WO2010087424A1 - 基板ブレーク装置 - Google Patents

基板ブレーク装置 Download PDF

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Publication number
WO2010087424A1
WO2010087424A1 PCT/JP2010/051185 JP2010051185W WO2010087424A1 WO 2010087424 A1 WO2010087424 A1 WO 2010087424A1 JP 2010051185 W JP2010051185 W JP 2010051185W WO 2010087424 A1 WO2010087424 A1 WO 2010087424A1
Authority
WO
WIPO (PCT)
Prior art keywords
substrate
break
break bar
brittle material
scribe line
Prior art date
Application number
PCT/JP2010/051185
Other languages
English (en)
French (fr)
Japanese (ja)
Inventor
正信 曽山
Original Assignee
三星ダイヤモンド工業株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 三星ダイヤモンド工業株式会社 filed Critical 三星ダイヤモンド工業株式会社
Priority to KR1020117015981A priority Critical patent/KR101275540B1/ko
Priority to CN201080005708.6A priority patent/CN102300688B/zh
Publication of WO2010087424A1 publication Critical patent/WO2010087424A1/ja

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26F—PERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
    • B26F3/00—Severing by means other than cutting; Apparatus therefor
    • B26F3/002—Precutting and tensioning or breaking
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28B—SHAPING CLAY OR OTHER CERAMIC COMPOSITIONS; SHAPING SLAG; SHAPING MIXTURES CONTAINING CEMENTITIOUS MATERIAL, e.g. PLASTER
    • B28B11/00—Apparatus or processes for treating or working the shaped or preshaped articles
    • B28B11/14—Apparatus or processes for treating or working the shaped or preshaped articles for dividing shaped articles by cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26F—PERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
    • B26F3/00—Severing by means other than cutting; Apparatus therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0005—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
    • B28D5/0011—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing with preliminary treatment, e.g. weakening by scoring
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/033—Apparatus for opening score lines in glass sheets
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/06—Cutting or splitting glass tubes, rods, or hollow products
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment

Definitions

  • the present invention relates to a substrate breaker capable of breaking a brittle material substrate such as a glass plate on which a scribe line is formed with high quality without depending on the plate thickness.
  • LTCC Low Temperature Co-fired Ceramics
  • a scribe line is formed on the surface of the LTCC substrate and a predetermined load is applied.
  • the LTCC substrate is broken along the formed scribe line to cut out a plurality of electronic components.
  • Patent Document 1 the substrate is broken by the lower break bar 31B while being supported by the pair of upper substrate fixing bars 32A and 32A, or the upper break bar 31A is supported by the pair of lower substrate fixing bars 32B and 32B.
  • a substrate break device for breaking a substrate is disclosed.
  • the substrate break device of Patent Document 1 since the substrate is supported at two points and the substrate is broken by a break bar positioned between the two points, the position where the break bar is pressed, that is, the accuracy of determining the break position is high. Moreover, even a thin substrate such as a laminated substrate can be broken with high accuracy.
  • the substrate to be broken is supported at two points, and the substrate is broken by a break bar positioned between the two supported points. There is a considerable shift in the break position due to bending of the thin substrate. When used for cutting out a small electronic component, positioning accuracy capable of corresponding to a minimum pitch is required for the break position.
  • the present invention has been made in view of such circumstances, and even when the brittle material substrate to be broken is a thin plate and breaks at a small pitch, the substrate break can be accurately positioned.
  • An object is to provide an apparatus.
  • a substrate break device is a substrate break device that breaks a brittle material substrate having a scribe line formed on a surface thereof along the scribe line.
  • a substrate support plate having a corresponding rectangular opening formed thereon, an elastic film mounted on the upper surface of the substrate support plate so as to cover the opening, and fixing the brittle material substrate; and above the elastic film
  • the first upper break bar and the second upper break bar which are arranged so as to be movable in the vertical direction and break along the scribe line, and are moved in the vertical direction below the elastic film.
  • a lower break bar arranged to break along the scribe line, the lower break bar being Crimping along the scribe line to the side opposite to the side where the cryline is formed, the second upper break in a state where the brittle material substrate is sandwiched between the lower break bar and the first upper break bar It is characterized by a break at the bar.
  • a substrate support plate in which a rectangular opening corresponding to the shape of the brittle material substrate is formed, and mounted on the upper surface of the substrate support plate so as to cover the opening, to fix the brittle material substrate.
  • An elastic film, a first upper break bar and a second upper break bar which are arranged so as to be movable in the vertical direction above the elastic film and break along a scribe line, and an elastic film And a lower break bar that breaks along the scribe line and is arranged so as to be able to move vertically.
  • the lower break bar is crimped along the scribe line to the side opposite to the side where the scribe line is formed, and the second upper break bar is sandwiched between the lower break bar and the first upper break bar.
  • the substrate breaker according to a second aspect of the present invention is the substrate breaker according to the first aspect, wherein the elastic film is fixed to the substrate support plate by a film crimping mechanism disposed around the four sides of the opening. It is characterized by that.
  • the elastic film is fixed to the substrate support plate by a film crimping mechanism disposed around the four sides of the opening, thereby allowing the gap between the elastic film and the rectangular brittle material substrate. Can be shortened, and it is possible to minimize the positional deviation due to the stretch of the elastic film.
  • the substrate breaker according to a third aspect of the present invention is the substrate breaker according to the first or second aspect, wherein an imaging device is disposed above the first upper breakbar and the second upper breakbar, and the imaging The mark given to the brittle material substrate is imaged by an apparatus to adjust the installation position of the brittle material substrate, and the first upper break bar and the second upper break bar are An oblique movement mechanism capable of moving obliquely at a predetermined angle with respect to the substrate support plate is provided.
  • the imaging device is arranged above the first upper break bar and the second upper break bar.
  • the mark given to the brittle material substrate is imaged by the imaging device, and the installation position of the brittle material substrate is adjusted.
  • an oblique movement mechanism capable of moving the first upper break bar and the second upper break bar obliquely at a predetermined angle with respect to the substrate support plate, a brittle material is obtained by the imaging device before the break starts.
  • the mark attached to the substrate can be imaged, and the break position can be accurately positioned.
  • the substrate breaker according to a fourth aspect of the present invention is the substrate breaker according to the first or second aspect, wherein an imaging device is disposed above the first upper breakbar and the second upper breakbar, and the imaging The mark given to the brittle material substrate is imaged by an apparatus to adjust the installation position of the brittle material substrate, and the first upper break bar and the second upper break bar are A horizontal movement mechanism capable of moving in a substantially horizontal direction with respect to the substrate support plate is provided.
  • the imaging device is arranged above the first upper break bar and the second upper break bar.
  • the mark given to the brittle material substrate is imaged by the imaging device, and the installation position of the brittle material substrate is adjusted.
  • the imaging device applies the brittle material substrate before the break starts.
  • the marked mark can be imaged, and the break position can be accurately positioned.
  • the lower break bar is crimped along the scribe line to the side opposite to the side where the scribe line is formed, and the brittle material substrate is sandwiched between the lower break bar and the first upper break bar.
  • FIG. 1 is a cross-sectional view taken along a plane substantially perpendicular to the moving direction of a brittle material substrate made of a brittle material, showing the configuration of the substrate breaker according to the embodiment of the present invention.
  • the substrate breaker according to the embodiment of the present invention opens a strong adhesive elastic film 4 using a dicing frame 3 and has an opening 7 from the lower surface in the dicing frame 3. It fixes to the upper surface of the support plate 2 (for example, by the vacuum suction mechanism of the substrate support plate 2).
  • the upper surface of the elastic film 4 has strong adhesiveness, and this adhesiveness can hold the brittle material substrate 1 to be scribed or broken.
  • the substrate break device has two upper breaks that can move up and down above the brittle material substrate 1 with the brittle material substrate 1 to be broken mounted on the upper surface of the opening 7 of the substrate support plate 2. Bars 6a and 6b and one lower break bar 5 that can move up and down below the elastic film 4 are provided. A plurality of scribe lines 11, 11,... Are formed on the upper surface of the brittle material substrate 1 placed on the elastic film 4.
  • the upper break bars 6 a and 6 b are lowered across the scribe line 11 formed on the upper surface of the brittle material substrate 1, and the lower break bar 5 is moved to the scribe line 11.
  • the brittle material substrate 1 is broken along the scribe line 11 by raising it so as to match the position.
  • FIG. 2 is a plan view showing a state where the LTCC substrate 1 is mounted as the brittle material substrate 1. Since the LTCC substrate 1 on which a plurality of electronic components are integrally formed is square, a rectangular opening 7 is provided at the center of the substrate support plate 2. The elastic film 4 is placed so as to cover the rectangular opening 7, and the elastic film 4 is opened by the dicing frame 3 that functions as a film opening mechanism provided outside the substrate supporting plate 2. (For example, by a vacuum suction mechanism on the upper surface). An alignment mark (alignment mark) 8 with the lower break bar 5 is provided on the LTCC substrate 1. For example, by imaging the surface of the LTCC substrate 1 from above with an imaging device or the like, the break position can be positioned based on the imaged alignment mark 8.
  • FIG. 3 is a plan view showing a state in which a scribe process is performed with the LTCC substrate 1 mounted. As shown in FIG. 3, a plurality of scribe lines 11, 11,... Are formed by a scribe device vertically and horizontally so that an electronic component can be cut out from the mounted LTCC substrate 1.
  • FIG. 4 is a cross-sectional view for schematically explaining a break process of the substrate break device according to the embodiment of the present invention.
  • the substrate break device has two pieces so as to straddle the scribe line 11 formed on the upper surface of the LTCC substrate 1 mounted on the substrate support plate 2.
  • the upper break bars 6 a and 6 b are arranged, one upper break bar 6 a is lowered, and the lower break bar 5 is raised from below to the position of the scribe line 11.
  • the LTCC substrate 1 is clamped by the upper and lower break bars, and even when the LTCC substrate 1 is warped, bent or the like is generated, it is adjusted to be substantially horizontal by the pressure of the break bar. Can do.
  • the LTCC substrate 1 can be broken along the scribe line 11 by lowering the other upper break bar 6b.
  • the upper break bars 6a and 6b are raised and the lower break bar 5 is lowered, and then the substrate support plate 2 is pitch-moved until the next scribe line 11 is directly above the lower break bar 5, and the above-described operation Is repeated to break the LTCC substrate 1.
  • the moving order of the upper break bars 6a and 6b and the lower break bar 5 is not limited to the order described above.
  • the lower break bar 5 is raised from below. Thereby, the LTCC substrate 1 can be broken along the scribe line 11.
  • the lower break bar 5 is crimped along one of the scribe lines 11 to the side opposite to the side where the scribe lines 11, 11,... Are formed, and the lower break bar 5 and the upper break bar 6a. Since the upper break bar 6b is lowered while the LTCC substrate 1 is sandwiched, the scribe line 11 to be broken can be accurately identified, and the break position is supported from above and below to break at a small pitch. Even if it is a case, it is hard to produce the crack which was not assumed, the possibility that an unevenness
  • FIG. 5 is a schematic diagram showing the positional relationship between the substrate break device and the imaging device when the upper break bars 6a and 6b are moved up and down.
  • FIG. 5A is a schematic diagram showing a state in which the upper break bars 6a and 6b are raised
  • FIG. 5B is a schematic diagram showing a state in which the upper break bars 6a and 6b are lowered during a break. is there.
  • the upper break bars 6a and 6b are obstructive, and the image-taking device 20 cannot be used to image the alignment mark 8 provided on the LTCC substrate 1, and the break position can be positioned. Can not.
  • the upper break bars 6a and 6b are provided with an oblique movement mechanism capable of moving the upper break bars 6a and 6b obliquely at a predetermined angle with respect to the substrate support plate 2, thereby enabling alignment by the imaging device 20.
  • the mark 8 can be imaged, and the break position can be reliably positioned.
  • FIG. 6 is a schematic diagram showing a positional relationship between the substrate break device and the imaging device when the upper break bars 6a and 6b of the substrate break device according to the embodiment of the present invention are moved up and down.
  • FIG. 6A is a schematic diagram showing a state in which the upper break bars 6a and 6b are raised
  • FIG. 6B is a schematic diagram showing a state in which the upper break bars 6a and 6b are lowered during a break. is there.
  • the upper break bars 6a and 6b when the upper break bars 6a and 6b are lowered, the upper break bars 6a and 6b become an obstacle, and the alignment provided on the LTCC substrate 1 using the imaging device 20 is performed.
  • the mark 8 cannot be imaged and cannot be aligned.
  • FIG. 6A when the upper break bars 6a and 6b are raised obliquely upward, the upper break bars 6a and 6b do not interfere with imaging, and are disposed above.
  • the alignment mark 8 provided on the LTCC substrate 1 can be imaged using the imaging device 20.
  • the method of enabling imaging by the imaging device 20 is not limited to the above-described method of raising the upper break bars 6a and 6b obliquely upward.
  • the upper break bars 6a and 6b are attached to the substrate support plate 2.
  • a horizontal movement mechanism capable of moving in a substantially horizontal direction is provided, and in the case of alignment, the upper break bars 6a and 6b are directed toward FIG. 6 so that an image directly below the imaging device 20 can be taken. May be moved in the left-right direction.
  • the lower break bar 5 is pressure-bonded along the scribe line 11 to the side opposite to the side where the scribe lines 11, 11,.
  • breaking at the upper break bar 6b with the LTCC substrate 1 which is a brittle material sandwiched between the upper break bar 6a it is possible to reliably break along the scribe line 11 and to accurately position the break position. Can be done.
  • an unexpected crack does not occur even when a break is caused at a small pitch, and the possibility of unevenness in the broken section is low.
  • the target of the break is not limited to the LTCC substrate, and is not particularly limited as long as it is a substrate made of a brittle material that needs to break at a small pitch.
  • various modifications and replacements are possible within the scope of the present invention.
  • LTCC substrate 1 Brittle material substrate
  • Substrate support plate 3 Dicing frame (film crimping mechanism) 4 Elastic Film 5 Lower Break Bar 6, 6a, 6b Upper Break Bar 7 Opening 8 Alignment Mark (Alignment Mark) 11 scribe line 20 imaging device

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Power Engineering (AREA)
  • Forests & Forestry (AREA)
  • Physics & Mathematics (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Ceramic Engineering (AREA)
  • Structural Engineering (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Dicing (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
  • Devices For Post-Treatments, Processing, Supply, Discharge, And Other Processes (AREA)
PCT/JP2010/051185 2009-01-30 2010-01-29 基板ブレーク装置 WO2010087424A1 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
KR1020117015981A KR101275540B1 (ko) 2009-01-30 2010-01-29 기판 브레이크 장치
CN201080005708.6A CN102300688B (zh) 2009-01-30 2010-01-29 基板分断装置

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2009020447A JP5330845B2 (ja) 2009-01-30 2009-01-30 基板ブレーク装置
JP2009-020447 2009-01-30

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WO2010087424A1 true WO2010087424A1 (ja) 2010-08-05

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JP (1) JP5330845B2 (zh)
KR (1) KR101275540B1 (zh)
CN (1) CN102300688B (zh)
TW (1) TWI432304B (zh)
WO (1) WO2010087424A1 (zh)

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JP2012066479A (ja) * 2010-09-24 2012-04-05 Mitsuboshi Diamond Industrial Co Ltd 樹脂付き脆性材料基板の分割方法
JP2012066480A (ja) * 2010-09-24 2012-04-05 Mitsuboshi Diamond Industrial Co Ltd 樹脂付き脆性材料基板の分割方法
CN102431097A (zh) * 2010-08-31 2012-05-02 三星钻石工业股份有限公司 基板折断装置
CN102706740A (zh) * 2012-06-28 2012-10-03 济南科汇试验设备有限公司 一种可变跨距陶瓷弯曲夹具
CN102737979A (zh) * 2011-04-11 2012-10-17 夏普株式会社 切片装置及切片方法
KR101299793B1 (ko) * 2010-11-30 2013-08-23 미쓰보시 다이야몬도 고교 가부시키가이샤 취성 재료 기판의 브레이크 방법
CN103286861A (zh) * 2012-02-27 2013-09-11 三星钻石工业股份有限公司 陶瓷基板的割断方法
JP2014082301A (ja) * 2012-10-16 2014-05-08 Mitsuboshi Diamond Industrial Co Ltd 脆性材料基板のブレイク用治具及びブレイク方法
TWI617408B (zh) * 2016-01-22 2018-03-11 Mitsuboshi Diamond Ind Co Ltd 分斷裝置

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JP5202595B2 (ja) * 2010-09-10 2013-06-05 三星ダイヤモンド工業株式会社 レーザ割断装置
JP5796774B2 (ja) * 2011-08-24 2015-10-21 日本電気硝子株式会社 脆性板材の割断方法と割断装置
JP2013089622A (ja) * 2011-10-13 2013-05-13 Mitsuboshi Diamond Industrial Co Ltd 半導体基板のブレイク方法
JP5331189B2 (ja) * 2011-11-21 2013-10-30 三星ダイヤモンド工業株式会社 基板ブレーク装置
JP5451720B2 (ja) * 2011-11-21 2014-03-26 三星ダイヤモンド工業株式会社 基板ブレーク方法
JP5824365B2 (ja) * 2012-01-16 2015-11-25 三星ダイヤモンド工業株式会社 脆性材料基板のブレイク方法
JP6039363B2 (ja) * 2012-10-26 2016-12-07 三星ダイヤモンド工業株式会社 脆性材料基板の分断方法並びに分断装置
JP6111827B2 (ja) * 2013-04-30 2017-04-12 三星ダイヤモンド工業株式会社 ブレイク用治具
JP6140012B2 (ja) * 2013-07-08 2017-05-31 三星ダイヤモンド工業株式会社 貼り合わせ基板のブレイク方法
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JP2015034111A (ja) * 2013-08-09 2015-02-19 三星ダイヤモンド工業株式会社 積層セラミックス基板の分断方法
JP2015034112A (ja) * 2013-08-09 2015-02-19 三星ダイヤモンド工業株式会社 積層セラミックス基板の分断方法
JP6185792B2 (ja) * 2013-08-29 2017-08-23 三星ダイヤモンド工業株式会社 半導体ウエハの分断方法
JP6119551B2 (ja) * 2013-10-16 2017-04-26 三星ダイヤモンド工業株式会社 弾性支持板、破断装置及び分断方法
JP6289949B2 (ja) * 2014-03-18 2018-03-07 三星ダイヤモンド工業株式会社 ブレイク装置
CN104609717B (zh) * 2014-12-08 2016-09-07 福州大学 一种手工切割玻璃瓶的简易方法
CN105541099A (zh) * 2015-12-16 2016-05-04 江苏森莱浦光电科技有限公司 一种uhp泡管切管装置
JP6851067B2 (ja) * 2016-11-22 2021-03-31 三星ダイヤモンド工業株式会社 基板分断装置
JP7385908B2 (ja) * 2019-10-30 2023-11-24 三星ダイヤモンド工業株式会社 貼り合わせ基板の分断方法および応力基板の分断方法
JP7425966B2 (ja) * 2020-03-12 2024-02-01 日本電気硝子株式会社 ガラス板の製造方法及びその製造装置

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04249343A (ja) * 1991-02-05 1992-09-04 Sharp Corp 基板分断方法
JPH11138523A (ja) * 1997-11-11 1999-05-25 Yamaha Corp スクライブ装置及び基板のスクライブ方法
JPH11242236A (ja) * 1998-02-26 1999-09-07 Hitachi Electron Eng Co Ltd 液晶パネルのｐｃｂ圧着装置
JP2000001326A (ja) * 1998-06-12 2000-01-07 Toppan Printing Co Ltd ガラススクライブ装置
JP2006289625A (ja) * 2005-04-05 2006-10-26 Sony Corp 貼り合わせ基板の基板ブレイク装置及びその基板ブレイク方法
JP2007073602A (ja) * 2005-09-05 2007-03-22 Shibaura Mechatronics Corp 半導体チップのピックアップ装置及びピックアップ方法
JP2008140615A (ja) * 2006-11-30 2008-06-19 Optrex Corp 光学パネルの製造方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07223831A (ja) * 1994-02-14 1995-08-22 Nippon Sheet Glass Co Ltd 板材の切断方法
JP4249343B2 (ja) * 1999-07-19 2009-04-02 株式会社プライムポリマー プロピレン系ランダム共重合体組成物及びそれからなるフィルム
JP2005313479A (ja) * 2004-04-28 2005-11-10 Tdk Corp セラミック基板の製造方法

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04249343A (ja) * 1991-02-05 1992-09-04 Sharp Corp 基板分断方法
JPH11138523A (ja) * 1997-11-11 1999-05-25 Yamaha Corp スクライブ装置及び基板のスクライブ方法
JPH11242236A (ja) * 1998-02-26 1999-09-07 Hitachi Electron Eng Co Ltd 液晶パネルのｐｃｂ圧着装置
JP2000001326A (ja) * 1998-06-12 2000-01-07 Toppan Printing Co Ltd ガラススクライブ装置
JP2006289625A (ja) * 2005-04-05 2006-10-26 Sony Corp 貼り合わせ基板の基板ブレイク装置及びその基板ブレイク方法
JP2007073602A (ja) * 2005-09-05 2007-03-22 Shibaura Mechatronics Corp 半導体チップのピックアップ装置及びピックアップ方法
JP2008140615A (ja) * 2006-11-30 2008-06-19 Optrex Corp 光学パネルの製造方法

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JP2012066480A (ja) * 2010-09-24 2012-04-05 Mitsuboshi Diamond Industrial Co Ltd 樹脂付き脆性材料基板の分割方法
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JP5330845B2 (ja) 2013-10-30
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CN102300688B (zh) 2014-04-16
TWI432304B (zh) 2014-04-01

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