WO2009157664A3 - 반도체 소자 패키지 - Google Patents
반도체 소자 패키지 Download PDFInfo
- Publication number
- WO2009157664A3 WO2009157664A3 PCT/KR2009/003212 KR2009003212W WO2009157664A3 WO 2009157664 A3 WO2009157664 A3 WO 2009157664A3 KR 2009003212 W KR2009003212 W KR 2009003212W WO 2009157664 A3 WO2009157664 A3 WO 2009157664A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- semiconductor device
- device package
- electrode
- package
- package body
- Prior art date
Links
- 239000004065 semiconductor Substances 0.000 title abstract 4
- 239000011256 inorganic filler Substances 0.000 abstract 1
- 229910003475 inorganic filler Inorganic materials 0.000 abstract 1
- 239000002184 metal Substances 0.000 abstract 1
- 239000000843 powder Substances 0.000 abstract 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
- H01L33/641—Heat extraction or cooling elements characterized by the materials
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/3201—Structure
- H01L2224/32012—Structure relative to the bonding area, e.g. bond pad
- H01L2224/32013—Structure relative to the bonding area, e.g. bond pad the layer connector being larger than the bonding area, e.g. bond pad
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/32257—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic the layer connector connecting to a bonding area disposed in a recess of the surface of the item
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/49105—Connecting at different heights
- H01L2224/49107—Connecting at different heights on the semiconductor or solid-state body
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/73—Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01087—Francium [Fr]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
- H01L33/60—Reflective elements
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
- H01L33/647—Heat extraction or cooling elements the elements conducting electric current to or from the semiconductor body
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
- Die Bonding (AREA)
- Solid State Image Pick-Up Elements (AREA)
- Wire Bonding (AREA)
Abstract
실시 예는 반도체 소자 패키지에 관한 것이다. 실시 예에 따른 반도체 소자 패키지는, 패키지 몸체; 상기 패키지 몸체 위에 제1전극을 포함하는 복수의 전극; 상기 제1전극 위에 무기물 필러 및 금속 파우더 중 적어도 하나를 포함하는 페이스트 부재; 및 상기 페이스트 부재 위에 다이 본딩되는 반도체 소자를 포함한다.
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP09770336A EP2237327A4 (en) | 2008-06-23 | 2009-06-16 | SEMICONDUCTOR DEVICE HOUSING |
CN200980103215.3A CN101926014B (zh) | 2008-06-23 | 2009-06-16 | 半导体器件封装 |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR10-2008-0059069 | 2008-06-23 | ||
KR1020080059069A KR101438826B1 (ko) | 2008-06-23 | 2008-06-23 | 발광장치 |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2009157664A2 WO2009157664A2 (ko) | 2009-12-30 |
WO2009157664A3 true WO2009157664A3 (ko) | 2010-03-25 |
Family
ID=41430292
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/KR2009/003212 WO2009157664A2 (ko) | 2008-06-23 | 2009-06-16 | 반도체 소자 패키지 |
Country Status (5)
Country | Link |
---|---|
US (2) | US8203218B2 (ko) |
EP (1) | EP2237327A4 (ko) |
KR (1) | KR101438826B1 (ko) |
CN (1) | CN101926014B (ko) |
WO (1) | WO2009157664A2 (ko) |
Families Citing this family (29)
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CN101749625B (zh) * | 2010-01-22 | 2014-07-16 | 深圳市中庆微科技开发有限公司 | 一种照明模块 |
KR100993093B1 (ko) * | 2010-02-04 | 2010-11-08 | 엘지이노텍 주식회사 | 발광 소자 및 발광 소자 패키지 |
KR100986397B1 (ko) * | 2010-02-08 | 2010-10-08 | 엘지이노텍 주식회사 | 발광 장치 |
KR100999736B1 (ko) * | 2010-02-17 | 2010-12-08 | 엘지이노텍 주식회사 | 발광 소자, 발광 소자 제조방법 및 라이트 유닛 |
KR101643410B1 (ko) * | 2010-03-08 | 2016-07-28 | 엘지이노텍 주식회사 | 발광 소자, 발광 소자 제조방법 및 발광 소자 패키지 |
EP2365552A3 (en) * | 2010-03-09 | 2015-03-25 | LG Innotek Co., Ltd. | Light emitting device package with a lead frame having a recess |
KR101039937B1 (ko) * | 2010-04-28 | 2011-06-09 | 엘지이노텍 주식회사 | 발광소자, 발광소자의 제조방법, 발광소자 패키지 및 조명시스템 |
KR101125335B1 (ko) | 2010-04-15 | 2012-03-27 | 엘지이노텍 주식회사 | 발광소자, 발광소자 제조방법 및 발광소자 패키지 |
JP5528900B2 (ja) * | 2010-04-30 | 2014-06-25 | ローム株式会社 | 発光素子モジュール |
KR101676669B1 (ko) * | 2010-05-20 | 2016-11-16 | 엘지이노텍 주식회사 | 발광 소자 |
KR101297870B1 (ko) * | 2010-05-21 | 2013-08-19 | 도요타지도샤가부시키가이샤 | 반도체 장치 |
CN102456812B (zh) * | 2010-10-28 | 2015-08-12 | 展晶科技(深圳)有限公司 | 发光二极管封装结构 |
US20120112237A1 (en) * | 2010-11-05 | 2012-05-10 | Shenzhen China Star Optoelectronics Technology Co. Ltd. | Led package structure |
CN102916089B (zh) * | 2011-08-01 | 2015-03-25 | 赛恩倍吉科技顾问(深圳)有限公司 | 发光二极管封装结构的形成方法及其基座的形成方法 |
CN103152974B (zh) * | 2013-02-21 | 2016-03-16 | 金兴精密工业股份有限公司 | 一种使用金属线路片的电子线路板及其电子封装模块 |
KR101958418B1 (ko) * | 2013-02-22 | 2019-03-14 | 삼성전자 주식회사 | 발광 소자 패키지 |
CN104064663B (zh) * | 2013-03-21 | 2017-06-20 | 展晶科技(深圳)有限公司 | 发光二极管封装结构 |
CN104112806A (zh) * | 2013-04-17 | 2014-10-22 | 展晶科技(深圳)有限公司 | 发光二极管及其封装结构 |
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JP6139427B2 (ja) * | 2014-02-04 | 2017-05-31 | Hoya Candeo Optronics株式会社 | 発光装置及びその製造方法 |
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KR102346643B1 (ko) * | 2015-06-30 | 2022-01-03 | 쑤저우 레킨 세미컨덕터 컴퍼니 리미티드 | 발광 소자, 발광 소자 제조방법 및 발광 모듈 |
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- 2009-06-16 WO PCT/KR2009/003212 patent/WO2009157664A2/ko active Application Filing
- 2009-06-16 EP EP09770336A patent/EP2237327A4/en not_active Ceased
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2012
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Also Published As
Publication number | Publication date |
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CN101926014B (zh) | 2014-04-16 |
KR20090132879A (ko) | 2009-12-31 |
CN101926014A (zh) | 2010-12-22 |
US20090315056A1 (en) | 2009-12-24 |
US8203218B2 (en) | 2012-06-19 |
EP2237327A4 (en) | 2011-10-26 |
EP2237327A2 (en) | 2010-10-06 |
US8674521B2 (en) | 2014-03-18 |
WO2009157664A2 (ko) | 2009-12-30 |
KR101438826B1 (ko) | 2014-09-05 |
US20120256225A1 (en) | 2012-10-11 |
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