019-12-03 2021-06-04 中兴通讯股份有限公司 一种液冷板及散热设备
US20230147067A1 (en) * 2021-11-05 2023-05-11 Rochester Institute Of Technology Cooling device having a boiling chamber with submerged condensation and method

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