WO2010073780A1 - フレックスリジッド配線板及びその製造方法 - Google Patents
フレックスリジッド配線板及びその製造方法 Download PDFInfo
- Publication number
- WO2010073780A1 WO2010073780A1 PCT/JP2009/065872 JP2009065872W WO2010073780A1 WO 2010073780 A1 WO2010073780 A1 WO 2010073780A1 JP 2009065872 W JP2009065872 W JP 2009065872W WO 2010073780 A1 WO2010073780 A1 WO 2010073780A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- wiring board
- rigid
- flex
- flexible
- flexible wiring
- Prior art date
Links
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties
- H05K3/4691—Rigid-flexible multilayer circuits comprising rigid and flexible layers, e.g. having in the bending regions only flexible layers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0277—Bendability or stretchability details
- H05K1/028—Bending or folding regions of flexible printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/142—Arrangements of planar printed circuit boards in the same plane, e.g. auxiliary printed circuit insert mounted in a main printed circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/05—Flexible printed circuits [FPCs]
- H05K2201/055—Folded back on itself
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/07—Electric details
- H05K2201/0707—Shielding
- H05K2201/0715—Shielding provided by an outer layer of PCB
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/0909—Preformed cutting or breaking line
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09127—PCB or component having an integral separable or breakable part
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09218—Conductive traces
- H05K2201/09263—Meander
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/09509—Blind vias, i.e. vias having one side closed
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/096—Vertically aligned vias, holes or stacked vias
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0017—Etching of the substrate by chemical or physical means
- H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
- H05K3/0032—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4602—Manufacturing multilayer circuits characterized by a special circuit board as base or central core whereon additional circuit layers are built or additional circuit boards are laminated
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
- H05K3/4652—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49126—Assembling bases
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
- Y10T29/49156—Manufacturing circuit on or in base with selective destruction of conductive paths
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
- Y10T29/49165—Manufacturing circuit on or in base by forming conductive walled aperture in base
Definitions
- the present invention relates to a flex-rigid wiring board composed of a rigid wiring board and a flexible wiring board, and a method for manufacturing the same.
- Patent Document 1 discloses a flexible wiring board that is elongated by cutting.
- This flexible wiring board includes a flexible base material and a wiring pattern formed on the flexible base material.
- the flexible substrate has a cut in a region other than the wiring pattern. For this reason, by folding back at the front end of the cut, the flexible wiring board becomes longer than before folding.
- the flexible wiring board described in Patent Document 1 is difficult to align when mounting electronic components because the flexible base material is flexible.
- the present invention has been made in view of the above circumstances, and provides a flex-rigid wiring board in which a flexible wiring board can be elongated and an electronic component can be easily mounted and a method for manufacturing the same.
- the purpose is to do.
- Another object of the present invention is to provide a flex-rigid wiring board in which the wiring of the flexible wiring board is hard to be disconnected during manufacturing, and a method for manufacturing the same.
- a flex-rigid wiring board includes a flexible wiring board having a first conductor pattern on a flexible substrate, and a rigid wiring board having a second conductor pattern on a rigid substrate, The first conductor pattern and the second conductor pattern are electrically connected to each other, the flexible base material is cut, and the flexible wiring board is folded by the cut so that it is not folded. Also become long.
- the electrical connection includes, for example, a connection through an arbitrary conductive material, a plating connection, a via connection, or a through-hole connection.
- the first conductor pattern on the flexible substrate and the second conductor pattern on the rigid substrate are not only formed on the flexible substrate or the rigid substrate but also in the upper layer. Also included are conductor patterns, that is, conductor patterns laminated on one or both sides of a flexible substrate or a rigid substrate via an insulating layer.
- the manufacturing method of the flex-rigid wiring board according to the second aspect of the present invention includes a first step of preparing a flexible wiring board having a first conductor pattern on a flexible substrate, and a second step of cutting the flexible substrate. And a third step of forming a second conductor pattern electrically connected to the first conductor pattern on the rigid base material.
- the step of preparing includes not only the case of purchasing materials and parts and manufacturing them themselves, but also the case of purchasing and using finished products.
- the flexible wiring board in the flex-rigid wiring board can be easily elongated.
- electronic components can be easily mounted on the flex-rigid wiring board.
- FIG. 2 is a cross-sectional view taken along the line AA in FIG.
- FIG. 3 is a cross-sectional view taken along the line BB in FIG.
- FIG. 4 is a partially enlarged view of FIG. 3.
- It is a figure which shows the flex-rigid wiring board which mounted the electronic component.
- It is a figure which shows the flex-rigid wiring board lengthened.
- It is a flowchart which shows the procedure of the manufacturing method of the flex-rigid wiring board which concerns on embodiment of this invention. It is a figure for demonstrating the manufacturing process of a flexible wiring board. It is a figure for demonstrating the manufacturing process of a flexible wiring board.
- FIG. 20 It is a figure which shows the form when the flex-rigid wiring board shown in FIG. 20 is lengthened. It is sectional drawing which shows the example of the flex-rigid wiring board which incorporates an electronic component. It is a figure which shows the connection structure of a rigid wiring board and a flexible wiring board. It is a figure which shows the modification of the connection structure of a rigid wiring board and a flexible wiring board. It is sectional drawing which shows the modification of a flex-rigid wiring board. It is a figure which shows the example of the flex-rigid wiring board which has a flying tail structure. It is a flowchart which shows the modification of the manufacturing method of a flex-rigid wiring board. It is a figure which shows the modification of the manufacturing method of a flex-rigid wiring board.
- the flex-rigid wiring board 10 of the present embodiment includes a first rigid wiring board 11, a second rigid wiring board 12, and a flexible wiring board 13, as shown in FIG.
- the 1st and 2nd rigid wiring boards 11 and 12 and the flexible wiring board 13 are arranged in parallel spaced apart in the horizontal direction.
- the first rigid wiring board 11 and the second rigid wiring board 12 are disposed to face each other with the flexible wiring board 13 in between. That is, the main part of the flexible wiring board 13 is exposed in a region R ⁇ b> 1 between the first rigid wiring board 11 and the second rigid wiring board 12. Both ends of the flexible wiring board 13 are connected to the first rigid wiring board 11 and the second rigid wiring board 12, respectively. That is, the first rigid wiring board 11 and the second rigid wiring board 12 are connected to each other via the flexible wiring board 13.
- the first and second rigid wiring boards 11 and 12 have arbitrary circuit patterns (conductor patterns).
- the flexible wiring board 13 has striped wiring patterns (conductor layers 132 and 133) on the front and back surfaces, respectively.
- the wiring pattern of the flexible wiring board 13 has connection pads 132a and 133a at each end.
- the connection pads 132a and 133a are electrically connected to the circuit pattern of the first rigid wiring board 11 and the circuit pattern of the second rigid wiring board 12, respectively.
- the flexible wiring board 13 has a U-shaped outer shape that is line-symmetric with respect to the intermediate line L1 between the first rigid wiring board 11 and the second rigid wiring board 12. That is, the rectangular flexible wiring board 13 is provided with a cut 14 along the intermediate line L1. A predetermined gap is provided between the first rigid wiring board 11 and the second rigid wiring board 12 by slit-like gaps 15a and 15b.
- the flexible wiring board 13 extends in the region R1 along the side of the first or second rigid wiring board 11 or 12 (specifically, the side to which the flexible wiring board 13 is connected). A U-turn is made at the position of the end of the rigid wiring board 11 or 12 to cover almost the entire area of the rectangular region R1.
- the wiring patterns (conductor layers 132, 133) are also formed in a U shape according to the outer shape of the flexible wiring board 13.
- the notches 14 and the tips 14a, 151a and 151b of the gaps 15a and 15b are rounded and rounded. Thereby, the concentration of stress when the flexible wiring board is bent is alleviated.
- the dead space is hardly generated in the region R1 by effectively using the space (region R1) between the first and second rigid wiring boards 11 and 12. For this reason, even when manufacturing the elongate flexible wiring board 13, the number of manufacture according to the case where a elongate flexible wiring board is manufactured is obtained. That is, the number of production per unit material is improved.
- the flexible wiring board 13 has folded portions 13a to 13c that are easier to bend than other portions.
- the flexible wiring board 13 has a laminated structure including an electromagnetic wave shielding layer (described in detail later), and the shielding layer is removed from the folded portions 13a to 13c. Since the shield layer is harder than the other layers of the flexible wiring board 13, the folded portions 13a to 13c are easily bent by removing the shield layer.
- the folded portions 13a to 13c are laid out so that the flexible wiring board 13 becomes longer than before the folding by folding the flexible wiring board 13 at the folded portions 13a to 13c (see FIG. 6 described later in detail). reference).
- the flexible wiring board 13 includes, for example, a flexible base 131, conductor layers 132 and 133, insulating films 134 and 135, a shield layer, as shown in FIG. 2 (AA sectional view in FIG. 1). 136 and 137 and cover lays 138 and 139 are stacked.
- the flexible base 131 is made of an insulating flexible sheet, for example, a polyimide sheet having a thickness of “20 to 50 ⁇ m”, preferably about “30 ⁇ m”.
- the conductor layers 132 and 133 are made of, for example, a copper pattern having a thickness of about “5 to 15 ⁇ m”.
- the conductor layers 132 and 133 are formed on the front and back surfaces of the flexible substrate 131, respectively, thereby constituting the above-described stripe-shaped wiring pattern.
- the insulating films 134 and 135 are made of a polyimide film having a thickness of about “5 to 15 ⁇ m”.
- the insulating films 134 and 135 insulate the conductor layers 132 and 133 from the outside.
- the shield layers 136 and 137 are composed of a conductive layer, for example, a cured film of silver paste.
- the shield layers 136 and 137 shield electromagnetic noise from the outside to the conductor layers 132 and 133 and electromagnetic noise from the conductor layers 132 and 133 to the outside.
- the shield layers 136 and 137 of the folded portions 13a to 13c (FIG. 1) are removed.
- the coverlays 138 and 139 are made of an insulating film such as polyimide having a thickness of about “5 to 15 ⁇ m”. Coverlays 138 and 139 insulate and protect the entire flexible wiring board 13 from the outside.
- the first and second rigid wiring boards 11 and 12 are so-called build-up multilayer printed wiring boards as shown in FIG. 3 (BB sectional view of FIG. 1), respectively.
- the first and second rigid wiring boards 11 and 12 include a rigid base 112, first and second insulating layers 111 and 113, and first and second upper insulating layers 144 and 114.
- the third and fourth upper insulating layers 145 and 115 and the fifth and sixth upper insulating layers 172 and 173 are stacked.
- the rigid base 112 gives rigidity to the first and second rigid wiring boards 11 and 12.
- the rigid base material 112 is made of a rigid insulating material.
- the rigid base 112 is made of, for example, a glass epoxy resin having a thickness of about “50 to 150 ⁇ m”, preferably about “100 ⁇ m”.
- the rigid base 112 has substantially the same thickness as the flexible wiring board 13.
- conductor patterns 112a and 112b made of, for example, copper are formed on the front and back of the rigid base 112, respectively. These conductor patterns 112a and 112b are electrically connected to higher-layer conductors (wirings) at predetermined locations, respectively.
- the first and second insulating layers 111 and 113 are made of a cured prepreg.
- the first and second insulating layers 111 and 113 each have a thickness of about “50 to 100 ⁇ m”, preferably about “50 ⁇ m”.
- resin it is desirable for resin to have a low flow characteristic.
- Such a prepreg can be produced by advancement of the degree of curing in advance by impregnating an epoxy resin into a glass cloth and then thermally curing the resin.
- the glass cloth may be impregnated with a resin having a high viscosity
- the glass cloth may be impregnated with a resin containing an inorganic filler (for example, silica filler), or the resin impregnation amount of the glass cloth may be reduced.
- an inorganic filler for example, silica filler
- the rigid base 112 and the first and second insulating layers 111 and 113 constitute the cores of the first and second rigid wiring boards 11 and 12, and the first and second rigid wiring boards 11 and 12 are connected to each other. I support it.
- through holes (through holes) 163 are formed for electrically connecting the conductor patterns on both sides (two main surfaces) of the wiring board to each other.
- the first and second rigid wiring boards 11 and 12 and the flexible wiring board 13 are connected by the core portions of the first and second rigid wiring boards 11 and 12.
- the first and second insulating layers 111 and 113 support and fix each end of the flexible wiring board 13 sandwiched therebetween. Specifically, as shown in FIG. 4 in which the region R2 in FIG. 3 (the joined portion between the first rigid wiring board 11 and the flexible wiring board 13) is enlarged, the first and second insulating layers 111 and 113 covers the boundary part of the rigid base material 112 and the flexible wiring board 13 from both front and back sides, and exposes a part of the flexible wiring board 13.
- These first and second insulating layers 111 and 113 are overlapped with coverlays 138 and 139 provided on the surface of the flexible wiring board 13.
- connection portion between the second rigid wiring board 12 and the flexible wiring board 13 is the same as the structure of the connection portion between the first rigid wiring board 11 and the flexible wiring board 13. Therefore, here, only the structure (FIG. 4) of the connection portion between the first rigid wiring board 11 and the flexible wiring board 13 will be described in detail, and the detailed description of the other connection portions will be omitted.
- the resin 125 is formed in a space defined by the rigid base 112, the flexible wiring board 13, and the first and second insulating layers 111 and 113 (a space between these members). Filled. The resin 125 oozes out from the low-flow prepreg constituting the first and second insulating layers 111 and 113 at the time of manufacture, for example, and is cured integrally with the first and second insulating layers 111 and 113. Yes.
- the first and second insulating layers 111 and 113 have tapered via holes (contact holes) 141 and 116 at respective portions facing the connection pads 132a and 133a of the flexible wiring board 13, respectively.
- the shield layers 136 and 137 and the coverlays 138 and 139 of the flexible wiring board 13 are removed.
- the via holes 141 and 116 pass through the insulating films 134 and 135 of the flexible wiring board 13 to expose the connection pads 132a and 133a of the conductor layers 132 and 133, respectively.
- wiring patterns (conductor layers) 142 and 117 made of, for example, copper plating are formed on the inner surfaces of the via holes 141 and 116.
- the plating films of the wiring patterns 142 and 117 are connected to the connection pads 132a and 133a, respectively.
- the via holes 141 and 116 are filled with resin, respectively.
- the resin in the via holes 141 and 116 is filled by, for example, pressing the resin of the upper insulating layers (first and second upper insulating layers 144 and 114) by pressing.
- lead patterns 143 and 118 connected to the wiring patterns 142 and 117 are formed on the upper surfaces of the first and second insulating layers 111 and 113, respectively. These lead patterns 143 and 118 are each made of, for example, copper plating. Further, the end portions of the first and second insulating layers 111 and 113 on the flexible wiring board 13 side, that is, the position on the flexible wiring board 13 side from the boundary between the flexible wiring board 13 and the rigid base material 112, respectively, are different from each other. Insulated conductor patterns 151 and 124 are arranged. The conductor patterns 151 and 124 can effectively dissipate heat generated in the first rigid wiring board 11.
- the first and second rigid wiring boards 11 and 12 and the flexible wiring board 13 are electrically connected regardless of the connector. For this reason, even when an impact is caused by dropping or the like, the connector does not come off and contact failure does not occur.
- the flexible wiring board 13 enters (embeds) each of the first and second rigid wiring boards 11 and 12, the flexible wiring board 13 is inserted into the first portion (embedded portion). Are electrically connected to the second rigid wiring boards 11 and 12, respectively. Thereby, the connection location is bonded and reinforced by the first and second rigid wiring boards 11 and 12. For this reason, when the flex-rigid wiring board 10 receives an impact due to dropping or the temperature environment changes, the CTE (thermal expansion coefficient) between the first and second rigid wiring boards 11 and 12 and the flexible wiring board 13 is changed. Even when a stress is generated due to the difference, the electrical connection between the flexible wiring board 13 and the first and second rigid wiring boards 11 and 12 can be maintained more reliably.
- CTE thermal expansion coefficient
- connection portion is high.
- connection reliability is improved.
- first and second upper insulating layers 144 and 114 are laminated on the upper surfaces of the first and second insulating layers 111 and 113, respectively.
- the via holes 146 and 119 are filled with conductors 148 and 120 made of copper, for example.
- Conductor patterns 148a and 120a continuous with the conductors 148 and 120 are formed on the upper surfaces of the first and second upper insulating layers 144 and 114, respectively.
- Third and fourth upper insulating layers 145 and 115 are further laminated on the first and second upper insulating layers 144 and 114.
- Via holes (second upper layer via holes) 147 and 121 connected to the via holes 146 and 119 are formed in the third and fourth upper insulating layers 145 and 115, respectively.
- These via holes 147 and 121 are filled with conductors 149 and 122 made of, for example, copper, respectively.
- the conductors 149 and 122 are electrically connected to the conductors 148 and 120, respectively.
- a filled buildup via hole is formed by the via holes 146 and 147 and 119 and 121.
- the first and second upper insulating layers 144 and 114 and the third and fourth upper insulating layers 145 and 115 are formed, for example, by curing a prepreg.
- Conductor patterns (circuit patterns) 150 and 123 are formed on the upper surfaces of the third and fourth upper insulating layers 145 and 115, respectively. Then, via holes 147 and 121 are connected to predetermined portions of the conductor patterns 150 and 123, respectively. As a result, the conductor layer 133 and the conductor pattern 123 are connected via the wiring pattern 117, the lead pattern 118, the conductor 120, and the conductor 122. The conductor layer 132 and the conductor pattern 150 are electrically connected to each other.
- fifth and sixth upper insulating layers 172 and 173 are further stacked on the upper surfaces of the third and fourth upper insulating layers 145 and 115, respectively. These fifth and sixth upper insulating layers 172 and 173 are also formed, for example, by curing a prepreg.
- connection terminals are formed at predetermined positions of the conductor patterns 176 and 177, respectively, by chemical gold plating, for example. Such connection terminals are provided on both surfaces of the first and second rigid wiring boards 11 and 12, respectively.
- electronic components 501 and 502 are mounted on the surfaces (electrodes 179) of the first and second rigid wiring boards 11 and 12, respectively.
- These electronic components 501 and 502 are, for example, active components such as an IC circuit, or passive components such as resistors, capacitors (capacitors), and coils.
- the flexible wiring board 13 is folded back at the folding portions 13a to 13c, for example, as shown in FIG. Thereby, the flexible wiring board 13 becomes longer than before folding.
- the flex-rigid wiring board 10 is sealed in a package, it is mounted on a motherboard, for example, by an electrode 178 and mounted on a mobile phone or the like.
- the use and usage form of the flex-rigid wiring board 10 shown here are merely examples, and the present invention is not limited thereto.
- the flex-rigid wiring board 10 can mount electronic components on the surfaces (electrodes 179) of the first and second rigid wiring boards 11 and 12 (see FIG. 5). Thereby, alignment of an electronic component becomes easy rather than the case where an electronic component is mounted in a flexible wiring board.
- the worker prepares (manufactures) the flexible wiring board 13 (FIG. 2) in step S11. Specifically, as shown in FIG. 8A, copper films 1321 and 1331 are formed on both surfaces of a flexible base 131 made of polyimide processed into a predetermined size. Subsequently, as shown in FIG. 8B, the copper films 1321 and 1331 are patterned to form conductor layers 132 and 133 (first conductor pattern) including the connection pads 132a and 133a (FIG. 1). Then, as shown in FIG. 8C, insulating films 134 and 135 made of polyimide, for example, are formed on the surfaces of the conductor layers 132 and 133 in a stacked manner. Further, as shown in FIG.
- a silver paste is applied to the insulating films 134 and 135, respectively, and the applied silver paste is cured to form shield layers 136 and 137.
- the shield layers 136 and 137 of the folded portions 13a to 13c are removed by screen printing or etching after coating.
- cover lays 138 and 139 are formed so as to cover the surfaces of the shield layers 136 and 137, respectively.
- the shield layers 136 and 137 and the cover lays 138 and 139 are formed so as to avoid the connection pads 132a and 133a.
- the operator makes a cut 14 (FIG. 1) in the flexible base 131 in step S12 of FIG.
- the cut 14 (FIG. 1) is made by, for example, a laser, and the flexible wiring board 13 is cut (cut) into a predetermined size and shape.
- the corners of the notches 14 and the tips 14a, 151a, 151b of the gaps 15a, 15b are taken.
- the flexible wiring board 13 shown in FIG. 2 is completed.
- the operator joins the flexible wiring board 13 and the first and second rigid wiring boards 11 and 12 in step S13 of FIG.
- the operator can connect the second conductor patterns electrically connected to the conductor layers 132 and 133 of the flexible wiring board 13, that is, the lead patterns 118 and 143, the conductor patterns 148a and 120a, the conductor patterns 150 and 123, the conductors.
- Patterns 176 and 177 are sequentially formed on the rigid substrate 112.
- a material common to a plurality of products is cut by a laser or the like, for example.
- First and second insulating layers 111 and 113 having a size are prepared.
- a material common to a plurality of products is cut by, for example, a laser to prepare first separators 291a and 291b having a predetermined size.
- a material common to a plurality of products is cut by, for example, a laser to prepare second separators 292a and 292b having a predetermined size.
- the first separators 291a and 291b are made of, for example, a polyimide film.
- the second separators 292a and 292b are made of, for example, an adhesive sheet.
- the rigid base 112 serving as the core of the first and second rigid wiring boards 11 and 12 is produced from a wafer 110 common to a plurality of products, for example, as shown in FIGS. 12A to 12C.
- a double-sided copper-clad laminate having conductor films 110a and 110b made of, for example, copper on the front and back surfaces of a wafer 110 made of, for example, glass epoxy resin is prepared.
- the conductor films 110a and 110b are patterned by performing a predetermined lithography process (pretreatment, lamination, exposure, development, etching, peeling film, inner layer inspection, etc.), for example. In this way, conductor patterns 112a and 112b are formed.
- a predetermined portion of the wafer 110 is removed by, for example, a laser to obtain the rigid base 112 of the first and second rigid wiring boards 11 and 12.
- the roughened surface is formed by processing the conductor pattern surface of the rigid base material 112 thus manufactured.
- the thicknesses of the first and second insulating layers 111 and 113 are set to the same thickness so that the first and second rigid wiring boards 11 and 12 have, for example, opposite structures. To do.
- the thickness when the first and second separators 291a and 292a are stacked and the thickness when the first and second separators 291b and 292b are stacked are the thicknesses of the first and second insulating layers 111 and 113, respectively. Set to the same level.
- the first and second insulating layers 111 and 113, the rigid base 112, and the flexible wiring board 13 are aligned and arranged as shown in FIG. 13A, for example. That is, the flexible wiring board 13 is arranged next to the rigid base material 112. The boundary portion between the rigid base 112 and the flexible wiring board 13 is covered with the first and second insulating layers 111 and 113. At this time, each end portion of the flexible wiring board 13 is sandwiched between the first and second insulating layers 111 and 113 and aligned. The central portion of the flexible wiring board 13 is exposed between the rigid base materials 112.
- the first and second separators 291a and 292a, and the first and second separators 291b and 292b are placed on both sides of the center of the flexible wiring board 13, and the first and second insulating layers. 111 and 113 are arranged side by side.
- the structure is sandwiched between pressing jigs 601a and 601b, for example, as shown in FIG. 13C, and hot pressing is performed for several seconds, for example.
- the jigs 601 a and 601 b are positioned by the pins 602.
- the structure is pressed almost perpendicularly to the main surface.
- PET PolyEthylene
- conductor films 161 and 162 made of, for example, copper are disposed outside the structure (on the front and back sides, respectively). And as shown to FIG. 14A, they are press-pressed.
- This pressurization is performed using, for example, a hydro press apparatus under conditions of a temperature of “200 degrees Celsius”, a pressure of “40 kgf”, and a pressurization time of “3 hours”.
- the resin 125 (FIG. 4) is extruded from the prepregs constituting the first and second insulating layers 111 and 113, respectively. That is, the gap between the rigid base 112 and the flexible wiring board 13 is filled with the resin 125.
- the flexible wiring board 13 and the rigid base material 112 are reliably bonded by filling the gap with the resin 125. Further, when pressing, the first and second separators 291a and 291b, and 292a and 292b support the conductor films 161 and 162, thereby preventing or suppressing problems such as breakage of the copper foil.
- the prepreg and the resin 125 constituting the first and second insulating layers 111 and 113 are cured and integrated by, for example, heating the structure.
- the coverlays 138 and 139 (FIG. 4) of the flexible wiring board 13 and the resins of the first and second insulating layers 111 and 113 are polymerized.
- a CO 2 laser is irradiated from, for example, a CO 2 laser processing apparatus, thereby forming via holes 116 and 141 and a through hole 163 as shown in FIG. 14B.
- PN plating for example, chemical copper plating and electrolytic copper plating
- FIG. 14C the flexible wiring board 13 is covered with the conductor films 161 and 162.
- the conductor films 161 and 162 are formed on the entire surface of the wiring board including the via holes 116 and 141 and the through holes 163. A part of the conductor films 161 and 162 is thickened by integrating copper by copper plating and an existing conductor film.
- the conductive films 161 and 162 are patterned as shown in FIG. 14D, for example, through a predetermined lithography process (pretreatment, lamination, exposure, development, etching, peeling film, inner layer inspection, etc.).
- predetermined lithography process pretreatment, lamination, exposure, development, etching, peeling film, inner layer inspection, etc.
- the wiring patterns 142 and 117, the lead patterns 143 and 118, and the conductor patterns 151 and 124 (FIG. 4) are formed. That is, this process corresponds to the process of step S13 in FIG.
- the surface of the copper foil is treated to form a roughened surface.
- first and second upper insulating layers 144 and 114 are arranged on the front and back of the wiring board, respectively. Further, conductor films 114a and 144a made of copper, for example, are arranged on the outside thereof. Then, as shown in FIG. 15B, they are pressure-pressed. At this time, the via holes 116 and 141 are filled with resin from the prepregs constituting the first and second upper insulating layers 114 and 144. Thereafter, the resin in the prepreg and the via hole is cured by, for example, heat treatment, and the first and second upper insulating layers 144 and 114 are solidified.
- the conductor films 114a and 144a are thinned to a predetermined thickness, for example, by half etching.
- a predetermined pretreatment as shown in FIG. 15C, via holes 146 are formed in the first upper insulating layer 144 and via holes 119 are formed in the second upper insulating layer 114, for example, by a laser.
- PN plating for example, chemical copper plating and electrolytic copper plating
- the conductor films 114a and 144a are formed on the entire surface of the wiring board including the via holes 146 and 119.
- a part of the conductor films 114a and 144a is thickened by integrating copper by copper plating and an existing conductor film.
- the conductor films 114a and 144a can also be formed by printing a conductive paste (for example, a thermosetting resin containing conductive particles) by, for example, a screen printing method.
- the conductor film on the surface of the wiring board is thinned to a predetermined thickness by, for example, half etching.
- the conductor films 114a and 144a on the surface of the wiring board are patterned, for example, as shown in FIG. 15D. To do. Thereby, the conductors 148 and 120 and the conductor patterns 148a and 120a are formed. That is, this process also corresponds to the process of step S13 in FIG. Thereafter, the surfaces of the conductors 148 and 120 are treated to form roughened surfaces.
- third and fourth upper insulating layers 145 and 115 are arranged on the front and back of the wiring board.
- conductor films 145a and 115a made of copper, for example, are arranged on the outside (on the front and back sides).
- the third and fourth upper insulating layers 145 and 115 are solidified by heating, for example.
- the third and fourth upper insulating layers 145 and 115 are made of, for example, a prepreg in which a glass cloth is impregnated with a resin.
- the wiring board is pressed. Thereafter, the conductor films 145a and 115a are thinned to a predetermined thickness, for example, by half etching. After predetermined pretreatment, via holes 147 and 121 are formed in the third and fourth upper insulating layers 145 and 115, for example, by laser. Then, after desmearing (smear removal) and soft etching, PN plating (for example, chemical copper plating and electrolytic copper plating) is performed as shown in FIG. 16C, for example. Thereby, the conductor films 145a and 115a are formed on the entire surface of the wiring board including the inside of the via holes 147 and 121.
- PN plating for example, chemical copper plating and electrolytic copper plating
- a part of the conductor films 145a and 115a is thickened by integrating copper by copper plating and an existing conductor film.
- the conductor films 145a and 115a can also be formed by printing a conductive paste (for example, a thermosetting resin containing conductive particles) by, for example, a screen printing method.
- the conductor films 145a and 115a on the surface of the wiring board are thinned to a predetermined thickness by, for example, half etching.
- the conductive films 145a and 115a on the surface of the wiring board are patterned as shown in FIG. 16D. .
- the conductors 149 and 122 and the conductor patterns 150 and 123 are formed. That is, this process also corresponds to the process of step S13 in FIG.
- the surfaces of the conductor patterns 150 and 123 are processed to form a roughened surface.
- fifth and sixth upper insulating layers 172 and 173 are arranged on the front and back of the wiring board.
- conductor films 172a and 173a made of, for example, copper are arranged on the outer side (respectively on the front and back sides).
- the fifth and sixth upper insulating layers 172 and 173 are made of, for example, a prepreg in which a glass cloth is impregnated with a resin.
- the wiring board is pressed. Thereafter, the conductor films 172a and 173a are thinned to a predetermined thickness, for example, by half etching. Then, after predetermined pretreatment, as shown in FIG. 17C, via holes 174 and 175 are formed in the fifth and sixth upper insulating layers 172 and 173, respectively, by a laser, for example, and broken lines in FIG. The insulating layers in the respective parts are removed to form cut lines 293a to 293d. At this time, for example, the conductor patterns 151 and 124 are used as stoppers. In addition, the conductor patterns 151 and 124 can be cut to some extent by adjusting the laser irradiation energy or irradiation time.
- PN plating for example, chemical copper plating and electrolytic copper plating
- the conductor films 172a and 173a are formed on the entire surface of the wiring board including the via holes 174 and 175 and the cut lines 293a to 293d.
- a part of the conductor films 172a and 173a is thickened by integrating copper by copper plating and an existing conductor film.
- the conductor film on the surface of the wiring board is thinned to a predetermined thickness by, for example, half etching.
- the conductor films 172a and 173a on the surface of the wiring board are patterned through a predetermined lithography process (pretreatment, lamination, exposure, development, etching, stripping, etc.).
- pretreatment, lamination, exposure, development, etching, stripping, etc. a predetermined lithography process
- conductor patterns 176 and 177 are formed. That is, this process also corresponds to the process of step S13 in FIG. After pattern formation, the pattern is inspected.
- solder resists 298 and 299 are formed on the surface of the wiring board, for example, by screen printing. Further, the solder resists 298 and 299 are appropriately patterned as necessary. Thereafter, the solder resists 298 and 299 are cured, for example, by heating.
- the structural bodies 301 and 302 are removed by being peeled off from the flexible wiring board 13 as shown in FIG. 19A.
- the first separators 291a and 291b are arranged, separation is easy.
- a space (region R11 in FIG. 19A) for the flexible wiring board 13 to bend (bend) on the front and back of the flexible wiring board 13 (stacking direction of the insulating layer). And R12) are formed. Thereby, the flex-rigid wiring board 10 can be bent at the flexible wiring board 13 portion.
- the conductor remains, for example, as indicated by the broken line in FIG. 19B.
- the remaining conductor is removed by, for example, mask etching as shown in FIG. 19C as necessary.
- the flexible wiring board 13 and the first and second rigid wiring boards 11 and 12 are joined.
- electrodes 178 and 179 are formed by chemical gold plating, for example.
- the flex-rigid wiring board 10 shown in FIG. 1 is completed through external processing, warpage correction, energization inspection, appearance inspection, and final inspection.
- the manufacturing method of this embodiment manufactures the flex-rigid wiring board 10 in a state where the flexible wiring board 13 is not deformed, that is, as shown in FIG. Thereby, when manufacturing the flex-rigid wiring board 10 (particularly in the pressing step), stress applied to the wiring pattern (conductor layers 132 and 133) of the flexible wiring board 13 is reduced. Further, after manufacturing the flex-rigid wiring board 10, the electronic components 501 and 502 are mounted (FIG. 5), and then the flexible wiring board 13 is folded back at the folding portions 13a to 13c, that is, as shown in FIG. The flexible wiring board 13 can be lengthened by deforming it into such a form.
- the flexible wiring board 13 may be configured as shown in FIG.
- the flexible wiring board 13 has a zigzag outer shape. That is, a plurality of cuts 14 are made in the rectangular flexible wiring board 13 along the connection direction of the first and second rigid wiring boards 11 and 12.
- the flexible wiring board 13 extends from the second rigid wiring board 12 toward the first rigid wiring board 11 in a region R1 between the first rigid wiring board 11 and the second rigid wiring board 12.
- the U-turn is made in front of the first rigid wiring board 11, and this time it is extended toward the second rigid wiring board 12 to make a U-turn in front of the second rigid wiring board 12, and the first rigid wiring board again. It extends toward the wiring board 11.
- the flexible wiring board 13 covers almost the entire region of the rectangular region R1 in a zigzag manner.
- the flexible wiring board 13 has folded portions 13a to 13f. In the folded portions 13a to 13f, the shield layers 136 and 137 (FIG. 2) are removed. By folding the flexible wiring board 13 with these folding portions 13a to 13f, the flexible wiring board 13 becomes longer than before the folding as shown in FIG. In this example, the flexible wiring board 13 is elongated in a step shape. Even if it is such a form, the effect according to the flexible wiring board 13 shown in FIG. 1 is acquired.
- the shield layers 136 and 137 of the folded portions 13a to 13f are removed.
- the present invention is not limited to this, and the flexible wiring board 13 can be easily bent when the other layers, for example, the coverlays 138 and 139 are removed. Two or more layers may be removed. Moreover, if it is not necessary according to the material etc. of the flexible wiring board 13, a folding
- the flexible wiring board 13 covers almost the entire region R1 (see FIGS. 1 and 20).
- the present invention is not limited to this, and the flexible wiring board 13 may be arranged only in a predetermined region of the region R1, for example, by narrowing the width of the flexible wiring board 13 depending on the application.
- an electronic component 503 may be incorporated inside the flex-rigid wiring board 10. According to the flex-rigid wiring board 10 incorporating such electronic components, it is possible to increase the functionality of the electronic device.
- the material, size, number of layers, etc. of each layer can be arbitrarily changed.
- RCF Resin Coated cupper Foil
- both wiring boards 11 and 12 and the flexible wiring board 13 are electrically connected to each other by conformal vias.
- the present invention is not limited to this.
- both wiring boards may be through-hole connected.
- the via hole 116 may be filled with a conductor 117a, and both wiring boards may be connected by filled vias.
- a conductive resin may be filled in the conformal via or the through hole.
- a flex-rigid wiring board having a conductor (wiring layer) on only one of the core front and back surfaces of the first or second rigid wiring board 11 or 12 may be used.
- the second rigid wiring board 12 may be omitted, and for example, a structure in which the flexible wiring board 13 protrudes from the first rigid wiring board 11 in a tail shape, that is, a so-called flying tail structure may be adopted.
- a part of the inner layer pattern is pulled out from the first rigid wiring board 11, and the terminal 10 a is formed at the tip of the flexible wiring board 13. With this terminal 10a, other wiring boards and devices can be electrically connected.
- the order of step S12 and step S13 in FIG. That is, the cut 14 may not be formed in the step of FIG. 8F, and the cut 14 may be formed after the step of FIG. 19C as shown in FIG.
- the present invention can be applied to a bendable flex-rigid wiring board partially composed of a flexible substrate and an electronic device using the flex-rigid wiring board.
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Structure Of Printed Boards (AREA)
Abstract
Description
11 第1のリジッド配線板
12 第2のリジッド配線板(第2リジッド配線板)
13 フレキシブル配線板
13a~13f 折り返し部
14 切り込み
14a 先端(切り込みの先端)
111 第1の絶縁層
112 リジッド基材
113 第2の絶縁層
114 第2の上層絶縁層
115 第4の上層絶縁層
116、141 ビアホール
117、142 配線パターン(導体層)
118、143 引き出しパターン(第2導体パターン)
119、146 ビアホール(第1の上層ビアホール)
120、122、148、149 導体
121、147 ビアホール(第2の上層ビアホール)
120a、123、148a、150 導体パターン(第2導体パターン)
176、177 導体パターン(第2導体パターン)
124、151 導体パターン
125 樹脂
131 フレキシブル基材
132、133 導体層(第1導体パターン)
134、135 絶縁膜
136、137 シールド層
138、139 カバーレイ
144 第1の上層絶縁層
145 第3の上層絶縁層
163 スルーホール(貫通孔)
172 第5の上層絶縁層
173 第6の上層絶縁層
174、175 ビアホール(第3の上層ビアホール)
178、179 電極
291a、291b 第1セパレータ
292a、292b 第2セパレータ
501~503 電子部品
Claims (14)
- フレキシブル基材上に第1導体パターンを有するフレキシブル配線板と、
リジッド基材上に第2導体パターンを有するリジッド配線板と、
を備え、
前記第1導体パターンと前記第2導体パターンとは、互いに電気的に接続され、
前記フレキシブル基材には、切り込みが入れられ、
前記フレキシブル配線板は、前記切り込みで折り返されることにより、折り返し前よりも長尺になる、
ことを特徴とするフレックスリジッド配線板。 - 前記切り込みの先端は、角が取られている、
ことを特徴とする請求項1に記載のフレックスリジッド配線板。 - 前記フレキシブル配線板は、他の部分よりも曲がり易い折り返し部を有し、
該折り返し部で折り返されることにより、折り返し前よりも長尺になる、
ことを特徴とする請求項1に記載のフレックスリジッド配線板。 - 前記フレキシブル配線板は、積層構造を有し、前記折り返し部においては、所定の層が除去されている、
ことを特徴とする請求項3に記載のフレックスリジッド配線板。 - 前記フレキシブル配線板は、電磁波のシールド層を含む積層構造を有し、前記折り返し部においては、前記シールド層が除去されている、
ことを特徴とする請求項4に記載のフレックスリジッド配線板。 - 前記リジッド配線板は、前記フレキシブル配線板を介して、第2リジッド配線板に接続され、
前記フレキシブル配線板は、前記リジッド配線板と前記第2リジッド配線板との間のスペースの略全域にわたる、
ことを特徴とする請求項1に記載のフレックスリジッド配線板。 - 前記フレキシブル配線板と、前記リジッド基材とが、並設され、
前記フレキシブル配線板と前記リジッド基材とを被覆し、前記フレキシブル配線板の少なくとも一部を露出する絶縁層を備え、
該絶縁層上には、導体パターンが形成され、
前記第1導体パターンと前記絶縁層上の導体パターンとはめっき皮膜により接続される、
ことを特徴とする請求項1に記載のフレックスリジッド配線板。 - フレキシブル基材上に第1導体パターンを有するフレキシブル配線板を用意する第1工程と、
前記フレキシブル基材に切り込みを入れる第2工程と、
前記第1導体パターンと電気的に接続する第2導体パターンを、リジッド基材上に形成する第3工程と、
を備える、
ことを特徴とするフレックスリジッド配線板の製造方法。 - 前記第1工程、前記第2工程、前記第3工程の順に行う、
ことを特徴とする請求項8に記載のフレックスリジッド配線板の製造方法。 - 前記第1工程、前記第3工程、前記第2工程の順に行う、
ことを特徴とする請求項8に記載のフレックスリジッド配線板の製造方法。 - 前記第1工程、前記第2工程、及び前記第3工程を、前記フレキシブル配線板が未変形の状態で実行する、
ことを特徴とする請求項8に記載のフレックスリジッド配線板の製造方法。 - 前記第2工程は、前記切り込みの先端の角をとる、
ことを特徴とする請求項8に記載のフレックスリジッド配線板の製造方法。 - 前記フレキシブル配線板は、積層構造を有し、
前記第1工程よりも後に、
前記積層構造から所定の層を除去して折り返し部を形成する工程、
を備える、
ことを特徴とする請求項8に記載のフレックスリジッド配線板の製造方法。 - 前記第3工程よりも前に、
前記リジッド基材の隣に並べて、前記フレキシブル配線板を配置する工程と、
前記リジッド基材と前記フレキシブル配線板との境界部分を、絶縁層で被覆する工程と、
を備え、
前記第3工程は、
前記絶縁層上に、前記第2導体パターンを形成する工程と、
前記絶縁層を貫通するビアホールを形成する工程と、
前記ビアホールに導体を充填することにより、前記第1導体パターンと前記第2導体パターンとを、電気的に接続する工程と、
を含む、
ことを特徴とする請求項8に記載のフレックスリジッド配線板の製造方法。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN200980152657.7A CN102265717B (zh) | 2008-12-24 | 2009-09-10 | 刚挠性电路板及其制造方法 |
JP2010543952A JP5121942B2 (ja) | 2008-12-24 | 2009-09-10 | フレックスリジッド配線板及びその製造方法 |
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US14075408P | 2008-12-24 | 2008-12-24 | |
US61/140,754 | 2008-12-24 | ||
US12/496,141 US20100155109A1 (en) | 2008-12-24 | 2009-07-01 | Flex-rigid wiring board and method for manufacturing the same |
US12/496,141 | 2009-07-01 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2010073780A1 true WO2010073780A1 (ja) | 2010-07-01 |
Family
ID=42264404
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2009/065872 WO2010073780A1 (ja) | 2008-12-24 | 2009-09-10 | フレックスリジッド配線板及びその製造方法 |
Country Status (6)
Country | Link |
---|---|
US (2) | US20100155109A1 (ja) |
JP (1) | JP5121942B2 (ja) |
KR (1) | KR20110097990A (ja) |
CN (1) | CN102265717B (ja) |
TW (1) | TW201026172A (ja) |
WO (1) | WO2010073780A1 (ja) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2013098536A (ja) * | 2011-10-31 | 2013-05-20 | Tripod Technology Corp | 折り曲げ式プリント回路基板の製造方法 |
TWI469706B (zh) * | 2012-12-28 | 2015-01-11 | Zhen Ding Technology Co Ltd | 可撓折的電路板及其製作方法 |
JP2017181768A (ja) * | 2016-03-30 | 2017-10-05 | 住友大阪セメント株式会社 | Fpc付き光変調器、及びそれを用いた光送信装置 |
JP2020145395A (ja) * | 2019-03-04 | 2020-09-10 | サムソン エレクトロ−メカニックス カンパニーリミテッド. | プリント回路基板及びその製造方法 |
JP2021118294A (ja) * | 2020-01-28 | 2021-08-10 | 日本シイエムケイ株式会社 | リジッド・フレックス多層プリント配線板 |
Families Citing this family (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2011243897A (ja) * | 2010-05-21 | 2011-12-01 | Fujitsu Ltd | 多層プリント基板及びその製造方法 |
US8791864B2 (en) | 2011-01-11 | 2014-07-29 | Apple Inc. | Antenna structures with electrical connections to device housing members |
US20120325524A1 (en) * | 2011-06-23 | 2012-12-27 | Ibiden Co., Ltd. | Flex-rigid wiring board and method for manufacturing the same |
US9040837B2 (en) * | 2011-12-14 | 2015-05-26 | Ibiden Co., Ltd. | Wiring board and method for manufacturing the same |
JP5637340B2 (ja) * | 2012-08-03 | 2014-12-10 | 株式会社村田製作所 | フラットケーブル |
CN104349575B (zh) * | 2013-07-31 | 2017-12-26 | 鹏鼎控股(深圳)股份有限公司 | 柔性电路板及其制作方法 |
CN104582325B (zh) * | 2013-10-12 | 2018-03-27 | 鹏鼎控股(深圳)股份有限公司 | 刚挠结合板及其制作方法、电路板模组 |
JP6497853B2 (ja) * | 2014-06-30 | 2019-04-10 | 日東電工株式会社 | 配線回路基板およびその製造方法 |
US10080290B2 (en) * | 2015-11-17 | 2018-09-18 | Intel Corporation | Stretchable embedded electronic package |
JP6700207B2 (ja) * | 2017-02-08 | 2020-05-27 | 矢崎総業株式会社 | 印刷回路の電気接続方法 |
JP7385807B2 (ja) * | 2018-10-02 | 2023-11-24 | 株式会社オートネットワーク技術研究所 | フレキシブルプリント基板、及び配線モジュール |
US10638616B1 (en) * | 2018-10-30 | 2020-04-28 | Taiwan Semiconductor Manufacturing Co., Ltd. | Circuit carrier and manifacturing method thereof |
KR102426308B1 (ko) * | 2018-12-04 | 2022-07-28 | 삼성전기주식회사 | 인쇄회로기판 및 이를 포함하는 모듈 |
CN111952490B (zh) * | 2019-05-17 | 2022-12-02 | 莫仕连接器(成都)有限公司 | 电池连接模块及电池装置 |
KR20220099353A (ko) * | 2021-01-06 | 2022-07-13 | 삼성전자주식회사 | 회로 기판 및 이를 포함하는 전자 장치 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH07183663A (ja) * | 1993-12-24 | 1995-07-21 | Mitsubishi Gas Chem Co Inc | リジッドフレキシブル多層プリント板 |
JPH08130352A (ja) * | 1994-10-31 | 1996-05-21 | Rohm Co Ltd | フレキシブル配線部品 |
JP2004172208A (ja) * | 2002-11-18 | 2004-06-17 | Denso Corp | 多層配線基板 |
JP2006005134A (ja) * | 2004-06-17 | 2006-01-05 | Fujikura Ltd | フレキシブルプリント配線板及びその製造方法 |
JP4021472B1 (ja) * | 2006-10-24 | 2007-12-12 | イビデン株式会社 | フレックスリジッド配線板及びその製造方法 |
Family Cites Families (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4587719A (en) * | 1983-08-01 | 1986-05-13 | The Board Of Trustees Of The Leland Stanford Junior University | Method of fabrication of long arrays using a short substrate |
NL9001026A (nl) * | 1990-04-27 | 1991-11-18 | Du Pont Nederland | Flexibele schakeling en inrichting voor het vasthouden van de flexibele schakeling in de gevouwen toestand. |
JPH0421472A (ja) | 1990-05-16 | 1992-01-24 | Canon Inc | プリンタ制御装置 |
JPH069165U (ja) * | 1992-07-08 | 1994-02-04 | 旭光学工業株式会社 | フレキシブルプリント基板 |
US5795299A (en) * | 1997-01-31 | 1998-08-18 | Acuson Corporation | Ultrasonic transducer assembly with extended flexible circuits |
US5903440A (en) * | 1998-01-30 | 1999-05-11 | Delco Electronics Corporaiton | Method of forming assemblies of circuit boards in different planes |
DE69932304T2 (de) * | 1998-11-09 | 2007-12-06 | Ballard Power Systems Inc., Burnaby | Elektrische Kontaktvorrichtung für eine Brennstoffzelle |
JP3541697B2 (ja) * | 1998-11-20 | 2004-07-14 | ソニーケミカル株式会社 | フレキシブル配線板の製造方法 |
JP2001024297A (ja) * | 1999-07-09 | 2001-01-26 | Nippon Mektron Ltd | 可撓性多層回路基板のスル−ホ−ル導通構造及びその形成法 |
US6969806B2 (en) * | 2002-05-28 | 2005-11-29 | Lockheed Martin Corporation | Cable and method |
CN1765161B (zh) * | 2003-04-18 | 2011-06-22 | 揖斐电株式会社 | 刚挠性电路板 |
JP4536430B2 (ja) * | 2004-06-10 | 2010-09-01 | イビデン株式会社 | フレックスリジッド配線板 |
JP2006103189A (ja) * | 2004-10-06 | 2006-04-20 | Furukawa Circuit Foil Kk | 表面処理銅箔並びに回路基板 |
TWI277381B (en) * | 2005-04-12 | 2007-03-21 | Au Optronics Corp | Double-sided flexible printed circuit board |
JP2009517117A (ja) * | 2005-11-25 | 2009-04-30 | コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ | バイオメトリックセンサ |
JP2007165707A (ja) * | 2005-12-15 | 2007-06-28 | Nitto Denko Corp | フレキシブル配線回路基板 |
US7265719B1 (en) * | 2006-05-11 | 2007-09-04 | Ball Aerospace & Technologies Corp. | Packaging technique for antenna systems |
JP4781943B2 (ja) * | 2006-08-29 | 2011-09-28 | 日本メクトロン株式会社 | フレキシブル配線板 |
US8071883B2 (en) * | 2006-10-23 | 2011-12-06 | Ibiden Co., Ltd. | Flex-rigid wiring board including flexible substrate and non-flexible substrate and method of manufacturing the same |
TW200922428A (en) * | 2007-11-14 | 2009-05-16 | Wintek Corp | Bendable area design for flexible printed circuitboard |
-
2009
- 2009-07-01 US US12/496,141 patent/US20100155109A1/en not_active Abandoned
- 2009-09-10 KR KR1020117017172A patent/KR20110097990A/ko not_active Application Discontinuation
- 2009-09-10 JP JP2010543952A patent/JP5121942B2/ja not_active Expired - Fee Related
- 2009-09-10 WO PCT/JP2009/065872 patent/WO2010073780A1/ja active Application Filing
- 2009-09-10 CN CN200980152657.7A patent/CN102265717B/zh not_active Expired - Fee Related
- 2009-09-17 TW TW098131378A patent/TW201026172A/zh unknown
-
2011
- 2011-11-08 US US13/291,134 patent/US8677612B2/en active Active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH07183663A (ja) * | 1993-12-24 | 1995-07-21 | Mitsubishi Gas Chem Co Inc | リジッドフレキシブル多層プリント板 |
JPH08130352A (ja) * | 1994-10-31 | 1996-05-21 | Rohm Co Ltd | フレキシブル配線部品 |
JP2004172208A (ja) * | 2002-11-18 | 2004-06-17 | Denso Corp | 多層配線基板 |
JP2006005134A (ja) * | 2004-06-17 | 2006-01-05 | Fujikura Ltd | フレキシブルプリント配線板及びその製造方法 |
JP4021472B1 (ja) * | 2006-10-24 | 2007-12-12 | イビデン株式会社 | フレックスリジッド配線板及びその製造方法 |
Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2013098536A (ja) * | 2011-10-31 | 2013-05-20 | Tripod Technology Corp | 折り曲げ式プリント回路基板の製造方法 |
TWI469706B (zh) * | 2012-12-28 | 2015-01-11 | Zhen Ding Technology Co Ltd | 可撓折的電路板及其製作方法 |
JP2017181768A (ja) * | 2016-03-30 | 2017-10-05 | 住友大阪セメント株式会社 | Fpc付き光変調器、及びそれを用いた光送信装置 |
WO2017168790A1 (ja) * | 2016-03-30 | 2017-10-05 | 住友大阪セメント株式会社 | Fpc付き光変調器、及びそれを用いた光送信装置 |
US10477677B2 (en) | 2016-03-30 | 2019-11-12 | Sumitomo Osaka Cement Co., Ltd. | Optical modulator with FPC and optical transmission device using same |
JP2020145395A (ja) * | 2019-03-04 | 2020-09-10 | サムソン エレクトロ−メカニックス カンパニーリミテッド. | プリント回路基板及びその製造方法 |
JP7463654B2 (ja) | 2019-03-04 | 2024-04-09 | サムソン エレクトロ-メカニックス カンパニーリミテッド. | プリント回路基板及びその製造方法 |
JP2021118294A (ja) * | 2020-01-28 | 2021-08-10 | 日本シイエムケイ株式会社 | リジッド・フレックス多層プリント配線板 |
JP7449704B2 (ja) | 2020-01-28 | 2024-03-14 | 日本シイエムケイ株式会社 | リジッド・フレックス多層プリント配線板 |
Also Published As
Publication number | Publication date |
---|---|
CN102265717B (zh) | 2014-04-30 |
JP5121942B2 (ja) | 2013-01-16 |
KR20110097990A (ko) | 2011-08-31 |
JPWO2010073780A1 (ja) | 2012-06-14 |
US8677612B2 (en) | 2014-03-25 |
TW201026172A (en) | 2010-07-01 |
US20100155109A1 (en) | 2010-06-24 |
CN102265717A (zh) | 2011-11-30 |
US20120047727A1 (en) | 2012-03-01 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP5121942B2 (ja) | フレックスリジッド配線板及びその製造方法 | |
JP4684368B2 (ja) | 配線板及びその製造方法 | |
WO2010007704A1 (ja) | フレックスリジッド配線板及び電子デバイス | |
WO2010013366A1 (ja) | フレックスリジッド配線板及びその製造方法 | |
US8461459B2 (en) | Flex-rigid wiring board and method for manufacturing the same | |
JP5097827B2 (ja) | フレックスリジッド配線板及び電子デバイス | |
KR101168514B1 (ko) | 플렉스 리지드 배선판 및 그의 제조 방법 | |
US8404978B2 (en) | Flex-rigid wiring board and method for manufacturing the same | |
US8493747B2 (en) | Flex-rigid wiring board and method for manufacturing the same | |
WO2009118935A1 (ja) | フレックスリジッド配線板及びその製造方法 | |
JP5059950B2 (ja) | 配線板及びその製造方法 | |
US20130219712A1 (en) | Method of manufacturing multilayer wiring board | |
CN108811323B (zh) | 印刷电路板及其制造方法 | |
JP2013084692A (ja) | 配線板及びその製造方法 | |
KR20120028566A (ko) | 캐리어 부재 및 이를 이용한 인쇄회로기판의 제조방법 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
WWE | Wipo information: entry into national phase |
Ref document number: 200980152657.7 Country of ref document: CN |
|
121 | Ep: the epo has been informed by wipo that ep was designated in this application |
Ref document number: 09834586 Country of ref document: EP Kind code of ref document: A1 |
|
ENP | Entry into the national phase |
Ref document number: 2010543952 Country of ref document: JP Kind code of ref document: A |
|
NENP | Non-entry into the national phase |
Ref country code: DE |
|
ENP | Entry into the national phase |
Ref document number: 20117017172 Country of ref document: KR Kind code of ref document: A |
|
122 | Ep: pct application non-entry in european phase |
Ref document number: 09834586 Country of ref document: EP Kind code of ref document: A1 |