WO2009104302A1 - Tft、シフトレジスタ、走査信号線駆動回路、スイッチ回路、および、表示装置 - Google Patents
Tft、シフトレジスタ、走査信号線駆動回路、スイッチ回路、および、表示装置 Download PDFInfo
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- WO2009104302A1 WO2009104302A1 PCT/JP2008/068362 JP2008068362W WO2009104302A1 WO 2009104302 A1 WO2009104302 A1 WO 2009104302A1 JP 2008068362 W JP2008068362 W JP 2008068362W WO 2009104302 A1 WO2009104302 A1 WO 2009104302A1
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- 229910021417 amorphous silicon Inorganic materials 0.000 claims description 17
- 239000004065 semiconductor Substances 0.000 claims description 13
- 239000000463 material Substances 0.000 claims description 10
- 229910021424 microcrystalline silicon Inorganic materials 0.000 claims description 8
- 239000004973 liquid crystal related substance Substances 0.000 description 30
- 230000000694 effects Effects 0.000 description 15
- 238000010586 diagram Methods 0.000 description 8
- 238000004519 manufacturing process Methods 0.000 description 7
- 239000000758 substrate Substances 0.000 description 7
- 230000004048 modification Effects 0.000 description 6
- 238000012986 modification Methods 0.000 description 6
- 230000003287 optical effect Effects 0.000 description 5
- 230000008439 repair process Effects 0.000 description 5
- 101100489584 Solanum lycopersicum TFT1 gene Proteins 0.000 description 4
- 239000003990 capacitor Substances 0.000 description 4
- 239000011521 glass Substances 0.000 description 4
- 238000000034 method Methods 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 201000005569 Gout Diseases 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 239000011159 matrix material Substances 0.000 description 2
- 238000002161 passivation Methods 0.000 description 2
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 102100022887 GTP-binding nuclear protein Ran Human genes 0.000 description 1
- 101000774835 Heteractis crispa PI-stichotoxin-Hcr2o Proteins 0.000 description 1
- 101000620756 Homo sapiens GTP-binding nuclear protein Ran Proteins 0.000 description 1
- 230000005856 abnormality Effects 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 230000012447 hatching Effects 0.000 description 1
- 238000003698 laser cutting Methods 0.000 description 1
- 239000013081 microcrystal Substances 0.000 description 1
- 230000003071 parasitic effect Effects 0.000 description 1
- 239000002210 silicon-based material Substances 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
- H01L27/124—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs with a particular composition, shape or layout of the wiring layers specially adapted to the circuit arrangement, e.g. scanning lines in LCD pixel circuits
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F2201/00—Constructional arrangements not provided for in groups G02F1/00 - G02F7/00
- G02F2201/12—Constructional arrangements not provided for in groups G02F1/00 - G02F7/00 electrode
- G02F2201/124—Constructional arrangements not provided for in groups G02F1/00 - G02F7/00 electrode interdigital
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- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
- G09G2310/00—Command of the display device
- G09G2310/02—Addressing, scanning or driving the display screen or processing steps related thereto
- G09G2310/0264—Details of driving circuits
- G09G2310/0297—Special arrangements with multiplexing or demultiplexing of display data in the drivers for data electrodes, in a pre-processing circuitry delivering display data to said drivers or in the matrix panel, e.g. multiplexing plural data signals to one D/A converter or demultiplexing the D/A converter output to multiple columns
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- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
- G09G3/00—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes
- G09G3/20—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters
- G09G3/34—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters by control of light from an independent source
- G09G3/36—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters by control of light from an independent source using liquid crystals
- G09G3/3611—Control of matrices with row and column drivers
- G09G3/3648—Control of matrices with row and column drivers using an active matrix
Definitions
- the present invention relates to a transistor structure that is monolithically formed in a display panel.
- Gate monolithic construction has been promoted to reduce costs by forming gate drivers with amorphous silicon on a liquid crystal panel.
- Gate monolithic is also referred to as a gate driverless, panel built-in gate driver, gate-in panel, or the like.
- TFTs using amorphous silicon have low mobility, a large driving voltage is required, and TFTs with a considerably large channel width such as mm order or cm order are manufactured to charge the wiring capacity of the scanning signal line with the scanning pulse. I have to.
- FIG. 8 is a plan view showing the structure of such a TFT described in Patent Document 1.
- the TFT is made of amorphous silicon and includes a gate electrode line 310, a drain electrode line 330, and a source electrode line 350.
- the drain electrode line 330 includes a body drain line 332 extending from the outside of the gate electrode line 310, a hand drain line 334 branched from the body drain line 332, and finger fingers branched vertically from the hand drain line 334. And a drain line 336.
- the hand / drain line 334 is formed in a region where the gate electrode line 310 is not formed, and the finger / drain line 336 is formed in a region where the gate electrode line 310 is formed.
- the source electrode line 350 includes a body source line 352 extending from the outside of the gate electrode line 310, a hand source line 354 branched from the body source line 352, and finger fingers branched vertically from the hand source line 354.
- Source line 356 The hand source line 354 is formed in a region where the gate electrode line 310 is not formed, and the finger source line 356 is formed in a region where the gate electrode line 310 is formed.
- a U-shaped finger / source line 356 surrounds an I-shaped finger / drain line 336, and a channel is formed therebetween.
- FIG. 9 shows a configuration which is also described in the cited document 1 and can be used as a partial TFT region 200 in which one finger / drain line 336 is surrounded by a U-shaped finger / source line 356.
- the partial TFT region 200 is labeled with a gate electrode line 210, a source electrode line 230, and a drain electrode line 240.
- the gate electrode line 210 continuously extends to the other partial TFT regions 200 along the extending direction of the hand / drain line 334 and the hand / source line 354.
- the channel width W is represented by 2 ⁇ DL1 + DL2, which is an average distance between the length of the boundary line between the source electrode line 230 and the channel region and the length of the boundary line between the drain electrode line 240 and the channel region. is there.
- the channel length L is a distance between the boundary line between the source electrode line 230 and the channel region and the boundary line between the drain electrode line 240 and the channel region.
- one finger / source line 102a of the source electrode line 102 and one finger / drain line 103a of the drain electrode line 103 are When a short circuit occurs due to a defect or the like, the entire source electrode line 102 and the entire drain electrode line 103 are short-circuited, so that the entire TFT does not operate normally. However, in this case, if the shorted finger / drain line 103a is separated from the main body of the drain electrode line 103 at the point P by laser fusing, the entire TFT can be used normally.
- the conventional TFT has a small distance from the main body of the drain electrode line 103 to the region above the gate electrode line 101, when the finger / drain line 103a is laser blown, the range of the laser spot becomes the gate electrode. This extends to the layer provided in the region above the line 101.
- FIG. 10B is a cross-sectional view taken along line C-C ′ in which the cut surface in FIG. 10A passes through the center of the finger / drain line 103a in the extending direction.
- a gate electrode line 101, a gate insulating film 105, an i layer (semiconductor layer) 106, an n + layer 107, a source electrode line 102, a drain electrode line 103, and a finger / drain line 103a are formed on a glass substrate 100.
- a passivation film 108 are stacked. Assuming that the gate electrode line 101 has a width of xx ′, the stacked body of the i layer 106 and the n + layer 107 has a width of yy ′ that protrudes from the region of xx ′.
- the laser spot can be separated from the i layer 106 by simply aiming the laser spot in the range of x′-z.
- the laminated body with the n + layer 107 is directly hit.
- the laminated body is damaged by laser irradiation, the laminated body is connected to an adjacent partial TFT region, so that the heat of damage is further transferred to the adjacent region. As a result, a wide range of TFT regions including the adjacent partial TFT region are damaged.
- the y′-z range is narrow, and in the x′-z range, there is a large step in the order of ⁇ m in the layer structure.
- the optical system has a depth of focus, it is difficult to accurately optically focus both end positions of the range at the same time so as to align the aiming position of the laser spot with high resolution.
- the present invention has been made in view of the above-described conventional problems, and an object of the present invention is to provide a TFT having a comb-like source / drain structure that can easily repair a leak between the source and the drain, and the TFT A shift register, a scanning signal line driving circuit, a switch circuit, and a display device.
- the TFT of the present invention is provided with a gate electrode, a first source / drain electrode, and a second source / drain electrode, and the first source / drain electrode and the second source / drain electrode are provided.
- One of the electrodes is a TFT which is a source electrode and the other is a drain electrode, and an i layer using a semiconductor material so as to face the gate electrode with an insulating film in the film thickness direction.
- the i-layer and the n + layer are sequentially stacked, and the first source / drain electrode is a first in-panel region in which the i-layer is provided.
- the second source / drain electrode is disposed on the n + layer in the region, and the second source / drain electrode includes an electrode line provided outside the first region, and a plurality of branch electrodes extending from the electrode line.
- the branch electrode extends from the electrode line to on the n + layer of the first region, said first source-drain electrodes, between the branch electrodes in the first region.
- the i layer pattern formed so that the n + layer does not exist in the first region is sandwiched in the in-plane direction of the panel, and the branch electrode starts to cross the first region.
- the outer edge of the first region of the portion is more than the outer edge of the gate electrode of the second portion where the branch electrode starts to intersect the region of the gate electrode when the gate electrode is viewed in the film thickness direction.
- the outer edge of the first region at the first location is at the same position as the outer edge of the gate electrode at the second location, and the first region of the first location at the first location.
- the first distance which is the distance from the outer edge to the electrode line, is It is characterized in that it ⁇ m or more.
- the first distance from the outer edge of the first region where the branch electrode starts to intersect the first region to the electrode line is set to 5 ⁇ m or more. Therefore, when the first source / drain electrode and the branch electrode of the second source / drain electrode leak from each other, the laser spot is easily separated from the outer edge of the first region on the branch electrode, It can also be applied away from the electrode line. In this case, since the distance is large, the magnification of the optical system for aiming the laser spot does not have to be so large, and the laser spot can be aligned with a macro aim on the branch electrode. . Therefore, even if the branch electrode is laser-cut, it is possible to prevent the laser from directly hitting the laminated body of the i layer and the n + layer, and there is no possibility of damaging other adjacent partial TFT regions due to heat transfer. .
- the TFT of the present invention is characterized in that the first distance is 10 ⁇ m or less in order to solve the above problems.
- the TFT it is possible to reduce the overall size of the TFT, and for example, there is an effect that it becomes easy to fit below a standard size as a TFT formed in a general-purpose display device. .
- the TFT of the present invention is provided with a notch for narrowing the line width of the branch electrode at one or both ends in the line width direction of the branch electrode immediately before the first portion. It is characterized by being.
- the branch electrode by observing the pattern of the notch provided in the branch electrode, it is possible to easily know the location where the branch electrode starts to intersect the first region, and the branch electrode is made into a laser. The effect of facilitating positioning when fusing is achieved.
- the TFT of the present invention is provided with a gate electrode, a first source / drain electrode, and a second source / drain electrode, and the first source / drain electrode and the second source / drain electrode are provided.
- One of the electrodes is a TFT which is a source electrode and the other is a drain electrode, and an i layer using a semiconductor material so as to face the gate electrode with an insulating film in the film thickness direction.
- the i-layer and the n + layer are sequentially stacked, and the first source / drain electrode is a first in-panel region in which the i-layer is provided.
- the second source / drain electrode is disposed on the n + layer in the region, and the second source / drain electrode includes an electrode line provided outside the first region, and a plurality of branch electrodes extending from the electrode line.
- the branch electrode extends from the electrode line to on the n + layer of the first region, said first source-drain electrodes, between the branch electrodes in the first region
- the i layer pattern formed so that the n + layer does not exist in the first region is sandwiched in the in-plane direction of the panel, and the branch electrode starts to cross the first region.
- the outer edge of the first region of the portion is more than the outer edge of the gate electrode of the second portion where the branch electrode starts to intersect the region of the gate electrode when the gate electrode is viewed in the film thickness direction.
- the second distance which is on the side away from the line and is the distance from the outer edge of the gate electrode to the electrode line at the second location is 5 ⁇ m or more.
- the second distance from the outer edge of the gate electrode to the electrode line at the location where the branch electrode starts to intersect the gate electrode region is set to 5 ⁇ m or more. Therefore, when the first source / drain electrode and the branch electrode of the second source / drain electrode leak together, the laser spot is easily separated from the outer edge of the first region and the outer edge of the gate electrode on the branch electrode. As such, it can also be applied away from the electrode line. In this case, since the distance is large, the magnification of the optical system for aiming the laser spot does not have to be so large, and the laser spot can be aligned with a macro aim on the branch electrode. . Therefore, even if the branch electrode is laser-cut, it is possible to prevent the laser from directly hitting the laminated body of the i layer and the n + layer, and there is no possibility of damaging other adjacent partial TFT regions due to heat transfer. .
- the TFT of the present invention is characterized in that the second distance is 10 ⁇ m or less in order to solve the above problems.
- the TFT it is possible to reduce the overall size of the TFT, and for example, there is an effect that it becomes easy to fit below a standard size as a TFT formed in a general-purpose display device. .
- the TFT of the present invention is provided with a notch for narrowing the line width of the branch electrode at one or both ends in the line width direction of the branch electrode immediately before the second portion. It is characterized by having.
- the branch electrode by observing the pattern of the notch provided in the branch electrode, it is possible to easily know where the branch electrode starts to cross the gate electrode region, and laser cutting the branch electrode. There is an effect that the positioning becomes easy.
- the TFT of the present invention is characterized in that a notch for narrowing the line width of the electrode line is provided on one side or both sides of the branch point of the branch electrode in the electrode line. Yes.
- the position of the branch point of the branch electrode from the electrode line can be easily known, and when the branch electrode is laser blown The effect of facilitating the positioning is provided.
- the TFT of the present invention is characterized in that the semiconductor material is amorphous silicon in order to solve the above problems.
- the TFT of the present invention is characterized in that the semiconductor material is microcrystalline silicon.
- the transistor size can be reduced as compared with the amorphous silicon TFT. Further, when microcrystalline silicon is used for the TFT, it is possible to reduce the space, which is advantageous for a narrow frame. In addition, there is an effect that the fluctuation of the threshold voltage due to the application of the DC bias can be suppressed.
- the shift register of the present invention is characterized in that the TFT is provided as at least one of transistors constituting each stage.
- a scanning signal line driving circuit of the present invention includes the shift register, and generates a scanning signal for a display device using the shift register.
- the scanning signal line driving circuit can be manufactured with a high yield.
- the scanning signal line driving circuit of the present invention is characterized in that the TFT is an output transistor of the scanning signal in order to solve the above problems.
- the TFT as an output transistor for a scanning signal, it is possible to produce a TFT requiring a large driving capability with a high yield.
- the display device of the present invention is characterized by including the scanning signal line driving circuit in order to solve the above-described problems.
- the display device can be manufactured with a high yield.
- the display device of the present invention is characterized in that the scanning signal line driving circuit is formed monolithically with a display area on a display panel.
- a display device in which the scanning signal line drive circuit is formed monolithically on the display panel is manufactured with a high yield, making up for the disadvantage that the channel width of the TFT must be increased. There is an effect that can be.
- the switch circuit of the present invention is a switch for branching and connecting each output of the data signal line driving circuit to a plurality of paths, and is provided corresponding to each of the paths. It is characterized by having as a switch.
- each output of the data signal line driving circuit is branched and connected to a plurality of paths through the switch composed of the TFT, so that the output is connected to a low impedance load at each branch destination.
- the switch circuit made of TFT having a large channel width can be manufactured with high yield.
- the TFT as the switch has a rectangular region as a whole when viewed in the film thickness direction, and the longitudinal direction is the data as the path.
- the signal lines are arranged so as to be parallel to the extending direction.
- each switch it is possible to arrange each switch so that the longitudinal direction of the data signal line extends along the direction in which the data signal line extends.
- the TFT as the switch has a rectangular region as a whole when viewed in the film thickness direction, and the longitudinal direction is the data as the path.
- the signal line is arranged so as to be orthogonal to the extending direction.
- each switch can be arranged so as to be arranged along the direction in which the data signal line extends, that is, the direction orthogonal to the longitudinal direction, for each output of the data signal line driving circuit. .
- the display device of the present invention includes the switch circuit and the data signal line driving circuit, and the path is a data signal line.
- the display device is characterized in that, for each output, the switches are driven so as to conduct in a time division manner in each horizontal period.
- the display device of the present invention is characterized in that the switch circuit is formed monolithically with the display area on the display panel.
- a display device in which a switch circuit is formed monolithically with a display area on a display panel compensates for the disadvantage of the process that the channel width of the TFT has to be particularly large, and has a high yield. There exists an effect that it can manufacture.
- the display device of the present invention includes the scanning signal line driving circuit, the switch circuit, and the data signal line driving circuit, and the path is a data signal line. It is said.
- the scanning signal line driving circuit and the switch circuit can be manufactured with a high yield.
- the display device of the present invention is characterized in that at least one of the scanning signal line drive circuit and the switch circuit is formed monolithically with a display area on the display panel.
- the display device of the present invention is characterized in that the TFT is formed monolithically with the display area on the display panel.
- a display device in which the scanning signal line drive circuit is formed monolithically on the display panel is manufactured with a high yield, making up for the disadvantage that the channel width of the TFT must be increased. There is an effect that can be.
- FIG. 1 is a plan view showing a detailed configuration of a TFT.
- FIG. 1A and 1B are cross-sectional views taken along the line A-A ', and FIG. 1B is a cross-sectional view taken along the line B-B'. It is a top view which shows the whole structure of TFT of FIG.
- FIG. 5 is a plan view showing a detailed configuration of a first modification of a TFT according to an embodiment of the present invention.
- FIG. 11 is a plan view showing a detailed configuration of a second modification example of a TFT according to the embodiment of the present invention.
- 1, showing an embodiment of the present invention is a block diagram illustrating a configuration of a display device.
- FIG. FIG. 1A and 1B are cross-sectional views taken along the line A-A '
- FIG. 1B is a cross-sectional view taken along the line B-B'. It is a top view which shows the whole structure of TFT of FIG.
- FIG. 5 is a plan view
- FIG. 7 is a circuit block diagram illustrating a configuration of a shift register of a scanning signal line driving circuit included in the display device of FIG. 6. It is a top view which shows a prior art and shows the whole structure of TFT. It is a top view which shows the structure of the partial TFT area
- region applicable to the TFT of FIG. 4A and 4B are diagrams showing a problem of a conventional TFT, where FIG. 5A is a plan view of the TFT, and FIG. 5B is a cross-sectional view taken along line C-C ′ of FIG. 1, showing an embodiment of the present invention, is a block diagram illustrating a configuration of a display device.
- FIG. 1, showing an embodiment of the present invention is a block diagram illustrating a configuration of a display device.
- FIG. FIGS. 11A and 11B are plan views for explaining how TFTs are arranged on the display device of FIGS. 11 and 12, in which FIGS. 1 is a block diagram illustrating a general configuration of an SSD display device.
- FIG. 6 shows a configuration of the liquid crystal display device 11 which is a display device according to the present embodiment.
- the liquid crystal display device 11 includes a display panel 12, a flexible printed circuit board 13, and a control board 14.
- the display panel 12 uses amorphous silicon on a glass substrate, a display region 12a, a plurality of gate lines (scanning signal lines) GL, a plurality of source lines (data signal lines) SL, and a gate driver (scanning signal lines).
- This is an active matrix display panel in which a drive circuit 15 is built.
- the display area 12a is an area in which a plurality of picture elements PIX ... are arranged in a matrix.
- the picture element PIX includes a TFT 21, which is a picture element selection element, a liquid crystal capacitor CL, and an auxiliary capacitor Cs.
- the gate of the TFT 21 is connected to the gate line GL, and the source of the TFT 21 is connected to the source line SL.
- the liquid crystal capacitor CL and the auxiliary capacitor Cs are connected to the drain of the TFT 21.
- the plurality of gate lines GL are composed of gate lines GL1, GL2, GL3,... GLn, and are connected to the output of the gate driver (scanning signal line drive circuit) 15, respectively.
- the plurality of source lines SL are made up of source lines SL1, SL2, SL3,..., SLm, and are connected to the output of the source driver 16 described later. Further, although not shown, auxiliary capacitance lines for applying an auxiliary capacitance voltage to the auxiliary capacitances Cs of the picture elements PIX... Are formed.
- the gate driver 15 is provided in a region adjacent to the display region 12a on one side of the display region 12a in the direction in which the gate lines GL extend, and sequentially applies a gate pulse (scanning) to each of the gate lines GL. Pulse).
- the gate driver 15 is formed monolithically with the display region 12a using amorphous silicon or polycrystalline silicon on the display panel 12, and is referred to as gate monolithic, gate driverless, panel built-in gate driver, gate-in panel, or the like. All the gate drivers to be processed can be included in the gate driver 15.
- the flexible printed circuit board 13 includes a source driver 16.
- the source driver 16 supplies a data signal to each of the source lines SL.
- the control board 14 is connected to the flexible printed board 13 and supplies necessary signals and power to the gate driver 15 and the source driver 16. Signals and power supplied to the gate driver 15 output from the control board 14 are supplied from the display panel 12 to the gate driver 15 via the flexible printed board 13.
- FIG. 7 shows a configuration example of the gate driver 15.
- the gate driver 15 includes a shift register 15a, and extends along the extending direction of the gate line in which gate outputs G1, G2,... Are performed with respect to the display area 12a which is an active area of the display panel. Are arranged in a region adjacent to one side.
- the shift register 15a includes a plurality of cascade-connected shift register stages sr (sr1, sr2,). Each shift register stage sr includes a set input terminal Qn ⁇ 1, an output terminal GOUT, a reset input terminal Qn + 1, clock input terminals CKA and CKB, and a low power input terminal VSS.
- Shift register stage sri becomes the gate output Gi output to the i-th gate line.
- a gate start pulse GSP1 is input to the set input terminal Qn-1 of the first shift register stage sr1, and the gate output Gi-- of the previous shift register stage sri-1 is supplied to each of the second and subsequent shift register stages sri. 1 is input.
- the gate output Gi + 1 of the subsequent shift register stage sri + 1 is input to the reset input terminal Qn + 1.
- the clock signal CK1 is input to one of the clock input terminal CKA and the clock input terminal CKB, and the clock signal CK2 is input to the other, and the input destination of the clock signal CK1 and the input destination of the clock signal CK2 are switched between adjacent shift register stages sr. It is like that.
- the clock signal CK1 is input to the clock input terminal CKA and the clock signal CK2 is input to the clock input terminal CKB.
- the clock signal CK2 is input to the clock input terminal CKA, and the clock signal CK1 is input to the clock input terminal CKB.
- the clock signal CK1 and the clock signal CK2 have a phase relationship in which, for example, clock pulse periods do not overlap each other.
- FIG. 3 shows a configuration of the TFT 1 formed in the shift register 15a.
- the TFT 1 can be used as another transistor of the shift register stage sr or any other transistor on the panel.
- the TFT 1 includes a gate electrode 2, a first source / drain electrode 3, and a second source / drain electrode 4.
- the first source / drain electrode 3 and the second source / drain electrode 4 are each used as the drain electrode when one is used as the source electrode.
- the gate electrode 2 is a U-shaped region and is formed on the glass substrate on the lower layer side than the first source / drain electrode 3 and the second source / drain electrode 4.
- a stacked body (described later) of an i layer (semiconductor layer) and an n + layer using a silicon material is provided above the gate electrode 2 in the film thickness direction with a gate insulating film interposed therebetween.
- the region where the i layer is provided is a first region R as shown by hatching
- the region of the stacked body is in the first region R
- the first source / drain electrode 3 is the first region R. It is provided on the n + layer in R.
- the region 5 other than the first source / drain electrode 3 is an i-layer region in which no n + layer is provided above.
- the first source / drain electrode 3 has a shape obtained by removing a region for facing the second source / drain electrode 4 in the in-plane direction from the U-shaped region of the gate electrode 2. .
- the second source / drain electrode 4 includes one electrode line 4a and a plurality of branch electrodes 4b.
- the electrode line 4a is a line-shaped electrode provided in the central gap region of the U-shaped region of the gate electrode 2, and the branch electrodes 4b ... are directed from the electrode line 4a to the first source / drain electrodes 3 on both sides. It is an electrode group which branches and extends.
- Each branch electrode 4b extends to the n + layer in the first region R, and the first source / drain electrodes 3 are arranged so as to surround each branch electrode 4b with a predetermined distance.
- the first source / drain electrode 3 includes the i layer in the region 5 formed so that no n + layer exists in the stacked body between the first source / drain electrode 3 and the branch electrodes 4b in the first region R.
- the i layer pattern serves as a channel formation region 5a of the TFT1.
- the TFT 1 has a comb-like source / drain structure in which the first source / drain electrode 3 and the second source / drain electrode 4 mesh with each other to form a total channel width. have.
- a voltage is applied to the electrode line 4 a of the gate electrode 2, the first source / drain electrode 3, and the second source / drain electrode 4 from the outside of the TFT 1.
- FIG. 1 shows a more detailed configuration of the TFT 1.
- the outer edge of the first region R is the region of the gate electrode 2
- the laminated body of the i layer (semiconductor layer) and the n + layer protrudes from the boundary line e to the line f at the position of the line f closer to the electrode line 4a than the boundary line e inside the U-shape.
- a region 6 is provided. Accordingly, the outer edge (line f) of the first region R at the location D is a location where the branch electrode 4b starts to intersect with the region of the gate electrode 2 when the gate electrode 2 is viewed in the film thickness direction (second location).
- the outer edge (boundary line e) of the gate electrode 2 is on the electrode line 4a side.
- the outer edge of the first region R is set back to the line g which is on the side farther from the electrode line 4 a than the boundary line e.
- the distance d1 (first distance) from the location D to the electrode line 4a is set to 5 ⁇ m or more.
- the distance d1 is 5 ⁇ m or more
- the first source / drain electrode 3 and the branch electrode 4b of the second source / drain electrode 4 leak with each other, for example, when a short circuit occurs at the location S, At point Q, the laser spot can be applied easily away from location D and away from electrode line 4a.
- the distance d1 since the distance d1 is large, the magnification of the optical system for aiming the laser spot does not have to be very large, and the laser spot can be aligned with a macro aim on the branch electrode 4b. Become.
- the branch electrode 4b is laser-cut, it is possible to avoid the laser from directly hitting the laminated body of the i layer and the n + layer, and there is a possibility that other adjacent partial TFT regions may be damaged by heat transfer. Absent. This can also be said when the outer edge of the first region R at the location D is at the same position as the outer edge of the gate line 2 at the second location.
- the distance d1 is preferably set in the range of 5 ⁇ m to 10 ⁇ m. By setting it within this range, it is possible to suppress the entire size of the TFT 1 to be small, and it becomes easy to keep it below a standard size as a TFT formed in a general-purpose display device.
- FIG. 2A is a cross-sectional view taken along the line A-A 'of FIG. 1
- FIG. 2B is a cross-sectional view taken along the line B-B' of FIG.
- the A-A ′ line cross-sectional view is a cross-sectional view of a portion where the channel forming region 5 a is sandwiched between the first source / drain electrode 3 and the branch electrode 4 b of the second source / drain electrode 4.
- a gate electrode 2 for example, a gate insulating film 22 (insulating film) made of SiN, for example, an amorphous silicon i layer 23a, for example, an amorphous silicon n + layer 23b, a first A branch electrode 4b of the source / drain electrode 3 and the second source / drain electrode 4 and a passivation film 24 made of, for example, SiN are sequentially stacked.
- the laminated body 23 is configured by the i layer 23a and the n + layer 23b.
- the channel formation region 5a is composed of a pattern of the i layer 23a formed so that the n + layer 23b of the stacked body 23 does not exist.
- the i layer 23 in the channel forming region 5a may be made thinner by etching than the i layer 23 in other places.
- the cross-sectional view taken along the line B-B ' is a cross-sectional view of the branch electrode 4b cut to a position reaching the electrode line 4a so as to include the position D.
- the first region R exists on the gate electrode 2 side from the location D. Although there is a large step at the location D, the distance d1 is large, so that the point Q can be aimed only by macro alignment between the vicinity of the upper portion of the gate electrode 2 and the electrode line 4b. It is not necessary to perform a highly accurate operation that avoids this position by focusing the optical system on the outer edge of one region R.
- a notch 31 that narrows the line width of the branch electrode 4b immediately before intersecting the first region R is formed on the branch electrode 4b. It may be provided at one end or both ends in the line width direction to narrow the branch electrode 4b. By observing the pattern of the notch 31, the position of the location D can be easily known. Further, at the branching point of the branch electrode 4b from the electrode line 4a, a notch 32 for narrowing the line width of the electrode line 4a is provided on one side or both sides of the branching point of the electrode line 4a, thereby narrowing the electrode line 4a. You may make it. By observing the pattern of the notch 32, the position of the branch point can be easily known.
- FIG. 4 shows a configuration of a first modification of the TFT 1.
- the first region R is included in the region of the gate electrode 2 when the panel is viewed in the film thickness direction.
- the outer edge of the first region R at the point D where the branch electrode 4b of the second source / drain electrode 4 starts to intersect the first region R is an electrode beyond the boundary line e inside the U-shape of the gate electrode 2 Retreat to line h on the side away from line 4a.
- the outer edge (line h) of the first region R at the location D is a location where the branch electrode 4b starts to intersect with the region of the gate electrode 2 when the gate electrode 2 is viewed in the film thickness direction (second ) On the side farther from the electrode line 4 a than the outer edge (boundary line e) of the gate electrode 2.
- the distance d2 (second distance) from the second location to the electrode line 4a is 5 ⁇ m or more, preferably 5 ⁇ m or more and 10 ⁇ m or less.
- the action and effect in this case is that, in addition to the case of FIG. 1, damage to adjacent partial TFT regions due to irradiation of the laser spot on the gate electrode 2 can be avoided.
- the notch 31 may be provided in the branch electrode 4b immediately before the second location, or the notch 32 may be provided in the electrode line 4a.
- FIG. 5 shows the configuration of the second modification of TFT1.
- the first region R is entirely shifted to the electrode line 4 b side from the region of the gate electrode 2.
- the outer edge of the first region R at the point D where the branch electrode 4b of the second source / drain electrode 4 starts to intersect the first region R is an electrode beyond the boundary line e inside the U-shape of the gate electrode 2 Projects to line j on the line 4a side.
- the outer edge (line j) of the first region R at the location D starts to intersect the region of the gate electrode 2 when the branch electrode 4b looks at the gate electrode 2 in the film thickness direction. It is located on the electrode line 4a side from the outer edge (boundary line e) of the gate electrode 2 at the location (second location). Therefore, the distance d1 (first distance) from the location D to the electrode line 4a is 5 ⁇ m or more, preferably 5 ⁇ m or more and 10 ⁇ m or less. Moreover, it is the same as that of FIG. 1 that the notch part 31 and the notch part 32 may be provided.
- the branch electrode 4b was laser-fused for all of the TFTs 1 described above, no unnecessary damage occurred, and the TFTs 1 all operated normally. Whether the TFT 1 is operating normally can be determined, for example, by examining the relationship between the drain current and the gate voltage and the relationship between the drain current and the drain-source voltage with the gate voltage as a parameter.
- the present invention is not limited to this, and the present invention can be applied to display devices in which TFTs are formed, such as EL display devices and plasma displays.
- the TFT does not need to have a U-shape, and the first source / drain electrode faces the plurality of branch electrodes of the second source / drain electrode in the first region in the in-panel direction. If it is, the shape may be arbitrary as a whole.
- the branch electrodes of the second source / drain electrode do not need to be branched in a direction perpendicular to the electrode line, and the direction thereof is arbitrary.
- the direction in which the branch electrode intersects the first region need not be perpendicular to the outer edge of the first region, and is arbitrary.
- the length until the perpendicular in the in-panel direction with respect to the tangent of the outer edge intersects the electrode line is set to The distance between the outer edge of the region and the electrode line.
- the semiconductor material to be used is not limited to amorphous silicon, but may be polycrystalline silicon, CG silicon, microcrystalline silicon ( ⁇ c-Si: microcrystal silicon), or the like.
- TFTs using amorphous silicon are particularly advantageous when adopting a comb-like source / drain structure in which the channel width is increased in order to increase the driving capability. Therefore, the TFT of this embodiment is manufactured using amorphous silicon. As a result, the manufacturing yield of the TFT is improved and the cost can be significantly reduced.
- the transistor size can be reduced as compared with an amorphous silicon TFT.
- a space can be reduced, which is advantageous for a narrow frame.
- fluctuations in threshold voltage due to application of a DC bias can be suppressed.
- the source driver is often composed of a plurality of chips such as source drivers 16a, 16b, and 16c. . In this case, the number of source drivers and the mounting area are increased.
- a liquid crystal display device that performs display driving of an SSD (Source ⁇ Shared Driving) system that reduces the number of outputs of the source driver and drives each of the RGB source lines SL in a time-sharing manner.
- SSD Source ⁇ Shared Driving
- FIG. 11 shows a configuration of an SSD liquid crystal display device 51 which is a display device according to the present embodiment.
- the liquid crystal display device 51 includes a display panel 12 and a flexible printed board 13.
- the liquid crystal display device 51 may further include a control substrate 14.
- the display panel 12 includes picture elements PIX..., A gate driver (scanning signal line driving circuit) 53, and an SSD circuit (switch circuit) 55.
- a chip-like source driver (data signal line driving circuit) 52 is mounted on the flexible printed circuit board 13.
- the gate driver 53 is made monolithically so as to include the TFT 1 in the display panel 12 as with the gate driver 15.
- the source line (data signal line) RSL to which the R picture elements PIX ... are connected, the source line (data signal line) GSL to which the G picture elements PIX ... are connected, and the B picture element PIX ... are connected.
- the source lines (data signal lines) BSL are grouped one by one, and each group is adjacently arranged. In FIG.
- the SSD circuit 55 is connected to a switch ASWR (ASWRn-1, ASWRn, ASWRn + 1 in the figure) connected to one end of each source line RSL on the data signal supply side, and to one end of each source line GSL on the data signal supply side.
- a switch ASWG (ASWGn-1, ASWGn, ASWGn + 1 in the figure) and a switch ASWB (ASWBn-1, ASWBn, ASWBn + 1 in the figure) connected to one end on the data signal supply side of each source line BSL are provided.
- the switches ASWR, ASWG, and ASWB one end of which is connected to the same set of source lines RSL, GSL, and BSL, are connected to each other at the other end, and output DATA of the source driver 52 (DATAn-1, DATAn, DATAn + 1 in the figure) )It is connected to the.
- the number of output DATA of the source driver 52 is as small as one third of the total number of outputs of the source drivers 16a, 16b, and 16c of the liquid crystal display device 41. Therefore, the number of source drivers is reduced to one third, and the mounting area is reduced accordingly.
- Each of the switches ASWR, ASWG, and ASWB is configured by the TFT 1 described above, and is sequentially turned on in a time-division manner by approximately one third of one horizontal period by an ON signal Ron, Gon, and Bon input to the gate. .
- the ON signal Ron is High
- the switch ASWR is turned ON, and the R output DATA output from the source driver 52 at that time is supplied to the source line RSL.
- the ON signal Gon High
- the switch ASWG is turned ON, and the G output DATA output from the source driver 52 at that time is supplied to the source line GSL.
- the ON signal Bon is High
- the switch ASWB is turned on, and the B output DATA output from the source driver 52 at that time is supplied to the source line BSL.
- One of the first source / drain electrode 3 and the second source / drain electrode 4 of the switches ASWR / ASWG / ASWB is connected to the corresponding source line, and the other is connected to the output DATA of the source driver 52.
- the SSD circuit 55 includes the switches ASWR, ASWG, and ASWB that branch-connect the TFT1 to the respective paths of the source lines RSL, GSL, and BSL.
- the switches ASWR, ASWG, and ASWB are provided corresponding to the respective switches. According to this, since each output of the source driver 52 is branched and connected to a plurality of paths through the switch composed of the TFT1, if the output is used to connect to a low impedance load called a source line at each branch destination.
- An advantageous switch circuit including a TFT having a large channel width can be manufactured with high yield. Therefore, the liquid crystal display device 51 can be manufactured with a high yield.
- the switches ASWR, ASWG, and ASWB are driven so as to be conducted in a time division manner in each horizontal period for each output of the source driver 52. Accordingly, an SSD display device can be manufactured with high yield.
- the SSD circuit 55 is formed monolithically on the display panel 12 with the display area. If the switch circuit is formed monolithically with the display area on the display panel, the channel width of the TFT has to be particularly large in order to increase the driving capability, making it difficult to manufacture with a high yield. Although a disadvantage occurs, since the SSD circuit 55 includes the TFT 1 as a switch, the display device can be manufactured with high yield by compensating for such a disadvantage. Further, in the liquid crystal display device 51, the gate driver 53 is also formed monolithically with the display area on the display panel 12. However, since the gate driver 53 uses the TFT 1, the display device is disadvantageous in the above process. Can be manufactured with good yield.
- FIG. 12 shows a configuration of an SSD liquid crystal display device 61 which is another display device according to the present embodiment.
- the liquid crystal display device 61 is configured such that the gate driver 53 in the liquid crystal display device 51 is a gate driver 54 formed of a chip mounted on the flexible printed circuit board 13. Other configurations are the same as those of the liquid crystal display device 51. As in this case, a display device having a configuration in which a TFT 1 is used for the switches ASWR, ASWG, and ASWB of the SSD circuit 55 and a normal CMOS circuit is applied to the gate driver 54 is possible.
- the liquid crystal display devices 51 and 61 are configured to perform time-division driving with three divisions of RGB, but are SSD type liquid crystal displays that perform time-division driving with an arbitrary division number such as two divisions or four divisions or more. It is also possible to configure the device. If the number of divisions increases, the number of outputs and the number of source drivers can be greatly reduced accordingly.
- FIG. 13A and 13B show examples of how TFTs 1 are arranged in an SSD liquid crystal display device such as the liquid crystal display devices 51 and 61.
- FIG. FIG. 13A is a diagram in which the TFT 1, which is entirely rectangular in FIG. 3, is arranged with the longitudinal direction parallel to the extending direction of the source line SL for each of the switches ASWR, ASWG, and ASWB.
- FIG. 13B is a diagram in which the TFT 1 of FIG. 3 having a rectangular shape as a whole is arranged with the longitudinal direction orthogonal to the extending direction of the source line SL for each of the switches ASWR, ASWG, and ASWB.
- the length of the electrode line 4a is reduced in the TFT 1 of FIG.
- the TFT of the present invention is provided with the gate electrode, the first source / drain electrode, and the second source / drain electrode, and the TFT of the first source / drain electrode and the second source / drain electrode are provided.
- One of them is a TFT which is a source electrode and the other is a drain electrode, and an i layer using a semiconductor material so as to face the gate electrode with an insulating film therebetween in the film thickness direction, and the i layer A layered body in which a layer and an n + layer are sequentially stacked, and the first source / drain electrode is provided in a first region which is a region in a panel surface where the i layer is provided.
- the second source / drain electrode is disposed on the n + layer, and the second source / drain electrode includes an electrode line provided outside the first region and a plurality of branch electrodes extending from the electrode line.
- Each branch electrode Extends from the electrode line to on the n + layer in the first region, said first source-drain electrodes, between the branch electrodes in the first region, the first In the region, the i layer pattern formed so that the n + layer does not exist is sandwiched in the in-plane direction of the panel, and the first region at a position where the branch electrode starts to intersect the first region
- the distance from the outer edge to the electrode line is 5 ⁇ m or more.
- the present invention can be particularly suitably used for display devices such as liquid crystal display devices and EL display devices.
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Abstract
Description
2 ゲート電極
3 第1のソース・ドレイン電極
4 第2のソース・ドレイン電極
4a 電極ライン
4b 枝電極
11 液晶表示装置(表示装置)
15 ゲートドライバ(走査信号線駆動回路)
15a シフトレジスタ
22 ゲート絶縁膜(絶縁膜)
23 積層体
23a i層
23b n+層
31 切り欠き部(枝電極に設けられた切り欠き部)
32 切り欠き部(電極ラインに設けられた切り欠き部)
51 液晶表示装置(表示装置)
52 ソースドライバ(データ信号線駆動回路)
54 ゲートドライバ(走査信号線駆動回路)
55 スイッチ回路
61 液晶表示装置(表示装置)
D 箇所(第1の箇所)
d1 距離(第1の距離)
d2 距離(第2の距離)
R 第1の領域
ASWR、ASWG、ASWB
スイッチ
DATA 出力
本発明の一実施形態について図1ないし図7に基づいて説明すると以下の通りである。
本発明の他の実施形態について図11ないし図14に基づいて説明すると以下の通りである。なお、前記実施の形態1で説明した部材と同一の符号を付した部材は、特に断らない限り同等の機能を有するものとする。
Claims (23)
- ゲート電極、第1ソース・ドレイン電極、および、第2ソース・ドレイン電極が設けられ、上記第1ソース・ドレイン電極と上記第2ソース・ドレイン電極とのうちの一方はソース電極であるとともに他方はドレイン電極であるTFTであって、
上記ゲート電極と膜厚方向に絶縁膜を隔てて対向するように、半導体材料を用いた、i層と、上記i層とn+層とが順次積層された積層体とが設けられており、
上記第1ソース・ドレイン電極は、上記i層が設けられているパネル面内の領域である第1の領域内の上記n+層上に配置されており、
上記第2ソース・ドレイン電極は、上記第1の領域外に設けられた電極ラインと、上記電極ラインから分岐して延びる複数の枝電極とを備えており、
各上記枝電極は、上記電極ラインから上記第1の領域内の上記n+層上まで延びており、
上記第1ソース・ドレイン電極は、上記第1の領域内にある上記枝電極との間に、上記第1の領域において上記n+層が存在しないように形成された上記i層のパターンをパネル面内方向に挟んでおり、
上記枝電極が上記第1の領域と交差開始する第1の箇所の上記第1の領域の外縁は、上記枝電極が上記ゲート電極を膜厚方向に見たときの上記ゲート電極の領域と交差開始する第2の箇所の上記ゲート電極の外縁よりも上記電極ライン側にある、あるいは、上記第1の箇所の上記第1の領域の外縁は上記第2の箇所の上記ゲート電極の外縁と同じ位置にあり、
上記第1の箇所の上記第1の領域の外縁から上記電極ラインまでの距離である第1の距離が5μm以上であることを特徴とするTFT。 - 上記第1の距離は10μm以下であることを特徴とする請求の範囲第1項に記載のTFT。
- 上記第1の箇所の直前の、上記枝電極のライン幅方向の片端あるいは両端に、上記枝電極のライン幅を狭める切り欠き部が設けられていることを特徴とする請求の範囲第1項または第2項に記載のTFT。
- ゲート電極、第1ソース・ドレイン電極、および、第2ソース・ドレイン電極が設けられ、上記第1ソース・ドレイン電極と上記第2ソース・ドレイン電極とのうちの一方はソース電極であるとともに他方はドレイン電極であるTFTであって、
上記ゲート電極と膜厚方向に絶縁膜を隔てて対向するように、半導体材料を用いた、i層と、上記i層とn+層とが順次積層された積層体とが設けられており、
上記第1ソース・ドレイン電極は、上記i層が設けられているパネル面内の領域である第1の領域内の上記n+層上に配置されており、
上記第2ソース・ドレイン電極は、上記第1の領域外に設けられた電極ラインと、上記電極ラインから分岐して延びる複数の枝電極とを備えており、
各上記枝電極は、上記電極ラインから上記第1の領域内の上記n+層上まで延びており、
上記第1ソース・ドレイン電極は、上記第1の領域内にある上記枝電極との間に、上記第1の領域において上記n+層が存在しないように形成された上記i層のパターンをパネル面内方向に挟んでおり、
上記枝電極が上記第1の領域と交差開始する第1の箇所の上記第1の領域の外縁は、上記枝電極が上記ゲート電極を膜厚方向に見たときの上記ゲート電極の領域と交差開始する第2の箇所の上記ゲート電極の外縁よりも上記電極ラインから離れる側にあり、
上記第2の箇所の上記ゲート電極の外縁から上記電極ラインまでの距離である第2の距離が5μm以上であることを特徴とするTFT。 - 上記第2の距離は10μm以下であることを特徴とする請求の範囲第4項に記載のTFT。
- 上記第2の箇所の直前の、上記枝電極のライン幅方向の片端あるいは両端に、上記枝電極のライン幅を狭める切り欠き部が設けられていることを特徴とする請求の範囲第4項または第5項に記載のTFT。
- 上記電極ラインにおける上記枝電極の分岐点の片側あるいは両側に、上記電極ラインのライン幅を狭める切り欠き部が設けられていることを特徴とする請求の範囲第1項から第6項までのいずれか1項に記載のTFT。
- 上記半導体材料はアモルファスシリコンであることを特徴とする請求の範囲第1項から第7項までのいずれか1項に記載のTFT。
- 上記半導体材料は微結晶シリコンであることを特徴とする請求の範囲第1項から第7項までのいずれか1項に記載のTFT。
- 請求の範囲第1項から第9項までのいずれか1項に記載のTFTを、各段を構成するトランジスタの少なくとも1つとして備えていることを特徴とするシフトレジスタ。
- 請求の範囲第10項に記載のシフトレジスタを備え、上記シフトレジスタを用いて表示装置の走査信号を生成することを特徴とする走査信号線駆動回路。
- 上記TFTは、上記走査信号の出力トランジスタであることを特徴とする請求の範囲第11項に記載の走査信号線駆動回路。
- 請求の範囲第11項または第12項に記載の走査信号線駆動回路を備えていることを特徴とする表示装置。
- 上記走査信号線駆動回路は、表示パネルに表示領域とモノリシックに形成されていることを特徴とする請求の範囲第13項に記載の表示装置。
- 請求の範囲第1項から第9項までのいずれか1項に記載のTFTを、データ信号線駆動回路の各出力を複数の経路に分岐接続するスイッチであって、上記経路のそれぞれに対応して設けられたスイッチとして備えていることを特徴とするスイッチ回路。
- 上記スイッチとしてのTFTは、膜厚方向に見て、全体が長方形状の領域を有しているとともに、長手方向が上記経路としてのデータ信号線が延びる方向に平行であるように配置されていることを特徴とする請求の範囲第15項に記載のスイッチ回路。
- 上記スイッチとしてのTFTは、膜厚方向に見て、全体が長方形状の領域を有しているとともに、長手方向が上記経路としてのデータ信号線が延びる方向に直交しているように配置されていることを特徴とする請求の範囲第15項に記載のスイッチ回路。
- 請求の範囲第15項から第17項までのいずれか1項に記載の上記スイッチ回路と上記データ信号線駆動回路とを備えており、上記経路がデータ信号線であることを特徴とする表示装置。
- 上記出力ごとに、上記スイッチどうしが各水平期間に時分割で導通するように駆動されることを特徴とする請求の範囲第18項に記載の表示装置。
- 上記スイッチ回路は、表示パネルに表示領域とモノリシックに形成されていることを特徴とする請求の範囲第18項または第19項に記載の表示装置。
- 請求の範囲第11項または第12項に記載の走査信号線駆動回路と、請求の範囲第15項から第17項までのいずれか1項に記載の上記スイッチ回路および上記データ信号線駆動回路とを備えており、上記経路がデータ信号線であることを特徴とする表示装置。
- 上記走査信号線駆動回路と上記スイッチ回路との少なくとも一方は、表示パネルに表示領域とモノリシックに形成されていることを特徴とする請求の範囲第21項に記載の表示装置。
- 請求の範囲第1項から第9項までのいずれか1項に記載のTFTが表示パネルに表示領域とモノリシックに形成されていることを特徴とする表示装置。
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CN2008801269501A CN101946327B (zh) | 2008-02-19 | 2008-10-09 | Tft、移位寄存器、扫描信号线驱动电路、开关电路和显示装置 |
US12/867,510 US8963152B2 (en) | 2008-02-19 | 2008-10-09 | TFT, shift register, scanning signal line drive circuit, switch circuit, and display device |
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WO2011096125A1 (ja) | 2010-02-08 | 2011-08-11 | シャープ株式会社 | 表示装置 |
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Also Published As
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CN101946327A (zh) | 2011-01-12 |
US20110001736A1 (en) | 2011-01-06 |
CN101946327B (zh) | 2012-03-28 |
US8963152B2 (en) | 2015-02-24 |
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