WO2011061789A1 - 有機elディスプレイ - Google Patents
有機elディスプレイ Download PDFInfo
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- WO2011061789A1 WO2011061789A1 PCT/JP2009/006171 JP2009006171W WO2011061789A1 WO 2011061789 A1 WO2011061789 A1 WO 2011061789A1 JP 2009006171 W JP2009006171 W JP 2009006171W WO 2011061789 A1 WO2011061789 A1 WO 2011061789A1
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/805—Electrodes
- H10K50/82—Cathodes
- H10K50/828—Transparent cathodes, e.g. comprising thin metal layers
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/805—Electrodes
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- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/805—Electrodes
- H10K50/81—Anodes
- H10K50/818—Reflective anodes, e.g. ITO combined with thick metallic layers
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/805—Electrodes
- H10K50/82—Cathodes
- H10K50/824—Cathodes combined with auxiliary electrodes
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/844—Encapsulations
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/122—Pixel-defining structures or layers, e.g. banks
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/30—Devices specially adapted for multicolour light emission
- H10K59/38—Devices specially adapted for multicolour light emission comprising colour filters or colour changing media [CCM]
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- H—ELECTRICITY
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- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/805—Electrodes
- H10K59/8052—Cathodes
- H10K59/80522—Cathodes combined with auxiliary electrodes
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- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K2102/00—Constructional details relating to the organic devices covered by this subclass
- H10K2102/301—Details of OLEDs
- H10K2102/302—Details of OLEDs of OLED structures
- H10K2102/3023—Direction of light emission
- H10K2102/3026—Top emission
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- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/805—Electrodes
- H10K50/82—Cathodes
- H10K50/822—Cathodes characterised by their shape
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- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/842—Containers
- H10K50/8428—Vertical spacers, e.g. arranged between the sealing arrangement and the OLED
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- H—ELECTRICITY
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- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/805—Electrodes
- H10K59/8052—Cathodes
- H10K59/80521—Cathodes characterised by their shape
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- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/805—Electrodes
- H10K59/8052—Cathodes
- H10K59/80524—Transparent cathodes, e.g. comprising thin metal layers
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- H—ELECTRICITY
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- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/87—Passivation; Containers; Encapsulations
- H10K59/871—Self-supporting sealing arrangements
- H10K59/8723—Vertical spacers, e.g. arranged between the sealing arrangement and the OLED
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- H—ELECTRICITY
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- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/87—Passivation; Containers; Encapsulations
- H10K59/873—Encapsulations
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- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/10—Deposition of organic active material
- H10K71/12—Deposition of organic active material using liquid deposition, e.g. spin coating
- H10K71/13—Deposition of organic active material using liquid deposition, e.g. spin coating using printing techniques, e.g. ink-jet printing or screen printing
- H10K71/135—Deposition of organic active material using liquid deposition, e.g. spin coating using printing techniques, e.g. ink-jet printing or screen printing using ink-jet printing
Definitions
- the present invention mainly relates to an organic EL display.
- a panel unit of an organic EL display having a top emission structure typically has a configuration in which an organic EL element substrate (TFT substrate) and a color filter substrate are bonded together.
- TFT substrate organic EL element substrate
- An organic EL element substrate having a conventional structure includes, for example, a glass substrate, a TFT structure, a planarizing resin, an optional inorganic passivation film, an underlayer for improving adhesion, a reflective electrode, and a light emitting portion.
- An insulating film having an opening in a portion to be formed, an organic EL layer, a transparent electrode (including a translucent one), and a barrier layer covering the structure below the transparent electrode in the display region are included in this order.
- the transparent electrode is connected to the wiring at the periphery of the organic EL element substrate.
- a color filter substrate having a conventional structure includes, for example, a glass substrate, a black matrix, a color filter, and an optionally provided color conversion layer in this order.
- a coating method such as an inkjet method is becoming widespread.
- it is common to selectively form each of the color filters and / or color conversion layers at desired positions using partition walls. It is.
- the organic EL element substrate and the color filter substrate are bonded together while positioning the light emitting portion of the organic EL element substrate and the color filter of the color filter substrate to face each other, thereby obtaining an organic EL display.
- the bonding can be performed by, for example, a vacuum dropping bonding method generally used in manufacturing a liquid crystal display.
- a filler such as an adhesive may be enclosed in the bonding gap.
- a spacer can be provided on the color filter or the like.
- the bonding gap is too wide, there is a concern about the problem of crosstalk in which light enters the adjacent pixels.
- the bonding gap is too narrow, there are concerns about the influence of interference, mechanical contact between the organic EL element substrate and the color filter substrate in the display region, and the like.
- the filler is sealed in the bonding gap, if the bonding gap is too narrow, there is a possibility that uneven spreading of the filler occurs.
- a color conversion layer is formed by a coating method using a bank
- a partition wall having a desired shape is formed, and the process surface on which the partition wall is formed faces up, and an ink for forming a color conversion layer is applied using an inkjet device or the like.
- a color conversion layer is formed.
- the color conversion forming ink is generally formed by dissolving or dispersing a color conversion material in a solvent.
- the ink droplet immediately after application has a shape that rises to the extent that it protrudes from the upper part of the partition wall. Thereafter, a flat layer is formed at the bottom of the partition wall by heating and drying the ink droplets.
- a color conversion layer having a desired film thickness can be obtained by repeating the application and heating and drying a plurality of times.
- the partition wall needs to have a height of about 3 to 7 ⁇ m in order to prevent leakage of ink droplets during application.
- a height is not negligible compared to a sub-pixel size of about 40-60 ⁇ m in a 200-150 ppi definition display, thereby allowing the horizontal without entering the color conversion layer of a given sub-pixel.
- Increasing the proportion of light emitted that dissipates in the direction can reduce efficiency.
- the light scattered in the lateral direction enters the adjacent subpixels of different colors, the converted light from the color conversion layer of the adjacent subpixels is emitted, and the emitted light may exhibit an undesirable hue.
- the thin organic EL layer has extremely low mechanical strength
- mechanical bonding strength in the display region cannot be expected at all. Therefore, in a large-screen bonded organic EL display, even if the bonding gap is filled with an adhesive and the entire display area is bonded, a heat shock or impact applied during use or a filler to be sealed is used. There is inherent concern about film peeling due to cure shrinkage when solidifying.
- the structure which makes a bonding gap hollow is proposed in various places from the beginning of an organic electroluminescent display, it cannot be overemphasized that it is disadvantageous for manufacture of a large screen display.
- a barrier layer for protecting the organic EL layer is practically essential.
- the filler is sealed in the bonding gap and the filler has a lower refractive index than that of the barrier layer, total reflection occurs at the barrier layer / filler interface, and sufficient light can be extracted. Inability to do so causes optical loss.
- SiN or the like generally used as a barrier layer has a refractive index of about 1.7 to 1.9.
- the selection range of the filler is narrowed, and the manufacturing method is restricted.
- the barrier layer is formed using SiO having a refractive index of about 1.5 in order to match the refractive index with a general resin, reflection at the interface between the barrier layer and the filler is reduced. This time, a large loss occurs in the light from the organic EL layer and the transparent electrode to the barrier layer. This is because the organic EL layer and the transparent electrode usually have a refractive index of about 2.
- Japanese Patent Laid-Open No. 2006-32010 uses a forward tapered insulating film for separating the cathode as a partition wall.
- a structure has been proposed in which an organic EL layer, a transparent anode, and a protective layer are formed thereon, and a color filter and / or a color conversion layer is formed on the protective layer (see Patent Document 1).
- the insulating film used as a bank and the organic EL layer of the light emitting portion are connected to the entire screen.
- the insulating film formed of an organic material and extremely thick as compared with other layers contains a large amount of outgas such as moisture.
- the organic EL layer is continuous over the entire display area itself. There is a risk of causing widespread propagation of outgas entering through the protective layer.
- a color conversion material is formed on a protective layer by a wet process such as an inkjet method to form the color conversion layer, damage to the organic EL layer due to components entering through the protective layer becomes significant.
- Japanese Patent Application Laid-Open No. 2008-78038 an organic EL element substrate in which an organic EL layer and the like are separated into a plurality of portions using a partition wall is proposed (see Patent Document 2 and the like).
- the structure of Japanese Patent Application Laid-Open No. 2008-78038 uses a highly directional vapor deposition method to separate the organic EL layer by partition walls, and at the same time, exposes the auxiliary electrode formed on the substrate and has relatively good coverage ( That is, an object is to form a transparent electrode by a sputtering method having a low directivity and to connect the transparent electrode to the auxiliary electrode.
- the organic EL layer itself is formed by inkjet or the like, it is well known to form orthogonal lattice shaped partition walls on the organic EL element substrate side.
- a transparent electrode made of a metal that is thin enough to transmit light is formed using a highly directional vapor deposition method similar to the organic EL layer, and the transparent electrode is separated into a plurality of lines by a partition, In addition to uniform control over the entire area, control for each line becomes possible. Accordingly, it can be easily considered that the partition wall is formed on the organic EL element substrate side in terms of control diversity.
- an object of the present invention is to provide an inexpensive organic EL display having a reduced optical loss and high efficiency in a color conversion type top emission organic EL display. Another object of the present invention is to provide a highly reliable large-screen organic EL display that increases the bonding strength of the display region and exhibits high resistance to heat shock and impact. Another object of the present invention is to provide an organic EL display that can be manufactured by an easy method by expanding the selectivity of the filler enclosed in the bonding gap.
- the organic EL display of the present invention is formed by laminating an organic EL element substrate including a substrate, a reflective electrode, an organic EL layer, a partition, a barrier layer, a transparent electrode and a color conversion layer, and a sealing substrate, and the reflective electrode Is composed of a plurality of partial electrodes, the organic EL layer is formed on the reflective electrode, and is composed of a plurality of portions separated by the partition walls, and the transparent electrode is formed on the organic EL layer,
- the barrier layer covers the partition wall and the transparent electrode, and has a recess at a position corresponding to the reflective electrode, and the color conversion layer is formed in the recess of the barrier layer. .
- the refractive index of the color conversion layer is equal to or higher than the refractive index of the barrier layer.
- the sealing substrate may further include a color filter.
- the partition may have a plurality of openings corresponding to the partial electrodes constituting the reflective electrode, and the organic EL layer may be formed in the plurality of openings.
- an auxiliary wiring for a transparent electrode may be further included, and the auxiliary wiring may be connected to the transparent electrode in a region where the organic EL layer is not formed by the partition.
- the partition may be formed of a metal material, and the transparent electrode may be electrically connected to the partition.
- the partition wall is composed of a plurality of stripe-shaped portions arranged in gaps between the plurality of partial electrodes constituting the reflective electrode and extending in one direction, and the organic EL layer is formed of the partition wall. It may be formed in the gap.
- the transparent electrode may be composed of a plurality of stripe portions separated by the partition walls.
- the organic EL display of the present invention can achieve a significant improvement in color conversion efficiency.
- the effect is that (a) in the present invention, the color conversion layer is formed on the barrier layer of the organic EL element substrate to eliminate the distance between the barrier layer and the color conversion layer. (B) a low refractive index between the barrier layer and the color conversion layer, and thus between the light emitting layer and the color conversion layer. The absence of this layer is due to a reduction in reflection loss at the interface of each layer.
- the barrier ribs were formed before the formation of the organic EL layer in the present invention, instead of forming the barrier ribs after the formation of the organic EL layer as in the conventional organic EL element substrate. This is because by forming the partition wall before the formation of the organic EL layer, it is possible to sufficiently take measures against outgas from the partition wall by heat treatment. Furthermore, another factor of this effect is that the organic EL layer is divided into a plurality of portions in the organic EL display of the present invention. This is because even if outgas (moisture or the like) enters the organic EL layer due to propagation from the partition wall, defects called dark areas or dark spots do not propagate in the entire display region.
- the organic EL display of the present invention since there is no bonding gap in the light path from the organic EL layer to the color conversion layer, a conventional material such as a normal adhesive is used as a material to be filled at the time of bonding. Can be used. Increasing the choice of filler materials allows for a simplified manufacturing process and / or reduced manufacturing costs due to lower material costs.
- a structure for example, auxiliary wiring, transparent electrode separation wiring, etc.
- the color conversion layer can be formed by a coating method. This is also advantageous for reducing the manufacturing cost of the organic EL display.
- the organic EL display of the present invention when the organic EL element substrate and the sealing substrate are bonded together, there is a portion to be bonded without interposing the organic EL layer in the entire display region.
- the mechanical strength is increased and the mechanical reliability is improved.
- securing the mechanical strength in the display area will lead to the production of a display with a very narrow frame by eliminating the outer peripheral seal portion in the future.
- FIG. 1 is a top view showing an organic EL display of the present invention.
- FIG. 2A is a diagram showing a cross section taken along the cutting line IIA-IIA of the organic EL display according to the first embodiment of the present invention.
- FIG. 2B is a diagram showing a cross section taken along the cutting line IIB-IIB of the organic EL display according to the first embodiment of the present invention.
- FIG. 3A is a cross-sectional view showing an organic EL display according to a second embodiment of the present invention.
- FIG. 3B is a cross-sectional view showing an organic EL display according to the second embodiment of the present invention.
- FIG. 4A is a cross-sectional view showing an organic EL display according to a third embodiment of the present invention.
- FIG. 4B is a cross-sectional view showing an organic EL display according to a third embodiment of the present invention.
- FIG. 1 is a top view of the organic EL display of the present invention on the sealing substrate 210 side.
- FIG. 1 shows an example in which a black matrix 220 and three types of color filters 230 are formed on a sealing substrate 210.
- the organic EL display shown in FIG. 1 has three types of subpixels indicated by a red color filter 230R, a green color filter 230G, and a blue color filter 230B, and is adjacent to two green subpixels and two blue subpixels.
- a spacer 240 is arranged to do this.
- FIG. 2A and 2B show cross-sectional views of the organic EL display according to the first embodiment of the present invention.
- 2A is a cross-sectional view taken along the cutting line IIA-IIA shown in FIG. 1
- FIG. 2B is a cross-sectional view taken along the cutting line IIB-IIB shown in FIG.
- a patterned conductive layer 121 and an insulating layer 122 are formed on the TFT substrate 110 to form drive circuit wiring.
- the drive circuit wiring is covered with a protective layer 123 except for a contact hole for connecting the conductive layer 121 to the reflective electrode 142.
- a planarization layer 131 is formed so as to cover the protective layer 123, and the upper surface of the planarization layer 131 is planarized.
- a contact hole for connecting the conductive layer 121 and the reflective electrode 142 is also formed in the planarization layer 131.
- the planarization layer 131 is formed using any resin material known in the art, and the contact hole can be formed by patterning by a photolithography method.
- an inorganic passivation layer 132 for blocking outgas from the planarization layer 131 is formed.
- a contact hole for connecting the conductive layer 121 and the reflective electrode 142 is also formed in the inorganic passivation layer 132.
- the conductive layer 121 is electrically connected to the reflective electrode 142 in the contact hole formed in alignment with the protective layer 123, the planarization layer 131, and the inorganic passivation layer 132.
- a base layer 141 for the reflective electrode is formed using a conductive oxide such as IZO or ITO.
- the underlayer 141 is a layer provided as necessary.
- the base layer 141 is connected to the conductive layer 121 (a part of the TFT element) on the bottom surface of the contact hole provided in the protective layer 123, the planarization layer 131, and the inorganic passivation layer 132.
- the reflective electrode 142 is formed on the base layer 141.
- the reflective electrode 142 may be a single layer film of a highly reflective metal material such as MoCr, CrB, Ag, Ag alloy, or Al alloy, or a highly conductive metal material and a transparent conductive oxide such as IZO or ITO. It may be a laminated film with a material.
- the transparent conductive oxide material is effective for protecting a highly reflective metal material and adjusting the optical distance in the resulting organic EL display.
- the reflective electrode 142 is directly connected to the conductive layer 121 (a part of the TFT element) on the bottom surface of the contact hole.
- the base layer 141 is divided into a plurality of portions, and each portion is formed at a position corresponding to the light emitting portion (subpixel in the configuration of FIGS. 1 to 2B). Therefore, the reflective electrode 142 is also composed of a plurality of partial electrodes formed at positions corresponding to the light emitting part.
- an insulating film 143a is formed so as to cover the shoulders of the partial electrodes constituting the reflective electrode 142.
- the insulating film 143a is formed of an inorganic material or an organic material (such as polyimide) that can perform sufficient degassing and drainage treatment.
- 2A and 2B show a structure in which the insulating film 143a is covered with an insulating film barrier layer 143b which may be optionally provided.
- the insulating film barrier layer 143b is preferably formed using an inorganic material.
- the insulating film barrier layer 143b is effective in preventing outgas such as moisture from entering the organic EL layer 160 and the like from the insulating film 143a, particularly when the insulating film 143a is formed of an organic material.
- a partition wall 150 is formed on the insulating film 143a and the insulating film barrier layer 143b.
- the partition wall 150 includes a plurality of stripe-shaped portions extending in the vertical direction (direction of the cutting line IIB-IIB) and a plurality of extending portions in the horizontal direction (direction of the cutting line IIA-IIA) perpendicular to the first direction. And a plurality of openings. In each of the openings of the partition 150, the partial electrodes constituting the reflective electrode 142 are exposed.
- the partition wall 150 is preferably used as a bank when the color conversion layer 190 is formed later, and preferably has a height from the surface of the reflective electrode 142 of 3 to 7 ⁇ m.
- the partition wall 150 may be formed using either an organic material or an inorganic material.
- an organic material it is desirable to use an organic material from the viewpoint of easily increasing the film thickness and suppressing the manufacturing cost.
- the partition wall 150 preferably has a reverse tapered cross section in order to divide the organic EL layer 160 formed by a vapor deposition method into a plurality of portions.
- the inorganic material that can be used for forming the partition wall 150 includes a metal.
- the partition wall 150 can be formed using a plating method or the like in order to ensure the height from the surface of the reflective electrode 142.
- the partition 150 may have a cross-sectional shape such as a reverse taper shape or a rectangular shape (see Patent Document 3).
- Metal materials that can be used to form the partition 150 include Cu, Al, Ag, Au, Ni, Mo, and Ti.
- the metal partition wall 150 functions as an auxiliary wiring for the transparent electrode 170 to be formed later, particularly when a light emitting part having a relatively small size is provided, and causes uneven brightness and power consumption due to a reduction in wiring resistance of the transparent electrode 170. It is effective in suppressing the increase of
- the organic EL layer 160 is laminated on the laminate in which the partition wall 150 is formed.
- the organic EL layer 160 includes at least an organic light emitting layer, and may further include one or more layers for facilitating injection and / or transport of electrons and / or holes.
- any material known in the prior art can be used.
- the organic EL layer 160 is formed on the upper surface of the reflective electrode 142 (including the upper surface of the insulating film barrier layer 143b around the reflective electrode 142) and the upper surface of the partition 150. Is done.
- the organic EL layer 160 formed on the upper surface of the reflective electrode 142 is separated into a plurality of portions by the partition 150.
- the plurality of portions of the organic EL layer 160 are formed in one-to-one correspondence with the plurality of partial electrodes constituting the reflective electrode 142.
- the organic EL layer 160 is formed separately for each of a plurality of light emitting portions (subpixels).
- each of the plurality of portions of the organic EL layer 160 formed on the upper surface of the reflective electrode 142 is not in contact with the side surface of the partition wall 150.
- the organic EL layer 160 formed on the upper surface of the reflective electrode 142 that participates in light emission does not come into contact with the partition wall 150, and the transparent electrode 170 (described later) interposed between the partition wall 150 prevents moisture from entering the partition wall 150. Can be blocked.
- the organic EL layer 160 is separated into a plurality of portions.
- the deterioration of the organic EL layer 160 occurs only in the portion where moisture enters, and the deterioration (that is, a region called a dark spot or a dark area) does not propagate to the entire organic EL layer 160. Similarly, even when a defect exists in the insulating film barrier layer 143b and outgas enters through the insulating film 143a, the deterioration does not propagate to the entire organic EL layer 160.
- a transparent electrode 170 is formed on the organic EL layer 160.
- the transparent electrode 170 in the present invention may be transparent or translucent.
- the transparent electrode 170 can be formed by depositing a transparent conductive oxide such as ITO or IZO by a sputtering method.
- the transparent electrode 170 is formed so as to cover the upper surface of the organic EL layer 160 and the upper surface and side surfaces of the partition wall 150.
- a highly transparent metal thin film (not shown) such as MgAg or Au may be formed before the deposition of the transparent conductive oxide.
- the metal thin film desirably has a thickness of about several nm.
- the transparent electrode 170 is connected to a power supply line or a GND wiring in a contact hole different from the contact hole for the light emitting part shown in FIG.
- a barrier layer 180 is formed so as to cover the structure below the transparent electrode 170.
- the barrier layer 180 is a layer for preventing moisture and gas from the outside from entering the organic EL layer 160.
- the barrier layer 180 since the barrier layer 180 exists on the path for extracting light emitted from the organic EL layer 160, it is desirable to have a high transmittance.
- the barrier layer 180 is as high as the transparent electrode 170. It is desirable to have a refractive index.
- As the barrier layer 180 a single layer film or a laminated film of SiN or SiON can be used.
- the barrier layer 180 can be formed by sputtering, CVD, or the like. In order to pursue better coverage, it is desirable to form the barrier layer 180 by a CVD method. As a result, a barrier layer 180 is formed in which the gap between the partition walls 150 (that is, the position corresponding to the reflective electrode 142) is a recess.
- a color conversion layer 190 composed of a plurality of portions is formed in the recess of the barrier layer 180 formed due to the height of the partition wall 150.
- the color conversion layer 190 including a plurality of portions is formed using the partition wall 150 covered with the barrier layer 180 as a bank.
- FIG. 2A shows an example in which two types of color conversion layers 190 including a red conversion layer 190R and a green conversion layer 190G are formed.
- the color conversion layer 190 can be formed using a broad application method such as an inkjet method, a dispenser method, or a printing method.
- the color conversion layer 190 preferably has a refractive index equal to or higher than that of the barrier layer 180. By having such a refractive index, reflection at the interface between the barrier layer 180 and the color conversion layer 190 can be prevented, and the incident efficiency of the light emission of the organic EL layer 160 to the color conversion layer 190 can be improved.
- a protective layer (not shown) is provided on the color conversion layer 190 for the purpose of preventing deterioration of the color conversion layer 190 and elution of the color conversion material into the filler when the filler is sealed in the bonding gap. Further, it may be provided.
- the protective layer can be formed using an inorganic material or a resin.
- the organic EL display of this embodiment is obtained by bonding the sealing substrate 210 to the organic EL element substrate formed as described above.
- the sealing substrate 210 may be a plate-like member made of a transparent material, or may be one in which the color filter 230 and / or the black matrix 220 is formed on the plate-like member.
- 2A and 2B show an example in which the black matrix 220 and the color filter 230 including the red color filter 230R, the green color filter 230G, and the blue color filter 230B are provided on the sealing substrate 210.
- the sealing substrate 210 can be formed using a transparent material such as glass.
- the black matrix 220 and the color filter 230 can be formed using a commercially available flat panel display material.
- the black matrix 220 is formed to have an opening at a position corresponding to a light emitting portion (corresponding to a position of the subpixel, the reflective electrode 142, etc.) of the organic EL element substrate.
- the color filter 230 is formed at a position corresponding to a desired light emitting portion (subpixel) of the organic EL element substrate.
- the spacer 240 may be formed on any substrate.
- the spacer 240 it is convenient to form the spacer 240 on the barrier layer 180 formed on the partition wall 150. In this case, it is not necessary to provide the spacer 240 on all of the partition walls 150.
- spacers are provided only at positions where the stripe-shaped portions of the partition wall 150 are adjacent to each other, adjacent to two green light emitting portions (subpixels) and two blue light emitting portions (subpixels). 240 can be provided.
- the spacer 240 when providing the spacer 240 on the sealing substrate 210, it is preferable to provide the spacer 240 in a portion other than the light emission passage path of the organic EL layer 160.
- the spacer 240 may be provided on the black matrix 220 or on the overlapping portion of the black matrix 220 and the color filter 230. Good.
- the organic EL element substrate and the sealing substrate 210 are bonded together.
- the color filter 230 and the black matrix 220 are provided on the sealing substrate 210 as shown in FIGS. 2A and 2B, the position of the light emitting portion of the organic EL element substrate and the position of the opening portion of the black matrix 220 on the sealing substrate 210 Paste them so that they match exactly.
- the bonding can be performed using, for example, a UV curable adhesive provided on the periphery of the organic EL element substrate or the sealing substrate 210 so as to surround the display region of the organic EL element substrate.
- a bonding gap formed between the organic EL element substrate and the sealing substrate 210 may be filled with gas (atmospheric gas during bonding).
- gas atmospheric gas during bonding
- a method of filling a liquid material at the time of bonding includes, for example, a vacuum drop bonding method.
- the organic EL layer 160 having low mechanical strength is not formed in the region where the partition wall 150 is formed. Therefore, when bonding is performed by filling the bonding gap with a liquid adhesive, the region where the partition wall 150 is formed contributes to the improvement of the adhesive strength with the sealing substrate 210. Therefore, in the organic EL display of the present invention, it is possible to ensure the mechanical strength of bonding in the display area, and to narrow the periphery of the display area called a “picture frame”. This may eliminate the need for a UV curable adhesive (so-called “peripheral seal portion”) provided on the peripheral edge of the substrate in the future.
- FIG. 3A and FIG. 3B show sectional views of a second embodiment of the organic EL display of the present invention.
- the cross sections of FIGS. 3A and 3B correspond to the cross sections shown in FIGS. 2A and 2B, respectively.
- This embodiment has an auxiliary wiring 145 that is advantageous for expanding the dimensions of the organic EL display.
- the auxiliary wiring 145 is effective in suppressing the occurrence of luminance unevenness due to the wiring resistance of the transparent electrode 170 and the increase in power consumption.
- the structure below the inorganic passivation layer 132 of the organic EL display of this embodiment is the same as that of the first embodiment, and can be formed by the same method as described above.
- the base layer 144 and the auxiliary wiring 145 for the auxiliary wiring are formed, respectively. That is, since the auxiliary wiring 145 is formed of a low-resistance metal material, it has a lower resistance than the transparent electrode 170 formed of a transparent conductive oxide.
- Each of the base layer 144 and the auxiliary wiring 145 includes a plurality of portions. Each of the plurality of portions is formed in the gap between the base layer 141 and the reflective electrode 142 forming the light emitting portion.
- the auxiliary wiring 145 is connected to a power supply line, a GND wiring, or the like in a contact hole different from the contact hole for the light emitting portion illustrated in FIG.
- an insulating film 143 is formed so as to cover the shoulders of the partial electrodes constituting the reflective electrode 142.
- an opening for connecting the auxiliary wiring 144 and the transparent electrode 170 is formed in the insulating film 143.
- the insulating film 143 can be formed using the same material and process as the insulating film 143a of the first embodiment.
- the insulating film barrier layer may be formed on the condition that the opening of the insulating film 143 is not blocked.
- a partition wall 150 is formed on the insulating film 143.
- the partition 150 according to the present embodiment has a reverse taper-shaped cross-sectional shape, and is arranged so that the opening of the insulating film 143 on the rope-fitting wiring 145 is positioned below the upper surface of the partition 150. With such a cross-sectional shape and arrangement, an organic EL layer 160 described later can be formed so as not to block the opening of the insulating film 143.
- the organic EL layer 160 and the transparent electrode 170 are formed using the same method and materials as in the first embodiment. Similar to the first embodiment, the organic EL layer 160 is formed by separating the light emitting units by the partition 150. Since the transparent electrode 170 is formed by a sputtering method having excellent coverage, the transparent electrode 170 is formed on the upper and side surfaces of the partition wall and the upper surface of the organic EL layer 160, and below the upper surface of the partition wall where the organic EL layer 160 is not formed. It is electrically connected to the auxiliary wiring 145. By connecting to the low resistance auxiliary wiring 145, the wiring resistance of the transparent electrode 170 can be reduced, and the occurrence of uneven brightness and the increase in power consumption can be suppressed.
- the partition wall 150 has a height of about 1.5 to 3 ⁇ m.
- the partition 150 in order to use the partition 150 as a bank for separating the color conversion layer 190, the partition 150 preferably has a height of 3 to 7 ⁇ m.
- the barrier layer 180 and the color conversion layer 190 can be formed by the same method and material as in the first embodiment.
- the sealing substrate 210 may also have the same material and configuration (color filter 230, black matrix 220, etc.) as in the first embodiment. Bonding with the sealing substrate 210 can also be performed by the same method as in the first embodiment.
- the organic EL display according to the present embodiment is suitable when the area of the light emitting portion is reduced due to the presence of the auxiliary wiring 144 and thus has a relatively large light emitting portion size.
- the dimension of the light emitting portion is relatively small, it is effective to form the metal partition 150 in the first embodiment and use the partition 150 as an auxiliary wiring.
- FIG. 4A and FIG. 4B show sectional views of a third embodiment of the organic EL display of the present invention.
- 4A and 4B correspond to the cross sections shown in FIGS. 2A and 2B, respectively.
- the organic EL layer 160 composed of a plurality of parts separated for each light emitting section column (subpixel array), and the transparent electrode composed of a plurality of partial electrodes separated for each light emitting section array (subpixel array) 170.
- the transparent electrode 170 composed of a plurality of partial electrodes enables various controls such as current measurement for each light emitting section row and voltage control for each light emitting section row.
- the structure below the insulating film 143 of the organic EL display of this embodiment is the same as that of the second embodiment, and can be formed by the same method as described above.
- 4A and 4B show the configuration in which the insulating film barrier layer is not provided, the insulating film barrier layer can also be formed in this embodiment.
- the partition wall 150 in the present embodiment is composed of a plurality of stripe-shaped portions extending in one direction. Each of the striped portions of the partition wall 150 is disposed in the gap between the plurality of partial electrodes constituting the reflective electrode 142.
- 4A and 4B show an example of the partition wall 150 extending in the vertical direction (the direction of the cutting line IIB-IIB in FIG. 1). Except for the above points, the partition wall 150 can be formed by the same material and method as in the first embodiment.
- the organic EL layer 160 is formed using the same material and method as in the first embodiment. Similar to the first embodiment, the organic EL layer 160 is formed on the upper surface of the reflective electrode 142 and the upper surface of the partition wall 150. However, unlike the case of the first embodiment shown in FIG. 2B, in the present embodiment, as shown in FIG. 4B, an organic EL layer 160 composed of a plurality of stripe-like portions that are continuous in the light emitting part row is obtained.
- the transparent electrode 170 is formed using a translucent metal material such as MgAg or Au.
- the transparent electrode 170 of this embodiment has a thickness of about 10 to 50 nm.
- a vapor deposition method is used to form the transparent electrode 170.
- the metal material film is formed on the reflective electrode 142 and the partition wall 150 on the upper surface of the organic EL layer 160.
- the portion formed on the upper surface of the organic EL layer 160 functions as the transparent electrode 170, and the metal film 171 formed on the partition 150 is separated from the transparent electrode 170 and does not function as an electrode. Therefore, as shown in FIG. 4B, the transparent electrode 170 is composed of a plurality of stripe-shaped partial electrodes extending in the same direction as the partition wall 150.
- Each of the plurality of partial electrodes constituting the transparent electrode 170 is connected to a power supply line, a GND wiring, or the like in a contact hole different from the contact hole for the light emitting part shown in FIG. .
- the partition wall 150 desirably has a height of about 1.5 to 3 ⁇ m.
- the partition 150 in order to use the partition 150 as a bank for separating the color conversion layer 190, the partition 150 preferably has a height of 3 to 7 ⁇ m.
- the barrier layer 180 and the color conversion layer 190 can be formed by the same method and material as in the first embodiment.
- the sealing substrate 210 may also have the same material and configuration (color filter 230, black matrix 220, etc.) as in the first embodiment. Bonding with the sealing substrate 210 can also be performed by the same method as in the first embodiment.
- the transparent electrode 170 is separated into a plurality of partial electrodes for each light emitting section row, it is possible to measure a current for each light emitting section row. In addition, it is possible to perform more various controls of the organic EL display, such as controlling the voltage for each light emitting unit row.
- Example 1 This example is an example of the organic EL display according to the first embodiment of the present invention.
- the organic EL display of this embodiment has a nominal size of 3 inches, and each pixel has a size of 60 ⁇ m ⁇ 180 ⁇ m ⁇ RGB. Further, a color filter substrate in which a black matrix 220 and three kinds of color filters 230 are formed on a sealing substrate 210 was used.
- a planarization layer 131 was formed on the protective layer 123.
- the planarization layer 131 was patterned by a photolithographic method to form a contact hole having a dimension of 20 ⁇ m square for connecting the conductive layer 121 and the reflective electrode 142 for each subpixel (light emitting portion).
- an IZO film having a thickness of 50 nm was formed by RF-planar magnetron sputtering in an Ar atmosphere.
- a resist agent “OFRP-800” manufactured by Tokyo Ohka Kogyo Co., Ltd.
- the IZO film is wet-etched using the pattern as a mask to separate a plurality of subpixels.
- An underlayer 141 composed of the portion was formed. Each portion constituting the base layer 141 was connected to the conductive layer 121 through a contact hole formed in the planarization layer 131 and the inorganic passivation layer 132.
- an Ag alloy film having a thickness of 200 nm was formed using a sputtering method so as to cover the base layer 141, and patterning was performed using the same process, so that a reflective electrode 142 composed of a plurality of portions was formed. Each of the plurality of portions constituting the reflective electrode 142 was disposed so as not to protrude from the base layer 141.
- a novolac photosensitive resin film having a thickness of 1 ⁇ m was applied using a spin coating method.
- patterning is performed to form an insulating film 143a so as to provide an opening on the reflective electrode 142 that is 2 to 4 ⁇ m wider in both vertical and horizontal directions than the light emitting portion dimension (about 36 ⁇ m ⁇ about 150 ⁇ m).
- the obtained insulating film 143a was baked at about 230 ° C., and outgas such as moisture was sufficiently discharged.
- a 300 nm-thickness SiN film was formed by CVD.
- the SiN film obtained by using the dry etching method was patterned to form the opening having the above-described light emitting portion dimensions, and the insulating film barrier layer 143b was formed. By this operation, the insulating film 143a was completely covered with the insulating film barrier layer 143b.
- the insulating film barrier layer 143b has openings for providing necessary electrical connection portions at the peripheral portions of the display areas of the plurality of display portions arranged on the substrate. Had.
- a photosensitive resin manufactured by Hitachi Chemical Co., Ltd., CR-600
- the light emitting portion is composed of a plurality of stripe portions extending in the vertical and horizontal directions.
- a partition wall 150 having an opening at a position corresponding to is formed.
- Each of the stripe-shaped portions of the partition wall 150 had a reverse tapered (reverse trapezoidal) cross section having an upper base of about 10 ⁇ m, a lower base of about 6 ⁇ m, and a height from the electrode surface of about 5 ⁇ m.
- the obtained partition 150 was baked at about 220 ° C., and outgas such as moisture was discharged. By this operation, a partition wall 150 having a lateral opening width of about 50 ⁇ m was obtained for a lateral subpixel pitch of 60 ⁇ m.
- the “lateral direction” in the present embodiment is the left-right direction in FIG. 2A.
- a buffer layer having a thickness of 1.5 nm made of Li is formed on the reflective electrode 142 and the upper surface of the partition wall 150 by an evaporation method using a mask having openings corresponding to display areas of a plurality of display portions arranged on the substrate.
- the laminated body on which the damage alleviating layer was formed was moved to the counter sputtering apparatus without breaking the vacuum.
- IZO having a thickness of 200 nm was deposited to obtain a transparent electrode 170.
- the IZO film was formed on the organic EL layer 160 including the upper surface of the partition wall 150 and on the side surface of the partition wall 150 to provide a transparent electrode 170 that functions as an integrated electrode in each of the display portions.
- the transparent electrode 170 was connected to the conductive layer 121 through a contact hole (not shown) at the periphery of the display area of each display part.
- the organic EL layer 160 in each light-emitting portion is a layer formed of an inorganic material, and the reflective electrode 142 and the inorganic passivation layer 132 therebelow, the insulating film barrier layer 143b, and the transparent electrode 170. Besieged.
- a barrier layer 180 was formed by depositing a 2 ⁇ m thick SiN film by CVD.
- the resulting barrier layer 180 had a refractive index of about 1.8.
- the laminate on which the barrier layer 180 was formed was placed in a multi-nozzle ink jet apparatus (landing accuracy ⁇ 5 ⁇ m) installed in an environment having an oxygen concentration of 50 ppm or less and a moisture concentration of 50 ppm or less.
- the color conversion material ink was deposited on the barrier layer in the bank due to the partition wall 150.
- Ink adhesion was carried out under the condition that the ink droplets in flight became a sphere having a diameter of about 30 ⁇ m.
- 3 ink droplets were deposited in each bank. After ink droplets were attached to the entire substrate, the ink was dried by heating to 100 ° C.
- the ink for forming the red color conversion layer 190R is 1000 parts by weight of toluene and 50 parts by weight of a pigment mixture of coumarin 6 and DCM (molar ratio of coumarin 6 to DCM is 48: 2). It was a mixture of In addition, the ink for forming the green conversion layer 190G is a mixture of 1000 parts by weight of toluene and 50 parts by weight of a pigment mixture of coumarin 6 and DEQ (molar ratio of coumarin 6 and DEQ is 48: 2). there were.
- CK-7001 (available from FUJIFILM Corporation) is coated on a 200 mm ⁇ 200 mm ⁇ 0.7 mm non-alkali glass (Corning Eagle 2000) sealing substrate 210, and patterning is performed by a photolithographic method.
- a black matrix 220 having a film thickness of 1 ⁇ m was formed in the display areas of the plurality of display portions.
- the black matrix 220 has a structure in which a plurality of openings of 46 ⁇ m ⁇ 160 ⁇ m are arranged in the vertical direction and the horizontal direction.
- the horizontal line width (interval between openings in the horizontal direction) was 14 ⁇ m
- the vertical line width (interval between openings in the vertical direction) was 20 ⁇ m.
- CR-7001, CG-7001 and CB-7001 are applied and patterned, and a red color filter 230R and a green color filter 230G having a film thickness of 1.5 ⁇ m, respectively. And the blue color filter 230B was formed.
- Each color filter 230 was composed of a plurality of stripe-like portions extending in the vertical direction.
- photosensitive resin manufactured by Hitachi Chemical Co., Ltd., CR-600, two black matrix 220 openings provided with a green color filter 230G and two black matrix 220 openings provided with a blue color filter 230B.
- the organic EL element substrate and the color filter substrate obtained as described above were moved into a bonding apparatus installed in an environment having an oxygen concentration of 5 ppm or less and a water concentration of 5 ppm or less.
- a color filter substrate is placed with the surface on which the spacer 240 is formed facing upward, and an epoxy UV curable adhesive (XNR-, manufactured by Nagase ChemteX) is used on the outer periphery of the region corresponding to the plurality of display portions using a dispenser. 5516) was applied seamlessly.
- a mechanical lightweight valve discharge accuracy within ⁇ 5%
- a lower viscosity thermosetting epoxy adhesive (refractive index of about 1.5) is applied to the center of the area corresponding to the multiple display parts. It was dripped.
- the surface of the organic EL element substrate on which the color conversion layer 190 was formed was placed downward and opposed to the color filter substrate to which an adhesive was applied.
- the inside of the apparatus was depressurized to about 10 Pa or less, and the two substrates were kept close to each other until the distance between the substrates was about 30 ⁇ m while maintaining them in parallel.
- both substrates were aligned by the alignment mechanism. Thereafter, a slight load was applied between both substrates while returning the internal pressure of the apparatus to atmospheric pressure. At this time, the thermosetting epoxy adhesive spreads from the central portion of the region corresponding to the plurality of display portions toward the peripheral portion. The approach of both substrates stopped when the tip of the spacer 240 contacted the partition wall 150 of the organic EL element substrate.
- thermosetting epoxy adhesive was spread over the entire region corresponding to each display portion. Generation of bubbles in the region and protrusion of the outer periphery of the region from the UV curable adhesive were not observed.
- the temporary bonded body was divided into areas corresponding to individual display portions.
- the divided display was heated to 80 ° C. for 1 hour in a heating furnace to cure the thermosetting epoxy adhesive, and then naturally cooled over 30 minutes.
- the barrier layer 180 on the IC connection pad which is a terminal part for connection with an external drive circuit was removed by a dry etching method to obtain a plurality of organic EL displays.
- the organic EL display of the present example obtained as described above, a color conversion layer is provided on the color filter of the color filter substrate instead of the organic EL element substrate, and a special resin having a refractive index of 1.7 is bonded to the gap.
- the efficiency was improved by about 30%. Since the thermosetting epoxy adhesive used for filling the bonding gap in this example is a general-purpose adhesive, the manufacturing cost could be reduced.
- the organic EL display of this example was subjected to a high temperature storage test, no significant expansion of defects called dark areas or dark spots was observed. Further, the organic EL display of this example was subjected to a heat shock test, but no damage or the like occurred.
- Example 2 This example is another example of the organic EL display according to the first embodiment of the present invention.
- the organic EL display of this embodiment has a nominal size of 3 inches, and each pixel has a size of 60 ⁇ m ⁇ 180 ⁇ m ⁇ RGB. Further, a color filter substrate in which a black matrix 220 and three kinds of color filters 230 are formed on a sealing substrate 210 was used.
- an inorganic passivation layer 132 and lower layers were formed by the same procedure as in Example 1.
- the partition wall 150 is composed of a plurality of stripe-like portions extending in the vertical direction and the horizontal direction, and has openings at positions corresponding to the respective light emitting portions. Moreover, the stripe-shaped part which comprises the partition 150 had the rectangular cross-sectional shape which has a width
- an organic EL layer 160 was formed by the same procedure as in Example 1.
- the organic EL layer 160 was formed on the upper surface of the reflective electrode 142 and the upper surface of the partition 150, and was not formed on the side surface of the partition 150.
- a transparent electrode 170 was formed by the same procedure as in Example 1.
- the transparent electrode 170 was continuously formed on the upper surface of the organic EL layer and the side surfaces and the upper surface of the partition wall 150, and was electrically connected to the partition wall 150 formed of Cu.
- the barrier layer 180 is formed, the color filter substrate is formed, the organic EL element substrate and the color filter substrate are bonded together, and the plurality of display portions are separated by the same procedure as in the first embodiment. Got a display.
- the organic EL display of this example also showed the same effect as the display of Example 1.
- the organic EL layer 160 and the bottom of the partition 150 are in contact with each other, there is no transmission of moisture from the partition 150 to the organic EL layer 160 because the partition 150 is made of metal. It is considered that the same effect as 1 was obtained.
- the wiring resistance of the transparent electrode 170 was reduced by the conductive partition wall 150 made of Cu, the luminance unevenness did not stand out.
- This example is an example of the organic EL display according to the second embodiment of the present invention.
- the organic EL display of this example has a nominal size of 6 inches, and each pixel has a size of 100 ⁇ m ⁇ 300 ⁇ m ⁇ RGB. Further, a color filter substrate in which a black matrix 220 and three kinds of color filters 230 are formed on a sealing substrate 210 was used.
- a layer below the inorganic passivation layer 132 was formed by the same procedure as in Example 1 except that the dimensions of each pixel were changed.
- the IZO film is formed by the sputtering method and the IZO film is patterned by the same procedure as in the first embodiment, and the base layer 141 composed of a plurality of parts separated for each sub-pixel and the sub-layer adjacent in the horizontal direction are formed.
- a base layer 144 for auxiliary wiring composed of a plurality of stripe portions having a width of 16 ⁇ m was formed in the gap between the pixels.
- the stripe-like portion of the base layer 144 for auxiliary wiring extends to the outer peripheral portion of the display portion along the sub-pixel columns arranged in the vertical direction, and is connected to a power supply line provided on the outer peripheral portion of the display portion.
- an Ag alloy film having a thickness of 200 nm is formed using a sputtering method so as to cover the base layer 141, and is patterned using a similar process, so that the reflective electrode 142 including a plurality of portions and a plurality of stripes are formed.
- a part of auxiliary wiring 145 was formed.
- Each of the plurality of portions constituting the reflective electrode 142 was disposed so as not to protrude from the base layer 141.
- each of the stripe portions of the auxiliary wiring 145 is arranged so as not to protrude from the base layer 144 for auxiliary wiring.
- a polyimide photosensitive resin film having a film thickness of 1 ⁇ m was applied by using a spin coating method, and patterned by a photolithographic method to form an insulating film 143.
- the insulating film 143 has an opening of 60 ⁇ m wide ⁇ 270 ⁇ m long on the reflective electrode 142 and a stripe-shaped opening extending in the vertical direction on the auxiliary wiring 145.
- the stacked body on which the insulating film 143 was formed was baked at about 250 ° C., and outgas such as moisture was sufficiently discharged.
- a photosensitive resin manufactured by Hitachi Chemical Co., Ltd., CR-600
- patterning is performed by a photolithographic method to form a plurality of stripe portions extending in the vertical and horizontal directions. Formed.
- the partition 150 has an opening at a position corresponding to each light emitting portion.
- Each of the stripe portions of the partition wall 150 had a reverse tapered (reverse trapezoidal) cross section having an upper base of about 14 ⁇ m, a lower base of about 6 ⁇ m, and a height from the electrode surface of about 7 ⁇ m.
- the opening provided in the insulating film 143 on the auxiliary wiring 145 was positioned below the upper surface of the partition wall 150.
- the obtained partition 150 was baked at about 220 ° C., and outgas such as moisture was discharged. By this operation, a partition wall 150 having a lateral opening width of about 86 ⁇ m was obtained for a lateral subpixel pitch of 100 ⁇ m.
- an organic EL layer 160 was formed by the same procedure as in Example 1.
- the organic EL layer 160 was separated for each light emitting portion by the partition 150 in the same manner as in Example 1. Further, the organic EL layer 160 did not contact the side surface of the partition wall 150 and did not completely block the opening of the insulating film 143 on the auxiliary wiring 145.
- a transparent electrode 170 was formed by the same procedure as in Example 1. At this time, the transparent electrode 170 was formed along the side surface of the partition 150 in addition to the top surface of the organic EL layer 160 and the top surface of the partition 150, and connected to the auxiliary wiring 145 through the opening of the insulating film 143.
- the barrier layer 180 is formed, the color filter substrate is formed, the organic EL element substrate and the color filter substrate are bonded together, and the plurality of display portions are separated by the same procedure as in the first embodiment. Got a display.
- the organic EL display of this example also showed the same effect as the display of Example 1.
- the luminance unevenness did not stand out because the wiring resistance of the transparent electrode 170 was reduced by the auxiliary wiring 145 in spite of the enlargement of the display.
- Example 4 This example is an example of the organic EL display according to the third embodiment of the present invention.
- the organic EL display of this embodiment has a nominal size of 3 inches, and each pixel has a size of 60 ⁇ m ⁇ 180 ⁇ m ⁇ RGB. Further, a color filter substrate in which a black matrix 220 and three kinds of color filters 230 are formed on a sealing substrate 210 was used.
- an inorganic passivation layer 132 and lower layers were formed by the same procedure as in Example 1.
- a photosensitive resin manufactured by Hitachi Chemical Co., Ltd., CR-600
- a photolithographic method to form a partition wall 150 composed of a plurality of stripe portions extending in the vertical direction.
- the stripe portion of the partition wall 150 was located in the gap between the light emitting portion rows extending in the vertical direction.
- Each of the stripe-shaped portions of the partition wall 150 had a reverse tapered (reverse trapezoidal) cross section having an upper base of about 10 ⁇ m, a lower base of about 6 ⁇ m, and a height from the electrode surface of about 5 ⁇ m.
- the obtained partition 150 was baked at about 220 ° C., and outgas such as moisture was discharged. By this operation, a partition wall 150 having a lateral opening width of about 50 ⁇ m was obtained for a lateral subpixel pitch of 60 ⁇ m.
- an organic EL layer 160 was formed by the same procedure as in Example 1.
- the organic EL layer 160 was formed on the upper surface of the reflective electrode 142 and the upper surface of the partition 150, and was not formed on the side surface of the partition 150.
- the organic EL layer 160 of this example was composed of a plurality of stripe portions extending in the vertical direction.
- the laminated body on which the organic EL layer 160 was formed was moved to another chamber of a resistance heating vapor deposition apparatus to form an MgAg film having a thickness of about 30 nm.
- the MgAg film was located on the organic EL layer 160 and was separated into a transparent electrode 170 composed of a plurality of stripe-shaped portions extending in the vertical direction and an MgAg film 171 formed on the partition 150.
- the barrier layer 180 is formed, the color filter substrate is formed, the organic EL element substrate and the color filter substrate are bonded together, and the plurality of display portions are separated by the same procedure as in the first embodiment. Got a display.
- the organic EL display of this example also showed the same effect as the display of Example 1.
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Abstract
Description
本実施例は、本発明の第1の実施形態の有機ELディスプレイの例である。本実施例の有機ELディスプレイは、3インチの公称寸法を有し、各画素は、60μm×180μm×RGBの寸法を有する。また、封止基板210の上にブラックマトリクス220および3種のカラーフィルタ230を形成したカラーフィルタ基板を用いた。
本実施例は、本発明の第1の実施形態の有機ELディスプレイの別の例である。本実施例の有機ELディスプレイは、3インチの公称寸法を有し、各画素は、60μm×180μm×RGBの寸法を有する。また、封止基板210の上にブラックマトリクス220および3種のカラーフィルタ230を形成したカラーフィルタ基板を用いた。
本実施例は、本発明の第2の実施形態の有機ELディスプレイの例である。本実施例の有機ELディスプレイは、6インチの公称寸法を有し、各画素は、100μm×300μm×RGBの寸法を有する。また、封止基板210の上にブラックマトリクス220および3種のカラーフィルタ230を形成したカラーフィルタ基板を用いた。
本実施例は、本発明の第3の実施形態の有機ELディスプレイの例である。本実施例の有機ELディスプレイは、3インチの公称寸法を有し、各画素は、60μm×180μm×RGBの寸法を有する。また、封止基板210の上にブラックマトリクス220および3種のカラーフィルタ230を形成したカラーフィルタ基板を用いた。
121 導電層
122 絶縁層
123 保護層
131 平坦化層
132 無機パッシベーション層
141 反射電極用の下地層
142 反射電極
143、143a 絶縁膜
143b 絶縁膜用のバリア層
144 補助配線用の下地層
145 補助配線
150 隔壁
160 有機EL層
170 透明電極
171 金属膜
180 バリア層
190(R,G) 色変換層
210 封止基板
220 ブラックマトリクス
230(R,G,B) カラーフィルタ
240 スペーサ
Claims (10)
- 基板、反射電極、有機EL層、隔壁、バリア層、透明電極および色変換層を含む有機EL素子基板と、
封止基板と
を貼り合わせて形成されている有機ELディスプレイであって、
前記反射電極は複数の部分電極から構成され、
前記有機EL層は、前記反射電極上に形成され、前記隔壁によって分離された複数の部分から構成され、
前記透明電極は、前記有機EL層上に形成され、
前記バリア層は、前記隔壁および前記透明電極を覆い、かつ、前記反射電極に相当する位置に凹部を有し、
前記色変換層は、前記凹部内に形成されている
ことを特徴とする有機ELディスプレイ。 - 前記色変換層の屈折率は前記バリア層の屈折率以上であることを特徴とする請求項1に記載の有機ELディスプレイ。
- 前記封止基板がカラーフィルタをさらに含むことを特徴とする請求項1に記載の有機ELディスプレイ。
- 前記隔壁は、前記反射電極を構成する部分電極のそれぞれに対応する複数の開口部を有し、有機EL層は、前記複数の開口部内に形成されていることを特徴とする請求項1に記載の有機ELディスプレイ。
- 透明電極用の補助配線をさらに含み、前記補助配線は、前記隔壁によって前記有機EL層が形成されていない領域において前記透明電極と接続していることを特徴とする請求項4に記載の有機ELディスプレイ。
- 前記隔壁が金属材料から形成され、前記透明電極が前記隔壁と電気的に接続していることを特徴とする請求項4に記載の有機ELディスプレイ。
- 前記隔壁は、前記反射電極を構成する複数の部分電極の間隙に配置され1つの方向に延びる複数のストライプ状部分からなり、前記有機EL層は、前記隔壁の間隙に形成されていることを特徴とする請求項1に記載の有機ELディスプレイ。
- 前記透明電極が、前記隔壁によって分離された複数のストライプ状部分からなることを特徴とする請求項7に記載の有機ELディスプレイ。
- 前記透明電極の複数のストライプ状部分のそれぞれについて、印加電圧が個別に制御されることを特徴とする請求項8に記載の有機ELディスプレイ。
- 前記透明電極の複数のストライプ状部分のそれぞれについて、電気的特性の計測が可能であることを特徴とする請求項8に記載の有機ELディスプレイ。
Priority Applications (7)
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US13/510,485 US20120228603A1 (en) | 2009-11-17 | 2009-11-17 | Organic el display |
JP2011541730A JP5791514B2 (ja) | 2009-11-17 | 2009-11-17 | 有機elディスプレイ |
PCT/JP2009/006171 WO2011061789A1 (ja) | 2009-11-17 | 2009-11-17 | 有機elディスプレイ |
EP09851415.1A EP2503851B1 (en) | 2009-11-17 | 2009-11-17 | Organic el display |
CN200980162491.7A CN102668706B (zh) | 2009-11-17 | 2009-11-17 | 有机el显示器 |
TW099138493A TWI593306B (zh) | 2009-11-17 | 2010-11-09 | Organic electroluminescent display |
US15/063,008 US9929370B2 (en) | 2009-11-17 | 2016-03-07 | Organic EL display |
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PCT/JP2009/006171 WO2011061789A1 (ja) | 2009-11-17 | 2009-11-17 | 有機elディスプレイ |
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US13/510,485 A-371-Of-International US20120228603A1 (en) | 2009-11-17 | 2009-11-17 | Organic el display |
US15/063,008 Division US9929370B2 (en) | 2009-11-17 | 2016-03-07 | Organic EL display |
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EP (1) | EP2503851B1 (ja) |
JP (1) | JP5791514B2 (ja) |
CN (1) | CN102668706B (ja) |
TW (1) | TWI593306B (ja) |
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Also Published As
Publication number | Publication date |
---|---|
TWI593306B (zh) | 2017-07-21 |
CN102668706B (zh) | 2015-03-25 |
US9929370B2 (en) | 2018-03-27 |
TW201125421A (en) | 2011-07-16 |
US20120228603A1 (en) | 2012-09-13 |
EP2503851A1 (en) | 2012-09-26 |
EP2503851A4 (en) | 2014-04-30 |
EP2503851B1 (en) | 2018-07-11 |
JP5791514B2 (ja) | 2015-10-07 |
JPWO2011061789A1 (ja) | 2013-04-04 |
US20160190508A1 (en) | 2016-06-30 |
CN102668706A (zh) | 2012-09-12 |
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