WO2009075198A1 - 異方導電性接合パッケージ - Google Patents

異方導電性接合パッケージ Download PDF

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Publication number
WO2009075198A1
WO2009075198A1 PCT/JP2008/071801 JP2008071801W WO2009075198A1 WO 2009075198 A1 WO2009075198 A1 WO 2009075198A1 JP 2008071801 W JP2008071801 W JP 2008071801W WO 2009075198 A1 WO2009075198 A1 WO 2009075198A1
Authority
WO
WIPO (PCT)
Prior art keywords
insulating base
anisotropic conductive
conductive
package
conductive paths
Prior art date
Application number
PCT/JP2008/071801
Other languages
English (en)
French (fr)
Inventor
Yusuke Hatanaka
Yoshinori Hotta
Tadabumi Tomita
Original Assignee
Fujifilm Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujifilm Corporation filed Critical Fujifilm Corporation
Priority to CN2008801198972A priority Critical patent/CN101897083B/zh
Priority to US12/747,128 priority patent/US8516690B2/en
Priority to EP08859705.9A priority patent/EP2221926B1/en
Priority to KR1020107012668A priority patent/KR101496494B1/ko
Publication of WO2009075198A1 publication Critical patent/WO2009075198A1/ja

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
    • H01L23/5389—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates the chips being integrally enclosed by the interconnect and support structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49827—Via connections through the substrates, e.g. pins going through the substrate, coaxial cables
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/71—Coupling devices for rigid printing circuits or like structures
    • H01R12/712—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit
    • H01R12/714—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit with contacts abutting directly the printed circuit; Button contacts therefore provided on the printed circuit
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49126—Assembling bases
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49204—Contact or terminal manufacturing
    • Y10T29/49208—Contact or terminal manufacturing by assembling plural parts
    • Y10T29/4921—Contact or terminal manufacturing by assembling plural parts with bonding
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24058—Structurally defined web or sheet [e.g., overall dimension, etc.] including grain, strips, or filamentary elements in respective layers or components in angular relation
    • Y10T428/24074—Strand or strand-portions
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24058—Structurally defined web or sheet [e.g., overall dimension, etc.] including grain, strips, or filamentary elements in respective layers or components in angular relation
    • Y10T428/24074—Strand or strand-portions
    • Y10T428/24083—Nonlinear strands or strand-portions
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24058—Structurally defined web or sheet [e.g., overall dimension, etc.] including grain, strips, or filamentary elements in respective layers or components in angular relation
    • Y10T428/24074—Strand or strand-portions
    • Y10T428/24091—Strand or strand-portions with additional layer[s]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24174—Structurally defined web or sheet [e.g., overall dimension, etc.] including sheet or component perpendicular to plane of web or sheet
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • Y10T428/24917—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including metal layer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/249921—Web or sheet containing structurally defined element or component
    • Y10T428/249953—Composite having voids in a component [e.g., porous, cellular, etc.]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/249921—Web or sheet containing structurally defined element or component
    • Y10T428/249953—Composite having voids in a component [e.g., porous, cellular, etc.]
    • Y10T428/249955—Void-containing component partially impregnated with adjacent component
    • Y10T428/249956—Void-containing component is inorganic

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  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Non-Insulated Conductors (AREA)
  • Manufacturing Of Electrical Connectors (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)

Abstract

　本発明は、金（Ａｕ）、銀（Ａｇ）、銅（Ｃｕ）、アルミニウム（Ａｌ）、マグネシウム（Ｍｇ）、ニッケル（Ｎｉ）、インジウムがドープされたスズ酸化物（ＩＴＯ）、モリブデン（Ｍｏ）、鉄（Ｆｅ）、Ｐｄ（パラジウム）、ベリリウム（Ｂｅ）、およびレニウム（Ｒｅ）からなる群から選択される少なくとも1つの導電素材に異方性導電膜を接合したパッケージであって、 　該異方性導電膜は、絶縁性基材中に、導電性部材からなる複数の導通路が、互いに絶縁された状態で前記絶縁性基材を厚み方向に貫通し、かつ、前記各導通路の一端が前記絶縁性基材の一方の面において露出し、前記各導通路の他端が前記絶縁性基材の他方の面において露出した状態で設けられており、 　前記導通路の密度が３００万個／ｍｍ2以上であり、前記絶縁性基材がマイクロポアを有するアルミニウム基板の陽極酸化皮膜からなる構造体であり、 　前記マイクロポアが深さ方向に対して分岐構造をもたないことを特徴とする異方導電性接合パッケージ、であって導通路の設置密度を飛躍的に向上させ、高集積化が一層進んだ構造においても半導体素子等の電子部品の異方導電性部材または検査用コネクタ等として使用することができる。
PCT/JP2008/071801 2007-12-10 2008-12-01 異方導電性接合パッケージ WO2009075198A1 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
CN2008801198972A CN101897083B (zh) 2007-12-10 2008-12-01 各向异性导电接合组件
US12/747,128 US8516690B2 (en) 2007-12-10 2008-12-01 Anisotropic conductive joint package
EP08859705.9A EP2221926B1 (en) 2007-12-10 2008-12-01 Anisotropic conductive joint package
KR1020107012668A KR101496494B1 (ko) 2007-12-10 2008-12-01 이방 도전성 접합 패키지의 제조방법

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2007-318559 2007-12-10
JP2007318559 2007-12-10
JP2008118639A JP5145110B2 (ja) 2007-12-10 2008-04-30 異方導電性接合パッケージの製造方法
JP2008-118639 2008-04-30

Publications (1)

Publication Number Publication Date
WO2009075198A1 true WO2009075198A1 (ja) 2009-06-18

Family

ID=40755441

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/071801 WO2009075198A1 (ja) 2007-12-10 2008-12-01 異方導電性接合パッケージ

Country Status (6)

Country Link
US (1) US8516690B2 (ja)
EP (1) EP2221926B1 (ja)
JP (1) JP5145110B2 (ja)
KR (1) KR101496494B1 (ja)
CN (1) CN101897083B (ja)
WO (1) WO2009075198A1 (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010186022A (ja) * 2009-02-12 2010-08-26 Fuji Xerox Co Ltd 異方性導電体及び光通信装置
TWI809402B (zh) * 2020-05-27 2023-07-21 南韓商Ｉｓｃ股份有限公司 用於電連接的連接器

Families Citing this family (37)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI351237B (en) * 2009-02-06 2011-10-21 Tatung Co Circuit board structure
JP5523941B2 (ja) * 2009-09-10 2014-06-18 富士フイルム株式会社 金属充填微細構造体の製造方法
JP5318797B2 (ja) * 2010-02-23 2013-10-16 新光電気工業株式会社 実装基板および半導体装置
EP2434592A3 (en) * 2010-09-24 2014-09-24 Fujifilm Corporation Anisotropically conductive member
JP5864954B2 (ja) * 2011-08-26 2016-02-17 新光電気工業株式会社 基材
KR20130074488A (ko) * 2011-12-26 2013-07-04 삼성전기주식회사 터치패널의 접속구조체
CN103208514B (zh) * 2012-01-14 2017-05-17 盛况 一种含有金属的半导体装置及其制备方法
US20140039693A1 (en) * 2012-08-02 2014-02-06 Honeywell Scanning & Mobility Input/output connector contact cleaning
JP5752741B2 (ja) 2012-09-26 2015-07-22 富士フイルム株式会社 多層基板および半導体パッケージ
JP5824435B2 (ja) * 2012-09-27 2015-11-25 富士フイルム株式会社 異方導電性部材および多層配線基板
ITMI20121634A1 (it) * 2012-10-01 2014-04-02 Fond Istituto Italiano Di Tecnologia Materiale composito comprendente allumina porosa anodica ed una matrice polimerica, e suo uso per il restauro dentale
CN103887263B (zh) * 2012-12-21 2016-12-28 碁鼎科技秦皇岛有限公司 封装结构及其制作方法
JP2015179831A (ja) * 2014-02-27 2015-10-08 デクセリアルズ株式会社 接続体、接続体の製造方法及び検査方法
KR20160147990A (ko) 2014-07-11 2016-12-23 후지필름 가부시키가이샤 이방 도전성 부재 및 다층 배선 기판
JP6661969B2 (ja) * 2014-10-28 2020-03-11 デクセリアルズ株式会社 異方性導電フィルム及び接続構造体
JP6412587B2 (ja) * 2014-12-19 2018-10-24 富士フイルム株式会社 多層配線基板
JP6473897B2 (ja) * 2015-12-03 2019-02-27 国立大学法人東北大学 半導体デバイスの製造方法
JP6513281B2 (ja) * 2016-02-29 2019-05-15 富士フイルム株式会社 異方導電性接合部材、半導体デバイス、半導体パッケージおよび半導体デバイスの製造方法
US10572416B1 (en) * 2016-03-28 2020-02-25 Aquantia Corporation Efficient signaling scheme for high-speed ultra short reach interfaces
WO2017191772A1 (ja) * 2016-05-05 2017-11-09 デクセリアルズ株式会社 フィラー配置フィルム
CN109155259B (zh) * 2016-05-27 2023-02-28 富士胶片株式会社 电子元件、包含半导体元件的结构体及电子元件的制造方法
US10902769B2 (en) 2017-07-12 2021-01-26 Facebook Technologies, Llc Multi-layer fabrication for pixels with calibration compensation
US10600755B2 (en) * 2017-08-10 2020-03-24 Amkor Technology, Inc. Method of manufacturing an electronic device and electronic device manufactured thereby
JP7062389B2 (ja) * 2017-08-23 2022-05-06 デクセリアルズ株式会社 異方性導電フィルム
US10733930B2 (en) 2017-08-23 2020-08-04 Facebook Technologies, Llc Interposer for multi-layer display architecture
WO2019039071A1 (ja) * 2017-08-25 2019-02-28 富士フイルム株式会社 構造体、構造体の製造方法、積層体および半導体パッケージ
KR102536305B1 (ko) * 2018-01-05 2023-05-24 (주)포인트엔지니어링 마이크로 led 구조체 및 이의 제조방법
KR20190114368A (ko) * 2018-03-30 2019-10-10 (주)포인트엔지니어링 마이크로 led 반제품 모듈
US11855056B1 (en) 2019-03-15 2023-12-26 Eliyan Corporation Low cost solution for 2.5D and 3D packaging using USR chiplets
TWI760629B (zh) * 2019-07-15 2022-04-11 矽品精密工業股份有限公司 電子封裝件及其導電基材與製法
CN112867288B (zh) * 2021-01-05 2021-08-17 江苏特丽亮镀膜科技有限公司 一种acf导电胶膜结构及其热压方法、热压组件
US11817380B2 (en) * 2021-02-26 2023-11-14 Taiwan Semiconductor Manufacturing Co., Ltd. Semiconductor package and method of forming same
US11855043B1 (en) 2021-05-06 2023-12-26 Eliyan Corporation Complex system-in-package architectures leveraging high-bandwidth long-reach die-to-die connectivity over package substrates
US12002743B2 (en) * 2021-08-13 2024-06-04 Advanced Semiconductor Engineering, Inc. Electronic carrier and method of manufacturing the same
US11842986B1 (en) 2021-11-25 2023-12-12 Eliyan Corporation Multi-chip module (MCM) with interface adapter circuitry
US11841815B1 (en) 2021-12-31 2023-12-12 Eliyan Corporation Chiplet gearbox for low-cost multi-chip module applications
US12058874B1 (en) 2022-12-27 2024-08-06 Eliyan Corporation Universal network-attached memory architecture

Citations (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2708655A (en) 1955-05-17 Electrolytic polishing of aluminum
JPH03182081A (ja) 1989-12-11 1991-08-08 Canon Inc 電気的接続部材の製造方法
JPH03276512A (ja) * 1990-03-27 1991-12-06 Ricoh Co Ltd 異方性導電膜およびその製造方法
JPH0487213A (ja) * 1990-07-27 1992-03-19 Ricoh Co Ltd 異方性導電膜およびその製造方法
JP2000012619A (ja) 1998-06-23 2000-01-14 Nitto Denko Corp 異方導電性フィルム
JP2002134570A (ja) 2000-10-20 2002-05-10 Japan Electronic Materials Corp プローブカード及びそれに用いられる異方性導電シートの製造方法
JP2004022682A (ja) * 2002-06-13 2004-01-22 Sony Corp 液体流通構造体、冷却装置、電子機器装置及び多孔質アルミナの製造方法。
JP2004285405A (ja) * 2003-03-20 2004-10-14 Kanagawa Acad Of Sci & Technol 微小電極アレイおよびその製造方法
JP2005085634A (ja) 2003-09-09 2005-03-31 Nitto Denko Corp 異方導電性フィルムおよびその製造方法
JP2005206717A (ja) * 2004-01-23 2005-08-04 Hitachi Chem Co Ltd 支持体付接着剤、支持体付接着剤の製造方法及びそれを用いた回路接続構造体
JP2006127956A (ja) * 2004-10-29 2006-05-18 Hitachi Chem Co Ltd 異方導電フィルム、異方導電フィルムの製造方法、これを用いた接続体および半導体装置
JP2007053107A (ja) * 1993-07-29 2007-03-01 Hitachi Chem Co Ltd フィルム状回路接続材料
JP2007193972A (ja) * 2006-01-17 2007-08-02 Jsr Corp コネクター装置、回路基板検査装置および導電接続構造体
JP2007238988A (ja) * 2006-03-07 2007-09-20 Fujifilm Corp 微細構造体の製造方法および微細構造体
JP2007247015A (ja) * 2006-03-17 2007-09-27 Fujifilm Corp 微細構造体の製造方法および微細構造体

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5379515A (en) 1989-12-11 1995-01-10 Canon Kabushiki Kaisha Process for preparing electrical connecting member
JP3154713B2 (ja) * 1990-03-16 2001-04-09 株式会社リコー 異方性導電膜およびその製造方法
JP2000174399A (ja) * 1998-12-01 2000-06-23 Nhk Spring Co Ltd 立体配線基板とその製造方法および基板用絶縁材料
JP4536866B2 (ja) * 1999-04-27 2010-09-01 キヤノン株式会社 ナノ構造体及びその製造方法
JP4615746B2 (ja) * 2001-03-01 2011-01-19 アルバックマテリアル株式会社 スパッタリング用チタンターゲット組立て体及びその製造方法
EP1515399B1 (en) * 2003-09-09 2008-12-31 Nitto Denko Corporation Anisotropic conductive film, production method thereof and method of use thereof
KR100597391B1 (ko) * 2004-05-12 2006-07-06 제일모직주식회사 절연 전도성 미립자 및 이를 함유하는 이방 전도성 접착필름
TWI287805B (en) * 2005-11-11 2007-10-01 Ind Tech Res Inst Composite conductive film and semiconductor package using such film
JP5123664B2 (ja) * 2005-09-28 2013-01-23 スパンション エルエルシー 半導体装置およびその製造方法
US7795607B2 (en) * 2006-09-29 2010-09-14 Intel Corporation Current focusing memory architecture for use in electrical probe-based memory storage
US20080284042A1 (en) * 2007-03-27 2008-11-20 Fujifilm Corporation Anisotropically conductive member and method of manufacture

Patent Citations (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2708655A (en) 1955-05-17 Electrolytic polishing of aluminum
JPH03182081A (ja) 1989-12-11 1991-08-08 Canon Inc 電気的接続部材の製造方法
JPH03276512A (ja) * 1990-03-27 1991-12-06 Ricoh Co Ltd 異方性導電膜およびその製造方法
JPH0487213A (ja) * 1990-07-27 1992-03-19 Ricoh Co Ltd 異方性導電膜およびその製造方法
JP2007053107A (ja) * 1993-07-29 2007-03-01 Hitachi Chem Co Ltd フィルム状回路接続材料
JP2000012619A (ja) 1998-06-23 2000-01-14 Nitto Denko Corp 異方導電性フィルム
JP2002134570A (ja) 2000-10-20 2002-05-10 Japan Electronic Materials Corp プローブカード及びそれに用いられる異方性導電シートの製造方法
JP2004022682A (ja) * 2002-06-13 2004-01-22 Sony Corp 液体流通構造体、冷却装置、電子機器装置及び多孔質アルミナの製造方法。
JP2004285405A (ja) * 2003-03-20 2004-10-14 Kanagawa Acad Of Sci & Technol 微小電極アレイおよびその製造方法
JP2005085634A (ja) 2003-09-09 2005-03-31 Nitto Denko Corp 異方導電性フィルムおよびその製造方法
JP2005206717A (ja) * 2004-01-23 2005-08-04 Hitachi Chem Co Ltd 支持体付接着剤、支持体付接着剤の製造方法及びそれを用いた回路接続構造体
JP2006127956A (ja) * 2004-10-29 2006-05-18 Hitachi Chem Co Ltd 異方導電フィルム、異方導電フィルムの製造方法、これを用いた接続体および半導体装置
JP2007193972A (ja) * 2006-01-17 2007-08-02 Jsr Corp コネクター装置、回路基板検査装置および導電接続構造体
JP2007238988A (ja) * 2006-03-07 2007-09-20 Fujifilm Corp 微細構造体の製造方法および微細構造体
JP2007247015A (ja) * 2006-03-17 2007-09-27 Fujifilm Corp 微細構造体の製造方法および微細構造体

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
JITSUMU HYOMEN GIJUTSU, vol. 33, no. 3, 1986, pages 32 - 38

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010186022A (ja) * 2009-02-12 2010-08-26 Fuji Xerox Co Ltd 異方性導電体及び光通信装置
TWI809402B (zh) * 2020-05-27 2023-07-21 南韓商Ｉｓｃ股份有限公司 用於電連接的連接器

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