WO2010044548A3 - 발광 소자 패키지 및 그 제조방법, 발광 장치 - Google Patents

발광 소자 패키지 및 그 제조방법, 발광 장치 Download PDF

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Publication number
WO2010044548A3
WO2010044548A3 PCT/KR2009/005235 KR2009005235W WO2010044548A3 WO 2010044548 A3 WO2010044548 A3 WO 2010044548A3 KR 2009005235 W KR2009005235 W KR 2009005235W WO 2010044548 A3 WO2010044548 A3 WO 2010044548A3
Authority
WO
WIPO (PCT)
Prior art keywords
light emitting
emitting device
manufacturing
device package
lighting apparatus
Prior art date
Application number
PCT/KR2009/005235
Other languages
English (en)
French (fr)
Other versions
WO2010044548A2 (ko
Inventor
공성민
Original Assignee
엘지이노텍주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 엘지이노텍주식회사 filed Critical 엘지이노텍주식회사
Priority to JP2011532010A priority Critical patent/JP5512689B2/ja
Priority to CN200980110795.9A priority patent/CN101981714B/zh
Priority to EP09820698.0A priority patent/EP2249407B1/en
Publication of WO2010044548A2 publication Critical patent/WO2010044548A2/ko
Publication of WO2010044548A3 publication Critical patent/WO2010044548A3/ko

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/483—Containers
    • H01L33/486—Containers adapted for surface mounting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H01L33/54—Encapsulations having a particular shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/1336—Illuminating devices
    • G02F1/133602—Direct backlight
    • G02F1/133603—Direct backlight with LEDs
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Led Device Packages (AREA)

Abstract

실시 예는 발광소자 패키지 및 그 제조방법, 발광장치에 관한 것이다. 실시 예에 따른 발광소자 패키지는, 바닥 면에 대해 빗각의 광 출사면을 포함하는 패키지 몸체; 상기 패키지 몸체에 복수의 리드 전극; 상기 리드 전극에 전기적으로 연결된 적어도 하나의 발광 소자를 포함한다.
PCT/KR2009/005235 2008-10-16 2009-09-15 발광 소자 패키지 및 그 제조방법, 발광 장치 WO2010044548A2 (ko)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2011532010A JP5512689B2 (ja) 2008-10-16 2009-09-15 発光素子パッケージ及びその製造方法と、発光装置
CN200980110795.9A CN101981714B (zh) 2008-10-16 2009-09-15 发光器件封装及其制造方法和发光装置
EP09820698.0A EP2249407B1 (en) 2008-10-16 2009-09-15 Light emitting device package, manufacturing method thereof, and lighting apparatus

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR20080101641A KR101509760B1 (ko) 2008-10-16 2008-10-16 발광 다이오드 패키지 및 그 제조방법, 이를 구비한 발광 장치
KR10-2008-0101641 2008-10-16

Publications (2)

Publication Number Publication Date
WO2010044548A2 WO2010044548A2 (ko) 2010-04-22
WO2010044548A3 true WO2010044548A3 (ko) 2010-07-01

Family

ID=42107007

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2009/005235 WO2010044548A2 (ko) 2008-10-16 2009-09-15 발광 소자 패키지 및 그 제조방법, 발광 장치

Country Status (6)

Country Link
US (1) US8618558B2 (ko)
EP (1) EP2249407B1 (ko)
JP (1) JP5512689B2 (ko)
KR (1) KR101509760B1 (ko)
CN (1) CN101981714B (ko)
WO (1) WO2010044548A2 (ko)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201020643A (en) * 2008-11-25 2010-06-01 Chi Mei Lighting Tech Corp Side view type light-emitting diode package structure, and manufacturing method and application thereof
JP6113420B2 (ja) * 2011-05-30 2017-04-12 日亜化学工業株式会社 発光装置
KR101813495B1 (ko) * 2011-06-08 2017-12-29 엘지이노텍 주식회사 발광소자 패키지
CN102496613A (zh) * 2011-12-14 2012-06-13 南京中电熊猫液晶显示科技有限公司 Led封装和包括该led封装的背光模组
TWD161897S (zh) * 2013-02-08 2014-07-21 晶元光電股份有限公司 發光二極體之部分
USD847102S1 (en) 2013-02-08 2019-04-30 Epistar Corporation Light emitting diode
JP6318844B2 (ja) * 2014-05-20 2018-05-09 日亜化学工業株式会社 発光装置
CN105761624B (zh) * 2016-01-19 2019-03-15 潘尚法 一种带倾角的led元件、led灯条和显示屏
CN108565326A (zh) * 2018-02-09 2018-09-21 佛山市国星光电股份有限公司 Led支架、led器件和led显示屏
US20190331965A1 (en) * 2018-04-26 2019-10-31 Wuhan China Star Optoelectronics Technology Co., Ltd. Light source module, backlight module, and lcd device
CN113451487B (zh) * 2020-08-20 2022-09-23 重庆康佳光电技术研究院有限公司 显示面板及具有其的显示装置

Citations (4)

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JP2000091647A (ja) * 1998-09-09 2000-03-31 Sharp Corp 通信用光学素子組立体
KR20050029384A (ko) * 2003-09-22 2005-03-28 엘지이노텍 주식회사 발광 다이오드 패키지 및 그 제조방법
KR100565842B1 (ko) * 2004-03-30 2006-03-30 서울반도체 주식회사 방사각이 지향된 발광다이오드
KR100820529B1 (ko) * 2006-05-11 2008-04-08 엘지이노텍 주식회사 발광 장치 및 그 제조방법, 면 발광 장치

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JP2000091647A (ja) * 1998-09-09 2000-03-31 Sharp Corp 通信用光学素子組立体
KR20050029384A (ko) * 2003-09-22 2005-03-28 엘지이노텍 주식회사 발광 다이오드 패키지 및 그 제조방법
KR100565842B1 (ko) * 2004-03-30 2006-03-30 서울반도체 주식회사 방사각이 지향된 발광다이오드
KR100820529B1 (ko) * 2006-05-11 2008-04-08 엘지이노텍 주식회사 발광 장치 및 그 제조방법, 면 발광 장치

Also Published As

Publication number Publication date
EP2249407B1 (en) 2020-04-22
CN101981714B (zh) 2014-05-07
JP5512689B2 (ja) 2014-06-04
EP2249407A2 (en) 2010-11-10
KR101509760B1 (ko) 2015-04-08
KR20100050590A (ko) 2010-05-14
CN101981714A (zh) 2011-02-23
US20100096644A1 (en) 2010-04-22
EP2249407A4 (en) 2014-06-25
JP2012506142A (ja) 2012-03-08
WO2010044548A2 (ko) 2010-04-22
US8618558B2 (en) 2013-12-31

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